CN115315860A

CN115315860A - Terminal, connector for substrate, and method for manufacturing terminal

Info

Publication number: CN115315860A
Application number: CN202180022894.2A
Authority: CN
Inventors: 吉泽博文; 南光勇一
Original assignee: Sumitomo Wiring Systems Ltd
Current assignee: Sumitomo Wiring Systems Ltd
Priority date: 2020-03-25
Filing date: 2021-03-04
Publication date: 2022-11-08
Also published as: JP2021157883A; WO2021192889A1

Abstract

Provided are a terminal and a connector for a substrate, which have improved connectivity. The terminals (20A, 20B) are provided with: a terminal main body (30) having a quadrangular cross section extending from one end (21) to the other end (22); a terminal contact portion (40) which is provided on one end (21) side of the terminal main body (30) and which is in contact with the other side terminal (T); and a substrate contact part (50) which is arranged on the other end (22) side of the terminal main body (30) and is contacted with the substrate (B), wherein 2 surfaces facing opposite sides in 4 surfaces around the terminal main body (30) are formed into plating surfaces (23) with plating layers, and the plating surface (23) of the terminal contact part (40) and the plating surface (23) of the substrate contact part (50) face different directions.

Description

Terminal, connector for substrate, and method for manufacturing terminal

Technical Field

The present disclosure relates to a terminal, a connector for a substrate, and a method of manufacturing the terminal.

Background

Patent document 1 discloses a connector for a substrate. The terminals provided in the board connector are formed by punching and bending a single metal plate. The terminal has a plate-like fitting portion, a contact piece portion and a bridge portion which are continuously provided integrally with an end portion on the opposite side of the fitting portion, and a plate-like welded portion which is continuously provided integrally with the bridge portion. Such a substrate connector is also disclosed in patent document 2.

Documents of the prior art

Patent literature

Patent document 1: japanese patent laid-open No. 2000-68014

Patent document 2: japanese patent laid-open No. 2000-77120

Disclosure of Invention

Problems to be solved by the invention

However, in the connection portion such as the tab portion and the solder portion, plating is performed in advance for improving connection reliability. In this case, when the workability and cost of the plating step are taken into consideration, it is preferable to perform plating (pre-plating treatment) before punching the metal plate. However, according to the pre-plating treatment, the plate surface of the metal plate becomes the plated surface, but the cut surface (plate thickness surface) of the metal plate after punching does not become the plated surface. If the cut surface of the connecting portion becomes a main surface for connection with the counterpart conductor, there is a possibility that connection reliability cannot be secured.

Therefore, the present disclosure aims to provide a technique capable of improving the connectivity of a terminal easily. Another object of the present invention is to provide a method for manufacturing such a terminal.

Means for solving the problems

The disclosed terminal is provided with: a terminal body having a quadrangular cross section extending from one end to the other end; a terminal contact portion provided on one end side of the terminal main body and contacting with a counterpart terminal; and a substrate contact portion provided at the other end side of the terminal main body and contacting the substrate, wherein 2 surfaces of the 4 surfaces of the periphery of the terminal main body facing opposite sides of each other are formed as plated surfaces having plated layers, and the plated surfaces of the terminal contact portion and the plated surfaces of the substrate contact portion face in different directions from each other.

The connector for a substrate according to the present disclosure includes the terminal, wherein the plating surface of the terminal contact portion is arranged on a side contacting with the contact portion of the counterpart terminal, and the plating surface of the substrate contact portion is arranged to rise from a surface of the substrate.

In addition, a method for manufacturing a terminal according to the present disclosure is a method for manufacturing a terminal described above, including a step of plating both plate surfaces of a plate-shaped metal material, and setting the both plate surfaces as the plated surfaces; cutting the metal material having the plated surface to obtain a terminal body base material along the two plate surfaces; and a step of performing processing of making the orientation of the plating surface different between a portion capable of serving as the terminal contact portion and a portion capable of serving as the substrate contact portion in the terminal body base material.

