CN115327328B - Ultrasonic detection method and device for interface defects of asymmetric epoxy-conductor insert - Google Patents

Ultrasonic detection method and device for interface defects of asymmetric epoxy-conductor insert Download PDF

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CN115327328B
CN115327328B CN202211264660.1A CN202211264660A CN115327328B CN 115327328 B CN115327328 B CN 115327328B CN 202211264660 A CN202211264660 A CN 202211264660A CN 115327328 B CN115327328 B CN 115327328B
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detection
ultrasonic
epoxy
probe
conductor insert
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CN115327328A (en
Inventor
庞小峰
郝艳捧
张滢滢
姚聪伟
孙帅
李兴旺
赵晓凤
王增彬
李盈
杨贤
刘建明
刘琳
陈祖伟
蔡玲珑
邰彬
李端姣
黄盛龙
米鸿儒
梁学致
梁卓毅
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Guangdong Power Grid Co Ltd
Electric Power Research Institute of Guangdong Power Grid Co Ltd
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Guangdong Power Grid Co Ltd
Electric Power Research Institute of Guangdong Power Grid Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1209—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing using acoustic measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
    • G01R31/1254—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of gas-insulated power appliances or vacuum gaps

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

The invention discloses an ultrasonic detection method and device for interface defects of an asymmetric epoxy-conductor insert. Compared with the prior art that ultrasonic detection is directly adopted, the moving control of the ultrasonic detection device is carried out by acquiring the ultrasonic detection path, so that the missing detection and the false detection of the interface defect of the asymmetric epoxy-conductor insert can be avoided, and the accuracy of the ultrasonic detection of the interface defect of the asymmetric epoxy-conductor insert is improved.

Description

Ultrasonic detection method and device for interface defects of asymmetric epoxy-conductor insert
Technical Field
The invention relates to the field of power transmission and transformation insulating equipment, in particular to an ultrasonic detection method and device for interface defects of an asymmetric epoxy-conductor insert.
Background
The gas insulated metal-enclosed switchgear (GIS) is a metal enclosed switchgear which totally or partially adopts insulating gas rather than air under atmospheric pressure as an insulating medium in an electric power system, a basin-type insulator is a weak link of the GIS, faults caused by the basin-type insulator occupy a large proportion in equipment insulation faults, wherein an epoxy-conductor insert interface is an area with concentrated electric, thermal and force ratios, the interface effect is prominent, interface defects easily occur, local discharge and insulation damage of the basin-type insulator are caused, and the safe and stable operation of the GIS is seriously threatened.
At present, methods commonly used for detecting faults of the basin-type insulator include an ultrahigh frequency method, an ultrasonic partial discharge detection method, an X-ray detection method, an ultrasonic detection method and the like. The ultrahigh frequency method and the ultrasonic partial discharge detection method can be used for detecting GIS equipment in operation, and can judge the fault defect type by detecting electromagnetic physical signals generated along with partial discharge, but are easily interfered by other signals. The X-ray detection technology is mature, the detection efficiency is high, but the detection cost is high, and the detection sensitivity to defects is limited. The ultrasonic detection technology can be used for detecting the defects of the insulator by virtue of the advantages of simple and convenient operation, high detection sensitivity, no damage and the like. However, due to the complex curvature of the epoxy part at the frequently-occurring fault position of the basin-type insulator, for example, the structure of the 110kV three-phase common-box basin-type insulator interface is asymmetric, the defect detection difficulty is high, and detection errors are easy to occur when ultrasonic detection is directly carried out. Therefore, the interface defect detection of the 110kV three-phase common-box basin-type insulator is often not accurate enough.
Therefore, an ultrasonic detection strategy for the interface defect of the asymmetric epoxy-conductor insert is needed to solve the problem of low accuracy of the interface defect detection of the 110kV three-phase common-box basin-type insulator.
Disclosure of Invention
The embodiment of the invention provides an ultrasonic detection method and device for interface defects of an asymmetric epoxy-conductor insert, which are used for improving the accuracy of interface defect detection of a 110kV three-phase common-box basin-type insulator.
In order to solve the above problems, an embodiment of the present invention provides an ultrasonic testing method for an interface defect of an asymmetric epoxy-conductor insert, including:
obtaining structural data of a target epoxy-conductor insert;
obtaining an ultrasonic detection path required by the ultrasonic detection device when the target epoxy-conductor insert is detected according to the structural data and the size of a probe of the ultrasonic detection device;
controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path to obtain ultrasonic detection data;
and when the ultrasonic detection data is determined to have abnormal data, determining the defect position of the target epoxy-conductor insert interface according to the abnormal data in the ultrasonic detection data.
As an improvement of the above solution, before obtaining the ultrasonic testing path required by the ultrasonic testing apparatus when testing the target epoxy-conductor insert according to the structural data and the probe size of the ultrasonic testing apparatus, the method further comprises:
obtaining a first critical refraction angle according to an ultrasonic critical refraction longitudinal wave detection principle;
connecting a probe of the ultrasonic detection device with the target epoxy-conductor insert; wherein, the probe of ultrasonic detection device includes: a first probe and a second probe;
connecting the first probe with the epoxy part of the target epoxy-conductor insert according to a first critical refraction angle, and connecting the second probe with the metal conductor part of the target epoxy-conductor insert; wherein an angle formed by the first probe and the target epoxy-conductor insert interface is a first critical angle of refraction; and the target epoxy-conductor insert interface is the location where the epoxy portion and the metal conductor portion of the target epoxy-conductor insert are connected;
the ultrasonic signal transmitted by the ultrasonic detection device is transmitted from the epoxy part of the target epoxy-conductor insert through the first probe, and is finally received through the second probe positioned on the metal conductor part after passing through the interface of the target epoxy-conductor insert.
