CN115348752A

CN115348752A - Electronic device and processing method thereof

Info

Publication number: CN115348752A
Application number: CN202110522091.5A
Authority: CN
Inventors: 唐昌胜
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2022-11-15

Abstract

The application discloses an electronic device and a processing method thereof, wherein the method comprises the following steps: providing a printed circuit board, wherein a plurality of first grooves are formed in the first surface of the printed circuit board, and the first welding parts of the printed circuit board are exposed out of the first grooves; laying solder at the bottom of the first groove; transferring the plurality of welding pieces into the first groove, and performing welding treatment; wherein, a first groove accommodates a welding part, one side of the welding part facing the first welding part is provided with a second welding part, and the length of the second welding part is more than or equal to 20 percent of the length of the first groove and less than or equal to 80 percent of the length of the first groove; and/or the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and/or the height of the second welding part is more than or equal to 20% of the height of the first groove and less than or equal to 80% of the height of the first groove. Through the mode, the welding part can be improved, and the accuracy of the welding part falling into the welding position and the efficiency of the transfer process can be improved.

Description

Electronic device and processing method thereof

Technical Field

The present disclosure relates to the field of electronic device manufacturing technologies, and in particular, to an electronic device and a processing method thereof.

Background

With the continuous progress of technology, the functional requirements on electronic products are higher and higher. The manufacture of circuit boards often requires the transfer of a large number of solder connections, such as chips, wafers, components, devices, etc., to the circuit board.

In the prior art, a plurality of sets of solder parts with the same specification are usually placed on the designated soldering positions of the circuit board by using a transfer technique, such as electrostatic adsorption, vacuum adsorption, phase change transfer, and the like. In the transfer process of a welding part, the conditions that the windowing position is deviated, the welding position has errors, the thickness of a solder resist layer is too thick, the thickness of the solder resist layer is inconsistent and the like can often appear in the circuit board manufacturing process, the welding part cannot accurately fall into a specified groove under the conditions, and the accurate and stable transfer process cannot be realized. The existing solution is to manage and control the size of a welded part individually according to the size difference of the welding position, and place and heat-weld one by one, which seriously affects the efficiency of the transfer process.

Disclosure of Invention

The technical problem that this application mainly solved provides an electron device and processing method thereof, can effectively improve the welding piece and fall into the accuracy of welding position, is favorable to improving the efficiency of welding piece transfer process.

In order to solve the technical problem, the application adopts a technical scheme that: provided is a method for processing an electronic device, including: providing a printed circuit board, wherein a plurality of first grooves are formed in the first surface of the printed circuit board, and a plurality of first welding parts of the printed circuit board are respectively exposed out of the plurality of first grooves; laying solder at the bottoms of the first grooves; transferring a plurality of welding parts into the plurality of first grooves, and performing welding treatment to enable the first welding part to be welded and fixed with the second welding part through the welding materials; wherein one first groove accommodates one welding piece, one side of the welding piece facing the first welding part is provided with a second welding part, and the length of the second welding part is more than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and/or the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and/or the height of the second welding part is more than or equal to 20% of the height of the first groove and less than or equal to 80% of the height of the first groove.

Wherein the step of transferring a plurality of welds into the plurality of first grooves comprises: spreading the plurality of weldments over the first surface with the second welds of the plurality of weldments facing the first surface; applying vibration force in the horizontal direction to the printed circuit board to enable the welding pieces to fall into the first grooves under the action of the vibration force, wherein each first groove only accommodates one welding piece; removing the excessive welding part which does not fall into the first groove; detecting whether the first grooves are abnormally paved or not; wherein the abnormal laying condition comprises that the welding part is not arranged in the first groove, a plurality of welding parts are accommodated in the first groove, and the second welding part of the welding part deviates from the first welding part; in response to the laying abnormality of at least one first groove, the printed circuit board is stored independently; in response to the condition that all the first grooves have no laying abnormality, the step of performing welding processing so that the first welding part is welded and fixed with the second welding part through the welding flux is carried out.

Wherein the step of removing the excess weldment not falling into the first groove comprises: passing the printed circuit board through the middle of two conveying plates with certain relative heights so that the excessive welding parts are pushed away from the first surface by the conveying plates; wherein the relative height of the transmission plate is equal to the sum of the height of the printed circuit board and the height of the welding part above the first surface.

