CN115308305A - Ultrasonic nondestructive flaw detection method for target - Google Patents

Ultrasonic nondestructive flaw detection method for target Download PDF

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Publication number
CN115308305A
CN115308305A CN202210906833.9A CN202210906833A CN115308305A CN 115308305 A CN115308305 A CN 115308305A CN 202210906833 A CN202210906833 A CN 202210906833A CN 115308305 A CN115308305 A CN 115308305A
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Prior art keywords
target material
solder
sample target
product
scanning
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CN202210906833.9A
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王英洁
胡智向
文崇斌
朱刘
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Vital Thin Film Materials Guangdong Co Ltd
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Vital Thin Film Materials Guangdong Co Ltd
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Priority to CN202210906833.9A priority Critical patent/CN115308305A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
    • G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

The invention discloses an ultrasonic nondestructive flaw detection method for a target material, which comprises the following steps: target pretreatment: combining the sample target material with the solder, then selecting a local part of the solder as a detection position and performing demetalization to form an actual preset defect detection position. Combining steps: and combining the sample target material and the back tube together to form a product. A detection step: placing the product into a pool platform, and flatly placing the product according to a water distance formula: d = F- δ (V1/V0); wherein F is the focal length of the scanning probe; delta is the thickness of the sample target material; v1 is the sound velocity of the sample target material; v0 is the sound velocity of water; and adjusting the water distance d and placing the focus of a scanning probe of the scanning equipment to the flaw detection position until the area of the defect point displayed by the scanning equipment is the same as or close to the area of the actual preset defect detection position. Whether the detection result of the detection equipment is accurate or not can be accurately known by a detector, so that the assembly line detection operation of batch targets is more accurate.

