CN115334704B

CN115334704B - Ballast shell

Info

Publication number: CN115334704B
Application number: CN202210733973.0A
Authority: CN
Inventors: 李骞; 王慧; 谢积平; 叶华东
Original assignee: Guangzhou Kaihui Electronics Co ltd
Current assignee: Guangzhou Kaihui Electronics Co ltd
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2023-06-09
Anticipated expiration: 2042-06-27
Also published as: CN115334704A

Abstract

The invention relates to a ballast shell, which comprises a bottom cover and a top cover which are connected in a matching way, and a circuit board which is connected in a matching way with the bottom cover, wherein the circuit board is provided with a first port, a second port and an epoxy board, the first port and the second port are respectively positioned at two ends of the circuit board, the epoxy board is positioned between the first port and the second port, the bottom cover is provided with a first connecting component, the top cover is provided with a first connecting part, when the top cover is connected with the bottom cover, the first connecting part is connected with the first connecting component, the bottom cover is provided with a second connecting component which is connected with the circuit board in a matching way, the top cover is also provided with a glue filling hole, and the top cover is also provided with a connecting hole which is connected with the first port and the second port in a matching way. The ballast shell provided by the invention is mainly aimed at a shell radiating by adopting the radiating glue, so that the radiating effect is improved to a certain extent, and the overflow of the radiating glue can be prevented.

Description

Ballast shell

Technical Field

The invention relates to the technical field of electronic components, in particular to a ballast shell.

Background

The ballast is a device for limiting current and generating instant high voltage on fluorescent lamp, which is made up by winding enamelled wire on iron core made of silicon steel, when the instant switch is powered on, the coil with iron core will generate high voltage by self-sense and is applied to the electrodes (filaments) at two ends of fluorescent lamp tube. The action is alternately performed, when the starter (jump bulb) is closed, the filaments of the lamp tube are conducted and heated through the current limitation of the ballast; when the starter is opened, the ballast will generate high voltage by self-sense to the filaments at the two ends of the lamp tube, the filaments emit electrons to bombard the fluorescent powder on the tube wall to emit light, and the starter will be repeatedly turned on and off for several times, so as to turn on the lamp tube. When the lamp tube emits light normally, the internal resistance is reduced, and the starter always keeps an open state, so that the current stably passes through the lamp tube and the ballast to work, and the lamp tube emits light normally.

The ballast is more common in fluorescent lamp, and the temperature of the ballast is higher under the operating condition, most ballasts in the market at present adopt the fan to dissipate heat, but dissipate heat through the fan, on the one hand, the volume of the ballast is increased, on the other hand, the integral structure of the ballast is also required to be changed, so that the efficiency of the ballast is reduced in the processing and manufacturing process, and the device for dissipating heat of the ballast by adopting the heat-dissipating glue is less at present, and meanwhile, the shell for manufacturing the heat-dissipating glue is less, so that improvement is needed on the basis of the prior art, and the heat-dissipating shell for the heat-dissipating glue is provided for dissipating heat of the ballast.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides the ballast shell which mainly aims at the ballast shell radiating by the radiating glue, prevents the radiating glue from overflowing to a certain extent, and simultaneously can ensure the radiating effect of the ballast.

In order to achieve the purpose of the invention, the invention provides a ballast shell, which comprises a bottom cover and a top cover which are connected in a matching way, and a circuit board which is connected in a matching way with the bottom cover, wherein the circuit board is provided with a first port, a second port and an epoxy board, the first port and the second port are respectively positioned at two ends of the circuit board, the epoxy board is positioned between the first port and the second port, the bottom cover is provided with a first connecting component, the top cover is provided with a first connecting part, when the top cover is connected with the bottom cover, the first connecting part is connected with the first connecting component, the bottom cover is provided with a second connecting component which is connected with the circuit board in a matching way, and the top cover is also provided with a glue filling hole which is connected with the first port and the second port in a matching way.

Preferably, the first connecting portion includes a first inclined plate and a transverse plate which are connected with each other, the first connecting assembly includes a groove, the inlet of the groove is provided with a second inclined plate, when the first connecting portion is connected with the first connecting assembly, the first inclined plate is mutually abutted with the second inclined plate, and the transverse plate is connected with the groove.

