CN115359022A - Power chip quality detection method and system - Google Patents

Power chip quality detection method and system Download PDF

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CN115359022A
CN115359022A CN202211051583.1A CN202211051583A CN115359022A CN 115359022 A CN115359022 A CN 115359022A CN 202211051583 A CN202211051583 A CN 202211051583A CN 115359022 A CN115359022 A CN 115359022A
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image
power supply
supply chip
module
pixel
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袁永斌
朱林
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Suzhou Zhimaixin Information Technology Co ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T5/70
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/10Segmentation; Edge detection
    • G06T7/13Edge detection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/74Image or video pattern matching; Proximity measures in feature spaces
    • G06V10/75Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video features; Coarse-fine approaches, e.g. multi-scale approaches; using context analysis; Selection of dictionaries
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/80Fusion, i.e. combining data from various sources at the sensor level, preprocessing level, feature extraction level or classification level
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20024Filtering details
    • G06T2207/20028Bilateral filtering
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20024Filtering details
    • G06T2207/20032Median filtering
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer

Abstract

The invention discloses a power supply chip quality detection method and a system, comprising S1, obtaining an appearance image of a pin of a power supply chip; s2, acquiring an image imgR of a red component, an image imgG of a green component and an image imgB of a blue component of the appearance image in an RGB color space; s3, respectively carrying out noise reduction treatment on the imgR, the imgG and the imgB to obtain images lwnsimgR, lwnsimgG and lwnsimgB; s4, respectively carrying out image segmentation processing on the lwnsimgR, the lwnsimgG and the lwnsimgB to obtain images sggimgR, sggimgG and sggimgB; s5, carrying out image fusion processing on the sgtimgR, the sgtimgG and the sgtimgB to obtain an image trgimg; s6, performing feature extraction on the trgimg to obtain feature information; and S7, judging whether the pin of the power supply chip passes the quality detection or not based on the characteristic information. According to the invention, image graying processing is not carried out before image segmentation, more detail information can be reserved than graying processing, and the accuracy of the result of detecting the pin of the power management chip by using an image recognition technology is effectively improved.

Description

Power chip quality detection method and system
Technical Field
The invention relates to the field of detection, in particular to a power supply chip quality detection method and system.
Background
A power supply chip is a chip that plays roles in conversion, distribution, detection, and other power management of power in an electronic equipment system. The CPU power supply amplitude is mainly identified, corresponding short moment waves are generated, and a post-stage circuit is pushed to output power.
After the power supply chip is produced, various quality detection needs to be carried out, in the aspect of pin detection, the prior art generally adopts an image identification mode to carry out detection, but the existing image identification process generally carries out the identification steps such as remaining noise reduction after carrying out graying processing on an image, and the processing mode is not beneficial to the retention of detail information, so that the image identification result is not accurate enough, and the quality detection result is influenced.
Disclosure of Invention
The invention aims to disclose a power supply chip quality detection method and system, which solve the problems that in the prior art, when the quality of a pin of a power supply chip is detected by adopting an image recognition technology, an image is grayed firstly, and then other recognition steps are carried out, so that the detail information is not sufficiently reserved, and the accuracy of an image recognition result is influenced.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a method for detecting quality of a power chip, including:
s1, obtaining an appearance image of a pin of a power supply chip;
s2, acquiring an image imgR of a red component, an image imgG of a green component and an image imgB of a blue component of the appearance image in an RGB color space;
s3, respectively carrying out noise reduction treatment on the imgR, the imgG and the imgB to obtain images lwnsimgR, lwnsimgG and lwnsimgB;
s4, respectively carrying out image segmentation processing on the lwnsimgR, the lwnsimgG and the lwnsimgB to obtain images sgtimgR, sgtimgG and sgtimgB;
s5, carrying out image fusion processing on the sgtimgR, the sgtimgG and the sgtimgB to obtain an image trgimg;
s6, performing feature extraction on the trgimg to obtain feature information;
and S7, judging whether the pin of the power supply chip passes the quality detection or not based on the characteristic information.
Preferably, the S1 includes:
an appearance image of a pin of a power supply chip is acquired using an industrial camera.