As an improvement of the above scheme, the obtaining an ultrasonic detection path required by the ultrasonic detection device when detecting the target epoxy-conductor insert according to the structural data and the probe size of the ultrasonic detection device specifically includes:
obtaining the path length of single ultrasonic detection according to the structural data and the size of a probe of an ultrasonic detection device; wherein the single ultrasonic detection path length is: the first probe is perpendicular to the target epoxy-conductor insert interface, and the moving distance from the probe position where the highest point of the target epoxy-conductor insert interface is detected to the probe position where the lowest point of the target epoxy-conductor insert interface is detected is the first probe;
setting a first detection position, a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path, wherein one-time ultrasonic detection is carried out from the first detection position to the second detection position, and one-time ultrasonic detection is carried out from the third detection position to the fourth detection position; wherein the first detection position is a probe position at which a highest point of a target epoxy-conductor insert interface is detected at a first angle; the second detection position is a probe position at which a lowest point of a target epoxy-conductor insert interface is detected at a first angle; the third detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a second angle; the fourth detection position is a probe position at which a lowest point of a target epoxy-conductor insert interface is detected at a second angle; the fifth detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a third angle; the center of the first detection position and the center of the third detection position are separated by one probe diameter; the center of the second detection position and the center of the fourth detection position are separated by one probe diameter;
obtaining the length of a single detection transfer path according to the second detection position and the third detection position; wherein the single detection transfer path length is the shortest distance between the second detection position and the third detection position;
according to the first detection position, the second detection position, the third detection position, the fourth detection position and the fifth detection position, the ultrasonic detection path specifically comprises the following steps: the first detection position is detected to the second detection position according to the path length of single ultrasonic detection, then the second detection position is detected to the third detection position according to the path length of single ultrasonic detection, then the third detection position is detected to the fourth detection position according to the path length of single ultrasonic detection, and then the fourth detection position is detected to the fifth detection position according to the path length of single ultrasonic detection.
As an improvement of the above scheme, the controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path specifically includes:
taking the probe position of the highest point of any target epoxy-conductor insert interface as a first detection position, and determining a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path in an undetected area;
placing a first probe of the ultrasonic detection device at a first detection position, and executing ultrasonic detection movement and position judgment; wherein the ultrasonic detection movement comprises: controlling the first probe to move according to an ultrasonic detection path, and controlling the second probe to move to the same vertical plane as the first probe in the metal conductor when the first probe moves to a first detection position, a third detection position or a fifth detection position; the position judgment includes: judging whether the position of the first probe is located at a fifth detection position;
upon determining that the first probe is located at the fifth detection position, the fifth detection position is updated to the first detection position, while the second detection position, the third detection position, the fourth detection position, and the fifth detection position of the ultrasonic detection path are newly determined in the undetected area, a new ultrasonic detection path is formed, and the ultrasonic detection movement is performed.
As an improvement of the above scheme, the determining a defect position of the target epoxy-conductor insert interface according to abnormal data in the ultrasonic detection data specifically includes:
according to abnormal data of an ultrasonic detection signal peak value of which the received wave peak value is smaller than the defect-free epoxy-conductor insert interface in the ultrasonic detection data, acquiring the abnormal distance between the position of the probe and the highest point of the detected target epoxy-conductor insert interface at the same angle;
and obtaining the abnormal height of the defect position and the highest point of the detected target epoxy-conductor insert interface under the same angle according to the tangent trigonometric function relation and the abnormal distance.
As an improvement of the above solution, a first probe of the ultrasonic detection apparatus is connected with the epoxy part of the target epoxy-conductor insert through a water-based ultrasonic coupling agent, and a second probe of the ultrasonic detection apparatus is connected with the metal conductor part of the target epoxy-conductor insert through a water-based ultrasonic coupling agent.
As an improvement of the scheme, the ultrasonic detection device is connected with a plurality of epoxy-conductor insert interfaces through a plurality of probes, detection is carried out, and the defect positions of the epoxy-conductor insert interfaces are determined.
Correspondingly, an embodiment of the present invention further provides an ultrasonic testing apparatus for an interface defect of an asymmetric epoxy-conductor insert, including: the system comprises a data acquisition module, a path generation module, a detection control module and a defect judgment module;
the data acquisition module is used for acquiring structural data of the target epoxy-conductor insert;
the path generating module is used for obtaining an ultrasonic detection path required by the ultrasonic detection device when the target epoxy-conductor insert is detected according to the structural data and the size of a probe of the ultrasonic detection device;
the detection control module is used for controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path to obtain ultrasonic detection data;
and the defect judging module is used for determining the interface defect position of the target epoxy-conductor insert according to the abnormal data in the ultrasonic detection data when the ultrasonic detection data has the abnormal data.
As an improvement of the above solution, before the obtaining, according to the structural data and a probe size of the ultrasonic testing apparatus, an ultrasonic testing path required by the ultrasonic testing apparatus when testing the target epoxy-conductor insert, the method further includes: a detection preprocessing module; the detection preprocessing module comprises: an angle data acquisition unit and a connection unit;
the angle data acquisition unit is used for acquiring a first critical refraction angle according to an ultrasonic critical refraction longitudinal wave detection principle;
the connecting unit is used for connecting a first probe of the ultrasonic detection device with an epoxy part of the target epoxy-conductor insert according to a first critical refraction angle, and connecting a second probe of the ultrasonic detection device with a metal conductor part of the target epoxy-conductor insert; wherein an angle formed by the first probe and the target epoxy-conductor insert interface is a first critical angle of refraction; and the target epoxy-conductor insert interface is the location where the epoxy portion and the metal conductor portion of the target epoxy-conductor insert are connected;
the ultrasonic signal transmitted by the ultrasonic detection device is transmitted from the epoxy part of the target epoxy-conductor insert through the first probe, and is finally received through the second probe positioned on the metal conductor part after passing through the interface of the target epoxy-conductor insert.
