CN1153290C - Arrangement method with uniformly distributed current for preventing electrostatic discharge - Google Patents
Arrangement method with uniformly distributed current for preventing electrostatic discharge Download PDFInfo
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- CN1153290C CN1153290C CNB011118873A CN01111887A CN1153290C CN 1153290 C CN1153290 C CN 1153290C CN B011118873 A CNB011118873 A CN B011118873A CN 01111887 A CN01111887 A CN 01111887A CN 1153290 C CN1153290 C CN 1153290C
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Abstract
The present invention provides a novel method for the arrangement of electrostatic discharge (ESD) protection, which can make a 0CMOS element have the characteristic of uniform current distribution and can greatly improve the electrostatic discharge voltage withstanding property of a CMOS element in a sub-micron manufacturing process. The CMOS transistor structure of the present invention comprises a semiconductor substrate with a P well or an N well, a grid electrode structure between a drain electrode and a source electrode, a light doping drain electrode region positioned in the P well or the N well, and an electrostatic discharge provided region with the same electric polarity as the P well or the N well, wherein the electrostatic discharge arranging region is formed under the drain electrode region and is coiled upwards to correspond to the drain electrode region of a drain electrode contact point.
Description
Technical control
The present invention is the method for arranging of a kind of static discharge (static discharge) protection, utilizes this method can make semiconductor element have the equally distributed characteristic of electric current under the static discharge overvoltage, so can promote the static discharge tolerance of semiconductor element.
Background technology
Electrostatic discharge effect is an important topic of current semiconductor integrated circuit reliability, along with the microminiaturization of MOS element enters the field that is far more than sub-micron, the easier destruction that is subjected to static discharge of the grid oxic horizon that thickness is thinner, for present commercial size, according to the manikin (humanbody model) of static discharge, pin is gone in the output of IC product must be able to bear 2000 volts of above static discharge voltages.So the output of IC is located all must dispose electrostatic storage deflection (ESD) protection circuit with input weld zone (pad).
In the output buffer of CMOS IC, the NMOS and the PMOS element of output often are designed to have bigger element length-width ratio (W/L), so that provide enough electric currents to output loading, this large-sized output NMOS and PMOS itself promptly can be used as protecting component for electrostatic discharge.For example, in 0.35 micron MOS manufacture process, length-width ratio W/L is that the specific electrostatic discharge protective design of the output NMOS cooperation of 300/0.5 (micron/micron) can be born the electrostatic potential greater than 2000 volts.A kind of method of promoting the static discharge withstand voltage properties of output NMOS and PMOS promptly is the layout that adds static discharge in manufacture process.
An output NMOS component structure as shown in Figure 1, its layout then as shown in Figure 2.In order to promote the withstand voltage properties to static discharge, the layout of output NMOS all has the interval SDG of broad usually, and this SDG value is about about 3～5 microns.In being far more than the CMOS manufacture process of sub-micron, NMOS (or PMOS) all is formed with a light dope drain region structure to overcome the hot carrier effect of jitty device.Yet, light dope drain region structure is equivalent in the structure that forms a similar tip near the place, drain region of channel surface, when NMOS is subjected to the discharge of static discharge, this static discharge current promptly can through the drain region and concentrate by in structure place, light dope drain region and conducting to the source electrode of ground connection, this promptly as shown in Figure 3, the zone of light dope drain region all is a degree of depth～0.02 micron shallow junction (shallow junction) approximately usually, a biasing electric field that its tool is the highest and a cutting-edge structure, die static discharge very easily through zone discharge thus, thereby cause the damage of element.
