CN115302357A - Spiral polishing path planning method based on evaluation function - Google Patents

Spiral polishing path planning method based on evaluation function Download PDF

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CN115302357A
CN115302357A CN202210943915.0A CN202210943915A CN115302357A CN 115302357 A CN115302357 A CN 115302357A CN 202210943915 A CN202210943915 A CN 202210943915A CN 115302357 A CN115302357 A CN 115302357A
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path
point
polishing
points
evaluation function
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CN115302357B (en
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舒勇
王皖阳
陈凤云
赵军
刘旭鹏
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Air Force Engineering University of PLA Aircraft Maintenace Management Sergeant School
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Air Force Engineering University of PLA Aircraft Maintenace Management Sergeant School
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

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  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention discloses a spiral polishing path planning method based on an evaluation function, which comprises the following steps: s1: analyzing the characteristics of the polishing path according to the path evaluation function to find the polishing path; s2: planning a spiral polishing path based on the path evaluation function; s3: according to the step S2, a series of paths with differences are obtained by using different coefficients, and an optimal polishing path is selected; the spiral polishing path planning method provided by the invention is based on the path evaluation function, uses an optimized searching mode to plan and search for an optimal polishing path, can automatically avoid certain areas which do not need to be processed, improves the processing efficiency, and effectively solves the problems that in the prior art, if a certain area is to be avoided by using the spiral polishing path in the processing process, the advancing direction of the path needs to be manually changed, the manual setting process is complicated, the path direction needs to be continuously adjusted along with the change of the area, the workload is large, the efficiency is low, and the processing requirement cannot be met.

Description

Spiral polishing path planning method based on evaluation function
Technical Field
The invention relates to the field of optical element polishing, in particular to a spiral polishing path planning method based on an evaluation function.
Background
CCOS (Computer controlled optical surface shaping), the basic working principle of Computer controlled optical surface shaping, is: firstly, dividing the surface of an optical element into a plurality of residence points, then calculating the residence time of a polishing tool at each residence point according to the distribution of surface errors, then controlling the polishing tool to pass through all the residence points along a certain polishing path according to the calculated residence time to realize the quantitative removal of the surface of the optical element, measuring the surface errors of the optical element after the processing is finished, and then carrying out the next polishing flow, thus achieving the purpose of correcting the errors after a plurality of iterations.
Depending on the shape of the optical element and the configuration of the processing machine, the polishing path can be divided into two main categories: the X-Y grid path and the spiral polishing path are slightly less adaptable when processing a circular element, and thus the spiral polishing path is often used for processing.
In the process of processing by using the spiral polishing path, all residence points on the surface of the optical element are covered according to a certain rule, and in the specific processing process, different removal processing of different error areas is realized by residence for a longer time at points with larger errors and residence for a shorter time at points with smaller errors, so that the purpose of correcting surface errors is achieved.
In the processing process, the error of the area with larger error is hopefully removed, the area with smaller error on the surface of the optical element is avoided, and the removal amount is not generated in the area; in addition to the areas with smaller errors, it is sometimes desirable to process only a portion of the optical element while avoiding other areas to achieve better processing results.
In the prior art, when a spiral polishing path is implemented, if a certain area is to be avoided in a machining process, a common method is to find a boundary of the area, and then manually change the advancing direction of the path to enable the machining path to avoid the area. However, the manual setting process is complicated, and the path direction needs to be continuously adjusted along with the change of the area, so that the workload is large, the efficiency is low, and the processing requirement cannot be met.
The present invention therefore provides a new solution to this problem.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a spiral polishing path planning method based on an evaluation function, which effectively solves the problems that in the prior art, if a certain area is to be avoided by using a spiral polishing path in the processing process, the advancing direction of the path needs to be manually changed, the manual setting process is complicated, the path direction needs to be continuously adjusted along with the change of the area, the workload is large, the efficiency is low, and the processing requirements cannot be met.