Effects of the invention

According to the present disclosure, a terminal and a connector for a substrate having improved connectivity can be provided easily.

Drawings

Fig. 1 is a longitudinal sectional view of a substrate connector according to an embodiment.

Fig. 2 isbase:Sub>A sectional view taken along linebase:Sub>A-base:Sub>A of fig. 1.

Fig. 3 is a plan view of the substrate connector viewed from the rear.

Fig. 4 is a view of the substrate contact portion cut away and viewed from the rear.

Fig. 5 is a perspective view showing a terminal.

Fig. 6 is a perspective view showing a terminal body base member.

Detailed Description

[ description of embodiments of the present disclosure ]

First, embodiments of the present disclosure will be described.

The terminal of the present disclosure is provided with a terminal,

(1) The disclosed device is provided with: a terminal body having a quadrangular cross section extending from one end to the other end; a terminal contact portion provided on one end side of the terminal main body and contacting with a counterpart terminal; and a substrate contact portion provided at the other end side of the terminal main body and contacting the substrate, wherein 2 surfaces of the 4 surfaces of the periphery of the terminal main body facing opposite sides of each other are formed as plated surfaces having plated layers, and the plated surfaces of the terminal contact portion and the plated surfaces of the substrate contact portion face in different directions from each other. According to this configuration, even if the plating surface of the terminal main body is formed by the plating first treatment, the plating surface of the terminal contact portion and the plating surface of the substrate contact portion face in different directions, and therefore, the terminal contact portion and the counterpart terminal can be brought into conductive contact with each other through the plating surface, and the substrate contact portion and the substrate can be brought into conductive contact with each other through the plating surface. As a result, the contact area between the substrate contact portion and the substrate can be easily ensured, and the connectivity of the terminal can be improved.

(2) In the above configuration, it is preferable that the terminal main body further includes a bent portion having a bent shape, and the plated surface of the terminal contact portion and the plated surface of the board contact portion change their orientations by the bent portion. According to this configuration, by forming the bent portion, the orientation of the plating surface of the terminal contact portion and the orientation of the plating surface of the substrate contact portion can be easily changed. Further, by forming the bent portion, the plurality of terminals can be compactly arranged in the connector for a substrate.

In addition, the connector for substrate of the present disclosure,

(3) Preferably, the terminal is provided, wherein the plating surface of the terminal contact portion is arranged on a side contacting with the contact portion of the counterpart terminal, and the plating surface of the substrate contact portion is arranged to rise from a surface of the substrate. According to this configuration, the contact area between the substrate contact portion and the substrate can be easily ensured, and the connectivity of the substrate connector can be improved.

(4) Preferably, the substrate contact portion is surface mounted to the substrate.

In addition, the method for manufacturing the terminal of the present disclosure,

(5) Preferably, the method of manufacturing the terminal includes: plating both plate surfaces of a plate-shaped metal material to form the plated surfaces; cutting the metal material having the plated surface to obtain a terminal body base material along the two plate surfaces; and a step of performing processing of making the orientation of the plating surface different between a portion capable of serving as the terminal contact portion and a portion capable of serving as the substrate contact portion in the terminal body base material. With this configuration, the terminal having improved connectivity can be easily manufactured.

[ details of embodiments of the present disclosure ]

Specific examples of the terminal and the substrate connector according to the present disclosure will be described below with reference to the drawings. The present invention is not limited to these examples, and is defined by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims.

The board connector 10 is a surface-mount type connector mounted in a state of being mounted on a surface (upper surface) of the board B. The substrate B is not limited, and a known circuit substrate can be selected according to the application. The housing 11 can be fitted to the mating housing H. In the following description, the vertical direction is defined as a reference in a state where the substrate connector 10 is mounted on the substrate B oriented horizontally, as shown in fig. 1 and 3. In addition, with respect to the front-rear direction, the side facing the mating side case H (the left side in fig. 1) is defined as the front side.

