CN115384176A

CN115384176A - Solder printing apparatus and solder printing method

Info

Publication number: CN115384176A
Application number: CN202110571368.3A
Authority: CN
Inventors: 陈盈儒; 杨景筌; 鞠彦章
Original assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2021-05-25
Filing date: 2021-05-25
Publication date: 2022-11-25

Abstract

The application provides a solder printing device, including conveying assembly and set up in the printing element of conveying assembly top. The transmission assembly comprises a first driving part and a driven part, the first driving part is in transmission connection with the driven part, and the first driving part is used for driving the driven part to move so as to drive the circuit board to move along a first direction. The printing assembly comprises a rotating frame, a plurality of screen plates and a feeding device, the rotating frame comprises a rotating shaft and a plurality of rotating arms connected to the periphery of the rotating shaft, the screen plates are arranged at one ends, far away from the rotating shaft, of the rotating arms, and the feeding device is used for arranging solder on the screen plates so that the solder penetrates through the screen plates to be attached to the circuit board. The solder printing equipment provided by the application can improve the solder paste printing accuracy. In addition, the application also provides a solder printing method.

Description

Solder printing apparatus and solder printing method

Technical Field

The present application relates to a solder printing apparatus and a solder printing method.

Background

Generally, in the process of surface mounting of a flexible circuit board, solder paste needs to be accurately printed on a conductive pad of a conductive circuit layer, however, for a large-sized flexible circuit board, position deviation or deformation is caused to the large-sized flexible circuit board during positioning or moving, and how to accurately print the solder paste on the large-sized flexible circuit board becomes a problem to be solved urgently.

Disclosure of Invention

In order to solve the problems involved in the background art, the present application provides a solder printing method to improve solder paste printing accuracy of a circuit board.

In addition, it is also necessary to provide a solder printing apparatus.

A solder printing device comprises a conveying assembly and a printing assembly arranged above the conveying assembly. The conveying assembly comprises a first driving piece and a driven piece, the first driving piece is in transmission connection with the driven piece, and the first driving piece is used for driving the driven piece to move so as to drive the circuit board to move along a first direction. The printing assembly comprises a rotating frame, a plurality of screen plates and a feeding device, the rotating frame comprises a rotating shaft and a plurality of rotating arms connected to the periphery of the rotating shaft, the screen plates are arranged at one ends of the rotating arms far away from the rotating shaft, and the feeding device is used for arranging solder on the screen plates so that the solder is attached to the circuit board through the screen plates.

Furthermore, the rotating arm comprises a clamping part far away from the rotating shaft, the clamping part comprises a substrate, a plurality of second driving parts and a plurality of abutting parts, the second driving parts are arranged on one side, facing the driven part, of the substrate at intervals, the abutting parts are arranged between the second driving parts, the second driving parts are in transmission connection with the abutting parts, the second driving parts are used for driving the abutting parts arranged at intervals to move in the opposite direction or in the opposite direction, and the screen plate is arranged between the abutting parts arranged in the opposite direction.

Furthermore, the abutting piece comprises an inner surface facing the screen plate and an outer surface deviating from the inner surface, a containing groove is formed in the inner surface in a concave mode, and the edge of the screen plate is contained in the containing groove.

Furthermore, the printing assembly further comprises a scraping plate movably arranged between the substrate and the screen plate along a second direction, the scraping plate is used for scraping the solder arranged on the screen plate, and the second direction is perpendicular to the first direction.

Furthermore, the rotating arms are vertically connected to the rotating shaft, and the two adjacent rotating arms are arranged at 90 degrees.

Furthermore, the printing assembly further comprises a positioning identification device and a control unit, the control unit is electrically connected with the positioning identification device and the first driving piece, the positioning identification device is used for sensing the position information of the circuit board, and the control unit is used for controlling the corresponding operation of the first driving piece according to the position information.

Further, the positioning recognition device comprises a positioning grating or an image recognition camera.

A solder printing method comprising the steps of: a solder printing apparatus as described above is provided. And arranging a circuit board on the driven piece, wherein the circuit board is divided into a plurality of pre-welding areas. And arranging solder on the plurality of screen plates, and sequentially rotating the rotating shaft to enable the different screen plates to respectively correspond to the different pre-soldering areas, wherein the solder penetrates through the screen plates and is sequentially attached to the different pre-soldering areas.

Furthermore, the printed assembly further comprises a scraping plate, the circuit board has a length direction, and the scraping plate is arranged between the substrate and the screen plate in a scraping manner along a direction perpendicular to the length direction.

Further, the circuit board is provided with a plurality of conductive pads, and the solder is arranged on the conductive pads.

