CN115335977A - Substrate tray transfer system for substrate processing apparatus - Google Patents

Substrate tray transfer system for substrate processing apparatus Download PDF

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Publication number
CN115335977A
CN115335977A CN202080098832.5A CN202080098832A CN115335977A CN 115335977 A CN115335977 A CN 115335977A CN 202080098832 A CN202080098832 A CN 202080098832A CN 115335977 A CN115335977 A CN 115335977A
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CN
China
Prior art keywords
tray
magazine
carrier
base
chamber
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Pending
Application number
CN202080098832.5A
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Chinese (zh)
Inventor
栗田真一
阿部忍
申昌憙
小若雅彦
蔡容基
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN115335977A publication Critical patent/CN115335977A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00Manipulators not otherwise provided for
    • B25J11/0095Manipulators transporting wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00Gripping heads and other end effectors
    • B25J15/06Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0608Gripping heads and other end effectors with vacuum or magnetic holding means with magnetic holding means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25JMANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00Programme-controlled manipulators
    • B25J9/02Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)

Abstract

Methods and apparatus are provided for a transfer robot for a substrate processing system including a transfer chamber coupled to a plurality of process chambers. The transfer chamber includes: a transfer robot including a base coupled to the support bar; and a tray magazine secured to the base, wherein the tray magazine includes a first tray carrier for holding a first tray and transferring the first tray from the tray magazine to the susceptor in one of the plurality of processing chambers, and a second tray carrier stacked on the first tray carrier for holding a second tray, wherein each of the first tray carrier and the second tray carrier includes a plurality of friction reducing devices.

Description

Substrate tray transfer system for substrate processing apparatus
Technical Field
Embodiments of the present disclosure generally relate to a transport system for transporting a substrate tray in a processing system. More particularly, embodiments herein relate to a tray transport system for transporting solar cell substrates in a processing system.
Background
Solar cells are Photovoltaic (PV) devices that convert sunlight directly into electricity. The most common solar cell material is silicon in the form of a single crystal or polycrystalline substrate. Because the amortized cost of forming silicon-based solar cells to generate electricity is currently higher than the cost of generating electricity using conventional methods, it is desirable to reduce the cost of forming solar cells using silicon substrates.
Currently, to form a film layer on a silicon substrate for PV applications, a plurality of such substrates are placed on a carrier or tray that is transported between various processing chambers for processing the substrates or forming a film layer thereon. A tray of substrates is moved by using a robot having an end effector configured to transfer a large-area thin substrate between process chambers in which a film layer for forming a flat panel display is formed on the large-area substrate. However, the trays and silicon substrates are heavier than large area substrates, and end effectors that are originally used in flat panel display manufacturing equipment may fail or must be reinforced to support and transfer the trays.
Accordingly, there is a need for an improved method and apparatus for transferring substrate trays and substrates loaded thereon or therein.
Disclosure of Invention
Embodiments described herein provide a method and apparatus for a transfer robot for a substrate processing system including a transfer chamber coupled to a plurality of process chambers. The transfer chamber includes: a transfer robot including a base coupled to the support bar; and a tray magazine secured to the base, wherein the tray magazine includes a first tray carrier for holding a first tray and transferring the first tray from the tray magazine to the susceptor in one of the plurality of processing chambers, and a second tray carrier stacked on the first tray carrier for holding a second tray, wherein each of the first tray carrier and the second tray carrier includes a plurality of friction reducing devices.
Another embodiment provides a transfer robot comprising: a base coupled to the support rods; and a tray magazine secured to the base, wherein the tray magazine includes a first tray carrier for holding a first tray and transferring the first tray from the tray magazine to the base, and a second tray carrier for holding a second tray, wherein each of the first and second tray carriers are vertically stacked and include a magnetic levitation assembly.
Another embodiment provides a transfer robot comprising: a base coupled to the support rods; and a tray magazine secured to the base, wherein the tray magazine includes a first tray carrier for holding a first tray and transferring the first tray from the tray magazine to the base, and a second tray carrier for holding a second tray, wherein each of the first and second tray carriers are vertically stacked and contain a roller assembly.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments.
Fig. 1 is a top view of a multi-chamber substrate processing system suitable for fabricating solar cells on a substrate.
Fig. 2A-2E are isometric views of the transfer robot showing various motions of the robotic arms and trays.
Fig. 3A is an isometric view of a tray magazine.
Fig. 3B is a side (front or rear) view of the tray magazine.
Fig. 3C is an enlarged detail view of a portion of the tray magazine of fig. 3B.
Fig. 4A is a side view (front or rear) of a transfer robot having a tray magazine thereon.
Fig. 4B is an enlarged view of a portion of the tray magazine shown in fig. 4A.
Fig. 4C is an enlarged view of another portion of the tray magazine shown in fig. 4A.
Fig. 5A and 5B are cross-sectional views of a portion of the tray magazine, particularly the first tray carrier and the tray magazine, along lines 5A-5A and 5B-5B of fig. 3A, respectively.
FIG. 6 is a schematic top view of the pallet magazine and pallet, showing the connection interface between the pallet and the robotic arm.
Fig. 7A-7C are cross-sectional views of a substrate processing system illustrating one embodiment of a tray transfer process.
Fig. 8A and 8B are sectional views of the substrate processing system, showing other parts of the tray transfer process.
Fig. 9A to 9D are schematic cross-sectional views of a process chamber illustrating one embodiment of interaction of the lift pins and the magnetic track in the transfer process as described above.
Fig. 9E is a schematic top plan view of the base shown in fig. 9A and 9C, showing a magnetic track thereof.
Fig. 10A and 10B are sectional views of a substrate processing system showing another embodiment of a tray transfer process.