Description

Ultrasonic nondestructive flaw detection method for target
Technical Field
The invention relates to the technical field of flaw detection methods, in particular to an ultrasonic nondestructive flaw detection method for a target.
Background
Defective spots may be present in the interior of the target, or they may be present after the target has been bonded to the backing tube. In the production process, it is generally difficult to determine whether the defect point is within the error range, so that the defect point of the target needs to be detected to determine whether the defect point is a qualified product. The combined target is detected in all directions through detection equipment, if the detection position does not exceed the preset peak height, the target is qualified, and otherwise, the target is unqualified. In addition, the detection parameters of the detection equipment are different for targets with different specifications and different types.
It is important that the inspector is not aware of whether the determination of the inspection equipment is accurate.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide an ultrasonic nondestructive inspection method for a target, which can enable an inspector to accurately know whether the detection result of a detection device is accurate or not, so that the assembly line detection operation of batch targets is more accurate.
The purpose of the invention is realized by adopting the following technical scheme:
an ultrasonic nondestructive flaw detection method for a target material comprises the following steps:
target pretreatment: combining a sample target material with a solder, then selecting a local part of the solder as a detection position and performing demetalization to form an actual preset defect detection position;
combining steps: combining a sample target material with a back tube to form a product;
a detection step: placing the product in a pool platform, and leveling according to a water distance formula: d = F- δ (V1/V0); wherein F is the focal length of the scanning probe; delta is the thickness of the sample target material; v1 is the sound velocity of the sample target material; v0 is the sound velocity of water; and adjusting the water distance d and placing the focus of a scanning probe of the scanning equipment at the flaw detection position until the area of the defect point displayed by the scanning equipment is the same as or close to the area of the actual preset defect detection position.
Further, in the detection step, the water distance d is adjusted, and the focus of the scanning probe of the scanning device is placed at the flaw detection position until the error between the area of the defect point displayed by the scanning device and the area of the actual preset defect detection position is within 1%.
Further, in the detecting step, a scanning probe of the scanning device is perpendicular to the upper surface of the sample target.
And further, setting the peak height of an actual preset defect detection position of the product as a standard peak height value, and judging that the product is unqualified when the peak height value displayed on the detection equipment after any position of the product is detected is greater than or equal to the standard peak height value, or judging that the product is qualified.
Furthermore, the sample target is made of indium tin oxide, aluminum or zinc telluride materials.
Further, the solder is stainless steel solder, indium solder or tin solder.
Further, in the step of combining, the back tube is firstly combined with the solder structure, and then the solder of the back tube is combined with the solder of the sample target material.
Further, the actual default defect detection bits are rectangular in structure.
Further, the scanning device is a C-scan device.
Furthermore, a plurality of actual preset defect detection positions are arranged on the sample target, and the area of each actual preset defect detection position is different.
Compared with the prior art, the invention has the beneficial effects that:
the acceptable defects of the products are artificially manufactured on the sample target to form an actual preset defect detection position, so that the real area of the actual preset defect detection position can be exactly known, and the C scanning equipment is accurately debugged only when the C scanning equipment can be debugged to the point that the defect area of the actual preset defect detection position is close to the real surface test, so that the C scanning equipment is used as a high-precision detection device, the assembly line detection work is carried out on the products which belong to the same product with the sample target, the ultrasonic nondestructive inspection detection is carried out on the products exactly, and qualified products and unqualified products are screened out.
Detailed Description
The present invention is further described below by means of specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. As used herein, "vertical," "horizontal," "left," "right," and similar expressions are for purposes of illustration only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The ultrasonic nondestructive inspection method for the target material comprises the following steps:
target pretreatment: combining the sample target material with the solder, then selecting a local part of the solder as a detection position, and performing demetalization (namely scraping the solder at the detection position to expose the sample target material) to form an actual preset defect detection position.
Combining steps: and combining the sample target material and the back tube together to form a product.
A detection step: placing the product in a pool platform, and leveling according to a water distance formula: d = F- δ (V1/V0); wherein, F is the focal length of the scanning probe; delta is the thickness of the sample target material; v1 is the sound velocity of the sample target material; v0 is the sound velocity of water; and adjusting the water distance d and placing the focus of a scanning probe of the C scanning equipment at the flaw detection position until the area of the defect point displayed by the C scanning equipment is the same as or close to the area of the actual preset defect detection position.
The following tests of Table 1 were performedFor example, an indium tin oxide target material is used as a sample, a C-SCAN-ARS (scanning device) with the model of 7 axes is adopted, a focal length of 4inch (101.6 mm) and a 10MHz focusing probe are selected, the area of a defect detection position is preset to be 6mm by 8mm actually, namely the artificially manufactured area is 48mm 2 The defect of (2) is adjusted for 7 times in total, wherein the ultrasonic energy or the water distance is adjusted singly, so that the size of the defect area detected under each parameter is obtained. It is clear that the defect area size of the first group is 48.25mm 2 And 48mm 2 Most closely, the method is to select an indium tin oxide target, and adopt a C scanning device, select a focusing probe with a focal length of 4inch (i.e. 101.6 mm) and 10MHz, and under the conditions that the ultrasonic energy is 44db (decibel) and the water distance is 80.5mm, the C scanning device is in a state of being debugged, so that the method can be used for completing the ultrasonic nondestructive inspection of other products in batch. Note that: products belonging to the same product with the sample target material do not need to dig out a detection position, and the products can be directly subjected to ultrasonic nondestructive flaw detection by C scanning equipment. However, after each product replacement, the parameters of the C detection apparatus change, and when it is necessary to detect that the sample target belongs to the same target as the previous sample target, it is not necessary to re-manufacture a new sample target, that is, the old sample target can be re-used, but for data accuracy, the C scanning apparatus should be adjusted to the previous parameters (for example, a focus probe with a focal length of 4inch and a focus of 10MHz is selected) to perform the item 1-7 tests of table 1 on the old sample target again, and the old sample target is re-detected once to ensure that the defect area size of the item 1 is still 48.25mm 2 Or an approximation thereof.
TABLE 1 as follows
Figure BDA0003772746460000041
Figure BDA0003772746460000051
Wherein table 2 was prepared according to table 1:
TABLE 2 as follows
Figure BDA0003772746460000052
Obviously, the acceptable defects of the products are artificially made on the sample target to form an actual preset defect detection position, so that the real area of the actual preset defect detection position can be known exactly, and the C scanning equipment is accurately debugged only when the C scanning equipment can be debugged to detect that the defect area of the actual preset defect detection position is close to the real surface test, so that the C scanning equipment is used as a high-precision detection device to perform assembly line detection work on the products belonging to the same product with the sample target, to perform ultrasonic nondestructive inspection detection on the products exactly, and to screen out qualified products and unqualified products.
Preferably, in the detecting step, the water distance d is adjusted, and the focus of the scanning probe of the C scanning device is placed at the flaw detection position until the error between the area of the defect point displayed by the C scanning device and the area of the actual preset defect detection position is within 1%, and obviously, the error is the ratio of the absolute value of the difference between the two to the area of the actual preset defect detection position; the error is an artificial set value and is defined by the quality requirement of the manufacturer or industry or country for the product, which may be 0.6%, 0.7%, 0.8%, 0.9%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2%, etc.
Preferably, in the detecting step, in order to improve the detection accuracy, the scanning probe of the C-scan apparatus is preferably perpendicular to the upper surface of the sample target.
Preferably, based on the consumption of ultrasonic energy, in order to improve the detection requirement, the peak height of an actual preset defect detection position of the product is set as a standard peak height value, when the peak height value displayed on the C detection equipment after any position of the product is detected is greater than or equal to the standard peak height value, the product is judged to be unqualified, otherwise, the product is judged to be qualified.
Preferably, the sample target is made of indium tin oxide, aluminum or zinc telluride materials.
Preferably, the solder is stainless steel solder, indium solder or tin solder.
Preferably, in the step of combining, the back tube is firstly combined with the solder structure, and then the solder of the back tube is combined with the solder of the sample target material. It should be noted that, in the prior art, the combination of the backing tube and the sample target is many and mature, and therefore, the detailed description thereof is omitted.
In order to accurately calculate the area of the actual default defect detection site, the actual default defect detection site has a rectangular structure.
Preferably, the sample target is provided with a plurality of actual preset defect detection positions, and the areas of the actual preset defect detection positions are different. By means of the arrangement, through the parallel detection of multiple groups of data belonging to the same sample target, the adjustment of the C scanning equipment can be judged to be finished only when the area of each actually preset defect detection position is the same as or close to that of a defect point displayed by the current C scanning equipment, so that the C scanning equipment can be used for the assembly line detection of batch products which belong to the same product with the sample target.
In this embodiment, a C scanning device is taken as an example, and it can be understood that the detection method is also applicable to other scanning devices.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims (10)

