CN115296121A

CN115296121A - Laser heat radiator

Info

Publication number: CN115296121A
Application number: CN202211022014.4A
Authority: CN
Inventors: 郭俊生; 崔泰毓; 张凤杰
Original assignee: Guangzhou Asensing Technology Co Ltd
Current assignee: Guangzhou Asensing Technology Co Ltd
Priority date: 2022-08-24
Filing date: 2022-08-24
Publication date: 2022-11-04

Abstract

The application provides a laser heat abstractor relates to the technical field of on-vehicle electron. The heat abstractor of laser instrument includes: the laser device comprises a laser device shell and a laser device, wherein the laser device shell is provided with an accommodating cavity and an emission window; a laser component configured in the accommodating cavity to emit light through the emission window; a heat dissipation mechanism configured to receive at least a portion of the structure of the laser housing, and the at least a portion of the structure of the heat dissipation mechanism is configured within the receiving cavity to contact the portion of the structure with the laser assembly. The laser casing is provided with and holds chamber and transmission window, and the laser subassembly sets up in holding the intracavity, and the light of laser subassembly can see through the transmission window and launch, and heat dissipation mechanism connects in one side of laser casing, and is used for holding the structure of at least partly of laser casing to make the laser subassembly carry out the during operation, laser casing and heat dissipation mechanism homoenergetic dispel the heat to it, promote the detection distance of laser instrument by a wide margin, promote the number of dialling back.

Description

Laser heat radiator

Technical Field

The application relates to the technical field of vehicle-mounted electronics, in particular to a laser heat dissipation device.

Background

The automatic driving vehicle is an intelligent automobile which can realize unmanned driving through a computer system, along with popularization of automatic driving of the vehicle, when L2 transits to L3 and L4, the quantity of laser radars which need to be distributed is more and more, miniaturization is more urgent, installation at the positions of the lamps of the vehicle becomes a mainstream trend, and how to utilize the inherent forms of the lamps of the vehicle to realize heat dissipation of the laser radars becomes a key technology for development of transmitting power, repetition frequency efficiency and detection distance of the laser radars.

Disclosure of Invention

An object of this application is to provide a laser instrument heat abstractor, can satisfy the heat dissipation demand of laser instrument, promotes the detection distance of laser instrument by a wide margin, promotes the number of the callback.

In order to achieve the purpose, the following technical scheme is adopted in the application:

in a first aspect, the present application provides a heat dissipation device for a laser, comprising: the laser device comprises a laser device shell and a laser device, wherein the laser device shell is provided with an accommodating cavity and an emission window; a laser assembly disposed within the receiving cavity to emit light through the emission window; a heat dissipation mechanism configured to communicate with the laser housing, and at least a portion of the structure of the heat dissipation mechanism is configured within the receiving cavity such that the portion of the structure is in contact with the laser assembly.

At the in-process of above-mentioned realization, the laser casing is provided with and holds chamber and transmission window, the laser subassembly sets up in holding the intracavity, the light of laser subassembly can see through the transmission window and launch, heat dissipation mechanism connects in one side of laser casing, and is used for holding the structure of at least partly of laser casing, so that the laser subassembly carries out the during operation, laser casing and heat dissipation mechanism homoenergetic dispel the heat to it, promote the detection distance of laser instrument by a wide margin, promote the number of the dialling back.

In some embodiments, the heat dissipation mechanism includes a heat pipe and a heat dissipation module, the heat pipe is disposed in the accommodation chamber, and the laser assembly abuts against the heat pipe.

In the process of realizing, the heat pipe is arranged in the accommodating cavity, the laser component is arranged on the heat pipe, the heat dissipation module is arranged outside the laser shell, and when the laser component works, the heat pipe and the heat dissipation module can dissipate heat of the laser component, so that the heat dissipation problem of the laser component is solved.

In some embodiments, the heat pipe has an evaporation section and a condensation section, the evaporation section is disposed below the laser assembly, and the condensation section is disposed on a side close to the heat dissipation module.

