CN115347359B - Broadband high-gain circularly polarized magnetic dipole antenna array - Google Patents
Broadband high-gain circularly polarized magnetic dipole antenna array Download PDFInfo
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- CN115347359B CN115347359B CN202211001429.3A CN202211001429A CN115347359B CN 115347359 B CN115347359 B CN 115347359B CN 202211001429 A CN202211001429 A CN 202211001429A CN 115347359 B CN115347359 B CN 115347359B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/24—Polarising devices; Polarisation filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a broadband high-gain circularly polarized magnetic dipole antenna array, which comprises an upper metal patch, an upper medium substrate, a middle metal patch, a lower medium substrate and a lower metal patch which are arranged from top to bottom, wherein the upper metal patch consists of four groups of metal sheet units with identical structures, each group of metal sheet units consists of 5 metal sheets, and circular polarization characteristics are realized by adopting structures of rectangular metal sheet chamfer and rectangular perturbation addition; meanwhile, each group of metal sheet units is provided with a plurality of metal through holes penetrating through the upper medium substrate and connecting the upper metal patch and the middle metal patch; the middle layer metal patch is flatly paved on the upper surface of the whole lower layer dielectric substrate and is etched with four circular through holes; the lower layer dielectric substrate is penetrated by four metal through holes and is connected with the middle layer metal patch and the lower layer metal patch; the lower metal patch adopts a microstrip line to form a quarter-turn power divider. The antenna has the advantages of wide frequency band, wide axial ratio bandwidth, high gain and small volume.
Description
Technical Field
The invention relates to the technical field of circularly polarized magnetic dipole antennas, in particular to a broadband high-gain circularly polarized magnetic dipole antenna array.
Background
With the rapid development of modern wireless communication technology, more and more wireless devices working in different frequency bands are available, and meanwhile, the design space for a single antenna is more and more limited. The more wireless communication devices on the same carrier, the more complex the electromagnetic environment, and the mutual interference between different antennas can greatly influence the performance of the antennas. Therefore, it is highly demanded that a pair of antennas can operate in a plurality of communication systems and be compatible with a plurality of communication frequency bands, thereby reducing the number of antennas and realizing miniaturization of the device. Therefore, broadband antennas are one of the main trends of antenna design.
The electromagnetic wave has high frequency, short wavelength, poor penetrating power and large attenuation, more antennas are needed to be arranged in the same coverage area, and the data transmission quantity is increased dramatically. Compared with a linear polarized antenna, the circular polarized antenna can suppress multipath interference, has small polarization deflection loss and can resist the influence of severe weather, so that the development of the wide-band circular polarized antenna is necessary.
Disclosure of Invention
The invention aims to provide a broadband high-gain circularly polarized magnetic dipole antenna array which has a simple structure and is easy to realize, and the antenna has a communication frequency bandwidth, a circularly polarized frequency bandwidth and a high directional gain.
The technical solution for realizing the purpose of the invention is as follows: the utility model provides a broadband high-gain circular polarization magnetic dipole antenna array, includes upper metal paster, upper dielectric substrate, intermediate level metal paster, lower dielectric substrate, the lower floor metal paster that from top to bottom set up, wherein:
the upper metal patch consists of four groups of metal sheet units with identical structures, each group of metal sheet unit consists of 5 metal sheets, and circular polarization characteristics are realized by adopting structures of rectangular metal sheet corner cutting and rectangular perturbation addition; meanwhile, each group of metal sheet units is provided with a plurality of metal through holes penetrating through the upper medium substrate and connecting the upper metal patch and the middle metal patch;
the middle layer metal patch is tiled on the upper surface of the whole lower layer dielectric substrate and is etched with four circular through holes; the lower layer dielectric substrate is penetrated by four metal through holes and is connected with the middle layer metal patch and the lower layer metal patch;
the lower metal patch adopts a microstrip line to form a quarter-power divider.
Further, the upper layer metal patch is composed of 4 groups of metal sheet units with identical structures, and the metal sheet units are arranged in a 2 multiplied by 2 array, namely a first group of metal sheet units arranged at the left upper corner, a second group of metal sheet units arranged at the right upper corner, a third group of metal sheet units arranged at the right lower corner and a fourth group of metal sheet units arranged at the left lower corner;
the first group of metal sheet units consists of 5 metal sheets, namely a first metal sheet arranged at the upper left corner, a second metal sheet arranged at the upper right corner, a third metal sheet arranged at the lower right corner, a fourth metal sheet arranged at the lower left corner and a fifth metal sheet arranged at the middle position; the first metal sheet and the third metal sheet have the same structure and are symmetrically arranged about the center, the rectangular metal sheet is cut off into a first triangular metal sheet, and a first metal through hole array is etched; the rectangular metal sheet is cut off into a second triangular metal sheet, and a third metal through hole array is etched; the second metal sheet and the fourth metal sheet have the same structure and are symmetrically arranged about the center, the second metal sheet is formed by adding a sixth metal sheet to the right upper corner of the rectangular metal sheet, and etching a second metal through hole array; the fourth metal sheet is formed by adding a seventh metal sheet to the left lower corner of the rectangular metal sheet, and etching a fourth metal through hole array;
the left side of the fifth metal sheet is etched with a first metal through hole, and the left sides of the second group of metal sheet units, the third group of metal sheet units and the fourth group of metal sheet units are etched with a second metal through hole, a third metal through hole and a fourth metal through hole respectively at the same positions.
