CN115308305A - A kind of ultrasonic non-destructive testing method for target material - Google Patents
A kind of ultrasonic non-destructive testing method for target material Download PDFInfo
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- 238000009659 non-destructive testing Methods 0.000 title claims abstract description 19
- 239000013077 target material Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 76
- 239000000523 sample Substances 0.000 claims abstract description 60
- 230000007547 defect Effects 0.000 claims abstract description 53
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 4
- SKJCKYVIQGBWTN-UHFFFAOYSA-N (4-hydroxyphenyl) methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=C(O)C=C1 SKJCKYVIQGBWTN-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/265—Arrangements for orientation or scanning by relative movement of the head and the sensor by moving the sensor relative to a stationary material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
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- Acoustics & Sound (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
本发明公开了一种用于靶材的超声无损探伤检测方法，包括如下步骤：靶材预处理步骤：将样品靶材与焊料结合，然后挑选焊料的局部作为检测位并进行去金属化，以形成实际预设缺陷检测位。结合步骤：将样品靶材与背管结合在一起，以形成产品。检测步骤：将产品置入水池平台放平，根据水距公式：d＝F–δ*(V1/V0)；其中，F为扫描探头焦距；δ为样品靶材厚度；V1为样品靶材的声速；V0为水的声速；调节水距d并将扫描设备的扫描探头的焦点放到探伤位置，直至扫描设备显示的缺陷点面积与实际预设缺陷检测位的面积相同或相近。其能够使得检测员准确地知晓检测设备的检测结果是否精准，从而使得批量靶材的流水线检测作业更加准确。The invention discloses an ultrasonic non-destructive testing method for target materials, comprising the following steps: a target material pretreatment step: combining a sample target material with solder, and then selecting a part of the solder as a detection position and performing demetallization to Form the actual preset defect detection bits. Bonding step: Bond the sample target with the back tube to form the product. Detection step: Put the product into the pool platform and level it, according to the water distance formula: d=F–δ*(V1/V0); among them, F is the focal length of the scanning probe; δ is the thickness of the sample target; V1 is the sample target. Sound speed; V0 is the sound speed of water; adjust the water distance d and place the focus of the scanning probe of the scanning device on the flaw detection position until the area of the defect point displayed by the scanning device is the same or similar to the area of the actual preset defect detection position. It enables inspectors to accurately know whether the inspection results of the inspection equipment are accurate, thereby making the pipeline inspection operation of batch targets more accurate.
Description
技术领域technical field
本发明涉及探伤检测方法技术领域，尤其涉及一种用于靶材的超声无损探伤检测方法。The invention relates to the technical field of flaw detection methods, in particular to an ultrasonic nondestructive detection method for target materials.
背景技术Background technique
靶材的内部可能有不合格的缺陷点，或者靶材与背管结合后，也可能因此产生缺陷点。而在生产过程中，一般较难判定该缺陷点是否在误差范围内，因而需要对靶材的缺陷点进行检测，以判定其是否为合格产品。即通过检测设备将结合后的靶材进行全方位检测，如果检测位置未超过预设峰高，则代表合格，否则不合格。另外，不同规格、不同品类的靶材，检测设备的检测参数也不同。There may be unqualified defect points inside the target material, or defect points may also be generated after the target material is combined with the back tube. In the production process, it is generally difficult to determine whether the defect point is within the error range, so it is necessary to detect the defect point of the target to determine whether it is a qualified product. That is, the combined target is inspected in all directions by the detection equipment. If the detection position does not exceed the preset peak height, it is qualified, otherwise it is unqualified. In addition, for targets of different specifications and categories, the detection parameters of the detection equipment are also different.
重要的是，检测员也无从知晓检测设备的判定是否准确。The most important thing is that the inspector has no way of knowing whether the judgment of the detection equipment is accurate.