For improving the static discharge withstand voltage properties of output NMOS, known method is to increase by an extra static discharge to arrange manufacture process so that form a drain region that does not have a light dope drain region cutting-edge structure in the CMOS manufacture process, and these are promptly shown in Fig. 4 and 5.This kind do not possess the drain region of light dope drain region structure all can bear higher static discharge voltage usually, and its static discharge forms before or after arranging and can forming at the separator of grid oxic horizon.This type of known method all has disclosed in many United States Patent (USP) cases, as United States Patent (USP) case the 5th, 416, No. 036 (the invention people is C.C.Hsue), the 5th, 455, No. 444 (C.C.Hsue), the 5th, 496, No. 751 (Y.H.Wei), the 5th, 529, No. 941 (T.Y.Huang), the 5th, 585, No. 299 (C.C.Hsue), the 5th, 672, No. 527 (Lee), and the 5th, 733, No. 794 (P.Gilbert etc.).As shown in Figure 4, light dope drain region structure is to be contained in one to be arranged in the formed extra n-quadrant by static discharge, perhaps, also can not comprise light dope drain region structure, so, suitably adjust the interval of drain contact and grid again, can prevent that NMOS from damaging because of the static discharge that light dope drain region cutting-edge structure is caused.Yet with respect to the MOSFET that generally has light dope drain region structure, this kind method but can cause thermoelectronic effect, or short element useful life.
For NMOS with light dope drain region structure; the another kind of known method of promoting the static discharge withstand voltage properties is a knot of managing to form a low breakdown voltage below drain diffusion regions; so; static discharge current promptly can transfer to pass through this knot earlier but not above-mentioned light dope drain region cutting-edge structure, thereby reaches the purpose of protection component.Promptly shown in Fig. 6 and 7, its tie region under drain contact is implanted the P+ material of a high-concentration dopant for this, so can reduce the puncture voltage of this tie region.As shown in Figure 7, this static discharge arrange the district only the position under drain contact, comprise the centre of the drain region of knot, the puncture voltage of this knot depends on the p at this p-n junction place and the doping content of n type diffusion region.For example, one 0.25 microns with 3.3 volts CMOS manufacture process in, the output NMOS that originally has light dope drain region structure has about 8 volts puncture voltage, if this is exported the layout that NMOS imposes P+ (boron), then Jie puncture voltage can be reduced to about about 5 volts.So,, can in output NMOS, form the knot of a low breakdown voltage really effectively though the tie region that this kind static discharge is arranged has increased the mask exposure manufacture process one.This type of is improved one's methods and is disclosed in the United States Patent (USP) case the 5th, 374, No. 565 (the invention people is C.C.Hsue), the 5th, 581, No. 104 (A.Lowrey and R.W.Chance), the 5th, 674, No. 761 (K.Z.Chang), and the 5th, 953, No. 601 (R.Y.Shiue etc.).The current paths for ESD stress currents of this kind design as shown in Figure 8, the tie region of position below drain contact arranges to have lower puncture voltage because of static discharge, so earth terminal that static discharge current all tends to concentrate on this zone and flows to substrate, therefore, this static discharge in shallow junction is arranged that the district promptly easily produces high heat and the metal material of drain contact is melted, the metal material of this thawing also flows downward and forms the phenomenon of so-called " contact damage " (contact spiking), thereby causes the breaking-up of element.
Summary of the invention
Main purpose of the present invention provides the new method that a kind of static discharge is arranged, the method that this electrostatic discharge protective is arranged can make cmos element have the equally distributed characteristic of electric current under the static discharge overvoltage, so, can greatly promote the withstand voltage properties of cmos element to static discharge for being far more than the sub-micron manufacture process.The electrostatic discharge protective method for arranging that this has the even distribution character of electric current comprises the following step: provide one to have the Semiconductor substrate of P trap or N well structure; Form a complementary field-effect transistor in the P of this Semiconductor substrate trap or N trap, this field-effect transistor is to comprise grid, drain region and source region, and this grid comprises: a grid oxic horizon, is positioned at the gate electrode on this grid oxic horizon and is formed at the separator of these grid two sidewalls; Adjacent with this source region respectively light dope drain region of formation below this gate isolation with the drain region, and this light dope drain region has identical conduction type with this drain region; Form static discharge layout and distinguish under this drain region, this static discharge arranges that the district has and this P trap or the identical conduction type of N trap, and around vertical drain region corresponding to this drain contact.