Fig. 11A-11D are schematic cross-sectional views of a process chamber illustrating another embodiment of the interaction of lift pins and tray rollers in a transfer process as described in fig. 10A and 10B.
Fig. 12A and 12B are sectional views of a substrate processing system showing another embodiment of a tray transfer process.
Fig. 13A to 13D are schematic sectional views of a process chamber illustrating another embodiment of interaction of lift pins and pin rollers in the transfer process illustrated in fig. 12A and 12B.
To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
Detailed Description
Embodiments described herein provide a method and apparatus for transferring a tray comprising a plurality of substrates, such as solar cell substrates made of silicon or other materials suitable for forming photovoltaic devices.
Fig. 1 is a top view of a multi-chamber substrate processing system 100 suitable for fabricating solar cells on a substrate. The system 100 includes a plurality of processing chambers 105 and one or more load lock chambers 110 located around a central transfer chamber 115. Each process chamber 105 is configured to perform at least one of a plurality of different processing steps to achieve a desired processing of a plurality of substrates positioned on a tray (not shown). Each process chamber 105 may be configured to provide the same process or a different process as compared to another process chamber 105. The trays are positioned on a tray carrier 120 (shown in phantom), and the carrier 120 supports and transports the trays. Another tray carrier is positioned below tray carrier 120, which supports a tray having another plurality of substrates.
A transfer robot 125 having a multi-arm transfer assembly 128 is located within transfer chamber 115. One tray carrier 120 or two tray carriers 120 are placed in a tray magazine (described below) on a transfer robot 125. The transfer assembly 128 has two independently operated arms 130 and 135 to move the same number of tray carriers 120 thereon (each carrier can hold a single tray in a horizontal direction (X and/or Y direction)). The transfer robot 125 is movable about a rotation axis (in the Z direction). The transfer assembly 128 is configured to be supported and moved independently of the transfer robot 125. Each of arms 130 and 135 engages one of tray carriers 120 to transport an individual tray.
The tray carrier 120 includes a plurality of friction reducing devices 140, the friction reducing devices 140 being adapted to support and facilitate movement of a tray supported thereon. In one embodiment, the transfer robot 125 is configured to rotate about a vertical axis and/or to be driven linearly in a vertical direction (Z-direction), while the arms 130 and 135 are configured to move linearly in a horizontal direction (X-and/or Y-linear directions) independent of the transfer robot 125 and relative to the transfer robot 125. The movement of the arms 130 and 135 moves the respective tray carrier 120 relative to the friction reducing device 140. The transfer robot 125 is adapted to align one of the tray carriers 120 with the sealable openings in the process chamber 105 and the load lock chamber 110. When transfer robot 125 is at an appropriate height, one of arms 130 and 135 extends horizontally (in the X-direction, Y-direction, or a combination thereof in a typical linear path) to transfer and/or position tray carrier 120 and selectively move a tray supported thereon into or out of any one of process chamber 105 and load lock chamber 110. In addition, the transfer robot 125 may be rotated to align the arms 130 and 135 and/or the tray carrier 120 with the other process chambers 105 and load lock chambers 110.
A portion of the interior of one of the processing chambers 105 is shown in fig. 1 to expose a substrate support or susceptor 150 therein, the substrate support or susceptor 150 being adapted to receive and support one of the trays during processing. The pedestal 150 includes a plurality of lift pins 155, the top of the plurality of lift pins 155 being shown, the plurality of lift pins 155 being movable relative to the upper surface of the pedestal 150 to facilitate transfer of a tray within the processing chamber 105 (or within the load lock chamber 110) by lifting a tray of the tray carrier 120 or placing a tray on the tray carrier 120.
A portion of the process chamber 105 has one or more friction reducing devices 160 at or near the chamber opening 170. The orientation of the friction reducing devices 160 is the same as (e.g., parallel to) or orthogonal to the orientation of the friction reducing devices 140 on the tray carrier 120 when in the transport position. The friction reducing device 140 moves the tray off of or onto the tray carrier 120 and out of the processing chamber 105 (i.e., the tray off of or onto the tray carrier 120). The friction reducing device 160 enables the movement of the pallet into and out of the processing chamber 105 at least at the chamber opening 170 to facilitate the movement of the pallet onto the pedestal 150 or out of the pedestal 150.
The environment within the substrate processing system 100 is isolated from ambient pressure (i.e., the pressure outside the system 100) and is maintained at a negative pressure (i.e., at a vacuum pressure compared to the external environment) by one or more vacuum pumps (not shown). During processing, the processing chamber 105 is evacuated to a predetermined vacuum pressure configured to facilitate thin film deposition and other processes. Likewise, during transfer of the tray, the transfer chamber 115 is maintained at a reduced or vacuum pressure to facilitate a minimum pressure gradient between the processing chamber 105 and the transfer chamber 115. In one embodiment, the pressure in the transfer chamber 115 is maintained at a pressure below ambient pressure. For example, the pressure in the transfer chamber may be about 7 torr to about 10 torr, while the pressure in the processing chamber 105 may be lower. In one embodiment, the maintenance pressure within the transfer chamber 115 is substantially equal to the pressure within the processing chamber 105 and/or the load lock chamber 110 to facilitate substantially equal pressures in the system 100.
Fig. 2A-2E are isometric views of transfer robot 125 illustrating various movements of its arms 130 and 135. The transfer robot 125 includes a base 202, and the base 202 is supported on a support rod 203 in a raised position. One or more tray carriers 120 (shown as a first (upper) tray carrier 200A and a second (lower) tray carrier 200B) are supported by a base 202. Each of the first and second tray carriers 200A and 200B is adapted to support and facilitate the transport of a single tray, shown in fig. 2D and 2E at reference numerals 204A and 204B, respectively. Although not shown in some of the figures for clarity, the first tray carrier 200A and the second tray carrier 200B are each configured to operate with trays 204A and 204B, respectively. Each of the trays 204A and 204B contains a plurality of substrates 205.