Preferably, the top cover comprises a top plate, two side plates symmetrically arranged relative to the top plate and two bending plates symmetrically arranged relative to the top plate, the glue filling hole is formed in the top plate, the first connecting portion is formed in the bending plates, the bending plates further comprise first bending portions, one ends of the first bending portions are connected with the top plate, the other ends of the first bending portions are connected with the first connecting portions, the connecting hole is formed in the first bending portions, and the connecting hole is tightly close to the first connecting portions.

Preferably, the circuit board further includes a plurality of electronic components, the plurality of electronic components are located between two epoxy boards, the two epoxy boards are all protruding upwards to set up the circuit board, the lateral wall of the two epoxy boards is hugged closely the first port and the second port and is set up, or the lateral wall of the two epoxy boards is equipped with the clearance with between the first port and the second port.

Preferably, the second connecting assembly comprises a first fixing plate and a second fixing plate, a sliding groove is arranged between the first fixing plate and the second fixing plate, and when the circuit board is connected with the bottom cover, the circuit board is connected with the sliding groove.

Preferably, the bottom cover comprises a bottom plate and baffle plates respectively connected with two sides of the bottom plate, the baffle plates are arranged in an upward protruding mode relative to the bottom plate, the first connecting parts are located on the bottom plate, a plurality of fixed mounting holes are further formed in the bottom plate, and the second connecting components are located on the inner side walls of the baffle plates.

Preferably, the baffle is equipped with the lug on the one end that upwards protrudes the setting, be equipped with on the lug follow a plurality of joint grooves that the lug lateral wall runs through to the inside wall, the top cap include the roof and for two curb plates that the roof symmetry set up, be equipped with a plurality of joint pieces on the curb plate, works as the top cap with when the bottom is connected, the curb plate with the lateral wall of lug is connected, the joint piece with the joint groove is connected, the joint piece certainly the lateral wall of lug to the inside wall indent setting of lug.

Preferably, the two ends of the bottom plate are respectively provided with a first mounting groove and a second mounting groove, the first mounting grooves and the second mounting grooves are arranged at intervals, and the length ratio of the first mounting grooves to the second mounting grooves is (1-1.5): (1-1.5).

Preferably, a plurality of connecting plates are arranged on the outer side wall of the baffle, the plurality of connecting plates are arranged at intervals, and the intervals among the plurality of connecting plates are the same.

Preferably, the first connecting components are multiple, and the circuit board and the second connecting components are located between the two first connecting components.

The beneficial effects of the invention are as follows: the ballast shell provided by the invention is mainly aimed at a shell radiating by adopting the radiating glue, so that the radiating effect is improved to a certain extent, and the overflow of the radiating glue can be prevented.

Drawings

The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intentionally drawn to scale on actual size or the like, with emphasis on illustrating the principles of the invention.

Fig. 1 is a schematic cross-sectional view of a specific structure of a ballast housing according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a specific structure of a top cover according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a specific structure of a bottom cover according to an embodiment of the present invention;

FIG. 4 is an enlarged view of a portion A of FIG. 3;

in the figure: 1-top plate, 11-side plate, 12-clamping block, 13-glue filling hole, 14-connecting hole, 15-bending plate, 16-transverse plate, 17-first inclined plate, 2-first port, 21-second port, 22-epoxy plate, 3-bottom plate, 31-baffle, 32-bump, 33-clamping groove, 34-connecting plate, 35-second connecting component, 36-first mounting groove, 37-second mounting groove, 38-groove, 39-second inclined plate, 4-second fixed plate, 5-sliding groove and 6-first fixed plate.

Detailed Description

In order that the invention may be understood more fully, the invention will be described with reference to the accompanying drawings.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to and integrated with the other element or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-4, an embodiment of the present invention provides a ballast housing, including a bottom cover and a top cover that are connected in a matching manner, and a circuit board that is connected in a matching manner to the bottom cover, wherein the circuit board is provided with a first port 2, a second port 21 and an epoxy board, the first port 2 and the second port 21 are respectively located at two ends of the circuit board, the epoxy board is located between the first port 2 and the second port 21, a first connection component is provided on the bottom cover, a first connection portion is provided on the top cover, when the top cover is connected to the bottom cover, the first connection portion is connected to the first connection component, a second connection component 35 is provided on the bottom cover that is connected in a matching manner to the circuit board, a glue filling hole 13 is provided on the top cover, and a connection hole 14 is also provided on the top cover that is connected in a matching manner to the first port 2 and the second port 21.