For reaching this purpose, CMOS transistor arrangement provided by the present invention comprises one and has the Semiconductor substrate of P trap or N trap, one between the drain electrode and source electrode between grid structure, one is arranged in the zone, light dope drain region of P trap or N trap, and a static discharge layout area that has with P trap or N trap identical polar, this zone is formed under the drain region and around upwards corresponding to the drain region of drain contact.
Description of drawings
Fig. 1 is the drawing in side sectional elevation with known NMOS of light dope drain region structure.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the current paths for ESD stress currents figure with known NMOS of light dope drain region structure.
Fig. 4 has the known static discharge method for arranging that the N type mixes.
Fig. 5 is the vertical view of Fig. 4.
Fig. 6 has the known static discharge method for arranging that the P type mixes.
Fig. 7 is the vertical view of Fig. 6.
Fig. 8 is the current paths for ESD stress currents figure with known P type static discharge layout elements of P type doping.
Fig. 9 is in the first embodiment of the present invention, the drawing in side sectional elevation that P type static discharge is arranged.
Figure 10 is the vertical view of Fig. 9.
Figure 11 is in the first embodiment of the present invention, the drawing in side sectional elevation of static discharge current discharge path.
Figure 12 is in the first embodiment of the present invention, the vertical view of a layout type.
Figure 13 is in the first embodiment of the present invention, the vertical view of a layout type.
Figure 14 is the schematic diagram that the present invention is applied to one 1.8 volts/3.3 volts of output/input circuits.
Figure 15 is in the first embodiment of the present invention, is applied to the schematic diagram of the stacked NMOS of 1.8 volts/3.3 volts of output/input circuits.
Figure 16 is in the second embodiment of the present invention, the drawing in side sectional elevation of a P type static discharge method for arranging.
Figure 17 is in the second embodiment of the present invention, P type static discharge method for arranging is applied to the drawing in side sectional elevation of a field oxide element.
Figure 18 is in the second embodiment of the present invention, the drawing in side sectional elevation of a P type static discharge method for arranging.The drawing reference numeral explanation:
101～separator, 102～drain contact, 103～source region, 104～drain region, 105～static discharge is arranged the district, and 106～static discharge is arranged the district, and 107～static discharge is arranged district, 201～drain contact, 301～drain contact.
In addition, " drain electrode "～2 among Fig. 1,2,3,4,5,6,7,8,9,10,11,12,13,15,16,17,18, " grid "～4, " source electrode "～3; " P trap "～10 among Fig. 1,3,4,6,8,9,11,16,17,18, " P type substrate "～1; Drain contact among Fig. 2,3,10 "～102; " ESD layout area "～105 among Fig. 4,7,10,11,12,15; " (ESD layout) "～(205) among Fig. 4; " junction breakdown position "～5 among Fig. 8,11; " the ESD electric current is gathered under the drain contact, cause contact metal to melt easily and infiltrate in the silicon materials downwards " among Fig. 8～6; " N trap "～20 among Figure 16,17,18.
Embodiment
Fig. 9 arranges that in order to the static discharge that shows a NMOS element Figure 10 then is its relative layout type.
Shown in Fig. 9 and 10, according to the first embodiment of the present invention, a NMOS element with electrostatic discharge protective design comprises grid structure, the one source pole zone 103 and with separator 101 and is positioned at drain region 104 under the drain contact 102.Separator 101 times and be formed with zone, a light dope drain region.For example, formation can be implanted such as phosphorus or arsenic ion in this zone, light dope drain region, and its employed energy and implant dosage then are a known technology.
