CN115336015A - 显示基板以及显示装置 - Google Patents

显示基板以及显示装置 Download PDF

Info

Publication number
CN115336015A
CN115336015A CN202180000455.1A CN202180000455A CN115336015A CN 115336015 A CN115336015 A CN 115336015A CN 202180000455 A CN202180000455 A CN 202180000455A CN 115336015 A CN115336015 A CN 115336015A
Authority
CN
China
Prior art keywords
light emitting
color
light
layer
display substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180000455.1A
Other languages
English (en)
Inventor
王灿
李伟
袁丽君
张晶晶
张粲
牛晋飞
丛宁
玄明花
陈小川
董学
齐琪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN115336015A publication Critical patent/CN115336015A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)
  • Push-Button Switches (AREA)

Abstract

一种显示基板以及显示装置。该显示基板包括多个发光二极管芯片，各发光二极管芯片包括分别发不同颜色光的多个发光单元，各发光单元包括第一电极、发光层、衬底以及第二电极，衬底和第二电极分别位于发光层的两侧。各发光二极管芯片中，多个发光单元共用衬底和第一电极，多个发光单元的发光层发出相同颜色的光，且至少一个发光单元还包括位于衬底远离发光层一侧的第一色转换层，以将发光层发出的第一颜色光转换为第二颜色光。本公开的显示基板中，各发光二极管芯片包括至少两种不同颜色发光单元，可实现高像素密度需求，且多个发光单元共用一个第一电极，可提高发光单元的发光面积。

Description

PCT国内申请，说明书已公开。

Claims (23)

  1. PCT国内申请，权利要求书已公开。
CN202180000455.1A 2021-03-11 2021-03-11 显示基板以及显示装置 Pending CN115336015A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/080292 WO2022188107A1 (zh) 2021-03-11 2021-03-11 显示基板以及显示装置

Publications (1)

Publication Number Publication Date
CN115336015A true CN115336015A (zh) 2022-11-11

Family

ID=83226195

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180000455.1A Pending CN115336015A (zh) 2021-03-11 2021-03-11 显示基板以及显示装置

Country Status (5)

Country Link
US (1) US20230163157A1 (zh)
CN (1) CN115336015A (zh)
GB (1) GB2614126A (zh)
TW (1) TWI805028B (zh)
WO (1) WO2022188107A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115621385A (zh) * 2022-12-19 2023-01-17 季华实验室 发光二极管、显示面板、显示装置及制备方法
WO2024145751A1 (zh) * 2023-01-03 2024-07-11 京东方科技集团股份有限公司 芯片结构及其制备方法、显示基板及显示装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115236910B (zh) * 2022-09-23 2023-01-31 惠科股份有限公司 显示面板及显示装置
CN115621386B (zh) * 2022-12-19 2023-03-10 季华实验室 发光二极管、显示面板、显示装置及制备方法
WO2024192731A1 (zh) * 2023-03-22 2024-09-26 京东方科技集团股份有限公司 显示面板及其制作方法、显示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014049902A1 (ja) * 2012-09-25 2016-08-22 株式会社Ｊｏｌｅｄ Ｅｌ表示装置の製造方法、ｅｌ表示装置の製造に用いられる転写基板、ｅｌ表示装置の製造に用いられる転写基板の製造方法
CN112164737A (zh) * 2013-11-18 2021-01-01 晶元光电股份有限公司 发光装置及其制作方法
CN105096749B (zh) * 2015-08-04 2017-07-04 京东方科技集团股份有限公司 一种显示装置及其制备方法
CN107195653A (zh) * 2016-03-14 2017-09-22 群创光电股份有限公司 显示装置
WO2017217703A1 (en) * 2016-06-13 2017-12-21 Seoul Semiconductor Co., Ltd Display apparatus and manufacturing method thereof
TWI621277B (zh) * 2017-03-08 2018-04-11 錼創科技股份有限公司 顯示裝置與磊晶晶圓
KR101890582B1 (ko) * 2017-12-14 2018-08-22 엘지디스플레이 주식회사 발광 다이오드 칩, 마이크로 디스플레이 장치
CN110133886A (zh) * 2018-02-09 2019-08-16 京东方科技集团股份有限公司 像素排列结构、显示基板和显示装置
CN111261790A (zh) * 2018-12-03 2020-06-09 昆山工研院新型平板显示技术中心有限公司 显示面板和显示装置
US20210013367A1 (en) * 2019-04-04 2021-01-14 Bor-Jen Wu System and Method for Making Micro LED Display
KR20210047590A (ko) * 2019-10-22 2021-04-30 삼성전자주식회사 마이크로 led 소자 및 그 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115621385A (zh) * 2022-12-19 2023-01-17 季华实验室 发光二极管、显示面板、显示装置及制备方法
WO2024145751A1 (zh) * 2023-01-03 2024-07-11 京东方科技集团股份有限公司 芯片结构及其制备方法、显示基板及显示装置

Also Published As

Publication number Publication date
US20230163157A1 (en) 2023-05-25
GB202215951D0 (en) 2022-12-14
TWI805028B (zh) 2023-06-11
WO2022188107A1 (zh) 2022-09-15
GB2614126A (en) 2023-06-28
TW202236661A (zh) 2022-09-16

Similar Documents

Publication Publication Date Title
WO2022188107A1 (zh) 显示基板以及显示装置
US11264365B2 (en) Image display device and display
TWI588984B (zh) 顯示裝置
US11728370B2 (en) Image display device
US11075326B2 (en) Semiconductor light emitting device
CN112242468A (zh) 微型发光元件及图像显示元件
US20210183827A1 (en) Display device
KR20120038539A (ko) 픽셀화된 ｌｅｄ
TWI730951B (zh) 發光裝置
JP2017139464A (ja) 発光素子及びその製造方法
WO2020153191A1 (ja) 発光デバイスおよび画像表示装置
CN112930604B (zh) 一种发光二极管
WO2021166772A1 (ja) 発光デバイス、および発光デバイスの製造方法
WO2022239354A1 (ja) 発光装置および画像表示装置
CN112310142B (zh) 一种显示装置、显示面板及其制作方法
US20220216183A1 (en) Display substrate and display device
CN116033792A (zh) 有机发光二极管显示器
WO2022014421A1 (ja) 発光装置および画像表示装置
TW201937762A (zh) 發光裝置
CN114582246A (zh) 显示面板及其制造方法和显示装置
CN114975721B (zh) 显示面板及其制作方法、以及显示装置
US11742377B2 (en) Light emitting diode chip, display device and method for manufacturing the same
CN112037674B (zh) 面光源及其制备方法和显示装置
TW202213820A (zh) 發光裝置及顯示裝置
KR20200079434A (ko) 발광 장치 및 표시 장치

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination