CN115323306B

CN115323306B - Sputtering method and sputtering target unit

Info

Publication number: CN115323306B
Application number: CN202210396509.7A
Authority: CN
Inventors: 植松聪
Original assignee: Toyota Motor Corp
Current assignee: Toyota Motor Corp
Priority date: 2021-04-23
Filing date: 2022-04-15
Publication date: 2024-03-22
Anticipated expiration: 2042-04-15
Also published as: CN115323306A; JP2022167356A

Abstract

The invention relates to a sputtering method and a sputtering target unit. A thermal spraying method for spraying a thermal spraying member comprises: a step of preparing a mask member having a mask through hole, a sputtering target member, and a masking tool having a tool through hole; a step of disposing a mask member on the surface of the masking tool so that the mask through-hole and the tool through-hole overlap with each other; a step of disposing a member to be sputtered on the back surface of the masking tool; and a step of spraying a spray material from the mask through hole toward the sprayed member.

Description

Sputtering method and sputtering target unit

Technical Field

The present disclosure relates to a sputtering method and a sputtering target unit.

Background

A technique is known in which a masking tool provided with a through portion for spraying a spray material is used when spraying the spray material and fixing a spray-target member to a fixed object (for example, japanese patent application laid-open No. 2015-112534). The masking tool is disposed on the sprayed member.

Disclosure of Invention

When sputtering is performed using a masking tool, there is a problem in that deposition material adheres to and accumulates on the masking tool. When the deposition material is deposited on the masking tool, for example, dimensional errors may occur in the through-hole of the masking tool. Further, cleaning and replacement of the masking tool may be required.

The present disclosure can be implemented as follows.

(1) According to one aspect of the present disclosure, a deposition method for depositing a deposition target member is provided. The spraying method comprises the following steps: a step of preparing a mask member having a mask through hole, a sputtering target member, and a masking tool having a tool through hole; a step of disposing the mask member on the surface of the masking tool so that the mask through-hole and the tool through-hole overlap with each other; a step of disposing the sputtering target on the back surface of the masking tool; and a step of spraying a spray material from the mask through hole toward the sprayed member.

According to the deposition method of this aspect, deposition of the deposition material on the surface of the masking tool can be reduced or prevented because the masking member is deposited in a state of covering the surface of the masking tool.

(2) In the deposition method according to the above aspect, the mask member and the deposition target member may be connected by a connecting member, and in the step of disposing the deposition target member on the rear surface of the masking tool, the connecting member may be bent to dispose the deposition target member on the rear surface of the masking tool.

According to the sputtering method of this embodiment, after the mask member is disposed on the masking tool, the sputtering target member can be easily disposed on the rear surface of the masking tool.

(3) The sputtering method according to the above aspect may further include: cutting the connecting member after the step of spraying the spray material, and dividing the mask member from the sprayed member; and removing the divided mask member.

According to the deposition method of this aspect, the mask member can be easily detached from the deposition target member to be deposited.

(4) In the sputtering method according to the above aspect, the sputtering target may be an electrode electrically connected to a surface electrode of the electrically heated catalyst, and the sputtering target may further include a step of disposing the masking tool on the surface of the surface electrode after the step of disposing the sputtering target on the rear surface of the masking tool.

According to the sputtering method of this embodiment, deposition of the sputtering material on the surface of the masking tool can be reduced or prevented during the production of the electrically heated catalyst.

(5) According to another aspect of the present disclosure, a deposition subject unit for use in a masking tool is provided. The object unit includes: a deposition target member, the deposition target being deposited at a deposition target position including a portion of the deposition target member; a mask member having a mask through hole; and a coupling member that couples the mask member and the deposition target member so that the deposition target unit can be bent to a state in which a surface of the mask member and a surface of the deposition target member face each other. In the opposed state, the mask through hole and the deposition position are disposed at positions overlapping each other.

According to the object unit of this aspect, by assembling the masking tool to the object unit in the opposing state, it is possible to perform sputtering in a state in which the surface of the masking tool is covered with the masking member. Accordingly, deposition of the deposition material on the surface of the masking tool can be reduced or prevented.

(6) In the above-described object unit, the distance from the rotation axis of the mask member to the mask through hole when the object unit is bent to the opposing state may be equal to the distance from the rotation axis to the object position.

According to the object unit of this aspect, when the object unit is brought into the facing state, the mask through hole and the object position are easily overlapped with each other.

(7) In the above-described object unit, the mask member may include a position alignment mechanism for aligning a tool through hole provided in the masking tool with a position of the mask through hole.

According to the object unit of this embodiment, the tool through hole of the masking tool is easily aligned with the mask through hole.

The present disclosure can be implemented in various ways other than the sputtering method and the sputtering target unit. For example, the present invention can be realized as a thermal spraying body masking unit, a catalyst for electrical heating, a part for a vehicle, a method for producing a part for a vehicle, a method for processing a part for a vehicle, a surface treatment method, a construction method, a method for forming a sprayed film, a method for producing a thermal spraying body unit, a method for producing a thermal spraying body masking unit, a method for producing a catalyst for electrical heating, a method for producing a part for a vehicle, or the like.

Drawings

Features, advantages, technical and industrial significance of embodiments of the present invention are described below with reference to the accompanying drawings, in which like numerals denote like elements, in which:

fig. 1 is a perspective view showing the structure of a thermal spraying object masking unit.

Fig. 2 is a perspective view showing a deposition target unit according to the first embodiment.

Fig. 3 is an explanatory diagram showing a structure of a surface of the masking tool.

Fig. 4 is an explanatory diagram showing a structure of the rear surface of the masking tool.

Fig. 5 is a process diagram showing a sputtering method using a sputtering target masking unit.

Fig. 6 is a process diagram showing an assembly method of the thermal spraying object masking unit.

Fig. 7 is an explanatory view schematically showing a case where the thermal spraying object masking unit is assembled.

Fig. 8 is an explanatory diagram showing a sputtering method using a sputtering target masking unit.

Detailed Description

A. First embodiment:

fig. 1 is a perspective view showing a configuration of a thermal spraying body masking unit 300 provided with a thermal spraying body unit 100 as a first embodiment of the present disclosure. The thermal spraying body masking unit 300 is used when thermal spraying a thermal spraying material onto a thermal spraying member which is a target of thermal spraying of the thermal spraying material. In the present embodiment, the thermal spraying member is an electrode wire disposed on a surface electrode of an electrically heated catalyst (EHC: electrically Heated Catalyst). The electrically heated catalyst is used, for example, to forcedly activate the catalyst by electrically heating, thereby improving the purification efficiency of exhaust gas. As the electrically heated catalyst, for example, a cylindrical carrier having a honeycomb structure on which a catalyst such as platinum or palladium is supported is used. An energizing surface electrode is formed on the outer peripheral surface of the carrier. In the present embodiment, the sputtering target masking unit 300 is used to fix the electrode wiring for current application to the surface electrode of the current-carrying heated catalyst.

The object masking unit 300 includes the object unit 100 and the masking tool 200 according to the present embodiment. In fig. 1, hatching is added only to the deposition target unit 100 for easy understanding of the technique. The thermal spraying body masking unit 300 is formed by assembling the thermal spraying body unit 100 to the masking tool 200.

The sputtering target masking unit 300 includes a sputtering through-hole 342 for passing a sputtering material. The sputtering target member (electrode member 60 described later in this embodiment) included in the sputtering target unit 100 is fixed to the surface electrode of the electrically heated catalyst through the sputtering target through-hole 342 of the sputtering target masking unit 300. When the deposition material is used to fix the deposition material, the object to which the deposition material is used to fix the deposition material is also referred to as a "fixed object". In the present embodiment, the object to be immobilized is a surface electrode of an electrically heated catalyst. The thermal spraying body masking unit 300 suppresses adhesion of the thermal spraying material to an unintended position in the thermal spraying member by covering the surface of the thermal spraying member when the thermal spraying material is sprayed. As the sputtering material, various materials such as metal, ceramic, plastic, and cermet can be used. In the present embodiment, a powder composite material in which a metal and a ceramic are mixed is used as the sputtering material. The material of the thermal spraying material is not limited to powder, and may be a wire rod or a rod.

Fig. 2 is a perspective view showing the deposition target unit 100 according to the present embodiment. The sputtering target unit 100 is a flat plate-like member formed using a stainless steel alloy. The sputtering target unit 100 includes a mask member 40, a connecting member 50, and an electrode member 60. In the present embodiment, in the sputtering target unit 100, the mask member 40, the connecting member 50, and the electrode member 60 are arranged in this order on substantially the same straight line. The object unit 100 shown in fig. 2 shows a state after manufacture and a state before assembly into the masking tool 200. In the present embodiment, the thermal spraying body unit 100 is manufactured by mold molding using a metal material, and the mask member 40, the connecting member 50, and the electrode member 60 are integrally formed by mold molding. The deposition target unit 100 is not limited to a stainless steel alloy, and may be formed using various metals, for example, various alloys such as a Ni-based alloy and a Co-based alloy.

As shown in fig. 2, the manufactured thermal spraying body unit 100 is formed such that the plane direction of the surface MT of the mask member 40 and the plane direction of the surface ET of the electrode member 60 as a thermal spraying member are on the same plane as each other. As shown in fig. 2, a state in which the plane direction of the surface MT of the mask member 40 and the plane direction of the surface ET of the electrode member 60 are on the same plane as each other is also referred to as a "parallel state". The back surface MB of the mask member 40 and the back surface EB of the electrode member 60 are configured in the same manner as the surface MT of the mask member 40 and the surface ET of the electrode member 60, and therefore, the description thereof is omitted.