Wherein, to the printed circuit board exert horizontal direction's vibration power to make the welding spare falls in the step in the first recess under the effect of vibration power, include: and applying at least two vibration forces in the horizontal direction to the printed circuit board, and vibrating for a preset number of times respectively to enable the welding part to fall into the first groove under the action of the vibration forces.

Wherein, after the step of performing the soldering process to solder and fix the first soldering part and the second soldering part by the solder, the method comprises: cleaning the first surface of the printed circuit board and the surfaces of all the welding parts.

Wherein, the step of providing a printed circuit board, the first surface of printed circuit board is provided with a plurality of first recesses, and a plurality of first welding parts of printed circuit board are respectively from a plurality of first recesses expose, includes: forming a patterned metal circuit layer on at least one side surface of the substrate; forming an insulating medium layer on the surface of the metal circuit layer, wherein the insulating medium layer on the first surface of the substrate is flush with at least part of the metal circuit layer; reducing the height of the metal circuit layer which is flush with the insulating medium layer so that the insulating medium layer and the metal circuit layer which are positioned on the first surface form a plurality of first grooves; wherein the metal wiring layer exposed from the first groove forms the plurality of first welding parts.

Wherein the step of forming a patterned metal circuit layer on at least one side surface of the substrate comprises: providing a substrate, wherein the substrate comprises a first surface and a second surface which are arranged oppositely, and the first surface and the second surface are respectively covered with a metal layer in advance; drilling from one side of the first surface to form a plurality of holes, wherein the holes at least penetrate through the metal layer on the first surface and the substrate; forming photosensitive resist films on one sides of the first surface and the second surface, wherein a first opening is formed in the position, corresponding to the hole, of the photosensitive resist film on one side of the first surface, and the hole and the metal layer adjacent to the hole are exposed out of the first opening; electroplating the first opening and the hole to form a metal column; removing all the photosensitive resist film; forming photosensitive resist films on the first surface and the second surface, wherein the positions of each side corresponding to the metal posts are covered by the photosensitive resist films, and the rest at least partial positions are not covered by the photosensitive resist films; removing the metal layer not covered by the photosensitive resist film to form a patterned metal wiring layer; and removing the photosensitive resist film.

Wherein, the step of forming an insulating medium layer on the surface of the metal circuit layer, and the insulating medium layer on the first surface of the substrate is flush with at least part of the metal circuit layer comprises: forming an insulating medium layer on the surface of the metal circuit layer, wherein the insulating medium layer covers the metal circuit layer; and grinding the insulating medium layer until the metal column is exposed out of the insulating medium layer and the metal column is flush with the insulating medium layer.

Wherein the step of reducing the height of the metal line layer flush with the insulating dielectric layer comprises: and reducing the height of the metal column in any one mode of micro-etching, UV laser drilling ablation, laser milling and CO2 laser drilling ablation, wherein the metal column forms the first welding part.

The insulating medium layer comprises any one of epoxy resins, phenolic resins, polyimides, BT, ABF and ceramic substrates.

In order to solve the technical problem, the other technical scheme adopted by the application is as follows: provided is an electronic device including: the printed circuit board comprises a base material and a first surface, wherein a plurality of first grooves are formed in the first surface, and a plurality of first welding parts of the printed circuit board are respectively exposed out of the plurality of first grooves; a plurality of weldment, one said first recess receiving one said weldment; the welding part is provided with a first welding part, the first welding part is fixedly connected with the welding part through welding flux, and the length of the first welding part is greater than or equal to 20% of the length of the first groove and is less than or equal to 80% of the length of the first groove; and/or the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and/or the height of the second welding part is more than or equal to 20% of the height of the first groove and less than or equal to 80% of the length of the first groove.

Wherein the electronic device further comprises: the holes penetrate through the first surface and a second surface opposite to the first surface; and the metal columns are positioned in the holes and cover part of the surface of the substrate.

Wherein, still include: and the insulating medium layer is positioned on the first surface, and a plurality of first grooves are formed on one side, close to the first surface, of the metal column, wherein the insulating medium layer comprises any one of epoxy resins, phenolic resins, polyimides, BT (BT) s, ABF (ABF) s and ceramic substrates.