Referring to fig. 1 to 4, the ballast housing provided by the present invention is formed by firstly connecting a circuit board with a second connecting component 35 of a bottom cover in a matching manner, and firstly fixedly connecting the bottom cover with a top cover, specifically: the first connecting part of the top cover is matched and connected with the first connecting component of the bottom cover, then the first port 2 and the second port 21 are matched and connected with the corresponding connecting holes 14 on the top cover, the circuit board is completely sealed through the first connecting part and the first connecting component, so that overflow or leakage of the circuit board is prevented when the heat dissipation glue is poured, the heat dissipation glue is blocked by adopting the epoxy board, when the heat dissipation glue is poured, only the glue pouring holes 13 are manually or mechanically aligned, then the heat dissipation glue is poured, when the heat dissipation glue flows into the circuit board through the glue pouring holes 13, the heat dissipation glue flows onto the circuit board firstly, then the heat dissipation glue is dispersed from the center of the circuit board towards the periphery, when the heat dissipation glue slowly fills the bottom of the whole circuit board, or the capacity of the heat dissipation glue is preset, (the heat dissipation glue mainly dissipates heat of electronic components).

The beneficial effects of the invention are as follows: the electronic components on the circuit board are separated from the first port 2 and the second port 21 through the epoxy plate, and the heat dissipation glue is prevented from overflowing to the outside of the shell through the cooperation of the first connecting component and the first connecting part, so that the normal use and the heat dissipation efficiency of the ballast are ensured to a certain extent, and the cost of the ballast shell is lower compared with that of the traditional ballast shell adopting a radiator and an exhaust fan.

Referring to fig. 1-2, in a preferred embodiment, the first connection portion includes a first inclined plate 17 and a transverse plate 16 connected to each other, the first connection assembly includes a groove 38, an inlet of the groove 38 is provided with a second inclined plate 39, and when the first connection portion is connected to the first connection assembly, the first inclined plate 17 and the second inclined plate 39 abut against each other, and the transverse plate 16 is connected to the groove 38. The angle between the first inclined plate 17 and the transverse plate 16 and the angle between the second inclined plate 39 and the groove 38 (100-150 deg.) are identical, or the error is 1-5 deg., by the cooperation of the first connection portion and the first connection assembly, on the one hand, the tightness of the housing can be ensured, and at the same time, the heat-dissipating glue can be placed to overflow from the circuit board, when the first connection portion is connected with the first connection assembly, the end of the transverse plate 16 and the bottom wall of the groove 38 abut against each other (that is, the size of the transverse plate 16 and the size of the groove 38 are matched).

Referring to fig. 1-2, in a preferred embodiment, the top cover includes a top plate 1, two side plates 11 symmetrically disposed with respect to the top plate 1, and two bending plates 15 symmetrically disposed with respect to the top plate 1, the glue filling hole 13 is located on the top plate 1, the first connecting portion is located on the bending plate 15, the bending plate 15 further includes a first bending portion, one end of the first bending portion is connected with the top plate 1, the other end of the first bending portion is connected with the first connecting portion, the connecting hole 14 is located on the first bending portion, the connecting hole 14 is located close to the first connecting portion, the two side plates 11 symmetrically disposed with respect to the top plate 1 and the two bending plates 15 symmetrically disposed with respect to the top plate 1 are both rotatable with respect to the transverse axis of the top plate 1, the two bending plates 15 and the side plates 11 are both rotatable with respect to the longitudinal axis of the top plate 1, and the connecting hole 14 is mainly used for connecting the first port 2 and the second port 21.