The technical scheme for solving the problem is that the method for planning the spiral polishing path based on the evaluation function comprises the following steps:
s1: analyzing the characteristics of the polishing path according to the path evaluation function to find the polishing path;
s2: planning a spiral polishing path based on a path evaluation function;
s3: according to the step S2, a series of paths with differences are obtained by using different coefficients, and an optimal polishing path is selected;
the path evaluation function is a characteristic function describing the characteristics of the optimal polishing path;
and S1: analyzing the characteristics of the polishing path according to the path evaluation function to find the polishing path, which specifically comprises the following contents:
the path evaluation function contains several parameters describing the polishing path, including the total length of the path, the angle through which the path turns, the movement of the path in the radial direction, and the sum of the radial lengths of each point on the path;
analyzing the characteristics of the polishing path, it has the following characteristics: firstly, the length of the polishing path is short; secondly, the rotating angle of the polishing path is small; thirdly, the polishing path has small radial movement; fourthly, the sum of the radial lengths of all points on the polishing path is small;
according to the characteristics of the polishing path, carrying out optimization search to find the optimal polishing path, connecting all resident points on the optical element, covering the optical surface and avoiding certain regions which do not need to be processed on the optical element;
and S2: the method for planning the spiral polishing path based on the path evaluation function specifically comprises the following steps:
s2.1, searching adjacent points of the initial point, setting a parameter r by taking the initial point as the center of a circle, drawing a circle by taking the r as the radius, calculating the distance between other points and the initial point, if the distance value from a certain point to the initial point is less than the radius r of the circle, locating the point in the circle, and selecting all the points in the circle as the adjacent points of the initial point;
s2.2: calculating a path evaluation function using f 1 =a 1 *s 1 +b 1 *rd 1 +c 1 *r 1 Calculating a path merit function for each neighboring point, wherein a 1 ,b 1 ,c 1 Is a coefficient of three, s 1 Is the distance between a certain adjacent point and the starting point, rd 1 Is a value of radial movement between a certain adjacent point and the starting point, r 1 Is the radial length of a certain adjacent point, f 1 A path merit function representing a certain neighboring point;
s2.3: selecting n adjacent points with the minimum numerical value, calculating the path evaluation functions of all the adjacent points, then sorting the path evaluation function numerical values of the adjacent points according to the minimum value, and selecting the points which are ranked at the top n in the sequence, namely the n adjacent points with the minimum numerical value;
s2.4: selecting one of n adjacent points as a starting point, and searching the adjacent point according to the step S2.1, wherein the numerical value of the parameter r is consistent with the step S2.1;
s2.5: according to the step S2.2, calculating a path evaluation function of each adjacent point, wherein the calculation formula and the parameter value are consistent with the step S2.2;
s2.6: according to the step S2.3, n adjacent points with the minimum numerical value are selected, after the path evaluation functions of all the adjacent points are calculated, the path evaluation function numerical values of the adjacent points are sorted from small to large, and the points which are arranged at the top n in the sequence, namely the n adjacent points with the minimum numerical values, are selected;
s2.7: repeating steps S2.4 to S2.6 to obtain n × n dots;
s2.8: searching a father point of each point in n x n points, connecting the point to the father point, wherein the father point refers to a point expanded to the point and is connected to an ancestor point, the ancestor point refers to a point expanded to the father point, and after searching connection, connecting to a starting point finally to obtain n x n paths;
s2.9: using the formula f 2 =a 2 *s 2 +b 2 *rd 2 +c 2 *r 2 +d 2 * ag calculating path evaluation function of the n x n paths, wherein a 2 ,b 2 ,c 2 ,d 2 Is a four coefficient, s 2 Is the total length of the path, rd 2 Is the sum of the radial movements of all points on the path, r 2 Is the sum of the radial lengths of all points, ag is the sum of the angular changes of the entire path;
s2.10: sorting the path evaluation function values of n paths by n according to the sequence from small to large, selecting the paths ranked at the top n in the sequence, namely selecting the n lines with the minimum values, and setting the tail points of the paths, namely the last points as calculation points;
s2.11: if the calculated path covers all the residence points, finishing the calculation; otherwise, repeating the step S2.4 to the step S2.10 until all the residence points are covered;
and S3: according to the step S2, a series of paths with differences are obtained by using different coefficients, and the optimal polishing path is selected, wherein the specific contents are as follows:
step S2, aiming at a group of parameters, calculating polishing paths under the group of parameters, obtaining a series of paths with differences by using different coefficients, and selecting an optimal polishing path as a final polishing path;
the final polishing path is selected to satisfy the following constraints:
firstly, the polishing path covers all the points desired to be processed, and cannot be missed or missing;
secondly, the distribution of the polishing paths is continuous, and the polishing paths only pass through each processing point once, so that the polishing paths cannot pass through a certain processing point for multiple times.
