CN115260987A - Adhesive, preparation method of adhesive, composite flour and plywood - Google Patents

Adhesive, preparation method of adhesive, composite flour and plywood Download PDF

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Publication number
CN115260987A
CN115260987A CN202210991434.7A CN202210991434A CN115260987A CN 115260987 A CN115260987 A CN 115260987A CN 202210991434 A CN202210991434 A CN 202210991434A CN 115260987 A CN115260987 A CN 115260987A
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China
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adhesive
powder
glue
flour
parts
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Chinese (zh)
Inventor
谭志刚
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Qinhuangdao Coastal Wood Industry Co ltd
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Individual
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Priority to CN202210991434.7A priority Critical patent/CN115260987A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J199/00—Adhesives based on natural macromolecular compounds or on derivatives thereof, not provided for in groups C09J101/00 -C09J107/00 or C09J189/00 - C09J197/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/13—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board all layers being exclusively wood
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/14—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09J161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C09J161/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The embodiment of the invention provides an adhesive, a preparation method of the adhesive, composite flour and a plywood, wherein the adhesive comprises the following components: the flour comprises three-aldehyde glue and composite flour in a preset proportion, the preset proportion range of the mass of the three-aldehyde glue and the mass of the composite flour is 25% -50%, wherein the three-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine-formaldehyde glue, and the composite flour at least comprises the following raw materials in parts by weight: 20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier. The embodiment of the invention can reduce the production cost of the adhesive or the plywood and improve the adhesive strength.

Description

Adhesive, preparation method of adhesive, composite flour and plywood
Technical Field
The embodiment of the invention relates to the field of plywood preparation, and particularly relates to an adhesive, an adhesive preparation method, composite flour and plywood.
Background
In 2019, the consumption of formaldehyde adhesives for the national plywood industry is 1518 ten thousand tons (the solid content is 100%), the equivalent ratio is reduced by 7.5%, the consumption of adhesives for the wood industry is about 85.6%, the consumption of formaldehyde adhesives is increased by 12% every year, the speed is increased, the output value is about 778 million yuan, the equivalent ratio is reduced by 5.2%, and the output value is increased by 13% in the past time. With the advancement of technology, the glue application amount of plywood unit products is continuously reduced. In order to reduce the production cost and achieve good cementing effect, 30-40% of wheat flour is usually added into the adhesive used by the plywood in the production process for mixing.
However, the filler used in the production process of the adhesive is common wheat flour, and the price of the wheat flour is higher due to the influence of the international market price and the factors of contradiction between supply and demand, so that the cost of the common wheat flour used in the existing adhesive is higher, and when only the wheat flour is used as the flour filler in the adhesive at present, the adhesive strength of the adhesive is lower, so that the condition of plywood fracture occurs sometimes, the adhesive effect is not ideal, and therefore, the adhesive is urgently needed to reduce the production cost and improve the adhesive strength.
Disclosure of Invention
In order to solve the problems, the embodiment of the invention provides an adhesive, a preparation method of the adhesive, composite flour and a plywood, which can reduce production cost and improve bonding strength.
In a first aspect, an embodiment of the present invention provides an adhesive, including: the flour comprises a preset proportion of a tri-aldehyde glue and composite flour, wherein the preset proportion range of the mass of the tri-aldehyde glue and the mass of the composite flour is 25% -50%, the tri-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine-formaldehyde glue, and the composite flour at least comprises the following raw materials in percentage by weight:
20-50 parts of base stock, 30-65 parts of reinforcing thickener, 2-10 parts of active filler and 2-10 parts of tackifier, wherein the base stock is wheat flour.
Optionally, the reinforcing thickener comprises one or more of gypsum powder, kaolin powder, bentonite powder, sepiolite powder, zeolite powder and attapulgite powder.
Optionally, the active filler includes one or more of plant protein powder, bark powder and peanut shell powder, wherein the plant protein powder includes one or more of corn steep liquor dry powder, defatted soybean powder, seaweed powder and defatted cotton seed powder.