As an improvement of the above scheme, the path generating module includes: the device comprises a path first data acquisition unit, a path preprocessing unit, a path second data acquisition unit and a path generation unit;
the path first data acquisition unit is used for acquiring the length of a single ultrasonic detection path according to the structural data and the size of a probe of the ultrasonic detection device; wherein the single ultrasonic detection path length is: the first probe is perpendicular to the target epoxy-conductor insert interface, and the moving distance from the probe position where the highest point of the target epoxy-conductor insert interface is detected to the probe position where the lowest point of the target epoxy-conductor insert interface is detected is greater than the moving distance of the first probe;
the path preprocessing unit is used for setting a first detection position, a second detection position, a third detection position, a fourth detection position and a fifth detection position of the ultrasonic detection path, wherein one ultrasonic detection is performed from the first detection position to the second detection position, and one ultrasonic detection is performed from the third detection position to the fourth detection position; wherein the first detection position is a probe position at which a highest point of a target epoxy-conductor insert interface is detected at a first angle; the second detection position is a probe position for detecting the lowest point of the target epoxy-conductor insert interface at the first angle; the third detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a second angle; the fourth detection position is a probe position at which a lowest point of a target epoxy-conductor insert interface is detected at a second angle; the fifth detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a third angle; the center of the first detection position and the center of the third detection position are separated by one probe diameter; the center of the second detection position and the center of the fourth detection position are separated by one probe diameter;
the path second data acquisition unit is used for acquiring the length of the single detection transfer path according to the second detection position and the third detection position; the length of the single detection transfer path is the shortest distance between the second detection position and the third detection position;
the path generating unit is configured to generate an ultrasonic detection path according to a first detection position, a second detection position, a third detection position, a fourth detection position, and a fifth detection position: the first detection position is detected to the second detection position according to the path length of single ultrasonic detection, then the second detection position is detected to the third detection position according to the path length of single ultrasonic detection, then the third detection position is detected to the fourth detection position according to the path length of single ultrasonic detection, and then the fourth detection position is detected to the fifth detection position according to the path length of single ultrasonic detection.
As an improvement of the above scheme, the controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path specifically includes:
taking the probe position of the highest point of any target epoxy-conductor insert interface as a first detection position, and determining a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path in an undetected area;
placing a first probe of the ultrasonic detection device at a first detection position, and executing ultrasonic detection movement and position judgment; wherein the ultrasonic detection movement comprises: controlling the first probe to move according to the ultrasonic detection path, and controlling the second probe to move to the same vertical plane with the first probe in the metal conductor when the first probe moves to the first detection position, the third detection position or the fifth detection position; the position judgment includes: judging whether the position of the first probe is located at a fifth detection position;
upon determining that the first probe is located at the fifth detection position, the fifth detection position is updated to the first detection position, while the second detection position, the third detection position, the fourth detection position, and the fifth detection position of the ultrasonic detection path are newly determined in the undetected area, a new ultrasonic detection path is formed, and the ultrasonic detection movement is performed.
As an improvement of the above scheme, the determining a defect position of a target epoxy-conductor insert interface according to abnormal data in the ultrasonic detection data specifically includes:
according to abnormal data of an ultrasonic detection signal peak value of which the received wave peak value is smaller than the defect-free epoxy-conductor insert interface in the ultrasonic detection data, acquiring the abnormal distance between the position of the probe and the highest point of the detected target epoxy-conductor insert interface at the same angle;
and obtaining the abnormal height of the defect position and the highest point of the detected target epoxy-conductor insert interface under the same angle according to the tangent trigonometric function relation and the abnormal distance.
As an improvement of the above solution, a first probe of the ultrasonic detection apparatus is connected with the epoxy part of the target epoxy-conductor insert through a water-based ultrasonic coupling agent, and a second probe of the ultrasonic detection apparatus is connected with the metal conductor part of the target epoxy-conductor insert through a water-based ultrasonic coupling agent.
As an improvement of the scheme, the ultrasonic detection device is connected with a plurality of epoxy-conductor insert interfaces through a plurality of probes, detection is carried out, and the defect positions of the epoxy-conductor insert interfaces are determined.
Accordingly, an embodiment of the present invention further provides a computer terminal device, which includes a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, and when the processor executes the computer program, the processor implements an asymmetric epoxy-conductor insert interface defect ultrasonic detection method according to the present invention.
Correspondingly, an embodiment of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium includes a stored computer program, where the computer program, when executed, controls an apparatus where the computer-readable storage medium is located to perform the ultrasonic detection method for the interface defect of the asymmetric epoxy-conductor insert according to the present invention.
From the above, the present invention has the following advantages:
the invention provides an ultrasonic detection method for interface defects of an asymmetric epoxy-conductor insert, which comprises the steps of firstly obtaining structural data of a target epoxy-conductor insert, obtaining an ultrasonic detection path of an ultrasonic detection device when the epoxy-conductor insert is detected based on the structural data of the insert and the size of a probe of the ultrasonic detection device, thus prompting the ultrasonic detection device to move according to the ultrasonic detection path and detect in real time, thus obtaining the ultrasonic detection data of the insert interface, and finally analyzing whether the ultrasonic detection data has abnormal data or not, thus judging whether the insert interface has defects or not. Compared with the prior art that ultrasonic detection is directly adopted, the moving control of the ultrasonic detection device is carried out by acquiring the ultrasonic detection path, the missing detection and the false detection of the interface defect of the asymmetric epoxy-conductor insert can be avoided, and the accuracy of the ultrasonic detection of the interface defect of the asymmetric epoxy-conductor insert is improved.
Drawings
FIG. 1 is a schematic flow chart of an ultrasonic inspection method for detecting defects at an interface of an asymmetric epoxy-conductor insert according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an ultrasonic testing apparatus for detecting an interface defect of an asymmetric epoxy-conductor insert according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a connection between an ultrasonic detection apparatus and a 110kV asymmetric epoxy-conductor insert according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a probe of an ultrasonic testing apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a probe of an ultrasonic testing apparatus according to an embodiment of the present invention for testing a 110kV asymmetric epoxy-conductor insert interface;
FIG. 6 is a schematic diagram of an ultrasonic detection path for an asymmetric epoxy-conductor insert interface defect of a 110kV basin insulator according to an embodiment of the present invention;
FIG. 7 is a graphical representation of the results of a defect-free 110kV asymmetric epoxy-conductor insert interface provided by an embodiment of the present invention;
FIG. 8 is a schematic diagram of the results of a defect in the 110kV asymmetric epoxy-conductor insert interface provided by one embodiment of the present invention;
fig. 9 is a schematic structural diagram of a terminal device according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, fig. 1 is a schematic flow chart of an ultrasonic inspection method for an interface defect of an asymmetric epoxy-conductor insert according to an embodiment of the present invention, as shown in fig. 1, the embodiment includes steps 101 to 104, and each step specifically includes the following steps:
step 101: structural data of the target epoxy-conductor insert is obtained.
In one embodiment, the target epoxy-conductor insert has a structure in which the upper epoxy surface is convexly curved and the lower epoxy surface is concavely curved, and the structural data includes: the distance from the epoxy top surface to the epoxy bottom surface at the epoxy-conductor insert interface.
