CN115338563A - Zero-halogen no-clean soldering flux - Google Patents
Zero-halogen no-clean soldering flux Download PDFInfo
- Publication number
- CN115338563A CN115338563A CN202110519637.1A CN202110519637A CN115338563A CN 115338563 A CN115338563 A CN 115338563A CN 202110519637 A CN202110519637 A CN 202110519637A CN 115338563 A CN115338563 A CN 115338563A
- Authority
- CN
- China
- Prior art keywords
- surfactant
- halogen
- soldering flux
- organic acid
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000004907 flux Effects 0.000 title claims abstract description 29
- 238000005476 soldering Methods 0.000 title claims abstract description 28
- 229910052736 halogen Inorganic materials 0.000 title claims abstract description 16
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000004094 surface-active agent Substances 0.000 claims abstract description 22
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 150000007524 organic acids Chemical class 0.000 claims abstract description 14
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003208 petroleum Substances 0.000 claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 239000001361 adipic acid Substances 0.000 claims abstract description 8
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 8
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 8
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 8
- 150000003333 secondary alcohols Chemical class 0.000 claims abstract description 8
- 239000000654 additive Substances 0.000 claims abstract description 7
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims abstract description 4
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 5
- 239000001384 succinic acid Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000013543 active substance Substances 0.000 abstract description 8
- 150000002367 halogens Chemical class 0.000 description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000012190 activator Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- -1 halogen ions Chemical class 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention provides a zero-halogen no-clean soldering flux, which comprises petroleum resin, a surfactant, an organic acid active agent and a solvent, wherein the solvent is isopropanol, the organic acid active agent comprises adipic acid and succinic acid, the surfactant comprises secondary alcohol polyoxyethylene ether, the soldering flux takes the isopropanol as the solvent, the petroleum resin, the organic acid active agent and the surfactant as additives, and halogen-free elements are not contained as environment-friendly active agents.
Description
Technical Field
The invention relates to the technical field of soldering flux, in particular to zero-halogen no-clean soldering flux.
Background
The halogen-containing surfactant has strong activity and high soldering assistant capability, but halogen ions are difficult to clean, the ion residue degree is high, and halogen elements (mainly chlorides) have strong corrosivity, so the halogen-containing surfactant is not suitable for being used as a no-clean soldering flux generally, and the service life and the stability of a soldered electronic circuit board are poor.
The halogen-free soldering flux is also called as environment-friendly halogen-free soldering flux, not only meets the common environment-friendly requirement, but also does not contain halogen, and can pass the halogen test.
The invention relates to the field of welding materials in the electronic industry and discloses halogen-free soldering flux. The halogen-free soldering flux comprises the following components in percentage by weight: 2.5-3% of organic acid activator, 3-5% of rosin film-forming agent, 0.1-0.3% of surfactant and 90-95% of alcohol solvent (isopropanol); the organic acid activator can be formed by mixing one or more of succinic acid and adipic acid; the rosin film-forming agent is petroleum resin; the surfactant is secondary alcohol polyoxyethylene ether. The solvent is one or both of ethanol and isopropanol. The halogen-free soldering flux disclosed by the invention is environment-friendly and does not need to be cleaned, and a colorless high-insulation resistance film is generated on the surface of the welded electronic circuit board, so that the quality and the performance of the electronic circuit board are correspondingly improved, and the production efficiency is also improved.
With the continuous development and growth of the electronic industry, the continuous update of electronic products and the continuous upgrade of environmental protection laws and regulations, the requirement of the market on the soldering flux is increasing day by day, and the development of the soldering flux is from the traditional rosin type soldering flux to the synthetic soldering flux, the no-clean soldering flux and the water-soluble soldering flux appearing in the 80 s, and then to the existing lead-free halogen-free soldering flux and the like.
