CN115319787A - System and method for adjusting adsorption force of non-contact manipulator - Google Patents
System and method for adjusting adsorption force of non-contact manipulator Download PDFInfo
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- CN115319787A CN115319787A CN202210910799.2A CN202210910799A CN115319787A CN 115319787 A CN115319787 A CN 115319787A CN 202210910799 A CN202210910799 A CN 202210910799A CN 115319787 A CN115319787 A CN 115319787A
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- end effector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/085—Force or torque sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/087—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices for sensing other physical parameters, e.g. electrical or chemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
The invention provides a regulating system and a method for the adsorption force of a non-contact manipulator, which relate to the technical field of semiconductor manufacturing, wherein the regulating system comprises an end effector, an in-situ sensor, a distance sensor, a pressure sensor, a gas flow control valve, a flow controller and a controller, wherein the peripheral surface of a boss is provided with a plurality of gas flow nozzles, and a flow channel for communicating a gas inlet with the gas flow nozzles is formed inside the end effector; and the in-place sensor is arranged on the end effector and used for detecting whether the wafer is in a preset area of the end effector. Through the signals fed back by the in-place sensor and the distance sensor, the PID operation is carried out through the controller by combining the real-time pressure value detected by the pressure sensor, the operation output value is sent to the flow controller, and the flow controller controls the gas flow control valve according to the operation output value, so that the automatic regulation of the pressure is realized, the purpose of accurately controlling the size of the adsorption force is achieved, and the balance of the size of the generated adsorption force is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a system and a method for adjusting the adsorption force of a non-contact manipulator.
Background
In the production of semiconductors, due to the fact that semiconductor products are numerous and the process is complex, the thickness and the specification of wafers of different manufacturers are greatly different, and some wafers are very light and thin, the contact area between an end effector and the wafers is required to be as small as possible, and the problems of defects, exposure and the like are avoided.
In the application process of the manipulator end effector, the adsorption force between the manipulator end effector and the wafer is very important and insufficient, the wafer position can deviate in the transmission process to cause transmission failure, the adsorption force is too large, the wafer can be deformed or damaged to influence the production quality and efficiency, and particularly for light and thin wafers, the contact adsorption mode is difficult to finish transmission with high quality.
The method for transporting the wafer on the end effector of the manipulator is generally in two modes, one mode is a contact type adsorption mode by using friction force, the other mode is a vacuum negative pressure adsorption mode, and both modes are contact type transportation methods.
Disclosure of Invention
The invention provides a non-contact type manipulator adsorption force adjusting system, which is used for solving the problem that in the prior art, the adsorption force cannot be accurately controlled and the wafer is damaged.
The invention provides a non-contact type manipulator adsorption force adjusting system, which comprises:
the manipulator comprises an end effector, a gas inlet is formed at the first end of the end effector, an airflow guide groove is formed in the middle of the manipulator, a boss is formed at the bottom of the airflow guide groove, a plurality of airflow nozzles are arranged on the outer peripheral surface of the boss at intervals, and a flow channel for communicating the gas inlet with the airflow nozzles is formed inside the end effector;
the in-place sensor is arranged on the end effector and used for detecting whether the wafer is in a preset area of the end effector or not;
the distance sensor is arranged on the end effector and is used for detecting the real-time distance between the wafer and the end effector;
the pressure sensor is arranged at the air inlet and used for detecting a real-time pressure value of the air inlet;
the gas flow control valve is arranged at the gas inlet;
a flow controller electrically connected to the gas flow control valve;
and the controller is electrically connected with the on-position sensor, the distance sensor, the pressure sensor and the flow controller respectively.
According to the adjusting system for the adsorption force of the non-contact manipulator provided by the embodiment of the invention, the boss is cylindrical, and the plurality of air flow nozzles are arranged on the outer peripheral surface of the boss at equal intervals.
According to the adjusting system for the adsorption force of the non-contact manipulator provided by the embodiment of the invention, the air flow guide groove forms a circular air outlet on the upper surface of the end effector, and an air flow guide part protruding upwards is formed on the edge of the air outlet.
According to the adjusting system for the adsorption force of the non-contact manipulator provided by the embodiment of the invention, the cross section of the airflow guide part is semicircular.
According to the adjusting system for the adsorption force of the non-contact manipulator provided by the embodiment of the invention, the in-place sensor and the distance sensor are respectively arranged at the second end of the end effector.