Further, the second metal through hole array and the first metal through hole array have the same structure and are symmetrically arranged according to left and right directions, the third metal through hole array and the first metal through hole array have the same structure and are symmetrically arranged about the center, and the fourth metal through hole array and the first metal through hole array have the same structure and are symmetrically arranged according to up and down directions;
the upper medium substrate is penetrated by a first metal through hole array, a second metal through hole array, a third metal through hole array, a fourth metal through hole array and a first metal through hole in the first group of metal sheet units at the position corresponding to the first group of metal sheet units to form a first group of metal through holes;
and similarly, the second group of metal through holes, the third group of metal through holes and the fourth group of metal through holes are respectively formed on the upper medium substrate at positions corresponding to the second group of metal sheet units, the third group of metal sheet units and the fourth group of metal sheet units.
Further, the middle layer metal patch is tiled on the upper surface of the whole lower layer dielectric substrate and consists of 4 groups of completely identical through holes, namely a first group of through holes arranged at the left upper corner, a second group of through holes arranged at the right upper corner, a third group of through holes arranged at the right lower corner and a fourth group of through holes arranged at the left lower corner;
the middle layer metal patch is penetrated by a first metal through hole array, a second metal through hole array, a third metal through hole array and a fourth metal through hole array in the first group of metal sheet units at the position corresponding to the first group of metal sheet units to form a first group of through holes; similarly, a second group of through holes, a third group of through holes and a fourth group of through holes are respectively formed on the middle layer metal patch at positions corresponding to the second group of metal sheet units, the third group of metal sheet units and the fourth group of metal sheet units;
etching a circular through hole in the first group of through holes, the second group of through holes, the third group of through holes and the fourth group of through holes respectively, wherein the circular through holes are respectively a first circular through hole, a second circular through hole, a third circular through hole and a fourth circular through hole; the first through fourth circular through holes are arranged below orthographic projections of the first through fourth metal through holes in a one-to-one correspondence mode, the circle centers of the circular through holes and the metal through holes at corresponding positions are the same, and the radius of the first through fourth circular through holes is larger than that of the first through fourth metal through holes.
Further, the lower dielectric substrate is penetrated by the first to fourth metal through holes for connecting the middle layer metal patch and the lower layer metal patch.
Further, the lower metal patch is a 1-to-4 power divider composed of microstrip lines, and the whole is composed of 7 parts, namely an eighth metal sheet, a ninth metal sheet, a tenth metal sheet, an eleventh metal sheet, a twelfth metal sheet, a thirteenth metal sheet and a fourteenth metal sheet;
the ninth metal sheet and the tenth metal sheet are bilaterally symmetrical, the structures are identical, the upper right corner of the ninth metal sheet is etched with a third triangle, and the upper left corner of the tenth metal sheet is etched with a fourth triangle;
the eleventh metal sheet, the twelfth metal sheet, the thirteenth metal sheet and the fourteenth metal sheet have the same structure, wherein the eleventh metal sheet and the thirteenth metal sheet are vertically symmetrical, and the twelfth metal sheet and the fourteenth metal sheet are vertically symmetrical; etching a fifth triangle at the left upper corner of the eleventh metal sheet, etching a sixth triangle at the left lower corner of the eleventh metal sheet, and penetrating the right upper corner of the eleventh metal sheet by the first metal through hole; the left upper corner of the twelfth metal sheet is etched with a seventh triangle, the right lower corner of the twelfth metal sheet is etched with an eighth triangle, and the right upper corner of the twelfth metal sheet is penetrated by the second metal through hole; etching a ninth triangle at the left upper corner of the thirteenth metal sheet, etching a thirteenth triangle at the left lower corner, and penetrating the right lower corner by the fourth metal through hole; the fourteenth metal sheet has an eleventh triangle etched in the upper right corner and a twelfth triangle etched in the lower left corner, the lower right corner being penetrated by the third metal via.
Further, energy is input by the eighth metal sheet, is transmitted to the eleventh to fourteenth metal sheets through the ninth metal sheet and the tenth metal sheet, then is transmitted to the first to fourth groups of metal sheets through the first to fourth metal through holes to radiate outwards, the middle layer metal patch is a common floor of the antenna and the power divider, and the feeder line is positioned on the lower layer metal patch.
Further, the first metal sheet and the third metal sheet are of a trapezoid structure.