The electrode member 60 is a flat plate-like member having a thickness of about 0.1 mm. The electrode member 60 is a sputtering target member onto which a sputtering material is sputtered, and is fixed to a surface electrode of an electrically heated catalyst that is a fixed object. The electrode member 60 fixed to the surface electrode functions as an electrode for energizing the electrically heated catalyst. In the present embodiment, the electrode member 60 functions as an anode provided in a pair of electrodes of the electrically heated catalyst. The electrode member 60 is not limited to the anode, and may be used as a cathode, and may be used as both an anode and a cathode.

As shown in fig. 2, the electrode member 60 includes a first wiring 61 and a second wiring 62. The electrode member 60 has a shape long in one direction, and the first wiring 61 and the second wiring 62 are arranged in order along the extending direction. The first wiring 61 is a portion of the electrode member 60 that is directly or indirectly connected to a power source such as a battery. The second wiring 62 is a portion that is in contact with the surface electrode of the electrically heated catalyst and is electrically connected thereto. The second wiring 62 is formed continuously with the first wiring 61, and supplies electric power supplied from the power supply via the first wiring 61 to the surface electrode of the electrically heated catalyst. In the present embodiment, the second wiring 62 has 15 linear wirings, and has a so-called Comb-tooth (Comb-tooth) appearance. The width of each of the second wirings 62 is, for example, about 0.5 to 1.0 mm.

Each of the second wires 62 is fixed to the surface electrode by disposing a plating material in a range of a part of each of the second wires 62 disposed on the surface electrode of the electrically heated catalyst and the surface electrode around each of the wires. In the present disclosure, a predetermined position at which the deposition material is deposited on the deposition target member is also referred to as a "deposition target position". The position to be sprayed is preset. When the deposition target member is fixed to the fixed target using the deposition material, the deposition target position includes a part of the fixed target. In fig. 2, the deposition position PT is conceptually shown for easy understanding of the technique. The deposition position PT includes a part of the surface electrode as the fixed object and a part of the second wiring 62 as the deposition member disposed on the surface electrode. The number of the deposition positions PT and the arrangement positions thereof can be arbitrarily set. In the present embodiment, the number of the plating positions PT is 15 which is the same as the number of the wirings included in the second wiring 62. The deposition positions PT are arranged on the straight lines of the first line PL1 and the second line PL 2. The first line PL1 has 8 deposition positions PT, and the second line PL2 has 7 deposition positions PT. The deposition positions PT are arranged in a so-called staggered arrangement (staggered array) in which the first line PL1 and the second line PL2 are alternately arranged.

The mask member 40 is a flat plate-like member having a thickness of about 0.1 mm. When the masking member 40 is used for spraying the spray material, as will be described later, the surface of the masking tool 200 is covered, thereby reducing or suppressing the adhesion of the spray material to the masking tool 200. The mask member 40 includes a mask through hole 42 and a fixing hole 44.

The fixing hole 44 is fitted to a mask fixing protrusion 244 of the masking tool 200 as will be described later. The fixing hole 44 functions together with the mask fixing protrusion 244 as a position alignment mechanism for aligning the mask member 40 with the position of the masking tool 200 when the mask member 40 is arranged on the masking tool 200.

The mask through hole 42 is a portion through which the deposition material passes during deposition. The mask through-hole 42 penetrates the mask member 40 from the front surface MT to the back surface MB of the mask member 40, that is, in the thickness direction. The mask through holes 42 are provided with the number corresponding to the number of the plating positions PT. In the present embodiment, 15 mask through holes 42 are provided. The mask through holes 42 are arranged on respective straight lines of a first line ML1 corresponding to the first line PL1 of the deposition positions PT and a second line ML2 corresponding to the second line PL 2. The first column ML1 has 8 mask through holes 42, and the second column ML2 has 7 mask through holes 42. The mask through holes 42 are alternately arranged in the first and second columns ML1 and ML2, respectively, and are arranged in a so-called staggered arrangement.

The connection member 50 connects the electrode member 60 and the mask member 40. In the present embodiment, the coupling member 50 is a shaft-like member having a thickness of about 0.1mm and a width of about 0.5 to 1.0 mm. In the example of fig. 2, the connection member 50 is provided at an end portion of the second wiring 62 in the extending direction of the electrode member 60. The length W1 of the coupling member 50 is longer than the thickness T1 of the masking tool 200 described later. The coupling member 50 can be bent by plastic deformation of metal, and the phase alignment position of the mask member 40 and the electrode member 60 can be arbitrarily changed. The connection member 50 can be cut, for example, by cutting after the completion of the sputtering, to divide the sputtered body unit 100 into the mask member 40 and the electrode member 60.