As shown in fig. 1 and 2, the substrate connector 10 includes a housing 11 made of synthetic resin and a plurality of

metal terminals

20A and 20B. The housing 11 includes: a wall-shaped terminal holding wall 12 that is substantially perpendicular to the substrate B and has a substantially rectangular shape that is horizontally long when viewed from the front; and a square tubular cover portion 14 projecting forward from the outer peripheral edge of the terminal holding wall 12.

The terminal holding wall 12 is formed with a plurality of press-in

holes

13A, 13B penetrating the terminal holding wall 12 in the front-rear direction. The plurality of press-in

holes

13A and 13B are arranged in parallel in the left-right direction (direction parallel to the substrate B) and in two layers up and down. The upper press-fitting hole 13A and the lower press-fitting hole 13B are arranged vertically.

As shown in fig. 1 to 3, one end 21 of the terminal 20A, which is the tip end of the plurality of

terminals

20A, 20B, is press-fitted into the upper press-fitting hole 13A and held by the terminal holding wall 12. Among the plurality of

terminals

20A and 20B, one end 21 side of the terminal 20B is press-fitted into the press-fitting hole 13B in the lower layer, and held by the terminal holding wall 12. One ends 21 of the plurality of

terminals

20A and 20B are arranged in a lattice shape of two upper and lower stages when viewed from the front in a state of being held by the terminal holding wall 12. That is, the terminal 20A located at the upper layer and the terminal 20B located at the lower layer are arranged coaxially in the upper and lower layers on the side of the one end 21 of the

terminals

20A and 20B. The other ends 22 of the plurality of

terminals

20A and 20B are arranged in parallel in the left-right direction (direction parallel to the substrate B) while being held by the terminal holding wall 12. The other ends 22 of the plurality of

terminals

20A and 20B are arranged at equal intervals in the left-right direction. The interval between the substrate contact portions 50 adjacent to each other at the portion on the other end 22 side of the terminal 20A and the terminal 20B (substrate contact portion 50 described later) is defined as a gap P (see fig. 4).

Each of the

terminals

20A and 20B includes a terminal body 30, a terminal contact portion 40 provided on the one end 21 side of the terminal body 30, and a substrate contact portion 50 provided on the other end 22 side of the terminal body 30. The terminal 20A and the terminal 20B have the same structure as the terminal contact portion 40 and the substrate contact portion 50. In the

terminals

20A and 20B, the terminals 20A are explained with respect to the same configuration, and the explanation of the terminals 20B is omitted.

As shown in fig. 5, the terminal body 30 is formed to have a quadrangular cross section extending from one end 21 to the other end 22. Of the 4 surfaces of the periphery of the terminal body 30, the 2 surfaces facing the opposite sides are formed as plating surfaces 23 having plating layers. Of the 4 surfaces around the terminal body 30, the 2 surfaces having no plating layer are cut surfaces 24 (non-plated surfaces) of the metal material. The terminal body 30 is formed in a rectangular cross section, and a long side surface in the cross section is a plated surface 23, and a short side surface is a cut surface 24. That is, the width of the plated surface 23 is larger than the width of the cut surface 24. The plated surface 23 has excellent conductivity with the other-side terminal T as compared with the cut surface 24. The plated surface 23 has excellent solder wettability compared to the cut surface 24.

As shown in fig. 4, the terminal main body 30 constituting the terminal 20A has a coupling portion 31A coupling the terminal contact portion 40 and the substrate contact portion 50. The coupling portion 31A includes an offset portion 32A, a bent portion 33A, and a hanging portion 34A.

The offset portion 32A extends leftward from the terminal contact portion 40 in a state where the terminal 20A is held by the terminal holding wall 12. The dimension of the offset portion 32A in the left-right direction is half of the interval P. That is, the offset portion 32A is a structure in which the substrate contact portion 50 is offset to the left with respect to the terminal contact portion 40 by half the interval P. The front surface of the offset portion 32A is in contact with the rear surface of the terminal holding wall 12 in a state where the terminal 20A is held by the terminal holding wall 12.

