CN115361772A - Temperature sensing module and manufacturing method thereof - Google Patents

Abstract

The application relates to a temperature sensing module and a manufacturing method thereof, comprising the following steps: the conductive sheet is provided with a plurality of circuit units, each circuit unit comprises two independent closed circuits, and each closed circuit surrounds the conductive sheet to form a pad part; a first insulating film covering and connected to the bottom of the conductive sheet; the second insulating film covers and is connected with the top of the conducting strip, window units corresponding to the pad parts are arranged on the second insulating film, and each window unit comprises a thermistor window and a sampling line window, wherein the projections of the thermistor window and the sampling line window are respectively positioned at two ends of the corresponding pad parts. Because it only has conducting strip and the insulation system of its top below, in addition its circuit unit once cuts the shaping for the temperature sensing module is direct just can weld thermistor, does not need the PCB board, and carries out the operation technology of PCB board printed wiring, very big reduction production manufacturing cost. In addition, the PCB can be attached to any position of a carrier to be detected without limitation of the PCB.

Description

Temperature sensing module and manufacturing method thereof

Technical Field

The application relates to the technical field of temperature measurement, in particular to a temperature sensing module and a manufacturing method thereof.

Background

At present, the thermistor has the characteristic that the resistance is reduced in an exponential relation along with the temperature rise, and is commonly used for temperature sampling of electronic products or mechanical products. The existing temperature sampling component is as follows: the thermistor is welded on two wires or a flexible circuit board, the thermistor is packaged through epoxy resin or heat conducting glue, and the outside of the thermistor is connected with a heating structure through a metal sheet (a nickel sheet or an aluminum sheet) to conduct heat.

In the development and manufacturing process of electronic products, printed Circuit Board (PCB) printing is inevitably involved. The printed circuit board is formed by cutting an insulating board serving as a base material into a certain size and forming conductive patterns such as lines, bonding pads, via holes, solder masks and the like on the insulating board so as to realize the mutual connection of electronic components. Generally, in the process of printing a PCB, ink is applied to a substrate made of an insulating material, the ink on the substrate is dried, a circuit pattern to be manufactured is covered on the substrate coated with the ink for exposure, and finally, the substrate after exposure is developed to complete circuit printing.

In some related arts, when forming a temperature sensing module having a thermistor, a circuit is generally printed on a PCB, and then the thermistor is attached to the PCB, and finally a temperature sensing module is formed, but there are the following problems:

(1) As can be seen from the above explanation, the process flow of printing the circuit on the PCB is complex, and the production cost is greatly increased, so that the temperature sensing module can be manufactured without the printing process, and a new temperature sensing module structure is provided to change the manufacturing process, which is urgently needed to be solved.

(2) Because the printed circuit on the PCB is fixed, the position of the thermistor mounted on the PCB is also fixed, and the position requirement in the actual use process cannot be met.

Disclosure of Invention

The embodiment of the application provides a temperature sensing module and a manufacturing method thereof, and aims to solve the problems that in the related art, a printed circuit is printed on a PCB, then a thermistor is arranged on the printed circuit to form the temperature sensing module with a complex structure, and the complex process flow of the temperature sensing module greatly increases the production cost.

In a first aspect, a method for manufacturing a temperature sensing module is provided, which specifically includes the following steps:

carrying out circuit cutting on the whole conducting sheet to form a plurality of circuit units;

after the conducting plate is subjected to line cutting, pressing a first insulating film at the bottom of the conducting plate;

forming a hole on the second insulating film to form a thermistor window and a sampling line window, and pressing the hole on the top of the conducting plate after the conducting plate finishes circuit cutting;

and cutting and slicing the conducting strip laminated with the first insulating film and the second insulating film to form the temperature sensing module.

In some embodiments, each circuit unit is provided with a thermistor;

the method for cutting and slicing the conducting strip laminated with the first insulating film and the second insulating film to form the temperature sensing module further comprises the following steps:

carrying out anti-oxidation treatment on the surfaces of the welding disc parts exposed out of the thermistor window and the sampling line window in the temperature sensing module to form a temperature sensing module plate capable of being subjected to reflow soldering;

welding the thermistor on the temperature sensing module board through reflow soldering;

and after welding is finished, performing three-proofing paint brushing treatment on the surface of the thermistor, and finally obtaining a finished product.