发明内容Contents of the invention
为了克服现有技术的不足，本发明的目的在于提供一种用于靶材的超声无损探伤检测方法，其能够使得检测员准确地知晓检测设备的检测结果是否精准，从而使得批量靶材的流水线检测作业更加准确。In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide an ultrasonic non-destructive testing method for targets, which can enable the inspector to accurately know whether the detection results of the detection equipment are accurate, so that the assembly line of batch targets Detection operations are more accurate.
本发明的目的采用如下技术方案实现：The purpose of the present invention adopts following technical scheme to realize:
一种用于靶材的超声无损探伤检测方法，包括如下步骤：An ultrasonic nondestructive testing method for a target, comprising the steps of:
靶材预处理步骤：将样品靶材与焊料结合，然后挑选焊料的局部作为检测位并进行去金属化，以形成实际预设缺陷检测位；Target pretreatment step: combine the sample target with solder, then select a part of the solder as the detection position and perform demetallization to form the actual preset defect detection position;
结合步骤：将样品靶材与背管结合在一起，以形成产品；Binding step: combining the sample target with the back tube to form a product;
检测步骤：将产品置入水池平台放平，根据水距公式：d＝F–δ*(V1/V0)；其中，F为扫描探头焦距；δ为样品靶材厚度；V1为样品靶材的声速；V0为水的声速；调节水距d并将扫描设备的扫描探头的焦点放到探伤位置，直至扫描设备显示的缺陷点面积与实际预设缺陷检测位的面积相同或相近。Detection steps: put the product into the pool platform and lay it flat, according to the water distance formula: d=F–δ*(V1/V0); where, F is the focal length of the scanning probe; δ is the thickness of the sample target; V1 is the thickness of the sample target Sound velocity; V0 is the sound velocity of water; adjust the water distance d and place the focus of the scanning probe of the scanning device on the flaw detection position until the area of the defect point displayed by the scanning device is the same or similar to the area of the actual preset defect detection position.
进一步地，在检测步骤中，调节水距d并将扫描设备扫描探头的焦点放到探伤位置，直至扫描设备显示的缺陷点面积与实际预设缺陷检测位的面积之间的误差在1％以内。Further, in the detection step, adjust the water distance d and place the focus of the scanning probe on the flaw detection position until the error between the area of the defect point displayed by the scanning device and the area of the actual preset defect detection position is within 1%. .
进一步地，在检测步骤中，扫描设备的扫描探头与样品靶材的上表面垂直。Further, in the detection step, the scanning probe of the scanning device is perpendicular to the upper surface of the sample target.
进一步地，设定产品的实际预设缺陷检测位的峰高为标准峰高值，当产品的任意位置被检测后的在检测设备上显示的峰高值大于或等于标准峰高值时，则判定产品不合格，否则判定产品合格。Further, the peak height of the actual preset defect detection position of the product is set as the standard peak height value, when the peak height value displayed on the detection equipment after any position of the product is detected is greater than or equal to the standard peak height value, then The product is judged to be unqualified, otherwise the product is judged to be qualified.
进一步地，所述样品靶材采用氧化铟锡、铝或碲化锌材料制成。Further, the sample target is made of indium tin oxide, aluminum or zinc telluride.
进一步地，所述焊料为不锈钢焊料、铟焊料或锡焊料。Further, the solder is stainless steel solder, indium solder or tin solder.
进一步地，结合步骤中，所述背管先与焊料结构，然后再将背管的焊料与样品靶材的焊料结合。Further, in the combining step, the back tube is first combined with the solder structure, and then the solder of the back tube is combined with the solder of the sample target.
进一步地，实际预设缺陷检测位为矩形结构。Further, the actual preset defect detection bit is a rectangular structure.
进一步地，所述扫描设备为C扫描设备。Further, the scanning device is a C-scanning device.
进一步地，所述样品靶材上设有多个实际预设缺陷检测位，且每个实际预设缺陷检测位的面积不同。Further, the sample target is provided with a plurality of actual preset defect detection positions, and the area of each actual preset defect detection position is different.