Consult Fig. 9 and 10,104 times formation one P type static discharges are arranged district 105 in the drain region, and its doping content is greater than the doping content of P trap.Consult layout vertical view shown in Figure 10, static discharge arranges that district 105 is to form around drain contact, perhaps, as shown in figure 12, also this static discharge can be arranged the district forms a plurality of squares zone, utilize the even distribution mode in this kind square zone, then the static discharge current through drain region 104 promptly has preferable CURRENT DISTRIBUTION, the heat that the former discharge of dissipate it is effectively caused also gets final product the withstand voltage properties of lift elements to static discharge.3 of Fig. 1 are the variations of another kind of layout, and in this example, static discharge arranges that the district is constituted with two rectangular areas and a plurality of square zone, and it also has the effect that even distribution static discharge current has dispelled the heat.Arrange that at static discharge the doping content of distinguishing in 105 is because of than other drain region being height, so its formed pn knot has lower puncture voltage relatively, drain contact 102 belows, static discharge arrange that district's 105 other drain junction region then keep normal puncture voltage, so its current paths for ESD stress currents will be as shown in figure 11, that is, the one static discharge high voltage that imposes on an output NMOS will be scattered in drain contact 102 and static discharge is arranged the tie region in 105 in district, and is guided to the earth terminal VSS of NMOS.The more known static discharge arrangement of current path shown in Figure 11 has more wide CURRENT DISTRIBUTION zone, thus electric current not reason concentrate on the tie region under the drain contact 102 and the phenomenon that easily causes contact to damage.
Figure 14 is the schematic diagram that the present invention is applied to one 1.8 volts/3.3 volts of output/input circuits.Static discharge shown in Fig. 14 arranges that district 106 can be far more than the static discharge withstand voltage properties of 1.8 volts/3.3 volts of I/O circuit of sub-micron CMOS IC in order to lifting.Figure 15 then is the layout of this stacked NMOS (Mn1 and Mn2) among Figure 14; wherein; the polysilicon gate of Mn1 and Mn2 is close each other; static discharge arranges that the district then is disposed between the polysilicon gate of drain contact and Mn1; so; when one static discharge high voltage took place place, I/O weld zone, static discharge arranged that district 106 can give full play to the effect that it protects this stacked NMOS.
Consult Figure 16, according to a second embodiment of the present invention, except the static discharge identical with first embodiment arranged district 107, and further under drain contact 201, add an extra N trap, this N trap is compared to normal drain junction (about 0.15 micron of junction depth) and has profound junction depth (about 2 microns), so can reduce the damage effect of drain contact significantly, that is this static discharge arrangement can further increase the static discharge withstand voltage properties of element.
Above-described static discharge arrangement also can be applied to the element (FOD) with field oxide (field-oxide), to promote its static discharge withstand voltage properties.For example, N type FOD as shown in figure 17, drain junction except the position the zone under the drain contact 301, all impose aforesaid static discharge and arrange manufacture process, further, this FOD also can form an above-mentioned extra N trap, to overcome the damage effect of drain contact.In Figure 16 and 17, N well area that this is extra and static discharge are arranged the 107 overlapped zones that also can have as shown in figure 18, district, so that disperse the static discharge discharging current, and increase the elasticity on the layout.
The description that more than utilizes embodiment and done is a content of the present invention for convenience of description, but not with narrow sense of the present invention be limited to this embodiment.Allly do not deviate from any change that spirit of the present invention is done, all belong to claim scope of the present invention.
Claims (5)
1. electrostatic discharge protective method for arranging with the even distribution character of electric current comprises the following step:
Provide one to have the Semiconductor substrate of P trap or N well structure;
Form a complementary field-effect transistor in the P of this Semiconductor substrate trap or N trap, this field-effect transistor is to comprise grid, drain region and source region, and this grid comprises: a grid oxic horizon, is positioned at the gate electrode on this grid oxic horizon and is formed at the separator of these grid two sidewalls;
The light dope drain region that separator formation below this gate isolation is adjacent with the drain region with this source region respectively, and this light dope drain region has identical conduction type with this drain region;
Form static discharge layout and distinguish under this drain region, this static discharge arranges that the district has and this P trap or the identical conduction type of N trap, and around vertical drain region corresponding to this drain contact.