Optionally, the viscosifier comprises one or more of pregelatinized corn starch, pregelatinized tapioca starch.
In a second aspect, embodiments of the present invention provide an adhesive preparation method for preparing the adhesive described above, including:
1) Mixing the base material with the enhanced thickening agent to obtain base material mixed powder;
2) Adding an active filler into the base material mixed powder obtained in the step 1), and stirring for 10-30min to obtain active mixed powder containing active substances;
3) Adding a tackifier into the active mixed powder containing the active substances obtained in the step 2), and continuously stirring for 10-30min to obtain composite flour;
4) Mixing the dialdehyde glue and the composite flour according to a preset proportion to obtain the adhesive, wherein the preset proportion range of the quality of the dialdehyde glue and the quality of the composite flour is 25-50%.
Optionally, the reinforcing thickener is bentonite, the tackifier is pregelatinized corn starch, and the active filler is corn steep liquor dry powder.
In a third aspect, the embodiment of the invention provides a compound flour, which is applied to the adhesive as described in any one of claims 1 to 4, wherein the compound flour in the adhesive at least comprises the following raw materials in content:
20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier.
In a fourth aspect, an embodiment of the present invention provides a plywood, including the adhesive and multiple single boards glued to each other as described above, where the adhesive is located on one side of the multiple single boards, and the multiple single boards are glued to each other by the adhesive.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following advantages:
the disclosed adhesive of the embodiment of the invention comprises: the flour comprises a preset proportion of a tri-aldehyde glue and composite flour, wherein the preset proportion range of the mass of the tri-aldehyde glue and the mass of the composite flour is 25% -50%, the tri-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine-formaldehyde glue, and the composite flour at least comprises the following raw materials in percentage by weight: 20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier. The adhesive at least comprises composite flour and a formaldehyde-formaldehyde adhesive, wherein the composite flour takes wheat flour as a base material and comprises 30-65 parts of a reinforcing thickener and 2-10 parts of a tackifier, and 2-10 parts of an active filler.
Furthermore, the active filler in the application is 2-10 parts, and the active filler in the embodiment of the application can improve the water resistance and reduce the release amount of free formaldehyde in the process of combining with the trialdehyde glue.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is an alternative flow diagram of a method of preparing a glue provided in accordance with an embodiment of the present invention.
Detailed Description
As described in the background art, when only wheat flour is used as flour filler in the existing adhesive, the adhesive strength of the adhesive is not high, so that the condition that the plywood is broken occurs sometimes, and the adhesive effect is not ideal.
Specifically, an embodiment of the present invention provides an adhesive, including: the flour comprises a preset proportion of a tri-aldehyde glue and composite flour, wherein the preset proportion range of the mass of the tri-aldehyde glue and the mass of the composite flour is 25% -50%, the tri-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine-formaldehyde glue, and the composite flour at least comprises the following raw materials in percentage by weight: 20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example 1
Provided herein is an adhesive comprising: the flour comprises three-aldehyde glue and composite flour in a preset proportion, the preset proportion range of the mass of the three-aldehyde glue and the mass of the composite flour is 25% -50%, wherein the three-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine-formaldehyde glue, and the composite flour at least comprises the following raw materials in parts by weight:
20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier.
The urea-formaldehyde glue in the three-aldehyde glue is prepared by polycondensing urea and formaldehyde into urea-formaldehyde resin in the initial stage under the action of a catalyst (an alkaline catalyst or an acidic catalyst), and then forming an infusible and insoluble adhesive in the final stage under the action of a curing agent or an auxiliary agent. The adhesive is often applied to adhesive enterprises such as building templates, packaging plates, veneers, multi-layer plates and the like.