The invention has the following beneficial effects:
the spiral polishing path planning method analyzes the characteristics of the polishing path, based on the path evaluation function, the optimal polishing path is planned and found in an optimized searching mode, all the residence points are connected, the surface of the optical element is covered, the optimal polishing path can be automatically found, certain areas which do not need to be machined can be automatically avoided, and the machining efficiency is improved.
Drawings
FIG. 1 is a schematic view of a spiral polishing path process.
Fig. 2 is a schematic diagram of the amount of extra removal.
FIG. 3 is a flow chart of planning a spiral polishing path based on a path merit function.
FIG. 4 is a diagram illustrating the optimization results of the spiral polishing path of the circular element.
FIG. 5 is a graphical representation of the results of path optimization of a circular element with fan-shaped unmachined areas.
Fig. 6 is a schematic diagram of the optimization results of a circular element path with a circular unmachined area.
Detailed Description
The foregoing and other technical and other features and advantages of the invention will be apparent from the following more particular description of the embodiments, as illustrated in the accompanying drawings. The structural contents mentioned in the following embodiments are all referred to the attached drawings of the specification.
Hereinafter, a method for planning a spiral polishing path according to the present invention based on an evaluation function will be described in detail by way of embodiments with reference to the accompanying drawings.
A method for spiral polishing path planning based on an evaluation function, the method comprising the steps of:
s1: analyzing the characteristics of the polishing path according to the path evaluation function to find the polishing path;
s2: planning a spiral polishing path based on a path evaluation function;
s3: and according to the step S2, obtaining a series of paths with difference by using different coefficients, and selecting an optimal polishing path.
CCOS polishing means that a polishing tool stays for different time at each resident point on the surface of an optical element under the control of a computer to realize different removal amount of each point so as to achieve the aim of correcting surface errors, and with the development of the polishing tool, the CCOS gradually uses the traditional grinding head for polishing to develop various forms such as magnetorheological polishing, ion beam polishing, airbag polishing, jet polishing, polishing wheel polishing and the like;
although CCOS polishing has various different expression forms, the basic working principle is consistent, firstly, the surface of an optical element is divided into a plurality of residence points, then the residence time of a polishing tool at each residence point is calculated according to the distribution of surface errors, then the polishing tool is controlled to pass through all the residence points according to the calculated residence time and a certain polishing path, so that the quantitative removal of the surface of the optical element is realized, the surface errors of the optical element are measured after the processing is finished, and then the next polishing flow is carried out, so that the purpose of correcting the errors is achieved after a plurality of iterations;
the division of the polishing path can be divided into two main categories according to the shape of the optical element and the structure of the processing machine: an X-Y grid path and a spiral polishing path, the earliest occurring polishing machine tool is provided with an X axis and a Y axis, and a polishing tool moves along the X-Y direction, so that the polishing path is an X-Y grid path, which is simple to calculate and easy to implement, but the X-Y grid path is slightly less adaptable when processing a circular element, and the spiral polishing path as shown in fig. 1 can be used for processing;
the processing of the spiral polishing path can be described by a polar coordinate system, a machine tool for generating the spiral polishing path generally comprises a rotary motion turntable and a linear motion shaft, an optical element rotates along with the turntable during working, a polishing tool linearly moves along the radial direction of the optical element, and polishing of each standing point of the optical element is realized through linkage of the optical element and the polishing tool;