Step 102: and obtaining an ultrasonic detection path required by the ultrasonic detection device when the ultrasonic detection device detects the target epoxy-conductor insert according to the structural data and the size of the probe of the ultrasonic detection device.
In a specific embodiment, the ultrasonic testing system comprises an ultrasonic flaw detector, an oscilloscope, a transmitting (referred to as T) probe (i.e. the first probe in the right of the present invention), a receiving (referred to as R) probe (i.e. the second probe in the right of the present invention), a probe connecting line and a high impedance transmission line: the ultrasonic flaw detector is an ultrasonic transmitting and receiving device which is excited by negative square waves and has adjustable square wave amplitude and width; the oscilloscope is a high-input-impedance four-channel high-performance digital storage oscilloscope; the T probe and the R probe are ultrasonic longitudinal wave straight probes with the diameter of 6 mm and the frequency and the wafer size of the T probe and the R probe determine the sensitivity and the depth of ultrasonic detection;
to better illustrate the structure and connection of the ultrasonic testing device, please refer to fig. 3, which includes: the ultrasonic flaw detector 301, the oscilloscope 302, the computer 303, the 110kV three-phase common-box basin-type insulator 304, the T and R ultrasonic straight probe 305, the probe connecting wire 306, the high-impedance transmission line 307 and the USB wire 308. The three-phase box-shared basin-type insulator 304 is composed of an epoxy insulator 3041 and three conductor metal inserts 3042, defects are prone to occurring at the interface of the epoxy and the conductor inserts, and the size of the basin-type insulator is related to different voltage grades, manufacturers and the like.
In this embodiment, before obtaining, according to the structural data and a probe size of the ultrasonic testing apparatus, an ultrasonic testing path required by the ultrasonic testing apparatus when testing the target epoxy-conductor insert, the method further includes:
obtaining a first critical refraction angle according to an ultrasonic critical refraction longitudinal wave detection principle;
connecting a first probe of the ultrasonic detection device with an epoxy part of the target epoxy-conductor insert according to a first critical refraction angle, and connecting a second probe of the ultrasonic detection device with a metal conductor part of the target epoxy-conductor insert; wherein an angle formed by the first probe and the target epoxy-conductor insert interface is a first critical angle of refraction; and the target epoxy-conductor insert interface is where an epoxy portion and a metal conductor portion of the target epoxy-conductor insert meet;
the ultrasonic signal transmitted by the ultrasonic detection device is transmitted from the epoxy part of the target epoxy-conductor insert through the first probe, and is finally received through the second probe positioned on the metal conductor part after penetrating through the interface of the target epoxy-conductor insert.
In a specific embodiment, the ultrasonic waves are incident at an angle from the upper epoxy surface to the epoxy-conductor insert interface where they are reflected and refracted due to the different acoustic impedances on the two sides of the interface. According to Snell's law, when the incident angle is equal to the first critical refraction angle, the wave conversion occurs at the epoxy-conductor insert interface, and critical refracted longitudinal wave (LCR) appears, and the LCR propagates parallel to the interface surface along a certain depth range, and the signal is received by the receiving probe at the lower part of the conductor insert;
in the detection process, a water-based ultrasonic coupling agent is required to be used for a contact surface of the probe and the insulator to enhance the contact effect, and according to Snell's law, when an incident angle theta is equal to a first critical refraction angle, a refraction angle beta is equal to 90 degrees; the ultrasound wave forms a waveform transition at the epoxy-conductor insert interface, LCR appears, and the LCR propagates parallel to the interface surface along a certain depth range, so that the ultrasound signal is received by the receiving probe at the lower part of the conductor insert.
In a specific embodiment, to better illustrate the probe structure of the ultrasonic testing apparatus, please refer to fig. 4, the ultrasonic straight probe uses a circular composite piezoelectric wafer 401. The frequency of the probe and the wafer size determine the sensitivity, depth, etc. of the ultrasonic test. The higher the frequency of the ultrasonic probe is, the larger the attenuation coefficient of the material to be detected is, and the poorer the ultrasonic propagation effect is; the diameter d of the bottom surface of the probe is small, the piezoelectric wafer is small, and the energy of ultrasonic emission signals is low.
In this embodiment, the first probe of the ultrasonic testing apparatus is connected to the epoxy portion of the target epoxy-conductor insert through a water-based ultrasonic coupling agent, and the second probe of the ultrasonic testing apparatus is connected to the metal conductor portion of the target epoxy-conductor insert through a water-based ultrasonic coupling agent.
In this embodiment, the obtaining, according to the structural data and the size of the probe of the ultrasonic detection apparatus, an ultrasonic detection path required by the ultrasonic detection apparatus when detecting the target epoxy-conductor insert specifically includes:
obtaining the path length of single ultrasonic detection according to the structural data and the size of a probe of an ultrasonic detection device; wherein the single ultrasonic detection path length is: the first probe is perpendicular to the target epoxy-conductor insert interface, and the moving distance from the probe position where the highest point of the target epoxy-conductor insert interface is detected to the probe position where the lowest point of the target epoxy-conductor insert interface is detected is greater than the moving distance of the first probe;
setting a first detection position, a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path, wherein one ultrasonic detection is performed from the first detection position to the second detection position, and one ultrasonic detection is performed from the third detection position to the fourth detection position; wherein the first detection position is a probe position at which a highest point of a target epoxy-conductor insert interface is detected at a first angle; the second detection position is a probe position at which a lowest point of a target epoxy-conductor insert interface is detected at a first angle; the third detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a second angle; the fourth detection position is a probe position at which a lowest point of a target epoxy-conductor insert interface is detected at a second angle; the fifth detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a third angle; the center of the first detection position and the center of the third detection position are separated by one probe diameter; the center of the second detection position and the center of the fourth detection position are separated by one probe diameter;
obtaining the length of a single detection transfer path according to the second detection position and the third detection position; wherein the single detection transfer path length is the shortest distance between the second detection position and the third detection position;
according to the first detection position, the second detection position, the third detection position, the fourth detection position and the fifth detection position, the ultrasonic detection path specifically comprises the following steps: the method comprises the steps of detecting a path length from a first detection position to a second detection position according to single-time ultrasonic detection, then transferring the path length from the second detection position to a third detection position according to single-time ultrasonic detection, then transferring the path length from the third detection position to a fourth detection position according to single-time ultrasonic detection, and then transferring the path length from the fourth detection position to a fifth detection position according to single-time ultrasonic detection.