According to the non-contact manipulator adsorption force adjusting system provided by the embodiment of the invention, the width of the air inlet port of the air flow nozzle is larger than that of the air outlet port of the air flow nozzle.
According to the adjusting system for the adsorption force of the non-contact manipulator provided by the embodiment of the invention, the bottom surface of the airflow guide groove is a curved surface which is concave downwards.
The invention also provides a method for adjusting the adsorption force of the non-contact manipulator, which comprises the following steps:
step S100, acquiring an in-place signal, a plurality of real-time distances and a plurality of real-time pressure values;
step S200, calculating a distance average value Dav of a plurality of real-time distances and a pressure average value Pav of a plurality of real-time pressure values;
step S300, determining that the pressure average value Pav is within a preset range, and judging whether the wafer is in a preset area of the end effector;
step S400, determining that the wafer is in the preset area, and calculating the absolute value of the difference between the distance average value Dav and the preset distance Dr to obtain a distance deviation value Dd;
step S500, if the distance deviation value Dd is greater than or equal to a preset deviation value Dra, performing rapid pressure adjustment; otherwise, a slow pressure adjustment is performed.
According to the method for adjusting the adsorption force of the non-contact manipulator provided by the embodiment of the invention, after the step S200 is executed, the following steps are also executed:
and if the pressure average value Pav is determined not to be within the preset range, outputting an alarm signal.
According to the method for adjusting the adsorption force of the non-contact manipulator provided by the embodiment of the invention, after the step S300 is executed, the following steps are also executed:
and if the wafer is determined not to be in the preset area, returning to execute the step S100.
According to the non-contact type manipulator adsorption force adjusting system provided by the embodiment of the invention, the compressed air is sprayed to different directions through the air flow nozzle, the sprayed high-speed compressed air forms a negative pressure area on the surface of the end effector, so that the wafer is adsorbed on the surface of the end effector in a non-contact manner, the air flow guide grooves can enable the air flow to be uniformly distributed, the adsorption force on the wafer is more balanced, and the stability of the wafer in the transportation process is improved. Through the signals fed back by the in-place sensor and the distance sensor, the PID operation is carried out through the controller by combining the real-time pressure value detected by the pressure sensor, the operation output value is sent to the flow controller, and the flow controller controls the gas flow control valve according to the operation output value, so that the automatic regulation of the pressure is realized, the purpose of accurately controlling the size of the adsorption force is achieved, and the balance of the size of the generated adsorption force is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic top view of a system for adjusting an adsorption force of a non-contact robot according to an embodiment of the present invention;
fig. 2 is a schematic partial cross-sectional view of a system for adjusting an adsorption force of a non-contact robot according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the connection relationship between the controller and the remaining modules according to the embodiment of the present invention;
fig. 4 is a flowchart of a method for adjusting an adsorption force of a non-contact robot according to an embodiment of the present invention.
Reference numerals:
110. an end effector; 111. an air inlet; 112. an airflow guiding groove; 113. an air flow nozzle; 114. a flow channel; 115. a boss; 116. an airflow guide part; 120. an in-situ sensor; 130. a distance sensor; 140. a pressure sensor; 150. a gas flow control valve; 160. a flow controller; 170. and a controller.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, a first feature may be "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The following describes a system and a method for adjusting the suction force of a non-contact robot according to an embodiment of the present invention with reference to fig. 1 to 4.
Fig. 1 illustrates a schematic top view structure diagram of an adjusting system for a non-contact robot suction force provided by an embodiment of the present invention, fig. 2 illustrates a schematic partial cross-sectional structure diagram of the adjusting system for the non-contact robot suction force provided by the embodiment of the present invention, and fig. 3 illustrates a schematic connection relationship between a controller and the rest of modules provided by the embodiment of the present invention; as shown in fig. 1, 2 and 3, the adjustment system for the adsorption force of the non-contact robot includes an end effector 110, an in-place sensor 120, a distance sensor 130, a pressure sensor 140, a gas flow control valve 150, a flow controller 160 and a controller 170, wherein a gas inlet 111 is formed at a first end of the end effector 110, and the gas inlet 111 is communicated with a gas supply device through a pipeline. During the operation of the non-contact manipulator, the compressed gas output by the gas supply device firstly enters the flow channel 114 through the gas inlet 111 and then is sprayed to different directions through each gas flow nozzle 113. An air flow guide groove 112 is formed in the middle of the robot, a boss 115 is formed at the bottom of the air flow guide groove 112, a plurality of air flow nozzles 113 are arranged at intervals on the outer circumferential surface of the boss 115, and a flow passage 114 communicating the air inlet 111 and the air flow nozzles 113 is formed inside the end effector 110.