Further, the twelfth metal sheet and the fourteenth metal sheet are respectively obtained by right translation of the eleventh metal sheet and the thirteenth metal sheet.
Further, the thickness of the upper dielectric substrate is 1.57mm, the thickness of the lower dielectric substrate is 0.254mm, and the overall height of the antenna is 1.824mm.
Compared with the prior art, the invention has the remarkable advantages that: (1) The circular polarization characteristic is realized by adopting a rectangular patch corner cutting structure and a rectangular perturbation adding structure, the structure is simple, the integration is easy, and the axial ratio bandwidth is widened; (2) The wider impedance bandwidth is obtained by adopting a mode of feeding through metal through holes and circular through holes; (3) A quarter-divided power divider formed by microstrip lines is adopted, so that the antenna has high gain performance, stable radiation mode and more concentrated radiation direction.
Drawings
Fig. 1a is a side view of an antenna of the circularly polarized magnetic electric dipole antenna array of the present invention.
FIG. 1b is a circuit diagram of the upper layer metal patch of the circularly polarized magnetic electric dipole antenna array of the present invention.
FIG. 1c is a top view of the upper dielectric layer substrate of the circularly polarized magnetic dipole antenna array of the present invention.
FIG. 1d is a circuit diagram of an interlayer metal patch of a circularly polarized magnetic electric dipole antenna array of the present invention.
FIG. 1e is a top view of the underlying dielectric substrate of the circularly polarized magnetic dipole antenna array of the present invention.
FIG. 1f is a circuit diagram of the underlying metal patch of the circularly polarized magnetic electric dipole antenna array of the present invention.
FIG. 1g is a top view of a circularly polarized magnetic dipole antenna array of the present invention from an upper dielectric layer substrate to a lower metal patch.
FIG. 2 is a diagram of an S-shaped wideband high gain circularly polarized magnetic dipole antenna array of the present invention 11 Graph diagram.
FIG. 3 is a graph of the axial ratio of a wideband high gain circularly polarized magnetic dipole antenna array of the present invention.
Fig. 4 is a graph of the gain of a wideband high gain circularly polarized magnetic dipole antenna array of the present invention.
Fig. 5 is an E-plane radiation pattern at 40GHz for a wideband high gain circularly polarized magnetic dipole antenna array of the present invention.
Fig. 6 is an H-plane radiation pattern at 40GHz for a wideband high gain circularly polarized magnetic dipole antenna array of the present invention.
Detailed Description
The broadband high-gain circularly polarized magnetic dipole antenna array comprises three layers of metal patches and two layers of dielectric substrates, wherein the three layers of metal patches, the upper layer of dielectric substrate, the middle layer of metal patches, the lower layer of dielectric substrate and the lower layer of metal patches are respectively arranged; the upper layer metal patch consists of four groups of antenna units with identical structures, each group of metal sheet units consists of 5 metal sheets, circular polarization characteristics are realized by adopting structures of rectangular metal sheet corner cutting and rectangular perturbation addition, the upper layer metal patch has wider axial ratio frequency bands, and each group of metal sheet units is provided with 17 metal through holes which penetrate through an upper layer medium substrate and are connected with the upper layer metal patch and the middle layer metal patch; the middle layer metal patch is flatly paved on the upper surface of the whole lower layer dielectric substrate and is etched with four circular through holes; the lower layer dielectric substrate is penetrated by four metal through holes and is connected with the middle layer metal patch and the lower layer metal patch; the lower metal patch adopts a quarter-turn power divider composed of microstrip lines, so that the antenna is more compact, the radiation direction is more concentrated, and the high-gain characteristic is realized. The antenna has the advantages of wide frequency band, wide axial ratio bandwidth, high gain and small volume.
The broadband high-gain circularly polarized magnetic dipole antenna array has the characteristics of broadband, wide axial ratio bandwidth and high gain, and is used as a bottom metal patch to enable the antenna performance to be more stable, the antenna has wider impedance bandwidth by adopting a mode of feeding through metal through holes and circular through holes, and the upper metal patch adopts a rectangular patch chamfer and adds rectangular perturbation to realize a circularly polarized characteristic structure to enable the antenna to have wider axial ratio frequency band.
Referring to fig. 1, the wideband high-gain circularly polarized magnetic dipole antenna array of the invention comprises an upper metal patch 1, an upper dielectric substrate 2, an intermediate metal patch 3, a lower dielectric substrate 4 and a lower metal patch 5 which are arranged from top to bottom, wherein:
the upper metal patch 1 is composed of four groups of metal sheet units with identical structures, each group of metal sheet units is composed of 5 metal sheets, and circular polarization characteristics are realized by adopting structures of rectangular metal sheet corner cutting and rectangular perturbation addition; meanwhile, each group of metal sheet units is provided with a plurality of metal through holes penetrating through the upper medium substrate 2 to connect the upper metal patch 1 and the middle metal patch 3;
the middle layer metal patch 3 is tiled on the upper surface of the whole lower layer dielectric substrate 4 and is etched with four circular through holes; the lower dielectric substrate 4 is penetrated by four metal through holes and is connected with the middle layer metal patch 3 and the lower layer metal patch 5;
the lower metal patch 5 adopts a microstrip line to form a quarter-turn power divider.