In some embodiments, the step of pressing the conductive sheet after the circuit cutting on the first insulating film specifically includes the following steps:

providing a first stitching roller set which comprises two first stitching rollers with opposite rotation directions, wherein the two first stitching rollers are oppositely arranged;

placing the first insulating film under the conductive sheet; then feeding the first insulating film and the conducting sheet into the first pressing roller group together;

and pressing the first insulating film on the bottom of the conducting strip under the pressing of the two first pressing rollers.

In some embodiments, pressing a second insulating film on top of the conductive sheet comprises:

providing a second stitching roller set which comprises two second stitching rollers which are oppositely arranged, wherein the rotating directions of the two second stitching rollers are opposite;

placing the second insulating film over the conductive sheet; then feeding the second insulating film and the conductive sheet together into a second nip roller set;

and pressing the second insulating film on the top of the conducting strip under the pressing of the two second pressing rollers.

In some embodiments, the second stitching roller set further comprises a film feeding roller which is close to one of the second stitching rollers and opposite to the rotation direction of the second stitching roller; the film feeding roller is far away from the other second pressing roller;

after opening the hole in the second insulating film and before laminating the second insulating film and the conductive sheet, the method further includes:

and feeding the waste film and the second insulating film together between the film feeding roller and a second pressing roller close to the film feeding roller to perform insulating film waste discharge operation.

In some embodiments, the cutting and slicing of the conductive sheet laminated with the first insulating film and the second insulating film to form the temperature sensing module includes:

providing a third press-fit roller group and slicing equipment, wherein the third press-fit roller group comprises two third press-fit rollers which are oppositely arranged, and the rotating directions of the two third press-fit rollers are opposite;

feeding the conducting strip pressed with the first insulating film and the second insulating film into a third pressing roller group;

and after the third press-fit roller in the third press-fit roller group rotates for a circle, cutting and slicing are carried out once by using the slicing equipment.

A second aspect provides a temperature sensing module, which is implemented by the above method for manufacturing a temperature sensing module, and includes:

the circuit comprises a conductive sheet, a plurality of circuit units and a plurality of control circuits, wherein the conductive sheet is provided with the circuit units, each circuit unit comprises two independent closed circuits, and each closed circuit surrounds the conductive sheet to form a pad part;

a first insulating film covering and connected to a bottom of the conductive sheet;

and the second insulating film covers and is connected to the top of the conducting strip, window units corresponding to the pad parts are arranged on the second insulating film, and each window unit comprises a thermistor window and a sampling line window, wherein the projections of the thermistor window and the sampling line window are respectively positioned at two ends of the corresponding pad parts.

In some embodiments, the temperature sensing module further comprises: the thermistors are in one-to-one correspondence with the circuit units;

the positive electrode of the thermistor penetrates through a thermistor window of one of the two pad parts contained in the circuit unit and is connected with the pad part;

the negative pole of the thermistor passes through the thermistor window of the other pad part of the two pad parts contained in the circuit unit and is connected with the pad part;

each sampling line window is provided with a sampling line, and one end of each sampling line penetrates through the sampling line window to be connected with the pad part.

In some embodiments, the temperature sensing module further comprises: the protection assembly is used for protecting the temperature sensing module.

The temperature sensing module also comprises a bottom plate which covers and is connected with the bottom of the first insulating film and a cover plate which covers and is connected with the top of the second insulating film, and a temperature sensing hole is formed in the bottom plate; and/or the presence of a gas in the gas,

the protection component comprises a bottom plate and a cover plate, wherein the bottom plate covers and is connected to the bottom of the first insulating film, the cover plate covers and is connected to the top of the second insulating film, and heat dissipation holes are formed in the cover plate.

