CN115323348B - Pretreatment equipment for coating film on FPGA chip substrate - Google Patents
Pretreatment equipment for coating film on FPGA chip substrate Download PDFInfo
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- CN115323348B CN115323348B CN202210994517.1A CN202210994517A CN115323348B CN 115323348 B CN115323348 B CN 115323348B CN 202210994517 A CN202210994517 A CN 202210994517A CN 115323348 B CN115323348 B CN 115323348B
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- fpga chip
- plate
- substrate
- cleaning
- chip substrate
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
Abstract
The invention discloses pretreatment equipment for coating a substrate of an FPGA chip, which comprises a working frame and a cleaning mechanism; the cleaning mechanism comprises a connecting plate; the connecting plates are arranged above the outer walls of the two sides of the working frame, and the upper parts of the connecting plates are horizontally moved through the connecting beams; the connecting shaft is rotatably arranged on the mounting plate, a connecting plate is sleeved on the connecting shaft, the connecting plate is connected with the output end of the second cylinder, one end of the connecting shaft extends out of the mounting plate, and a fixing frame matched with the substrate carrier is arranged on the connecting shaft; the cleaning mechanism provided by the invention can enable the FPGA chip substrate to continuously swing and clean in degreasing agent solution and deionized water through the arranged swinging mechanism, thereby improving the cleaning efficiency of the FPGA chip substrate.
Description
Technical Field
The invention relates to the technical field of FPGA chips, in particular to pretreatment equipment for coating a substrate of an FPGA chip.
Background
Chinese patent CN113363135a discloses a coating processing method for chips, comprising the steps of: s1, cleaning and degreasing a semi-finished chip; s2, placing the degreased semi-finished product chip in a PECVD (plasma enhanced chemical vapor deposition) growth system, vacuumizing, forming a silicon atom deposition layer on the surface of the semi-finished product chip, S3, processing the semi-finished product chip with the surface plated with the silicon atom deposition layer into a finished product chip, and performing degreasing treatment in the step S1 on the finished product chip; s4, placing the finished chip subjected to degreasing treatment in an ECR-PECVD growth system, and depositing and preparing a crystalline silicon film on the surface of the finished chip;
based on the prior art, during the process of coating, the cleaning and pretreatment of the FPGA chip substrate is generally performed by immersing the FPGA chip substrate in a corresponding liquid, but the manner affects the progress of coating the FPGA chip.
Disclosure of Invention
The invention aims to solve the problems of the background technology and provides pretreatment equipment for coating an FPGA chip substrate.
The aim of the invention can be achieved by the following technical scheme:
a preprocessing equipment for coating a substrate of an FPGA chip comprises a working frame and a cleaning mechanism;
a cleaning mechanism is arranged above the working frame and comprises a connecting plate;
the connecting plates are arranged above the outer walls of the two sides of the working frame, and the upper parts of the connecting plates are horizontally moved through the connecting beams; the connecting shaft is rotatably arranged on the mounting plate, a connecting plate is sleeved on the connecting shaft, the connecting plate is connected with the output end of the second cylinder, one end of the connecting shaft extends out of the mounting plate, and a fixing frame matched with the substrate carrier is arranged on the connecting shaft;
the mount is including installing vertical beam, installation crossbeam, and installation vertical beam level is provided with two to install on the connecting axle, vertical being provided with two on the installation vertical beam, and set up at the installation vertical beam.
As a further scheme of the invention: the mode of horizontal movement of the swinging mechanism is as follows: the front side and the rear side of the connecting beam are respectively provided with a bracket, two limiting rods are respectively arranged between the two brackets, a mounting plate for fixing the swing mechanism is sleeved on the limiting rods, and the mounting plate is connected with the output end of the first cylinder.
As a further scheme of the invention: the working frame is divided into a first cleaning tank, a second cleaning tank and a drying tank by two partition boards.
As a further scheme of the invention: the base plate carrier is including placing the frame, places the frame and is provided with a plurality of side by side, and a plurality of between placing the frame link to each other side by side in proper order through the connecting block, is located both ends are provided with the sleeve respectively about the lateral wall of placing the frame of both sides.