Wherein, still include: and the metal circuit layer is positioned on one side of the metal column close to the first surface, the height of the metal circuit layer is smaller than that of the insulating medium layer, and the metal circuit layer is exposed out of the first grooves to form a plurality of first welding parts. Different from the prior art, the beneficial effects of the application are that: the application provides a processing method of an electronic device, which comprises the steps of providing a printed circuit board, wherein a plurality of first grooves are formed in a first surface of the printed circuit board, and a plurality of first welding parts of the printed circuit board are respectively exposed out of the plurality of first grooves; paving solder at the bottoms of the first grooves; transferring a plurality of welding parts into the plurality of first grooves, and performing welding treatment to enable the first welding part to be welded and fixed with the second welding part through the welding materials; wherein one first groove accommodates one welding piece, one side of the welding piece facing the first welding part is provided with a second welding part, and the length of the second welding part is more than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and/or the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and/or the height of the second welding part is more than or equal to 20% of the height of the first groove and less than or equal to 80% of the length of the first groove. By the mode, the size of the welding end is designed according to the length, width and height of the first groove, so that the welding end and the non-welding end of the welding part are in size difference, and the welding part can accurately fall into the first groove in the transfer process by utilizing the characteristic of size difference; before the welding part is transferred, the size of the welding end is designed according to the size of the welding position in advance in a matching mode, and the efficiency of the welding part transfer process is greatly improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic flow chart diagram illustrating one embodiment of a method of processing an electronic device according to the present application;

FIG. 2 is a flowchart illustrating an embodiment of step S103;

FIG. 3 is a flowchart illustrating an embodiment of step S101;

FIG. 4 is a schematic structural diagram illustrating an embodiment of steps S301 to S303 in FIG. 3;

FIG. 5 is a flowchart illustrating an embodiment of step S301;

FIG. 6 is a schematic structural diagram illustrating an embodiment of steps S401 to S408 in FIG. 5;

FIG. 7 is a flowchart illustrating an embodiment of step S302;

fig. 8 is a schematic structural diagram of an electronic device of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for processing an electronic device according to the present application, the method including:

s101: providing a printed circuit board, wherein a plurality of first grooves are formed in the first surface of the printed circuit board, and a plurality of first welding parts of the printed circuit board are respectively exposed out of the plurality of first grooves.

Specifically, the printed circuit board is also called a printed circuit board, which is one of the supports of the electronic device and is a carrier for electrical connection of the electronic device. In the process of manufacturing electronic devices, a process of transferring solder parts such as chips, wafers, components, devices, etc. to designated soldering positions of a circuit board is often involved, and therefore, soldering positions need to be opened in advance in the printed circuit board for the solder parts to be transferred and fall into. The first groove in the step S101 is a soldering position in the fingerprint circuit board; the first welding part is a metal layer at the bottom of the first groove, and the welding part is welded and fixed with the metal layer through welding flux; the first surface refers to a soldering surface of the printed circuit board, and the opening of the first groove faces the surface. In addition, the specific processing process of the printed circuit board will be described in detail in the following embodiments, which are not described herein.

S102: and paving solder at the bottoms of the first grooves.

Specifically, the solder only needs to be spread to the bottom of the whole first groove, and the height of the solder does not exceed the height of the first groove, so that the follow-up welding and assembling steps are effectively guaranteed.

S103: transferring the plurality of welding parts into the plurality of first grooves, and performing welding treatment to enable the first welding parts to be welded and fixed with the second welding parts through welding fluxes; wherein, a first groove accommodates a welding part, one side of the welding part facing the first welding part is provided with a second welding part, and the length of the second welding part is more than or equal to 20 percent of the length of the first groove and less than or equal to 80 percent of the length of the first groove; and/or the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and/or the height of the second welding part is more than or equal to 20% of the height of the first groove and less than or equal to 80% of the height of the first groove.

Specifically, each of the welded members includes a functional body portion and a welded portion, and the second welded portion in the above-described steps refers to the welded portion of the welded member. When the size of the designed welding part is matched with the size of the first groove, only the size of the welding part needs to be designed and determined, and the corresponding welding part is processed according to the designed specified size. The welding member may be formed by integrally forming the functional main body portion and the welding portion by die casting, or may be formed by separately processing the functional main body portion and the welding portion and then connecting them, which is not particularly limited herein. In addition, the specific transfer process of the welding parts will be described in detail in the following embodiments, which are not described herein again.

Through the embodiment, the size of the welding end is designed according to the length, width and height of the first groove, so that the welding end and the non-welding end of the welding part are subjected to size difference, and the welding part can accurately fall into the first groove in the transfer process by utilizing the characteristic of size difference; before the welding part is transferred, the size of the welding end is designed according to the size of the welding position in advance in a matching mode, the efficiency of the welding part transfer process is greatly improved, and efficient batch welding part transfer can be achieved.