The bent portion 33A has a bent shape and is provided between the offset portion 32A and the hanging portion 34A. When the substrate connector 10 is viewed from the rear, the bent portion 33A is formed such that the offset portion 32A and the hanging portion 34A are arranged at an angle of 90 °. The angle between the offset portion 32A and the hanging portion 34A is not limited to 90 °, and may be any angle that appears to be 90 ° (for example, 85 ° to 95 °). The suspended portion 34A extends downward from the left end of the offset portion 32A to the substrate contact portion 50.

The terminal body 30 constituting the terminal 20B has a connection portion 31B connecting the terminal contact portion 40 and the substrate contact portion 50. The coupling portion 31B includes an offset portion 32B, a bent portion 33B, and a hanging portion 34B. When the substrate connector 10 is viewed from the rear, the offset portion 32B, the bent portion 33B, and the hanging portion 34B have an L-shape.

The offset portion 32B extends rightward from the terminal contact portion 40 in a state where the terminal 20B is held by the terminal holding wall 12. The dimension of the offset portion 32B in the left-right direction is half of the interval P. That is, the offset portion 32B is a structure in which the substrate contact portion 50 is offset to the right with respect to the terminal contact portion 40 by half the interval P. The front surface of the offset portion 32B is in contact with the rear surface of the terminal holding wall 12 in a state where the terminal 20B is held by the terminal holding wall 12.

The bent portion 33B has a bent shape and is provided between the offset portion 32B and the hanging portion 34B. When the substrate connector 10 is viewed from the rear, the bent portion 33B is formed such that the offset portion 32B and the hanging portion 34B are arranged at an angle of 90 °. The angle between the offset portion 32B and the hanging portion 34B is not limited to exactly 90 °, and may be an angle that appears to be 90 ° (e.g., 85 ° to 95 °). The hanging portion 34B extends downward from the right end of the offset portion 32B to the substrate contact portion 50. The vertical dimension of the hanging portion 34B is shorter than that of the hanging portion 34A.

As shown in fig. 1, the terminal contact portion 40 is a portion that contacts the counterpart terminal T. The terminal contact portion 40 extends forward from the terminal holding wall 12 in a state where the

terminals

20A, 20B are held by the terminal holding wall 12. The terminal contact portion 40 is inserted into the counterpart terminal T, and the upper surface and the lower surface thereof are brought into contact with a contact portion (not shown) of the counterpart terminal T. The upper and lower surfaces of the terminal contact portion 40 serve as plating surfaces 23.

As shown in fig. 2, the terminal contact portion 40 has a held portion 41 held by the terminal holding wall 12. The held portion 41 has a claw-shaped locking piece 42 provided to protrude from the cut surface 24 of the terminal contact portion 40. The locking piece 42 can be locked so as to be recessed into the inner surfaces of the press-fitting

holes

13A and 13B of the terminal holding wall 12.

As shown in fig. 1 and 4, the substrate contact portion 50 is a portion that contacts the substrate B. The substrate contact portion 50 is cantilevered rearward from the lower end portions of the

connection portions

31A and 31B. The substrate contact portion 50 is formed in an inclined shape that slightly descends as it goes toward the rear. The substrate contact portion 50 is surface mounted on the substrate B. The left and right surfaces of the substrate contact portion 50 are plated surfaces 23.

