CN115339178A - Backing plate for PCB drilling, preparation method thereof and adhesive - Google Patents

Backing plate for PCB drilling, preparation method thereof and adhesive Download PDF

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Publication number
CN115339178A
CN115339178A CN202111563679.1A CN202111563679A CN115339178A CN 115339178 A CN115339178 A CN 115339178A CN 202111563679 A CN202111563679 A CN 202111563679A CN 115339178 A CN115339178 A CN 115339178A
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CN
China
Prior art keywords
adhesive
wood fiber
polyethylene glycol
urea
base plate
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Pending
Application number
CN202111563679.1A
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Chinese (zh)
Inventor
黄宏锡
唐明明
张伦强
周永飞
蒲强
杨柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUNAN LIUXIN ELECTRONIC NEW MATERIAL CO Ltd
Shenzhen Newccess Industrial Co ltd
Original Assignee
HUNAN LIUXIN ELECTRONIC NEW MATERIAL CO Ltd
Shenzhen Newccess Industrial Co ltd
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Priority to CN202111563679.1A priority Critical patent/CN115339178A/en
Publication of CN115339178A publication Critical patent/CN115339178A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B21/06—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C08K2003/329—Phosphorus containing acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention provides a base plate for PCB drilling, a preparation method thereof and an adhesive, wherein the base plate comprises a wood fiber plate and surface paper attached to the upper surface and the lower surface of the wood fiber plate, an adhesive layer is arranged between the wood fiber plate and the surface paper, the adhesive layer is an adhesive layer formed after the adhesive is cured, and the adhesive comprises urea-formaldehyde resin, polyethylene oxide, polyethylene glycol and an acidic substance. In the invention, when the adhesive is used for preparing a paper pasting base plate under the normal temperature condition and is used for pasting the paper pasting base plate, the adhesive can not only ensure the binding force between the surface paper and the wood fiber plate, but also can fully exert the integral heat dissipation and lubrication effects of functional materials of polyoxyethylene and polyethylene glycol. When the base plate provided by the invention is used for PCB drilling, the base plate can effectively reduce the temperature of the drill point, thereby playing the roles of reducing the abrasion of the drill bit and reducing drill cuttings adhered to the drill point, and obviously improving the quality of the hole wall.

Description

Backing plate for PCB drilling, preparation method thereof and adhesive
Technical Field
The invention relates to the technical field of PCB drilling, in particular to a backing plate for PCB drilling, a preparation method thereof and an adhesive.
Technical Field
In the prior art, when a cover plate and a base plate for drilling a Printed Circuit Board (PCB) with high heat dissipation characteristics are manufactured, an adhesive is usually required, the adhesive is required to have a good lubricating and heat dissipation effect, the high heat dissipation characteristics are exerted in the drilling process, and the temperature of a drill point is reduced, so that the abrasion of the drill point is reduced, drill cuttings adhered to the drill point are reduced, chip removal is facilitated, the quality of the wall of a PCB drilling hole is improved, and the reliability of the circuit board is improved; meanwhile, the adhesive is required to have higher adhesive capacity with a paper fiber base material, and does not fall off in use. On the other hand, the waterproof backing plate also has the function of improving moisture resistance and reducing the warping deformation of the backing plate caused by moisture absorption.
The existing adhesives used for the cover plate and the base plate mostly use aqueous polyurethane, aqueous acrylic acid, aqueous epoxy resin and the like as main body resins, and functional materials with lubricating and heat dissipating functions, such as polyoxyethylene, polyethylene glycol and the like are added, the functional materials basically have no adhesive force to the base material, and the components such as the aqueous polyurethane, the aqueous acrylic acid, the aqueous epoxy resin and the like have the main function of improving the bonding force between the adhesive film and the base material. When the existing adhesive is used for preparing the base plate, the processing technology adopted generally is to coat the adhesive resin on the surface paper, bake the surface paper at a high temperature, then superpose the fiber boards, and press and form the fiber boards. The processing technology is improved, adhesive resin is coated on a fiberboard firstly, then the surface paper is automatically pasted, the base plate is manufactured in a natural drying mode after rolling forming, the processing technology is fast and convenient, the generation efficiency is greatly improved, the processing cost is greatly reduced, but the problems that the surface paper is wrinkled, the bonding force of the surface paper and the wood fiber base material is low and the like easily occur to the base plate manufactured by the technology due to the fact that the solid content of the existing adhesive is low and the bonding force is poor are solved.
