CN115287495A - Copper alloy strip for semi-etched lead frame and preparation method thereof - Google Patents
Copper alloy strip for semi-etched lead frame and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Abstract
The invention discloses a copper alloy strip for a semi-etched lead frame, which is characterized in that: the copper alloy comprises the following components in percentage by mass: 2.0 to 3.5%, P:0.03 to 0.05 percent, zn:0.05 to 0.3%, sn:0.01 to 0.05%, nb:0.1 to 0.5 percent, and the balance of copper and inevitable trace impurities. By controlling the addition amounts of Fe, P, zn, sn and Nb, the grain refinement is obvious, the structure is uniform, the directions are the same, the tensile strength is more than 550MPa, and the electric conductivity is more than 60IACS percent. The area proportion of a recrystallized structure in a microstructure of the copper alloy strip is controlled to be more than 90% and the area proportion of a dislocation structure is controlled to be less than 10% by controlling intermediate rolling, finished product rolling and stress relief annealing, so that the plate shape of the copper alloy strip is not more than 3I, and the warp degree of a semi-etched lead frame is not more than 0.10mm.
Description
Technical Field
The invention belongs to the technical field of copper alloy, and particularly relates to a copper alloy strip for a lead frame and a preparation method thereof.
Background
The semiconductor lead frame industry develops towards miniaturization and high density, a copper-based lead frame used by an integrated circuit develops towards the direction of lead spacing micronization and multi-pin, the processing mode of the copper-based lead frame is divided into two modes of stamping and etching, but the hard alloy stamping die cannot meet the requirement of lead frame micro-spacing, and the etching processing technology can realize the production of the lead frame with the highest density and the maximum pin number, so that the lead frame is processed by etching forming and has wide application prospect.
The copper strip for lead frame etching puts higher requirements on the plate shape and residual stress of the product, and the semi-etching material product has higher requirements on the residual stress of the copper alloy strip. The half etching refers to a product with a first-level surface with a corrosion recess on the surface, a surface lower than the first-level surface with a depth and a depth, and different material thicknesses, and different requirements on the surface lower than the first-level surface can be met, and the half etching is called as half etching in a unified way. Because half etching is the local corrosion of surface layer, the shape is also complicated simultaneously, and the product etching process relative to full etching leads to the roughness to be poor because of copper strips residual stress release or the board type is bad because of the etching process more easily. Therefore, the requirements for the shape and residual stress of the copper strip are higher in order to ensure the flatness of the product after half etching.
At present, the strength of the iron bronze strip for lead frame full etching (C19210/C19400) is 480-540MPa, the electric conductivity is more than 60% IACS, the shape degree of the product is less than or equal to 10I, and the warping degree is 0.15-0.30mm (residual stress), and at present, the customer demands for half-etching iron bronze: the strength is more than 550MPa, the conductivity is more than 60 percent, the plate shape of the product is less than or equal to 3I, and the warping degree is less than 0.1mm.
The existing domestic iron bronze for half etching cannot meet the new requirements of products brought forward by customer requirements in the aspects of tensile strength, plate shape and residual stress, so that the plate shape and the residual stress of the existing copper strip alloy strip for the half etching lead frame need to be further improved.
Disclosure of Invention
The first technical problem to be solved by the invention is to provide a copper alloy strip for a half-etched lead frame, which has the advantages of strength, electric conductivity, favorable plate shape and low residual stress.
The technical scheme adopted by the invention for solving the first technical problem is as follows: the utility model provides a copper alloy strip for half etching lead frame which characterized in that: the copper alloy comprises the following components in percentage by mass: 2.0 to 3.5%, P:0.03 to 0.05 percent, zn:0.05 to 0.3%, sn:0.01 to 0.05%, nb:0.1 to 0.5 percent, and the balance of copper and inevitable trace impurities.
Sn can be dissolved in a copper matrix in a solid solution manner, plays a role in improving the strength of the alloy by solid solution strengthening, and simultaneously improves the high-temperature softening resistance of the iron bronze, but when the content is too high, the conductivity of the alloy is influenced, so that the content is controlled to be 0.01-0.05%.