Preferably, the S3 includes:
for image I, I e { imgR, imgG, imgB }, the noise reduction is as follows:
respectively carrying out noise reduction processing on each pixel point in the image I by using a median filtering algorithm to obtain an image midI;
acquiring a set U of pixels to be processed in an image midI according to a set acquisition algorithm;
and respectively carrying out noise reduction treatment on each pixel point in the set U by using an improved bilateral filtering algorithm to obtain a noise-reduced image lwnsI.
Preferably, the acquiring a set U of to-be-processed pixel points in the image midI according to the set acquisition algorithm includes:
the pixel value of the pixel point pix in the image I is recorded as
Figure 530499DEST_PATH_IMAGE001
The pixel value of the pixel pix in the image midI is recorded as
Figure 775535DEST_PATH_IMAGE003
The coefficient of variation of the prime point pix is calculated using the following formula:
Figure 403875DEST_PATH_IMAGE005
in the formula (I), the compound is shown in the specification,
Figure 595822DEST_PATH_IMAGE006
the coefficient of variation is represented by a coefficient of variation,
Figure 19981DEST_PATH_IMAGE007
representing a preset pixel value change standard value;
judgment of
Figure 154028DEST_PATH_IMAGE006
And if so, storing the pixel point pix as a pixel point to be processed in the set U.
Preferably, the S4 includes:
the image segmentation process for image J, J ∈ { lwnsimgR, lwnsimgG, lwnsimgB }, is as follows:
dividing the image J into a plurality of sub-images with the same area;
carrying out edge detection on the image J to obtain a set of edge pixel points
Figure 686640DEST_PATH_IMAGE008
Will comprise
Figure 495327DEST_PATH_IMAGE008
In the collection of subimages of the pixels
Figure 429785DEST_PATH_IMAGE009
Using image segmentation algorithm to respectively pair
Figure 485466DEST_PATH_IMAGE009
Each subimage in the image segmentation processing unit is used for carrying out image segmentation processing to obtain a set of foreground pixel points
Figure 348118DEST_PATH_IMAGE010
Will be at
Figure 898179DEST_PATH_IMAGE010
The pixel points in the area are connected into pixel points in the area and
Figure 483881DEST_PATH_IMAGE010
and taking the image formed by the pixel points in the image J as an image obtained by performing image segmentation processing on the image J.
Preferably, the edge detection is performed on the image J,obtaining a set of edge pixels
Figure 959731DEST_PATH_IMAGE011
The method comprises the following steps:
carrying out edge detection on the image J by using a Marr-Hildreth algorithm to obtain a set of edge pixel points
Figure 60411DEST_PATH_IMAGE012
Preferably, the S5 includes:
respectively calculating the self-adaptive fusion weights of sgtimgR, sgtimgG and sgtimgB
Figure 883004DEST_PATH_IMAGE014
Respectively storing pixel points in the sgtimgR, sgtimgG and sgtimgB into sets sgtimgRU, sgtimgGU and sgtimgBU,
acquiring intersection uniU of sgtmsgRU, sgtmsgU and sgtmsgBU;
for a pixel point appix in the uniU, a pixel value trgimg (appix) of the appix in the image trgimg is obtained by using the following formula:
Figure 652375DEST_PATH_IMAGE015
in the formula (I), the compound is shown in the specification,
Figure 784279DEST_PATH_IMAGE016
respectively, the pixel values of appix in sgimgr, sgimgg, sgimgb.
Preferably, the S6 includes:
and performing feature extraction on the trgimg by using a SUFR algorithm to obtain feature information.
Preferably, the S7 includes:
matching the characteristic information acquired from the image trgimg with the corresponding characteristic information of the preset defect type, and if the matching is successful, indicating that the pin of the power supply chip does not pass the quality detection; and if the matching fails, indicating that the pin of the power supply chip passes the quality detection.