Accordingly, there is a need for improvements and developments in the art.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a pad plate for PCB drilling, a preparation method thereof and an adhesive, and aims to solve the problems that the existing pad plate is poor in heat dissipation effect and poor in drilling quality caused by wrinkling of surface paper.
The technical scheme of the invention is as follows:
the utility model provides a PCB is backing plate for drilling, wherein, is in including wood fiberboard and laminating the facial tissue of two sides about the wood fiberboard, the wood fiberboard with be provided with gluing agent layer between the facial tissue, gluing agent layer is the glue film that forms after the gluing agent solidification, the gluing agent includes urea-formaldehyde resin, polyoxyethylene, polyethylene glycol and acidic material.
The base plate for PCB drilling comprises, by weight, 80-100 parts of urea-formaldehyde resin, 10-40 parts of polyethylene oxide, 80-120 parts of polyethylene glycol and 1-6 parts of an acidic substance.
The pad plate for PCB drilling is characterized in that the acidic substance is one or more of formic acid, boric acid and phosphoric acid.
The pad plate for PCB drilling is characterized in that the molecular weight of the polyoxyethylene is 1-10 ten thousand; and/or the molecular weight of the polyethylene glycol is 2000-50000.
The backing plate for PCB drilling is characterized in that the solid content of the adhesive is higher than 70%.
A preparation method of the backing plate for PCB drilling comprises the following steps:
providing an adhesive, wherein the adhesive comprises urea-formaldehyde resin, polyethylene oxide, polyethylene glycol and an acidic substance;
coating the adhesive on the upper surface of the wood fiber board, and attaching a piece of surface paper to the upper surface of the wood fiber board for rolling treatment for later use;
coating the adhesive on the lower surface of the wood fiber plate, attaching another piece of face paper on the lower surface of the wood fiber plate, performing rolling treatment, and airing at room temperature to obtain the PCB drilling base plate.
The preparation method of the backing plate for PCB drilling comprises the following steps:
dissolving polyethylene oxide in urea-formaldehyde resin, and stirring until the polyethylene oxide is completely dissolved;
continuously adding polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
and (3) adding an acidic substance under the stirring condition, and standing for a preset time to prepare the adhesive.
The preparation method of the base plate for PCB drilling comprises the step of preparing a base plate for PCB drilling, wherein the solid content of urea resin is 50%.
The adhesive comprises urea-formaldehyde resin, polyethylene oxide, polyethylene glycol and an acidic substance.
The adhesive comprises, by weight, 80-100 parts of urea-formaldehyde resin, 10-40 parts of polyethylene oxide, 80-120 parts of polyethylene glycol and 1-6 parts of an acidic substance.
Has the beneficial effects that: the invention provides a PCB (printed circuit board) drilling base plate which comprises a wood fiber plate and surface paper attached to the upper surface and the lower surface of the wood fiber plate, wherein an adhesive layer is arranged between the wood fiber plate and the surface paper, the adhesive layer is an adhesive layer formed after the adhesive is cured, and the adhesive comprises urea-formaldehyde resin, polyoxyethylene, polyethylene glycol and acidic substances. When the adhesive is used for preparing the base plate, the adhesive can ensure the bonding force between the surface paper and the wood fiber plate and can fully exert the integral heat dissipation and lubrication effects of functional materials of polyethylene oxide and polyethylene glycol. When the base plate provided by the invention is used for PCB drilling, the base plate can effectively reduce the temperature of the drill point, thereby playing the roles of reducing the abrasion of the drill bit and reducing drill cuttings adhered to the drill point, and obviously improving the quality of the hole wall.
Drawings
Fig. 1 is a schematic structural view of a pad for PCB drilling according to the present invention.
FIG. 2 is a flow chart of a method for manufacturing a pad for PCB drilling according to the present invention.
Detailed Description
The invention provides a backing plate for PCB drilling, a preparation method thereof and an adhesive, and the invention is further described in detail below in order to make the purpose, technical scheme and effect of the invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
The invention provides an adhesive which comprises urea-formaldehyde resin, polyethylene oxide, polyethylene glycol and an acidic substance.
