CN115353848B - Ceramic tile adhesive composition - Google Patents
Ceramic tile adhesive composition Download PDFInfo
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- CN115353848B CN115353848B CN202211130466.4A CN202211130466A CN115353848B CN 115353848 B CN115353848 B CN 115353848B CN 202211130466 A CN202211130466 A CN 202211130466A CN 115353848 B CN115353848 B CN 115353848B
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- 239000000203 mixture Substances 0.000 title claims abstract description 74
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 68
- 239000000853 adhesive Substances 0.000 title claims abstract description 67
- 239000000919 ceramic Substances 0.000 title claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 50
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 25
- 239000002270 dispersing agent Substances 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000005871 repellent Substances 0.000 claims abstract description 19
- 230000002940 repellent Effects 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 239000010954 inorganic particle Substances 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 12
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 229920002647 polyamide Polymers 0.000 claims description 6
- 239000006004 Quartz sand Substances 0.000 claims description 5
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 5
- 229910052604 silicate mineral Inorganic materials 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 239000004576 sand Substances 0.000 claims description 4
- 239000010456 wollastonite Substances 0.000 claims description 4
- 229910052882 wollastonite Inorganic materials 0.000 claims description 4
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 150000003672 ureas Chemical class 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 23
- 239000004034 viscosity adjusting agent Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 16
- 239000008187 granular material Substances 0.000 description 12
- 238000010276 construction Methods 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 239000004568 cement Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 6
- 229910003475 inorganic filler Inorganic materials 0.000 description 6
- 230000009974 thixotropic effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000009472 formulation Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 101100136092 Drosophila melanogaster peng gene Proteins 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000003469 silicate cement Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a tile adhesive composition, which comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 1:1: (4-8); wherein the component A comprises the following components in parts by weight: 9-10 parts of liquid epoxy resin, 0.1-1 part of first viscosity regulator and 0.1-1 part of liquid thixotropic agent; the component B comprises the following components in parts by weight: 9-10 parts of epoxy resin curing agent, 0.1-1 part of second viscosity regulator and 0.1-1 part of dispersing agent; the component C comprises the following components in parts by weight: 10-40 parts of inorganic powder, 20-50 parts of inorganic particle materials, 0.1-1 part of powder thixotropic agent and 0.1-1 part of water repellent. The ceramic tile adhesive composition has the advantages of strong adhesiveness, no corrosion to metal, glass and the like.
Description
Technical Field
The invention belongs to the technical field of building materials, and particularly relates to a tile adhesive composition.
Background
With the development of the building decoration industry, people have increasingly high requirements on decoration attractiveness. In order to match different decorative effects, besides common ceramic tiles, decorative materials made of metal, glass and other materials are widely applied to the decoration field.
In the prior art, a cement-based adhesive is generally adopted to fix the decorative material and the base layer, and because the cement-based adhesive takes silicate cement as a main component, the cement-based adhesive is easy to corrode materials such as metal and glass, and blackening phenomenon occurs; secondly, the cement-based adhesive has low bonding strength, is not firm in bonding, and is easy to fall off.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a ceramic tile adhesive composition, which has the advantages of strong adhesiveness, no corrosion to metal, glass and the like.
The ceramic tile adhesive composition provided by the invention comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 1:1: (4-8); wherein the component A comprises the following components in parts by weight: 9-10 parts of liquid epoxy resin, 0.1-1 part of first viscosity regulator and 0.1-1 part of liquid thixotropic agent; the component B comprises the following components in parts by weight: 9-10 parts of epoxy resin curing agent, 0.1-1 part of second viscosity regulator and 0.1-1 part of dispersing agent; the component C comprises the following components in parts by weight: 10-40 parts of inorganic powder, 20-50 parts of inorganic particle materials, 0.1-2 parts of powder thixotropic agent and 0.1-5 parts of water repellent.
According to one embodiment of the present invention, the liquid epoxy resin comprises bisphenol a type epoxy resin.
According to an embodiment of the present invention, the first viscosity modifier and the second viscosity modifier each independently include at least one of a phosphate-based viscosity modifier, a polyamide-based viscosity modifier, and a polyurethane-based viscosity modifier.
According to an embodiment of the invention, the liquid thixotropic agent comprises at least one of a modified urea-based thixotropic agent, a polyamide-based thixotropic agent.
According to one embodiment of the present invention, the epoxy resin curing agent includes an aliphatic amine type curing agent.
According to an embodiment of the present invention, the dispersant includes at least one of a silicone-based dispersant, a polyacrylate-based dispersant, and a polyurethane-based dispersant.