As a further scheme of the invention: the placing frame comprises cross-shaped plates, the two cross-shaped plates are arranged side by side, and the two cross-shaped plates are connected with each other through a connecting strip.
As a further scheme of the invention: a placing groove for loading the FPGA chip substrate is reserved between the two cross-shaped plates.
As a further scheme of the invention: the end of the connecting beam is provided with a transition plate, and the transition plate is provided with a guide chute.
As a further scheme of the invention: the transition plate is correspondingly provided with a correcting mechanism; the correcting mechanism comprises a plurality of bearing plates which are arranged in parallel with the transition plate, wherein the bearing plates are arranged in an annular array, the bearing plates are arranged on a rotating shaft, the bearing plates are provided with bearing grooves, and the bearing grooves are communicated with the guide grooves;
the end of the rotating shaft is provided with a gear, and the connecting shaft is provided with a rack which is matched with the gear.
The invention has the beneficial effects that:
(1) According to the cleaning mechanism, through the swing mechanism, the FPGA chip substrate can be continuously swung and cleaned in the degreasing agent solution and the deionized water, so that the cleaning efficiency of the FPGA chip substrate is improved, and the problems of long cleaning time and low cleaning efficiency in the prior art are solved by immersing the FPGA chip substrate in corresponding liquid so as to drive the cleaning effect; the same is true, the drying efficiency of the FPGA chip substrate is improved, and the swinging mechanism is matched with horizontal movement, so that the position of the FPGA chip substrate can be transferred, degreasing cleaning, washing and drying automation and rapid transfer work are performed on the FPGA chip substrate, and the cleaning efficiency is further improved on the basis of swinging cleaning;
(2) The substrate carrier can finish the cleaning and drying work of a plurality of FPGA chip substrates and the structural design of the placement frame, so that the cleaning area of the FPGA chip substrates can be increased, and the cleaning efficiency of the FPGA chip substrates is further improved;
(3) According to the invention, the transition plate and the correction mechanism are matched, so that the FPGA chip substrate in the vertical state after cleaning can be converted into a horizontal state, and then the FPGA chip substrate is conveyed to the next working procedure by using the conveyor belt, so that the problem that the FPGA chip substrate is damaged due to tilting of the FPGA chip substrate when the FPGA chip substrate is directly dropped on the conveyor belt after cleaning and drying is avoided.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the construction of the work frame of the present invention;
FIG. 3 is a schematic view of the structure of the cleaning mechanism of the present invention;
FIG. 4 is a schematic view of the structure of a substrate carrier of the present invention;
FIG. 5 is a schematic view of the structure of the placement frame of the present invention;
FIG. 6 is a schematic structural view of the connection between the cleaning mechanism and the transition plate according to the present invention;
FIG. 7 is a schematic view of the connection of the installation vertical beams, the transition plates and the correction mechanism;
fig. 8 is a schematic structural view of the connection relationship between the bearing plate and the conveyor belt according to the present invention.
In the figure: 1. a work frame; 2. a cleaning mechanism; 3. a substrate carrier; 4. a transition plate; 5. a correction mechanism; 6. a conveyor belt; 11. a first cleaning tank; 12. a second cleaning tank; 13. a drying tank; 14. a partition plate; 21. a connecting plate; 22. a connecting beam; 23. a bracket; 24. a first cylinder; 25. a limit rod; 26. a mounting plate; 27. a swinging mechanism; 271. a second cylinder; 272. a connecting plate; 273. a connecting shaft; 274. installing a vertical beam; 275. mounting a cross beam; 276. a rack; 31. placing a frame; 32. a connecting block; 33. a sleeve; 41. a guide groove; 51. a gear; 52. a rotation shaft; 53. a carrying plate; 54. a carrying groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-3, the invention relates to a pretreatment device for coating a substrate of an FPGA chip, comprising a working frame 1 and a cleaning mechanism 2;
a cleaning mechanism 2 is arranged above the working frame 1, and the cleaning mechanism 2 comprises a connecting plate 21, a connecting beam 22, a bracket 23, a first cylinder 24, a limiting rod 25, a mounting plate 26 and a swinging mechanism 27;