The adhesive disclosed by the invention takes urea-formaldehyde resin as main resin, the viscosity of the urea-formaldehyde resin is very low, but under an acidic environment, the molecular chains of the urea-formaldehyde resin can quickly undergo dehydration condensation reaction in the drying process to be crosslinked into a three-dimensional network structure, so that better adhesive force is formed. In addition, polyoxyethylene and polyethylene glycol with lubricating and heat-dissipating functions are added into the adhesive as functional resins, wherein the polyoxyethylene and the polyethylene glycol are high heat-dissipating functional materials with proper low melting point (50-70 ℃) and higher heat-transfer enthalpy (more than 160J/g). Therefore, the adhesive provided by the invention also improves the overall lubricating and heat dissipating effects on the premise of ensuring better adhesive force with the base material. In the invention, the polyethylene glycol has more hydrogen ions, and can also perform a dehydration condensation reaction with the urea-formaldehyde resin to a certain extent to improve the initial viscosity of the adhesive, namely, the polyethylene glycol can be used as a high heat dissipation type functional material and can also improve the adhesive property of the adhesive to a certain extent.
Specifically, the urea-formaldehyde resin has a solid content of 50%, and is an initial product obtained by reacting urea with formaldehyde, wherein the initial product is in a prepolymer state before curing, that is, the formaldehyde is bonded to an imino group of urea to form an intermediate product containing a hydroxymethyl group, R-NH 2 +HCHO—R-NHCH 2 And (5) OH. The solidification of the urea-formaldehyde resin is realized by adding a curing agent, the curing agent is a substance capable of converting a monomer or an oligomer into a high polymer or a reticular cross-linked polymer, and the solidification is the continuation of a polycondensation reaction and is a key process for obtaining the bonding strength of the urea-formaldehyde resin. During the solidification process of the urea-formaldehyde resin, the lower the pH value of the system, the faster the molecular weight growth and the faster the solidification speed, namely, the speed of the polycondensation dehydration reaction is closely related to the concentration of hydrogen ions in the system. Therefore, the invention improves the bonding performance of the urea-formaldehyde resin by adding the acidic substance into the urea-formaldehyde resin as the curing agent. In this embodiment, the condensation of the urea-formaldehyde resin may be a combination of or one of the following two ways, the first being: the hydroxymethyl groups of the two intermediate products can be connected with each other to release moisture, so that an ether structure is generated. The second method is as follows: the methylol groups of the intermediate may also combine with amino groups of another intermediate to give off moisture, thereby forming a methylene-linked product.
Further, the adhesive provided by the invention does not need additional water, so that a flowable liquid with solid content higher than 70% can be formed.
In some embodiments, the acidic material is one or more of formic acid, boric acid, and phosphoric acid, but is not limited thereto.
In some embodiments, the polyethylene oxide has a molecular weight of 1 to 10 million. In the molecular weight of polyethylene oxide defined in this embodiment, the lower the molecular weight of the polyethylene oxide, the lower the melting point thereof, and the stronger the heat dissipation driving force.
In some embodiments, the polyethylene glycol has a molecular weight of 2000 to 50000. Similarly, in the molecular weight of the polyethylene glycol defined in this example, the lower the molecular weight of the polyethylene glycol, the lower the melting point of the polyethylene glycol, and the stronger the heat dissipation driving force.
In some embodiments, the adhesive comprises 80-100 parts by weight of urea formaldehyde resin, 10-40 parts by weight of polyethylene oxide, 80-120 parts by weight of polyethylene glycol and 1-6 parts by weight of acidic material. In this embodiment, if the urea-formaldehyde resin ratio is too low, the binding force cannot meet the requirement; if the proportion of the urea-formaldehyde resin is too high, the heat dissipation effect of the adhesive is affected. In this embodiment, if the ratio of polyethylene oxide is too low, the heat dissipation effect of the adhesive will be affected; if the ratio of polyethylene oxide is too high, the urea resin is difficult to dissolve, and the viscosity of the system is too high to facilitate coating. In this embodiment, if the ratio of polyethylene glycol is too low, the heat dissipation effect of the adhesive is affected; if the ratio of polyethylene glycol is too high, the binding force cannot meet the requirement. In this example, the acid content is too low or too high to achieve rapid crosslinking.