According to an embodiment of the present invention, the powder comprises at least one of heavy calcium carbonate powder, quartz powder, wollastonite powder, and the powder has an average particle size of 100 to 400 mesh.
According to one embodiment of the invention, the granules comprise at least one of quartz sand and river sand, and the average particle size of the granules is 40-100 meshes.
According to one embodiment of the invention, the powder thixotropic agent comprises a silicate mineral.
According to one embodiment of the invention, the water repellent comprises a silicone-based water repellent.
The implementation of the invention has at least the following beneficial effects:
according to the tile adhesive composition, due to the chemical activity of epoxy groups in the liquid epoxy resin of the component A, the epoxy resin curing agent of the component B and the liquid epoxy resin of the component A can be utilized to carry out curing and crosslinking reaction to form a reticular structure, so that the adhesiveness is improved, and the grading among the components of the component C is utilized to enable the component C to be filled in the pores of the reticular structure, so that the adhesive property and the anti-slip property of the composition are improved, the falling off is prevented, and the hollowing phenomenon is avoided. In addition, the tile adhesive composition provided by the invention is neutral, does not corrode metal, glass and the like, has a wide application range, and is especially suitable for decorative materials of metal, glass and the like.
Detailed Description
The following detailed description is merely illustrative of the principles and features of the present invention, and examples are set forth for the purpose of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be made by those skilled in the art based on the examples of the invention without making any inventive effort, are intended to be within the scope of the invention.
The ceramic tile adhesive composition provided by the invention comprises a component A, a component B and a component C, wherein the mass ratio of the component A to the component B to the component C is 1:1: (4-8); wherein the component A comprises the following components in parts by weight: 9-10 parts of liquid epoxy resin, 0.1-1 part of first viscosity regulator and 0.1-1 part of liquid thixotropic agent; the component B comprises the following components in parts by weight: 9-10 parts of epoxy resin curing agent, 0.1-1 part of second viscosity regulator and 0.1-1 part of dispersing agent; the component C comprises the following components in parts by weight: 10-40 parts of inorganic powder, 20-50 parts of inorganic particle materials, 0.1-2 parts of powder thixotropic agent and 0.1-5 parts of water repellent.
The liquid epoxy resin in the invention is in a liquid state at normal temperature, namely a polymer containing more than two epoxy groups in the molecule, and is used as the main component of the tile adhesive composition, and the liquid epoxy resin and the curing agent are subjected to curing reaction to generate the netty three-dimensional polymer.
The first viscosity modifier is used for improving the rheological property of the liquid epoxy resin, and the liquid thixotropic agent is used for adjusting the thixotropic property of the liquid epoxy resin.
The epoxy resin curing agent refers to a curing agent capable of chemically reacting with a liquid epoxy resin. The second viscosity modifier is used to improve the rheology of the epoxy resin curing agent.
The inorganic filler has the advantages of stable performance, low cost and the like, and can be divided into powder and granule according to the size of the particle size, wherein the inorganic filler with the particle size of more than 200 meshes is powder, and the inorganic filler with the particle size of less than 200 meshes is granule.
The powder thixotropic agent is used for adjusting thixotropic properties of powder and granular materials. The water repellent agent is introduced into the ceramic tile adhesive composition, so that a water repellent layer can be formed, and the ceramic tile adhesive composition has a water repellent effect.
The inventor finds that the epoxy resin curing agent in the component B and the liquid epoxy resin in the component A are utilized to carry out curing and crosslinking reaction to form a polymer with a net structure, and then the inorganic filler in the component C is utilized to be matched with the inorganic filler in the component C, so that the inorganic filler in the component C is filled in the pores of the formed net structure, the bonding performance and the anti-slip performance of the adhesive are further improved, the falling off is prevented, the hollowing phenomenon is not generated, and the bonding force of the ceramic tile adhesive composition to various materials is very strong. In addition, the ceramic tile adhesive composition provided by the invention is neutral after being cured, does not react with metal, glass and other decorative materials, and cannot corrode the metal, glass and other materials.
According to the technical scheme of the invention, the application method of the ceramic tile adhesive composition comprises the following steps: uniformly mixing the component A, the component B and the component C in the ceramic tile adhesive composition according to a certain mass ratio to form a mixture, coating the mixture on the back surface of the decorative material and the base layer, bonding the surface of the decorative material coated with the mixture with the base layer, and forming an adhesive layer between the decorative material and the base layer after curing. Wherein the base layer can be a wall or floor.
