CN115283835B

CN115283835B - Defect marking method and device for PCB

Info

Publication number: CN115283835B
Application number: CN202210846679.0A
Authority: CN
Inventors: 张超; 张骏; 陈锐钊
Original assignee: Shenzhen Magic Ray Technology Co ltd
Current assignee: Shenzhen Mingrui Ideal Technology Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2023-10-20
Anticipated expiration: 2042-07-05
Also published as: CN115283835A

Abstract

The embodiment of the application discloses a defect marking method and device for a PCB, wherein the method comprises the following steps: acquiring image information of a PCB (printed Circuit Board); determining the defect type and the defect severity of the PCB according to the element information in the image information, and determining the PCB as a rechecking board or a destroying board according to the defect type and the defect severity; and controlling the marking pen to mark the rechecking board and the destroying board according to a preset marking mode. The defect marking method of the PCB disclosed by the application can identify the defect type and the defect severity of the PCB, classify the defect type and the defect severity into the recheck board or the destroy board, mark the recheck board and the destroy board according to a preset marking mode, facilitate the detection of the defect type and the defect severity at a glance during manual recheck, and repair or recover the defect type and the defect severity, thereby being beneficial to saving cost in factories and improving the manual recheck efficiency, and further improving the production efficiency.

Description

Defect marking method and device for PCB

Technical Field

The embodiment of the application relates to the technical field of defect detection and marking of PCB (printed circuit board), in particular to a defect marking method and device of a PCB.

Background

In the prior art, the production process of the PCB is complex, each production link is likely to generate defects, and the defective PCB is required to be found out in time and prevented from entering the next working procedure. In the prior art, an automatic optical detection system such as AOI is generally adopted to realize real-time detection of the PCB in each production link, but the detection can only evaluate the defect type of the PCB and cannot evaluate the defect severity of the PCB, and although false detection judgment can be carried out manually in the process of re-detection, if a plurality of sub-boards on one PCB are needed, the corresponding standard boards are needed to be found manually for comparison according to different defect types, and the time is more.

The defect marking method of the PCB disclosed by the application can identify the defect type and the defect severity of the PCB, classify the defect type and the defect severity into the reinspection board or the destruction board, mark the reinspection board and the destruction board according to a preset marking mode, facilitate the manual inspection of the defect type and the sorting of the reinspection board and the destruction board, and improve the production efficiency.

Disclosure of Invention

The technical problem that the defect marking method and the device for the PCB mainly solve can solve the technical problems that the defect severity of the PCB cannot be estimated, and the efficiency of classification marking and manual review is low in the prior art.

In order to solve the technical problems, one technical scheme adopted by the embodiment of the application is as follows: the defect marking method for the PCB comprises the following steps: acquiring image information of a PCB (printed Circuit Board); determining the defect type and the defect severity of the PCB according to the element information in the image information; determining that the PCB is a recheck board or a destroy board according to the defect type and the defect severity; marking the rechecking board or the destroying board in a preset marking mode.

Optionally, the obtaining the image information of the PCB includes: shooting the PCB image; gray scale processing is carried out on the PCB image to obtain a gray scale image; performing binarization processing on the gray-scale image to obtain a first gray-scale binarization image; or, scaling the PCB image to obtain a scaled graph; obtaining the maximum value and the minimum value of three-color channel pixels in a pixel area of a preset range in the proportionality diagram; carrying out logic judgment on the three-color channel pixel value of each coordinate in the proportionality diagram according to the maximum value and the minimum value of the three-color channel pixel of the pixel area to obtain a pixel a value of the corresponding coordinate; performing binarization inversion on the corresponding pixel a value to obtain a first color extraction binarization map; or the image rotates within a preset angle range according to a preset rotation angle, is matched with the template image, and obtains a matching result, wherein the matching result comprises a matching template, a matching position and a matching rotation angle. Or, obtaining the substrate color proportion of a preset detection window in the PCB image.