The first and second pallet carriers 200A, 200B each include a pallet magazine 206, the pallet magazine 206 being configured to selectively accommodate both the pallet 204A and the pallet 204B simultaneously. The tray magazine 206 includes upper and lower portions each including one or more friction reducing devices 140 as shown in fig. 1, and this will be discussed in more detail with respect to fig. 3A-3C. An upper portion of the tray magazine 206 holds a first tray carrier 200A, while a lower portion of the tray magazine 206 holds a second tray carrier 200B. A tray magazine 206 including one or more friction reducing devices 140 (fig. 3A-3C) for both the upper and lower portions guides and facilitates the transfer of trays 204A and 204B, respectively, during the movement of arms 130 and 135. With independent movement of the arm 130 and the arm 135, the movement of the pallet 204A within the pallet magazine 206 is independent of the movement of the pallet 204B, and vice versa.
The support rod 203 is coupled to a motor (not shown) that provides rotational movement of the base 202 (and tray magazine 206) about an axis of rotation 210. The support bar 203 is also adapted to move the base 202 (and the tray magazine 206) in a vertical direction (Z-direction). Each of arms 130 and 135 is coupled to a separate drive system (not shown) that enables arms 130 and 135 to move laterally (in the X/Y plane) over the entire length of base 202.
In fig. 2A, the extension member 207 of the arm 130 is adapted to contact a tray 204A (not shown) disposed on the first tray carrier 200A to move the tray 204A within the first tray carrier 200A laterally (X-direction) on the base 202. Movement of the arm 130 and the extension member 207 coupled thereto in the-X and + X directions across the tray magazine 206 moves the tray 204A in the same direction. For example, movement of the arm 130 in the-X direction pushes the tray 204A out of the tray magazine 206. Similarly, movement of the arm 130 in the + X direction pulls the tray 204A into the tray magazine 206.
In fig. 2B, the arm 135 is adapted to contact a tray 204B (not shown) disposed on the second tray carrier 200B to move the tray 204B within the second tray carrier 200B laterally (X-direction) across the base 202. The movement of the arm 135 in the-X and + X directions across the tray magazine 206 moves the tray 204B in the same direction. For example, movement of the arm 135 in the-X direction pushes the tray 204B out of the tray magazine 206. Similarly, movement of the arm 135 in the + X direction pulls the tray 204B into the tray magazine 206.
In fig. 2C, arms 130 and 135 are both in the "home" position. When present, a tray 204A (disposed on the first tray carrier 200A) and a tray 204B (disposed on the second tray carrier 200B) are secured in the tray magazine 206. In this position, the transfer robot 125 may rotate and move both the first tray carrier 200A (and the tray 204A) and the second tray carrier 200B (and the tray 204B) in the tray magazine 206. In addition, the transfer robot 125 may move both the first pallet carrier 200A (and pallet 204A) and the second pallet carrier 200B (and pallet 204B) in the pallet magazine 206 vertically (+ Z or-Z direction) to modify the base 202 and the pallet magazine 206 positioned thereon.
In fig. 2D, arm 130 is in a maximum extended position (arm 135 is in the home position shown in fig. 2C), and arm 130 moves tray 204A to one end of base 202 and out of tray magazine 206 (i.e., into processing chamber 105) during a transfer operation to transfer tray 204A into processing chamber 105 (a portion of which is shown in phantom). A portion of the arm 130 is sized to pass over and/or around the tray magazine 206. In a transfer operation to remove the tray 204A from the process chamber 105, when the arm 130 is actuated, the arm 130 contacts the tray 204A at that position and moves the tray 204A back (in the + X direction) into the tray magazine 206.
In fig. 2E, arm 135 is in the most extended position (arm 135 is in the home position shown in fig. 2C), and arm 135 moves tray 204B to one end of base 202 and out of tray magazine 206 (i.e., into processing chamber 105) during a transfer operation to transfer tray 204B into processing chamber 105 (a portion of which is shown in phantom). The arm 135 is sized to pass through the tray magazine 206. In a transfer operation to remove the tray 204B from the process chamber 105, when the arm 135 is actuated, the arm 135 contacts the tray 204B at that position and moves the tray 204B back (in the + X direction) into the tray magazine 206.
Fig. 3A-3C are various views of details of the tray magazine 206 as described herein. Fig. 3A is an isometric view of the tray magazine 206. Fig. 3B is a side (front or rear) view of the tray magazine 206. Fig. 3C is an enlarged detail view of fig. 3B.
The tray magazine 206 includes a body 300 having two opposing major sides 302 and two opposing minor sides 304 extending between the opposing major sides 302. In one embodiment, primary side 302 is greater than the length of secondary side 304, i.e., longer. However, in other embodiments, the length of primary side 302 is substantially equal to the length of secondary side 304. The main body 300 of the tray magazine 206 includes an upper portion 305 and a lower portion 310. The upper portion 305 and the lower portion 310 include a first tray carrier 200A and a second tray carrier 200B, respectively. As seen more clearly in fig. 3C, tray 204A is located in the volume of first tray carrier 200A and tray 204B is located in the volume of second tray carrier 200B.
The body 300 also includes a dimension 315A (length or width) that allows the arm 130 to pass through or around the body 300. At least a lower portion 310 of the main body 300 (the first pallet carrier 200A) includes a gap 312 having a width or length, the gap 312 including a sub-dimension 315B that allows the arm 135 to pass through the pallet magazine 206.