The beneficial effect that technical scheme that this application provided brought includes:

the embodiment of the application provides a temperature sensing module and a manufacturing method thereof, because circuit units are formed on a conductive sheet, each circuit unit comprises two independent closed circuits, and each closed circuit surrounds the conductive sheet to form a bonding pad part; then, a first insulating film and a second insulating film are respectively arranged at the bottom and the top of the conducting plate, window units corresponding to the welding parts are arranged on the second insulating film, each window unit comprises a thermistor window and a sampling line window, the projections of the thermistor window and the sampling line window are respectively positioned at two ends of the corresponding pad part, so that a temperature sensing module with a new structure is formed, and because the temperature sensing module only has the conducting plate and an insulating structure below the conducting plate, and a circuit unit is formed by cutting once, the subsequent process does not need to be cut again; the temperature sensing module can be directly used for welding the thermistor without a PCB (printed Circuit Board) and carrying out the operation process of PCB printed circuits, so that the production and manufacturing cost is greatly reduced.

In addition, the temperature sensing module with the new structure can be attached to any position of a carrier to be detected due to the fact that the temperature sensing module breaks away from the limit of a PCB, and the position requirement in the actual use process is met.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic distribution diagram of circuit units on a conductive sheet according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a circuit unit according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of a circuit unit and a window unit corresponding thereto, and a connection between a first insulating film and a second insulating film according to an embodiment of the present application;

fig. 4 is a schematic diagram illustrating a pad portion and a window unit formed on a conductive sheet according to an embodiment of the present disclosure;

fig. 5 is a schematic view of a temperature sensing module on a carrier plate according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a temperature sensing module with a protection component according to an embodiment of the present disclosure;

fig. 7 is a schematic flowchart illustrating a process of manufacturing a temperature sensing module according to an embodiment of the disclosure.

In the figure: 1. a conductive sheet; 2. a line unit; 3. a pad part; 4. a first insulating film; 5. a second insulating film; 6. a thermistor window; 7. a sampling line window; 8. a thermistor; 9. a cover plate; 10. a base plate; 11. a temperature sensing hole; 12. heat dissipation holes; 13. a first mark; 14. a second mark; 15. a first compression roller set; 16. a second press-fit roller set; 17. a third press-fit roller set; 18. a carrier plate; 19. and (5) discharging waste films.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a temperature sensing module and a manufacturing method thereof, and aims to solve the problems that in the related art, a circuit is printed on a PCB, then a thermistor is arranged on the printed circuit to form the temperature sensing module with a complex structure, the complex process flow of the temperature sensing module is formed, and the production cost is greatly increased.

Referring to fig. 1-5, a temperature sensing module includes a conductive sheet 1, a first insulating film 4 and a second insulating film 5;

wherein, be equipped with a plurality of circuit units 2 on the conducting strip 1, every circuit unit 2 includes two independent closed circuits, and closed circuit encloses to close on conducting strip 1 and forms pad portion 3, and closed circuit can be rectangle, annular or polygon etc. this application embodiment does not do specific restriction to the concrete shape of closed circuit, specifically can set up according to actual demand, and then corresponding pad portion 3 also is corresponding shape.

The first insulating film 4 covers and is connected to the bottom of the conductive sheet 1, and has a bottom supporting and insulating function. The second insulating film 5 covers and is connected to the top of the conducting strip 1, the second insulating film 5 is provided with window units corresponding to the pad parts 3, and each window unit comprises a thermistor window 6 and a sampling line window 7, wherein the projections of the thermistor window 6 and the sampling line window 7 are respectively positioned at two ends of the corresponding pad part 3.

The first insulating film 4 and the second insulating film 5 may be transparent or opaque. The thermistor window 6 and the sample line window 7 are used for connecting the thermistor 8 and the sample box, respectively, at the positions of the first mark 13 and the second mark 14 shown in fig. 2.

Through above structure setting, this new construction's temperature sensing module, because it only has conducting strip 1 and the insulation system of its top below, in addition its circuit unit 2 once-through cutting shaping, subsequent process does not need to cut once more for the temperature sensing module is direct just can weld thermistor, does not need the PCB board to and carry out the operation technology of PCB board printed circuit, consequently very big reduction production manufacturing cost.