In some embodiments, the heat sink module is connected to an outside of the laser housing.

In some embodiments, the heat dissipation module includes a heat dissipation housing and a heat dissipation member, the heat dissipation member is disposed on a side of the heat dissipation housing away from the laser housing, and the heat dissipation housing is communicated with the accommodation cavity.

At the in-process of above-mentioned realization, the heat dissipation piece sets up on the one side that laser instrument casing was kept away from to the heat dissipation casing for the heat that the heat dissipation piece produced the laser instrument subassembly distributes away at the in-process of work, solves laser instrument subassembly's heat dissipation demand.

In some embodiments, the heat dissipation member includes a first heat dissipation member disposed inside the heat dissipation housing, and the first heat dissipation member is distributed along a circumference of the heat dissipation housing.

In some embodiments, the heat dissipation member further includes a second heat dissipation member disposed on a side of the first heat dissipation member away from the laser assembly.

In the process of realizing, the first radiator is distributed along the periphery of the radiating shell, and the second radiator is arranged on the radiating shell, so that part of heat of the laser assembly is dissipated by the first radiator, and the other part of heat is dissipated by the second radiator, and the whole radiating effect of the device is improved.

In some embodiments, the laser assembly includes a control circuit board, a laser body and a heat-generating element, the laser body and the heat-generating element are both connected to the control circuit board, and the laser body is disposed on a side of the heat-generating element away from the heat-dissipating mechanism.

In the process of realizing the laser device, the laser device body and the heating element are connected to the control circuit board, the heating element is closer to the heat dissipation mechanism relative to the laser device body, the influence of heat generated by the heating element on the laser device body can be reduced, and meanwhile, the heat dissipation mechanism is favorable for dissipating heat of the heat.

In some embodiments, the position where the heating element is connected to the control circuit board is located at one third of the heat pipe, so that a better heat dissipation effect can be achieved.

In some embodiments, the heating element includes a first heating element and a second heating element, the power of the first heating element is greater than the power of the second heating element, and the first heating element is located between the second heating element and the laser body, so that the control circuit board can be reasonably utilized, and the maximization of the heat dissipation effect is facilitated.

In some embodiments, the outer edge of the heat dissipation mechanism is arranged in a step shape, the end with the smallest dimension of the heat dissipation mechanism is connected with the laser housing, and the dimension of the end with the smallest dimension of the heat dissipation mechanism is not smaller than the dimension of the outer edge of the laser housing.

In some embodiments, the emission window is configured at the top of the laser housing.

In some embodiments, the emission window is disposed on a side of the laser housing away from the heat dissipation mechanism.

In some embodiments, the bottom of the laser housing is configured with heat dissipation fins, at least a portion of which is configured to correspond to the heat pipe and to dissipate heat from the heat pipe, thereby indirectly dissipating heat from the laser assembly.

Additional features and advantages of the present application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the present application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for a user of ordinary skill in the art, other related drawings can be obtained according to the drawings without inventive effort.

Fig. 1 is a sectional view of a heat dissipation device for a laser according to an embodiment of the present disclosure.

Fig. 2 is a schematic overall structural diagram of a heat dissipation apparatus for a laser device according to an embodiment of the present disclosure.

Reference numerals

100. A laser housing; 101. a transmission window; 200. a laser assembly; 300. a heat dissipation mechanism; 301. a heat dissipation module; 3011. a heat dissipating housing; 3012. a first heat radiation body; 3013. a second heat radiation body; 302. a heat pipe; 400. and (4) radiating fins.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a user of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of the present application.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the present invention is conventionally placed in use, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it should also be noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, detachable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case to a user of ordinary skill in the art.

An autonomous vehicle, also known as an unmanned vehicle or a computer-driven vehicle, is a vehicle that can automatically travel with little or no human operation according to environmental sensing results. In recent years, as research on decision making, command transmission, mechanism operation, and the like of vehicles has been invested, techniques for automatically driving vehicles have been dramatically developed.