In a specific embodiment, looking down from directly above a target epoxy-conductor insert in the basin insulator, the center of the conductor portion to the highest point of the epoxy portion is taken as the reference line; and a first straight line in which the first detection position and the second detection position are located is a radius extension line of the circular conductor part, a second straight line in which the third detection position and the fourth detection position are located is another radius extension line of the circular conductor part, and a third straight line in which the fifth detection position is located is another radius extension line of the circular conductor part, so that an included angle between the first straight line and the reference line is a first angle, an included angle between the second straight line and the reference line is a second angle, and an included angle between the third straight line and the reference line is a third angle.
In a specific embodiment, to better illustrate the structure of the probe of the ultrasonic testing apparatus for testing a 110kv asymmetric epoxy-conductor insert interface, please refer to fig. 5, wherein two probes are respectively located on an epoxy portion 501 and a metal conductor portion 502; the distance from M point to N point of the basin-type insulator epoxy-conductor insert interface is known as s, the diameter d of the ultrasonic straight probe is known, and the ultrasonic signal emitted by the ultrasonic straight probe can detect the whole epoxy-conductor insert interface through the round surface structure of the wafer in the probe. The size of the epoxy-conductor insert interface of the 110kV basin-type insulator is 60 mm, so that the ultrasonic detection range of the method for the epoxy-conductor insert interface is s, namely 60 mm. And L0 is the position of the probe, of which the upper surface of the epoxy insulation can detect the M point of the epoxy-conductor insert interface, and Ln is the position of the probe, of which the upper surface of the epoxy insulation can detect the N point of the maximum range of the epoxy-conductor insert interface, so that the moving path of the ultrasonic T probe is from L0 to Ln. The calculation formula of the probe moving path length L (from L0-Ln, namely the path length of single ultrasonic detection in the invention) for detecting the interface defect of the epoxy-conductor insert is as follows, and the probe moving path length L is in a circular ring shape around the conductor insert;
Figure 329033DEST_PATH_IMAGE001
step 103: and controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path to obtain ultrasonic detection data.
In this embodiment, the controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path specifically includes:
taking the probe position of the highest point of any target epoxy-conductor insert interface as a first detection position, and determining a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path in an undetected area;
placing a first probe of the ultrasonic detection device at a first detection position, and executing ultrasonic detection movement and position judgment; wherein the ultrasonic detection movement comprises: controlling the first probe to move according to an ultrasonic detection path, and controlling the second probe to move to the same vertical plane as the first probe in the metal conductor when the first probe moves to a first detection position, a third detection position or a fifth detection position; the position judgment includes: judging whether the position of the first probe is located at a fifth detection position;
upon determining that the first probe is located at the fifth detection position, the fifth detection position is updated to the first detection position, while the second detection position, the third detection position, the fourth detection position, and the fifth detection position of the ultrasonic detection path are newly determined in the undetected area, a new ultrasonic detection path is formed, and the ultrasonic detection movement is performed.
In an embodiment, to better explain the detection path control of the ultrasonic detection apparatus, please refer to fig. 6, which includes: an epoxy portion 601 of the epoxy-conductor insert and a metal conductor portion 602 of the epoxy-conductor insert; the ultrasonic detection system detects three epoxy-conductor insert interfaces of the insulator respectively. At the same angle of the epoxy-conductor insert structure, a T probe is used to measure the length of the epoxy insulation surface from L 0 To L n And the scanning probe and the R probe can receive ultrasonic signals. Followed byMoving the T probe around the metal conductor insert in an N shape, and correspondingly moving the R probe under the metal conductor insert to obtain received wave signals of different detection positions; the T probe moves the distance of the single ultrasonic detection path length from the lowest end of the left vertical edge (a first detection position) to the uppermost end of the left vertical edge (a second detection position) according to the N-shaped left vertical edge, moves the distance of the single ultrasonic detection path length from the uppermost end of the left vertical edge to the lowest end of the right vertical edge (a third detection position) along the oblique line in the middle of the N-shaped, moves the distance of the single ultrasonic detection path length from the lowest end of the right vertical edge to the uppermost end of the right vertical edge (a fourth detection position) along the right vertical edge of the N-shaped, and finally moves from the uppermost end of the right vertical edge to the lowest end of the left vertical edge of the second N-shaped (a fifth detection position) according to the oblique line in the middle of the N-shaped according to the right vertical edge of the N-shaped right vertical edge, namely, finishes one-time ultrasonic detection movement, and continuously repeats ultrasonic detection movement until data is accurate, and stops moving according to a signal sent by a user; where the defect is at the epoxy-conductor insert interface in the figure.
Step 104: and when the ultrasonic detection data is determined to have abnormal data, determining the defect position of the target epoxy-conductor insert interface according to the abnormal data in the ultrasonic detection data.
In this embodiment, the determining the defect position of the target epoxy-conductor insert interface according to the abnormal data in the ultrasonic detection data specifically includes:
according to abnormal data of an ultrasonic detection signal peak value of which the received wave peak value is smaller than the defect-free epoxy-conductor insert interface in the ultrasonic detection data, acquiring the abnormal distance between the position of the probe and the highest point of the detected target epoxy-conductor insert interface at the same angle;
and obtaining the abnormal height of the defect position and the highest point of the detected target epoxy-conductor insert interface under the same angle according to the tangent trigonometric function relation and the abnormal distance.
In a specific embodiment, the peak value of the ultrasonic detection signal is lower than that of the defect-free epoxy-conductor insert interface because the ultrasonic signal meets the defect and the reflection can not be received by the R probe; part of ultrasonic signals are seriously propagated and attenuated in the defect; the R probe can only receive a small part of signals;
to better illustrate the ultrasonic testing results, referring to fig. 7 and 8, when a defect is present, the peak value received by the R probe is significantly smaller than that of the defect-free.
In a specific embodiment, the peak value variation of the received wave signal of each detection point is compared, and if the received wave peak value is smaller than the peak value of the ultrasonic detection signal of the defect-free epoxy-conductor insert interface, it can be determined that the defect exists at the corresponding interface of the detection point. The distance of the probe from the highest point of the epoxy upper part of the epoxy-conductor insert is known as L i The position of the defect can be determined by the geometrical relation, and the calculation method of the distance between the defect and the M point h is shown in the following formula.