Body 300 also includes a plurality of cross members 320 between major sides 302 thereof. Each of the first and second tray carriers 200A and 200B includes a plurality of cross members 320. While the cross members 320 of the first tray carrier 200A are one-piece (unitary) and extend between their opposing ends and are connected to the opposing major sides 302, the cross members 320 of at least the second tray carrier 200B are smaller and extend from a connection with one of the major sides 302 partially toward the opposing major side 302, thus being formed as a two-piece structure including a gap 312 of dimension 315B between its (inwardly positioned) opposing ends. Accordingly, the gap 312 extends from the first end 325A of the body 300 to the second end 325B of the body 300 at least in the lower portion 310.
Also shown in fig. 3A-3C are a plurality of friction reducing devices 140. The friction reducing device 140 is included on both the first tray carrier 200A and the second tray carrier 200B. Each friction reducing device 140 may be a magnetic device, a roller (e.g., one or more roller assemblies), or a wheel, or a combination thereof. The friction reducing means 140 comprises external friction reducing means 330 (direction between the opposite main sides 302 with respect to the width of the tray) and internal friction reducing means 335 (direction between the opposite main sides 302 with respect to the width of the tray). The friction reducing device 140 may be formed continuously or discontinuously from the first end 325A of the body 300 to the second end 325B of the body 300. For example, the friction reducing devices 140 may comprise a solid bar or linear pattern across the body 300, or comprise discrete devices at specific locations across the body 300 from the first end 325A to the second end 325B of the body 300. The friction reducing device 140 causes reduced or no frictional movement of the trays 204A and 204B within the tray magazine 206 relative to the first and second tray carriers 200A and 200B.
Fig. 4A-4C are various views of the transfer robot 125 and the tray magazine 206, illustrating one embodiment of the friction reducing device 140 of the tray magazine 206 as described herein. Fig. 4A is a side view (front or rear) of the transfer robot 125 with the tray magazine 206 thereon. Fig. 4B is an enlarged view of a portion of the tray magazine 206 shown in fig. 4A. Fig. 4C is an enlarged view of another portion of the tray magazine 206 shown in fig. 4A.
In this embodiment, the friction reducing means 140 comprises a plurality of magnetic means 400. A magnetic device 400 is located in each of the first and second tray carriers 200A and 200B. As will be described further herein, the tray 204A is shown in the first tray carrier 200A and is magnetically suspended (i.e., floating) relative to the cross member 320, as shown in fig. 4B and 4C. The second tray carrier 200B shown in fig. 4A is empty, but includes magnetic means 400 to support the tray (i.e., tray 204B).
Referring again to fig. 4A, as described above, the base 202 of the transfer robot 125 is coupled to the support rods 203, and the support rods 203 are coupled to the actuators 405. The actuator 405 moves the base 202 and the supported tray magazine 206 in the vertical direction (Z direction) and rotates about the rotation axis 210. The arm 130 (for moving the tray 204A in the first tray carrier 200A) is coupled to a first linear drive 410. An arm 135 for moving a tray (not shown) in the second tray carrier 200B is coupled to the second linear drive 415. The first and second linear drives 410 and 415 include stepper motors, belt drives, lead screws attached to motors (e.g., stepper motors or other linear motors or devices) to move the arms 130 and 135 in the X direction. Each of the first and second linear drives 410, 415 and the actuator 405 are coupled to a controller 420. Controller 420 independently controls the movement of arms 130 and 135 in the X direction, the movement of base 202 in the Z direction, and the rotation of base 202.
Also shown in fig. 4A, the arm 130 is coupled to a rectangular frame 425. The rectangular frame 425 defines a space 430, and the space 430 can be sized to pass over and around the tray magazine 206.
The rectangular frame 425 also positions the arm 130 vertically (in the Z-direction) so that the arm 130 is vertically aligned with the tray 204A to push or pull the tray laterally (in the X-direction). The rectangular frame 425 is coupled to the first linear drive 410 to move the arm 135 and the tray 204A in the X direction. The arm 130 is disposed on the spacer 440. The spacer 440 is coupled to the second linear drive 415 to move the arm 130 and the tray (not shown) in the X direction. The spacer 440 also positions the arm 135 vertically (in the Z-direction) so that the arm 135 is vertically aligned with the tray (when present) to push or pull the tray laterally (in the X-direction). The spacer 440 is coupled to the second linear drive 415 to move the arm 130 and the tray in the X-direction.
The materials for the transfer robot 125 and the tray box 206 include materials having low thermal conductivity and low thermal expansion coefficient. Example materials for the transfer robot 125 and the tray magazine 206 include stainless steel, aluminum, carbon fiber, or graphite. In one particular example, the arms 130 and 135 and the tray box 206 can be stainless steel, aluminum, or carbon fiber. Trays 204A and 204B should be made of a material with good mechanical rigidity and thermal conductivity, and a low CTE. In one example, trays 204A and 204B may be made of carbon composite, al-SiC composite, al,
Figure BDA0003854975090000091
Or some combination or alloy thereof.
According to one embodiment, each magnetic device 400 includes a linear rail 445. The linear rail 445 is continuous along the X direction of each of the first tray carrier 200A and the second tray carrier 200B. Referring to fig. 4B, the linear rail 445 is coupled to the side wall 450 of the tray box 206 by a bracket 455. The bracket 455 includes a first magnet 460A and the tray 204A includes a second magnet 460B. The second magnet 460B is disposed in a housing 465 (shown in fig. 4C), the housing 465 being fixed to the tray 204A. As shown in fig. 4C, the magnetic device 400 inside the magnetic device 400 adjacent to the side wall 450 of the tray magazine 206 is disposed in a housing 470, the housing 470 being fixed to the cross member 320. The first magnet 460A and the second magnet 460B are positioned such that their poles repel each other. In some embodiments, the second magnet 460B includes a coating 475. Since the tray 204A (and the tray 204B) are in a processing environment that includes plasma conditions, the coating 475 is plasma resistant or plasma compatible material, such as aluminum.