Optionally, the determining the defect type and the defect severity of the PCB according to the element information in the image information, and determining the PCB as a recheck board or a destruction board according to the defect type and the defect severity includes: processing the first gray scale binary image and the first color extraction binary image in a communication area respectively, and calculating a first gray scale contour area and a first color extraction contour area corresponding to the communication area; if the first gray-scale contour area is smaller than a preset area threshold value, determining that the defect type of the PCB is a component missing part; if the element area is smaller than a preset first threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; acquiring an external rectangular area where the element area is located, and calculating the offset distance between the center point of the external rectangular area and the center point of the sample; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset gray-scale distance threshold value, determining that the defect type is element offset; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset second threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; or calculating the offset distance between the center point of the matching template and the center point of the sample; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset matching distance threshold, confirming that the defect type is element offset; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset third threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board; if the matching rotation angle is larger than a preset deflection angle threshold value, confirming that the defect type is element deflection; if the matching rotation angle is larger than a preset fourth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; if the difference between the first gray-scale contour area and the sample area is larger than a preset gray-scale size threshold value, confirming that the defect type is the element size difference; if the difference between the first gray level outline area and the sample area is larger than a preset fifth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; or if the difference between the first color extraction outline area and the sample area is larger than a preset color extraction size threshold value, confirming that the defect type is the element size difference; if the difference between the first color drawing outline area and the sample area is larger than a preset sixth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; if the first gray scale contour area is larger than a preset gray scale scratch threshold value, determining that the defect type is element scratch; if the first gray level outline area is larger than a preset seventh threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; or if the first color drawing outline area is larger than a preset color drawing scratch threshold value, determining that the defect type is element scratch; if the first gray level outline area is larger than a preset eighth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; if the first gray-scale contour area is larger than a preset gray-scale foreign matter threshold value, confirming that the defect type is element foreign matter; if the first gray level outline area is larger than a preset ninth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; or if the first color extraction outline area is larger than a preset color extraction foreign matter threshold value, confirming that the defect type is the element foreign matter; if the first extraction outline area is larger than a preset tenth threshold value, judging the PCB as a destruction board; otherwise, determining the PCB as a rechecking board; and if the substrate color area ratio of the preset detection window is larger than the preset substrate color ratio threshold value, determining that the PCB is a destruction plate.

Optionally, the marking the review board or the destruction board by the preset marking method includes: according to a preset reference point and a preset offset value, controlling a common pen to mark a reinspection mark on a designated position on the reinspection board; or, according to a preset reference point and a preset motion trail, controlling the common pen to mark the destruction board with destruction marks according to the preset motion trail.

Optionally, the controlling the normal pen to mark the specified position on the reinspection board with a reinspection mark, or marking the destruction board with a destruction mark according to the preset motion track with a normal pen, further includes: acquiring a sampling image of the last review board marked with the review mark or the last destruction board marked with the destruction mark; and acquiring the characteristic information of the sampling image, comparing the characteristic information with preset characteristic information, and sending an alarm signal to remind the user to replace the common pen if the comparison result reaches a preset condition.

Optionally, the acquiring the feature information of the sampled image compares the feature information with preset feature information, and if the comparison result reaches a preset condition, sends an alarm signal to remind the replacement of the common pen, including: performing gray level binarization processing on the sampling image to obtain a second gray level binarization graph; performing contour extraction processing on the second gray level binarization map to obtain a contour array; taking the maximum outline of the outline array as a marking point outline, and calculating an outline area; and comparing the contour area with a preset area threshold, and if the contour area is smaller than the preset area threshold, sending an alarm signal to remind the replacement of the common pen.

Optionally, the acquiring the feature information of the sampled image compares the feature information with preset feature information, and if the comparison result reaches a preset condition, sends an alarm signal to remind the user to replace the common pen, and further includes: performing color extraction binarization processing on the sampling image to obtain a second color extraction binarization image; performing contour extraction processing on the second color extraction binarization graph to obtain a circular track; calculating the area of the circular track to obtain the area percentage of the circular track; and comparing the area percentage with a preset percentage threshold, and if the area percentage is smaller than the preset percentage threshold, sending an alarm signal to remind the replacement of the common pen.