Next, the orientation of the plated surface 23 in the

terminals

20A and 20B will be described with reference to fig. 4 and 5. The plating surface 23 of the terminal contact portion 40 and the plating surface 23 of the substrate contact portion 50 face in different directions from each other. The plated surfaces 23 of the terminal contact portions 40 and the plated surfaces 23 of the substrate contact portions 50 change their orientations by the

bent portions

33A and 33B. The plated surface 23 of the terminal contact portion 40 is disposed on the side of contact with the contact portion of the counterpart terminal T. The plating surface 23 of the substrate contact portion 50 is arranged to stand from the surface of the substrate B. Specifically, in a state where the

terminals

20A and 20B are held by the terminal holding wall 12, the plated surface 23 of the terminal contact portion 40 faces in the vertical direction, and the plated surface 23 of the substrate contact portion 50 faces in the horizontal direction. In the terminal 20A, the upper plating surface 23 of the terminal contact portion 40 and the left plating surface 23 of the substrate contact portion 50 are connected to each other in a bent portion 33A, and the lower plating surface 23 of the terminal contact portion 40 and the right plating surface 23 of the substrate contact portion 50 are connected to each other in a bent portion 33A. In the terminal 20B, the upper plating surface 23 of the terminal contact portion 40 and the right plating surface 23 of the substrate contact portion 50 are connected to each other in a bent manner at the bent portion 33B, and the lower plating surface 23 of the terminal contact portion 40 and the left plating surface 23 of the substrate contact portion 50 are connected to each other in a bent manner at the bent portion 33B.

The upper and lower surfaces of the offset

portions

32A and 32B serve as the plating surfaces 23 connected to the upper and lower surfaces of the terminal contact portion 40 without any step. The left and right surfaces of the hanging

portions

34A, 34B are plating surfaces 23 connected to the left and right surfaces of the substrate contact portion 50 without steps.

Next, a method for manufacturing the

terminals

20A and 20B will be described. The method for manufacturing the terminal 20A includes: a step (A) for plating both plate surfaces of a plate-shaped metal material to form plated surfaces (23); a step B of cutting the metal material having the plated surface 23 to obtain a terminal body base material 35 along both plate surfaces; and a step C of performing processing of making the orientation of the plating surface 23 different between a portion 38 capable of serving as the terminal contact portion 40 and a portion 39 capable of serving as the substrate contact portion 50 of the terminal body base material 35. The method for manufacturing the terminal 20A further includes, after the step B, a step D of: the tip end portion of the terminal contact portion 40 is formed into a tapered shape by hammering the terminal body base member 35. Step D may be performed before step C, or may be performed after step C. The method of manufacturing the terminal 20B is similar to the method of manufacturing the terminal 20A, except that the direction of bending of the bent portion 33B is different.

In step a, as the plating treatment, a treatment method such as electroplating or electroless plating can be specifically used. As the plating treatment, one of the above specific examples or a combination of two or more kinds thereof can be used. As the plating treatment, electroplating is preferably used. In a conventional method for manufacturing a terminal, for example, when a plating step is performed after a punching step, the punched terminal is hung in an electrolyte solution and plated. In the method of manufacturing a terminal according to the present embodiment, a metal plate plated in advance is punched out. Therefore, the

terminals

20A and 20B can be easily manufactured by plating which is inexpensive and suitable for mass production.

In step B, the metal plate having the plated surface 23 obtained in step a is subjected to punching to obtain the terminal body base material 35 shown in fig. 6. In step B, a plurality of terminal body base members 35 can be punched out from a single metal plate. As shown in fig. 6, the terminal body base material 35 extends in a crank shape along both plate surfaces of the metal plate. The terminal body base member 35 has

corner portions

36 and 37. The terminal main body base member 35 is a portion 38 which can be a terminal contact portion 40 on the side of the one end 21 with respect to the corner portion 36. The terminal main body base material 35 is a portion 39 that can serve as a substrate contact portion 50 on the other end 22 side of the corner portion 37. The

corner portions

36 and 37 are formed by blanking a metal plate. That is, the terminal 20A of the present embodiment can be formed by only one bending process in the step C described later. Therefore, the dimensional accuracy and flatness of the terminal 20A can be improved as compared with the case where the corner portion is formed by bending unlike the present embodiment. The method of blanking is not limited. As a method of punching, a method of punching a metal plate using a press die is generally cited.