Referring to fig. 2, fig. 2 is a flowchart illustrating an embodiment of the step S103, specifically describing a transferring process of the welding part. The step S103 includes:

s201: the plurality of weldment is spread over the first surface with a second weld of the plurality of weldment facing the first surface.

Because the quantity of the welding parts is huge, a huge quantity of transfer technologies are needed to realize the transfer process of the welding parts. The mass transfer is to pick up a plurality of welding parts with the same specification from an original storage position with very high space precision and direction, move the welding parts to a preset position, maintain the relative space position and direction of the welding parts, distribute the welding parts to each welding position at the preset position, and repeat the actions for a plurality of times to realize the welding part transfer with large magnitude order. In the present embodiment, the solder is sprayed onto the soldering surface of the printed circuit board at a uniform speed from the solder-applying plate above the printed circuit board by a predetermined height, preferably 10 to 2000 μm. The relative spatial position and the direction of the welding end of the welding part are kept, and the welding end faces to the welding surface.

In another embodiment, before step S201, cleaning the first surface of the printed circuit board may be further included, so as to ensure that the solder assembly is not affected by slag, scraps, and the like during the transferring and soldering processes.

S202: and applying vibration force in the horizontal direction to the printed circuit board so that the welding parts fall into the first grooves under the action of the vibration force, and each first groove only contains one welding part.

Specifically, in this embodiment, when the solder members in step S201 are spread over the entire solder surfaces of the printed circuit board, the transfer of the printed circuit board is stopped, and a vibration force is applied by a robot or a gripper to hold both sides of the printed circuit board so that each solder member falls into one of the grooves. In the embodiment, at least two horizontal vibration forces are applied to the printed circuit board, for example, the printed circuit board is vibrated in the front-back and left-right directions, and the vibration forces are respectively vibrated for a predetermined number of times, for example, 2-100 times, so that the solder part falls into the first groove under the vibration force. Through the implementation mode, the massive transfer process of the welding parts can be efficiently completed by using a simple process, and the efficiency of the transfer process is effectively improved.

S203: and removing the excessive welding pieces which do not fall into the first groove.

Specifically, in the present embodiment, the printed circuit board is passed through the middle of two transfer plates having a certain relative height, so that the excessive solder members are pushed away from the first surface by the transfer plates; wherein, the relative height of the transmission plate is equal to the sum of the height of the printed circuit board and the height of the welding part above the first surface. In other words, the two transfer plates function as a height limit, and the height between the transfer plates allows only one solder piece falling into the first groove and the circuit board to pass through. In addition, a welding part bearing plate is arranged below the transmission plate, and redundant welding parts pushed away from the first surface fall into the bearing plate through the gap of the transmission plate. Through above-mentioned embodiment, utilize the restriction of height can effectively get rid of unnecessary welding, guarantee that only has a welding in the first recess, also provide technical support for subsequent detection and welding process simultaneously.

S204: detecting whether each first groove is abnormally paved; wherein, lay unusual condition including in the first recess not having the welding piece, the first recess is held a plurality of welding pieces, the second welding part of welding deviates from first welding part.

Specifically, according to the originally designed circuit board diagram, all the first grooves on the printed circuit board are scanned by the optical scanning device, and the condition that no abnormity exists in the laying of the welding parts at all the welding positions is checked.

S205: in response to the laying abnormality of the at least one first groove, the printed circuit board is independently stored; and responding to the condition that all the first grooves have no laying abnormity, and entering the step of performing welding treatment to enable the first welding part to be welded and fixed with the second welding part through welding materials.

Specifically, in the present embodiment, according to the type of solder selected, a heating process is performed in conjunction with the melting point thereof, and the solder melts to connect the soldering end of the solder member and the first soldering portion of the first groove bottom portion.

In another embodiment, after step S205, cleaning the first surface of the printed circuit board and the surfaces of all the solder parts is further performed, so as to ensure the cleanliness of the prepared printed circuit board, and provide a guarantee for the subsequent processing of the electronic device, so that the subsequent processing is not affected by the solder waste residue, the residual material, and other substances.

Through the implementation mode, a large number of welding part transferring processes are realized by utilizing the matching design of the welding parts and the welding positions and a huge transferring technology, the transferring efficiency is effectively improved, and the time cost is saved.