Based on the adhesive, the invention also provides a base plate for PCB drilling, which comprises a wood fiber plate 10 and surface paper 20 attached to the upper surface and the lower surface of the wood fiber plate 10, wherein an adhesive layer 30 is arranged between the wood fiber plate 10 and the surface paper 20, the adhesive layer 30 is an adhesive layer formed by curing the adhesive, and the adhesive comprises urea-formaldehyde resin, polyethylene oxide, polyethylene glycol and acidic substances, as shown in fig. 1.
The adhesive layer in the embodiment is an adhesive layer formed by curing an adhesive, wherein the adhesive takes urea-formaldehyde resin as main resin and is added with an acidic substance, and under an acidic environment, the urea-formaldehyde resin molecular chains can rapidly undergo a dehydration condensation reaction in a drying process and are crosslinked into a three-dimensional network structure, so that the adhesive has a better bonding characteristic after being cured, and the surface paper can be firmly adhered to the wood fiber board; in addition, polyoxyethylene and polyethylene glycol with lubricating and heat-dissipating functions are added into the adhesive in the embodiment as functional resins, and the polyoxyethylene and the polyethylene glycol are high heat-dissipating functional materials with proper low melting points (50-70 ℃) and higher heat transformation enthalpy (above 160J/g). Therefore, when the adhesive is used for preparing the base plate, the adhesive can not only ensure the bonding force of the surface paper and the wood fiber plate, but also fully exert the integral heat dissipation and lubrication effects of functional materials of polyethylene oxide and polyethylene glycol. When the base plate provided by the invention is used for PCB drilling, the base plate can effectively reduce the temperature of the drill point, thereby playing the roles of reducing the abrasion of the drill bit and reducing drill cuttings adhered to the drill point, and obviously improving the quality of the hole wall.
Further, the system of the adhesive after curing contains a large number of ether bonds, which can automatically hydrolyze in the presence of water. Therefore, when the base plate is used for drilling the PCB, the trace adhesive adhered to the hole wall is easy to hydrolyze and remove in the wet process of copper deposition, electroplating and the like on the hole wall, so that the drilling efficiency is improved.
Furthermore, the adhesive provided by the invention does not need additional water, and the solid content of the adhesive is more than 70% of flowable liquid. Therefore, the backing plate prepared by the method has no problem of wrinkling of the surface paper, and the drilling quality of the PCB can be improved.
In this embodiment, the acidic substance is one or more of formic acid, boric acid and phosphoric acid, but is not limited thereto. The molecular weight of the polyethylene oxide is 1 to 10 ten thousand, but is not limited thereto. The molecular weight of the polyethylene glycol is 2000-50000, but is not limited thereto. The paper is one or more of release paper, titanium white paper, kraft paper, balance paper and bleached wood pulp paper, but is not limited to the above.
In some embodiments, the base plate further comprises a wood fiber plate and surface paper attached to the upper surface and the lower surface of the wood fiber plate, an adhesive layer is arranged between the wood fiber plate and the surface paper, the adhesive layer is an adhesive layer formed after the adhesive is cured, and the adhesive comprises, by weight, 80-100 parts of urea-formaldehyde resin, 10-40 parts of polyethylene oxide, 80-120 parts of polyethylene glycol and 1-6 parts of an acidic substance.
In some embodiments, there is also provided a method for preparing a pad for PCB drilling, as shown in fig. 2, comprising the steps of:
s10, dissolving the polyethylene oxide in the urea-formaldehyde resin, and stirring until the polyethylene oxide is completely dissolved;
s20, continuously adding polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
s30, adding an acidic substance under a stirring condition, and standing for a preset time to prepare the adhesive;
s40, coating the adhesive on the upper surface of the wood fiber board, and attaching a piece of surface paper to the upper surface of the wood fiber board for rolling treatment for later use;
s50, coating the adhesive on the lower surface of the wood fiber plate, attaching another piece of face paper to the lower surface of the wood fiber plate, performing rolling treatment, and drying at room temperature to obtain the PCB drilling base plate.
In the embodiment, no water is added in the adhesive preparation process, so that the flowable adhesive with the solid content higher than 70% can be prepared; and coating the adhesive on the upper surface and the lower surface of the wood fiber board, adhering surface paper, rolling, and naturally drying to obtain the PCB drilling base plate. Because the adhesive adopted by the implementation has higher solid content and higher viscosity, the adhesive liquid can not be extruded out when the adhesive is rolled after being pasted with paper, and the requirement that the coating adhesive amount is more than 30g/m can be met 2 The requirement of (2) to achieve better heat dissipation effect. In the process of preparing the base plate in this embodiment, the wood fiber plate and the surface paper both absorb moisture, so that the solid content of the adhesive is gradually increased, and the molecular chain of the urea-formaldehyde resin is further promotedThe mutual cross-linking between the wood fiber board and the surface paper can form better bonding force.