In the present embodiment, two coupling members 50 are provided. The arrangement direction of the two coupling members 50 is a direction orthogonal to the arrangement direction of the mask member 40 and the electrode member 60. Thus, the rotation axis of the mask member 40 during bending is configured as the rotation axis BD along the arrangement direction of the coupling members 50. That is, the object unit 100 according to the present embodiment can rotate the mask member 40 about the rotation axis BD with respect to the electrode member 60. As a result, the coupling member 50 can bend the deposition target unit 100 to a state in which the surface MT of the mask member 40 and the surface ET of the electrode member 60 face each other. The number of the coupling members 50 is not limited to two, and may be one, or three or more. The coupling member 50 is not limited to the shaft shape, and may have any shape, for example, a flat plate shape, and may have a columnar shape such as a column or a polygonal column.

Fig. 2 shows a rotation axis BD of the mask member 40 in a case where one mask through hole 421 included in the plurality of mask through holes 42, one deposition position PT1 included in the plurality of deposition positions PT, and the deposition target unit 100 are bent to face each other. The mask through hole 421 is disposed at a position corresponding to the deposition position PT 1. Specifically, the mask through-holes 421 are arranged at positions overlapping the deposition positions PT1 in a plan view when the deposition target units 100 are in a facing state. Fig. 2 shows a linear distance L1 from the rotation axis BD to the mask through hole 421 and a linear distance L2 from the rotation axis BD to the deposition position PT 1. The straight distance L1 and the straight distance L2 are equal. In this way, the mask through holes 42 and the deposition positions PT corresponding thereto are arranged such that the linear distance from the rotation axis BD to the mask through holes 42 is equal to the linear distance from the rotation axis BD to the deposition positions PT. For example, in the parallel-state object unit 100 shown in fig. 2, each mask through hole 42 is disposed at a position symmetrical with respect to the axis of symmetry BD with respect to the position at which each deposition position PT is disposed. In this way, in the opposing object unit 100, the mask through holes 42 of the mask member 40 can be arranged so as to overlap the respective object positions PT of the second wiring 62.

Fig. 3 is an explanatory diagram showing a structure of the surface TP of the masking tool 200. The masking tool 200 is a flat plate-like member formed using aluminum or an aluminum alloy. When the masking tool 200 sprays the spray material, the surface of the electrode member 60 and the surface electrode, which are the spray-target members, are covered, whereby the spray material is prevented from adhering to the spray-target position PT, that is, the surface electrode and the non-predetermined position in the electrode member 60. In the formation of the sputtering target masking unit 300, the mask member 40 is disposed on the surface TP of the masking tool 200 in a state where the surface MT of the mask member 40 is in contact with the surface TP of the masking tool 200. The masking tool 200 is not limited to aluminum, and may be formed using various metal materials such as iron-based materials. The mask member 40 may be disposed so as to face the surface TP of the masking tool 200 and be away from the surface TP of the masking tool 200 without abutting the surface TP of the masking tool 200.

The mask tool 200 has a tool through hole 242 and a mask fixing protrusion 244 provided on a surface TP thereof. The tool through hole 242 is a part of the through hole 342 for spraying, and is a through hole for passing a spraying material. The tool through hole 242 penetrates the masking tool 200 from the front surface TP to the rear surface BP of the masking tool 200, that is, in the thickness direction. The number of tool through holes 242 is set to a number corresponding to the number of the positions PT to be plated, that is, a number corresponding to the mask through holes 42 of the mask member 40. In the present embodiment, the number of tool through holes 242 is 15, and the tool through holes are arranged in a straight line in each of the first row JL1 corresponding to the first row PL1 of the deposition positions PT and the second row JL2 corresponding to the second row PL2 of the deposition positions PT. The first row JL1 has 8 tool through holes 242, and the second row JL2 has 7 tool through holes 242. The tool through holes 242 are alternately arranged in the first row JL1 and the second row JL2, respectively, and are arranged in a so-called staggered arrangement. When the deposition target unit 100 is assembled to the masking tool 200, the tool through-hole 242 and the mask through-hole 42 overlap with each other, and the deposition through-hole 342 shown in fig. 1 is formed in the deposition target masking unit 300.

The mask fixing protrusion 244 is fitted into the fixing hole 44 provided in the mask member 40 shown in fig. 2. The mask fixing protrusion 244 functions as a position alignment mechanism for aligning the tool through hole 242 with the mask through hole 42 when the mask member 40 is placed on the surface TP of the masking tool 200 together with the fixing hole 44. In the case where the tool through-hole 242 and the mask through-hole 42 are aligned with sufficient accuracy, the mask fixing convex portion 244 and the fixing hole 44 may not be provided.