In addition, the temperature sensing module with the new structure is free from the limitation of a PCB, so that glue can be coated on the first insulating film 4 and then attached to any position of a carrier to be detected, and the position requirement in the actual use process is met.

As shown in fig. 5, in some preferred embodiments, each circuit unit 2 in the temperature sensing module corresponds to one thermistor 8, and the connection manner of the thermistor 8 is as follows:

the positive electrode of the thermistor 8 passes through the thermistor window 6 of one of the two pad portions 3 included in the corresponding wiring unit 2, and is connected to the pad portion 3;

the negative electrode of the thermistor 8 passes through the thermistor window 6 of the other pad portion 3 of the two pad portions 3 included in the corresponding wiring unit 2 and is connected to the pad portion 3, that is, the thermistor 8 connects the two pad portions 3 to form a circuit.

In some preferred embodiments, each of the sampling line windows 7 is provided with one sampling line, one end of which is connected to the pad portion 3 through the sampling line window 7, the sampling line supplies power to the thermistor 8, and the resistance change of the thermistor 8 is transmitted to the information collecting device.

As shown in fig. 6, the temperature sensing module with the thermistor 8 and the sampling line formed above is mostly soft, and only the first insulating film 4 and the second insulating film 5 are covered outside the temperature sensing module in the using process, so that the temperature sensing module is easily damaged by the outside; in addition, the following arrangement is also provided in consideration of the fact that the structure is not stable enough, and the adhesive tape is easy to deform and fix when being adhered to a measured object or a carrier:

and a protection component is wrapped outside the temperature sensing module, and the protection component comprises a bottom plate 10 covering and connected to the bottom of the first insulating film 4 and/or comprises a cover plate 9 covering and connected to the top of the second insulating film 5. For protection of the temperature sensing module, in a possible embodiment, the base plate 10 and the cover plate 9 are preferably made of hard, wear-resistant and light-weight material.

Further, in consideration of the fact that the temperature sensing module is directly attached to the object to be measured, in order to improve the temperature sensing capability of the thermistor 8, a temperature sensing hole 11 is formed in the bottom plate 10.

Further, in order to further improve the temperature sensing capability of the thermistor 8 and prevent heat from accumulating and staying on the temperature sensing module, the cover plate 9 is provided with heat dissipation holes 12 to improve the accuracy of temperature sensing.

In some preferred embodiments, the conductive sheet 1 is a flexible conductive sheet or a rigid conductive sheet, wherein the flexible conductive sheet has both conductivity and flexibility, such as: bending, stretching, twisting, etc., and for flexible conductive sheets, the more important property is the retention of electrical properties when subjected to these deformations. Such as copper foil, silver, etc.

In one possible embodiment, the conductive sheet 1 is a hard conductive sheet comprising a hard conductive metal or non-metallic material. .

The application also provides a manufacturing method of the temperature sensing module, which specifically comprises the following steps:

performing circuit cutting on the whole conducting strip 1 by using circular knife cutting equipment to form a plurality of circuit units 2 which are arranged in a rectangular array on the whole conducting strip 1; as shown in fig. 1.

After the conducting strip 1 finishes circuit cutting, a first insulating film 4 is pressed at the bottom of the conducting strip 1; as shown in fig. 2-4.

Forming a hole on the second insulating film 5 by using circular knife cutting equipment to form a thermistor window 6 and a sampling line window 7, and pressing the window on the top of the conducting plate 1 after the conducting plate 1 finishes circuit cutting; as shown in fig. 2-4.

And cutting and slicing the conducting strip 1 laminated with the first insulating film 4 and the second insulating film 5 by using circular knife cutting equipment to form a temperature sensing module.

In the above steps, the best mode is as follows: the first insulating film 4 is pressed on the bottom of the conducting plate 1, then the second insulating film 5 is opened to form a thermistor window 6 and a sampling line window 7, and the first insulating film is pressed on the top of the conducting plate 1.