the connecting plates 21 are arranged above the outer walls of the two sides of the working frame 1, connecting beams 22 are arranged above the connecting plates 21, and swinging mechanisms 27 capable of horizontally moving are arranged on the two connecting beams 22, wherein each swinging mechanism 27 comprises a second cylinder 271, a connecting plate 272 and a connecting shaft 273; the connecting shaft 273 is rotatably installed on the mounting plate 26, the connecting plate 272 is sleeved on the connecting shaft 273, the connecting plate 272 is connected with the output end of the second air cylinder 271, the second air cylinder 271 is installed on the mounting plate 26, one end of the connecting shaft 273 extends out of the mounting plate 26, and a fixing frame matched with the substrate carrier 3 is arranged;
the fixing frame comprises two mounting vertical beams 274 and mounting cross beams 275, wherein the two mounting vertical beams 274 are horizontally arranged and mounted on the connecting shaft 273, the two mounting vertical beams 274 are vertically arranged and arranged on the mounting vertical beams 274, the fixing frame is of a rectangular frame structure through the arrangement of the two mounting vertical beams 274 and the four mounting cross beams 275, and the mounting vertical beams 274 and the mounting cross beams 275 are detachably connected, so that the volume of the fixing frame can be adjusted through the adjustment of the mounting vertical beams 274 and the mounting cross beams 275, and chip matrixes with different numbers or different sizes can be mounted on the cleaning mechanism 2;
the manner in which the swing mechanism 27 moves horizontally is: the front side and the rear side of the connecting beam 22 are respectively provided with a bracket 23, two limiting rods 25 are respectively arranged between the two brackets 23, a mounting plate 26 for fixing a swinging mechanism 27 is sleeved on the limiting rods 25, the mounting plate 26 is connected with the output end of a first air cylinder 24, and the first air cylinder 24 is arranged on the bracket 23; by starting the first air cylinder 24, the mounting plate 26 can horizontally move along the limiting rod 25, so that the swing mechanism 27 is driven to horizontally move to a designated position, and the corresponding cleaning work is completed;
two partition plates 14 are arranged in the working frame 1 at intervals, so that the working frame 1 is divided into a first cleaning tank 11, a second cleaning tank 12 and a drying tank 13 through the two partition plates 14, the first cleaning tank 11, the second cleaning tank 12 and the drying tank 13 are sequentially arranged, degreasing agent solution is filled in the first cleaning tank 11, deionized water is filled in the second cleaning tank 12, a heat source is provided in the drying tank 13, and the cleaned FPGA chip substrate is subjected to rapid drying treatment;
when the degreasing cleaning device works, the first air cylinder 24 is started to enable the mounting plate 26 to horizontally move along the limiting rod 25, the swinging mechanism 27 with the FPGA chip substrate is firstly moved to the upper side of the first cleaning tank 11, then the second air cylinder 271 is controlled to work, the connecting shaft 273 is driven to rotate along the mounting plate 26 through the connecting plate 272, the FPGA chip substrate on the swinging mechanism 27 is enabled to rotate into the first cleaning tank 11, then the second air cylinder 271 is controlled to perform small-amplitude reciprocating telescopic work, the connecting shaft 273 is enabled to continuously reciprocate to drive the FPGA chip substrate on the fixing frame to continuously swing in the degreasing agent solution, and therefore degreasing cleaning of the FPGA chip substrate is completed;
after degreasing and cleaning are completed, the second cylinder 271 is controlled to enable the chip swinging mechanism 27 to be in a horizontal state, and then the chip swinging mechanism is moved into the second cleaning tank 12 under the pushing action of the first cylinder 24, and the FPGA chip substrate is driven to swing continuously in deionized water according to degreasing and cleaning work, so that the washing work of the FPGA chip substrate is completed;
after the water washing is finished, the second air cylinder 271 and the first air cylinder 24 are continuously controlled, so that the FPGA chip substrate enters the drying groove 13, and the FPGA chip substrate continuously swings in a heat source, so that the drying work of the FPGA chip substrate is finished;
therefore, the cleaning mechanism 2 can enable the FPGA chip substrate to continuously swing and clean in degreasing agent solution and deionized water through the swing mechanism 27, so that the cleaning efficiency of the FPGA chip substrate is improved, and the problems of long cleaning time and low cleaning efficiency in the prior art are solved by immersing the FPGA chip substrate in corresponding liquid so as to drive the cleaning effect; similarly, the drying efficiency of the FPGA chip substrate will be improved, and the swinging mechanism 27 is matched with the horizontal movement, so that the position of the FPGA chip substrate can be transferred, and the degreasing cleaning, the washing and the drying automation and the rapid transfer of the FPGA chip substrate can be performed, so that the cleaning efficiency of the FPGA chip substrate is further improved on the basis of swinging cleaning.