Masking tool 200 has a first side S1 and a second side S2 opposite first side S1. When the coupling member 50 is bent to form the opposing state of the deposition body unit 100, the first side surface S1 abuts against the coupling member 50 and functions as a guide portion for defining the rotation axis BD. A recess 261 is formed on the second side surface S2. The recess 261 has a shape having a concave shape toward the center of the masking tool 200. The width of the recess 261 is substantially the same as the width of the first wiring 61 of the electrode member 60. Thus, for example, after the electrode member 60 is fixed to the surface electrode by spraying the spray material onto the spray masking unit 300 shown in fig. 1, the first wiring 61 is bent in a direction away from the fixation target in order to connect the first wiring 61 to the power supply.

Fig. 4 is an explanatory diagram showing the structure of the back surface BP of the masking tool 200. The electrode member 60 is disposed on the back surface BP of the masking tool 200. From the standpoint of avoiding contact between the deposition material deposited by deposition and the inner wall of the tool through hole 242 of the masking tool 200, the electrode member 60 is preferably in a state of being separated from the back surface BP of the masking tool 200 in a state where the deposition target masking unit 300 is formed. However, the electrode member 60 is not limited to this, and may be disposed in contact with the back surface BP of the masking tool 200.

As shown in fig. 4, four wiring fixing projections 260 are provided on the back surface BP of the masking tool 200. The four wiring fixing projections 260 are arranged at positions corresponding to the outer shape of the second wiring 62. Each wire fixing protrusion 260 abuts on the outer peripheral ends of the four corners of the second wire 62 when the second wire 62 is arranged on the back surface BP of the masking tool 200. Accordingly, when the second wiring 62 is disposed on the back surface BP of the masking tool 200, the position PT to be sputtered acts as a position alignment mechanism with respect to the tool through hole 242. According to the thus configured object masking unit 300, when the coupling member 50 is bent to be in a facing state after the mask member 40 is disposed on the front surface TP of the masking tool 200, the electrode member 60 can be easily aligned with respect to the rear surface BP of the masking tool 200. As a result, the position PT of the electrode member 60 can be easily aligned with respect to the tool through hole 242 of the masking tool 200.

The steps of the deposition method using the deposition target masking unit 300 including the deposition target unit 100 according to the present embodiment will be described with reference to fig. 5 to 8. Fig. 5 is a process diagram showing a sputtering method using the sputtering target masking unit 300. In step S10, the deposition subject unit 100 and the masking tool 200 are prepared. The object unit 100 may be prepared in a parallel state after the mold forming shown in fig. 2.

In step S20, the thermal spraying object masking unit 300 is assembled. Specifically, the thermal spraying body masking unit 300 is formed by assembling the thermal spraying body units 100 in a facing state in the masking tool 200. In step S30, the assembled sputtering target masking unit 300 is disposed on the surface electrode of the electrically heated catalyst. In step S40, a deposition material is deposited on the deposition through-hole 342 of the deposition target masking unit 300. Thereby, the deposition material is deposited at the deposition position PT including the electrode member 60. As a result, the electrode member 60 is fixed to the surface electrode as the fixation target, and the second wiring 62 is electrically connected to the surface electrode.

In step S50, the connecting member 50 is cut. The connecting member 50 can be cut by an operator using pliers, for example. As a result, the object unit 100 is divided into the mask member 40 and the electrode member 60. The connection member 50 is preferably cut at a position close to the second wiring 62 in view of suppressing the flow of current to a portion corresponding to the connection member 50 after cutting at the time of energizing the electrode member 60. The connection member 50 may be cut by a dedicated device or by a stress applied to the connection member 50 when the connection member 50 is bent, without using pliers. In step S60, the mask member 40 and the masking tool 200 of the sputtering target unit 100 are detached from the surface electrode. The spraying is completed through the steps. In the present embodiment, the removed mask member 40 is discarded, and the masking tool 200 is reused.

The details of the method of assembling the thermal spraying object masking unit 300 in step S20 will be described with reference to fig. 7 together with fig. 6. Fig. 6 is a process diagram showing an assembly method of the thermal spraying object masking unit 300. The steps shown in fig. 6 may be performed manually by an operator or by a dedicated apparatus.

In step S22, the mask member 40 of the thermal spraying subject unit 100 is disposed on the surface TP of the masking tool 200. In step S24, the coupling member 50 of the deposition subject unit 100 in which the mask member 40 is disposed on the surface TP of the masking tool 200 is bent around the rotation axis BD to form a facing state of the deposition subject unit 100. In step S26, the electrode member 60 is disposed on the back surface BP of the masking tool 200. Through the above steps, the assembly of the thermal spraying object masking unit 300 is completed.

Fig. 7 is an explanatory diagram schematically showing a case where the thermal spraying object masking unit 300 is assembled. Fig. 7 shows the front surface TP of the masking tool 200 and the rear surface of the object unit 100, i.e., the rear surface MB of the masking member 40 and the rear surface EB of the electrode member 60.