Optionally, the preset marking mode marks the reinspection board or the destruction board, and further includes: controlling a laser pen to mark a reinspection mark on a designated position on the reinspection plate according to a preset reference point and a preset offset value; or, according to a preset reference point and a preset motion trail, controlling the laser pen to mark the destruction board with destruction marks according to the preset motion trail.

Optionally, the PCB board is a whole board or a single sub board composed of a plurality of sub boards.

In addition, in order to achieve the above object, a defect marking apparatus of a PCB board, the defect marking apparatus comprising: the PCB defect marking device comprises a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to realize the PCB defect marking method.

Compared with the prior art, the application has the beneficial effects that: the embodiment of the application provides a defect marking method and device for a PCB, wherein the method comprises the following steps: acquiring image information of a PCB (printed Circuit Board); determining the defect type and the defect severity of the PCB according to the element information in the image information, and determining the PCB as a rechecking board or a destroying board according to the defect type and the defect severity; and controlling the marking pen to mark the rechecking board and the destroying board according to a preset marking mode. The defect marking method of the PCB disclosed by the application can identify the defect type and the defect severity of the PCB, divide the defect type and the defect severity into the reinspection board or the destruction board, mark the reinspection board and the destruction board according to a preset marking mode, facilitate the manual inspection of the defect type and the sorting of the reinspection board and the destruction board, and improve the production efficiency.

Drawings

Fig. 1 is a schematic flow chart of a defect marking method for a PCB according to an embodiment of the present application;

FIG. 2 is a schematic diagram of detection of a destruction plate according to an embodiment of the present application;

FIG. 3 is a schematic illustration of a review board marking intent provided in accordance with an embodiment of the present application;

FIG. 4 is a schematic illustration of a destruction plate according to an embodiment of the present application;

FIG. 5 is a schematic flow chart of a method for replacing a normal marking pen according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a defect marking device for a PCB according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of a defect marking apparatus for a PCB board according to an embodiment of the present application.

Detailed Description

In order that the application may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "upper," "lower," "inner," "outer," "bottom," and the like as used in this specification are used in an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

In addition, the technical features mentioned in the different embodiments of the application described below can be combined with one another as long as they do not conflict with one another.

Because the production process of the PCB in the prior art is complex, each production link is likely to generate defects, and the defective PCB needs to be found out in time and prevented from entering the next working procedure. Automatic optical detection systems such as AOI and the like are commonly adopted in the industry to realize real-time detection of the PCB in each production link, but the detection can only evaluate the defect type of the PCB and cannot evaluate the defect severity of the PCB, and although false detection judgment can be carried out manually in the process of re-detection, if a plurality of sub-boards on one PCB are needed, the corresponding standard boards are needed to be found manually for comparison according to different defect types, and the time is more. Therefore, if the defect type and the defect severity of the defective PCB can be automatically confirmed according to the image information of the defective PCB, and the defective PCB is marked according to the defect type and the defect severity and according to different marking modes, the defect type and the defect severity can be seen at a glance during the rechecking by manpower, and the repair or the recovery is performed, so that the method is beneficial to saving cost of factories and improving the efficiency of manual rechecking.

The main solutions of the embodiments of the present application are: the utility model provides a marking method and equipment of defect PCB board, aims at solving the technical problem that the defect severity of defect PCB board can not be estimated in prior art and classification marking and manual review are inefficiency. Referring to fig. 1, an embodiment of the present application provides a method for evaluating defects of a PCB board, including:

s11, acquiring image information of the PCB.

In some embodiments, obtaining image information of the PCB board includes:

the PLC is used for controlling the machine track to drive the PCB to enter a designated position of the machine, and a camera is used for shooting the PCB image to obtain the PCB image; gray scale processing is carried out on the PCB image to obtain a gray scale image, and binarization processing is carried out on the gray scale image to obtain a first gray scale binarization image.