The application provides a solder printing device, through set up a plurality ofly on the rotating turret the otter board, a plurality of otter boards can rotate under the drive of pivot to realize the switching of a plurality of otter boards, a plurality of otter boards can correspond to tin cream printing is carried out in a plurality of different regions of circuit board, can reduce the number of times of fixing a position or removing the different soldering regions of circuit board in advance, thereby is favorable to improving the degree of accuracy of tin cream printing.

Drawings

Fig. 1 is a schematic view of a solder printing apparatus printing a first subarea according to an embodiment of the present application.

Fig. 2 is a cross-sectional view of the solder printing apparatus of fig. 1 taken along plane II-II.

Fig. 3 is a schematic view of a solder printing apparatus printing a second subarea according to an embodiment of the present application.

Fig. 4 is a schematic view of a solder printing apparatus printing a third subarea according to an embodiment of the present application.

Fig. 5 is a schematic view of a clamping portion of a solder printing apparatus according to an embodiment of the present application.

Fig. 6 is a schematic view of the nip portion shown in fig. 5 when solder paste is printed.

Description of the main elements

Solder printing apparatus 100

Conductive pad 201

Solder 202

Positioning point 205

Printing assembly 30

Rotating frame 31

Rotating shaft 311

Swivel arm 312

First pivot arm 312a

Second pivot arm 312b

Third arm 312c

Clamping part 313

Mounting portion 314

Substrate 310

Second driving member 315

Holding piece 316

Inner surface 316a

Outer surface 316b

Accommodating groove 316c

Screen plate 32

First net plate 32a

Second net plate 32b

Third net plate 32c

First surface 321

Second surface 322

Mesh 323

Feeding device 34

Scraping plate 35

Length direction X

Width direction Y

First direction D

Second direction E

First preweld area A

Second preweld zone B

Third pre-bonding area C

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

Referring to fig. 1 and 2, the present disclosure provides a solder printing apparatus 100, wherein the solder printing apparatus 100 can be used for printing solder 202 (see fig. 2) on a conductive pad 201 of a circuit board 200. The circuit board 200 may be any one of a flexible circuit board, a hard circuit board, or a flexible-hard board. Wherein the circuit board 200 has a plurality of pre-lands. In some embodiments, the circuit board 200 has a first pre-bonding area a, a second pre-bonding area B and a third pre-bonding area C disposed at a distance. The conductive pad 201 is exposed out of the outer surface of the circuit board 200, and the conductive pad 201 is disposed on each of the first pre-bonding area a, the second pre-bonding area B, and the third pre-bonding area C. The solder 202 is used to electrically connect an electronic component (e.g., a chip, a transistor, a capacitor, an inductor, a resistor, etc.) and the conductive pad 201. The circuit board 200 is substantially rectangular, the circuit board 200 has a length direction X and a width direction Y, and the solder printing apparatus 100 includes a conveying assembly (not shown) and a printing assembly 30 disposed above the conveying assembly.

The transmission assembly includes a first driving member (not shown) and a driven member (not shown), the first driving member is in transmission connection with the driven member to drive the driven member to move along the first direction D, and the driven member is used for placing the circuit board 200 to drive the circuit board 200 to move. The first driving part comprises any one of a motor and an air cylinder, and the driven part comprises any one of a conveyor belt and a hinge.

The printing assembly 30 includes a rotating frame 31, a plurality of screens 32 and a feeding device 34. The rotating frame 31 includes a rotating shaft 311 and a plurality of rotating arms 312 connected to the periphery of the rotating shaft 311, at least one screen plate 32 is disposed on each rotating arm 312, the screen plate 32 includes a first surface 321 and a second surface 322 opposite to the first surface 321, and the second surface 322 faces the driven member. The screen 32 is provided with a plurality of meshes 323, the meshes 323 penetrate through the first surface 321 and the second surface 322, and the feeding device 34 is used for arranging the flowing solder on the first surface 321. Specifically, when the solder printing apparatus 100 is used, the rotating shaft 311 rotates to drive the different rotating arms 312 to face the driven member, so as to switch the different screen plates 32 to face the circuit board 200.

The solder printing device 100 provided by the application can realize the switching of a plurality of screen plates 32 by arranging a plurality of screen plates 32 on the rotating frame 31, and the plurality of screen plates 32 can be corresponding to the solder printing is carried out on a plurality of different pre-welding areas of the circuit board 200, thereby reducing the positioning or moving times of different pre-welding areas, being beneficial to improving the accuracy of the solder printing and being applicable to the solder printing of the large-size circuit board 200. Meanwhile, by disposing a plurality of screen plates 32 on the turret 31, it is advantageous to reduce the footprint of the solder printing apparatus 100.