2. the electrostatic discharge protective method for arranging with the even distribution character of electric current as claimed in claim 1, wherein, this static discharge arranges that the district forms a plurality of rectangular areas, and these a plurality of rectangular areas are along the both sides arranged spaced of this drain region.
3. the electrostatic discharge protective method for arranging with the even distribution character of electric current as claimed in claim 1, wherein, this static discharge arranges that the district is pectination configuration.
4. electrostatic discharge protective method for arranging with the even distribution character of electric current comprises the following step:
Provide one to have the Semiconductor substrate of a P trap or N well structure;
Form a complementary field-effect transistor in a P trap or N trap of this Semiconductor substrate, this field-effect transistor comprises grid, drain electrode and source electrode, and this grid then comprises: a grid oxic horizon, is positioned at the gate electrode on this grid oxic horizon and is formed at the separator of these grid two sidewalls;
Form one the 2nd N trap or P trap, under this drain contact, and the conductivity type opposite of the conduction type of this second trap and this first trap;
The light dope drain region that separator formation below this gate isolation is adjacent with the drain region with this source region respectively, and this light dope drain region has identical conduction type with this drain electrode;
Form static discharge layout and distinguish under this drain region, this static discharge arranges that the district has and a P trap or the identical conduction type of N trap, and around vertical drain region corresponding to this drain contact.
5. the electrostatic discharge protective method for arranging with the even distribution character of electric current as claimed in claim 4, wherein, the 2nd N trap or P trap be with this static discharge arrange distinguish from or local overlapping.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB011118873A CN1153290C (en) | 2001-03-23 | 2001-03-23 | Arrangement method with uniformly distributed current for preventing electrostatic discharge |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB011118873A CN1153290C (en) | 2001-03-23 | 2001-03-23 | Arrangement method with uniformly distributed current for preventing electrostatic discharge |
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| CN1153290C true CN1153290C (en) | 2004-06-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449750C (en) * | 2005-06-01 | 2009-01-07 | 国际商业机器公司 | Semiconductor structure and manufacture method thereof |
| US8921941B2 (en) | 2010-08-05 | 2014-12-30 | Mediatek Inc. | ESD protection device and method for fabricating the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1331226C (en) * | 2004-01-07 | 2007-08-08 | 世界先进积体电路股份有限公司 | High voltage assembly structure with high static discharge protective tolerance capacity |
| CN1316618C (en) * | 2004-03-31 | 2007-05-16 | 矽统科技股份有限公司 | Semiconductor device, electrostatic discharging protection device and its making method |
| CN100341150C (en) * | 2004-05-18 | 2007-10-03 | 联华电子股份有限公司 | electrostatic discharge protection assembly structure having low trigger voltage characteristics |
| US7875933B2 (en) * | 2005-03-29 | 2011-01-25 | Infineon Technologies Ag | Lateral bipolar transistor with additional ESD implant |
| US7217984B2 (en) * | 2005-06-17 | 2007-05-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Divided drain implant for improved CMOS ESD performance |
| DE102005028919B4 (en) * | 2005-06-22 | 2010-07-01 | Infineon Technologies Ag | Method for producing an electronic component and electronic component |
| US7855419B2 (en) * | 2006-06-15 | 2010-12-21 | Himax Technologies Limited | ESD device layout for effectively reducing internal circuit area and avoiding ESD and breakdown damage and effectively protecting high voltage IC |
| CN106158956B (en) * | 2015-04-08 | 2020-02-11 | 无锡华润上华科技有限公司 | LDMOSFET with RESURF structure and manufacturing method thereof |
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2001
- 2001-03-23 CN CNB011118873A patent/CN1153290C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449750C (en) * | 2005-06-01 | 2009-01-07 | 国际商业机器公司 | Semiconductor structure and manufacture method thereof |
| US8921941B2 (en) | 2010-08-05 | 2014-12-30 | Mediatek Inc. | ESD protection device and method for fabricating the same |
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| CN1377087A (en) | 2002-10-30 |
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