As a specific example, the upper metal patch 1 is composed of 4 groups of metal sheet units with identical structures, and is arranged in a 2×2 array, and each of the metal sheet units is a first group of metal sheet units 11 arranged in the upper left corner, a second group of metal sheet units 12 arranged in the upper right corner, a third group of metal sheet units 13 arranged in the lower right corner, and a fourth group of metal sheet units 14 arranged in the lower left corner;
the first group of metal sheet units 11 consists of 5 metal sheets, namely a first metal sheet 111 arranged at the left upper corner, a second metal sheet 112 arranged at the right upper corner, a third metal sheet 113 arranged at the right lower corner, a fourth metal sheet 114 arranged at the left lower corner and a fifth metal sheet 115 arranged at the middle position; the first metal sheet 111 and the third metal sheet 113 have the same structure and are symmetrically arranged about the center, the first metal sheet 111 is a metal sheet obtained by cutting a rectangular metal sheet into a first triangle 116, and the first metal through hole array 25 is etched; the third metal sheet 113 is a rectangular metal sheet cut off from the second triangular metal sheet 118, and the third metal through hole array 27 is etched; the second metal sheet 112 and the fourth metal sheet 114 have the same structure and are symmetrically arranged about the center, the second metal sheet 112 is formed by adding a sixth metal sheet 117 to the right upper corner of the rectangular metal sheet, and etching the second metal through hole array 26; the fourth metal sheet 114 is formed by adding a seventh metal sheet 119 to the lower left corner of the rectangular metal sheet, and etching a fourth metal through hole array 28;
the first metal through holes 41 are etched on the left side of the fifth metal sheet 115, and the second metal through holes 42, the third metal through holes 43 and the fourth metal through holes 44 are etched on the same positions on the left side of the second group metal sheet unit 12, the third group metal sheet unit 13 and the fourth group metal sheet unit 14.
As a specific example, the second metal via array 26 and the first metal via array 25 have the same structure and are arranged symmetrically left and right, the third metal via array 27 and the first metal via array 25 have the same structure and are arranged symmetrically about the center, and the fourth metal via array 28 and the first metal via array 25 have the same structure and are arranged symmetrically up and down;
at a position corresponding to the first group of metal sheet units 11, the upper dielectric substrate 2 is penetrated by a first metal through hole array 25, a second metal through hole array 26, a third metal through hole array 27, a fourth metal through hole array 28 and a first metal through hole 41 in the first group of metal sheet units 11 to form a first group of metal through holes 21;
similarly, a second group of metal vias 22, a third group of metal vias 23, and a fourth group of metal vias 24 are formed in the upper dielectric substrate 2 at positions corresponding to the second group of metal sheet units 12, the third group of metal sheet units 13, and the fourth group of metal sheet units 14, respectively.
As a specific example, the middle metal patch 3 is tiled on the upper surface of the entire lower dielectric substrate 4, and is composed of 4 groups of completely identical through holes, namely, a first group of through holes 31 arranged at the upper left corner, a second group of through holes 32 arranged at the upper right corner, a third group of through holes 33 arranged at the lower right corner and a fourth group of through holes 34 arranged at the lower left corner;
at the positions corresponding to the first group of metal sheet units 11, the middle layer metal patch 3 is penetrated by a first metal through hole array 25, a second metal through hole array 26, a third metal through hole array 27 and a fourth metal through hole array 28 in the first group of metal sheet units 11 to form a first group of through holes 31; similarly, a second group of through holes 32, a third group of through holes 33 and a fourth group of through holes 34 are respectively formed on the middle layer metal patch 3 at positions corresponding to the second group of metal sheet units 12, the third group of metal sheet units 13 and the fourth group of metal sheet units 14;
one circular through hole is etched in the first group of through holes 31, the second group of through holes 32, the third group of through holes 33 and the fourth group of through holes 34 respectively, and the circular through holes are a first circular through hole 35, a second circular through hole 36, a third circular through hole 37 and a fourth circular through hole 38 respectively; the first to fourth circular through holes 35, 36, 37, 38 are arranged below the orthographic projection of the first to fourth metal through holes 41, 42, 43, 44 in a one-to-one correspondence manner, the circle center positions of the corresponding circular through holes and the metal through holes are the same, and the radius of the first to fourth circular through holes 35, 36, 37, 38 is larger than that of the first to fourth metal through holes 41, 42, 43, 44.
As a specific example, the lower dielectric substrate 4 is penetrated by first to fourth metal vias 41, 42, 43, 44 for connecting the intermediate layer metal patch 3 and the lower layer metal patch 5.
