CN115318583A - LED dispensing process - Google Patents
LED dispensing process Download PDFInfo
- Publication number
- CN115318583A CN115318583A CN202211131646.4A CN202211131646A CN115318583A CN 115318583 A CN115318583 A CN 115318583A CN 202211131646 A CN202211131646 A CN 202211131646A CN 115318583 A CN115318583 A CN 115318583A
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- CN
- China
- Prior art keywords
- bracket
- dispensing
- led
- led chip
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000003292 glue Substances 0.000 claims abstract description 22
- 238000004062 sedimentation Methods 0.000 claims abstract description 14
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000002950 deficient Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 4
- 235000017491 Bambusa tulda Nutrition 0.000 description 4
- 241001330002 Bambuseae Species 0.000 description 4
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 4
- 239000011425 bamboo Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses an LED dispensing process, which belongs to the technical field of LED production, and comprises the steps of firstly, placing a dry support on a platform of dispensing equipment, dispensing die bond glue on the support through a double-needle-nozzle dispensing needle head, and attaching an LED chip to a dispensing position of the support; then transferring the bracket with the LED chip attached to the bracket into a centrifuge for centrifugal sedimentation, taking out the bracket and standing for 1h; finally, transferring the bracket after centrifugal sedimentation into an oven for baking and cooling to finish the process; the single-point glue feeding is changed into the double-point glue feeding, so that the die bond glue is more uniform between the bottom of the LED chip and the bracket, and the close adhesion is favorable for heat dissipation; the LED chips are stressed uniformly when being attached, so that the risk of breakage can be reduced, the defective rate of products is reduced, and the utilization rate of the products is improved; centrifugal sedimentation is beneficial to removing bubbles, the concentration of a color area is effectively improved, light spots are obviously improved, and the process breaks through the brightness value achieved by the conventional process under the existing equivalent materials.
Description
Technical Field
The invention belongs to the technical field of LED production, and particularly relates to an LED dispensing process.
Background
The LED is a common light-emitting device, energy is released through electron and hole recombination to emit light, and the LED is widely applied to the field of illumination, and the die bonding process is a process of bonding an LED chip on a specified area of a support through a colloid to form a thermal path or an electric path and provide conditions for subsequent routing connection.
The existing die bonding technology is characterized in that single-point die bonding glue is poured into a support through glue dispensing equipment, then an LED chip is placed into the support for mounting, the die bonding glue at two ends of the LED chip cannot reach due to the fact that the length of the LED chip is increased, and therefore a gap cannot be tightly attached to the support, the LED chip is easy to shift during subsequent baking and curing, the yield of LED lamp beads is reduced, the service life of an assembled lamp is shortened, and the quality of the product is not favorably improved.
Disclosure of Invention
The invention aims to provide an LED dispensing process to solve the problems in the background art.
The purpose of the invention can be realized by the following technical scheme:
an LED dispensing process comprises the following steps:
the method comprises the following steps: placing the dried bracket on a platform of dispensing equipment, dispensing die bond glue on the bracket through a double-needle-nozzle dispensing needle head in a double-point glue feeding mode, and attaching the LED chip to the dispensing position of the bracket;
step two: transferring the bracket with the LED chip attached to the bracket into a centrifuge, centrifugally settling for 180-300s under the condition of 2000-2800r/min, taking out the bracket and standing for 1h;
step three: and transferring the bracket after centrifugal sedimentation into an oven, baking for 50-70min at the temperature of 60-80 ℃, then heating to 140-160 ℃, baking for 230-250min, and cooling to room temperature to finish the LED dispensing process.
Further, the temperature at the time of centrifugal sedimentation is 50 to 60 ℃.
The centrifuge comprises a shell and a rotary drum, wherein the shell is a square box body with an opening on one side, the rotary drum is horizontally arranged, a fixed frame is fixedly arranged at one end of the rotary drum, and a stable shaft is vertically arranged in the center of the fixed frame; a brushless motor is fixedly arranged in the center of one side of the shell, which is far away from the opening, and an output shaft of the brushless motor extends into the shell and is fixedly connected with the center of the fixing frame; the shell opening part level is provided with the connecting plate, and the connecting plate is close to the fixed spacing section of thick bamboo that is provided with of one end of changeing the rotary drum, and the steady axle just rotates through the bearing and connects in stretching into spacing section of thick bamboo.
A plurality of limiting assemblies are arranged in the rotary drum in an annular array and used for limiting and placing the bracket; the limiting assembly comprises a first limiting strip and a second limiting strip.
The lower end of the rotary drum is fixedly provided with a heating assembly used for providing heat during centrifugal sedimentation, the heating assembly comprises a mounting box, and a temperature-controllable heating wire is arranged in the mounting box; one side of the shell, which is far away from the opening, is also provided with a plurality of heat dissipation holes.