相比现有技术，本发明的有益效果在于：Compared with the prior art, the beneficial effects of the present invention are:
通过在样品靶材人为地制作产品可接受的缺陷，以形成实际预设缺陷检测位，从而能够确切地知晓该实际预设缺陷检测位的真实面积，只有当C扫描设备能够被调试至检测到该实际预设缺陷检测位的缺陷面积与真实面试接近时，才说明C扫描设备被精确地调试完毕，从而使得其作为一个高精度的检测装置，以对与样品靶材属于同一产品的产品进行流水线检测工作，以确切地对产品进行超声无损探伤检测，进而筛选出合格品和不合格品。By artificially making product acceptable defects on the sample target to form the actual preset defect detection position, so that the real area of the actual preset defect detection position can be known exactly, only when the C-scanning equipment can be debugged to detect When the defect area of the actual preset defect detection position is close to the actual interview, it means that the C-scan equipment has been accurately debugged, so that it can be used as a high-precision detection device to detect products that belong to the same product as the sample target. The assembly line inspection work is used to conduct ultrasonic non-destructive testing on the products, and then screen out qualified and unqualified products.
具体实施方式Detailed ways
下面，通过具体实施方式对本发明做进一步描述，需要说明的是，在不相冲突的前提下，以下描述的各实施例之间或各技术特征之间可以任意组合形成新的实施例。Hereinafter, the present invention will be further described through specific implementation methods. It should be noted that, on the premise of no conflict, the various embodiments or technical features described below can be combined arbitrarily to form new embodiments.
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上，或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能存在居中元件。本文所使用的“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不代表是唯一的实施方式。It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element, or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may be present. "Vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.
除非另有定义，本文所使用的所有的技术术语和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the invention is for the purpose of describing specific embodiments only, and is not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
本实施例的一种用于靶材的超声无损探伤检测方法，包括如下步骤：An ultrasonic nondestructive testing method for a target in this embodiment includes the following steps:
靶材预处理步骤：将样品靶材与焊料结合，然后挑选焊料的局部作为检测位并进行去金属化(即将检测位的焊料刮除，以使样品靶材裸露出来)，以形成实际预设缺陷检测位。Target pretreatment step: combine the sample target with solder, then select a part of the solder as the detection position and perform demetallization (that is, scrape off the solder at the detection position to expose the sample target) to form the actual preset Defect detection bit.
结合步骤：将样品靶材与背管结合在一起，以形成产品。Binding step: The sample target is combined with the back tube to form a product.
检测步骤：将产品置入水池平台放平，根据水距公式：d＝F–δ*(V1/V0)；其中，F为扫描探头焦距；δ为样品靶材厚度；V1为样品靶材的声速；V0为水的声速；调节水距d并将C扫描设备的扫描探头的焦点放到探伤位置，直至C扫描设备显示的缺陷点面积与实际预设缺陷检测位的面积相同或相近。Detection steps: put the product into the pool platform and lay it flat, according to the water distance formula: d=F–δ*(V1/V0); where, F is the focal length of the scanning probe; δ is the thickness of the sample target; V1 is the thickness of the sample target Sound velocity; V0 is the sound velocity of water; adjust the water distance d and place the focus of the scanning probe of the C-scanning device on the flaw detection position until the area of the defect point displayed by the C-scanning device is the same or similar to the area of the actual preset defect detection position.