On the other hand, the invention provides a power chip quality detection system, which comprises a shooting module, a component image acquisition module, a noise reduction module, an image segmentation module, an image fusion module, a feature extraction module and a quality detection module;
the shooting module is used for acquiring an appearance image of a pin of the power supply chip;
the component image acquisition module is used for acquiring an image imgR of a red component, an image imgG of a green component and an image imgB of a blue component of the appearance image in an RGB color space;
the noise reduction module is used for respectively carrying out noise reduction processing on imgR, imgG and imgB to obtain images lwnsimgR, lwnsimgG and lwnsimgB;
the image segmentation module is used for respectively carrying out image segmentation on lwnsimgR, lwnsimgG and lwnsimgB to obtain images sgtimgR, sgtimgG and sgtimgB;
the image fusion module is used for carrying out image fusion processing on the sgtimgR, the sgtimgG and the sgtimgB to obtain an image trgimg;
the characteristic extraction module is used for extracting characteristics of the trgimg to obtain characteristic information;
the quality detection module is used for judging whether the pins of the power supply chip pass quality detection or not based on the characteristic information.
When the pin of the power management chip is processed by using an image recognition technology, the component images of red, green and blue are obtained firstly, then the noise reduction and image segmentation processing are respectively carried out on the component images, then the three images obtained by the segmentation processing are subjected to fusion processing, finally the image obtained by the fusion processing is subjected to feature extraction, and the quality detection is carried out based on the obtained feature information. Compared with the prior art, the invention does not carry out image graying processing before image segmentation, and the graying processing is a dimension reduction process, so that more detail information can be reserved than the graying processing, and the accuracy of the result of detecting the pin of the power management chip by using the image identification technology is effectively improved.
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The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be obtained on the basis of the following drawings without inventive effort.
Fig. 1 is a diagram of an embodiment of a method for detecting quality of a power chip according to the present invention.
Fig. 2 is a diagram of a power chip quality detection system according to an embodiment of the invention.
Detailed Description
Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout. In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.
In one aspect, as shown in an embodiment of fig. 1, the present invention provides a method for detecting quality of a power chip, including:
s1, obtaining an appearance image of a pin of a power supply chip;
s2, acquiring an image imgR of a red component, an image imgG of a green component and an image imgB of a blue component of the appearance image in an RGB color space;
s3, respectively carrying out noise reduction treatment on the imgR, the imgG and the imgB to obtain images lwnsimgR, lwnsimgG and lwnsimgB;
s4, respectively carrying out image segmentation processing on the lwnsimgR, the lwnsimgG and the lwnsimgB to obtain images sggimgR, sggimgG and sggimgB;
s5, carrying out image fusion processing on the sgtimgR, the sgtimgG and the sgtimgB to obtain an image trgimg;
s6, performing feature extraction on the trgimg to obtain feature information;
and S7, judging whether the pin of the power supply chip passes the quality detection or not based on the characteristic information.
When the pin of the power management chip is processed by using an image recognition technology, the component images of red, green and blue are obtained firstly, then the noise reduction and image segmentation processing are respectively carried out on the component images, then the three images obtained by the segmentation processing are subjected to fusion processing, finally the image obtained by the fusion processing is subjected to feature extraction, and the quality detection is carried out based on the obtained feature information. Compared with the prior art, the invention does not carry out image graying processing before image segmentation, and the graying processing is a dimension reduction process, so that more detail information can be reserved than the graying processing, and the accuracy of the result of detecting the pin of the power management chip by using the image identification technology is effectively improved.
Taking an RGB image as an example, after the image is grayed, the detail information contained in the image is reduced from 3 channels to 1 channel, which also enables the detail information to be greatly reduced. The detail information has an important influence on whether the image can be accurately segmented, so that the accuracy of image segmentation can be influenced after dimension reduction.
Preferably, the S1 includes:
an industrial camera is used to acquire an appearance image of the pins of the power supply chip.
Preferably, the S3 includes:
for image I, I ∈ { imgR, imgG, imgB }, the noise reduction mode is as follows:
respectively carrying out noise reduction processing on each pixel point in the image I by using a median filtering algorithm to obtain an image midI;
acquiring a set U of pixels to be processed in the image midI according to a set acquisition algorithm;
and respectively carrying out noise reduction treatment on each pixel point in the set U by using an improved bilateral filtering algorithm to obtain a noise-reduced image lwnsI.