Referring to fig. 3 and 4, fig. 3 is a schematic flow chart of an embodiment of step S101, and fig. 4 is a schematic structural diagram of an embodiment of steps S301 to S303 in fig. 3, which mainly describes the processing process of the printed circuit board in detail. The step S101 includes:

s301: a patterned metal circuit layer 202 is formed on at least one side surface of the substrate 10.

Specifically, referring to fig. 4 (a), a substrate 10 with a copper layer covered on both sides is provided, and a patterned metal circuit layer 202 is formed by an etching process, where the pattern refers to a designed circuit pattern. In addition, the specific forming process of the metal circuit layer 202 will be described in detail in the following embodiments, which are not described herein.

S302: an insulating dielectric layer 30 is formed on the surface of the metal circuit layer 202, and the insulating dielectric layer 30 on the first surface 101 of the substrate 10 is flush with at least a portion of the metal circuit layer 202.

Referring to fig. 4 (b), here, the insulating medium layer 30 material is used to replace the solder resist ink used in the prior art, so that the problem of reduced soldering area caused by the ink windowing offset can be effectively avoided. The specific process corresponding to this step will be described in detail in the following examples.

S303: reducing the height of the metal line layer 202 which is flush with the insulating dielectric layer 30, so that the insulating dielectric layer 30 and the metal line layer 202 which are positioned on the first surface 101 form a plurality of first grooves 103; wherein, a plurality of first welding parts 201 are formed on the metal circuit layer 202 exposed from the first groove 103.

Specifically, referring to fig. 4 (c), in the present embodiment, the height of the metal circuit layer 202 can be reduced by any one of micro-etching, UV laser drilling ablation, laser milling, and CO2 laser drilling ablation, so that the metal circuit layer 202 forms a plurality of first welding portions 201. Through the above embodiment, the height difference between the surface of the insulating medium layer 30 and the first welding portion 201 at the welding position can be directionally controlled, and the depth of the first groove 103 can be effectively controlled and adjusted.

Through the implementation mode, the printed circuit board suitable for a massive transfer scene can be processed, and technical support is provided for the transfer process of welding parts.

In this embodiment, please refer to fig. 5 and fig. 6, wherein fig. 5 is a schematic flowchart of an embodiment of step S301, and fig. 6 is a schematic structural diagram of an embodiment of steps S401 to S408 in fig. 5, which specifically describes a processing process of a metal circuit layer. The step S301 includes:

s401: providing a substrate 10, wherein the substrate 10 includes a first surface 102 and a second surface 104 which are disposed opposite to each other, and the first surface 102 and the second surface 104 are respectively covered with a metal layer 20 in advance.

Specifically, referring to fig. 6 (a), the metal layer 20 may be a copper layer, and the substrate 10 is a dielectric layer, and the pre-processing of the substrate 10 with a copper layer on both sides can provide a basis for the subsequent processing.

S402: drilling is performed from the first surface 102 side to form a plurality of holes 40, and the holes 40 at least penetrate through the metal layer 20 and the substrate 10 on the first surface 102.

Specifically, referring to fig. 6 (b), a hole 40 penetrating through the metal layer 20 and the substrate 10 is formed by laser drilling, where the hole 40 refers to a blind via or a through via. After drilling is finished, drilling pollution removing treatment is carried out, redundant residual materials and waste residues are removed, hole treatment is carried out, the processed hole wall can be further treated by using a conductor material in a copper deposition or black hole treatment mode, and technical support is provided for subsequent electroplating steps.

S403: the photosensitive resist film 50 is formed on the first surface 102 and the second surface 104, and the photosensitive resist film 50 on the first surface 102 side is provided with a first opening 501 at a position corresponding to the hole 40, and the hole 40 and a part of the metal layer 20 adjacent to the hole 40 are exposed from the first opening 501.

Specifically, referring to fig. 6 (c), the photoresist film 50 is a polymer compound, which can generate a polymerization reaction after being irradiated by a specific light source to form a stable substance attached to the plate surface, thereby achieving the function of blocking electroplating. A photoresist 50 is attached over the metal layer 20 according to the circuit design drawing. The photosensitive resist film 50 is provided with first openings 501 at positions corresponding to the holes 40, and the lengths of all the first openings 501 are greater than the length of the holes 40, which provides technical support for the height of the subsequent thickened metal layer 20.