1. An ultrasonic nondestructive flaw detection method for a target material is characterized by comprising the following steps:
target pretreatment: combining a sample target material with a solder, then selecting a local part of the solder as a detection position and performing demetalization to form an actual preset defect detection position;
combining steps: combining a sample target material and a back tube together to form a product;
a detection step: placing the product in a pool platform, and leveling according to a water distance formula: d = F- δ (V1/V0); wherein F is the focal length of the scanning probe; delta is the thickness of the sample target material; v1 is the sound velocity of the sample target material; v0 is the sound velocity of water; and adjusting the water distance d and placing the focus of a scanning probe of the scanning equipment to the flaw detection position until the area of the defect point displayed by the scanning equipment is the same as or close to the area of the actual preset defect detection position.
2. The ultrasonic nondestructive inspection method for a target material according to claim 1, wherein in the inspection step, the water distance d is adjusted and the focal point of the scanning probe of the scanning device is placed at the inspection position until an error between the area of the defect point displayed by the scanning device and the area of the actual preset defect inspection position is within 1%.
3. The method according to claim 1, wherein in the step of inspecting, a scanning probe of the scanning device is perpendicular to the upper surface of the sample target.
4. The ultrasonic nondestructive inspection method for a target material according to claim 1, wherein the peak height of the actual preset defect inspection position of the product is set to a standard peak height value, and when the peak height value displayed on the inspection equipment after any position of the product is inspected is greater than or equal to the standard peak height value, the product is judged to be unqualified, otherwise, the product is judged to be qualified.
5. The ultrasonic nondestructive inspection method for a target according to claim 1, wherein the sample target is made of an indium tin oxide material, an aluminum material, or a zinc telluride material.
6. The ultrasonic nondestructive inspection method for a target material according to claim 1, wherein the solder is a stainless steel solder, an indium solder or a tin solder.
7. The ultrasonic nondestructive inspection method for a target according to claim 1, wherein in the bonding step, the backing tube is bonded to the solder structure first, and then the solder of the backing tube is bonded to the solder of the sample target.
8. The ultrasonic nondestructive inspection method for a target material according to claim 1, wherein the actual predetermined defect inspection site has a rectangular configuration.
9. The ultrasonic nondestructive inspection method for a target material according to claim 1, wherein the scanning apparatus is a C-scan apparatus.
10. The method according to claim 1, wherein the sample target has a plurality of actual default flaw detection sites, and each actual default flaw detection site has a different area.
CN202210906833.9A 2022-07-29 2022-07-29 Ultrasonic nondestructive flaw detection method for target Pending CN115308305A (en)

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Application Number Priority Date Filing Date Title
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