The liquid epoxy resin of the present invention is in a transparent liquid state, and the specific type thereof is not limited, and may be a liquid epoxy resin which is conventional in the art, for example, a bisphenol a type epoxy resin or a bisphenol F type epoxy resin, and in one embodiment of the present invention, a bisphenol a type epoxy resin is preferable, and the bisphenol a type epoxy resin is a polymer compound obtained by reacting bisphenol a and epichlorohydrin.
In the practice of the present invention, the liquid epoxy resin has an epoxy value of 0.48 to 0.54mol/g, and the epoxy value of the liquid epoxy resin refers to the amount of epoxy group-containing substance in 100g of the liquid epoxy resin.
The epoxy resin curing agent is in a transparent liquid state at normal temperature, and can be subjected to curing and crosslinking reaction with the liquid epoxy resin in the component A to form a polymer with a net structure. The epoxy resin curing agent may be a curing agent conventional in the art including, but not limited to, aliphatic amine based curing agents.
In the practice of the invention, the viscosity of the epoxy resin curing agent ranges from 5000 to 10000mPas, wherein the viscosity of the epoxy resin curing agent is measured at a temperature of 23℃and a humidity of RH 50%.
The tile adhesive composition provided by the invention is used for bonding decorative materials including tiles and a base layer, and the polymer with a reticular structure formed by the reaction of the liquid epoxy resin and the epoxy resin curing agent is the main component in the bonding layer, so that the bonding capability is strong, and the tile adhesive composition has certain flexibility under the condition of sufficient bonding strength, effectively avoids the phenomenon of hollowing and falling of the tiles, ensures the bonding stability, meets the actual engineering requirements, and is especially suitable for the base layer which is likely to deform.
According to the technical scheme of the invention, the first viscosity modifier and the second viscosity modifier promote the generation of the polymer with the network structure by improving the rheological property of the component A and the rheological property of the component B respectively, and the first viscosity modifier and the second viscosity modifier can be the same or different and respectively and independently comprise at least one of phosphate viscosity modifiers, polyamide viscosity modifiers and polyurethane viscosity modifiers. For example, it may be commercially available from Acidoma under the product model number LA-150 or from core chemistry under the product model number D790.
In the present invention, the liquid thixotropic agent includes, but is not limited to, at least one of a modified urea-based thixotropic agent and a polyamide-based thixotropic agent. By adding the liquid thixotropic agent, the thixotropic property of the A component can be improved, the generation of the polymer with the net structure is promoted by improving the thixotropic property of the A component, and the anti-slip performance of the adhesive is further improved, and particularly, the slip of the elevation construction can be reduced.
Dispersants are typically added to promote the formation of a uniform and stable system for the B component, wherein the dispersants may be conventional dispersants in the art, and in the practice of the present invention, the dispersants include at least one of silicone based dispersants, polyacrylate based dispersants, polyurethane based dispersants.
In the invention, the powder comprises at least one of heavy calcium carbonate powder, quartz powder and wollastonite powder, and has the advantages of stable performance, low cost and the like.
The particle size composition of the powder is reasonably controlled, and the effect of the powder is more favorably exerted. In the implementation process of the invention, the average particle size of the powder is 100-400 meshes, for example, the powder can be one or a mixture of 100-200 meshes of heavy calcium carbonate powder, 200-400 meshes of quartz powder and 200-400 meshes of wollastonite powder.
In the invention, the granular material comprises at least one of quartz sand and river sand, and has the advantages of stable performance, low cost and the like.
The particle size composition of the granule is reasonably controlled, and the effect of the granule is more beneficial to be exerted. In the implementation process of the invention, the average particle size of the particles is 40-100 meshes, for example, the particles can be one or two mixtures of quartz sand with 40-100 meshes and river sand with 40-100 meshes.
The powder and the granular materials meeting the particle size requirement are matched with each other, so that the powder and the granular materials can be used as filling materials to be filled in the pores of the reticular structure polymer formed by the reaction of the component A and the component B, thereby improving the compactness of the bonding layer, increasing the cohesive force of the bonding layer, reducing the shrinkage, and further ensuring that the decorative materials including the ceramic tiles can be firmly bonded on the base layer without hollowing.
In the present invention, the powder thixotropic agent includes, but is not limited to, silicate minerals. By adding the powder thixotropic agent, the thixotropic property of the C component can be improved, powder and granules can be promoted to be effectively filled in the pores of the reticular structure polymer by improving the thixotropic property of the C component, and the compactness of the bonding layer is improved, and the slippage of elevation construction can be reduced.