As a specific example, the lower metal patch 5 is a 1-to-4 power divider composed of microstrip lines, and is composed of 7 parts as a whole, namely, an eighth metal sheet 51, a ninth metal sheet 52, a tenth metal sheet 53, an eleventh metal sheet 54, a twelfth metal sheet 55, a thirteenth metal sheet 56, and a fourteenth metal sheet 57;
the ninth metal sheet 52 and the tenth metal sheet 53 are bilaterally symmetrical, the structures are identical, the upper right corner of the ninth metal sheet 52 is etched with a third triangle 521, and the upper left corner of the tenth metal sheet 53 is etched with a fourth triangle 531;
the eleventh metal sheet 54, the twelfth metal sheet 55, the thirteenth metal sheet 56 and the fourteenth metal sheet 57 have the same structure, wherein the eleventh metal sheet 54 and the thirteenth metal sheet 56 are vertically symmetrical, and the twelfth metal sheet 55 and the fourteenth metal sheet 57 are vertically symmetrical; the eleventh metal sheet 54 has an upper left corner etched with the fifth triangle 541, a lower left corner etched with the sixth triangle 542, and an upper right corner penetrated by the first metal via 41; the twelfth metal sheet 55 has an upper left corner etched with the seventh triangle 551, a lower right corner etched with the eighth triangle 552, and an upper right corner penetrated by the second metal via 42; the thirteenth metal piece 56 has an upper left corner etched with a ninth triangle 562, a lower left corner etched with a thirteenth corner 561, and a lower right corner penetrated by the fourth metal via 44; the fourteenth metal sheet 57 has an eleventh triangle 572 etched in the upper right corner and a twelfth triangle 571 etched in the lower left corner, the lower right corner being penetrated by the third metal via 43.
As a specific example, energy is input from the eighth metal sheet 51, transmitted to the eleventh to fourteenth metal sheets 54, 55, 56, 57 via the ninth metal sheet 52 and the tenth metal sheet 53, and then transmitted to the first to fourth groups of metal sheets 11, 12, 13, 14 through the first to fourth circular through holes 35, 36, 37, 38 via the first to fourth metal through holes 41, 42, 43, 44 to radiate outward, the middle metal patch 3 being a common floor of the antenna and the power divider, and the feeder line being located in the lower metal patch 5.
As one embodiment, the first metal sheet 111 and the third metal sheet 113 have a trapezoid structure.
In one embodiment, the twelfth metal sheet 55 and the fourteenth metal sheet 57 are respectively obtained by translating the eleventh metal sheet 54 and the thirteenth metal sheet 56 rightward.
In one embodiment, the thickness of the upper dielectric substrate 2 is 1.57mm, the thickness of the lower dielectric substrate 4 is 0.254mm, and the overall height of the antenna is 1.824mm.
The invention is described in further detail below with reference to the accompanying drawings and specific examples.
Examples
Referring to fig. 1, the broadband high-gain circularly polarized antenna array of the invention comprises an upper metal patch 1, an upper dielectric substrate 2, an intermediate metal patch 3, a lower dielectric substrate 4 and a lower metal patch 5; the upper metal patch 1 consists of four groups of metal sheet units 11, 12, 13 and 14 with identical structures; taking the first group of metal sheet units 11 as an example, the first group of metal sheet units 11 is composed of 5 metal sheets, namely a first metal sheet 111 arranged at the upper left corner, a second metal sheet 112 arranged at the upper right corner, a third metal sheet 113 arranged at the lower right corner, a fourth metal sheet 114 arranged at the lower left corner and a fifth metal sheet 115 arranged at the middle position; the first metal sheet 111 and the third metal sheet 113 have the same structure and are symmetrically arranged about the center, the first metal sheet 111 is a metal sheet obtained by cutting a rectangular metal sheet into a first triangle 116, and the first metal through hole array 25 is etched; the third metal sheet 113 is a rectangular metal sheet cut off from the second triangular metal sheet 118, and the third metal through hole array 27 is etched; the second metal sheet 112 and the fourth metal sheet 114 are identical and are symmetrically arranged about the center, the second metal sheet 112 is formed by adding a sixth rectangular metal sheet 117 to the upper right corner of the rectangular metal sheet, and etching the second metal through hole array 26; the fourth metal sheet 114 is formed by adding a seventh rectangular metal sheet 119 to the lower left corner of the rectangular metal sheet, and etching a fourth metal through hole array 28; the fifth metal pad 115 is etched with the first metal via 41 on the left side. The metal through holes 41, 42, 43, 44 penetrate through the dielectric substrate 2 and are used for connecting the upper metal patch 1 and the middle metal patch 3; the middle-layer metal patch 3 is flatly paved on the upper surface of the whole lower-layer dielectric substrate 4, and four circular through holes 35, 36, 37 and 38 are etched, wherein the radius of each circular through hole 35, 36, 37 and 38 is larger than that of each metal through hole 41, 42, 43 and 44, and the circle centers of the circular through holes are the same; the metal through holes 41, 42, 43, 44 penetrate through the dielectric substrate 4 and are used for connecting the middle-layer metal patch 3 and the lower-layer metal patch 5; the lower layer metal patch 5 consists of metal sheets 51, 52, 53, 54, 55, 56 and 57, wherein the metal sheets 52 and 53 are bilaterally symmetrical and have the same structure, the right upper corner of the metal sheet 52 is provided with a triangle 521, and the left upper corner of the metal sheet 53 is provided with a triangle 531; the metal sheets 54, 55, 56 and 57 have the same structure, the metal sheets 54 and 56 are vertically symmetrical, and the metal sheets 55 and 57 are vertically symmetrical; the upper left corner of metal sheet 54 etches triangle 541, lower left corner etches triangle 542, upper right corner etches metal via 41, upper left corner etches triangle 551, lower right corner etches triangle 552, upper right corner etches metal via 42, upper left corner etches triangle 562, lower left corner etches triangle 561, lower right corner etches metal via 44, upper right corner etches triangle 572, lower left corner etches triangle 571, lower right corner etches metal via 43.