Or, acquiring pixel values r, g and b of three-color channels of each coordinate (X, Y) in the PCB image, and performing the following processing according to a preset formula: total=r+g+b, r1=r×100/total, g1=g×100/total, b1=b×100/total, after the processing is completed, the values of the three-color channel pixel values r1, g1, b1 are in the range of 0-100, the value of the pixel a is total/3, and the value of the pixel a becomes the average value of the three-color channel pixel values, so as to obtain a proportionality diagram; selecting a pixel region with a certain size in the proportionality diagram to obtain the maximum value and the minimum value of three-color channel pixels in the region, wherein the maximum value and the minimum value are R (max), R (min), G (max), G (min), B (max) and B (min) respectively; the three-color channel pixel values at each coordinate (X ', Y') in the comparative example map are logically determined: if R1> R (min) and R1< R (max), G1> G (min) and G1< G (max), B1> B (min) and B1< B (max) are satisfied at the same time, setting the value of a position pixel a of each coordinate (X ', Y') in the proportionality diagram to be 0; if R1> R (min) and R1< R (max), G1> G (min) and G1< G (max), B1> B (min) and B1< B (max) are satisfied at the same time, setting the position pixel a value of each coordinate (X ', Y') in the proportionality diagram to be 1; if R1> R (min) and R1< R (max), G1> G (min) and G1< G (max), B1> B (min) and B1< B (max) are not satisfied, setting the pixel a value of each coordinate (X ', Y') in the scaled map to be 1. After the logic judgment, the value of the pixel a in the proportioned graph becomes 0 or is not 0; the pixel a value is binarized and inverted, all 0 values are changed to 255, and all non-0 values are changed to 0, so that a first color extraction binarization map is obtained.

Or, the detected image is respectively matched with the template image every 0.1 degree according to the detection angle range set by the user, and the matching result comprises a matching template, a matching position and a matching rotation angle.

Or, presetting a detection window on the PCB by a user, and calculating the color area size of the substrate in the preset detection window and the area proportion occupying the preset detection window.

In this embodiment, an image of a PCB board is obtained, and gray level binarization processing is performed on the image, or template matching processing is performed on the image, or color extraction binarization processing is performed on the image, or a substrate color area ratio is calculated, so as to facilitate subsequent determination of whether the PCB board is a review board or a destruction board according to a defect type and a severity.

S13, determining that the PCB is a recheck board or a destroy board according to the defect type and the defect severity.

In some embodiments, the user may also perform a dedicated inspection or multiple inspections of the PCB by checking for the type of inspection defect. Wherein the defect types include: component missing, component positional offset, component angular deflection, component dimensional differences, component scratching, and component foreign matter.

In some embodiments, the first gray scale binary image and the first color extraction binary image are respectively subjected to communication area processing, and a first gray scale contour area and a first color extraction contour area corresponding to the communication area are calculated;

if the first gray-scale contour area is smaller than the preset area threshold value, determining that the defect type of the PCB is the element missing piece; when the defect type of the PCB is determined to be the element missing piece, if the element area is smaller than a preset first threshold value, determining the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board; the preset first threshold value can be set by a user, for example, the preset first threshold value is 1/2 of the preset area threshold value.

Acquiring an external rectangular area where the area of the element is located, and calculating the offset distance between the center point of the external rectangular area and the center point of the sample; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset gray-scale distance threshold value, determining that the defect type is element offset; or calculating the offset distance between the center point of the matching template and the center point of the sample; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset matching distance threshold value, confirming that the defect type is element offset; when the determined defect type of the PCB is element offset, if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset second threshold value, determining the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board. Or if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset third threshold value, determining the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board.

In some embodiments, the preset second threshold and the preset third threshold may be set by the user, for example, the preset second threshold is 3/2 of the preset gray-scale distance threshold, and the preset third threshold is 3/2 of the preset matching distance threshold.

If the matching rotation angle is larger than a preset deflection angle threshold value, confirming that the defect type is element deflection; when the determined defect type of the PCB is element deflection, if the matching rotation angle is larger than a preset fourth threshold value, judging the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board.