Fig. 5A and 5B are cross-sectional views of a portion of the tray magazine 206, particularly the first tray carrier 200A and the tray magazine 206, along lines 5A-5A and 5B-5B of fig. 3A, respectively. Fig. 5A and 5B illustrate one embodiment of a magnetic levitation assembly 500 for a tray 204A. Although not shown, the second tray carrier 200B and the tray 204B include a magnetic levitation assembly 500.
Portions of the tray magazine 206 and the first tray carrier 200A are shown in different positions in fig. 5A and 5B to illustrate different portions of the magnetic levitation assembly 500. The magnetic levitation assemblies 500 shown in fig. 5A can alternate with the magnetic levitation assemblies 500 shown in fig. 5B along the length (X-direction) of the side wall 450 of the tray magazine 206.
The magnetic levitation assembly 500 shown in fig. 5A and 5B includes a first magnet 460A embedded in a bracket 455, the bracket 455 coupled to the side wall 450 of the tray box 206. The first magnet 460A may be a continuous band along the length (X direction) of the tray magazine 206 and/or the side wall 450 of the cradle 455.
In fig. 5A, the magnetic suspension assembly 500 includes a second magnet 460B, the second magnet 460B being positioned within a housing 505 (magnet housing), the housing 505 being coupled to a first (lower) surface 510 of the tray 204A. The first surface 510 of the tray 204A is opposite its second (upper) surface 515. The second surface 515 includes a plurality of pockets 520 formed therein, each pocket 520 defining a recess in the outline of the substrate to support a substrate (not shown) therein. In fig. 5B, the magnetic levitation assembly 500 includes side rollers 525. The side rollers 525 are coupled to the housing 505 (roller housing). Side rollers 525 are utilized to reduce contact between the brackets 455 and the pallet 204A and thus reduce friction and protect the spacing between them as the pallet 204A moves within the pallet magazine 206. The housing 505 extends along the length (X direction) of the tray 204A and includes a plurality of magnet housings alternating with a plurality of roller housings. Thus, the tray 204A includes a plurality of second magnets 460B and a plurality of side rollers 525.
The housing 505 may be made of a non-ferrous metal, such as aluminum, to protect the second magnet 460B from the processing conditions under which the tray 204A will be placed for substrate processing. The housing 505 is coupled to the tray 204A using fasteners 530 or other suitable engagement methods.
The magnetic levitation assembly 500 illustrated in figure 5A forms a lateral offset distance 535 between the first magnet 460A and the second magnet 460B. The lateral offset distance 535 may be about 2 millimeters (mm) to about 3mm. The first magnet 460A and the second magnet 460B provide a gap 540 between the bracket 455 and the housing 505. The gap 540 may be about 1mm to about 3mm and may be modified or selected based on the strength of the magnets 460A, B and the mass of the tray 204A or B and the substrate thereon, and based on those parameters.
Fig. 6 is a schematic top view of tray magazine 206 and tray 204A, showing a connection interface 600 between tray 204A and arm 130. Although not shown, the tray 204B and the arm 135 include a connection interface 600.
The connection interface 600 includes one or more coupling devices 605, the coupling devices 605 enabling a secure connection between the arm 130 and the end 610 of the tray 204A. The connection interface 600 can selectively connect and disconnect the arm 130 from the pallet 204A to move or fix the pallet 204A relative to the pallet magazine 206. Each of the one or more coupling devices 605 includes a magnetic connection or a mechanical connection. The magnetic connection may include an electromagnet on the arm 130 or the tray 204A that is selectively attracted to a magnetic component on the tray 204A or the arm 130 in an opposing relationship. The actuation of the electromagnet is controlled by a controller. The mechanical connection may be a pin/slot arrangement on the tray 204A and/or the arm 130. The mechanical connection may be controlled by moving the tray 204A relative to the arm 130 to connect/disconnect the pins and slots.
Fig. 7A-7C are cross-sectional views of the substrate processing system 100 illustrating one embodiment of a tray transfer process. The substrate processing system 100 shown in fig. 7A and 7C includes a processing chamber 105 and a load lock chamber 110 coupled to a central transfer chamber 115. Fig. 7B is an enlarged view of the central transfer chamber 115 and the processing chamber 105 shown in fig. 7A.
The processing chamber 105 includes a pedestal 150 having a plurality of lift pins 155 disposed in openings in the pedestal 150. The base 150 is coupled to the support bar 700 and the motor 755. The motor 755 moves the susceptor 150 vertically (in the Z direction) to lower and raise the susceptor 150 within the process chamber 105.
The central transfer chamber 115 includes a transfer robot 125 and a tray magazine 206 mounted thereon. Fig. 7A and 7B show the arm 130 extending through the chamber opening 170 to move the tray 204A out of the tray magazine 206 and into the processing chamber 105.
As shown in fig. 7B, the lift pins 155 extend a distance above the support surface 710 of the pedestal 150 when the pedestal is in the lowered position within the processing chamber 105 of fig. 7B. The support surface 710 is at least partially surrounded by a shoulder 715, the shoulder 715 being to receive the tray 204A.