The in-situ sensor 120 is disposed on the end effector 110, and the in-situ sensor 120 is used for detecting whether the wafer is within a predetermined area of the end effector 110. The distance sensor 130 is disposed on the end effector 110, and the distance sensor 130 is used for detecting a real-time distance between the wafer and the end effector 110. The pressure sensor 140 is disposed at the air inlet 111, and the pressure sensor 140 is configured to detect a real-time pressure value of the air inlet 111. The gas flow control valve 150 is provided in the gas inlet 111, and the flow controller 160 is electrically connected to the gas flow control valve 150. Controller 170 is electrically connected to in-situ sensor 120, distance sensor 130, pressure sensor 140, and flow controller 160, respectively.
According to the non-contact type manipulator adsorption force adjusting system provided by the embodiment of the invention, the compressed air is sprayed to different directions through the air flow nozzle 113, the sprayed high-speed compressed air forms a negative pressure area on the surface of the end effector 110, so that the wafer is adsorbed on the surface of the end effector 110 in a non-contact manner, the air flow guide groove 112 can enable the air flow to be uniformly distributed, the adsorption force on the wafer is more balanced, and the stability of the wafer in the transportation process is improved. Through the signals fed back by the in-place sensor 120 and the distance sensor 130, and the real-time pressure value detected by the pressure sensor 140, the PID operation is performed by the controller 170, and the operation output value is sent to the flow controller 160, and the flow controller 160 controls the gas flow control valve 150 according to the operation output value, so that the automatic adjustment of the pressure is realized, the purpose of accurately controlling the magnitude of the adsorption force is achieved, and the generated adsorption force is ensured to be balanced.
In the embodiment of the present invention, the boss 115 is a cylinder, a cavity is formed inside the boss 115, the cavity is respectively communicated with the flow channel 114 and the air flow nozzles 113, and the air flow nozzles 113 are equidistantly arranged on the outer circumferential surface of the boss 115. Through the arrangement of the cavity, the air pressure of compressed air sprayed by each air flow nozzle 113 is the same, so that the air flows are uniformly distributed, and the generated adsorption force is ensured to be balanced.
It should be noted here that the structure of the air flow nozzle 113 may be various, and may be a circular through hole, a strip-shaped through hole, or a slit.
In the embodiment of the present invention, the air flow guide groove 112 forms a circular air outlet on the upper surface of the end effector 110, and the edge of the air outlet forms an air flow guide portion 116 protruding upward, and the air flow guide portion 116 has a ring shape. The airflow guiding portion 116 is used for guiding the airflow, so that the airflow is distributed more uniformly, and the generated adsorption force is ensured to be balanced.
In the embodiment of the present invention, the cross section of the airflow guide portion 116 is semicircular, and the airflow guide portion 116 having the semicircular cross section has a streamline shape, so that when an airflow passes through the airflow guide portion 116, wind resistance is very small, and thus no turbulent flow is generated.
In an embodiment of the present invention, the in-situ sensor 120 is disposed on one side of the second end of the end effector 110, the distance sensors 130 are respectively disposed on the other side of the second end of the end effector 110, and a distance between the in-situ sensor 120 and the distance sensors 130 is smaller than an outer diameter of the wafer. The distance between the position sensor 120 and the distance sensor 130 is determined according to the size of the wafer, and is not limited in detail.
In an embodiment of the present invention, the width of the inlet port of the air flow nozzle 113 is greater than the width of the outlet port of the air flow nozzle 113. When the air flow flows from the air inlet port to the air outlet port of the air flow nozzle 113, the width of the air flow nozzle 113 is narrowed, the air flow is further compressed, and the flow rate of the air flow is further increased, so that the air flow is uniformly distributed, the adsorption force is more balanced, and the wafer is prevented from being biased in the transportation process.