Example 2
Referring to fig. 4 and 5, based on the above embodiment 1, the substrate carrier 3 includes a plurality of placement frames 31, a connection block 32, and a sleeve 33, wherein the placement frames 31 are arranged side by side, and the placement frames 31 are sequentially connected side by side through the connection block 32, and the upper and lower ends of the side walls of the placement frames 31 at the two sides are respectively provided with the sleeve 33; the substrate carrier 3 can complete the mounting and placing work of a plurality of FPGA chip substrates, thereby achieving the simultaneous cleaning and drying treatment work of the plurality of FPGA chip substrates;
the placement frame 31 comprises a cross-shaped plate, the two cross-shaped plates are arranged side by side, the two cross-shaped plates are connected with each other through connecting strips, the connecting strips are three, two connecting strips are positioned on the vertical part of the cross-shaped plate, the other connecting strip is positioned on the horizontal part of the cross-shaped plate, and a placement groove for loading an FPGA chip substrate is reserved between the two cross-shaped plates; the placement frame 31 adopts a cross-shaped plate structure, so that the substrate of the FPGA chip is exposed in a larger area, and the cleaning efficiency of the FPGA chip is improved;
during operation, the substrate carrier 3 is mounted on the mounting cross beam 275 of the swinging mechanism 27 through the sleeve 33 and is fixed, and then the FPGA chip substrates to be cleaned are sequentially placed in the placing groove, so that the substrate carrier 3 completes the cleaning and drying of the plurality of FPGA chip substrates and the structural design of the placing frame 31 on the basis of the embodiment 1, the cleaning area of the FPGA chip substrates can be increased, and the cleaning efficiency of the FPGA chip substrates can be further improved;
and after the cleaning is finished, the swinging mechanism 27 is moved to the end part of the connecting beam 22, and then the connecting shaft 273 is driven to rotate, so that the substrate carrier 3 is inclined outwards, namely, one side of the substrate carrier 3 away from the connecting shaft 273 is higher than one side of the substrate carrier 3 close to the connecting shaft 273, so that the FPGA chip substrate is moved along the placing groove and falls on the conveying belt 6 to enter the next working procedure for working.
Example 3
Referring to fig. 6-8, based on the above embodiment 2, when the FPGA chip substrate is led out, the FPGA chip substrate is in a vertical state, so that when the FPGA chip substrate falls on the conveyor belt 6, the FPGA chip substrate falls down, resulting in damage to the FPGA chip substrate;
therefore, a transition plate 4 is arranged at the end part of the connecting beam 22, a guide groove 41 is arranged on the transition plate 4, and a correction mechanism 5 is correspondingly arranged on the transition plate 4; the correcting mechanism 5 comprises a gear 51, a rotating shaft 52, a bearing plate 53 and a bearing groove 54, wherein the bearing plate 53 and the transition plate 4 are arranged in parallel, a plurality of bearing plates 53 are arranged in an annular array, the bearing plate 53 is arranged on the rotating shaft 52, the bearing plate 53 is provided with the bearing groove 54, and the bearing groove 54 and the guide groove 41 can be mutually communicated;
wherein, the end of the rotating shaft 52 is provided with a gear 51, and the connecting shaft 273 is provided with an adaptive rack 276;
the carrier plate 53 is provided with a conveyer belt 6 in a matching way, so that the FPGA chip substrate in the carrier plate 53 can directly slide onto the conveyer belt 6;
the transition plate 4 and the correction mechanism 5 are obliquely arranged and are matched with the FPGA chip substrate which is led out from the substrate carrier 3;
when the FPGA chip substrate is dried, the connecting shaft 273 is driven to rotate so that the substrate carrier 3 tilts outwards, then the first cylinder 24 is controlled so that the swinging mechanism 27 continues to move towards the direction of the transition plate 4, and when the first placement frame 31 is aligned with the guide chute 41, the FPGA chip substrate enters the bearing groove 54 of the bearing plate 53 along the guide chute 41;