As shown in fig. 7, when the parallel-state object unit 100 is assembled to the masking tool 200, the masking member 40 is moved in the direction D1 shown in fig. 7 and is disposed on the surface TP of the masking tool 200. At this time, by fitting the fixing hole 44 provided in the mask member 40 to the mask fixing protrusion 244 of the masking tool 200, the mask through hole 42 can be easily aligned with respect to the tool through hole 242. As a result, the surface MT of the mask member 40 is in contact with the surface TP of the masking tool 200, and the mask member 40 is disposed on the masking tool 200 in a state where the tool through holes 242 and the mask through holes 42 overlap with each other.

After the mask member 40 is placed on the masking tool 200, the deposition subject unit 100 is bent around the rotation axis BD in a state where the mask member 40 is placed on the masking tool 200. Specifically, as indicated by an arrow D2 in fig. 7, the electrode member 60 is rotated about the rotation axis BD toward the back surface BP of the masking tool 200. At this time, the rotation shaft BD can be easily formed by bending the coupling member 50 along the surface of the first side surface S1 of the masking tool 200. As a result, when the electrode member 60 is disposed on the back surface BP of the masking tool 200, the electrode member 60 can be easily aligned with respect to the back surface BP of the masking tool 200. The second wiring 62 in the electrode member 60 is arranged using the wiring fixing convex portion 260 shown in fig. 4. By using the wire fixing convex portion 260, the position alignment of the plating target position PT of the second wire 62 with respect to the tool through hole 242 becomes easy in the back surface BP of the masking tool 200. At this time, the electrode member 60 is disposed in a state of being separated from the back surface BP of the masking tool 200. Through the above steps, the assembly of the thermal spraying object masking unit 300 is completed.

A sputtering method of a sputtering material using the sputtering target masking unit 300 will be described with reference to fig. 8. Fig. 8 is an explanatory diagram schematically showing a sputtering method using the sputtering target masking unit 300. In fig. 8, the object masking unit 300 is schematically shown in an exploded perspective view for easy understanding of the technique, and the length of the coupling member 50 is shown longer than the length of the actual coupling member 50.

In fig. 8, a surface electrode 460 and a deposition nozzle 80 for spraying a deposition material are schematically shown. The surface electrode 460 is an object to be fixed, and is an electrode provided on the outer peripheral surface of the electrically heated catalyst. The surface electrode 460 has, for example, a substantially rectangular planar shape. In fig. 8, one surface electrode 460 is shown, but two surface electrodes 460 corresponding to the anode and the cathode are arranged so as to face each other on the outer surface of the electrically heated catalyst. The shape of the surface electrode 460 is not limited to a rectangular shape, and may be various shapes.

The deposition nozzle 80 is connected to a deposition device, not shown. In the present embodiment, the deposition device is a plasma deposition device. The deposition apparatus applies thermal energy to the deposition material, for example, to bring the deposition material into a semi-molten state, and ejects the deposition material in the semi-molten state to which the kinetic energy is applied from the deposition nozzle 80. The deposition apparatus is not limited to plasma deposition, and may be a deposition apparatus of various types such as flame deposition, arc deposition, high-speed flame deposition, and laser deposition.

In fig. 8, the movement path NR of the deposition nozzle 80 is schematically shown by a broken-line arrow. The movement path NR can be arbitrarily set. In the present embodiment, the movement path NR is a path that reciprocates along the arrangement of the through holes 342 for sputtering, that is, the arrangement of the first and second rows ML1 and ML2 of the mask through holes 42. The deposition nozzle 80 moves along the movement path NR, and deposits the deposition material into the deposition through-holes 342.

In fig. 8, a jet 82 of deposition material from a deposition nozzle 80 is schematically shown. The jet stream 82 of the deposition material collides with the deposition target position PT including the second wiring 62 and the surface electrode 460 through the deposition through hole 342 formed by overlapping the mask through hole 42 and the tool through hole 242. The deposition material is deposited and solidified at the deposition site PT to form a deposition film 70, also referred to as a flat sheet (splat). The sprayed film 70 solidifies in a state where the second wiring 62 is in contact with the surface electrode 460, and fixes the second wiring 62 to the surface electrode 460 by adhesion to the surface electrode 460, and electrically connects the second wiring 62 to the surface electrode 460.

After the deposition of the deposition material is completed, the connection member 50 is cut at a cutting position CT shown in fig. 8, and the deposition target unit 100 is divided into the mask member 40 and the electrode member 60. The segmented mask member 40 and masking tool 200 are detached from the surface electrode 460. The removed masking member 40 is discarded and the masking tool 200 is reused.