the spiral polishing path may start at the center or edge of the optical element, here described with the center as the starting point: the polishing tool starts from the center of the optical element and moves towards the edge of the element under the control of the linear motion shaft, namely, the polishing tool makes linear motion along the radial direction of the element; meanwhile, the optical element is driven by the turntable to rotate, and the optical element and the turntable finally form an outward-diffused spiral line according to the synthesis of movement, so that each residence point of the optical element is covered, and if the optical element moves from the edge of the element to the center, an inward-contracted spiral line is finally formed;
in the implementation process of the spiral polishing path, all residence points on the surface of the optical element are covered according to a certain rule, and in the specific processing process, different removal amounts of different error areas are realized by residence for a longer time at a point with a larger error and residence for a shorter time at a point with a smaller error, so that the purpose of correcting the surface error is achieved;
in the machining process, it is desirable to remove only the error in the area with the larger error, and remove as little or no error as possible in the area with the smaller error, so that the polishing tool is required to pass through the area with the smaller error or pass through the area with the smaller error as fast as possible, according to the basic principle of CCOS polishing, the polishing tool covers all the staying points on the optical element, and in addition, because of the limitation of the motion performance of the machine tool, a threshold value exists in the maximum speed of the polishing tool, which causes the polishing tool to generate a certain removal in the area with the smaller error, and in order to ensure the accuracy of surface error correction, a part of extra removed material is generally required to be added, and the part of the material is not required to be added, as shown in fig. 2, which is a schematic diagram of the extra removed amount;
it is desirable that the polishing tool can avoid the area with small surface error of the optical element during the processing, and the removal amount is not generated in the area, and the processing mode has the following advantages: firstly, the polishing efficiency can be improved, and because the processing is not carried out in a region with small error, the processing region becomes small, the required processing time is shortened, and the polishing efficiency is correspondingly improved; the polishing time is shortened, and because the polishing is not carried out in a region with small error, no extra removal amount is needed to be set, and the processing time can be reduced; thirdly, the success rate is improved, when the surface error of the optical element is measured, the measurement error is inevitably introduced, the processing is carried out completely according to the measurement error, the convergence of the error cannot be ensured, but only points with larger errors are removed in the processing process, areas with smaller errors are not processed, compared with the whole surface processing, the success rate of the error convergence is higher, except areas with smaller errors, people only want to process partial areas of the optical element and avoid other areas to obtain a better processing effect, and at the moment, a processing path is required to avoid certain areas;
in the prior art, a spiral polishing path is realized by a formula of ρ = a θ, where θ is an angle, ρ is a polar axis length, and a is a constant, a numerical value of a controls a distance between two adjacent spiral lines, the larger a is, the smaller a is, and a corresponding polar axis value ρ can be calculated by giving a θ value, so as to obtain a spiral line covering a surface of an optical element.
In order to solve the problems in the prior art, a path planning algorithm capable of automatically avoiding some areas on an optical element needs to be found, so that the application provides a spiral polishing path planning method based on an evaluation function, an optimal polishing path is planned and found in an optimized searching mode, all residence points are connected to cover the surface of the optical element, the optimal polishing path can be automatically found, some areas which do not need to be processed can be automatically avoided, and the processing efficiency is improved.