The phenol-formaldehyde glue in the three-aldehyde glue is prepared by performing polycondensation reaction on benzene and aldehydes in the presence of a catalyst, and is used as an adhesive and is an oligomer with the relative molecular mass of 500-1000. Has good adhesion to metal and most non-metals and has high adhesion strength. Because a large number of benzene rings exist in the phenolic glue, the phenolic glue can be crosslinked into a body structure, and the rigidity is higher, so that the phenolic glue has high heat resistance, creep resistance, ablation resistance and good dimensional stability. Water resistance, oil resistance, wear resistance, chemical medium resistance, mildew resistance, aging resistance and the like, and has excellent electrical insulation performance. The modified epoxy resin is easy to modify and can also modify other adhesives. The method is suitable for the fields of aviation, aerospace, machinery, war industry, automobiles, ships, electricity and the like.
The melamine acetal glue in the three-aldehyde glue is formed by condensation polymerization of melamine and formaldehyde and is characterized by high chemical activity, good thermal stability, boiling water resistance, good chemical resistance and good electrical insulation; the heat resistance and water resistance are superior to phenolic glue and urea-formaldehyde glue, but the melamine glue layer after curing is brittle, and the uncured glue has short storage period. The liquid melamine glue is a milky white uniform sticky matter, and the cured melamine glue is colorless and transparent and rich in light color. The melamine formaldehyde glue comprises melamine formaldehyde resin gluing melamine urea formaldehyde resin glue, and the melamine formaldehyde resin glue is mostly used and can be called as melamine resin glue.
Further, in the embodiment of the invention, the reinforcing thickener comprises one or more of gypsum powder, kaolin powder, bentonite powder, sepiolite powder, zeolite powder and attapulgite powder.
Optionally, the active filler comprises one or more of vegetable protein powder, bark powder and peanut shell powder, wherein the vegetable protein powder comprises one or more of corn steep liquor dry powder, defatted soybean powder, seaweed powder and defatted cotton seed powder.
Optionally, the viscosifier comprises one or more of pregelatinized corn starch, pregelatinized tapioca starch.
The composite flour contains protein and starch, the starch in the flour can absorb moisture, when the flour is used as a filler of an adhesive, a certain amount of moisture can be kept in a glue layer after glue is applied, the fluidity of the glue is increased, the surface of wood is wetted, a small amount of glue is infiltrated into the wood, and the gluing is firmer. The flour increases the solid content and viscosity of the adhesive, provides certain initial viscosity, improves the joint filling capacity of the adhesive, and enables the veneer to have good prepressing performance under the conditions of small pressure, uneven pressure or rough and uneven glued surfaces, thereby facilitating automatic plate installation of a hot press and reducing the reduction range of the gluing strength.
The adhesive in the embodiment of the invention takes wheat flour as a base material, and adopts inorganic filler (such as gypsum powder, kaolin powder and the like) as a reinforcing thickener; the reaction characteristics of the plant protein, the plant tannin and the formaldehyde in the active filler are used as the active filler to participate in the crosslinking and curing of the trialdehyde glue, so that the water resistance is improved, the free formaldehyde release amount is reduced, and the viscosity is improved by using the tackifier.
Example 2
A method for preparing an adhesive is provided herein, and fig. 1 is an alternative schematic diagram of an adhesive prepared in an embodiment of the present invention. Referring specifically to fig. 1, the step of preparing the adhesive comprises:
step S11, mixing the base material with a reinforcing thickener to obtain base material mixed powder;
step S12, adding an active filler into the obtained base material mixed powder, and stirring for 10-30min to obtain active mixed powder containing active ingredients;
s13, adding a tackifier into the active mixed powder containing the active filler, and continuously stirring for 10-30min to obtain composite flour, wherein the composite flour comprises 20-50 parts of base material, the base material is wheat flour, and 30-65 parts of reinforcing thickener; 2-10 parts of active filler; 2-10 parts of a tackifier;
and S14, mixing a three-aldehyde glue and the composite flour according to a preset proportion to obtain an adhesive, wherein the preset proportion range of the mass of the three-aldehyde glue and the mass of the composite flour is 25% -50%, and the three-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine acetal glue.