As described above, in the sputtering method using the sputtering target unit 100 according to the present embodiment, the mask member 40 is disposed on the front surface TP of the masking tool 200 so that the mask through-hole 42 of the mask member 40 and the tool through-hole 242 of the masking tool 200 overlap, and the electrode member 60 as the sputtering target is disposed on the rear surface BP of the masking tool 200. The deposition material is deposited from the mask through hole 42, i.e., the deposition through hole 342 of the masking tool 200 in this state toward the electrode member 60, i.e., the deposition target. According to the deposition method using the deposition subject unit 100 of the present embodiment, deposition is performed in a state where the mask member 40 covers the surface TP of the masking tool 200, so that deposition of deposition material on the surface TP of the masking tool 200 can be reduced or prevented.

According to the sputtering method of the present embodiment, when the electrode member 60 is disposed on the back surface BP of the masking tool 200, the connecting member 50 is bent, and the electrode member 60 as the sputtering target is disposed on the back surface MB of the masking tool 200. Therefore, when the sputtering target unit 100 is bent after the mask member 40 is placed on the surface TP of the masking tool 200, the electrode member 60 is easily placed on the back surface BP of the masking tool 200, and the mask member 40 and the electrode member 60 are easily aligned with respect to the masking tool 200. Further, the mask member 40 and the electrode member 60 can be integrally formed, and the productivity of the deposition target unit 100 can be improved.

According to the sputtering method of the present embodiment, after the sputtering material is sputtered, the connecting member 50 is cut, the mask member 40 and the sputtered member are separated, and the separated mask member 40 is detached. Therefore, the mask member 40 can be easily removed from the electrode member 60 fixed to the surface electrode 460 by sputtering.

According to the sputtering method of the present embodiment, the sputtering target is the electrode member 60 electrically connected to the surface electrode 460 of the electrically heated catalyst. After the step of disposing the electrode member 60 on the back surface MB of the masking tool 200, the masking tool 200 is disposed on the surface MT of the front electrode 460, and the deposition material is deposited from the mask through-hole 42 toward the electrode member 60. Accordingly, the electrode member 60 can be fixed to the surface electrode 460 of the electrically heated catalyst using the deposition material, and deposition of the deposition material on the surface TP of the masking tool 200 can be reduced or prevented during the production of the electrically heated catalyst.

The object unit 100 of the present embodiment includes: an electrode member 60, the deposition material being deposited at a deposition position PT; a mask member 40 having a mask through hole 42; and a connecting member 50 connecting the mask member 40 and the electrode member 60, and allowing the sputtering target unit 100 to bend to a state in which the surface MT of the mask member 40 and the surface ET of the electrode member 60 face each other. According to the object unit 100 of the present embodiment, the surface MT of the mask member 40 and the surface ET of the electrode member 60 are opposed to each other by bending the connecting member 50. Accordingly, since the deposition can be performed in a state where the surface TP of the masking tool 200 is covered by the mask member 40, deposition of the deposition material on the surface TP of the masking tool 200 can be reduced or prevented.

In the deposition target unit 100 of the present embodiment, the mask through hole 42 and the deposition target position PT are arranged such that the linear distance L1 from the rotation axis BD to the mask through hole 42 is equal to the linear distance L2 from the rotation axis BD to the deposition target position PT. Therefore, when the deposition target unit 100 is brought into the facing state, the mask through-hole 42 and the deposition target position PT are easily overlapped with each other.

In the object unit 100 of the present embodiment, the mask member 40 further includes fixing holes 44 that fit into mask fixing protrusions 244 provided in the masking tool 200. The fixing hole 44 functions as a position alignment mechanism for aligning the positions of the mask through hole 42 and the tool through hole 242. Therefore, when the surface MT of the mask member 40 is arranged on the surface TP of the masking tool 200, the tool through-hole 242 and the mask through-hole 42 are easily aligned.

B. Other embodiments:

(B1) In the above embodiment, the surface electrode 460 in which the object to be fixed is a catalyst heated by electric conduction is shown, and the sputtering target is the electrode member 60 fixed to the surface electrode 460. In contrast, the object to be fixed is not limited to the electrically heated catalyst, and may be various vehicle parts such as a cylinder head, a cylinder block, a piston, and various components such as a machine part, a structure such as a building, and the like. In this case, the thermal spraying member is not limited to the electrode member 60, and may be a member corresponding to various purposes, such as a protective film or a heat insulating film facing the various members, a film for corrosion protection and rust prevention of the structure, a film for improving wear resistance and heat resistance, or the like. Further, the object to be fixed may not be provided, and the thermal spraying member may not be fixed to the object to be fixed. In this case, the deposition position includes only the deposition target, and the deposition material is deposited only on the deposition target.