S404: a metal pillar 401 is formed in the first opening 501 and the hole 40 by electroplating.

Specifically, referring to fig. 6 (d), the surface of the metal pillar 401 is flush with the surface of the photoresist film 50, which can effectively increase the height of the metal layer 20.

S405: all the photosensitive resist film 50 is removed.

See fig. 6 (e) for details.

S406: the photosensitive resist film 50 is formed on the first surface 102 and the second surface 104, and each side of the position corresponding to the metal pillar is covered with the photosensitive resist film 50, and the rest of the position is not covered with the photosensitive resist film 50.

Specifically, referring to fig. 6 (f), the photosensitive resist film 50 is selectively disposed according to the welding position, and the photosensitive resist film 50 may be formed only on the first surface 102 or the second surface 104, which is not particularly limited herein. The arrangement of the photosensitive resist film 50 is also according to a previously designed circuit diagram.

S407: the metal layer 20 not covered by the photosensitive resist film 50 is removed to form a patterned metal wiring layer 202.

Specifically, referring to fig. 6 (g), the metal layer 20 is etched by an etching process, and a portion of the metal layer 20 protected by the photoresist film 50 is not etched, so that the pattern of the metal circuit layer 202 formed finally is completely consistent with the circuit diagram.

S408: the photosensitive resist film 50 is removed.

See fig. 6 (h) for details.

Through above-mentioned embodiment, can process the printed circuit board that accords with the circuit requirement, and effectively improve the thickness on the metal wiring layer that welding position department corresponds, provide the guarantee for follow-up directional control welding position's height.

Referring to fig. 7, fig. 7 is a flowchart illustrating an embodiment of the step S302. The step S302 specifically includes:

s501: and forming an insulating medium layer on the surface of the metal circuit layer, wherein the insulating medium layer covers the metal circuit layer.

Specifically, in the present embodiment, a pressing process is used to cover the insulating dielectric layer on the metal circuit layer. The insulating dielectric layer mentioned here includes any one of epoxy resins, phenol resins, polyimides, BT, ABF, and ceramic base. The insulating medium material is used for replacing solder resist ink used in the prior art, and the problem that the welding area is reduced due to ink windowing offset can be effectively solved.

S502: and grinding the insulating medium layer until the metal column is exposed out of the insulating medium layer and the metal column is level with the insulating medium layer.

Specifically, the surface of the insulating medium layer can be ground by means of flattening, brushing, laser ablation, ion cutting, ion polishing, water jet and the like.

Through the embodiment, the insulating medium layer material is used for replacing solder resist ink used in the prior art, the problem that the welding area is reduced due to ink windowing offset can be effectively solved, the height of the metal column can be directionally controlled, and technical support is provided for the batch transfer welding process.

The electronic device formed by the above steps in the present application will be further described in terms of structure.

Referring to fig. 8, fig. 8 is a schematic structural diagram of an electronic device according to the present application. The electronic device 100 includes: a printed circuit board 105 and a plurality of solder connections 107. The printed circuit board 105 comprises a base material 10 and a first surface 102, wherein a plurality of first grooves 103 are formed in the base material 10, and a plurality of first welding parts 201 of the printed circuit board 105 are respectively exposed out of the plurality of first grooves 103; in addition, a first recess 103 receives a weldment 107; wherein, the side of the welding part 107 facing the first welding part 201 is provided with a second welding part 1071, the second welding part 1071 is fixedly connected with the first welding part 201 by solder, and the length of the second welding part 1071 is greater than or equal to 20% of the length L of the first groove 103 and less than or equal to 80% of the length L of the first groove 103; and/or the width B of the second weld 1071 is greater than or equal to 20% and less than or equal to 80% of the width B of the first groove 103; and/or the height of the second welding portion 1071 is 20% or more and 80% or less of the height H of the first groove 103. Through the above embodiment, the dimensions of the welding part 107 are designed according to the corresponding dimensions of the length L, the width B and the height H of the first groove 103, so that the dimension difference is formed between the second welding part 1071 and the rest part of the welding part 107, and the welding part 107 can accurately fall into the first groove 103 during the transfer process by using the dimension difference characteristic, thereby improving the accuracy and precision of the transfer process; before the welding part 107 is transferred, the size of the welding part 107 is designed according to the size matching of the welding position in advance, so that the efficiency of the transfer process of the welding part 107 is greatly improved, and the high-efficiency mass transfer can be realized.