In order to fully perform the function of the powder thixotropic agent, the invention further defines that the silicate mineral has a lamellar structure, and in the implementation of the invention, lamellar silicate minerals which are conventional in the art, such as organic bentonite, are preferred.
In the invention, the water repellent is added, so that the waterproof film is formed on the surface of the bonding layer, the bonding part of the decorative material including the ceramic tile and the base layer is not expanded, deformed and separated, and the bonding service life can be effectively prolonged. The water repellent comprises but is not limited to an organic silicon-based water repellent, and is beneficial to improving the workability of the mixture and the water repellency of the bonding layer.
According to the invention, different construction requirements can be met by adjusting the proportion of the component C. Wherein the weight ratio of the component A to the component C is 1: (4-8), for example 1: 4. 1: 5. 1: 6. 1: 7. 1:8 or any two thereof. The weight ratio of the component B to the component C is 1: (4-8), for example 1: 4. 1: 5. 1: 6. 1: 7. 1:8 or any two thereof. The component A and the component B are mixed with equal mass.
The ceramic tile adhesive composition has the advantages of strong adhesive force, no corrosion to metal, glass and the like, and can be used for repairing. When the cement-based adhesive is used for fixing the decorative material and the base layer, the thickness of the cement-based adhesive needs to be coated, which is generally more than 10mm, and once the phenomenon that the ceramic tile and the bonding layer fall off in the later period, the base layer needs to be chiseled off for reinstallation, which is time-consuming and labor-consuming. The ceramic tile adhesive composition has high bonding strength and low consumption, can meet the bonding strength and construction performance after being coated with less than 5mm, has low bonding thickness requirement, and can be used as a repairing agent even if ceramic tiles and bonding layers fall off in the later period, and the ceramic tile adhesive composition can be directly coated on the original basis to repair a mixture formed by the ceramic tile adhesive composition. Further, the tile adhesive composition provided by the invention can be thick-coated or thin-coated, preferably thin-coated, for example, the thickness of the coating is 2-4mm.
The tile adhesive composition provided by the invention can be prepared on site during construction.
Further, the component A, the component B and the component C can be prepared respectively, then the component A, the component B and the component C are mixed uniformly according to the mass ratio on a construction site to obtain a mixture, and the mixture is adopted to bond the ceramic tile and the base layer.
Specifically, the construction method of the tile adhesive composition comprises the following steps:
S1: uniformly mixing the component A and the component B according to the weight equal proportion to obtain an AB mixture;
S2: adding the component C into the AB mixture according to the weight ratio A: b: c=1: 1 (4-8), mixing uniformly; the addition amount of the component C can be adjusted on site according to actual construction conditions;
s3: the mixture batch is scraped on the base layer by using a spatula with saw teeth of 4X 4mm, and then the ceramic tile is installed.
In the specific implementation process of the invention, the liquid epoxy resin with corresponding proportion is added into a mixing kettle, low-speed stirring is carried out at room temperature, then the first viscosity regulator and the liquid thixotropic agent with corresponding proportion are added, high-speed dispersion is started at room temperature, stirring is carried out for about 15min, and the component A can be obtained, and is packaged.
Adding epoxy resin curing agent with corresponding proportion into a mixing kettle, stirring at low speed at room temperature, adding second viscosity regulator and dispersing agent with corresponding proportion, opening high-speed dispersion at room temperature, stirring for about 15min to obtain component B, and packaging.
Adding inorganic powder and inorganic particles in corresponding proportion into a mixer, then adding a powder thixotropic agent and a water repellent in corresponding proportion, stirring at room temperature for about 8min at a stirring speed of 70rpm to obtain a component C, and packaging. Wherein the mixer may specifically be a coulter mixer.
Uniformly mixing the packaged components A, B and C according to mass proportion on a construction site to obtain a mixture, and bonding the ceramic tile and the base layer by adopting the mixture.
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The present invention will be further illustrated by the following specific examples and comparative examples. The reagents, materials and instruments used in the following are all conventional reagents, conventional materials and conventional instruments, which are commercially available, and the reagents and materials involved can be synthesized by conventional synthesis methods, unless otherwise specified.