(B2) In the above embodiment, an example in which the connecting member 50 is arranged at the end portion of the second wiring 62 in the extending direction of the electrode member 60 is shown. In contrast, the connecting member 50 is not limited to the end portion of the second wiring 62 arranged in the extending direction of the electrode member 60, and may be set at any position on the premise that the mask through hole 42 of the mask member 40 is arranged at the desired deposition position PT in the opposing state. For example, the connection member 50 may be formed at any end of the second wiring 62 in a direction intersecting the extending direction of the electrode member 60 among the second wiring 62. In this case, the mask member 40 is coupled to the coupling member 50 such that the mask through-hole 42 and the deposition position PT are arranged in the same orientation with each other in the facing state of the mask member 40.

(B3) In the above embodiment, an example in which the mask member 40 and the electrode member 60 are connected by the connecting member 50 is shown. In contrast, the coupling member 50 may not be provided, and the mask member 40 and the electrode member 60 may be used separately. Even in the sputtering method of this embodiment, by disposing the surface MT of the mask member 40 on the surface TP of the masking tool 200 and disposing the surface ET of the electrode member 60 on the rear surface BP of the masking tool 200, sputtering can be performed in the same manner as in the above embodiment, and deposition of the sputtering material on the surface of the masking tool 200 can be reduced or prevented.

(B4) In the above embodiment, the mask member 40 of the deposition subject unit 100 is disposed on the surface TP of the masking tool 200, the coupling member 50 of the deposition subject unit 100 in a state where the mask member 40 is disposed on the surface TP of the masking tool 200 is bent around the rotation axis BD to form the facing state of the deposition subject unit 100, and the electrode member 60 is disposed on the back surface BP of the masking tool 200. In contrast, after the electrode member 60 is disposed on the back surface BP of the masking tool 200, the coupling member 50 of the deposition subject unit 100 in which the electrode member 60 is disposed on the back surface BP of the masking tool 200 may be bent around the rotation axis BD to form a state in which the deposition subject unit 100 faces, and the mask member 40 of the deposition subject unit 100 may be disposed on the surface TP of the masking tool 200.

(B5) In the above embodiment, an example is shown in which the surface direction of the surface MT of the mask member 40 formed by the sputtering target unit 100 and the surface direction of the surface ET of the electrode member 60 as the sputtering target are on the same plane as each other. In contrast, the deposition target unit 100 is not necessarily formed such that the surface direction of the surface MT of the mask member 40 and the surface ET of the electrode member 60 are necessarily on the same plane, and may be configured such that the mask member 40 and the electrode member 60 can be brought into a facing state by bending the connecting member 50. The mask member 40 and the electrode member 60 need not be manufactured in a parallel state, but may be manufactured in a state other than a parallel state, such as a relative state.

The present disclosure is not limited to the above-described embodiments, and can be implemented in various configurations within a scope not departing from the spirit thereof. For example, the technical features of the embodiments corresponding to the technical features of the embodiments described in the summary of the invention can be replaced or combined as appropriate in order to solve part or all of the above-described problems or in order to achieve part or all of the above-described effects. In addition, if this technical feature is not described as an essential matter in the present specification, it can be deleted appropriately.

Claims

1. A deposition method for depositing a deposition target member, the deposition method comprising:

a step of preparing a mask member having a mask through hole, a sputtering target member, and a masking tool having a tool through hole;

a step of disposing the mask member on the surface of the masking tool so that the mask through-hole and the tool through-hole overlap with each other;

a step of disposing the sputtering target on the back surface of the masking tool; and

a step of spraying a spray material from the mask through hole toward the sprayed member,

the mask member and the sputtering target member are connected by a connecting member,

in the step of disposing the deposition target member on the rear surface of the masking tool, the coupling member is bent to dispose the deposition target member on the rear surface of the masking tool.

2. The deposition method according to claim 1, wherein,

the spraying method further comprises the steps of:

cutting the connecting member after the step of spraying the spray material, and dividing the mask member from the sprayed member; and

and removing the divided mask member.

3. The sputtering method according to claim 1 or 2, wherein,

the sprayed member is an electrode electrically connected to a surface electrode of the electrically heated catalyst,

the sputtering method further includes a step of disposing the masking tool on the surface of the surface electrode after the step of disposing the sputtering target on the back surface of the masking tool.

4. A thermal spray body unit for use in a masking tool, wherein the thermal spray body unit comprises:

a deposition target member, the deposition target being deposited at a deposition target position including a portion of the deposition target member;

a mask member having a mask through hole; and

a coupling member for coupling the mask member and the deposition target member to each other so that the deposition target unit can be bent to a state in which a surface of the mask member and a surface of the deposition target member face each other,

in the opposed state, the mask through hole and the deposition position are disposed at positions overlapping each other.

5. The thermal spray coating body unit according to claim 4, wherein,

the distance from the rotation axis of the mask member to the mask through hole when the object unit is bent to the opposing state is equal to the distance from the rotation axis to the object position.

6. The object unit according to claim 4 or 5, wherein,

the mask member includes a position alignment mechanism for aligning a tool through hole provided in a masking tool with a position of the mask through hole.