Certainly, the hole is opened on the second insulating film 5 to form the thermistor window 6 and the sampling line window 7, and the two windows are pressed on the top of the conducting strip 1; then, the first insulating film 4 is laminated on the bottom of the conductive sheet 1.

And the step of forming the opening in the second insulating film 5 to form the thermistor window 6 and the sampling line window 7 and laminating on the top of the conductive sheet 1 and the step of laminating the first insulating film 4 on the bottom of the conductive sheet 1 may be performed simultaneously.

Through the steps, a PCB (printed Circuit Board) is not needed, and the operation process of PCB printed circuits is carried out, so that the production and manufacturing cost is greatly reduced.

In addition, the temperature sensing module with the new structure can be attached to any position of a carrier to be detected due to the fact that the temperature sensing module is free from the limitation of a PCB, and the position requirement in the actual use process is met.

In some preferred embodiments, the method for cutting and slicing the conductive sheet 1 laminated with the first insulating film 4 and the second insulating film 5 to form the temperature sensing module further comprises the following steps:

and (3) carrying out anti-oxidation treatment on the surfaces of the welding disc parts 3 exposed by the thermistor windows 6 and the sampling line windows 7 in the temperature sensing module to form a temperature sensing module plate capable of being subjected to reflow soldering.

Furthermore, each circuit unit 2 is correspondingly provided with a thermistor 8;

after forming the temperature sensing module board which can be subjected to reflow soldering, the method further comprises the following steps:

the thermistor 8 is soldered by reflow soldering;

and after welding is finished, performing three-proofing paint brushing treatment on the surface of the thermistor 8 to obtain a finished product.

As shown in fig. 7, in some preferred embodiments, the step of pressing the conductive sheet 1 after wire cutting on the first insulating film 4 specifically includes the following steps:

providing a first stitching roller set 15, which includes two first stitching rollers with opposite rotation directions, wherein the two first stitching rollers are arranged oppositely, and the opposite arrangement can be understood as that the two first stitching rollers are arranged in parallel rows at intervals, and the arrangement can include not only the up-and-down arrangement shown in the figure, but also the left-and-right inclined arrangement;

placing a first insulating film 4 under the conductive sheet 1; then sent together into the first press-fit roller group 15; the first insulating film 4 is laminated on the bottom of the conductive sheet 1 under the lamination by the first lamination roller. The first step of pressing is completed and the workpiece is transported to the next processing position along the feeding direction shown in fig. 7.

As shown in fig. 7, in some preferred embodiments, the specific operation of pressing the second insulating film 5 on top of the conductive sheet 1 is:

providing a second stitching roller group 16, wherein the second stitching roller group 16 comprises two second stitching rollers which are oppositely arranged, and the rotating directions of the two second stitching rollers are opposite;

placing a second insulating film 5 over the conductive sheet 1; then fed together into the second stitching roller set 16; the second insulating film 5 is laminated on top of the conductive sheet 1 under the lamination by the second lamination roller. This step is also as explained in the above description, and the bonding operation of the second insulating film 5 may be performed simultaneously with, subsequently to, or prior to the bonding operation of the first insulating film 4.

Further, since a waste material remains in the thermistor window 6 and the sampling line window 7 formed by opening the second insulating film 5, the welding of the thermistor 8 and the sampling line which affects the subsequent steps is not excluded, and therefore, the method includes the steps of:

the second stitching roller group 16 also comprises a film feeding roller which is close to one of the second stitching rollers and is opposite to the rotation direction of the second stitching roller; the film feeding roller is far away from the other second press roller;

after the opening of the second insulating film 5 and before the press-fitting of the second insulating film 5 with the conductive sheet 1, the method further comprises: the waste film 19 is fed together with the second insulating film 5 between the film feeding roller and the second nip roller adjacent to the film feeding roller to perform the insulating film waste discharging operation. The waste film 19 has a low viscosity, and is explained in detail with reference to fig. 7.