As shown in fig. 7B, when the pedestal 150 is lowered, the lift pins 155 contact the bottom 720 of the processing chamber 105, which causes the upper ends of the lift pins 155 to extend above the support surface 710. In one embodiment, lift pin 155 supports magnetic track 725. The magnetic track 725 magnetically levitates the tray 204A in the process chamber 105 along with the magnets 460B in the tray ( trays 204A, 204B). When the base 150 is lifted (in the Z direction), the lift pins 155 movably disposed in the openings 730 formed through the base 150 and the magnetic rails 725 move close to the support surface 710. When the base 150 is raised to a distance, the tray 204A will contact the support surface 710 and the shoulder 715 prevents movement of the tray 204A during processing. Magnetic tracks 725 are configured to contact bearing surface 710 when the tray contacts the surface of base 150.
Transfer of the tray 204A from the arm 130 to the track 725 on the base 150 is accomplished by removing the connection interface 600. When connection interface 600 is magnetic, the electromagnet (i.e., coupling 605) is de-energized to release tray 204A from arm 130. When the connection interface 600 is a mechanical connection, the pin/hole connection (i.e., the coupling 605) is decoupled. Decoupling is provided by relative vertical motion (in the Z direction) by moving the transfer robot 125 and the arm 130 upward (in the Z direction). Once the tray 204A is decoupled at the connection interface 600, the arm 130 is retracted into the central transfer chamber 115, as shown in fig. 7C. A valve 735, such as a slit valve mechanism, then seals the process chamber 105 from the central transfer chamber 115 to enable processing in the process chamber 105. Removal of the tray 204A is accomplished by reversing the transfer steps described above.
In one embodiment, the chamber opening 170 includes a friction reducing device 160 embedded in or disposed on its body. For example, the magnet assembly 740 is included in or on the body 745 of the central transfer chamber 115 adjacent to the chamber opening 170. Also shown is a magnet arrangement 740 in the body 750 of the process chamber 105 adjacent the chamber opening 170. The friction reducing device 160 provides a magnetic repulsion force to levitate the tray 204A when passing through the chamber opening 170.
Fig. 8A and 8B are sectional views of the substrate processing system 100, showing other parts of the tray transfer process. Fig. 8A shows the transfer robot 125 in a vertical position to align the tray magazine 206 such that the second tray carrier 200B is aligned with the chamber opening 170. In a position where the transfer robot 125 is at a higher elevation than shown in fig. 7A, a tray 204B (not shown, but within the second tray carrier 200B) may be transferred into the processing chamber 105 through the chamber opening 170. The transfer process is similar to the process described in fig. 7A-7C. Fig. 8B shows the transfer robot 125 rotated along the rotation axis 210 to transfer the tray 204B into the slot of the load lock chamber 110. As shown, the arm 135 extends into the chamber opening 800 to place the tray 204B therein.
Fig. 9A to 9D are schematic cross-sectional views of the process chamber 105 illustrating one embodiment of the interaction of the lift pins 155 and the magnetic track 725 in the transfer process as described above. In these figures, a tray 900 is shown, the tray 900 may be any of the trays 204A and 204B described herein. The view of the process chamber 105 in fig. 9A-9D is rotated 90 degrees from the view in fig. 7A-8C.
Fig. 9E is a schematic top plan view of base 150 shown in fig. 9A and 9C, showing magnetic track 725 thereof.
Fig. 9A shows the susceptor 150 in a transfer position in which the lift pins 155 are in contact with the bottom 720 and the magnetic track 725 on each lift pin 155 is raised from the support surface 710 of the susceptor 150. Fig. 9B is an enlarged view of a portion of the base 150 and tray 900 of fig. 9A. Fig. 9C shows the base 150 in a processing position, wherein the tray 900 rests on the support surface 710 of the base 150. Fig. 9D is an enlarged view of a portion of the base 150 and tray 900 of fig. 9C.
Magnetic track 725 includes a plurality of magnets 905 attached to the upper surface of each lift pin 155. The lift pins 155 include a central or inner lift pin 910 and a peripheral or outer lift pin 915. In one embodiment, each column includes a plurality of magnets 905 (in the X-direction), and each column of outer lift pins 915 includes a plurality of magnets 905 (in the X-direction).
In some embodiments, the plurality of magnets 905 form a track as described above, and the base 150 includes a plurality of grooves formed therein to receive the track. A portion of the lift pins 155 are coupled to each other by a connection plate 920. For example, at least a portion of the inner lift pins 910 are coupled to a portion of the outer lift pins 915 to maintain the position of the plurality of magnets 905 parallel to the grooves formed in the base 150.
In fig. 9C, the base 150 is raised in the Z direction, which allows the magnet 905 to be recessed into an opening 730 formed through the base 150. This allows the tray 900 to rest on the support surface 710 of the base 150 for processing.
In fig. 9B and 9D, the outer lift pin 915 includes a bracket 925 attached thereto. The bracket 925 includes a magnet 930. The bracket 925 may span the length of the tray 900 (in the X direction), or be a discrete section attached to each outer lift pin 915. In one embodiment, the carriage 925 may be coupled with the arm 130 or 135 (shown in other figures) such that the carriage 925 (in some embodiments on both sides of the tray 900) moves with the tray 900 during transport using the transfer robot 125. In fig. 9E, the bracket 925 is slightly longer than the magnetic track 725. This allows the robotic arm 130 or 135 to access the carriage 925.
The openings 730 of the base 150 for the outer lift pins 915 include enlarged openings or channels 935, the openings or channels 935 receiving the brackets 925 when the base 150 is in the processing position. As shown in fig. 9D, when the bracket 925 is placed in the channel 935, the tray 900 rests on the support surface 710 of the base 150 for processing.