Figure 108770DEST_PATH_IMAGE002
In this embodiment, the ultrasonic detection device is connected to a plurality of epoxy-conductor insert interfaces through a plurality of probes, and the defect positions of the plurality of epoxy-conductor insert interfaces are determined by performing detection.
In the embodiment, the ultrasonic detection path of the ultrasonic detection device when the epoxy-conductor insert is detected is obtained based on the structural data of the target epoxy-conductor insert and the probe size of the ultrasonic detection device, so that the ultrasonic detection device can be prompted to move according to the ultrasonic detection path and detect in real time, the ultrasonic detection data of the insert interface is obtained, and finally, whether abnormal data exist in the ultrasonic detection data is analyzed, so that whether the insert interface has defects is judged. The embodiment has the advantages of simple and convenient operation, high detection sensitivity, low cost, capability of efficiently identifying and positioning the epoxy-conductor insert interface defects and the like, and can be used for factory delivery, field assembly detection and the like of the GIS basin-type insulator.
Example two
Referring to fig. 2, fig. 2 is a schematic structural diagram of an ultrasonic inspection apparatus for an interface defect of an asymmetric epoxy-conductor insert according to an embodiment of the present invention, including: a data acquisition module 201, a path generation module 202, a detection control module 203 and a defect judgment module 204;
the data acquisition module 201 is configured to acquire structural data of the target epoxy-conductor insert;
the path generating module 202 is configured to obtain an ultrasonic detection path required by the ultrasonic detection apparatus when the target epoxy-conductor insert is detected according to the structural data and the probe size of the ultrasonic detection apparatus;
the detection control module 203 is configured to control the ultrasonic detection apparatus to detect the target epoxy-conductor insert according to the ultrasonic detection path, so as to obtain ultrasonic detection data;
the defect determining module 204 is configured to determine an interface defect position of the target epoxy-conductor insert according to abnormal data in the ultrasonic detection data when it is determined that the ultrasonic detection data has the abnormal data.
As an improvement of the above solution, before obtaining the ultrasonic testing path required by the ultrasonic testing apparatus when testing the target epoxy-conductor insert according to the structural data and the probe size of the ultrasonic testing apparatus, the method further comprises: a detection pre-processing module 205; the detection preprocessing module 205 includes: an angle data acquisition unit and a connection unit;
the angle data acquisition unit is used for acquiring a first critical refraction angle according to an ultrasonic critical refraction longitudinal wave detection principle;
the connecting unit is used for connecting a first probe of the ultrasonic detection device with an epoxy part of the target epoxy-conductor insert according to a first critical refraction angle, and connecting a second probe of the ultrasonic detection device with a metal conductor part of the target epoxy-conductor insert; the angle formed by the first probe and the target epoxy-conductor insert interface is a first critical refraction angle; and the target epoxy-conductor insert interface is where an epoxy portion and a metal conductor portion of the target epoxy-conductor insert meet;
the ultrasonic signal transmitted by the ultrasonic detection device is transmitted from the epoxy part of the target epoxy-conductor insert through the first probe, and is finally received through the second probe positioned on the metal conductor part after passing through the interface of the target epoxy-conductor insert.
As an improvement of the above solution, the path generating module 202 includes: the device comprises a path first data acquisition unit, a path preprocessing unit, a path second data acquisition unit and a path generation unit;
the path first data acquisition unit is used for acquiring the length of a single ultrasonic detection path according to the structural data and the size of a probe of the ultrasonic detection device; wherein the single ultrasonic detection path length is: the first probe is perpendicular to the target epoxy-conductor insert interface, and the moving distance from the probe position where the highest point of the target epoxy-conductor insert interface is detected to the probe position where the lowest point of the target epoxy-conductor insert interface is detected is the first probe;
the path preprocessing unit is used for setting a first detection position, a second detection position, a third detection position, a fourth detection position and a fifth detection position of the ultrasonic detection path, wherein one ultrasonic detection is carried out from the first detection position to the second detection position, and one ultrasonic detection is carried out from the third detection position to the fourth detection position; wherein the first detection position is a probe position at which a highest point of a target epoxy-conductor insert interface is detected at a first angle; the second detection position is a probe position at which a lowest point of a target epoxy-conductor insert interface is detected at a first angle; the third detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a second angle; the fourth detection position is a probe position for detecting the lowest point of the target epoxy-conductor insert interface at a second angle; the fifth detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a third angle; the center of the first detection position and the center of the third detection position are separated by one probe diameter; the center of the second detection position and the center of the fourth detection position are separated by one probe diameter;
the path second data acquisition unit is used for acquiring the length of the single detection transfer path according to the second detection position and the third detection position; the length of the single detection transfer path is the shortest distance between the second detection position and the third detection position;
the path generating unit is configured to generate an ultrasonic detection path according to a first detection position, a second detection position, a third detection position, a fourth detection position, and a fifth detection position: the method comprises the steps of detecting a path length from a first detection position to a second detection position according to single-time ultrasonic detection, then transferring the path length from the second detection position to a third detection position according to single-time ultrasonic detection, then transferring the path length from the third detection position to a fourth detection position according to single-time ultrasonic detection, and then transferring the path length from the fourth detection position to a fifth detection position according to single-time ultrasonic detection.
As an improvement of the above scheme, the controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path specifically includes:
taking the probe position of the highest point of any target epoxy-conductor insert interface as a first detection position, and determining a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path in an undetected area;
placing a first probe of the ultrasonic detection device at a first detection position, and executing ultrasonic detection movement and position judgment; wherein the ultrasonic detection movement comprises: controlling the first probe to move according to the ultrasonic detection path, and controlling the second probe to move to the same vertical plane with the first probe in the metal conductor when the first probe moves to the first detection position, the third detection position or the fifth detection position; the position judgment includes: judging whether the position of the first probe is located at a fifth detection position;
upon determining that the first probe is located at the fifth detection position, the fifth detection position is updated to the first detection position while the second detection position, the third detection position, the fourth detection position, and the fifth detection position of the ultrasonic detection path are newly determined in the undetected region, a new ultrasonic detection path is formed, and an ultrasonic detection movement is performed.