Firstly, placing the waste discharge film 19 above the second insulating film 5, and then feeding the waste discharge film 19 and the second insulating film into a space between the film feeding roller and a second pressing roller close to the film feeding roller, wherein the waste discharge film 19 penetrates through the space between the film feeding roller and the second pressing roller close to the film feeding roller and moves obliquely upwards; after the film feeding roller and the second pressing roller close to the film feeding roller are pressed, the waste materials are stuck on the waste discharge film 19, and the waste discharge operation is finished; the direction of conveyance of the waste film 19 and the second insulating film 5 at this time is opposite to the direction of conveyance of the conductive sheet 1 in the step of pressing the first insulating film 4 against the bottom of the conductive sheet 1.

And pressing the second insulating film 5 on the top of the conductive sheet 1 after the second insulating film 5 is discarded.

As shown in fig. 7, in some preferred embodiments, the dicing of the conductive sheet 1 with the first insulating film 4 and the second insulating film 5 laminated thereon includes the steps of:

providing a third pressing roller set 17 and slicing equipment, wherein the third pressing roller set 17 comprises two third pressing rollers which are oppositely arranged, and the rotating directions of the two third pressing rollers are opposite;

feeding the conductive sheet 1 laminated with the first insulating film 4 and the second insulating film 5 into the third press-fit roller group 17; after the third press-fit roller in the third press-fit roller group 17 rotates for one circle, the slicing device is used for cutting and slicing once.

It should be understood that, when a plurality of temperature sensing modules with thermistors 8 and sampling lines are formed on the conductive sheet according to the above steps, the conductive sheet is divided into a plurality of circuit units on each sheet according to actual use requirements. Wherein the diameter of the third stitching roller may be adjusted to vary the circumference to control the size of the segment.

Further, because the temperature sensing module who has thermistor 8 and sampling line that the aforesaid formed, most texture is softer to when not having foretell protection component, when the dress is on the testee, receive harm easily, later stage dismantlement also can be damaged, consequently considers subsequent use, need add a loading board 18, specific step is:

providing a bearing plate 18, wherein the bearing plate 18 is provided with a through hole; the carrier plate 18 may be FR4, aluminum plate, copper plate, etc., and may also be broadly understood as long as the hardness is sufficient to stabilize the material carrying the temperature sensing module.

The bottom of the temperature sensing module is coated with insulating glue, and then the carrier plate 18 is pressed or laid on the bottom of the conducting plate 1.

In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A manufacturing method of a temperature sensing module is characterized by comprising the following steps:

carrying out circuit cutting on the whole conducting strip (1) to form a plurality of circuit units (2);

after the conducting strip (1) finishes circuit cutting, pressing a first insulating film (4) at the bottom of the conducting strip (1);

forming a hole on the second insulating film (5) to form a thermistor window (6) and a sampling line window (7), and pressing the hole on the top of the conducting sheet (1) after the conducting sheet (1) completes circuit cutting;

and cutting and slicing the conducting sheet (1) laminated with the first insulating film (4) and the second insulating film (5) to form the temperature sensing module.

2. The method for manufacturing a temperature sensing module according to claim 1, wherein:

each circuit unit (2) is correspondingly provided with a thermistor (8);

the method comprises the following steps of cutting and slicing the conducting strip (1) laminated with the first insulating film (4) and the second insulating film (5) to form the temperature sensing module:

carrying out anti-oxidation treatment on the surfaces of the welding disc parts (3) exposed by the thermistor window (6) and the sampling line window (7) in the temperature sensing module to form a temperature sensing module plate capable of being subjected to reflow soldering;

welding the thermistor (8) on the temperature sensing module board through reflow soldering;

and after welding is finished, performing three-proofing paint brushing treatment on the surface of the thermistor (8) to obtain a finished product.

3. The method for manufacturing a temperature sensing module according to claim 1, wherein the step of pressing the circuit-cut conductive sheet (1) on the first insulating film (4) comprises the steps of:

providing a first stitching roller group (15) which comprises two first stitching rollers with opposite rotation directions, wherein the two first stitching rollers are oppositely arranged;

placing the first insulating film (4) under the conductive sheet (1); then feeding the first insulating film (4) and the conductive sheet (1) together into the first nip roller group (15);

and pressing the first insulating film (4) on the bottom of the conducting strip (1) under the pressing of the two first pressing rollers.