In examples 1-4 below, the raw materials used were of the following types:
Liquid epoxy resin: bisphenol A type epoxy resin 164R type, purchased from Nantong star synthetic materials Co., ltd;
a first viscosity modifier, a second viscosity modifier: s18, available from Guangdong core New Material stock Co., ltd;
liquid thixotropic agent: BYK410 type, available from pick chemistry;
epoxy resin curing agent: mitsubishi chemical LB5189 epoxy curing agent is purchased from Guangzhou city company of New Material Co., ltd;
Dispersing agent: polyurethane dispersant type S13, available from Guangdong core New Material Co., ltd;
Powder material: 200 mesh heavy calcium carbonate powder, purchased from Jingmenpeng source materials factory;
particle material: 60 mesh quartz sand, purchased from Jingmen Peng Source Material works;
Water repellent: organosilicon water repellent SEAL80, available from yi laitai company;
Powder thixotropic agent: type OPTIBENT 602, available from pick chemistry.
The amounts of the components in the following examples are each expressed in parts by weight, and the mass per part by weight is 1g unless otherwise specified.
In the following examples and comparative examples, tile adhesive compositions were prepared by the following methods:
Respectively adding liquid epoxy resin into a mixing kettle according to the mass parts provided by the embodiment, starting low-speed stirring, stirring at room temperature, then adding a first viscosity regulator and a liquid thixotropic agent, starting high-speed dispersion, and stirring for about 15min to obtain a component A;
Adding the epoxy resin curing agent into a mixing kettle, starting low-speed stirring, stirring at room temperature, then adding a second viscosity regulator and a dispersing agent, starting high-speed dispersing, and stirring for about 15min to obtain a component B;
Adding the powder material and the granular material into a coulter mixer, stirring at the speed of 70rpm at room temperature, then adding the powder thixotropic agent and the water repellent, and stirring for about 8 minutes to obtain the component C.
Example 1
The tile adhesive composition provided in this example has the components and parts by weight shown in table 1.
Table 1 formulation of tile adhesive composition
Wherein the mass ratio of the component A to the component B to the component C is 1:1:8.
The preparation of the tile adhesive specifically comprises the following steps:
S1: uniformly mixing the component A and the component B according to the weight proportion to obtain an AB mixture;
S2: and adding the component C into the AB mixture, and uniformly mixing according to the weight proportion to obtain the tile adhesive.
Example 2
The tile adhesive composition provided in this example has the components and parts by weight shown in table 2.
Table 2 formulation of tile adhesive composition
Wherein the mass ratio of the component A to the component B to the component C is 1:1:8.
The tile adhesive was prepared as in example 1.
Example 3
The tile adhesive composition provided in this example has the components and parts by weight shown in table 3.
Table 3 formulation of tile adhesive composition
Wherein the mass ratio of the component A to the component B to the component C is 1:1:6.
The tile adhesive was prepared as in example 1.
Example 4
The tile adhesive composition provided in this example is shown in table 4 for each component and parts by weight.
Table 4 formulation of tile adhesive composition
Wherein the mass ratio of the component A to the component B to the component C is 1:1:4.
The tile adhesive was prepared as in example 1.
Comparative example 1
The tile adhesive composition provided in this comparative example is similar to example 1 in composition and preparation process, except that the mass ratio of the component a, the component B, and the component C is 1:1:2.5.
The tile adhesive was prepared as in example 1.
Comparative example 2
The tile adhesive composition provided in this comparative example is similar to example 1 in composition and preparation process, except that the mass ratio of the component a, the component B, and the component C is 1:1:10.
The tile adhesive was prepared as in example 1.
Comparative example 3
The tile adhesive composition provided in this comparative example is similar to example 1 in composition and preparation process, except that the mass ratio of the component a, the component B, and the component C is 1.5:1:8.
The tile adhesive was prepared as in example 1.
Comparative example 4
The tile adhesive composition provided in this comparative example is a cement-based tile adhesive, and meets the standard JC/T547-2017 model C1, such as kecis C300 tile adhesive.
Comparative example 5
The tile adhesive composition provided in this comparative example was similar in composition and preparation to example 1, except that the first viscosity modifier in the a-component was replaced with an acrylate salt, wherein the acrylate salt was a thickening rheology 1803 available from yoshi jingzha textile materials limited.
The tile adhesive was prepared as in example 1.
The overall properties of the mixtures of examples 1 to 4 and comparative examples 1 to 5 were evaluated according to the standard of JC/T547-2017 ceramic tile adhesive, and the evaluation results are shown in Table 5 and Table 6.
TABLE 5
In Table 5, "shear bond strength after thermal shock" was measured at a temperature of 70 ℃; the tile adhesive composition was applied to a thickness of 3mm.