Different from the existing one-step noise reduction mode, the invention carries out two-step noise reduction processing, firstly carries out rapid first-step noise reduction processing through a median filtering algorithm, then obtains the pixel points to be processed needing second-step noise reduction processing according to the image obtained by the first-step noise reduction processing, and then carries out noise reduction processing on the pixel points to be processed. The pixels to be processed are all noise pixels with greatly changed pixel values after the first step of noise reduction processing, so that the selected noise pixels are subjected to the second step of noise reduction processing again on the basis of the first step of noise reduction processing, and the accuracy of the noise reduction processing result is further improved. Because all the pixel points are not processed in the second step, compared with the noise reduction in one step, the method can greatly improve the accuracy of the noise reduction result on the premise of increasing smaller noise reduction time.
Preferably, the improved bilateral filtering algorithm comprises:
Figure 122988DEST_PATH_IMAGE017
in the formula (I), the compound is shown in the specification,
Figure 998540DEST_PATH_IMAGE019
representing the pixel value of the pixel point q after the noise reduction processing is carried out on the pixel point q by using an improved bilateral filtering algorithm; setq representing pixel point q
Figure 604840DEST_PATH_IMAGE020
A collection of pixel points in a neighborhood of size,
Figure 189536DEST_PATH_IMAGE022
representing the distance between pixel point r and pixel point q,
Figure 936912DEST_PATH_IMAGE023
the standard deviation representing the distance between the pixel point in setq and the pixel point r,
Figure 662160DEST_PATH_IMAGE024
and
Figure 76961DEST_PATH_IMAGE025
respectively representing the pixel values of pixel points q and r,
Figure 98138DEST_PATH_IMAGE026
a standard deviation representing the difference in pixel values between the pixel point in setq and the pixel point r,
Figure 332810DEST_PATH_IMAGE027
Figure 65012DEST_PATH_IMAGE028
which represents a preset weight coefficient for the weight of the image,
Figure 599898DEST_PATH_IMAGE029
and
Figure 526397DEST_PATH_IMAGE030
respectively representing the gradient amplitudes of the pixel points q and r,
Figure 513945DEST_PATH_IMAGE031
the standard deviation representing the difference in gradient magnitude between the pixel point in setq and the pixel point r.
Compared with the existing bilateral filtering algorithm, the invention also considers the aspect of gradient amplitude, and carries out weighted fusion on the original filtering result and the filtering result in the aspect of increased gradient amplitude by setting the weight coefficient, thereby obtaining a more accurate noise reduction result.
Preferably, the acquiring a set U of to-be-processed pixel points in the image midI according to the set acquisition algorithm includes:
recording the pixel value of the pixel point pix in the image I
Figure 55696DEST_PATH_IMAGE001
The pixel value of the pixel pix in the image midI is recorded as
Figure 179510DEST_PATH_IMAGE032
The coefficient of variation of the prime point pix is calculated using the following formula:
Figure 808069DEST_PATH_IMAGE034
in the formula (I), the compound is shown in the specification,
Figure 328918DEST_PATH_IMAGE006
the coefficient of variation is represented by a coefficient of variation,
Figure 419234DEST_PATH_IMAGE007
representing a preset pixel value change standard value;
judgment of
Figure 617128DEST_PATH_IMAGE035
And if so, storing the pixel point pix as a pixel point to be processed in the set U.
Preferably, the S4 includes:
the image segmentation process for image J, J ∈ { lwnsimgR, lwnsimgG, lwnsimgB }, is as follows:
dividing the image J into a plurality of sub-images with the same area;
carrying out edge detection on the image J to obtain a set of edge pixel points
Figure 665855DEST_PATH_IMAGE008
Will comprise
Figure 877263DEST_PATH_IMAGE008
In the collection of subimages of the pixels
Figure 505690DEST_PATH_IMAGE009
Using image segmentation algorithm to respectively pair
Figure 620408DEST_PATH_IMAGE009
Each subimage in the image segmentation processing unit is used for carrying out image segmentation processing to obtain a set of foreground pixel points
Figure 43299DEST_PATH_IMAGE010
Will be at
Figure 945265DEST_PATH_IMAGE010
The pixel points in the area are connected into pixel points in the area and
Figure 174121DEST_PATH_IMAGE010
and taking the image formed by the pixel points in the image J as an image obtained by performing image segmentation processing on the image J.