In the embodiment of the present invention, as shown in fig. 2, the bottom surface of the airflow guiding groove 112 is a curved surface that is concave downward. As known from the bernoulli vacuum adsorption principle, after being ejected through the air flow nozzle 113, the air flow is guided by the bottom surface of the air flow guide groove 112, flows to the air outlet, and flows around while being adhered to the surface of the end effector 110 after exiting from the air outlet, so that a negative pressure region is generated in the vicinity of the air flow guide groove 112, and after the wafer is placed in the negative pressure region, the wafer is adsorbed by the adsorption force and keeps a certain distance from the end effector 110. Because the bottom surface of the airflow guiding groove 112 is a curved surface, large wind resistance and turbulent flow cannot be generated to the airflow, and the adsorption force and the stability of the end effector 110 are improved.
Fig. 4 is a flowchart illustrating a method for adjusting an adsorption force of a non-contact manipulator according to an embodiment of the present invention, and as shown in fig. 4, the present invention further provides a method for adjusting an adsorption force of a non-contact manipulator, where the method for adjusting an adsorption force of a non-contact manipulator includes the following steps:
it should be noted that, when starting the operation, the parameters need to be initialized to match wafers with different sizes.
Step S100, acquiring an in-place signal, a plurality of real-time distances and a plurality of real-time pressure values;
the in-situ sensor 120 sends the detected in-situ signal to the controller 170, and the controller 170 determines whether the wafer is in the preset area of the end effector 110 according to the acquired in-situ signal. The distance sensor 130 sends the detected signal to the controller 170, and the controller 170 acquires the real-time distance by collecting the signal detected by the distance sensor 130, and in order to improve the accuracy of calculation, the real-time distance needs to be acquired for multiple times to obtain multiple real-time distances. The pressure sensor 140 sends the detected signal to the controller 170, and the controller 170 acquires a real-time pressure value by acquiring the signal detected by the pressure sensor 140, and in order to improve the accuracy of calculation, the signal needs to be acquired for multiple times to acquire a plurality of real-time pressure values.
Step S200, calculating a distance average value Dav of a plurality of real-time distances and a pressure average value Pav of a plurality of real-time pressure values;
the distance between the wafer and the end effector can be more accurately reflected by calculating the average distance value Dav. The pressure value of the air outlet can be reflected more truly by calculating the pressure average value Pav, and then the air flow is accurately controlled, so that the adsorption force is more balanced, and the wafer is prevented from being biased in the transportation process.
Step S300, determining that the pressure average value Pav is within a preset range, and judging whether the wafer is in a preset area of the end effector;
step S400, determining that the wafer is in a preset area, and calculating the absolute value of the difference between the distance average value Dav and the preset distance Dr to obtain a distance deviation value Dd;
when the sizes of the wafers transported are different, the preset distance Dr is also different. The value of the preset distance Dr can be adjusted according to the size of the wafer.
Step S500, if the distance deviation value Dd is greater than or equal to the preset deviation value Dra, performing rapid pressure adjustment; otherwise, a slow pressure adjustment is performed.
The distance deviation Dd is compared with a preset deviation Dra in order to determine which way to use for flow regulation. If the distance deviation Dd is greater than or equal to the preset deviation Dra, which indicates that the distance between the wafer and the end effector has a large deviation from the preset distance Dr, a rapid pressure adjustment is required. If the distance deviation Dd is smaller than the predetermined deviation Dra, which indicates that the deviation between the distance between the wafer and the end effector and the predetermined distance Dr is small, the slow pressure adjustment is performed.
It should be noted here that both the slow adjustment and the fast adjustment are implemented by the controller sending an output value Pout percentage to the flow controller according to the distance deviation Dd, and the flow controller controlling the opening of the gas flow control valve according to the output value Pout percentage, so as to implement the pressure control. The difference between the two is that the control parameter P output by the controller in the fast adjustment mode is greater than the control parameter P output by the controller in the slow adjustment mode.
In an embodiment of the present invention, the following steps are further performed after performing step S200:
and if the pressure average value Pav is determined not to be within the preset range, outputting an alarm signal.
When the detected pressure average value Pav is not in the preset range, the real-time pressure deviation is large, and an alarm signal is output to prompt an operator to adjust in time so as to prevent the wafer from being damaged. Of course, the equipment can also be directly controlled to stop running.