And (S1): analyzing the characteristics of the polishing path according to the path evaluation function to find the polishing path, which specifically comprises the following contents:
the method changes the method for generating the polishing path in the prior art, and is different from the traditional technology for calculating the polishing path by using a formula, the method plans and searches for the optimal polishing path by using an optimized searching mode, connects all the residence points to realize the coverage of the surface of the optical element, and needs to define a characteristic function capable of describing the characteristics of the optimal path, which is called a path evaluation function, for the polishing path during optimized searching;
the path evaluation function contains several parameters describing the polishing path, such as the total length of the path, the angle through which the path is turned, the movement of the path in the radial direction, and the sum of the radial lengths of each point on the path, etc. by analyzing the spiral polishing path, it has the following characteristics: firstly, the length of the polishing path is short; secondly, the rotating angle of the polishing path is small; thirdly, the polishing path has small radial movement; fourthly, the sum of the radial lengths of all points on the polishing path is small; after the characteristics of the polishing path are clarified, an optimization search is carried out on the basis of the characteristics, and the optimal polishing path can be automatically found and certain areas which do not need to be machined can be avoided.
And S2: the method for planning the spiral polishing path based on the path evaluation function specifically comprises the following steps:
s2.1, searching adjacent points of the starting point, setting a parameter r by taking the starting point as the center of a circle, drawing a circle by taking r as the radius, calculating the distance between other points and the starting point, if the distance value from a certain point to the starting point is less than the radius r of the circle, locating the point in the circle, and selecting all the points in the circle as the adjacent points of the starting point;
s2.2: calculating a path evaluation function using f 1 =a 1 *s 1 +b 1 *rd 1 +c 1 *r 1 Calculating a path merit function for each neighboring point, wherein a 1 ,b 1 ,c 1 Is a factor of three, s 1 Is the distance between a certain adjacent point and the starting point, rd 1 Is a value of radial movement between a certain adjacent point and the starting point, r 1 Is the radial length of a certain adjacent point, f 1 A path evaluation function representing a certain neighboring point;
s2.3, selecting n adjacent points with the minimum value, calculating the path evaluation functions of all the adjacent points, sorting the path evaluation function values of the adjacent points from small to large, and selecting the points which are ranked at the top n in the sequence, namely the n adjacent points with the minimum value;
s2.4: selecting one of n adjacent points as a starting point, and searching the adjacent point according to the step S2.1, wherein the numerical value of the parameter r is consistent with the step S2.1;
s2.5: according to the step S2.2, calculating a path evaluation function of each adjacent point, wherein the calculation formula and the parameter value are consistent with the step S2.2;
s2.6: according to the step S2.3, n adjacent points with the minimum value are selected, after the path evaluation functions of all the adjacent points are calculated, the path evaluation function values of all the adjacent points are sorted from small to large, and the points which are arranged at the top n in the sequence, namely the n adjacent points with the minimum value, are selected;
s2.7: repeating steps S2.4 to S2.6 to obtain n × n dots;
s2.8: searching a father point of each point in n x n points, connecting the point to the father point, wherein the father point refers to a point expanded to the point and is connected to an ancestor point, the ancestor point refers to a point expanded to the father point, and after searching connection, connecting to a starting point finally to obtain n x n paths;
s2.9: using the formula f 2 =a 2 *s 2 +b 2 *rd 2 +c 2 *r 2 +d 2 * ag calculating a path evaluation function for the n x n paths, where a 2 ,b 2 ,c 2 ,d 2 Is a four coefficient, s 2 Is the total length of the path, rd 2 Is the sum of the radial movements of all points on the path, r 2 Is the sum of the radial lengths of all points, ag is the sum of the angular variations of the entire path;
s2.10: sorting the path evaluation function values of n paths by n according to the sequence from small to large, selecting the paths ranked at the top n in the sequence, namely selecting the n lines with the minimum values, and setting the tail points of the paths, namely the last points as calculation points;
s2.11: if the calculated path covers all the residence points, finishing the calculation; otherwise, step S2.4 to step S2.10 are repeated until all the resident points are covered.