When the image is divided, the sub-images are firstly acquired, then the sub-images which need to be divided are divided, and finally the final overall division result is acquired based on the division results of the plurality of sub-images. Compared with the existing image segmentation algorithm, the method has the advantage that the number of pixel bands required to be subjected to image segmentation is greatly reduced, so that the efficiency of image segmentation processing is effectively improved. For the sub-images not containing the edge pixel points, the sub-images may belong to a background part or a foreground part, therefore, the sub-images are not subjected to image segmentation, and the image segmentation of the pixel points can obtain an error segmentation result, namely, the pixel points which are originally the background part are forcibly divided into parts to be used as the pixel points of the foreground part, or the pixel points which are originally the foreground part are forcibly divided into parts to be used as the pixel points of the background part. In addition, since the sub-image has a much smaller area than the entire image, a partial region of the entire image is divided at the time of image division, and there is no need to consider other parts, so that the result of division is more accurate.
In obtaining a collection
Figure 877766DEST_PATH_IMAGE036
Then, since the image J also has the foreground pixel points, the invention firstly gathers the pixels
Figure 471558DEST_PATH_IMAGE037
The pixel points in the image segmentation method are used as partial foreground to form a region with a hollow middle, and all the pixel points in the region are used as foreground pixel points.
Preferably, the edge detection is performed on the image J to obtain a set of edge pixel points
Figure 182857DEST_PATH_IMAGE012
The method comprises the following steps:
carrying out edge detection on the image J by using a Marr-Hildreth algorithm to obtain a set of edge pixel points
Figure 621928DEST_PATH_IMAGE038
Preferably, the S5 includes:
respectively calculating the self-adaptive fusion weights of sgtimgR, sgtimgG and sgtimgB
Figure 976817DEST_PATH_IMAGE039
Respectively storing the pixel points in the sgtimgR, sgtimgG and sgtimgB into the sets sgtimgU, sgtimgGU and sgtimgBU,
acquiring intersection uniU of sgtmsgRU, sgtmsgU and sgtmsgBU;
for a pixel point appix in the uniU, a pixel value trgimg (appix) of the appix in the image trgimg is obtained by using the following formula:
Figure 53095DEST_PATH_IMAGE040
in the formula (I), the compound is shown in the specification,
Figure 945965DEST_PATH_IMAGE042
respectively, the pixel values of appix in sgimgr, sgimgg, sgimgb.
Preferably, the S6 includes:
when the image fusion is carried out, the self-adaptive fusion weight is adopted, so that compared with the conventional fusion mode set as a fixed weight, the pixel distribution histogram of the fusion result of the invention is closer to the original pixel distribution histogram, and the fusion is more accurate.
Preferably, the adaptive fusion weight is calculated by using the following formula:
Figure 267356DEST_PATH_IMAGE044
Figure 709708DEST_PATH_IMAGE046
in the formula (I), the compound is shown in the specification,
Figure 458352DEST_PATH_IMAGE048
the distribution represents an average value of pixel values of pixel points in the images sgtimgR, sgtimgG, sgtimgB.
When the self-adaptive weight is calculated, starting from the pixel value mean value of the pixel points of the three images, the larger the mean value is, the higher the importance degree of the component in the original pixel value is, and therefore, the accuracy of the image fusion result can be effectively improved.
And performing feature extraction on the trgimg by using a SUFR algorithm to obtain feature information.
Preferably, the S7 includes:
matching the feature information acquired from the image trgimg with the feature information corresponding to the preset defect type, and if the matching is successful, indicating that the pin of the power supply chip does not pass the quality detection; and if the matching fails, indicating that the pin of the power supply chip passes the quality detection.
Specifically, the defect types of the pins include that the number of the pins does not meet the set number requirement, the length of the pins does not meet the set length requirement, and the like, and the bending degree of the pins is too large.