In some embodiments, the preset fourth threshold may be set by the user, for example, 3/2 of the preset deflection angle.

If the difference between the first gray-scale contour area and the sample area is larger than a preset gray-scale size threshold value, confirming that the defect type is the element size difference; or if the difference between the first color extraction profile area and the sample area is greater than a preset color extraction size threshold, determining that the defect type is the element size difference. When the determined defect type of the PCB is the element size difference, if the difference between the first gray-scale contour area and the sample area is larger than a preset fifth threshold value, judging the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board. Or if the difference between the first color drawing outline area and the sample area is larger than a preset sixth threshold value, judging the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board.

In some embodiments, the preset fifth threshold and the preset sixth threshold may be set by the user, for example, the preset fifth threshold may be 3/2 of the preset gray-scale threshold, and the preset sixth threshold may be 3/2 of the preset color-extraction threshold.

If the first gray scale contour area is larger than a preset gray scale scratch threshold value, determining that the defect type is element scratch; or if the first color drawing outline area is larger than a preset color drawing scratch threshold value, determining that the defect type is element scratch. When the determined defect type of the PCB is element scratch, if the first gray level outline area is larger than a preset seventh threshold value, determining the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board. Or if the first gray level outline area is larger than the preset eighth threshold value, judging the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board.

In some embodiments, the preset seventh threshold and the preset eighth threshold may be set by the user, for example, the seventh threshold may be 3/2 of the preset gray-scale scratch threshold, and the eighth threshold may be 3/2 of the preset color-drawing scratch threshold.

If the first gray-scale contour area is larger than a preset gray-scale foreign matter threshold value, confirming that the defect type is the element foreign matter; or if the first color extraction outline area is larger than a preset color extraction foreign matter threshold value, confirming that the defect type is the element foreign matter. When the determined defect type of the PCB is element foreign matter, if the first gray level outline area is larger than a preset ninth threshold value, judging the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board; or if the first color drawing outline area is larger than a preset tenth threshold value, judging the PCB as a destruction plate; otherwise, determining the PCB as a rechecking board.

In some embodiments, the preset ninth threshold and the preset tenth threshold may be set by the user, for example, the preset ninth threshold may be 3/2 of the preset gray-level threshold, and the tenth threshold may be 3/2 of the preset color extraction foreign matter threshold.

In some embodiments, a user presets a detection window on the PCB board, calculates the size of the substrate color area within the preset detection window, and occupies the area proportion of the preset detection window. And if the substrate color area ratio of the preset detection window is larger than the preset substrate color ratio threshold value, determining that the PCB is a destruction plate. For example, referring to fig. 2, a preset detection window is defined on the PCB board, the preset detection window may be determined by a user, the detection window includes a certain number of elements, the color of the elements is different from the color of the PCB board substrate, for example, the color of the elements is blue, the color of the PCB board substrate is green, the green area ratio in the detection window is calculated, and if the ratio is greater than a preset substrate color ratio threshold, the PCB board is determined to be a destruction board.

In the prior art, an AOI, ADC and other intelligent defect detection systems are adopted, so that the real-time detection of the PCB produced on the line can be realized, and the defects in the production process can be found in time. However, these defect detection techniques can only detect the type of defect and cannot evaluate the severity of the defect.

In this embodiment, the user can detect the defect type, evaluate the defect severity, and determine that the PCB is a reinspection board or a destruction board according to the defect type and the defect severity through presetting the area threshold, presetting the gray-scale distance threshold, presetting the matching distance threshold, presetting the deflection angle threshold, presetting the color extraction size threshold, and presetting the color extraction threshold, so that the reinspection board and the destruction board can be conveniently marked according to a preset marking mode.

S15, marking the reinspection plate and the destruction plate according to a preset marking mode.

In some embodiments, the marking the review board or the destruction board by the preset marking method includes:

and according to the preset reference point and the preset offset value, controlling the common pen to mark the specified position on the reinspection board with reinspection marks.