Nb can play a role in fine grain strengthening and dispersion strengthening in the copper alloy, improve the strength and the high-temperature softening resistance of the alloy, and simultaneously can effectively prevent the crystal grains of the alloy structure from growing in the heat treatment process. Nb enables the alloy to effectively improve and control the microstructure of the copper alloy strip in the stress relief annealing process. That is, nb prevents the recrystallization texture from further growing when the alloy processing dislocation texture is transformed to the recrystallization texture in the stress relief annealing process, thereby achieving the effect of avoiding the reduction of the alloy performance by the stress relief annealing. When the content of Nb is 0.1-0.5%, the strength and high-temperature softening resistance of the iron bronze are obviously improved, and when the content of Nb exceeds 0.5%, the electric conductivity of the alloy is greatly influenced.
Preferably, the area ratio of the recrystallized structure in the microstructure of the copper alloy strip is 90% or more, and the area ratio of the dislocation structure is 10% or less. When the recrystallized structure area ratio in the microstructure is large, the deformation residual stress of cold working is kept lower. Therefore, on the premise that the alloy meets the performance requirement, the cold machining internal stress of the copper strip is controlled by controlling the area proportion of the recrystallization structure. When the area ratio of the recrystallized structure reaches more than 90 percent, the warping degree of the lead frame after half etching is less than or equal to 0.10mm.
The second technical problem to be solved by the invention is to provide a preparation method of the copper alloy strip for the semi-etched lead frame.
The technical scheme adopted by the invention for solving the second technical problem is as follows: a preparation method of a copper alloy strip for a half-etched lead frame is characterized by comprising the following steps: the process flow comprises the following steps: smelting → semicontinuous casting → hot rolling → rough rolling → softening annealing → intermediate rolling → high temperature solid solution → finish rolling → aging treatment → finished product rolling → stretch bending and straightening → stress relief annealing; the processing rate of the intermediate rolling is 42-50%, the processing rate of the finished product rolling is 45-55%, the stress relief annealing equipment is a tension straightening air cushion annealing furnace, the annealing temperature is 470-520 ℃, the annealing speed is 70-90 m/min, and the straightening tension of the copper strip is controlled at 200-300N/mm 2 。
The processing rate of finished product rolling is 45-55%, if the processing rate is low, the strength of the finished product after stress relief annealing can not reach the requirement of more than 550MPa, and when the processing rate reaches more than 55%, the plate shape can not meet the requirement that the plate shape is less than or equal to 3I due to large processing rate of the finished product.
The stress-relief annealing equipment is a tension straightening air cushion annealing furnace, the annealing temperature is 470-520 ℃, the annealing speed is 70-90 m/min, and the copper strip straightening unit tension in the air cushion furnace is controlled at 200-300N/mm 2 . The annealing temperature, the annealing speed and the tension are carried out through coordination, so that the internal processing stress in the annealed copper strip is released, and the plate shape is further improved. If the annealing temperature is lower or the annealing speed is higher, dislocation formed by cold working of the copper strip cannot be fully recovered to be recrystallized, the recrystallized structure area ratio cannot reach more than 90 percent, and the residual internal stress of the copper strip cannot meet the requirement. When the temperature of the stress relief annealing is higher or the speed is lower, the grain structure grows up after the recrystallization of the copper strip cold-processed structure is finished, the alloy strength can be greatly reduced, and the requirement of more than 550MPa cannot be met.
Stress relief annealing is carried out to increase tension control, the internal stress of cold machining can be further released in the annealing process, the plate shape can be further improved, the requirement that the plate shape degree is less than or equal to 3I is ensured, and the unit tension at the moment needs to reach the tensile strength value of the material of 30 percentAbove, namely the unit tension is more than 200N/mm 2 However, if the tension is too large, the alloy strip will generate local new internal stress at the tension during the stress relief annealing, and the internal stress of the cold working of the alloy cannot be reduced to the required range.