As an improvement of the above scheme, the determining a defect position of a target epoxy-conductor insert interface according to abnormal data in the ultrasonic detection data specifically includes:
according to abnormal data of an ultrasonic detection signal peak value of which the received wave peak value is smaller than the defect-free epoxy-conductor insert interface in the ultrasonic detection data, acquiring the abnormal distance between the position of the probe and the highest point of the detected target epoxy-conductor insert interface at the same angle;
and obtaining the abnormal height of the defect position and the highest point of the detected target epoxy-conductor insert interface under the same angle according to the tangent trigonometric function relation and the abnormal distance.
In an improvement of the above scheme, a first probe of the ultrasonic detection device is connected with an epoxy part of the target epoxy-conductor insert through a water-based ultrasonic coupling agent, and a second probe of the ultrasonic detection device is connected with a metal conductor part of the target epoxy-conductor insert through a water-based ultrasonic coupling agent.
As an improvement of the scheme, the ultrasonic detection device is connected with a plurality of epoxy-conductor insert interfaces through a plurality of probes, detection is carried out, and the defect positions of the epoxy-conductor insert interfaces are determined.
In this embodiment, the data acquisition module acquires the structural data of the target epoxy-conductor insert, the acquired structural data is input to the path generation module to generate an ultrasonic detection path, the detection control module controls the ultrasonic detection device to perform detection according to the ultrasonic detection path to acquire ultrasonic detection data, and the acquired defect determination module determines the defect position. Compared with the prior art that ultrasonic detection is directly adopted, the moving control of the ultrasonic detection device is carried out by acquiring the ultrasonic detection path, so that the missing detection and the false detection of the interface defect of the asymmetric epoxy-conductor insert can be avoided, and the accuracy of the ultrasonic detection of the interface defect of the asymmetric epoxy-conductor insert is improved.
EXAMPLE III
Referring to fig. 9, fig. 9 is a schematic structural diagram of a terminal device according to an embodiment of the present invention.
A terminal device of this embodiment includes: a processor 901, a memory 902 and a computer program stored in said memory 902 and executable on said processor 901. The processor 901, when executing the computer program, implements the steps in the various asymmetric epoxy-conductor insert interface defect ultrasonic inspection methods described above, such as all the steps of the asymmetric epoxy-conductor insert interface defect ultrasonic inspection method shown in fig. 1. Alternatively, the processor, when executing the computer program, implements the functions of the modules in the foregoing device embodiments, for example: all of the modules of the ultrasonic testing apparatus for asymmetric epoxy-conductor insert interface defects shown in fig. 2.
In addition, the embodiment of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium includes a stored computer program, where the computer program, when running, controls an apparatus where the computer-readable storage medium is located to perform the ultrasonic detection method for interface defects of an asymmetric epoxy-conductor insert according to any one of the above embodiments.
It will be appreciated by those skilled in the art that the schematic diagram is merely an example of a terminal device and does not constitute a limitation of a terminal device, and may include more or less components than those shown, or combine certain components, or different components, for example, the terminal device may also include input output devices, network access devices, buses, etc.
The Processor 901 may be a Central Processing Unit (CPU), other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. The general processor may be a microprocessor or the processor may be any conventional processor, etc., and the processor 901 is a control center of the terminal device and connects various parts of the whole terminal device by using various interfaces and lines.
The memory 902 can be used for storing the computer programs and/or modules, and the processor 901 implements various functions of the terminal device by running or executing the computer programs and/or modules stored in the memory and calling the data stored in the memory 902. The memory 902 may mainly include a program storage area and a data storage area, where the program storage area may store an operating system, an application program (such as a sound playing function, an image playing function, etc.) required by at least one function, and the like; the storage data area may store data (such as audio data, a phonebook, etc.) created according to the use of the cellular phone, and the like. In addition, the memory may include high speed random access memory, and may also include non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), at least one magnetic disk storage device, a Flash memory device, or other volatile solid state storage device.
Wherein, the terminal device integrated module/unit can be stored in a computer readable storage medium if it is implemented in the form of software functional unit and sold or used as a stand-alone product. Based on such understanding, all or part of the flow of the method according to the embodiments of the present invention may also be implemented by a computer program, which may be stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method embodiments may be implemented. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, read-Only Memory (ROM), random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like.
It should be noted that the above-described embodiments of the apparatus are merely illustrative, where the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. In addition, in the drawings of the embodiment of the apparatus provided by the present invention, the connection relationship between the modules indicates that there is a communication connection therebetween, and may be specifically implemented as one or more communication buses or signal lines. One of ordinary skill in the art can understand and implement without inventive effort.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.

Claims (9)

1. An ultrasonic detection method for interface defects of an asymmetric epoxy-conductor insert is characterized by comprising the following steps:
obtaining structural data of a target epoxy-conductor insert;
obtaining a first critical refraction angle according to an ultrasonic critical refraction longitudinal wave detection principle; connecting a first probe of an ultrasonic detection device with an epoxy part of the target epoxy-conductor insert according to a first critical refraction angle, and connecting a second probe of the ultrasonic detection device with a metal conductor part of the target epoxy-conductor insert; the angle formed by the first probe and the target epoxy-conductor insert interface is a first critical refraction angle; and the target epoxy-conductor insert interface is where an epoxy portion and a metal conductor portion of the target epoxy-conductor insert meet; the ultrasonic signal transmitted by the ultrasonic detection device is transmitted from the epoxy part of the target epoxy-conductor insert through the first probe, and is finally received through the second probe positioned on the metal conductor part after passing through the interface of the target epoxy-conductor insert;
obtaining an ultrasonic detection path required by the ultrasonic detection device when the target epoxy-conductor insert is detected according to the structural data and the size of a probe of the ultrasonic detection device;
controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path to obtain ultrasonic detection data;
and when the ultrasonic detection data is determined to have abnormal data, determining the defect position of the target epoxy-conductor insert interface according to the abnormal data in the ultrasonic detection data.