In step C, the bent portion 33A is formed by bending at a position spaced apart from the corner portion 36 on the one end 21 side by half the distance P. The bent portion 33A is formed by bending the other end 22 side by 90 ° with respect to the one end 21 side. Further, in the terminal 20B, the bent portion 33B is formed by bending the other end 22 side by 90 ° opposite to the bent portion 33A with respect to the one end 21 side. The method of bending is not limited. Specifically, the bending method may be a method of pressing the terminal body base material 35 with a press die.

Next, a method of manufacturing the substrate connector 10 and the substrate B with the substrate connector 10 will be described. The board connector 10 is manufactured by, for example, press-fitting one ends 21 of the plurality of

terminals

20A and 20B into the corresponding press-fitting

holes

13A and 13B, and assembling the plurality of

terminals

20A and 20B and the housing 11. The plurality of

terminals

20A, 20B are press-fitted until the front surfaces of the offset

portions

32A, 32B come into contact with the rear surface of the terminal holding wall 12.

The substrate B with the substrate connector 10 is manufactured by mounting the substrate connector 10 on the substrate B by reflow soldering or the like. First, flux is applied to each portion to be soldered on one surface of the substrate B. Next, the substrate connector 10 is placed at a predetermined position on the substrate B. At this time, the substrate contact portion 50 is disposed in a posture in which one cut surface 24 faces the upper surface of the substrate B and the plating surfaces 23 and 23 rise from the upper surface of the substrate B.

Next, the substrate B on which the substrate connector 10 is mounted is moved in a reflow furnace, not shown, to heat the solder. When the flux is cooled and solidified, the solder portion 51 is formed, the substrate contact portion 50 and the conductive path are electrically connected, and the substrate contact portion 50 is fixed to the substrate B. Since the solder wettability of the plating surfaces 23 and 23 in the substrate contact portion 50 is good, the solder portion 51 is smoothly wetted and a good fillet is formed.

Next, the operation of the present embodiment will be described. In the present embodiment, since the plating surfaces 23 of the terminal contact portions 40 are disposed above and below the terminal contact portions 40, the plating surfaces 23 contact the counterpart terminals T in the terminal contact portions 40. Therefore, in the present embodiment, compared with a configuration in which the surface of the metal plate exposed in the terminal contact portion is brought into contact with the mating terminal, unlike the present embodiment, the electrical conductivity between the terminal contact portion 40 and the mating terminal T is improved.

In the present embodiment, since the plating surfaces 23 of the substrate contact portion 50 are disposed on the left and right sides of the substrate contact portion 50, the contact surfaces between the plating surfaces 23 and the solder portions 51 can be ensured to be 2 surfaces. Therefore, in the present embodiment, the contact area with the solder portion 51 in the substrate contact portion 50 can be increased compared to a configuration in which the plating surfaces of the substrate contact portion are arranged above and below the substrate contact portion, unlike in the present embodiment. Further, since the width of the plated surface 23 is larger than the width of the cut surface 24 in the substrate contact portion 50, the solder portion 51 is sufficiently wetted on the plated surface 23, and the contact area between the plated surface 23 and the solder portion 51 can be sufficiently secured. As a result, the reliability of the electrical and mechanical connection between the substrate contact portion 50 and the substrate B is improved.

The

terminals

20A and 20B of the present embodiment are manufactured by a so-called pre-plating process in which a step B of cutting a metal material is performed after a step a of performing plating, because plating surfaces 23 are formed on 2 surfaces facing opposite sides of each other among 4 surfaces around the terminal body 30. Further, since the plating surface 23 of the terminal contact portion 40 and the plating surface 23 of the substrate contact portion 50 change their orientations by the

bent portions

33A and 33B, the plating surface 23 of the terminal contact portion 40 and the plating surface 23 of the substrate contact portion 50 can be formed at the same time in the step a of performing the plating. Therefore, the

terminals

20A and 20B having improved connectivity can be easily manufactured.