And S3: according to the step S2, a series of paths with differences are obtained by using different coefficients, and the optimal polishing path is selected, wherein the specific contents are as follows:
step S2 is to calculate the polishing paths under the set of parameters for a set of parameters, obtain a series of paths with differences by using different coefficients, select a final polishing path, select a set of coefficients with the best optimization effect, and use the polishing paths obtained under the set of coefficients as the final polishing path, where the selected final polishing path satisfies the following constraints:
first, the polishing path should cover all the points desired to be machined, with no omissions or deletions;
secondly, the distribution of the polishing paths should be continuous, passing only once at each processing point, and not passing a certain processing point multiple times.
Carrying out a simulation test:
in order to verify the spiral polishing path planning method provided by the application, a simulation test is carried out, and the result is as follows:
fig. 4 is a schematic diagram illustrating an optimization result of a spiral polishing path of a circular element, and it can be seen from fig. 4 that the spiral polishing path planning method provided by the present application can smoothly find a spiral path and connect all residence points together;
fig. 5 is a schematic diagram of a path optimization result of a circular element with a fan-shaped unmachined area, fig. 6 is a schematic diagram of a path optimization result of a circular element with a circular unmachined area, fig. 5 and fig. 6 respectively show the performance of the spiral polishing path planning method of the present application when facing different machined areas, in fig. 5, a fan-shaped unmachined area is disposed on an element, and in fig. 6, a circular unmachined area is disposed on an element, and the result shows that the polishing path can avoid the unmachined area, and the optimized path is continuously realized and can be realized in the actual machining process;
it should be noted that, in the present application, the polishing path can avoid the non-processing region, and is not limited to the region with smaller error, any given region can be avoided, and the polishing path has adaptability, and it can be understood that the region with smaller error is a specific example of the region with non-processing, and the region with non-processing has generality and representativeness than the region with smaller error, and in the actual processing process, the region with smaller error can be set as the region with non-processing, and the specific process is as follows: the error value range of the region with smaller error is counted firstly, then the upper limit of the error value is set as an error threshold value, when setting the dwell point of the surface of the component, the point with the error value lower than the threshold value is removed from the dwell point, so that the dwell point is not included in the optimization, and the region with smaller error can be set as the non-processing region.
The invention has the following beneficial effects:
the application provides a spiral polishing route planning method, use fixed formula to produce the polishing route with prior art, can only generate the polishing route difference that the style is relatively fixed, prior art need set for in order to avoid the region that does not need processing through the manual work, work load is big and the process is loaded down with trivial details, can not adapt to the demand of processing, this problem can be solved in this application, this application has analyzed the characteristic of polishing route, based on path evaluation function, use the mode planning of optimizing search to look for optimum polishing route, link together all stay points, the realization is to the cover on optical element surface, this application can seek optimum polishing route automatically, can avoid some regions that do not need processing automatically, and the machining efficiency is improved.

Claims (4)

1. A method for planning a spiral polishing path based on an evaluation function is characterized by comprising the following steps:
s1: analyzing the characteristics of the polishing path according to the path evaluation function to find the polishing path;
s2: planning a spiral polishing path based on a path evaluation function;
s3: according to the step S2, a series of paths with differences are obtained by using different coefficients, and an optimal polishing path is selected;
the path evaluation function is a characteristic function describing characteristics of an optimal polishing path.
2. The method according to claim 1, wherein the step S1: analyzing the characteristics of the polishing path according to the path evaluation function to find the polishing path, which specifically comprises the following contents:
the path evaluation function contains several parameters describing the polishing path, including the total length of the path, the angle through which the path turns, the movement of the path in the radial direction, and the sum of the radial lengths of each point on the path;
analyzing the characteristics of the polishing path, it has the following characteristics: firstly, the length of the polishing path is short; secondly, the rotating angle of the polishing path is small; thirdly, the polishing path has small radial movement; fourthly, the sum of the radial lengths of all points on the polishing path is small;
and according to the characteristics of the polishing path, carrying out optimization search to find the optimal polishing path, connecting all residence points on the optical element, and covering the optical surface to avoid certain regions which do not need to be processed on the optical element.