Preferably, the semi-continuous casting comprises: controlling the temperature of the copper liquid at 1220-1240 ℃, controlling the water pressure at 100-150 Kpa, controlling the water inlet temperature of the cooling water at 18-26 ℃, controlling the water outlet temperature at 40-50 ℃ and controlling the flow at 15-18m 3 The casting speed is 40-50 mm/min, the frequency of the vibrator is 50-70 times/min, and the amplitude is 3-6 mm.
Preferably, the hot rolling is carried out at the ingot heating temperature of 940-970 ℃ and the heat preservation time of 2-3 h, the hot rolling starting temperature of 920-950 ℃, the finishing temperature of 360-420 ℃ and the hot rolling processing rate of 92-96%;
preferably, the softening annealing is to heat the copper strip to 250-290 ℃ and keep the temperature for 1-2 h, then heat the copper strip to 540-580 ℃ and keep the temperature for 6-9 h, and the annealing process adopts reducing gas for protection.
Preferably, the high-temperature solid solution adopts an air cushion annealing furnace, the solid solution temperature is 960-1000 ℃, the speed is 10-20 m/min, and the protection of reducing gas is adopted in the solid solution process.
Preferably, the copper strip is heated to 250-290 ℃ and is kept warm for 1-2 h, then the temperature is raised to 460-500 ℃ and is kept warm for 7-10 h, and finally the copper strip is cooled to below 65 ℃ and taken out of the furnace.
Compared with the prior art, the invention has the advantages that:
1) By controlling the addition amounts of Fe, P, zn, sn and Nb, the refined crystal grains are obvious, the structure is uniform, the directions are the same, meanwhile, the tensile strength is more than 550MPa, and the electric conductivity is more than 60IACS percent.
2) The area ratio of a recrystallized structure in a microstructure of the copper alloy strip is controlled to be more than 90% by controlling intermediate rolling, finished product rolling and stress relief annealing, the area ratio of a dislocation structure is controlled to be less than 10%, finally, the shape of the copper alloy strip is less than or equal to 3I, and the warp of the lead frame after half etching is less than or equal to 0.10mm.
Drawings
FIG. 1 is a photograph of the microstructure of example 4 of the present invention before stress relief annealing.
FIG. 2 is a photograph of the microstructure after stress relief annealing in example 4 of the present invention.
Detailed Description
The invention is described in further detail below with reference to the following examples of the drawings.
The invention provides 4 examples and 1 comparative example, the specific components are shown in table 1, the examples are prepared according to the preparation method of the copper alloy strip for the half-etched lead frame, taking example 1 as an example, the specific preparation method is as follows:
1) Smelting: weighing the components according to the component proportion of the copper alloy strip, adding Cu, zn, nb and Sn into a smelting furnace, heating to melt, and adding covering agent glass for covering after the copper liquid is melted. Then the temperature is raised to 1300 ℃ to 1350 ℃, and pure iron sheets are slowly added according to the alloy proportion. After the pure iron sheet is completely melted in the copper liquid, the temperature of the copper liquid is raised to 1350 ℃ to 1400 ℃, and the temperature is preserved for 20 minutes to 30 minutes. Then reducing the temperature to 1250-1300 ℃, adding phosphorus-copper alloy according to the proportion of components, keeping the temperature for 10-15 minutes, controlling the temperature at 1200-1270 ℃ for slag dragging, adding covering agent cryolite and carbonic acid (weight ratio is 1).
2) Semi-continuous casting: controlling the temperature of the copper liquid at 1220-1240 ℃, then opening cooling water, controlling the water pressure at 100-150 Kpa, rotating the stopper rod, starting a traction machine when the height of the copper liquid in the crystallizer reaches about two thirds of the height of the crystallizer, starting the casting work at 40-50 mm/min, starting vibration, adding a small amount of powdery covering agent cryolite, anhydrous borax and sodium carbonate (the weight ratio of the covering agent cryolite, anhydrous borax and sodium carbonate is 1. The ingot is cast by red ingotThe technology is that the crystallizer cooling only adopts primary cooling water cooling and does not adopt secondary cooling water. The temperature of the primary cooling water is controlled to be 18-26 ℃, the temperature of the water outlet is controlled to be 40-50 ℃, and the flow is 15-18m 3 And h, directly contacting water on the surface of the cast ingot before the cast ingot is cooled to be below 95 ℃, and preventing the cast ingot from cracking during hot rolling. The size of the ingot is 620mm +/-5 mm in width and 230 +/-3 mm in thickness.