Further, in the present embodiment, since the

terminals

20A and 20B have the

bent portions

33A and 33B bent in different directions, even when the terminal contact portion 40 of the terminal 20A and the terminal contact portion 40 of the terminal 20B are vertically arranged, the

coupling portions

31A and 31B can be prevented from interfering with each other. Therefore, it is not necessary to arrange the terminal contact portions 40 of the terminals 20A and the terminal contact portions 40 of the terminals 20B in a staggered manner in order to avoid interference between the

coupling portions

31A and 31B, and the terminals 20A and the terminals 20B can be arranged compactly. As a result, the connector 10 for a substrate can be miniaturized.

As described above, in the present embodiment, the

terminals

20A and 20B and the substrate connector 10 having improved connectivity can be provided easily. Further, in the present embodiment, it is possible to contribute to downsizing of the board connector 10.

[ other embodiments of the present disclosure ]

The embodiments disclosed herein are illustrative and not restrictive in all respects.

In the case of the above embodiment, the plated surfaces of the terminal contact portion and the plated surfaces of the substrate contact portion change their mutual orientations by the bent portion, but the plated surfaces of the terminal contact portion and the plated surfaces of the substrate contact portion may change their mutual orientations by a portion of the terminal main body that is torsionally deformed.

In the above embodiment, one end sides of the plurality of terminals are arranged in a lattice shape of two upper and lower layers, but one end sides of the plurality of terminals may be one upper and lower layers or three or more upper and lower layers. Further, the plurality of terminals may be arranged in a staggered arrangement of two or more upper and lower layers on one end side.

In the above embodiment, both the upper-stage terminal and the lower-stage terminal have the bent portions, but only one of the upper-stage terminal and the lower-stage terminal may have the bent portion.

In the case of the above embodiment, the substrate contact portion is surface-mounted on the substrate, but the substrate contact portion may be mounted so as to penetrate the substrate.

Description of the reference numerals

10: connector for substrate

11: shell body

12: terminal holding wall

13A, 13B: press-in hole

14: cover part

20A, 20B: terminal with a terminal body

21: one end of

22: the other end of the tube

23: plated coating

24: cut surface

30: terminal body

31A, 31B: coupling part

32A, 32B: offset part

33A, 33B: bending part

34A, 34B: lower part of the drop

35: terminal main body base material

36. 37: corner part

38: can become part of the terminal contact part

39: can become part of the substrate contact part

40: terminal contact part

41: held part

42: clamping stop piece

50: substrate contact part

51: solder part

B: substrate

H: casing on the other side

T: the other side terminal

P: spacer

Claims

1. A terminal is provided with:

a terminal body having a quadrangular cross section extending from one end to the other end;

a terminal contact portion provided on one end side of the terminal main body and contacting with a counterpart terminal; and

a substrate contact portion provided on the other end side of the terminal main body and contacting the substrate,

the terminal body has a plating surface formed on the 2 surfaces facing opposite sides of the 4 surfaces around the terminal body,

the plated surface of the terminal contact portion and the plated surface of the substrate contact portion face in different directions from each other.

2. A terminal of claim 1, wherein the terminal body further has a bent portion in a bent shape,

the plated surface of the terminal contact portion and the plated surface of the substrate contact portion change their orientations by the bent portion.

3. A connector for a substrate, comprising the terminal according to claim 1 or claim 2,

the plated surface of the terminal contact portion is disposed on a side contacting with the contact portion of the counterpart terminal,

the plating surface of the substrate contact portion is arranged to stand from the surface of the substrate.

4. The connector for a substrate according to claim 3, wherein the substrate contact portion is surface-mounted to the substrate.

5. A method for manufacturing a terminal according to claim 1 or claim 2, comprising:

plating both plate surfaces of a plate-shaped metal material to form the plated surfaces;

cutting the metal material having the plated surface to obtain a terminal main body base material along the two plate surfaces;

and a step of performing processing of making the orientation of the plating surface different between a portion capable of serving as the terminal contact portion and a portion capable of serving as the substrate contact portion in the terminal body base material.