TABLE 6
In Table 6, "shear bond strength after thermal shock" was measured at a temperature of 70 ℃; the tile adhesive composition was applied to a thickness of 3mm.
As can be seen from tables 5 and 6, the tile adhesive compositions of examples 1-4 meet the standard requirements of JC/T547-2017 ceramic tile adhesive. The ceramic tile adhesive composition provided by the invention has high shear bonding strength, good bonding strength and meets construction requirements. Although the bonding strength of comparative examples 1 and 3 reached the strength standard, the workability was poor, comparative example 1 was easy to slip due to too thin slurry, and comparative example 3 was stirred uniformly and time-consuming, reducing the workability. In addition, the invention adopts resin as the main raw material of the composition, and the resin is neutral and does not corrode glass metal.
It should be noted that in the description of the present invention, the terms "first viscosity modifier" and "second viscosity modifier" are used merely to facilitate description of different viscosity modifiers and are not to be construed as indicating or implying a sequential relationship.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (1)
1. The ceramic tile adhesive composition is characterized by comprising an A component, a B component and a C component, wherein the mass ratio of the A component to the B component to the C component is 1:1: (4-8);
Wherein the component A comprises the following components in parts by weight: 9-10 parts of liquid epoxy resin, 0.1-1 part of first viscosity regulator and 0.1-1 part of liquid thixotropic agent;
the component B comprises the following components in parts by weight: 9-10 parts of epoxy resin curing agent, 0.1-1 part of second viscosity regulator and 0.1-1 part of dispersing agent;
The component C comprises the following components in parts by weight: 10-40 parts of inorganic powder, 20-50 parts of inorganic particle materials, 0.1-2 parts of powder thixotropic agent and 0.1-5 parts of water repellent;
the inorganic powder comprises at least one of heavy calcium carbonate powder, quartz powder and wollastonite powder; the average grain diameter of the inorganic powder is 200-400 meshes;
The inorganic particle material comprises at least one of quartz sand and river sand, and the average particle size of the inorganic particle material is 40-100 meshes;
the liquid epoxy resin comprises bisphenol A type epoxy resin;
the first viscosity regulator and the second viscosity regulator respectively and independently comprise at least one of phosphate viscosity regulator, polyamide viscosity regulator and polyurethane viscosity regulator;
the liquid thixotropic agent comprises at least one of modified urea thixotropic agent and polyamide thixotropic agent;
the epoxy resin curing agent comprises an aliphatic amine curing agent;
the dispersing agent comprises at least one of organosilicon dispersing agent, polyacrylate dispersing agent and polyurethane dispersing agent;
the powder thixotropic agent comprises silicate minerals;
The water repellent comprises an organosilicon water repellent;
adding liquid epoxy resin with corresponding proportion into a mixing kettle, stirring at a low speed at room temperature, then adding a first viscosity regulator and a liquid thixotropic agent with corresponding proportion, starting high-speed dispersion at room temperature, and stirring for 15min to obtain a component A;
Adding epoxy resin curing agent with corresponding proportion into a mixing kettle, stirring at a low speed at room temperature, then adding second viscosity regulator and dispersing agent with corresponding proportion, starting high-speed dispersion at room temperature, and stirring for 15min to obtain component B;
adding inorganic powder and inorganic particles in corresponding proportion into a mixer, then adding a powder thixotropic agent and a water repellent in corresponding proportion, and stirring at a stirring speed of 70rpm for 8min at room temperature to obtain the component C.
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| JP2009149727A (en) * | 2007-12-19 | 2009-07-09 | Nippon Steel Chem Co Ltd | Film-like adhesive, semiconductor package using it, and its manufacturing method |
| CN105084814A (en) * | 2015-08-17 | 2015-11-25 | 北京东方雨虹防水技术股份有限公司 | Self-expansion sand-free ceramic tile gap filling treatment material and preparation method thereof |
| CN113260648A (en) * | 2019-01-04 | 2021-08-13 | 毕克化学有限公司 | Rheology control additives containing urea groups |
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| CN110981289A (en) * | 2019-12-17 | 2020-04-10 | 佛山科学技术学院 | Tile adhesive |
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| JP2009149727A (en) * | 2007-12-19 | 2009-07-09 | Nippon Steel Chem Co Ltd | Film-like adhesive, semiconductor package using it, and its manufacturing method |
| CN105084814A (en) * | 2015-08-17 | 2015-11-25 | 北京东方雨虹防水技术股份有限公司 | Self-expansion sand-free ceramic tile gap filling treatment material and preparation method thereof |
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