以下面的表1的测试为例，以氧化铟锡靶材为样品，C扫描设备的型号为7轴的C-SCAN-ARS，选用焦距4inch(即101.6mm)，10MHz聚焦探头，实际预设缺陷检测位的面积为6mm*8mm，即人为制造面积为48mm2的缺陷，一共进行了7次调节，其中为单一调节超声波能量或单一调节水距，从而得出各参数下检测出来的缺陷面积的大小。显然，第一组的缺陷面积大小为48.25mm2与48mm2最相近，即代表选用氧化铟锡靶材，且采用C扫描设备、选用焦距4inch(即101.6mm)，10MHz聚焦探头的情形下，且超声波能量为44db(分贝)，水距为80.5mm情况下，此时的C扫描设备处于调试完毕状态，因而可以用于批量地完成其他产品的超声无损探伤检测。注意：与样品靶材属于同一产品的产品无需挖出检测位，即直接被C扫描设备进行超声无损探伤检测即可。但每次更换产品后，C检测设备的参数产生了变化，需要检测与之前的样品靶材属于同一靶材时，无需重新制作新的样品靶材，即旧的样品靶材可以重新启用，但为了数据准确，应当将C扫描设备调试至之前的各参数(例如选用焦距4inch、10MHz聚焦探头)对旧的样品靶材再次进行表1的项目1-7测试，将所述旧的样品靶材重新检测一遍，以确保项目1的缺陷面积大小依然是48.25mm2或近似值即可。Taking the test in Table 1 below as an example, the indium tin oxide target is used as the sample, the C-scanning equipment model is 7-axis C-SCAN-ARS, the focal length is 4inch (ie 101.6mm), the 10MHz focusing probe is selected, and the actual preset The area of the defect detection position is 6mm*8mm, that is, the artificially manufactured defect with an area of 48mm 2 , a total of 7 adjustments have been made, including single adjustment of ultrasonic energy or single adjustment of water distance, so as to obtain the detected defect area under each parameter the size of. Obviously, the size of the defect area of the first group is 48.25mm 2 which is the closest to 48mm 2 , which means that the target material of indium tin oxide is selected, and the C-scan equipment is used, the focal length is 4inch (ie 101.6mm), and the focus probe of 10MHz is selected. And when the ultrasonic energy is 44db (decibels) and the water distance is 80.5mm, the C-scan equipment is in the state of debugging at this time, so it can be used to complete the ultrasonic non-destructive testing of other products in batches. Note: The product that belongs to the same product as the sample target does not need to dig out the detection position, that is, it can be directly tested by the C-scan equipment for ultrasonic non-destructive testing. However, after each replacement of the product, the parameters of the C detection equipment have changed. When it is necessary to detect the same target as the previous sample target, there is no need to make a new sample target, that is, the old sample target can be used again, but For the accuracy of the data, the C-scan equipment should be adjusted to the previous parameters (for example, the focal length 4inch, 10MHz focusing probe) should be used to test the items 1-7 of Table 1 again on the old sample target, and the old sample target Re-inspect to ensure that the size of the defect area of item 1 is still 48.25mm 2 or an approximate value.
表1如下Table 1 is as follows
其中，根据表1制得表2：Wherein, table 2 is made according to table 1:
表2如下Table 2 is as follows
显然，通过在样品靶材人为地制作产品可接受的缺陷，以形成实际预设缺陷检测位，从而能够确切地知晓该实际预设缺陷检测位的真实面积，只有当C扫描设备能够被调试至检测到该实际预设缺陷检测位的缺陷面积与真实面试接近时，才说明C扫描设备被精确地调试完毕，从而使得其作为一个高精度的检测装置，以对与样品靶材属于同一产品的产品进行流水线检测工作，以确切地对产品进行超声无损探伤检测，进而筛选出合格品和不合格品。Obviously, by artificially making product-acceptable defects on the sample target to form the actual preset defect detection position, so that the real area of the actual preset defect detection position can be known exactly, only when the C-scanning equipment can be debugged to When it is detected that the defect area of the actual preset defect detection position is close to the real interview, it means that the C-scanning equipment has been accurately debugged, so that it can be used as a high-precision detection device to detect the same product as the sample target. The products are tested on the assembly line to accurately conduct ultrasonic non-destructive testing on the products, and then screen out qualified and unqualified products.