The invention has the beneficial effects that:
1. according to the LED dispensing process, through equipment optimization, a traditional single-needle-nozzle dispensing needle head is improved into a double-needle-nozzle dispensing needle head, single-point glue feeding is changed into double-point glue feeding during dispensing, so that solid crystal glue is uniformly distributed between the bottom of an LED chip and a support, the LED chip and the support are attached more tightly, heat generated during the operation of the LED chip can be better conducted to the support through the solid crystal glue, the heat of the LED chip is LED out in time, the service life of a lamp bead is prolonged, and meanwhile, the photoelectric parameter performance of the lamp bead is more stable.
2. The LED dispensing process adopts double-point glue feeding, so that the contact area between the LED chip and the die bond glue is increased, the LED chip is uniformly stressed, the risk of breakage can be reduced, the defective rate of products is reduced, and the utilization rate of the products is improved; adopt the centrifuge to carry out centrifugal sedimentation after laminating the LED chip, be favorable to detaching the bubble, effectively promote the colour gamut concentration, obviously improve the facula, the luminance value that conventional technology reached under current equal material has been broken through to this technology.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a flow chart of an LED dispensing process of the present invention;
FIG. 2 is a schematic view of the construction of the centrifuge of the present invention;
FIG. 3 is a schematic view of the internal structure of the front face of the centrifuge of the present invention;
FIG. 4 is a schematic view of the internal structure of the side of the centrifuge of the present invention;
FIG. 5 is a schematic view of the structure of the double-nozzle dispensing needle head of the present invention;
FIG. 6 is an enlarged view of an LED chip after the dispensing process in example 3 of the present invention;
FIG. 7 is an enlarged view of the LED chip after the dispensing process in comparative example 1.
In the figure: 1. a housing; 2. a connecting plate; 3. a rotating drum; 4. a brushless motor; 5. a support; 6. dispensing a glue needle head with double needle mouths; 11. heat dissipation holes; 21. a limiting cylinder; 22. a bearing; 23. mounting a box; 31. a fixed mount; 32. a first limit strip; 33. a second limit strip; 34. and stabilizing the shaft.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 5, the double-nozzle dispensing needle head 6 includes two nozzles, and the distance between the nozzles can be adjusted according to the actual length of the LED chip in production.
Referring to fig. 2-4, the centrifuge includes a housing 1 and a rotating drum 3, the housing 1 is a square box with an opening on one side, the rotating drum 3 is horizontally disposed, a fixing frame 31 is fixedly disposed at one end of the rotating drum 3, and a stabilizing shaft 34 is vertically disposed in the center of the fixing frame 31; a brushless motor 4 is fixedly arranged in the center of one side of the shell 1 away from the opening, and an output shaft of the brushless motor 4 extends into the shell 1 and is fixedly connected with the center of the fixing frame 31; the opening part level of shell 1 is provided with connecting plate 2, and connecting plate 2 is close to the fixed spacing section of thick bamboo 21 that is provided with of one end of changeing rotary drum 3, and steady axle 34 just rotates through bearing 22 and connects in stretching into spacing section of thick bamboo 21, is favorable to improving the stability when rotary drum 3 rotates.
A plurality of limiting assemblies are arranged in the rotary drum 3 in an annular array and used for limiting the placing bracket 5; the stop assembly comprises a first stop bar 32 and a second stop bar 33. The lower end of the rotary drum 3 is fixedly provided with a heating component for providing heat during centrifugal sedimentation and preventing the sedimentation effect from being influenced after the cold solidification of the solid crystal glue; the heating assembly comprises a mounting box 23, and a temperature-controllable heating wire is arranged in the mounting box 23; the side of the casing 1 away from the opening is also provided with a plurality of heat dissipation holes 11.
Referring to fig. 1 of the drawings, a drawing,
example 1
The LED dispensing process comprises the following steps:
the method comprises the following steps: placing the dried bracket 5 on a platform of dispensing equipment, dispensing die bond glue on the bracket 5 through a double-needle-nozzle dispensing needle 6 of the dispensing equipment, and attaching the LED chip to the dispensing position of the bracket 5;
step two: transferring the bracket 5 with the LED chip attached to the bracket into a centrifuge, limiting and fixing the bracket 5 through a limiting assembly, controlling the temperature to 50 ℃ through a heating assembly, centrifugally settling for 180s under the condition of 2000r/min, taking out the bracket 5, and standing for 1h;
step three: and transferring the bracket 5 subjected to centrifugal sedimentation into an oven, baking for 50min at the temperature of 60 ℃, then heating to 140 ℃, baking for 230min, and cooling to room temperature to finish the LED dispensing process.