The driving of the automatic vehicle depends on the navigation device, and the navigation device needs to make a correct judgment under a precise positioning no matter the planning of the driving path or the real-time road condition, so as to obtain an accurate navigation result.

Among them, one of the mainstream applications of the automated driving vehicle is to perform high-grade (grade 4 or more) automated driving in a limited area. In such applications, the autonomous vehicle usually travels along a general vehicular road in a limited area, and the road surface condition and road environment of the vehicular road are simple, so that most of the navigation devices available on the market can provide a usable navigation result.

Example 1

The automatic driving technology is divided into a plurality of grades, and according to the standard of SAE (society of automotive Engineers), the automatic driving automobile is divided into 6 grades according to the intelligent and automatic degree: no automation (L0), driving assistance (L1), partial automation (L2), conditional automation (L3), high automation (L4) and full automation (L5). Where SAE (society of automotive engineers) defines L2 level autopilot as: the driving support can be provided for a plurality of operations in the steering wheel and acceleration/deceleration by the driving environment, and other driving actions are operated by the human driver. The automatic driving level is an automatic driving level which can electrically control a steering wheel and an accelerator brake pedal of a vehicle and requires the driver to monitor road conditions and intervene in control at any time. The following can be realized: some automatic driving functions of adaptive cruise, lane keeping, automatic brake assist, automatic parking, etc., require that various sensors be mounted on the automobile, such as: the system comprises a camera, a millimeter wave radar, a laser radar, a GPS and a wheel speed sensor, and an automatic driving controller which is used for collecting sensor information, making a driving decision after operation fusion and controlling an automobile is required to be carried.

At present, two emission technologies exist for a vehicle-mounted Laser radar, one is an Edge Emitting Laser (EEL) and the other is a Vertical Cavity Surface Emitting Laser (VCSEL). Generally, the photoelectric conversion efficiency of the laser is only about 30%, and the rest energy of about 70% is completely converted into heat. Therefore, the heat dissipation of the laser is solved, the detection distance of the radar can be greatly increased, and the number of echo points can be increased.

In view of the above, as shown in fig. 1, in a first aspect, the present application provides a laser heat sink applied in a technology of automatic driving of a vehicle, the laser heat sink comprising: the laser module 200 is arranged inside the laser module 100, the laser module 200 can transmit light through the laser module 100, and the heat dissipation mechanism 300 is connected to the laser module 100, so that when the heat dissipation mechanism 300 works, heat generated by the laser module 200 can be dissipated, thereby improving the performance of the laser module 200.

Specifically, the laser housing 100 has an accommodating cavity and an emission window 101; the laser assembly 200 configured in the accommodating cavity to emit light through the emission window 101; the heat dissipation mechanism 300 is configured to communicate with the laser housing 100, and at least a portion of the structure of the heat dissipation mechanism 300 is configured in the accommodating cavity so that the portion of the structure contacts the laser assembly 200.

Illustratively, the outer edge of the heat dissipation mechanism is arranged in a step shape, the end with the smallest size of the heat dissipation mechanism is connected with the laser shell, and the size of the end with the smallest size of the heat dissipation mechanism is not smaller than the size of the outer edge of the laser shell; the material of the laser housing 100 includes, but is not limited to, a metal material, which can be used to dissipate heat of the laser assembly 200, the emission window 101 is disposed on one side of the laser housing 100, the position and shape of the emission window 101 are not particularly limited, and the emission window may be disposed on the top of the laser housing 100, or disposed on one side (for example, the left side) of the laser housing 100, and the like, which may be set according to actual situations.

As shown in fig. 2, the laser housing 100 may be disposed to be distributed along a left-right direction, the laser assembly 200 is disposed in the accommodating cavity along the left-right direction, and the length of the laser housing 100 and the length of the laser assembly 200 may be set according to an actual application condition, which is not repeated herein.