Fig. 10A and 10B are sectional views of the substrate processing system 100, showing another embodiment of the tray transfer process. The substrate processing system 100 shown in fig. 10A and 10B is similar to the embodiment shown in fig. 7A and 7B, except that a plurality of pallet rollers 1000 (e.g., roller assemblies) are used in place of the magnet arrangement (e.g., magnetic levitation assembly 500 (shown in fig. 5A)). Thus, the plurality of friction reducing devices 140 depicted in fig. 1-2E include a tray roller 1000. Similar to fig. 7A, the substrate processing system 100 includes a process chamber 105 and a load lock chamber 110 coupled to a central transfer chamber 115. Fig. 10B is an enlarged view of the central transfer chamber 115 and the processing chamber 105 shown in fig. 10A. For the sake of brevity, the same reference numerals as in fig. 7A and 7B will not be repeated. In addition, other views of the tray transfer process (using a magnetic levitation system) shown in fig. 7C-9D are not shown, as the tray transfer process described in the following figures will operate in a similar manner unless otherwise noted.
In fig. 10A and 10B, the tray roller 1000 is shown coupled to the trays 204A and 204B. However, in other figures below, the rollers are coupled to the tray magazine 206 (in the central transfer chamber 115) and to each lift pin 155 (in the process chamber 105).
Fig. 10A and 10B show the arm 130 extending through the chamber opening 170 to move the tray 204A out of the tray magazine 206 and into the processing chamber 105.
As shown in fig. 10B, the tray rollers 1000 on the tray 204A are aligned with the lift pins 155 of the base 150. When the base 150 is lifted (in the Z direction), the lift pins 155 movably disposed in the openings 730 formed through the base 150 and the tray roller 1000 are retracted into the openings 730. Thus, the tray 204A will contact the support surface 710 for processing. Before releasing the tray 204A, the base 150 may be urged vertically (upwardly) a short distance to position the tray rollers at least partially in the openings 730 to prevent the tray 204A from sliding off the base 150.
The transfer of the tray 204A from the arm 130 to the base 150 is accomplished by removing the connection interface 600. In this embodiment, the connection interface 600 is a mechanical connection, such as a pin/hole connection. Decoupling is provided by relative vertical motion (in the Z direction) by moving the transfer robot 125 and arm 130 upward (in the Z direction). Once the tray 204A is decoupled at the connection interface 600, the arm 130 is retracted into the central transfer chamber 115. A valve 735, such as a slit valve mechanism, then seals the process chamber 105 from the central transfer chamber 115 to enable processing in the process chamber 105. Removal of the tray 204A is accomplished by reversing the transfer steps described above.
Fig. 11A to 11D are schematic cross-sectional views of the process chamber 105, illustrating one embodiment of the interaction of the lift pins 155 and the tray rollers 1000 in the transfer process as described above. In these figures, a tray 900 is shown, the tray 900 may be any of the trays 204A and 204B described herein. The views of the process chamber 105 in fig. 11A-11D are in the same orientation as shown in fig. 10A-10B. 11A-11D are similar to the embodiment shown in FIGS. 9A-9D, and for the sake of brevity, the reference numbers common to both sets of figures will not be explained in detail.
Fig. 11A shows the base 150 in the transfer position with the tray roller 1000 above the lift pins 155 raised from the support surface 710 of the base 150. Fig. 11B is an enlarged view of a portion of the base 150 and the tray 900 of fig. 11A. Fig. 11C shows the base 150 in a processing position, wherein the tray 900 rests on the support surface 710 of the base 150. Fig. 11D is an enlarged view of a portion of the base 150 and tray 900 of fig. 11C.
In contrast to the above detailed fig. 9B and 9D, the base 150 includes a ramp 1100. The ramp 1100 smoothes the transition between the pedestal 150 and the surface 1105 of the chamber opening 170. For example, if the heights are different, the ramp 1100 allows the pallet roller 1000 to move from the height of the chamber opening 170 to the height of the base 150. Ramp 1100 may also form a portion of shoulder 715 (shown in fig. 7B).
As shown in fig. 11B, the tray roller 1000 is coupled to the tray 204A by a bracket 1110. The tray roll 1000 is coupled to the carrier 1110 by a shaft 1115.
In fig. 11C and 11D, the tray 204A rests on the base 150 in the processing position. The tray roller 1000 is recessed in an opening 730 formed in the base 150. As shown in fig. 11D, a gap 1120 is provided between the upper surface of the lift pin 155 and the outer surface of the tray roller 1000. The gap 1120 may be about 3mm to about 6mm, for example about 5mm.
Fig. 12A and 12B are sectional views of the substrate processing system 100, showing another embodiment of the tray transfer process. The substrate processing system 100 shown in fig. 12A and 12B is similar to the embodiment shown in fig. 10A and 10B, except that the pallet roller 1000 is replaced with a plurality of pallet magazine rollers 1200 in the transfer robot 125. Thus, the plurality of friction reducing devices 140 depicted in fig. 1-2E include a pallet magazine roll 1200. Similar to fig. 7A and 10A, the substrate processing system 100 includes a process chamber 105 and a load lock chamber 110 coupled to a central transfer chamber 115. Fig. 12B is an enlarged view of the central transfer chamber 115 and the process chamber 105 shown in fig. 12A. For the sake of brevity, the same reference numerals as fig. 7A and 7B (and/or fig. 10A and 10B) will not be repeated. In addition, other views of the tray transfer process (using a magnetic levitation system) shown in fig. 7C-9D are not shown, as the tray transfer process described in the following figures will operate in a similar manner unless otherwise noted.
In the central transfer chamber 115, a tray cassette roller 1200 is coupled to the tray cassette 206. In the process chamber 105, the susceptor 150 includes a pin roller 1205. Thus, the lift pin 155 includes a roller head attached to an upper surface of the lift pin 155.