On the other hand, as shown in fig. 2, the invention provides a power chip quality detection system, which includes a shooting module, a component image obtaining module, a noise reduction module, an image segmentation module, an image fusion module, a feature extraction module and a quality detection module;
the shooting module is used for acquiring an appearance image of a pin of the power supply chip;
the component image acquisition module is used for acquiring an image imgR of a red component, an image imgG of a green component and an image imgB of a blue component of the appearance image in an RGB color space;
the noise reduction module is used for respectively carrying out noise reduction processing on imgR, imgG and imgB to obtain images lwnsimgR, lwnsimgG and lwnsimgB;
the image segmentation module is used for respectively carrying out image segmentation processing on the lwnsimgR, the lwnsimgG and the lwnsimgB to obtain images sggimgR, sggimgG and sggimgB;
the image fusion module is used for carrying out image fusion processing on the sgtimgR, the sgtimgG and the sgtimgB to obtain an image trgimg;
the characteristic extraction module is used for extracting characteristics of the trgimg to obtain characteristic information;
the quality detection module is used for judging whether the pins of the power supply chip pass quality detection or not based on the characteristic information.
In the description herein, references to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more program modules for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present application includes additional implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.
Although embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (10)

1. A power supply chip quality detection method is characterized by comprising the following steps:
s1, obtaining an appearance image of a pin of a power supply chip;
s2, acquiring an image imgR of a red component, an image imgG of a green component and an image imgB of a blue component of the appearance image in an RGB color space;
s3, respectively carrying out noise reduction treatment on the imgR, the imgG and the imgB to obtain images lwnsimgR, lwnsimgG and lwnsimgB;
s4, respectively carrying out image segmentation processing on the lwnsimgR, the lwnsimgG and the lwnsimgB to obtain images sgtimgR, sgtimgG and sgtimgB;
s5, carrying out image fusion processing on the sgtimgR, the sgtimgG and the sgtimgB to obtain an image trgimg;
s6, performing feature extraction on the trgimg to obtain feature information;
and S7, judging whether the pin of the power supply chip passes the quality detection or not based on the characteristic information.
2. The method for detecting the quality of the power supply chip as claimed in claim 1, wherein the step S1 comprises:
an industrial camera is used to acquire an appearance image of the pins of the power supply chip.
3. The method for detecting the quality of the power supply chip as claimed in claim 2, wherein the step S3 comprises:
for image I, I ∈ { imgR, imgG, imgB }, the noise reduction mode is as follows:
respectively carrying out noise reduction processing on each pixel point in the image I by using a median filtering algorithm to obtain an image midI;
acquiring a set U of pixels to be processed in the image midI according to a set acquisition algorithm;
and respectively carrying out noise reduction treatment on each pixel point in the set U by using an improved bilateral filtering algorithm to obtain a noise-reduced image lwnsI.
4. The method for detecting the quality of the power supply chip according to claim 3, wherein the obtaining the set U of the pixels to be processed in the image midI according to the set obtaining algorithm includes:
the pixel value of the pixel point pix in the image I is recorded as
Figure 719447DEST_PATH_IMAGE001
Recording the pixel value of the pixel pix in the image midI
Figure 182658DEST_PATH_IMAGE002
The coefficient of variation of the prime point pix is calculated using the following formula:
Figure 275248DEST_PATH_IMAGE003
in the formula (I), the compound is shown in the specification,
Figure 761593DEST_PATH_IMAGE004
the coefficient of variation is represented by a coefficient of variation,
Figure 597831DEST_PATH_IMAGE005
representing a preset pixel value change standard value;
judgment of
Figure 790915DEST_PATH_IMAGE004
And if the pixel point pix is larger than the set change coefficient threshold, storing the pixel point pix as the pixel point to be processed into the set U.