3. The method according to claim 1, wherein the step of S2: the method for planning the spiral polishing path based on the path evaluation function specifically comprises the following steps:
s2.1, searching adjacent points of the initial point, setting a parameter r by taking the initial point as the center of a circle, drawing a circle by taking the r as the radius, calculating the distance between other points and the initial point, if the distance value from a certain point to the initial point is less than the radius r of the circle, locating the point in the circle, and selecting all the points in the circle as the adjacent points of the initial point;
s2.2: calculating a path evaluation function using f 1 =a 1 *s 1 +b 1 *rd 1 +c 1 *r 1 Calculating a path merit function for each neighboring point, wherein a 1 ,b 1 ,c 1 Is a factor of three, s 1 Is the distance between a certain adjacent point and the starting point, rd 1 Is a value of radial movement between a certain adjacent point and the starting point, r 1 Is the radial length of a certain adjacent point, f 1 A path evaluation function representing a certain neighboring point;
s2.3: selecting n adjacent points with the minimum numerical value, calculating the path evaluation functions of all the adjacent points, then sorting the path evaluation function numerical values of the adjacent points according to the minimum value, and selecting the points which are ranked at the top n in the sequence, namely the n adjacent points with the minimum numerical value;
s2.4: selecting one of n adjacent points as a starting point, and searching the adjacent point according to the step S2.1, wherein the numerical value of the parameter r is consistent with the step S2.1;
s2.5: according to the step S2.2, calculating a path evaluation function of each adjacent point, wherein the calculation formula and the parameter value are consistent with the step S2.2;
s2.6: according to the step S2.3, n adjacent points with the minimum value are selected, after the path evaluation functions of all the adjacent points are calculated, the path evaluation function values of all the adjacent points are sorted from small to large, and the points which are arranged at the top n in the sequence, namely the n adjacent points with the minimum value, are selected;
s2.7: repeating steps S2.4 to S2.6 to obtain n × n dots;
s2.8: searching a father point of each point in n x n points, connecting the point to the father point, wherein the father point refers to a point expanded to the point and is connected to an ancestor point, the ancestor point refers to a point expanded to the father point, and after searching connection, connecting to a starting point finally to obtain n x n paths;
s2.9: using the formula f 2 =a 2 *s 2 +b 2 *rd 2 +c 2 *r 2 +d 2 * ag calculating path evaluation function of the n x n paths, wherein a 2 ,b 2 ,c 2 ,d 2 Is a four coefficient, s 2 Is the total length of the path, rd 2 Is the sum of the radial movements of all points on the path, r 2 Is the sum of the radial lengths of all points, ag is the sum of the angular variations of the entire path;
s2.10: sorting the path evaluation function values of n paths by n according to the sequence from small to large, selecting the paths ranked at the top n in the sequence, namely selecting the n lines with the minimum values, and setting the tail points of the paths, namely the last points as calculation points;
s2.11: if the calculated path covers all the residence points, finishing the calculation; otherwise, step S2.4 to step S2.10 are repeated until all the resident points are covered.
4. The method according to claim 1, wherein the step of S3: according to the step S2, a series of paths with differences are obtained by using different coefficients, and the optimal polishing path is selected, wherein the specific contents are as follows:
step S2, aiming at a group of parameters, calculating polishing paths under the group of parameters, obtaining a series of paths with differences by using different coefficients, and selecting an optimal polishing path as a final polishing path;
the final polishing path is selected to satisfy the following constraints:
firstly, the polishing path covers all the points desired to be processed, and cannot be missed or missing;
secondly, the distribution of the polishing paths is continuous, and each processing point passes only once, so that the polishing paths cannot pass through a certain processing point for multiple times.
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