The design process of the invention is as follows:
the thickness of the upper dielectric substrate 2 is 1.57mm, the dielectric constant is 2.2, and the thickness of the lower dielectric substrate 4 is 0.254mm, the dielectric constant is 2.2.
Secondly, the upper metal patch 1 makes the antenna realize circular polarization performance by cutting angles and adding a perturbation structure to the rectangular patch, widens the axial ratio bandwidth, and makes the antenna have broadband characteristic by adopting a mode of metal through holes 41, 42, 43 and 44 and circular through holes 35, 36, 37 and 38;
and (III) the lower metal patch 5 is designed as a quarter-turn divider consisting of microstrip lines, and four groups of identical metal sheets are arranged into a 2X 2 structure, so that the designed antenna has high gain characteristic and more concentrated radiation direction.
Referring to FIGS. 1a to 1g, the broadband high-gain circularly polarized antenna array of the invention has a dielectric substrate 2 made of Roger RT5880 and a dielectric constant epsilon r =2.2, thickness h1=1.57 mm, dimensions 20mm×21.6mm×1.57mm, material of dielectric substrate 4 Roger RT5880, dielectric constant epsilon r =2.2, thickness h2=0.254 mm, dimensions 20.3mm×21.6mm×0.254mm; the diameters of the metal through holes 41, 42, 43 and 44 penetrating through the upper layer dielectric substrate 2 are 0.4mm, the diameters of the circular through holes 35, 36, 37 and 38 on the middle layer metal patch are 0.9mm, the two right-angle sides of the first triangle 116 are 1.1mm multiplied by 1.7mm, the width of the rectangular metal sheet 117 is 1.1mm, and the length is 0.2mm.
FIG. 2 is a diagram of an S-shaped wideband high gain circularly polarized magnetic dipole antenna array of the present invention 11 The graph shows that the working frequency band of the broadband high-gain circularly polarized antenna array is 32-48 GHz, the absolute bandwidth is 16GHz, the relative bandwidth is 40%, and the antenna has wider working frequency band。
FIG. 3 is an axial ratio graph of a broadband high-gain circularly polarized magnetic dipole antenna array of the present invention, the axial ratio frequency band of the broadband high-gain circularly polarized antenna array is 32-48 GHz, the absolute axial ratio bandwidth is 16GHz, and the relative axial ratio bandwidth is 40%.
Fig. 4 is a graph of gain as a function of frequency for a wideband high gain circularly polarized magnetic dipole antenna array of the present invention, with a gain up to 14dBic, and a higher gain compared to a single circularly polarized antenna element.
Fig. 5 and 6 are diagrams of the broadband high-gain circularly polarized antenna array of the present invention in a 40GHz radiation direction, the broadband high-gain circularly polarized antenna array is stable in direction, and the cross polarization level is low.
In conclusion, the broadband high-gain circularly polarized antenna array has the advantages of stable directional diagram, low cross polarization level, simple structure and easy processing and realization.