Fig. 12A and 12B show the arm 130 extending through the chamber opening 170 to move the tray 204A out of the tray magazine 206 and into the processing chamber 105.
As illustrated in fig. 12B, when the base 150 is lifted (in the Z direction), the lift pins 155 movably disposed in the openings 730 formed through the base 150 and the pin rollers 1205 are retracted into the openings 730. Thus, the tray 204A will contact the support surface 710 for processing.
The transfer of the tray 204A from the arm 130 to the base 150 is accomplished by removing the connection interface 600. In this embodiment, the connection interface 600 is a mechanical connection, such as a pin/hole connection. Decoupling can be provided by relative vertical motion (in the Z direction) by moving the transfer robot 125 and arm 130 upward (in the Z direction). Once the tray 204A is decoupled at the connection interface 600, the arm 130 retracts into the central transfer chamber 115. A valve 735, such as a slit valve mechanism, then seals the process chamber 105 from the central transfer chamber 115 to enable processing in the process chamber 105. Removal of the tray 204A is accomplished by reversing the transfer steps described above.
Fig. 13A-13D are schematic cross-sectional views of the process chamber 105 illustrating one embodiment of the interaction of the lift pins 155 and the pin rollers 1205 in the transfer process described above. In these figures, a tray 900 is shown, the tray 900 may be any of the trays 204A and 204B described herein. The views of the process chamber 105 in fig. 13A-13D are in the same orientation as shown in fig. 12A-12B. FIGS. 13A-13D are similar to the embodiment shown in FIGS. 11A-11D, and reference numerals common to both sets of figures will not be explained in detail for the sake of brevity.
Fig. 13A shows the base 150 in the transfer position, in which the lift pins 155 and the pin rollers 1205 are raised from the support surface 710 of the base 150. Fig. 13B is an enlarged view of a portion of the base 150 and tray 900 of fig. 13A. Fig. 13C shows the base 150 in a processing position, wherein the tray 900 rests on the support surface 710 of the base 150. Fig. 13D is an enlarged view of a portion of the base 150 and tray 900 of fig. 13C.
In contrast to fig. 11B and 11D described above, the chamber opening 170 includes a transition roller 1300. The transition roller 1300 smoothes the transition between the base 150 and the surface 1105 of the chamber opening 170. For example, if the heights are different, the transition roller 1300 allows the tray 204A to move from the height of the chamber opening 170 to the height of the base 150. The transition roll 1300 is an example of one or more of the friction reducing devices 160 described above.
In fig. 13C and 13D, the tray 204A rests on the base 150 in the processing position. The pin roller 1205 is recessed in an opening 730 formed in the base 150.
While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (15)

1. A substrate processing system, comprising:
a transfer chamber coupled to a process chamber, wherein the process chamber includes a pedestal therein, the transfer chamber comprising:
a transfer robot including a base coupled to a support bar; and
a tray magazine secured to the base, wherein the tray magazine includes a first tray carrier for holding a first tray and transferring the first tray from the tray magazine to the pedestal in the processing chamber, and a second tray carrier stacked on the first tray carrier for holding a second tray, wherein each of the first and second tray carriers includes a plurality of friction reducing devices.
2. The system of claim 1, wherein each of the plurality of friction reducing devices comprises a magnetic levitation assembly.
3. The system of claim 1, wherein each of the plurality of friction reducing devices comprises one or more magnets coupled to each of the first tray carrier and the second tray carrier.
4. The system of claim 3, wherein the one or more magnets comprise linear rails.
5. The system of claim 4, wherein the linear rail comprises a plurality of linear rails.
6. The system of claim 1, wherein each of the plurality of friction reducing devices comprises a roller assembly.
7. The system of claim 6, wherein the roller assembly comprises a plurality of rollers coupled to each of the first and second pallet carriers.
8. The system of claim 1, wherein the one of the plurality of process chambers comprises an opening having a friction reducing device positioned therein.
9. The system of claim 8, wherein the friction reducing device comprises one or more magnets.
10. The system of claim 8, wherein the friction reducing device comprises one or more rollers.
11. A transfer robot, comprising:
a base coupled to a support bar; and
a tray magazine secured to the base, wherein the tray magazine includes a first tray carrier for holding a first tray and transferring the first tray from the tray magazine to a base and a second tray carrier for holding a second tray, wherein each of the first and second tray carriers are vertically stacked and include a magnetic levitation assembly.
12. The system of claim 11, wherein the magnetic levitation assembly comprises one or more magnets coupled to each of the first and second tray carriers.
13. The system of claim 12, wherein the one or more magnets comprise linear rails.
14. The system of claim 13, wherein the linear rail comprises a plurality of linear rails.
15. The system of claim 11, wherein each of the first tray carrier and the second tray carrier comprises a plurality of cross members.
CN202080098832.5A 2020-03-20 2020-03-26 Substrate tray transfer system for substrate processing apparatus Pending CN115335977A (en)

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US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
JP3386986B2 (en) * 1997-10-16 2003-03-17 シャープ株式会社 Plasma processing equipment
CN1217773C (en) * 2002-12-05 2005-09-07 爱德牌工程有限公司 Plate display producing apparatus
US8309374B2 (en) * 2008-10-07 2012-11-13 Applied Materials, Inc. Advanced platform for processing crystalline silicon solar cells
KR101691066B1 (en) * 2010-11-17 2016-12-29 주성엔지니어링(주) Tray, substrate processing apparatus using the same, and manufacturing method of tray
KR101167947B1 (en) * 2010-03-19 2012-07-23 (주) 엔피홀딩스 Sputtering system
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