Before the invention, in the prior art, when the backing plate is prepared, the surface paper is coated with the adhesive resin by adopting a gluing device, and a prepreg is formed by high-temperature baking; then, after the fiber boards are superposed, the fiber boards are pressed and formed. The process is complex, has VOC emission, needs pressing by a press and has higher processing cost. The cost of the cushion plate prepared by the process is about 25 yuan per sheet, and the efficiency is about 2min per sheet.
The invention is based on the improvement of the adhesive formula, the processing technology of the base plate is also improved, the wood fiber plate is directly coated with the adhesive resin, then the surface paper is automatically pasted, and the base plate is formed in a natural drying mode after rolling forming. The preparation method of the backing plate for PCB drilling provided by the invention does not need to prepare a prepreg, does not have VOC emission, and does not need pressing by a press. The method is quick and convenient, the production efficiency is greatly improved, the processing cost is greatly reduced, and the problems of facial tissue wrinkling and low facial tissue binding force can not occur in the process. The production cost is about 8 yuan per sheet, and the production efficiency is about 1min per sheet.
The adhesive can be cured at normal temperature, does not need high-temperature curing, and can avoid the problem of warping of the urea-formaldehyde resin.
The preparation method of the PCB drilling base plate is suitable for continuous production, the binding force of the adhesive is higher along with the longer placing time, and the requirements of quick production, low cost and high heat dissipation of the lubricating base plate are met.
The invention is further illustrated by the following specific examples:
example 1
1. Preparing an adhesive:
dissolving 20g of polyethylene oxide in 100g of urea-formaldehyde resin with the solid content of 50%, and stirring until the polyethylene oxide is completely dissolved;
continuously adding 100g of polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
adding 1g of formic acid under the stirring condition, and standing for 1h to obtain the adhesive with the viscosity of 60000-70000mPa & s and the solid content of 77%.
2. Preparing a base plate:
coating the adhesive on the upper surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 ；
Attaching a piece of face paper on the upper surface of the wood fiber board, and rolling for later use;
coating adhesive on the lower surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 And attaching another piece of face paper to the lower surface of the wood fiber board, performing rolling treatment, and airing for 2 hours under natural conditions to obtain the PCB drilling base plate.
The backing plate prepared in this example was subjected to a peel resistance test to measure a peel strength of 3.2N/cm. And the caul sheet was observed to be apparently wrinkle-free.
Example 2
1. Preparing an adhesive:
dissolving 10g of polyethylene oxide in 80g of urea-formaldehyde resin with the solid content of 50%, and stirring until the polyethylene oxide is completely dissolved;
continuously adding 120g of polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
adding 1g of formic acid under the stirring condition, and standing for 2 hours to obtain the adhesive with the viscosity of 70000-75000mPa & s and the solid content of 81%.
2. Preparing a base plate:
coating the adhesive on the upper surface of the wood fiber board, wherein the coating amount is 40g/m 2 ；
Attaching a piece of face paper on the upper surface of the wood fiber board, and rolling for later use;
coating adhesive on the lower surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 And attaching another piece of face paper to the lower surface of the wood fiber board, performing rolling treatment, and airing for 2 hours under natural conditions to obtain the PCB drilling base plate.
The backing plate prepared in this example was subjected to a peel resistance test to measure a peel resistance strength of 2.1N/cm. And the caul sheet was observed to be apparently wrinkle-free.
Example 3
1. Preparing an adhesive:
dissolving 40g of polyethylene oxide in 100g of urea-formaldehyde resin with the solid content of 50%, and stirring until the polyethylene oxide is completely dissolved;
continuously adding 80g of polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
after 1g of formic acid is added under the stirring condition, the mixture is kept stand for 2 hours to prepare the adhesive with the viscosity of 85000 to 90000mPa & s and the solid content of 77 percent.