3) Hot rolling: the heating temperature of the cast ingot is 950 ℃, the heat preservation time is 2.8h, the hot rolling starting temperature is 930 ℃, the finishing temperature is controlled at 400 ℃, the thickness after hot rolling is 13mm, and the bandwidth is 655 +/-5 mm.
4) Milling a surface: the milling amount of the single surface is 0.6-0.8 mm, and the thickness after milling is 11.5mm.
5) Rough rolling: rough rolling to 1.5mm.
6) Trimming: the unilateral shearing is 7-8 mm, and the bandwidth after shearing is 640 +/-0.5 mm.
7) Softening and annealing: firstly heating to 280 ℃ and preserving heat for 1.1 hours, then heating to 560 ℃ and preserving heat for 8 hours, and adopting full H for an annealing furnace 2 And (5) gas reduction protection.
8) And (5) cleaning.
9) Intermediate rolling: and (5) medium rolling to 0.8mm.
10 High-temperature solid solution: adopting an air cushion annealing furnace, the solid solution temperature is 990 ℃, the speed is 18m/min, and the protective gas is H 2 And N 2 The mixed gas of (1).
11 Finish rolling: and (5) finish rolling to 0.5mm.
12 Aging treatment: the aging treatment comprises the steps of heating the copper strip to 280 ℃ and preserving heat for 1.2h, then heating to 480 ℃, preserving heat for 9h, and finally cooling to below 65 ℃ and discharging.
13 ) rolling the finished product.
14 ) stretch bending straightening.
15 Stress relief annealing, the stress relief annealing equipment is a tension straightening air cushion annealing furnace.
16 Cleaning.
17 ) splitting and packaging the finished product.
The preparation processes of examples 2 to 4 are the same as those of example 1, except that specific parameters are adjusted within the scope of the preparation method of the present invention, and are not repeated herein, and the control of the key process parameters of the examples is shown in table 2.
Comparative example 1 differs from the examples in that: no Nb element is added to the composition.
Comparative example 2 differs from the examples in that: the processing rate of finished product rolling is 30%.
Comparative example 3 differs from the examples in that: the stress relief annealing equipment is a tension straightening air cushion annealing furnace, the annealing temperature is 490 ℃, the annealing speed is 80m/min, and tension control is not performed.
Comparative example 4 differs from the examples in that: the stress relief annealing equipment is a tension straightening air cushion annealing furnace, the annealing temperature is 390 ℃, the annealing speed is 80m/min, and the straightening tension of the copper strip is controlled at 250N/mm 2 。
The following tests were carried out on the obtained examples and comparative examples, and the specific test results are shown in Table 3.
The area contents of the recrystallized and dislocation structures were tested by transmission electron microscopy.
Tensile test at room temperature according to GB/T228.1-2010 metallic Material tensile test part 1: room temperature test method was performed on an electronic universal mechanical property tester using a tape head specimen having a width of 12.5mm and a drawing speed of 5mm/min.
Conductivity test according to GB/T3048.2-2007 electric wire and cable electric performance test method part 2: resistivity test of metal material, the tester is ZFD microcomputer bridge DC resistance tester, sample width is 20mm, length is 500mm.
The plate type detection adopts an online plate type automatic detection device.
Warpage was measured after half-etching for the obtained examples and comparative examples: a strip sample of 250mm in length and 70mm in width was sampled and subjected to half-etching to measure warpage.
Before the stress relief annealing, as shown in fig. 1, a gray area is a dislocation cluster structure, a white area is a recrystallization structure, the area of the dislocation cluster structure accounts for 91.2%, and the residual stress in the plate is large. After the stress relief annealing, as shown in fig. 2, the white region is a dislocation cluster structure, the black region is a recrystallization structure, the area of the dislocation cluster structure is 8.1%, and the residual stress in the plate is greatly reduced.