优选地，在检测步骤中，调节水距d并将C扫描设备扫描探头的焦点放到探伤位置，直至C扫描设备显示的缺陷点面积与实际预设缺陷检测位的面积之间的误差在1％以内，显然，误差即为两者差值绝对值与实际预设缺陷检测位的面积之间的比值；而该误差为人为设定值，以厂家或行业或国家对产品的品质要求进行界定，其可以是0.6％、0.7％、0.8％、0.9％、1.1％、1.2％、1.3％、1.4％、1.5％、1.6％、1.7％、1.8％、1.9％、2％等等。Preferably, in the detection step, the water distance d is adjusted and the focus of the scanning probe of the C-scanning device is placed on the flaw detection position until the error between the area of the defect point displayed by the C-scanning device and the area of the actual preset defect detection position is within 1 %, obviously, the error is the ratio between the absolute value of the difference between the two and the area of the actual preset defect detection position; and the error is an artificially set value, which is defined by the quality requirements of the manufacturer, industry or country , which can be 0.6%, 0.7%, 0.8%, 0.9%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2% and so on.
优选地，在检测步骤中，为了提高检测精度，C扫描设备的扫描探头最好与样品靶材的上表面垂直。Preferably, in the detection step, in order to improve the detection accuracy, the scanning probe of the C-scan device is preferably perpendicular to the upper surface of the sample target.
优选地，基于超声波能量有消耗，为了提高检测的要求，设定产品的实际预设缺陷检测位的峰高为标准峰高值，当产品的任意位置被检测后的在C检测设备上显示的峰高值大于或等于标准峰高值时，则判定产品不合格，否则判定产品合格。Preferably, based on the consumption of ultrasonic energy, in order to improve the detection requirements, the peak height of the actual preset defect detection position of the product is set as the standard peak height value, which is displayed on the C detection equipment when any position of the product is detected When the peak height value is greater than or equal to the standard peak height value, the product is judged to be unqualified, otherwise the product is judged to be qualified.
优选地，所述样品靶材采用氧化铟锡、铝或碲化锌材料制成。Preferably, the sample target is made of indium tin oxide, aluminum or zinc telluride.
优选地，所述焊料为不锈钢焊料、铟焊料或锡焊料。Preferably, the solder is stainless steel solder, indium solder or tin solder.
优选地，结合步骤中，所述背管先与焊料结构，然后再将背管的焊料与样品靶材的焊料结合。需要说明的是，现有技术中，背管与样品靶材的结合方式很多，也较为成熟，因此不对其进行赘述。Preferably, in the combining step, the back tube is first combined with the solder structure, and then the solder of the back tube is combined with the solder of the sample target. It should be noted that, in the prior art, there are many ways to combine the back tube and the sample target, and they are relatively mature, so they will not be described in detail.
其中，为了精确地计算实际预设缺陷检测位的面积，实际预设缺陷检测位为矩形结构。Wherein, in order to accurately calculate the area of the actual preset defect detection bit, the actual preset defect detection bit has a rectangular structure.
优选地，样品靶材上设有多个实际预设缺陷检测位，且每个实际预设缺陷检测位的面积不同。这样设置，通过隶属于同一样品靶材的多组数据并行检测，只有当每个实际预设缺陷检测位与当次的C扫描设备显示的缺陷点面积相同或相近时，才能判定C扫描设备调节完毕，从而可以用于与该样品靶材同属于同一产品的批量产品的流水线检测。Preferably, the sample target is provided with a plurality of actual preset defect detection positions, and the area of each actual preset defect detection position is different. With this setting, through parallel detection of multiple sets of data belonging to the same sample target, only when each actual preset defect detection position is the same or similar to the area of the defect point displayed by the current C-scan device, can the C-scan device be adjusted completed, so that it can be used for the assembly line detection of batch products that belong to the same product as the sample target.
本实施例以C扫描设备为例，可以理解的是，本检测方法同样适用于其他扫描设备。This embodiment takes a C-scanning device as an example, and it can be understood that this detection method is also applicable to other scanning devices.
上述实施方式仅为本发明的优选实施方式，不能以此来限定本发明保护的范围，本领域的技术人员在本发明的基础上所做的任何非实质性的变化及替换均属于本发明所要求保护的范围。The above-mentioned embodiment is only a preferred embodiment of the present invention, and cannot be used to limit the protection scope of the present invention. Any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention belong to the scope of the present invention. Scope of protection claimed.
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