Example 2
The LED dispensing process comprises the following steps:
the method comprises the following steps: placing the dried bracket 5 on a platform of dispensing equipment, dispensing die bond on the bracket 5 through a double-needle-mouth dispensing needle 6 of the dispensing equipment, and attaching the LED chip to the dispensing position of the bracket 5;
step two: transferring the bracket 5 with the LED chip attached to the bracket into a centrifuge, limiting and fixing the bracket 5 through a limiting assembly, controlling the temperature to 55 ℃ through a heating assembly, centrifugally settling for 220s under the condition of 2500r/min, taking out the bracket 5, and standing for 1h;
step three: and transferring the bracket 5 subjected to centrifugal sedimentation into an oven, baking for 60min at 70 ℃, then heating to 150 ℃, baking for 240min, and cooling to room temperature to finish the LED dispensing process.
Example 3
The LED dispensing process comprises the following steps:
the method comprises the following steps: placing the dried bracket 5 on a platform of dispensing equipment, dispensing die bond glue on the bracket 5 through a double-needle-nozzle dispensing needle 6 of the dispensing equipment, and attaching the LED chip to the dispensing position of the bracket 5;
step two: transferring the bracket 5 with the LED chip attached to the bracket into a centrifuge, limiting and fixing the bracket 5 through a limiting assembly, controlling the temperature to 60 ℃ through a heating assembly, centrifugally settling for 300s under the condition of 2800r/min, taking out the bracket 5 and standing for 1h;
step three: and transferring the bracket 5 subjected to centrifugal sedimentation into an oven, baking for 70min at the temperature of 80 ℃, then heating to 160 ℃, baking for 250min, and cooling to room temperature to finish the LED dispensing process.
Comparative example 1
On the basis of the embodiment 3, a single-nozzle glue dispensing needle head is adopted for dispensing, and the other steps are kept unchanged to finish the glue dispensing process.
Quality inspection is performed on the LED chips after the dispensing process in examples 1 to 3 and comparative example 1, and the dispensing quality at each group of LED chips is observed, and the results show that double dispensing is adopted in examples 1 to 3, the dispensing amount is appropriate, the LED chips after dispensing are uniformly bonded, and the enlarged view of the LED chips after the dispensing process in examples 3 and comparative example 1 is taken as an example (see fig. 6 and 7).
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. An LED dispensing process is characterized by comprising the following steps:
the method comprises the following steps: placing a support (5) on a platform of dispensing equipment, dispensing die bond glue on the support (5) through a double-needle-nozzle dispensing needle head (6), and attaching an LED chip to a dispensing position of the support (5);
step two: transferring the bracket (5) with the LED chip attached to the bracket into a centrifuge, centrifuging and settling for 180-300s under the condition of 2000-2800r/min, taking out the bracket (5), and standing for 1h;
step three: and transferring the bracket (5) subjected to centrifugal sedimentation into an oven for baking and cooling to finish the LED dispensing process.
2. The LED dispensing process according to claim 1, wherein the temperature of centrifugal sedimentation in the second step is 50-60 ℃.
3. The LED dispensing process of claim 1, wherein the baking conditions in the third step are as follows: baking at 60-80 deg.C for 50-70min, heating to 140-160 deg.C, and baking for 230-250min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211131646.4A CN115318583A (en) | 2022-09-15 | 2022-09-15 | LED dispensing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211131646.4A CN115318583A (en) | 2022-09-15 | 2022-09-15 | LED dispensing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115318583A true CN115318583A (en) | 2022-11-11 |
Family
ID=83930052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211131646.4A Pending CN115318583A (en) | 2022-09-15 | 2022-09-15 | LED dispensing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115318583A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130578A (en) * | 2023-02-17 | 2023-05-16 | 无锡美科微电子技术有限公司 | Chip mounting method, pre-curing device and chip mounting system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203134850U (en) * | 2013-03-06 | 2013-08-14 | 华南理工大学广州学院 | LED phosphor centrifugation deposition apparatus |
| CN114203883A (en) * | 2021-11-12 | 2022-03-18 | 芜湖聚飞光电科技有限公司 | Die bonding dispensing head, die bonding method and LED device |
-
2022
- 2022-09-15 CN CN202211131646.4A patent/CN115318583A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203134850U (en) * | 2013-03-06 | 2013-08-14 | 华南理工大学广州学院 | LED phosphor centrifugation deposition apparatus |
| CN114203883A (en) * | 2021-11-12 | 2022-03-18 | 芜湖聚飞光电科技有限公司 | Die bonding dispensing head, die bonding method and LED device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130578A (en) * | 2023-02-17 | 2023-05-16 | 无锡美科微电子技术有限公司 | Chip mounting method, pre-curing device and chip mounting system |
| CN116130578B (en) * | 2023-02-17 | 2023-12-22 | 无锡美科微电子技术有限公司 | Chip mounting method, pre-curing device and chip mounting system |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20221111 |
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| RJ01 | Rejection of invention patent application after publication |