It is understood that the heat dissipation mechanism 300 may be configured to accommodate at least a portion of the laser housing 100, or may be directly connected to one end of the laser housing 100, and the heat dissipation mechanism 300 has a plurality of heat dissipation forms, where the heat dissipation form of the portion of the heat dissipation mechanism 300 located in the accommodating cavity is different from the heat dissipation form of the portion of the heat dissipation mechanism located outside the accommodating cavity, and the heat dissipation of the laser assembly 200 is completed through a combination of the plurality of heat dissipation forms.

In-process that above-mentioned was realized, laser instrument casing 100 is provided with and holds chamber and transmission window 101, laser instrument subassembly 200 sets up in holding the intracavity, the light of laser instrument subassembly 200 can see through transmission window 101 and launch, heat dissipation mechanism 300 is connected in one side of laser instrument casing 100, and be used for holding the structure of at least part of laser instrument casing 100, so that laser instrument subassembly 200 carries out the during operation, laser instrument casing 100 and heat dissipation mechanism 300 homoenergetic dispel the heat to it, promote the detection distance of laser instrument by a wide margin, promote the number of the setback points.

Referring to fig. 1 again, the heat dissipation mechanism 300 includes a heat pipe 302 and a heat dissipation module 301, the heat pipe 302 is disposed in the accommodating cavity, the laser device 200 abuts against the heat pipe 302, and the heat dissipation module 301 is connected to the outer side of the laser device housing 100.

Illustratively, the heat pipe 302 is a heat transfer element with extremely high heat conductivity, which transfers heat through evaporation and condensation of liquid in a totally-enclosed vacuum pipe, and it utilizes the fluid principle such as capillary action to achieve the effect similar to refrigeration of a refrigerator compressor, and has a series of advantages such as high heat conductivity, excellent isothermal property, heat flow density variability, heat flow direction reversibility, remote heat transfer, constant temperature property (controllable heat pipe 302), thermal diode and thermal switch performance, and the heat exchanger composed of the heat pipe 302 has the advantages of high heat transfer efficiency, compact structure, small fluid resistance loss, and the like. The typical heat pipe 302 is composed of a pipe shell, a wick and an end cover, wherein the pipe is pumped to negative pressure and then filled with a proper amount of working liquid, so that the wick capillary porous material tightly attached to the inner wall of the pipe is filled with liquid and then sealed; one end of the heat pipe 302 is an evaporation section (heating section), the other end is a condensation section (cooling section), the evaporation section is arranged below the laser component, the condensation section is arranged at one side close to the heat dissipation module, a heat insulation section can be arranged between the two sections according to application requirements, when one end of the heat pipe 302 is heated, liquid in the capillary core is evaporated and vaporized, steam flows to the other end under small pressure difference to emit heat to be condensed into liquid, the liquid flows back to the evaporation section along the porous material under the action of capillary force, and the heat is transferred from one end of the heat pipe 302 to the other end after circulation, so that the heat transfer process is realized.

It is understood that the heat pipe 302 may be made of materials including, but not limited to, metal,

for example, a copper material, and the connection manner of the heat pipe 302 and the laser housing 100 may be welding, or may be connection through a thermal interface material, where the thermal interface material includes, but is not limited to, a thermal conductive gel, a thermal conductive silica gel, a thermal conductive pad, a double-sided adhesive tape, and the like.

In the process of the implementation, the heat pipe 302 is disposed in the accommodating cavity, the laser assembly 200 is disposed on the heat pipe 302, and the heat dissipation module 301 is disposed outside the laser housing 100, so that when the laser assembly 200 works, the heat pipe 302 and the heat dissipation module 301 can dissipate heat of the laser assembly 200, thereby solving the heat dissipation problem of the laser assembly 200.

Referring to fig. 1 again, the heat dissipation module 301 includes a heat dissipation casing 3011 and a heat dissipation member, and the heat dissipation member is disposed on a side of the heat dissipation casing 3011 away from the laser housing 100. Illustratively, the heat dissipation housing 3011 is disposed on the other side (for example, the right side) of the laser housing 100, heat dissipation fins are disposed on the outer edge of the heat dissipation housing 3011, the heat dissipation housing 3011 is fixedly connected to the laser housing 100 through fixing members (including but not limited to screws), the material of the heat dissipation housing 3011 includes but not limited to metal materials, such as stainless steel, cast aluminum, ordinary aluminum, or copper, etc., the thermal conductivity of stainless steel is about 20W/MK, the thermal conductivity of cast aluminum is about 90W/MK, the thermal conductivity of ordinary aluminum is about 180W/MK, and the thermal conductivity of copper is about 380W/MK, which may be set according to the actual situation of the laser assembly 200, which is not described herein repeatedly.