Referring to fig. 5, in the present embodiment, the rotating arm 312 includes a clamping portion 313 and a mounting portion 314 (see fig. 1) opposite to the clamping portion 313, the mounting portion 314 is connected to the rotating shaft 311, the clamping portion 313 includes a substrate 310, a plurality of second driving members 315 and a plurality of abutting members 316, the second driving members 315 are disposed on a side of the substrate 310 facing the driven member at intervals, the abutting members 316 are disposed between the second driving members 315 at intervals, the second driving members 315 are in transmission connection with the abutting members 316 to drive the abutting members 316 disposed at intervals to move towards or away from each other, and the mesh plate 32 is disposed between the abutting members 316 disposed opposite to each other. When printing is required, the second driving member 315 drives the abutting members 316 to move towards each other to clamp the screen 32, so that the screen 32 is fixed, and then the feeding device 34 sets solder on the first surface 321. When the screen plate 32 needs to be detached, the second driving member 315 drives the abutting member 316 to move back and forth, so as to release the screen plate 32, and the screen plate 32 can be detached.

In this embodiment, the supporting member 316 includes an inner surface 316a and an outer surface 316b opposite to the inner surface 316a, the inner surface 316a is recessed to form a receiving groove 316c, and an edge portion of the mesh plate 32 is received in the receiving groove 316 c.

Referring to fig. 6, in the present embodiment, the printing assembly 30 further includes a scraper plate 35, the scraper plate 35 is movably disposed between the substrate 310 and the first surface 321 along the second direction E, and the scraper plate 35 is used for coating solder so that the solder can flow out of each of the meshes 323. The second direction E is substantially perpendicular to the first direction D. That is, the movement direction of the scraper 35 is substantially along the width direction Y, so that the printing direction is substantially along the width direction Y, which is advantageous to reduce the deformation of the circuit board 200 and further improve the printing accuracy. It is understood that if the moving direction of the scraper 35 is other directions, the moving distance of the scraper 35 will be greater than the moving distance of the scraper 35 along the width direction Y, and the larger moving distance will increase the deformation, resulting in lower printing precision.

Referring to fig. 1, 3 and 4, in the present embodiment, the rotating arms 312 are vertically connected to the rotating shaft 311, and two adjacent rotating arms 312 are disposed at an angle of about 90 degrees. When printing, each time the rotating shaft 311 is rotated by about 90 degrees, different screen plates 32 can be switched to print.

In this embodiment, the printing assembly 30 further includes a positioning recognition device (not shown) and a control unit (not shown), the control unit is electrically connected to the positioning recognition device and the first driving member, the positioning recognition device is used for sensing the position information of the circuit board 200, and the control unit controls the stop/moving state of the driving member according to the position information. The recognition device 36 includes any one of a positioning grating and an image recognition camera, and the control unit includes a processor and the like.

Referring to fig. 1, 3 and 4, in the present embodiment, the mesh plate 32 includes a first mesh plate 32a, a second mesh plate 32b and a third mesh plate 32c, and the rotating arm 312 includes a first rotating arm 312a, a second rotating arm 312b and a third rotating arm 312c. The first screen plate 32a is disposed on the first rotating arm 312a, the second screen plate 32b is disposed on the second rotating arm 312b, and the third screen plate 32c is disposed on the third rotating arm 312c. Specifically, taking printing solder paste as an example, the printing process can be roughly divided into the following steps:

s1, referring to fig. 1 and 2, a circuit board 200 is provided and the circuit board 200 is disposed on the driven member, the circuit board 200 has a first pre-bonding area a, a second pre-bonding area B and a third pre-bonding area C disposed at a distance, and the first pre-bonding area a, the second pre-bonding area B and the third pre-bonding area C are disposed with the conductive pad 201.

In this embodiment, in step S1, the circuit board 200 further has a plurality of positioning points 205, and the positioning points 205 are respectively disposed in the first pre-soldering area a, the second pre-soldering area B, and the third pre-soldering area C.

S2, the driven member moves the circuit board 200 to a first position (not shown) along a first direction D, such that the first pre-soldering area a faces the first screen plate 32a, the conductive pad 201 faces the mesh 323, the first screen plate 32a is slowly attached to the first pre-soldering area a, the conductive pad 201 is attached to the second surface 322, the feeding device 34 sets solder paste on the first surface 321 of the first screen plate 32a, and the solder paste falls on the conductive pad 201 in the first pre-soldering area a through the mesh 323. Wherein the first direction D is substantially parallel to the length direction X.