Claims (8)
1. The utility model provides a broadband high-gain circular polarization magnetic dipole antenna array, its characterized in that includes upper metal paster (1), upper dielectric substrate (2), intermediate level metal paster (3), lower dielectric substrate (4), lower floor metal paster (5) that set up from top to bottom, wherein:
the upper metal patch (1) consists of four groups of metal sheet units with identical structures, each group of metal sheet units consists of 5 metal sheets, and circular polarization characteristics are realized by adopting structures of rectangular metal sheet corner cutting and rectangular perturbation addition; simultaneously, each group of metal sheet units is provided with a plurality of metal through holes penetrating through the upper medium substrate (2) and connecting the upper metal patch (1) and the middle metal patch (3);
the middle layer metal patch (3) is tiled on the upper surface of the whole lower layer dielectric substrate (4) and is etched with four circular through holes; the lower layer dielectric substrate (4) is penetrated by four metal through holes and is connected with the middle layer metal patch (3) and the lower layer metal patch (5);
the lower metal patch (5) adopts a microstrip line to form a quarter-power divider;
the upper layer metal patch (1) consists of 4 groups of metal sheet units with identical structures, and the metal sheet units are arranged in a 2 multiplied by 2 array, namely a first group of metal sheet units (11) arranged at the left upper corner, a second group of metal sheet units (12) arranged at the right upper corner, a third group of metal sheet units (13) arranged at the right lower corner and a fourth group of metal sheet units (14) arranged at the left lower corner;
the first group of metal sheet units (11) consists of 5 metal sheets, namely a first metal sheet (111) arranged at the upper left corner, a second metal sheet (112) arranged at the upper right corner, a third metal sheet (113) arranged at the lower right corner, a fourth metal sheet (114) arranged at the lower left corner and a fifth metal sheet (115) arranged at the middle position; the first metal sheet (111) and the third metal sheet (113) have the same structure and are symmetrically arranged about the center, the first metal sheet (111) is a rectangular metal sheet obtained by cutting off a first triangle (116), and a first metal through hole array (25) is etched; the third metal sheet (113) is formed by cutting off a rectangular metal sheet into a metal sheet with a second triangle (118), and etching a third metal through hole array (27); the second metal sheet (112) and the fourth metal sheet (114) have the same structure and are symmetrically arranged about the center, the second metal sheet (112) is formed by adding a sixth metal sheet (117) to the right upper corner of a rectangular metal sheet, and a second metal through hole array (26) is etched; a seventh metal sheet (119) is added to the left lower corner of the rectangular metal sheet (114), and a fourth metal through hole array (28) is etched;
the left side of the fifth metal sheet (115) is etched with a first metal through hole (41), and the left sides of the second group of metal sheet units (12), the third group of metal sheet units (13) and the fourth group of metal sheet units (14) are etched with a second metal through hole (42), a third metal through hole (43) and a fourth metal through hole (44) respectively at the same positions;
the lower metal patch (5) is a 1-to-4 power divider composed of microstrip lines, and the whole is composed of 7 parts, namely an eighth metal sheet (51), a ninth metal sheet (52), a tenth metal sheet (53), an eleventh metal sheet (54), a twelfth metal sheet (55), a thirteenth metal sheet (56) and a fourteenth metal sheet (57);
the ninth metal sheet (52) and the tenth metal sheet (53) are bilaterally symmetrical and have the same structure, the upper right corner of the ninth metal sheet (52) is etched with a third triangle (521), and the upper left corner of the tenth metal sheet (53) is etched with a fourth triangle (531);
the eleventh metal sheet (54), the twelfth metal sheet (55), the thirteenth metal sheet (56) and the fourteenth metal sheet (57) have the same structure, wherein the eleventh metal sheet (54) and the thirteenth metal sheet (56) are vertically symmetrical, and the twelfth metal sheet (55) and the fourteenth metal sheet (57) are vertically symmetrical; the eleventh metal sheet (54) has an upper left corner etched with a fifth triangle (541), a lower left corner etched with a sixth triangle (542), and an upper right corner penetrated by the first metal via (41); a seventh triangle (551) is etched in the left upper corner of the twelfth metal sheet (55), an eighth triangle (552) is etched in the right lower corner, and the right upper corner is penetrated by the second metal through hole (42); the thirteenth metal sheet (56) has a ninth triangle (562) etched in the upper left corner and a thirteenth triangle (561) etched in the lower left corner, the lower right corner being penetrated by the fourth metal via (44); the fourteenth metal sheet (57) has an eleventh triangle (572) etched in the upper right corner and a twelfth triangle (571) etched in the lower left corner, the lower right corner being penetrated by the third metal via (43).
2. The broadband high-gain circularly polarized magnetic dipole antenna array according to claim 1, wherein the second metal via array (26) and the first metal via array (25) have the same structure and are symmetrically arranged according to the left-right direction, the third metal via array (27) and the first metal via array (25) have the same structure and are symmetrically arranged about the center, and the fourth metal via array (28) and the first metal via array (25) have the same structure and are symmetrically arranged according to the up-down direction;
the upper dielectric substrate (2) is penetrated by a first metal through hole array (25), a second metal through hole array (26), a third metal through hole array (27), a fourth metal through hole array (28) and a first metal through hole (41) in the first group of metal sheet units (11) at positions corresponding to the first group of metal sheet units (11) to form a first group of metal through holes (21);
similarly, a second group of metal through holes (22), a third group of metal through holes (23) and a fourth group of metal through holes (24) are respectively formed on the upper dielectric substrate (2) at positions corresponding to the second group of metal sheet units (12), the third group of metal sheet units (13) and the fourth group of metal sheet units (14).