TABLE 1 chemical compositions of inventive and comparative examples
TABLE 2 Key Process parameter control for inventive and comparative examples
TABLE 3 organization and Performance of inventive examples, comparative examples
Claims (9)
1. The utility model provides a copper alloy strip for half etching lead frame which characterized in that: the copper alloy comprises the following components in percentage by mass: 2.0 to 3.5%, P:0.03 to 0.05%, zn:0.05 to 0.3%, sn:0.01 to 0.05%, nb:0.1 to 0.5 percent, and the balance of copper and inevitable trace impurities.
2. The copper alloy strip for half-etched lead frames according to claim 1, wherein: the area ratio of a recrystallized structure in the microstructure of the copper alloy strip is 90% or more, and the area ratio of a dislocation structure is 10% or less.
3. The copper alloy strip for a half-etched lead frame according to any one of claims 1 to 2, wherein: the plate shape of the copper alloy strip is less than or equal to 3I, and the warping degree of the lead frame after half etching is less than or equal to 0.10mm.
4. A method for producing the copper alloy strip for a half-etched lead frame according to any one of claims 1 to 2, characterized in that: process streamThe process comprises the following steps: smelting → semicontinuous casting → hot rolling → rough rolling → softening annealing → intermediate rolling → high temperature solid solution → finish rolling → aging treatment → finished product rolling → stretch bending and straightening → stress relief annealing; the processing rate of the intermediate rolling is 42-50%, the processing rate of the finished product rolling is 45-55%, the stress-relief annealing equipment is a tension straightening air cushion annealing furnace, the annealing temperature is 470-520 ℃, the annealing speed is 70-90 m/min, and the straightening tension of the copper strip is controlled at 200-300N/mm 2 。
5. The method for manufacturing a copper alloy strip for a half-etched lead frame according to claim 4, wherein: the semi-continuous casting comprises the following steps: controlling the temperature of the copper liquid at 1220-1240 ℃, controlling the water pressure at 100-150 Kpa, controlling the inlet water temperature of the cooling water at 18-26 ℃, controlling the outlet water temperature at 40-50 ℃ and controlling the flow at 15-18m 3 The casting speed is 40-50 mm/min, the frequency of the vibrator is 50-70 times/min, and the amplitude is 3-6 mm.
6. The method for preparing a copper alloy strip for a half-etched lead frame according to claim 4, wherein: the hot rolling is carried out at the ingot heating temperature of 940-970 ℃ and the heat preservation time of 2-3 h, the hot rolling starting temperature of 920-950 ℃, the finishing temperature of 360-420 ℃ and the hot rolling processing rate of 92-96%.
7. The method for manufacturing a copper alloy strip for a half-etched lead frame according to claim 4, wherein: the softening annealing is to heat the copper strip to 250-290 ℃ and keep the temperature for 1-2 h, then heat the copper strip to 540-580 ℃ and keep the temperature for 6-9 h, and the annealing process adopts reducing gas for protection.
8. The method for manufacturing a copper alloy strip for a half-etched lead frame according to claim 4, wherein: the high-temperature solid solution adopts an air cushion annealing furnace, the solid solution temperature is 960-1000 ℃, the speed is 10-20 m/min, and the reduction gas protection is adopted in the solid solution process.
9. The method for preparing a copper alloy strip for a half-etched lead frame according to claim 4, wherein: the aging treatment comprises the steps of heating the copper strip to 250-290 ℃, preserving heat for 1-2 h, then heating to 460-500 ℃, preserving heat for 7-10 h, and finally cooling to below 65 ℃ and discharging.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115896512A (en) * | 2022-12-25 | 2023-04-04 | 中国兵器科学研究院宁波分院 | Preparation method of copper alloy material for high-precision etched lead frame |
| CN116136005A (en) * | 2023-02-24 | 2023-05-19 | 宁波金田铜业(集团)股份有限公司 | Copper alloy strip and preparation method and application thereof |
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