With reference to fig. 8, the electronic device 100 further includes a plurality of holes 40 penetrating through the first surface 102 and the second surface 104 opposite to the first surface 102, where the holes 40 are blind micro holes or through holes, and can be formed by laser drilling; a plurality of metal posts 401 are correspondingly disposed in the plurality of holes 40, and the metal posts 401 are in an i shape, formed by an electroplating process, and cover a portion of the surface of the substrate 10. Through the above embodiment, the height of the welding position is effectively increased by the arrangement of the metal posts 40, and technical support is provided for the arrangement of the subsequent metal circuit layer 202.

In this embodiment, with reference to fig. 8, the electronic device 100 further includes an insulating dielectric layer 30 disposed on the first surface 102, and a plurality of first recesses 103 are formed on a side of the metal pillar 401 close to the first surface 102, wherein the insulating dielectric layer 30 includes any one of epoxy, phenolic, polyimide, BT, ABF, and ceramic. The insulating medium material is used for replacing solder resist ink used in the prior art, and the problem that the welding area is reduced due to ink windowing offset can be effectively solved. In still another embodiment, with reference to fig. 8, the electronic device 100 further includes a metal circuit layer 202, wherein the metal circuit layer 202 is located on a side of the metal pillar 401 close to the first surface 102, a height (not shown) of the metal circuit layer 202 is smaller than a height (not shown) of the insulating dielectric layer 30, and a height difference formed between the two is a height H of the first recess 103. The metal circuit layer 202 is exposed from the first grooves 103 to form a plurality of first welding parts 201, and by means of the above embodiment, a printed circuit board suitable for a mass transfer scene can be processed, and technical support is provided for a transfer process of a subsequent welding part. In addition, the pattern formed by the metal circuit layer 202 is consistent with the pre-designed circuit pattern, so that the processed printed circuit board can meet the requirement of circuit design.

The above description is only an embodiment of the present application, and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes performed by the present application and the contents of the attached drawings, which are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A method of processing an electronic device, comprising:

providing a printed circuit board, wherein a plurality of first grooves are formed in the first surface of the printed circuit board, and a plurality of first welding parts of the printed circuit board are respectively exposed out of the plurality of first grooves;

laying solder at the bottoms of the first grooves;

transferring a plurality of welding parts into the plurality of first grooves, and performing welding treatment to enable the first welding part to be welded and fixed with the second welding part through the welding materials; wherein one first groove accommodates one welding piece, one side of the welding piece facing the first welding part is provided with a second welding part, and the length of the second welding part is more than or equal to 20% of the length of the first groove and less than or equal to 80% of the length of the first groove; and/or the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and/or the height of the second welding part is more than or equal to 20% of the height of the first groove and less than or equal to 80% of the height of the first groove.

2. The method of machining as in claim 1, wherein the step of transferring the plurality of weldments into the plurality of first grooves comprises:

spreading the plurality of weldments over the first surface with the second welds of the plurality of weldments facing the first surface;

applying vibration force in the horizontal direction to the printed circuit board so that the welding parts fall into the first grooves under the action of the vibration force, and each first groove only accommodates one welding part;

removing the excessive welding pieces which do not fall into the first groove;

detecting whether the first grooves are abnormally paved or not; wherein the abnormal laying condition comprises that the welding part is not arranged in the first groove, a plurality of welding parts are accommodated in the first groove, and the second welding part of the welding part deviates from the first welding part;

in response to the laying abnormality of at least one first groove, the printed circuit board is stored independently; responding to the condition that all the first grooves have no laying abnormity, and entering the step of carrying out welding treatment so that the first welding part is welded and fixed with the second welding part through the welding material.

3. The method of machining as claimed in claim 2, wherein the step of removing the excess weldment not falling into the first groove comprises:

passing the printed circuit board through the middle of two conveying plates with certain relative heights so that the excessive welding parts are pushed away from the first surface by the conveying plates; wherein the relative height of the transmission plate is equal to the sum of the height of the printed circuit board and the height of the welding part above the first surface.

4. The process of claim 2, wherein said step of applying a vibration force to said pcb in a horizontal direction to cause said solder members to drop into said first recesses under the action of the vibration force comprises:

and applying at least two vibration forces in the horizontal direction to the printed circuit board, and vibrating for a preset number of times respectively to enable the welding part to fall into the first groove under the action of the vibration forces.