then, the swing mechanism 27 is continuously moved forwards, so that the next FPGA chip substrate is positioned at the guide groove 41 for guiding and discharging, meanwhile, the rack 276 on the connecting shaft 273 rotates the driving gear 51, the bearing plate 53 is driven to rotate through the rotating shaft 52, the next bearing plate 53 is rotated to the guide groove 41, and the next FPGA chip substrate is guided out;
sequentially carrying out the above operations, guiding out all the cleaned FPGA chip substrates, converting the FPGA chip substrates in the vertical state into a horizontal state in the guiding-out process, and sliding the FPGA chip substrates onto the conveying belt 6 along the bearing groove 54;
therefore, the transition plate 4 and the correction mechanism 5 are matched, so that the FPGA chip substrate in the vertical state after cleaning can be converted into a horizontal state, and then the FPGA chip substrate is conveyed to the next process by the conveying belt 6, so that the problem that the FPGA chip substrate is damaged due to the fact that the FPGA chip substrate falls down when the FPGA chip substrate is directly arranged on the conveying belt 6 after cleaning and drying is avoided.
Example 4
Based on the above embodiment 3, a pretreatment process for coating a substrate of an FPGA chip includes the following steps:
step 1: the substrate carrier 3 is arranged on the mounting cross beam 275 of the swinging mechanism 27 through the sleeve 33 and fixed, and then the FPGA chip substrates to be cleaned are sequentially placed in the placing groove;
step 2: starting a first air cylinder 24 to enable a mounting plate 26 to horizontally move along a limiting rod 25, firstly moving a swinging mechanism 27 with an FPGA chip substrate to the upper side of a first cleaning tank 11, then controlling a second air cylinder 271 to work, driving a connecting shaft 273 to rotate along the mounting plate 26 through a connecting plate 272, enabling the FPGA chip substrate on the swinging mechanism 27 to rotate into the first cleaning tank 11, and then controlling the second air cylinder 271 to perform small-amplitude reciprocating telescopic work, enabling the connecting shaft 273 to continuously reciprocate, and driving the FPGA chip substrate on a fixing frame to continuously swing in degreasing agent solution, so that degreasing and cleaning of the FPGA chip substrate are completed;
after degreasing and cleaning are completed, the second cylinder 271 is controlled to enable the chip swinging mechanism 27 to be in a horizontal state, and then the chip swinging mechanism is moved into the second cleaning tank 12 under the pushing action of the first cylinder 24, and the FPGA chip substrate is driven to swing continuously in deionized water according to degreasing and cleaning work, so that the washing work of the FPGA chip substrate is completed;
after the water washing is finished, the second air cylinder 271 and the first air cylinder 24 are continuously controlled, so that the FPGA chip substrate enters the drying groove 13, and the FPGA chip substrate continuously swings in a heat source, so that the drying work of the FPGA chip substrate is finished;
step 3: after the cleaning is finished, the swinging mechanism 27 is moved to the end part of the connecting beam 22, then the connecting shaft 273 is driven to rotate, so that the substrate carrier 3 is inclined outwards, the first air cylinder 24 is controlled, the swinging mechanism 27 continues to move towards the direction of the transition plate 4, and when the first placing frame 31 is aligned with the guide groove 41, the FPGA chip substrate enters into the bearing groove 54 of the bearing plate 53 along the guide groove 41;
then, the swing mechanism 27 is continuously moved forwards, so that the next FPGA chip substrate is positioned at the guide groove 41 for guiding and discharging, meanwhile, the rack 276 on the connecting shaft 273 rotates the driving gear 51, the bearing plate 53 is driven to rotate through the rotating shaft 52, the next bearing plate 53 is rotated to the guide groove 41, and the next FPGA chip substrate is guided out;
in order, all the cleaned FPGA chip substrates are led out, and in the process of leading out, the FPGA chip substrates in the vertical state are converted into a horizontal state and then slide down onto the conveyor belt 6 along the carrying groove 54.