Optionally, the process of mixing the base material and the reinforcing thickener can be completed in a mixer, specifically, the base material is added into the mixer, the mixer is started, then a certain amount of the reinforcing thickener is added, and the base material and the reinforcing thickener are stirred to be uniformly mixed.
In an alternative example, the reinforcing thickener may be bentonite, the viscosifier may be pregelatinized corn starch, and the active filler may be corn steep liquor dry powder.
In this embodiment, the compound flour may be prepared first, and then the adhesive may be prepared.
For example, the composite flour may be prepared by adding 400 kg of wheat flour as a base material into a mixer, starting the mixer to stir, adding 500 kg of bentonite as a reinforcing thickener to continue stirring, adding 50 kg of pregelatinized corn starch as a thickener to continue stirring, adding 20 kg of corn steep liquor dry powder and 30 kg of defatted soybean powder as active fillers to continue stirring and mixing for 30 minutes to obtain the composite flour.
It should be noted that the composite flour prepared by the method in the embodiment of the present application at least comprises the following raw materials: 20-50 parts of base stock, 30-65 parts of reinforcing thickener, 2-10 parts of active filler and 2-10 parts of tackifier, wherein the base stock is wheat flour.
When the adhesive is prepared, the composite flour prepared by the method can be mixed with the trioxymethylene adhesive according to a preset proportion to obtain the adhesive. The preset proportion range of the mass of the dialdehyde glue and the mass of the composite flour is 25-50%.
In an alternative embodiment, to obtain an adhesive as described herein, urea-formaldehyde glue may be added in an amount of 10% by mass of the flour composition, slowly stirred until no fly ash is present, and then added in an amount of 15% until the urea-formaldehyde glue is completely mixed with the flour composition to form an adhesive having a predetermined ratio of 25% urea-formaldehyde glue to flour composition.
In the preferred embodiment of the invention, the adhesive takes wheat flour as a base material and bentonite as a reinforcing thickener; the adhesive strength of the adhesive is improved by solidifying the vegetable protein and formaldehyde of the corn steep liquor dry powder and the defatted soybean powder, and the viscosity of the adhesive system is improved by utilizing the pregelatinized corn starch under the adhesion promoting effect of the vegetable polysaccharide, so that the defect that the viscosity of the adhesive system is reduced possibly due to the addition of the inorganic filler is effectively overcome.
In addition, when the bonding strength of the adhesive is improved by adopting the solidification of the vegetable protein of the corn steep liquor dry powder and the defatted soybean powder and formaldehyde, the water resistance can be improved.
Example 3
The embodiment of the application provides composite flour which is applied to the adhesive, wherein the composite flour in the adhesive at least comprises the following raw materials in percentage by weight: 20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier.
Optionally, the reinforcing thickener comprises one or more of gypsum powder, kaolin powder, bentonite powder, sepiolite powder, zeolite powder and attapulgite powder.
Optionally, the active filler comprises one or more of vegetable protein powder, bark powder and peanut shell powder, wherein the vegetable protein powder comprises one or more of corn steep liquor dry powder, defatted soybean powder, seaweed powder and defatted cotton seed powder.
Optionally, the viscosifier comprises one or more of pregelatinized corn starch, pregelatinized tapioca starch.
In one embodiment, the compound flour can be packaged in a emptying way, but a packaging bag for storing the compound flour is required to be provided with an inner film to prevent moisture absorption and agglomeration, so that the compound flour can be stored in a dry way,
the composite flour in the embodiment of the application takes wheat flour as a base material, and comprises 30-65 parts of reinforcing thickening agent and 2-10 parts of tackifier, 2-10 parts of active filler, and the viscosity of the composite flour obtained based on the proportion is higher.
Example 4
The embodiment of the invention provides a method for manufacturing a plywood, which comprises the following steps:
gluing the single plates by using the adhesive so as to enable the gluing amount of each single plate to reach the preset gluing amount;
and aging the veneers, cold pressing, hot pressing and cooling to obtain the plywood.