Referring to fig. 1, in a further preferred embodiment, the circuit board further includes a plurality of electronic components, the plurality of electronic components are located between two epoxy boards, the two epoxy boards are each disposed protruding upward from the circuit board, and sidewalls of the two epoxy boards are disposed in close proximity to the first port 2 and the second port 21, or a gap is disposed between sidewalls of the two epoxy boards and the first port 2 and the second port 21. The electronic component comprises a plurality of capacitors, the capacitors are metallized polypropylene film capacitors, the metallized polypropylene film is used as dielectrics and electrodes, the wires are encapsulated by tin-plated copper clad steel wires and flame-retardant epoxy resin, the capacitors have the advantages of small high-frequency loss and good self-healing property, the capacitors are used in filtering, noise reduction, pulse, resonance and resistance-capacitance voltage reduction circuits, the capacitors are used in circuits with high frequency, high current and high stability, and the electronic component further comprises piezoresistors, wherein the piezoresistors are voltage-limiting type protection devices. By utilizing the nonlinear characteristic of the piezoresistor, when the overvoltage occurs between two poles of the piezoresistor, the piezoresistor can clamp the voltage to a relatively fixed voltage value, so that the protection of a subsequent circuit is realized. The main parameters of the piezoresistor are as follows: voltage-sensitive voltage, current capacity, junction capacitance, response time, etc. The response time of the piezoresistor is ns-level, is faster than that of the air discharge tube and is slightly slower than that of the TVS tube, and the response speed of the overvoltage protection for the electronic circuit can meet the requirement under the general condition. The junction capacitance of piezoresistors is typically in the order of magnitude of hundreds to thousands Pf; the piezoresistor has the functions that: the piezoresistor is characterized in that when the voltage applied to the piezoresistor is lower than a threshold value 'UN', the current flowing through the piezoresistor is extremely small and corresponds to a closed valve, and when the voltage exceeds the UN, the resistance value of the piezoresistor is reduced, so that the current flowing through the piezoresistor is increased sharply and the influence on other circuits is not greatly changed, and the influence of overvoltage on a subsequent sensitive circuit is reduced. With this function, abnormal overvoltage which often occurs in the circuit can be suppressed, and the circuit can be protected from the overvoltage.

The epoxy board is an insulating material, and aims to prevent the heat-dissipating glue from overflowing outwards when the heat-dissipating glue is filled, so that the fluidity of the glue is effectively blocked. The epoxy board can be 3240, FR4 and G11 epoxy boards, and is mainly selected according to the actual circuit board.

Referring to fig. 4, in a further preferred embodiment, the second connection assembly 35 includes a first fixing plate 6 and a second fixing plate 4, a sliding groove 5 is provided between the first fixing plate 6 and the second fixing plate 4, and when the circuit board is connected to the bottom cover, the circuit board is connected to the sliding groove 5. The first fixing plate 6 and the second fixing plate 4 are used for connecting the circuit board and the bottom cover, so that on one hand, the working efficiency is improved during installation, and meanwhile, when the circuit board is damaged or the heat dissipation glue is insufficient and the circuit board and the components are required to be supplemented or replaced, the working complexity is reduced.

Referring to fig. 3-4, in a preferred embodiment, the bottom cover includes a bottom plate 3 and a baffle plate 31 respectively connected to two sides of the bottom plate 3, the baffle plate 31 protrudes upward relative to the bottom plate 3, the first connecting portion is located on the bottom plate 3, a plurality of fixing mounting holes are further formed in the bottom plate 3, and the second connecting assembly 35 is located on an inner sidewall of the baffle plate 31. The fixed mounting holes are mainly used for fixing the ballast and other equipment.

Referring to fig. 1 and 3, in a further preferred embodiment, a protruding block 32 is disposed at an end of the baffle 31 protruding upward, a plurality of clamping grooves 33 penetrating from an outer side wall to an inner side wall of the protruding block 32 are disposed on the protruding block 32, the top cover includes a top plate 1 and two side plates 11 symmetrically disposed with respect to the top plate 1, a plurality of clamping blocks 12 are disposed on the side plates 11, when the top cover is connected with the bottom cover, the side plates 11 are connected with an outer side wall of the protruding block 32, the clamping blocks 12 are connected with the clamping grooves 33, and the clamping blocks 12 are disposed from the outer side wall of the protruding block 32 to an inner side wall of the protruding block 32. The clamping block 12 and the clamping groove 33 are adopted to strengthen and fix the top cover and the bottom cover, so that the tightness of the ballast is ensured to a certain extent, and the effect of quickly disassembling the shell can be realized.

Referring to fig. 1 and 3, in a preferred embodiment, the two ends of the bottom plate 3 are respectively provided with a first mounting groove 36 and a second mounting groove 37, the first mounting groove 36 and the second mounting groove 37 are arranged at intervals, and the length ratio of the first mounting groove 36 to the second mounting groove 37 is (1-1.5): (1-1.5). The first mounting groove 36 and the second mounting groove 37 are mainly used for improving the fixity when equipment such as a ballast, a fluorescent lamp and the like are matched, and the specific length ratio of the first mounting groove 36 to the second mounting groove 37 is (1-1.1): (1.2-1.5), (1): (1.2), (1.1): (1.3).