The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (5)
1. The pretreatment equipment for the coating of the FPGA chip substrate is characterized by comprising a working frame (1) and a cleaning mechanism (2);
a cleaning mechanism (2) is arranged above the working frame (1), and the cleaning mechanism (2) comprises a connecting plate (21);
the connecting plates (21) are arranged above the outer walls of the two sides of the working frame (1), connecting beams (22) are arranged above the connecting plates (21), and swinging mechanisms (27) capable of horizontally moving on the two connecting beams (22) are arranged above the connecting plates (21), wherein each swinging mechanism (27) comprises a second air cylinder (271), a connecting plate (272) and a connecting shaft (273); the connecting shaft (273) is rotatably arranged on the mounting plate (26), the connecting plate (272) is sleeved on the connecting shaft (273), the connecting plate (272) is connected with the output end of the second air cylinder (271), the second air cylinder (271) is arranged on the mounting plate (26), one end of the connecting shaft (273) extends out of the mounting plate (26), and a fixing frame matched with the substrate carrier (3) is arranged;
the fixing frame comprises two mounting vertical beams (274) and two mounting cross beams (275), wherein the two mounting vertical beams (274) are horizontally arranged and are mounted on the connecting shaft (273), and the mounting cross beams (275) are vertically arranged on the mounting vertical beams (274);
the end part of the connecting beam (22) is provided with a transition plate (4), and a guide chute (41) is arranged on the transition plate (4);
a correcting mechanism (5) is correspondingly arranged on the transition plate (4); the correcting mechanism (5) comprises a bearing plate (53), wherein the bearing plate (53) is arranged in parallel with the transition plate (4), a plurality of bearing plates (53) are arranged in an annular array, the bearing plates (53) are arranged on a rotating shaft (52), bearing grooves (54) are formed in the bearing plates (53), and the bearing grooves (54) are communicated with the guide grooves (41);
the end part of the rotating shaft (52) is provided with a gear (51), and the connecting shaft (273) is provided with a rack (276) which is matched with the gear; a conveying belt (6) is arranged at the bearing plate (53) in a matched manner;
the swinging mechanism (27) horizontally moves in the following way: the front side and the rear side of the connecting beam (22) are respectively provided with a bracket (23), two limiting rods (25) are respectively arranged between the two brackets (23), a mounting plate (26) for fixing a swinging mechanism (27) is sleeved on the limiting rods (25), the mounting plate (26) is connected with the output end of a first air cylinder (24), and the first air cylinder (24) is arranged on the brackets (23).
2. The pretreatment device for coating a substrate of an FPGA chip according to claim 1, wherein the work frame (1) is divided into a first cleaning tank (11), a second cleaning tank (12) and a drying tank (13) by two partition boards (14).
3. The pretreatment device for coating a substrate of an FPGA chip according to claim 1, wherein the substrate carrier (3) comprises a plurality of placement frames (31), the placement frames (31) are arranged side by side, the placement frames (31) are sequentially connected side by side through connecting blocks (32), and sleeves (33) are respectively arranged at upper and lower ends of the side walls of the placement frames (31) at two sides.
4. A pretreatment device for plating a substrate of an FPGA chip according to claim 3, characterized in that the placement frame (31) comprises a cross-shaped plate, two cross-shaped plates being arranged side by side, the two cross-shaped plates being connected to each other by a connecting strip.
5. The pretreatment device for coating an FPGA chip substrate according to claim 4, wherein a placement groove for loading the FPGA chip substrate is reserved between the two cross-shaped plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210994517.1A CN115323348B (en) | 2022-08-18 | 2022-08-18 | Pretreatment equipment for coating film on FPGA chip substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210994517.1A CN115323348B (en) | 2022-08-18 | 2022-08-18 | Pretreatment equipment for coating film on FPGA chip substrate |
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| Publication Number | Publication Date |
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| CN115323348A CN115323348A (en) | 2022-11-11 |
| CN115323348B true CN115323348B (en) | 2023-09-22 |
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| CN115323348A (en) | 2022-11-11 |
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