2. Preparing a base plate:
coating the adhesive on the upper surface of the wood fiber board, wherein the coating amount is 40g/m 2 ；
Attaching a piece of face paper on the upper surface of the wood fiber board, and rolling for later use;
coating adhesive on the lower surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 And attaching another piece of face paper to the lower surface of the wood fiber board, performing rolling treatment, and airing for 2 hours under natural conditions to obtain the PCB drilling base plate.
The backing plate prepared in this example was subjected to a peel resistance test to measure a peel resistance of 8.1N/cm. And the mat was observed to be apparently wrinkle-free.
Example 4
1. Preparing an adhesive:
dissolving 40g of polyethylene oxide in 80g of urea-formaldehyde resin with the solid content of 50%, and stirring until the polyethylene oxide is completely dissolved;
continuously adding 120g of polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
adding 1g of formic acid under the stirring condition, and standing for 2 hours to obtain the adhesive with the viscosity of 100000-110000mPa & s and the solid content of 83%.
2. Preparing a base plate:
coating the adhesive on the upper surface of the wood fiber board, wherein the coating amount is 40g/m 2 ；
Attaching a piece of face paper on the upper surface of the wood fiber board, and rolling for later use;
coating adhesive on the lower surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 And attaching another piece of face paper to the lower surface of the wood fiber boardAnd carrying out rolling treatment, and airing for 2 hours under natural conditions to obtain the PCB drilling base plate.
The backing plate prepared in this example was subjected to a peel resistance test to measure a peel resistance strength of 8.5N/cm. And the caul sheet was observed to be apparently wrinkle-free.
Example 5
1. Preparing an adhesive:
dissolving 10g of polyethylene oxide in 80g of urea-formaldehyde resin with the solid content of 50%, and stirring until the polyethylene oxide is completely dissolved;
continuously adding 120g of polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
adding 3g of formic acid under the stirring condition, and standing for 2 hours to obtain the adhesive with the viscosity of 70000-75000mPa & s and the solid content of 81%.
2. Preparing a base plate:
coating the adhesive on the upper surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 ；
Attaching a piece of face paper on the upper surface of the wood fiber board, and rolling for later use;
coating adhesive on the lower surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 And attaching another piece of face paper to the lower surface of the wood fiber board, performing rolling treatment, and airing for 2 hours under natural conditions to obtain the PCB drilling base plate.
The backing plate prepared in this example was subjected to a peel resistance test to measure a peel resistance strength of 3.8N/cm. And the caul sheet was observed to be apparently wrinkle-free.
Example 6
1. Preparing an adhesive:
dissolving 20g of polyethylene oxide in 100g of urea-formaldehyde resin with the solid content of 50%, and stirring until the polyethylene oxide is completely dissolved;
continuously adding 100g of polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
5g of formic acid is added under the stirring condition, and then the mixture is kept stand for 2 hours to prepare the adhesive with the viscosity of 60000-70000mPa & s and the solid content of 77%.
2. Preparing a base plate:
in wood fiberThe upper surface of the board is coated with the adhesive, and the coating amount is 40g/m 2 ；
Attaching a piece of face paper on the upper surface of the wood fiber board, and rolling for later use;
coating adhesive on the lower surface of the wood fiber board, wherein the adhesive coating amount is 40g/m 2 And attaching another piece of face paper to the lower surface of the wood fiber board, performing rolling treatment, and airing for 2 hours under natural conditions to obtain the PCB drilling base plate.
The backing plate prepared in this example was subjected to a peel resistance test to measure a peel strength of 4.2N/cm. And the caul sheet was observed to be apparently wrinkle-free.