Or, according to the preset reference point and the preset motion trail, controlling the common pen to beat the destruction board with destruction marks according to the preset motion trail.

Or controlling the laser pen to mark the recheck mark on the appointed position on the recheck plate according to the preset reference point and the preset offset value.

Or, according to the preset reference point and the preset motion trail, controlling the laser pen to beat the destruction board with destruction marks according to the preset motion trail.

In some embodiments, when the adopted marking pen is a common pen, the motion control device controls the clamping jaw to drive the common marking pen to move above the designated position of the reinspection board, and according to the vertical motion distance set by a user, the clamping jaw controls the marking pen to perform pressing and lifting actions in the vertical direction to perform point touch marking, so that a graph like the upper left corner of each of the subplate 1 and the subplate 3 in fig. 3 is formed, and fig. 3 is the marking intention of the reinspection board. When the adopted marking pen is a laser pen, the laser marking pen is driven to move above the appointed position of the reinspection board through the motion control device, the laser pen is controlled to be turned on and off for burning marking, the graph of the upper left corner of each of the subplate 1 and the subplate 3 in the figure 3 is formed, and the figure 3 is the marking intention of the reinspection board. When the adopted marking pen is a common pen, the motion control device controls the clamping jaw to drive the common marking pen to move above the datum point of the destroying plate, the clamping jaw controls the marking pen to perform a pressing action in the vertical direction of the datum point of the destroying plate according to the motion track rule set by a user, then the marking pen moves according to the motion track to form a track graph as shown in fig. 4, and fig. 4 shows marking intention of the destroying plate. When the marking pen is a laser marking pen, the laser pen is controlled to be started at the reference point position of the destroying plate, and the motion control device is controlled to drive the laser marking pen to move according to the motion track rule set by a user to form a track graph as shown in fig. 4, and fig. 4 is a marking intention of the destroying plate.

In the prior art, although the defect type of the PCB can be detected based on an AOI intelligent defect detection system or an ADC intelligent defect detection system, the detection can only evaluate the defect type of the PCB and cannot evaluate the defect severity of the PCB, and the recheck is needed manually, when a plurality of sub-boards on one PCB are needed, the corresponding standard boards are needed to be found manually according to different defect types for comparison, and the time is more. In this embodiment, marking operation is performed on the reinspection board and the destruction board according to a preset marking mode, staff responsible for reinspection can see defect types and defect severity at a glance according to special marks on the PCB board, the destruction board may need to be discarded, manual reinspection is not needed, in order to improve the detection speed of the following procedure, the destruction board needs to be marked in advance, and the reinspection board and the destruction board are sorted out according to the marking operation, so that recycling of the reinspection board and the destruction board is realized, thereby reducing the expense of factories and improving the production efficiency.

In some embodiments, referring to fig. 5, controlling the normal pen to mark the specified position on the reinspection board with the reinspection mark, or marking the destruction board with the normal pen according to the preset motion track, includes:

s151, acquiring a last rechecking board marked with a rechecking mark or a last destroying board sampling image marked with a destroying mark;

in some embodiments, the motion control device controls the camera to move to the marking position of the last defective board, and performs an image capturing operation to obtain a sampling image of the last review board marked with the review mark or a sampling image of the last destruction board marked with the destruction mark.

S153, acquiring characteristic information of the sampling image.

In some embodiments, performing gray level binarization processing on the sampled image to obtain a second gray level binarization map; performing contour extraction processing on the second gray level binarization map to obtain a contour array; taking the maximum outline of the outline array as a marking point outline, and calculating the outline area;

or performing color extraction binarization processing on the sampling image to obtain a second color extraction binarization image; performing contour extraction processing on the second color extraction binarization graph to obtain a circular track;

calculating the area of the circular track to obtain the area percentage of the circular track;

s155, comparing the characteristic information with preset characteristic information.

In some embodiments, the contour area is compared to a preset area threshold. Alternatively, the area percentage is compared to a preset percentage threshold.