In the process of the above implementation, the heat dissipation member is disposed on one side of the heat dissipation casing 3011 away from the laser casing 100, so that the heat generated by the laser module 200 is dissipated in the working process of the heat dissipation member, thereby meeting the heat dissipation requirement of the laser module 200.

In some embodiments, the heat dissipation member includes a first heat dissipation member 3012 and a second heat dissipation member 3013, the first heat dissipation member 3012 is disposed inside the heat dissipation housing 3011, the first heat dissipation member 3012 is distributed along a periphery of the heat dissipation housing 3011, and the second heat dissipation member 3013 is disposed on a side of the first heat dissipation member 3012 away from the laser assembly 200.

For example, the first heat dissipation bodies 3012 include, but are not limited to, fins, where the fins are provided with a plurality of fins, and the fins are distributed in a distributed manner, where the number and the distribution density of the first heat dissipation bodies 3012 may be set according to the actual situation of the laser assembly 200; the second heat sink 3013 includes but is not limited to a heat dissipation fan, the second heat sink 3013 is fixedly connected to the heat dissipation housing 3011 through a connector (e.g., a bolt), and the size, air volume, air pressure, and the like of the second heat sink 3013 may also be set according to the actual situation of the laser component; it should be noted that, in order to achieve a more balanced heat dissipation effect, the distribution center of the first heat sink 3012 and the center of the second heat sink 3013 are both coaxially disposed with the center of the laser housing 100 (that is, in the left-right direction, the first heat sink 3012, the second heat sink 3013, and the laser housing 100 are coaxially disposed).

In the process of realizing the above, the first heat radiator 3012 is distributed along the periphery of the heat radiation shell 3011, and the second heat radiator 3013 is arranged on the heat radiation shell 3011, so that heat of one part of the laser component 200 is radiated by the first heat radiator 3012, heat of the other part is radiated by the second heat radiator 3013, and the overall heat radiation effect of the laser component is improved.

Referring to fig. 1 again, the laser assembly 200 includes a control circuit board, a laser body and a heating element, the laser body and the heating element are both connected to the control circuit board, and the laser body is disposed on a side of the heating element away from the heat dissipation mechanism 300.

Illustratively, the control Circuit Board includes, but is not limited to, a Printed Circuit Board (PCB-Printed Circuit Board), the material of the control Circuit Board may be FR4 (glass fiber epoxy resin copper clad laminate) base material, an aluminum substrate, a copper substrate, a ceramic substrate, etc., from the heat dissipation perspective, the thermal conductivity of the FR4 substrate is about 0.3W/MK, the thermal conductivity of the aluminum substrate and the copper substrate is about 2-3W/MK, the thermal conductivity of the ceramic substrate is about 100-150W/MK, and the laser body may select substrates of different materials according to the heating power and the cost.

In the process of realizing the heat dissipation structure, the laser body and the heating element are connected to the control circuit board, the heating element is closer to the heat dissipation mechanism 300 relative to the laser body, the influence of heat generated by the heating element on the laser body can be reduced, and the heat dissipation mechanism 300 is favorable for dissipating heat of the heat dissipation mechanism 300.

In some embodiments, the position where the heating element is connected to the control circuit board is located in one third of the heat pipe 302, so as to achieve a better heat dissipation effect.

Referring to fig. 1 again, the emission window 101 is disposed at the top of the laser housing 100; illustratively, the material of the emission window 101 includes, but is not limited to, a glass material, the Surface of which may be designed to be defogged, plated with a heating film, etc., and when the emission window 101 is disposed on the top of the Laser housing 100, the Laser body includes, but is not limited to, a Vertical Cavity Surface Emitting Laser (VCSEL).