The backing plates prepared in examples 1 to 6 were used in combination with a common aluminum sheet, the drilling temperature was tested according to the following drilling scheme, and the drilled PCB was subjected to electroplating treatment to test the hole wall quality, compare the hole thickness and wick, wherein the drilling equipment and material and parameter settings are shown in table 1:
TABLE 1
Figure BDA0003421304020000121
The drilling protocol and the drilling test results are shown in table 2:
TABLE 2
Kind of cover plate Kind of base plate Drill temperature Roughness of hole wall Lampwick with hole wall
Common aluminum foil Phenolic aldehyde backing plate 171℃ 27μm 153um
Common aluminum sheet EXAMPLE 1 backing plate 103℃ 14um 89um
Common aluminum sheet EXAMPLE 2 backing plate 105℃ 16μm 105um
Common aluminum sheet EXAMPLE 3 backing plate 105℃ 17μm 98um
Common aluminum sheet EXAMPLE 4 backing plate 85℃ 11μm 86um
Common aluminum sheet EXAMPLE 5 backing plate 112℃ 18um 105um
As can be seen from the test results in Table 2, the hole wall quality (hole thickness, wick) has a strong correlation with the drilling temperature, and the lower the drilling temperature, the larger the hole wall thickness and the smaller the wick. The cover backing plate manufactured by the adhesive in the embodiment of the invention has better heat dissipation characteristic, and can better play a role in reducing the temperature of the drill point in the drilling process, thereby reducing the abrasion of the drill point, reducing drill cuttings adhered to the drill point, and being more beneficial to chip removal, thereby improving the quality of the hole wall of the PCB (reducing the hole thickness and the wick) and improving the reliability of the circuit board.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a PCB is backing plate for drilling which characterized in that, is in including wood fiber board and laminating the facial tissue of two sides about the wood fiber board, wood fiber board with be provided with gluing agent layer between the facial tissue, gluing agent layer is the glue film that forms after the gluing agent solidification, the gluing agent includes urea-formaldehyde resin, polyoxyethylene, polyethylene glycol and acidic substance.
2. The pad plate for PCB drilling according to claim 1, wherein the adhesive comprises 80-100 parts by weight of urea-formaldehyde resin, 10-40 parts by weight of polyethylene oxide, 80-120 parts by weight of polyethylene glycol and 1-6 parts by weight of acidic substances.
3. The pad for PCB drilling according to any one of claims 1 to 2, wherein the acidic substance is one or more of formic acid, boric acid and phosphoric acid.
4. The pad for PCB drilling as recited in any one of claims 1-2, wherein the polyethylene oxide has a molecular weight of 1-10 ten thousand; and/or the molecular weight of the polyethylene glycol is 2000-50000.
5. A PCB drilling pad according to any of claims 1-2, wherein the adhesive has a solids content of more than 70%.
6. A method for preparing a PCB drilling pad as claimed in any one of claims 1 to 5, comprising the steps of:
providing an adhesive, wherein the adhesive comprises urea-formaldehyde resin, polyethylene oxide, polyethylene glycol and an acidic substance;
coating the adhesive on the upper surface of the wood fiber board, and attaching a piece of surface paper to the upper surface of the wood fiber board for rolling treatment for later use;
coating the adhesive on the lower surface of the wood fiber plate, attaching another piece of face paper to the lower surface of the wood fiber plate, performing rolling treatment, and airing at room temperature to obtain the PCB drilling base plate.
7. The method for preparing a pad plate for drilling a PCB according to claim 6, wherein the preparation of the adhesive comprises the following steps:
dissolving polyethylene oxide in urea-formaldehyde resin, and stirring until the polyethylene oxide is completely dissolved;
continuously adding polyethylene glycol, and stirring until the polyethylene glycol is completely dissolved;
and (3) after adding the acidic substance under the stirring condition, standing for a preset time to prepare the adhesive.
8. The method for preparing a pad plate for PCB drilling according to claim 7, wherein the urea resin has a solid content of 50%.
9. The adhesive is characterized by comprising urea-formaldehyde resin, polyethylene oxide, polyethylene glycol and an acidic substance.
10. The adhesive according to claim 9, characterized by comprising 80-100 parts by weight of urea-formaldehyde resin, 10-40 parts by weight of polyethylene oxide, 80-120 parts by weight of polyethylene glycol and 1-6 parts by weight of acidic substances.
CN202111563679.1A 2021-12-20 2021-12-20 Backing plate for PCB drilling, preparation method thereof and adhesive Pending CN115339178A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1086224A (en) * 1993-08-20 1994-05-04 山东省鱼台县合成胶厂 A kind of modified urea-formaldehyde resin and production technique thereof
CN104175658A (en) * 2014-08-22 2014-12-03 烟台柳鑫新材料科技有限公司 Base plate for printed circuit board drilling and preparation method for base plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1086224A (en) * 1993-08-20 1994-05-04 山东省鱼台县合成胶厂 A kind of modified urea-formaldehyde resin and production technique thereof
CN104175658A (en) * 2014-08-22 2014-12-03 烟台柳鑫新材料科技有限公司 Base plate for printed circuit board drilling and preparation method for base plate

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