2. The ultrasonic detection method for the interface defect of the asymmetric epoxy-conductor insert as claimed in claim 1, wherein the ultrasonic detection path required by the ultrasonic detection device when detecting the target epoxy-conductor insert is obtained according to the structural data and the probe size of the ultrasonic detection device, and specifically comprises:
obtaining the path length of single ultrasonic detection according to the structural data and the size of a probe of an ultrasonic detection device; wherein the single ultrasonic detection path length is: the first probe is perpendicular to the target epoxy-conductor insert interface, and the moving distance from the probe position where the highest point of the target epoxy-conductor insert interface is detected to the probe position where the lowest point of the target epoxy-conductor insert interface is detected is greater than the moving distance of the first probe;
setting a first detection position, a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path, wherein one-time ultrasonic detection is carried out from the first detection position to the second detection position, and one-time ultrasonic detection is carried out from the third detection position to the fourth detection position; the first detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a first angle; the second detection position is a probe position for detecting the lowest point of the target epoxy-conductor insert interface at the first angle; the third detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a second angle; the fourth detection position is a probe position at which a lowest point of a target epoxy-conductor insert interface is detected at a second angle; the fifth detection position is a probe position for detecting the highest point of the target epoxy-conductor insert interface at a third angle; the center of the first detection position and the center of the third detection position are separated by one probe diameter; the center of the second detection position and the center of the fourth detection position are separated by one probe diameter;
obtaining the length of a single detection transfer path according to the second detection position and the third detection position; the length of the single detection transfer path is the shortest distance between the second detection position and the third detection position;
according to the first detection position, the second detection position, the third detection position, the fourth detection position and the fifth detection position, the ultrasonic detection path specifically comprises the following steps: the method comprises the steps of detecting a path length from a first detection position to a second detection position according to single-time ultrasonic detection, then transferring the path length from the second detection position to a third detection position according to single-time ultrasonic detection, then transferring the path length from the third detection position to a fourth detection position according to single-time ultrasonic detection, and then transferring the path length from the fourth detection position to a fifth detection position according to single-time ultrasonic detection.
3. The ultrasonic testing method for the interface defect of the asymmetric epoxy-conductor insert as claimed in claim 2, wherein said controlling said ultrasonic testing apparatus to test said target epoxy-conductor insert according to said ultrasonic testing path comprises:
taking the probe position of the highest point of any target epoxy-conductor insert interface as a first detection position, and determining a second detection position, a third detection position, a fourth detection position and a fifth detection position of an ultrasonic detection path in an undetected area;
placing a first probe of the ultrasonic detection device at a first detection position, and executing ultrasonic detection movement and position judgment; wherein the ultrasonic detection movement comprises: controlling the first probe to move according to the ultrasonic detection path, and controlling the second probe to move to the same vertical plane with the first probe in the metal conductor when the first probe moves to the first detection position, the third detection position or the fifth detection position; the position judgment includes: judging whether the position of the first probe is located at a fifth detection position;
upon determining that the first probe is located at the fifth detection position, the fifth detection position is updated to the first detection position, while the second detection position, the third detection position, the fourth detection position, and the fifth detection position of the ultrasonic detection path are newly determined in the undetected area, a new ultrasonic detection path is formed, and the ultrasonic detection movement is performed.
4. The ultrasonic testing method for the defect of the interface of the asymmetric epoxy-conductor insert as claimed in claim 1, wherein the defect position of the target epoxy-conductor insert interface is determined according to abnormal data in the ultrasonic testing data, specifically:
according to abnormal data of an ultrasonic detection signal peak value of which the received wave peak value is smaller than the defect-free epoxy-conductor insert interface in the ultrasonic detection data, acquiring the abnormal distance between the position of the probe and the highest point of the detected target epoxy-conductor insert interface at the same angle;
and obtaining the abnormal height between the defect position and the highest point of the detected target epoxy-conductor insert interface under the same angle according to the tangent trigonometric function relation and the abnormal distance.
5. The ultrasonic testing method for the interface defect of the asymmetric epoxy-conductor insert as claimed in claim 2, wherein a first probe of the ultrasonic testing apparatus is connected with the epoxy part of the target epoxy-conductor insert by a water-based ultrasonic couplant, and a second probe of the ultrasonic testing apparatus is connected with the metal conductor part of the target epoxy-conductor insert by a water-based ultrasonic couplant.
6. The ultrasonic testing method for the defects of the asymmetric epoxy-conductor insert interfaces as claimed in any one of claims 1 to 5, wherein an ultrasonic testing device is connected with a plurality of epoxy-conductor insert interfaces through a plurality of probes and is used for testing, and the defect positions of the plurality of epoxy-conductor insert interfaces are determined.
7. An ultrasonic testing device for asymmetric epoxy-conductor insert interface defects, comprising: the device comprises a data acquisition module, a path generation module, a detection control module and a defect judgment module;
the data acquisition module is used for acquiring structural data of the target epoxy-conductor insert;
a detection preprocessing module; the detection preprocessing module comprises: an angle data acquisition unit and a connection unit; the angle data acquisition unit is used for acquiring a first critical refraction angle according to an ultrasonic critical refraction longitudinal wave detection principle; the connecting unit is used for connecting a first probe of the ultrasonic detection device with the epoxy part of the target epoxy-conductor insert according to a first critical refraction angle, and connecting a second probe of the ultrasonic detection device with the metal conductor part of the target epoxy-conductor insert; the angle formed by the first probe and the target epoxy-conductor insert interface is a first critical refraction angle; and the target epoxy-conductor insert interface is where an epoxy portion and a metal conductor portion of the target epoxy-conductor insert meet; the ultrasonic signal transmitted by the ultrasonic detection device is transmitted from the epoxy part of the target epoxy-conductor insert through the first probe, and is finally received through the second probe positioned on the metal conductor part after passing through the interface of the target epoxy-conductor insert;
the path generating module is used for obtaining an ultrasonic detection path required by the ultrasonic detection device when the target epoxy-conductor insert is detected according to the structural data and the size of a probe of the ultrasonic detection device;
the detection control module is used for controlling the ultrasonic detection device to detect the target epoxy-conductor insert according to the ultrasonic detection path to obtain ultrasonic detection data;
and the defect judging module is used for determining the interface defect position of the target epoxy-conductor insert according to the abnormal data in the ultrasonic detection data when the ultrasonic detection data has the abnormal data.
8. A computer terminal device comprising a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, the processor implementing an asymmetric epoxy-conductor insert interface defect ultrasonic detection method as claimed in any one of claims 1 to 6 when executing the computer program.
9. A computer readable storage medium comprising a stored computer program, wherein the computer program when executed controls an apparatus in which the computer readable storage medium is located to perform a method for ultrasonic inspection of asymmetric epoxy-conductor insert interface defects as recited in any of claims 1-6.
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