In some embodiments, the bottom of the laser housing 100 is configured with heat dissipation fins 400, and at least a portion of the heat dissipation fins 400 is configured to correspond to the heat pipe 302 and form a heat sink for the heat pipe 302, thereby indirectly dissipating heat from the laser assembly 200. For example, the heat dissipation fins 400 may be welded to the laser housing 100, and a plurality of the heat dissipation fins 400 are provided, and a length of the plurality of the heat dissipation fins 400 may be set according to an actual length of the heat pipe 302.

Example 2

Unlike the first embodiment, the emission window 101 is disposed on a side of the laser housing 100 away from the heat dissipation mechanism 300. Illustratively, the emission window 101 is made of a material including, but not limited to, glass, and the surface of the emission window may be designed to be defogged, plated with a heating film, and when the emission window 101 is disposed on the left side of the Laser housing 100, the Laser body includes, but not limited to, an Edge Emitting Laser (EEL).

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat sink for a laser, comprising:

the laser device comprises a laser device shell and a laser device, wherein the laser device shell is provided with an accommodating cavity and an emission window;

a laser assembly configured within the receiving cavity to emit light through the emission window;

a heat dissipation mechanism configured to communicate with the laser housing, and at least a portion of a structure of the heat dissipation mechanism is configured within the receiving cavity such that the portion of the structure is in contact with the laser assembly.

2. The heat dissipation apparatus of claim 1, wherein the heat dissipation mechanism comprises a heat pipe and a heat dissipation module, the heat pipe is disposed in the accommodating cavity, and the laser assembly abuts against the heat pipe.

3. The heat dissipation device of claim 2, wherein the heat pipe has an evaporation section and a condensation section, the evaporation section is disposed below the laser assembly, and the condensation section is disposed on a side close to the heat dissipation module.

4. The laser heat sink of claim 2, wherein the heat sink module is attached to an outside of the laser housing.

5. The heat dissipation device for laser device according to claim 2, wherein the heat dissipation module includes a heat dissipation housing and a heat dissipation member, the heat dissipation member is disposed on a side of the heat dissipation housing away from the laser housing, and the heat dissipation housing is communicated with the accommodating cavity.

6. The heat dissipation device for laser of claim 5, wherein the heat dissipation member comprises a first heat dissipation member disposed inside the heat dissipation housing, and the first heat dissipation member is distributed along a circumference of the heat dissipation housing.

7. The heat sink of claim 6, wherein the heat sink further comprises a second heat sink, and the second heat sink is disposed on a side of the first heat sink away from the laser assembly.

8. The heat dissipation device of claim 2, wherein the laser assembly comprises a control circuit board, a laser body and a heat generating element, the laser body and the heat generating element are connected to the control circuit board, and the laser body is disposed on a side of the heat generating element away from the heat dissipation mechanism.

9. The laser heat sink of claim 8, wherein the location where the heating element is connected to the control circuit board is located one third of the heat pipe.

10. The heat sink according to claim 8, wherein the heat generating element comprises a first heat generating element and a second heat generating element, the power of the first heat generating element is greater than the power of the second heat generating element, and the first heat generating element is located between the second heat generating element and the laser body.

11. The heat sink device according to claim 1, wherein the outer edge of the heat sink mechanism is arranged in a step shape, the end of the heat sink mechanism with the smallest dimension is connected to the laser housing, and the dimension of the end of the heat sink mechanism with the smallest dimension is not smaller than the dimension of the outer edge of the laser housing.

12. The laser heat sink as recited in claim 1 wherein the emission window is disposed at a top of the laser housing.

13. The heat sink as claimed in claim 1, wherein the emission window is disposed on a side of the laser housing away from the heat sink.

14. The heat sink for laser device as claimed in claim 2, wherein the bottom of the laser housing is configured with heat dissipation fins, at least a portion of the heat dissipation fins corresponding in structure to the heat pipe.