3. The broadband high-gain circularly polarized magnetic dipole antenna array according to claim 2, wherein the middle layer metal patch (3) is tiled on the upper surface of the whole lower layer dielectric substrate (4) and consists of 4 groups of completely identical through holes, namely a first group of through holes (31) arranged at the left upper corner, a second group of through holes (32) arranged at the right upper corner, a third group of through holes (33) arranged at the right lower corner and a fourth group of through holes (34) arranged at the left lower corner;
the middle layer metal patch (3) is penetrated by a first metal through hole array (25), a second metal through hole array (26), a third metal through hole array (27) and a fourth metal through hole array (28) in the first group metal sheet unit (11) at a position corresponding to the first group metal sheet unit (11) to form a first group of through holes (31); similarly, a second group of through holes (32), a third group of through holes (33) and a fourth group of through holes (34) are respectively formed on the middle layer metal patch (3) at positions corresponding to the second group of metal sheet units (12), the third group of metal sheet units (13) and the fourth group of metal sheet units (14);
a circular through hole is etched in the first group of through holes (31), the second group of through holes (32), the third group of through holes (33) and the fourth group of through holes (34) respectively, and the circular through holes are respectively a first circular through hole (35), a second circular through hole (36), a third circular through hole (37) and a fourth circular through hole (38); the first through fourth circular through holes (35, 36, 37, 38) are arranged below orthographic projections of the first through fourth metal through holes (41, 42, 43, 44) in a one-to-one correspondence mode, the circle center positions of the corresponding circular through holes and the metal through holes are the same, and the radius of the first through fourth circular through holes (35, 36, 37, 38) is larger than that of the first through fourth metal through holes (41, 42, 43, 44).
4. A broadband high-gain circularly polarized magneto-electric dipole antenna array according to claim 3, wherein the lower dielectric substrate (4) is penetrated by first to fourth metal vias (41, 42, 43, 44) for connecting the middle layer metal patch (3) and the lower layer metal patch (5).
5. The broadband high-gain circularly polarized magnetic dipole antenna array according to claim 4, wherein energy is inputted from an eighth metal sheet (51), transmitted to eleventh to fourteenth metal sheets (54, 55, 56, 57) through a ninth metal sheet (52) and a tenth metal sheet (53), and then transmitted to the first to fourth groups of metal sheets (11, 12, 13, 14) through first to fourth circular through holes (35, 36, 37, 38) through first to fourth metal through holes (41, 42, 43, 44), radiated outwards, the middle layer metal patch (3) being a common floor of an antenna and a power divider, and the feeder line being located at the lower layer metal patch (5).
6. The broadband high-gain circularly polarized magneto-electric dipole antenna array according to claim 4, wherein said first metal sheet (111) and said third metal sheet (113) are of a trapezoidal structure.
7. The broadband high-gain circularly polarized magnetic dipole antenna array according to claim 4, wherein the twelfth metal sheet (55) and the fourteenth metal sheet (57) are respectively obtained by shifting the eleventh metal sheet (54) and the thirteenth metal sheet (56) rightward.
8. The broadband high-gain circularly polarized magnetic dipole antenna array according to any one of claims 1-7, wherein the thickness of the upper dielectric substrate (2) is 1.57mm, the thickness of the lower dielectric substrate (4) is 0.254mm, and the overall height of the antenna is 1.824mm.
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| CN103872459A (en) * | 2014-03-24 | 2014-06-18 | 电子科技大学 | Novel LTCC double-layer single-feed circular polarization micro-strip patch array antenna |
| WO2019015298A1 (en) * | 2017-07-18 | 2019-01-24 | 东南大学 | Low-profile broadband circularly-polarized array antenna using stacked travelling wave antenna elements |
| CN112838365A (en) * | 2020-12-29 | 2021-05-25 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Circular polarization substrate integrated waveguide magnetoelectric dipole antenna and array thereof |
| CN113036459A (en) * | 2021-03-08 | 2021-06-25 | 安徽大学 | Millimeter wave low-profile broadband circularly polarized slot-fed dipole array antenna |
| WO2021147782A1 (en) * | 2020-01-21 | 2021-07-29 | 大唐移动通信设备有限公司 | Antenna apparatus and base station device |
| CN114336021A (en) * | 2021-12-28 | 2022-04-12 | 西安理工大学 | Broadband circularly polarized substrate integrated waveguide resonant cavity antenna array |
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| CN103872459A (en) * | 2014-03-24 | 2014-06-18 | 电子科技大学 | Novel LTCC double-layer single-feed circular polarization micro-strip patch array antenna |
| WO2019015298A1 (en) * | 2017-07-18 | 2019-01-24 | 东南大学 | Low-profile broadband circularly-polarized array antenna using stacked travelling wave antenna elements |
| WO2021147782A1 (en) * | 2020-01-21 | 2021-07-29 | 大唐移动通信设备有限公司 | Antenna apparatus and base station device |
| CN112838365A (en) * | 2020-12-29 | 2021-05-25 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Circular polarization substrate integrated waveguide magnetoelectric dipole antenna and array thereof |
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