In the embodiment of the present invention, after performing step S300, the following steps are further performed:
if the wafer is determined not to be in the predetermined area, the process returns to step S100.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A non-contact manipulator adsorption affinity governing system characterized by, includes:
the manipulator comprises an end effector, a gas inlet is formed at the first end of the end effector, an airflow guide groove is formed in the middle of the manipulator, a boss is formed at the bottom of the airflow guide groove, a plurality of airflow nozzles are arranged on the outer peripheral surface of the boss at intervals, and a flow channel for communicating the gas inlet with the airflow nozzles is formed inside the end effector;
the in-place sensor is arranged on the end effector and used for detecting whether the wafer is in a preset area of the end effector or not;
the distance sensor is arranged on the end effector and is used for detecting the real-time distance between the wafer and the end effector;
the pressure sensor is arranged at the air inlet and used for detecting a real-time pressure value of the air inlet;
the gas flow control valve is arranged at the gas inlet;
a flow controller electrically connected to the gas flow control valve;
and the controller is electrically connected with the on-position sensor, the distance sensor, the pressure sensor and the flow controller respectively.
2. The system for adjusting an adsorption force of a non-contact robot according to claim 1, wherein the boss is a cylindrical body, and the plurality of air flow nozzles are arranged on an outer circumferential surface of the boss at equal intervals.
3. The system for adjusting an adsorption force of a non-contact robot hand according to claim 1, wherein the air flow guide groove forms a circular air outlet on an upper surface of the end effector, and an edge of the air outlet forms an air flow guide portion protruding upward.
4. The system for adjusting an adsorption force of a non-contact robot according to claim 3, wherein the cross section of the air flow guide is semicircular.
5. The system for adjusting an adsorption force of a non-contact robot according to claim 1, wherein the in-place sensor and the distance sensor are respectively disposed at the second end of the end effector.
6. The system for adjusting an adsorption force of a non-contact robot according to claim 1, wherein a width of the inlet port of the air flow nozzle is larger than a width of the outlet port of the air flow nozzle.
7. The system for adjusting an adsorption force of a non-contact robot according to claim 1, wherein a bottom surface of the air flow guide groove is a curved surface that is recessed downward.
8. A method for adjusting the adsorption force of a non-contact manipulator is characterized by comprising the following steps:
step S100, acquiring an in-place signal, a plurality of real-time distances and a plurality of real-time pressure values;
step S200, calculating a distance average value Dav of a plurality of real-time distances and a pressure average value Pav of a plurality of real-time pressure values;
step S300, determining that the pressure average value Pav is within a preset range, and judging whether the wafer is in a preset area of the end effector;
step S400, determining that the wafer is in the preset area, and calculating the absolute value of the difference between the distance average value Dav and the preset distance Dr to obtain a distance deviation value Dd;
step S500, if the distance deviation value Dd is greater than or equal to a preset deviation value Dra, performing rapid pressure adjustment; otherwise, a slow pressure adjustment is performed.
9. The method for adjusting an adsorption force of a non-contact robot according to claim 8, wherein the following steps are further performed after the step S200 is performed:
and if the pressure average value Pav is determined not to be within the preset range, outputting an alarm signal.
10. The method for adjusting an adsorption force of a non-contact robot according to claim 8, wherein the following steps are further performed after the step S300 is performed:
and if the wafer is determined not to be in the preset area, returning to the step S100.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210910799.2A CN115319787A (en) | 2022-07-29 | 2022-07-29 | System and method for adjusting adsorption force of non-contact manipulator |
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| CN202210910799.2A CN115319787A (en) | 2022-07-29 | 2022-07-29 | System and method for adjusting adsorption force of non-contact manipulator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116553173A (en) * | 2023-05-16 | 2023-08-08 | 华中科技大学 | High-reliability non-contact chip pickup device and online control method |
| CN116872218A (en) * | 2023-09-05 | 2023-10-13 | 泓浒(苏州)半导体科技有限公司 | Eccentric correction method and system in semiconductor wafer conveying process |
-
2022
- 2022-07-29 CN CN202210910799.2A patent/CN115319787A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116553173A (en) * | 2023-05-16 | 2023-08-08 | 华中科技大学 | High-reliability non-contact chip pickup device and online control method |
| CN116553173B (en) * | 2023-05-16 | 2024-08-20 | 华中科技大学 | On-line control method of non-contact chip pick-up device |
| CN116872218A (en) * | 2023-09-05 | 2023-10-13 | 泓浒(苏州)半导体科技有限公司 | Eccentric correction method and system in semiconductor wafer conveying process |
| CN116872218B (en) * | 2023-09-05 | 2023-11-24 | 泓浒(苏州)半导体科技有限公司 | Eccentric correction method and system in semiconductor wafer conveying process |
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