Disclosure of Invention
The invention provides a halogen-free soldering flux, and provides a zero-halogen no-clean soldering flux aiming at the defects of the existing product, wherein the flux comprises petroleum resin, a surfactant, an organic acid active agent, a solvent and an additive, the solvent is isopropanol, the organic acid active agent comprises adipic acid and succinic acid, the surfactant comprises secondary alcohol polyoxyethylene ether, and the additive comprises petroleum resin, the organic acid active agent and the surfactant.
Preferably, the total amount of the raw materials is 100 parts by weight, and the raw materials and the parts by weight are as follows:
isopropyl alcohol: 90-95 percent of the total weight of the mixture,
petroleum resin: 3 to 5 percent of
Succinic acid: 1-2%, adipic acid: 2 to 3 percent of
Secondary alcohol polyoxyethylene ether: 0.1 to 0.3 percent.
The invention has the beneficial effects that:
1. no halogen and other harmful substances;
2. less residue on the welding surface, no viscosity of residues and dry surface after welding;
3. the surface ductility is good, and the cleaning is avoided;
4. the insulation impedance of the board surface still better accords with the IPC test specification under the condition of not cleaning, and the electrical reliability is high;
5. the adaptability is wide.
Detailed Description
The invention comprises the following steps: a zero-halogen no-clean soldering flux comprises petroleum resin, a surfactant, an organic acid surfactant, a solvent and an additive, wherein the solvent is isopropanol, the organic acid surfactant comprises adipic acid and succinic acid, the surfactant comprises secondary alcohol polyoxyethylene ether, and the additive comprises the petroleum resin, the organic acid surfactant and the surfactant.
The soldering flux does not contain halogen elements and is an environment-friendly active agent, the soldering flux can be widely applied to the assembly process of electronic products, the insulation resistance of a circuit board after being soldered is higher than that of other soldering fluxes, the soldering flux can be used for the production of products with higher performance requirements such as LEDs, instruments, automobile electronics, power supplies and the like, and the circuit board after being soldered does not need to be cleaned.
In this embodiment, the total amount of the raw materials is, based on 100 parts by weight, as follows:
isopropyl alcohol: 90-95 percent of the total weight of the mixture,
petroleum resin: 3 to 5 percent of
Succinic acid: 1-2%, adipic acid: 2 to 3 percent of
Secondary alcohol polyoxyethylene ether: 0.1 to 0.3 percent.
The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Those skilled in the art can modify and/or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims be embraced by the present application. The invention is described in detail below, and the description in this section is merely exemplary and explanatory and should not be construed as limiting the scope of the invention in any way.
Claims (2)
1. A zero-halogen no-clean soldering flux comprises petroleum resin, a surfactant, an organic acid surfactant, a solvent and an additive, wherein the solvent is isopropanol, the organic acid surfactant comprises adipic acid and succinic acid, the surfactant comprises secondary alcohol polyoxyethylene ether, and the additive comprises the petroleum resin, the organic acid surfactant and the surfactant.
2. The zero-halogen no-clean flux according to claim 1, wherein: the total amount of the raw materials is 100 parts by weight, and the raw materials comprise the following components in parts by weight:
isopropyl alcohol: 90-95 percent of the total weight of the mixture,
petroleum resin: 3 to 5 percent of
Succinic acid: 1-2%, adipic acid: 2 to 3 percent
Secondary alcohol polyoxyethylene ether: 0.1 to 0.3 percent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110519637.1A CN115338563A (en) | 2021-05-12 | 2021-05-12 | Zero-halogen no-clean soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110519637.1A CN115338563A (en) | 2021-05-12 | 2021-05-12 | Zero-halogen no-clean soldering flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115338563A true CN115338563A (en) | 2022-11-15 |
Family
ID=83946951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110519637.1A Withdrawn CN115338563A (en) | 2021-05-12 | 2021-05-12 | Zero-halogen no-clean soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115338563A (en) |
-
2021
- 2021-05-12 CN CN202110519637.1A patent/CN115338563A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20221115 |
|
| WW01 | Invention patent application withdrawn after publication |