5. The processing method according to claim 2, wherein the step of performing the soldering process to solder-fix the first soldering part to the second soldering part by the solder is followed by:

cleaning the first surface of the printed circuit board and the surfaces of all the welding parts.

6. The method of claim 1, wherein the step of providing a printed circuit board, the first surface of the printed circuit board being provided with a plurality of first grooves, and the plurality of first solder portions of the printed circuit board being exposed from the plurality of first grooves comprises:

forming a patterned metal circuit layer on at least one side surface of the substrate;

forming an insulating medium layer on the surface of the metal circuit layer, wherein the insulating medium layer on the first surface of the substrate is flush with at least part of the metal circuit layer;

reducing the height of the metal circuit layer which is flush with the insulating medium layer so that the insulating medium layer and the metal circuit layer which are positioned on the first surface form a plurality of first grooves; wherein the metal wiring layer exposed from the first groove forms the plurality of first welding parts.

7. The process of claim 6, wherein the step of forming a patterned metal wiring layer on at least one side surface of the substrate comprises:

providing a substrate, wherein the substrate comprises a first surface and a second surface which are arranged oppositely, and the first surface and the second surface are respectively covered with a metal layer in advance;

drilling from one side of the first surface to form a plurality of holes, wherein the holes at least penetrate through the metal layer on the first surface and the substrate;

forming photosensitive resist films on one sides of the first surface and the second surface, wherein a first opening is formed in the position, corresponding to the hole, of the photosensitive resist film on the side of the first surface, and the hole and a part of the metal layer adjacent to the hole are exposed out of the first opening;

electroplating the first opening and the hole to form a metal column;

removing all the photosensitive resist film;

forming a photosensitive resist film on one side of the first surface and the second surface, wherein the position of each side corresponding to the metal post is covered by the photosensitive resist film, and the rest at least part of the position is not covered by the photosensitive resist film;

removing the metal layer not covered by the photosensitive resist film to form a patterned metal wiring layer;

and removing the photosensitive resist film.

8. The process of claim 7, wherein the step of forming an insulating dielectric layer on the surface of the metal wiring layer, wherein the insulating dielectric layer on the first surface of the substrate is flush with at least a portion of the metal wiring layer comprises:

forming an insulating medium layer on the surface of the metal circuit layer, wherein the insulating medium layer covers the metal circuit layer;

and grinding the insulating medium layer until the metal column is exposed out of the insulating medium layer and the metal column is flush with the insulating medium layer.

9. The process of claim 7, wherein said step of reducing the height of said metal line layer flush with said dielectric layer comprises:

and reducing the height of the metal column by any one of micro-etching, UV laser drill ablation, laser milling and CO2 laser drill ablation, wherein the metal column forms the first welding part.

10. The process of claim 8, wherein the dielectric layer comprises any one of epoxy, phenolic, polyimide, BT, ABF, and ceramic based.

11. An electronic device, comprising:

the printed circuit board comprises a base material and a first surface, wherein a plurality of first grooves are formed in the first surface, and a plurality of first welding parts of the printed circuit board are respectively exposed out of the plurality of first grooves;

a plurality of weldment, one said first recess receiving one said weldment; the welding part is provided with a first welding part, the first welding part is fixedly connected with the welding part through welding flux, and the length of the first welding part is greater than or equal to 20% of the length of the first groove and is less than or equal to 80% of the length of the first groove; and/or the width of the second welding part is greater than or equal to 20% of the width of the first groove and less than or equal to 80% of the width of the first groove; and/or the height of the second welding part is more than or equal to 20% of the height of the first groove and less than or equal to 80% of the length of the first groove.

12. The electronic device of claim 11, further comprising:

the holes penetrate through the first surface and the second surface opposite to the first surface;

and the metal columns are positioned in the holes and cover part of the surface of the substrate.

13. The electronic device of claim 12, further comprising:

and the insulating medium layer is positioned on the first surface, and a plurality of first grooves are formed on one side of the first surface close to the metal column, wherein the insulating medium layer comprises any one of epoxy resins, phenolic resins, polyimides, BT (BT) s, ABF (amorphous carbon fiber) s and ceramic substrates.

14. The electronic device of claim 13, further comprising:

and the metal circuit layer is positioned on one side of the metal column close to the first surface, the height of the metal circuit layer is smaller than that of the insulating medium layer, and the metal circuit layer is exposed out of the first grooves to form a plurality of first welding parts.