4. The method for manufacturing a temperature sensing module according to claim 1, wherein the step of pressing the second insulating film (5) on top of the conductive sheet (1) comprises the steps of:

providing a second stitching roller group (16) which comprises two oppositely arranged second stitching rollers, wherein the rotation directions of the two second stitching rollers are opposite;

-placing the second insulating film (5) over the conductive sheet (1); then feeding the second insulating film (5) and the conductive sheet (1) together into a second nip roller set (16);

and pressing the second insulating film (5) on the top of the conducting strip (1) under the pressing of the two second pressing rollers.

5. The method for manufacturing a temperature sensing module according to claim 4, wherein:

the second pressing roller group (16) also comprises a film feeding roller which is close to one of the second pressing rollers and is opposite to the rotation direction of the second pressing roller; the film feeding roller is far away from the other second laminating roller;

after the opening of the second insulating film (5) and before the press-fitting of the second insulating film (5) and the conductive sheet (1), the method further comprises:

the waste film (19) and the second insulating film (5) are fed together between the film feeding roller and the second nip roller adjacent to the film feeding roller to perform the insulating film waste discharging operation.

6. The method for manufacturing a temperature sensing module according to claim 1, wherein: the method is characterized in that the conducting strip (1) laminated with the first insulating film (4) and the second insulating film (5) is cut and sliced to form the temperature sensing module, and comprises the following steps:

providing a third pressing roller set (17) and slicing equipment, wherein the third pressing roller set (17) comprises two third pressing rollers which are oppositely arranged, and the rotating directions of the two third pressing rollers are opposite;

feeding the conductive sheet (1) laminated with the first insulating film (4) and the second insulating film (5) into a third laminating roller group (17);

and after the third press-fit roller in the third press-fit roller group (17) rotates for one circle, cutting and slicing are carried out once by using slicing equipment.

7. A temperature sensing module realized by the method for manufacturing a temperature sensing module according to any one of claims 1 to 6, comprising:

the circuit comprises a conducting strip (1), a plurality of circuit units (2) are arranged on the conducting strip (1), each circuit unit (2) comprises two independent closed circuits, and each closed circuit surrounds the conducting strip (1) to form a pad part (3);

a first insulating film (4) covering and connected to the bottom of the conductive sheet (1);

and the second insulating film (5) covers and is connected to the top of the conducting strip (1), window units corresponding to the pad part (3) are arranged on the second insulating film, and each window unit comprises a thermistor window (6) and a sampling line window (7) which are respectively positioned at two ends corresponding to the pad part (3) in a projection mode.

8. The temperature sensing module of claim 7, further comprising: a plurality of thermistors (8), the thermistors (8) corresponding to the line units (2) one by one;

the positive electrode of the thermistor (8) penetrates through a thermistor window (6) of one pad part (3) of the two pad parts (3) contained in the circuit unit (2) and is connected with the pad part (3);

the negative electrode of the thermistor (8) passes through the thermistor window (6) of the other pad part (3) of the two pad parts (3) contained in the circuit unit (2) and is connected with the pad part (3);

each sampling line window (7) is provided with a sampling line, and one end of each sampling line penetrates through the sampling line window (7) to be connected with the pad part (3).

9. The temperature sensing module of claim 7, further comprising: and the protection component is used for protecting the temperature sensing module.

10. The temperature sensing module of claim 9, wherein:

the protection component comprises a bottom plate (10) covering and connected to the bottom of the first insulating film (4) and a cover plate (9) covering and connected to the top of the second insulating film (5), and a temperature sensing hole (11) is formed in the bottom plate (10); and/or the presence of a gas in the gas,

the protection component comprises a bottom plate (10) covering and connected to the bottom of the first insulating film (4) and a cover plate (9) covering and connected to the top of the second insulating film (5), and heat dissipation holes (12) are formed in the cover plate (9).

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