In this embodiment, step S2 further includes: the positioning identification device senses the position information of the positioning point 205, for example, when the positioning identification device senses that the positioning point 205 is not located under the first screen plate 32a, the control unit controls the driving member to start, the driving member drives the circuit board 200 to continue moving along the first direction D until the positioning identification device senses that the positioning point is located under the first screen plate 32a, and the control unit controls the driving member to stop.

S3, referring to fig. 3, the driven member continuously drives the circuit board 200 to move to a second position (not shown) along the first direction D, the rotating shaft 311 is rotated, so that the second pre-soldering region B faces the second screen plate 32B, the conductive pads 201 face the meshes 323, the second screen plate 32B slowly adheres to the second pre-soldering region B slowly on the second screen plate 32B, so that the conductive pads 201 adhere to the second surface 322, the feeding device 34 sets flowing solder paste on the first surface 321 of the first screen plate 32a, and the flowing solder paste is attached to the conductive pads 201 in the second pre-soldering region B through the meshes 323.

S4, referring to fig. 4, according to a method similar to the steps S2 to S3, solder paste is attached to the conductive pad 201 of the third pre-bonding area C, so as to complete solder paste printing on the circuit board 200.

The above description is only an optimized specific embodiment of the present application, but in practical application, the present application is not limited to this embodiment. Other modifications and changes made by those skilled in the art based on the technical idea of the present application should fall within the scope of the present application.

Claims

1. The solder printing equipment is characterized by comprising a conveying assembly and a printing assembly arranged above the conveying assembly;

the conveying assembly comprises a first driving piece and a driven piece, the first driving piece is in transmission connection with the driven piece, and the first driving piece is used for driving the driven piece to move so as to drive the circuit board to move along a first direction;

the printing assembly comprises a rotating frame, a plurality of screen plates and a feeding device, the rotating frame comprises a rotating shaft and a plurality of rotating arms connected to the periphery of the rotating shaft, the screen plates are arranged at one ends of the rotating arms far away from the rotating shaft, and the feeding device is used for arranging solder on the screen plates so that the solder penetrates through the screen plates and is attached to the circuit board.

2. The solder printing apparatus according to claim 1, wherein the rotating arm includes a clamping portion away from the rotating shaft, the clamping portion includes a substrate, a plurality of second driving members and a plurality of supporting members, the second driving members are disposed at a distance from one side of the substrate facing the driven member, the supporting members are disposed between the second driving members, the second driving members are connected to the supporting members in a driving manner, the second driving members are configured to drive the supporting members disposed at a distance to move toward or away from each other, and the screen is disposed between the supporting members disposed opposite to each other.

3. The solder printing apparatus according to claim 2, wherein the abutting member includes an inner surface facing the screen and an outer surface facing away from the inner surface, the inner surface is recessed to form a receiving groove, and an edge of the screen is received in the receiving groove.

4. The solder printing apparatus of claim 2, wherein the printing assembly further comprises a scraper plate movably disposed between the substrate and the screen in a second direction, the scraper plate being configured to scrape the solder disposed on the screen, the second direction being perpendicular to the first direction.

5. The solder printing apparatus according to claim 1, wherein the pivot arms are perpendicularly connected to the pivot shafts, and two adjacent pivot arms are disposed at 90 degrees therebetween.

6. The solder printing apparatus of claim 1, wherein the printing assembly further comprises a positioning recognition device and a control unit, the control unit is electrically connected to the positioning recognition device and the first driving member, the positioning recognition device is configured to sense position information of the circuit board, and the control unit is configured to control corresponding operations of the first driving member according to the position information.

7. The solder printing apparatus of claim 6, wherein the positioning recognition device comprises a positioning raster or an image recognition camera.

8. A solder printing method, comprising the steps of:

providing a solder printing apparatus as claimed in any one of claims 1 to 6;

arranging a circuit board on the driven piece, wherein the circuit board is divided into a plurality of pre-welding areas;

arranging solder on the plurality of screen plates; and (c) a second step of,

and sequentially rotating the rotating shaft to enable different screen plates to respectively correspond to different pre-welding areas, wherein the solder flows to the different pre-welding areas sequentially through the screen plates.

9. The solder printing method according to claim 8, wherein the printed assembly further comprises a scraper plate, the circuit board has a length direction, and the scraper plate is arranged between the substrate and the screen plate in a manner of scraping along a direction perpendicular to the length direction.

10. The solder printing method according to claim 8, wherein the circuit board is provided with a plurality of conductive pads on which the solder is provided.