S157, alarming to remind of replacing the marking pen.

In some embodiments, if the profile area is less than a preset area threshold, the test is stopped and an alarm signal is sent to alert the replacement of the ordinary pen. For example, the preset area threshold is 10 pixels, if the calculated outline area is smaller than 10 pixels, the test is stopped, and meanwhile, PLC alarm processing is carried out to remind a user to replace the marking pen.

Or if the area percentage is smaller than the preset percentage threshold, stopping the test, and simultaneously carrying out PLC alarm processing to remind a user to replace the marking pen.

Through the description, it is easy to find that when the common pen, such as a mark pen and other consumables, is used for marking the review board or the destruction board, the problem that ink is consumed is solved, the consumption condition of the common pen is judged based on the comparison of the characteristic information and the preset characteristic information, and a worker can be warned to remind the worker of replacing the common pen based on the consumption condition. Specifically, in this embodiment, by acquiring a sampling image of the last review board with the review marks or a sampling image of the last destruction board with the destruction marks, comparing the feature information with the preset feature information, the consumption condition of the ordinary pen is judged, and a worker is reminded of replacing the ordinary marking pen, so that the technical problems that in the marking process using the expendable products such as the ordinary pen, the marking cannot be performed or the marking is unclear due to the problem of the consumption of ink and the like are solved, and the marking efficiency and the marking precision are improved.

As shown in fig. 6, based on the same inventive principles, an embodiment of the present application further provides a defect marking apparatus 60 for a PCB, including:

the image processing module 601 is used for acquiring an image of the PCB and detecting elements in the image;

the defect judging module 603 is configured to judge that the PCB board is a recheck board or a destruction board according to the type and the severity of the detection result;

the marking control module 605 is configured to mark the review board or the destruction board according to a preset marking manner;

it should be noted that, each module in the device for evaluating defects of a PCB in this embodiment corresponds to each step in the method for marking defects of a PCB in the foregoing embodiment, so specific implementation and achieved technical effects of this embodiment may refer to implementation of the foregoing method for marking defects of a PCB, which is not described herein again.

As another aspect of the embodiment of the present application, the embodiment of the present application provides a defect marking apparatus for a PCB board. Referring to fig. 7, which is a schematic hardware structure diagram of a defect marking apparatus 70 for a PCB board, referring to fig. 7, the defect marking apparatus for a PCB board includes: one or more processors 701, and a memory 702, one processor 701 being illustrated in fig. 7.

The processor 701 and the memory 702 may be connected by a bus or otherwise, for example in fig. 7.

The memory 702 is used as a non-volatile computer readable storage medium, and may be used to store a non-volatile software program, a non-volatile computer executable program, and modules, such as program instructions/modules (e.g., the image processing module 601, the defect determining module 603, and the marking control module 605 shown in fig. 6) corresponding to the defect marking device of the PCB board in the embodiment of the present application. The processor 701 executes various functional applications and data processing of the defect marking apparatus of the PCB board by running the nonvolatile software programs, instructions and modules stored in the memory 702, that is, implements the defect marking method of the PCB board of the above method embodiment.

Memory 702 may include a storage program area that may store an operating system, at least one application program required for functionality, and a storage data area; the storage data area may store data created according to the use of the controller, etc. In addition, the memory 702 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid-state storage device. In some embodiments, memory 702 optionally includes memory remotely located with respect to processor 701, which may be connected to the defect marking device of the PCB board via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The one or more modules are stored in the memory 702 and when executed by the one or more processors 701 perform the method of defect marking of PCBs in any of the method embodiments described above, e.g., performing the method steps S11-S15 in fig. 1, and the method steps S151-S157 in fig. 5 described above; the functions of modules 601-605 in fig. 6.

The product can execute the method provided by the embodiment of the application, and has the corresponding functional modules and beneficial effects of the execution method. Technical details not described in detail in this embodiment may be found in the methods provided in the embodiments of the present application.

Embodiments of the present application also provide a non-transitory computer-readable storage medium storing computer-executable instructions for causing a chip to perform a hardware driving method as described above.