The adhesive is prepared by mixing a three-aldehyde glue and composite flour according to a preset proportion, wherein the preset proportion range of the mass of the three-aldehyde glue and the mass of the composite flour is 25% -50%, the three-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine acetal glue, and the composite flour at least comprises the following raw materials in parts by weight:
20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier.
Optionally, the reinforcing thickener comprises one or more of gypsum powder, kaolin powder, bentonite powder, sepiolite powder, zeolite powder and attapulgite powder.
Optionally, the active filler includes one or more of plant protein powder, bark powder and peanut shell powder, wherein the plant protein powder includes one or more of corn steep liquor dry powder, defatted soybean powder, seaweed powder and defatted cotton seed powder.
Optionally, the viscosifier comprises one or more of pregelatinized corn starch, pregelatinized tapioca starch.
The adhesive has good bonding strength and can be applied to the preparation process of eucalyptus multilayer boards.
The process of gluing a plurality of eucalyptus boards to form a eucalyptus multilayer board by taking the single board as the eucalyptus is explained. Optionally, 100 kg of urea-formaldehyde glue and 50 kg of composite flour are added into the glue mixing barrel, the stirrer is started, the mixture is slowly stirred until no flying dust exists, the stirring speed is increased, after the mixture is uniformly stirred, about 43 kg of urea-formaldehyde glue is continuously added, the stirring is continuously carried out until the mixture is uniformly mixed, and the fluidity of the glue is good and basically consistent with the amount of the normal wheat flour. And then entering a plywood arranging procedure, observing the two surfaces of each eucalyptus board, coating adhesive uniformly, and standing for 30 minutes after the adhesive amount is 185 grams per square meter (single surface). Putting a plurality of eucalyptus plates into a cold press for prepressing for 120 minutes, wherein the prepressing unit pressure is 7-10 kg.f/cm 2 And after cold pressing is removed, if the cold pressing molding effect is good, entering a next repairing procedure, after the repairing is finished, placing for 12 hours, carrying out hot pressing according to the process requirements, inspecting that the hot pressing effect is normal (namely, no phenomena of bubbling, layering, glue opening and the like), and cooling for 24 hours to obtain the eucalyptus multilayer board. The sample detection of the eucalyptus multilayer board has the advantages that the bonding strength and the dipping stripping performance are superior to the performance index requirements of common plywood.
Wherein the veneer is made of one of poplar, eucalyptus, pine, birch, basswood, crabapple wood, lotus, maple, elm, oak or rubber wood.
Referring to table 1, table 1 is a table of results of testing formaldehyde emission of the adhesive in the examples of the present invention. The formaldehyde release test result of the adhesive in the embodiment of the invention shows that the formaldehyde release of the plywood obtained by using the adhesive provided by the invention is equivalent to that of a raw veneer, wherein the sample 1, the sample 2 and the sample 3 are veneers prepared by using the adhesive in the application; the comparative examples 1, 2 and 3 are veneers corresponding to the veneers prepared by the plywood in the application, and the adhesive in the embodiment of the invention can effectively reduce the release amount of free formaldehyde.
Figure BDA0003804107540000091
TABLE 1
Example 5
The embodiment of the invention provides a plywood, which comprises the adhesive and a plurality of veneers glued with each other, wherein the adhesive is positioned on one side of the veneers, and the veneers are glued with each other through the adhesive.
Optionally, the adhesive in the embodiment of the present invention includes: the flour comprises a preset proportion of a tri-aldehyde glue and composite flour, wherein the preset proportion range of the mass of the tri-aldehyde glue and the mass of the composite flour is 25% -50%, the tri-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine-formaldehyde glue, and the composite flour at least comprises the following raw materials in percentage by weight:
20-50 parts of base stock, wherein the base stock is wheat flour, 30-65 parts of enhanced thickening agent, 2-10 parts of active filler and 2-10 parts of tackifier.
Optionally, the reinforcing thickener comprises one or more of gypsum powder, kaolin powder, bentonite powder, sepiolite powder, zeolite powder and attapulgite powder.