Referring to fig. 1 and 3, in a preferred embodiment, a plurality of connection plates 34 are disposed on the outer sidewall of the baffle 31, the plurality of connection plates 34 are disposed at intervals, and the intervals between the plurality of connection plates 34 are the same. The plurality of connection plates 34 are spaced apart to provide fixation (i.e., to enhance fixation when the fluorescent lamp or other device is mounted in a mating manner).

Referring to fig. 1, in the preferred embodiment, the first connecting members are plural, and the circuit board and the second connecting member 35 are located between the two first connecting members. The tightness of the circuit board is ensured to a certain extent, so that the heat dissipation glue is ensured not to flow to the outside.

The beneficial effects of the invention are as follows: the invention provides a ballast shell, which mainly aims at a shell radiating by adopting radiating glue, improves the radiating effect to a certain extent and can also prevent the radiating glue from overflowing.

In this specification, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to the terms "preferred embodiment," "further embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims

1. The ballast shell is characterized by comprising a bottom cover and a top cover which are connected in a matching way, and a circuit board which is connected in a matching way with the bottom cover, wherein the circuit board is provided with a first port, a second port and an epoxy board;

the first connecting part comprises a first inclined plate and a transverse plate which are connected with each other, the first connecting component comprises a groove, a second inclined plate is arranged at the inlet of the groove, when the first connecting part is connected with the first connecting component, the first inclined plate is mutually abutted with the second inclined plate, and the transverse plate is connected with the groove;

the top cover comprises a top plate, two side plates symmetrically arranged relative to the top plate and two bending plates symmetrically arranged relative to the top plate, the glue filling hole is formed in the top plate, the first connecting portion is formed in the bending plates, the bending plates further comprise first bending portions, one ends of the first bending portions are connected with the top plate, the other ends of the first bending portions are connected with the first connecting portions, the connecting hole is formed in the first bending portions, and the connecting hole is tightly arranged on the first connecting portions.

2. The ballast housing according to claim 1, wherein the circuit board further comprises a plurality of electronic components, the plurality of electronic components being located between two epoxy boards, the two epoxy boards each protruding upward from the circuit board, the sidewalls of the two epoxy boards being disposed in close proximity to the first port and the second port, or a gap being provided between the sidewalls of the two epoxy boards and the first port and the second port.

3. The ballast housing of claim 1, wherein the second connection assembly includes a first fixing plate and a second fixing plate, a sliding groove is provided between the first fixing plate and the second fixing plate, and the circuit board is connected with the sliding groove when the circuit board is connected with the bottom cover.

4. The ballast housing of claim 1, wherein the bottom cover includes a bottom plate and a baffle plate respectively connected to both sides of the bottom plate, the baffle plate is disposed to protrude upward with respect to the bottom plate, the first connection assembly is disposed on the bottom plate, a plurality of fixing mounting holes are further disposed on the bottom plate, and the second connection assembly is disposed on an inner sidewall of the baffle plate.

5. The ballast housing according to claim 4, wherein a bump is provided at one end of the baffle protruding upward, a plurality of engaging grooves extending from the outer side wall to the inner side wall of the bump are provided on the bump, the top cover comprises a top plate and two side plates disposed symmetrically with respect to the top plate, a plurality of engaging blocks are provided on the side plates, when the top cover is connected with the bottom cover, the side plates are connected with the outer side wall of the bump, the engaging blocks are connected with the engaging grooves, and the engaging blocks are disposed from the outer side wall of the bump to the inner side wall of the bump.

6. The ballast housing as set forth in claim 4, wherein the base plate is provided at both ends thereof with a first mounting groove and a second mounting groove, respectively, which are provided at an interval therebetween, the first mounting groove and the second mounting groove having a length ratio of (1-1.5): (1-1.5).

7. The ballast housing according to claim 4, wherein a plurality of connection plates are provided on an outer sidewall of the baffle plate, the plurality of connection plates are disposed at intervals, and intervals between the plurality of connection plates are the same.

8. The ballast housing according to claim 1, wherein the first connection assembly is plural, and the circuit board and the second connection assembly are each located between the two first connection assemblies.