5. The method for detecting the quality of the power supply chip as claimed in claim 1, wherein the step S4 comprises:
the image segmentation process for image J, J ∈ { lwnsimgR, lwnsimgG, lwnsimgB }, is as follows:
dividing the image J into a plurality of sub-images with the same area;
performing edge detection on the image J to obtain a set of edge pixel points
Figure 325845DEST_PATH_IMAGE006
Will comprise
Figure 112535DEST_PATH_IMAGE006
In the collection of subimages of the pixels
Figure 752464DEST_PATH_IMAGE007
Using image segmentation algorithm to respectively pair
Figure 331213DEST_PATH_IMAGE007
Each subimage in the image segmentation processing unit is used for carrying out image segmentation processing to obtain a set of foreground pixel points
Figure 93501DEST_PATH_IMAGE008
Will be at
Figure 554438DEST_PATH_IMAGE008
The pixel points in the area are connected into pixel points in the area and
Figure 935741DEST_PATH_IMAGE008
and taking the image formed by the pixel points as an image obtained by performing image segmentation on the image J.
6. The method according to claim 5, wherein the image J is subjected to edge detection to obtain a set of edge pixels
Figure 165734DEST_PATH_IMAGE006
The method comprises the following steps:
carrying out edge detection on the image J by using a Marr-Hildreth algorithm to obtain a set of edge pixel points
Figure 115236DEST_PATH_IMAGE006
7. The method for detecting the quality of the power supply chip as claimed in claim 1, wherein the step S5 comprises:
respectively calculating the self-adaptive fusion weights of sgtimgR, sgtimgG and sgtimgB
Figure 735573DEST_PATH_IMAGE009
Respectively storing the pixel points in the sgtimgR, sgtimgG and sgtimgB into the sets sgtimgU, sgtimgGU and sgtimgBU,
acquiring intersection uniU of sgtmmgU, sgtmmgGU and sgtmmgBU;
for a pixel point appix in the uniU, a pixel value trgimg (appix) of the appix in the image trgimg is obtained by using the following formula:
Figure 462DEST_PATH_IMAGE010
in the formula (I), the compound is shown in the specification,
Figure 819382DEST_PATH_IMAGE011
respectively, the pixel values of appix in sgimgr, sgimgg, sgimgb.
8. The method for detecting the quality of the power supply chip as claimed in claim 1, wherein the step S6 comprises:
and performing feature extraction on the trgimg by using a SUFR algorithm to obtain feature information.
9. The method for detecting the quality of the power supply chip as claimed in claim 1, wherein the step S7 comprises:
matching the feature information acquired from the image trgimg with the feature information corresponding to the preset defect type, and if the matching is successful, indicating that the pin of the power supply chip does not pass the quality detection; and if the matching fails, indicating that the pin of the power supply chip passes the quality detection.
10. A power chip quality detection system is characterized by comprising a shooting module, a component image acquisition module, a noise reduction module, an image segmentation module, an image fusion module, a feature extraction module and a quality detection module;
the shooting module is used for acquiring an appearance image of a pin of the power supply chip;
the component image acquisition module is used for acquiring an image imgR of a red component, an image imgG of a green component and an image imgB of a blue component of the appearance image in an RGB color space;
the noise reduction module is used for respectively carrying out noise reduction processing on the imgR, the imgG and the imgB to obtain images lwnsimgR, lwnsimgG and lwnsimgB;
the image segmentation module is used for respectively carrying out image segmentation processing on the lwnsimgR, the lwnsimgG and the lwnsimgB to obtain images sggimgR, sggimgG and sggimgB;
the image fusion module is used for carrying out image fusion processing on the sgtimgR, the sgtimgG and the sgtimgB to obtain an image trgimg;
the characteristic extraction module is used for extracting characteristics of the trgimg to obtain characteristic information;
the quality detection module is used for judging whether the pins of the power supply chip pass quality detection or not based on the characteristic information.
CN202211051583.1A 2022-08-31 2022-08-31 Power chip quality detection method and system Pending CN115359022A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038494A (en) * 2023-10-10 2023-11-10 天津芯成半导体有限公司 Auxiliary intelligent detection system for chip processing industry

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117038494A (en) * 2023-10-10 2023-11-10 天津芯成半导体有限公司 Auxiliary intelligent detection system for chip processing industry
CN117038494B (en) * 2023-10-10 2023-12-15 天津芯成半导体有限公司 Auxiliary intelligent detection system for chip processing industry

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