Optionally, the active filler comprises one or more of vegetable protein powder, bark powder and peanut shell powder, wherein the vegetable protein powder comprises one or more of corn steep liquor dry powder, defatted soybean powder, seaweed powder and defatted cotton seed powder.
Optionally, the viscosifier comprises one or more of pregelatinized corn starch, pregelatinized tapioca starch.
Optionally, the veneer is made of one of poplar, eucalyptus, pine, birch, basswood, crabapple, lotus, maple, elm, oak or rubber.
The manufacturing method for preparing the plywood can be specifically referred to as shown in example 4, and is not described herein again.
While various embodiments of the present invention have been described above, various alternatives described in the various embodiments can be combined and cross-referenced without conflict to extend the variety of possible embodiments that can be considered disclosed and disclosed in connection with the embodiments of the present invention.
Although the embodiments of the present invention have been disclosed above, the present application is not limited thereto. Various changes and modifications may be effected by one skilled in the art without departing from the spirit and scope of the application, and the scope of protection is defined by the claims.

Claims (8)

1. An adhesive, comprising: the flour comprises a preset proportion of a tri-aldehyde glue and composite flour, wherein the preset proportion range of the mass of the tri-aldehyde glue and the mass of the composite flour is 25% -50%, the tri-aldehyde glue comprises at least one of urea-formaldehyde glue, phenol-formaldehyde glue and melamine-formaldehyde glue, and the composite flour at least comprises the following raw materials in percentage by weight:
20-50 parts of base stock, 30-65 parts of reinforcing thickener, 2-10 parts of active filler and 2-10 parts of tackifier, wherein the base stock is wheat flour.
2. The adhesive of claim 1 wherein said reinforcing thickener comprises one or more of gypsum powder, kaolin powder, bentonite powder, sepiolite powder, zeolite powder, attapulgite powder.
3. The adhesive of claim 1 wherein the active filler comprises one or more of a vegetable protein powder, a bark powder, a peanut shell powder, wherein the vegetable protein powder comprises one or more of a corn steep liquor dry powder, a defatted soybean powder, a seaweed powder, and a defatted cotton seed powder.
4. The adhesive of claim 1, wherein the tackifier comprises one or more of pregelatinized corn starch, pregelatinized tapioca starch.
5. A method for preparing an adhesive, characterized in that the preparation of the adhesive according to any one of claims 1 to 4 comprises:
1) Mixing the base material with the enhanced thickening agent to obtain base material mixed powder;
2) Adding an active filler into the base material mixed powder obtained in the step 1), and stirring for 10-30min to obtain active mixed powder containing the active filler;
3) Adding a tackifier into the active mixed powder containing the active filler obtained in the step 2), and continuously stirring for 10-30min to obtain composite flour;
4) Mixing the three-aldehyde glue and the composite flour according to a preset proportion to obtain the adhesive, wherein the preset proportion range of the mass of the three-aldehyde glue and the mass of the composite flour is 25% -50%, and the three-aldehyde glue comprises at least one of urea-formaldehyde glue, phenolic glue and melamine acetal glue.
6. The method of claim 5 wherein the reinforcing thickener is bentonite, the tackifier is pregelatinized corn starch, and the active filler is corn steep liquor dry powder.
7. A compound flour applied to the adhesive as claimed in any one of claims 1 to 4, wherein the compound flour in the adhesive at least comprises the following raw materials in percentage by weight:
20-50 parts of base stock, 30-65 parts of reinforcing thickener, 2-10 parts of active filler and 2-10 parts of tackifier, wherein the base stock is wheat flour.
8. A plywood comprising a plurality of single boards glued to each other with the adhesive according to any one of claims 1 to 4, wherein the adhesive is located on one side of the plurality of single boards, and the plurality of single boards are glued to each other by the adhesive.
CN202210991434.7A 2022-08-18 2022-08-18 Adhesive, preparation method of adhesive, composite flour and plywood Pending CN115260987A (en)

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