Embodiments of the present application provide a computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions which, when executed by a chip, cause the chip to perform a hardware driving method as described above.

The above-described embodiments of the apparatus or device are merely illustrative, in which the unit modules illustrated as separate components may or may not be physically separate, and the components shown as unit modules may or may not be physical units, may be located in one place, or may be distributed over multiple network module units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

From the above description of embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus a general purpose hardware platform, or may be implemented by hardware. Based on such understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the related art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform the method described in the respective embodiments or some parts of the embodiments.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the application, the steps may be implemented in any order, and there are many other variations of the different aspects of the application as described above, which are not provided in detail for the sake of brevity; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims

1. The marking method of the PCB board is characterized by comprising the following steps:

acquiring image information of a PCB (printed Circuit Board);

determining the defect type and the defect severity of the PCB according to the element information in the image information; determining that the PCB is a recheck board or a destroy board according to the defect type and the defect severity;

marking the reinspection board or the destruction board in a preset marking mode;

the obtaining the image information of the PCB board comprises the following steps:

shooting the PCB image;

gray scale processing is carried out on the PCB image to obtain a gray scale image; performing binarization processing on the gray-scale image to obtain a first gray-scale binarization image;

scaling the PCB image to obtain a scaled graph; obtaining the maximum value and the minimum value of three-color channel pixels in a pixel area of a preset range in the proportionality diagram; carrying out logic judgment on the three-color channel pixel value of each coordinate in the proportionality diagram according to the maximum value and the minimum value of the three-color channel pixel of the pixel area to obtain a pixel a value of the corresponding coordinate; performing binarization inversion on the pixel a value of the corresponding coordinate to obtain a first color extraction binarization map;

the image rotates within a preset angle range according to a preset rotation angle, is matched with the template image, and a matching result is obtained, wherein the matching result comprises a matching template, a matching position and a matching rotation angle;

acquiring the color area ratio of a substrate of a preset detection window in the PCB image;

the determining the defect type and the defect severity of the PCB according to the element information in the image information, and determining the PCB as a rechecking board or a destroying board according to the defect type and the defect severity comprises the following steps:

processing the first gray scale binary image and the first color extraction binary image in a communication area respectively, and calculating a first gray scale contour area and a first color extraction contour area corresponding to the communication area;

if the first gray-scale contour area is smaller than a preset area threshold value, determining that the defect type of the PCB is a component missing part; if the area of the element is smaller than a preset first threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or, acquiring an external rectangular area where the area of the element is positioned, and calculating the offset distance between the center point of the external rectangular area and the center point of the sample; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset gray-scale distance threshold value, determining that the defect type is element offset; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset second threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or calculating the offset distance between the center point of the matching template and the center point of the sample; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset matching distance threshold, confirming that the defect type is element offset; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset third threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board;

or if the matching rotation angle is larger than a preset deflection angle threshold, confirming that the defect type is element deflection; if the matching rotation angle is larger than a preset fourth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or if the difference between the first gray-scale contour area and the sample area is larger than a preset gray-scale size threshold value, confirming that the defect type is the element size difference; if the difference between the first gray level outline area and the sample area is larger than a preset fifth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or if the difference between the first color extraction outline area and the sample area is larger than a preset color extraction size threshold value, confirming that the defect type is the element size difference; if the difference between the first color drawing outline area and the sample area is larger than a preset sixth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or if the first gray scale contour area is larger than a preset gray scale scratch threshold value, determining that the defect type is element scratch; if the first gray level outline area is larger than a preset seventh threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or if the first color drawing outline area is larger than a preset color drawing scratch threshold value, determining that the defect type is element scratch; if the first gray level outline area is larger than a preset eighth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or if the first gray-scale contour area is larger than a preset gray-scale foreign matter threshold value, confirming that the defect type is the element foreign matter; if the first gray level outline area is larger than a preset ninth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;

or if the first color extraction outline area is larger than a preset color extraction foreign matter threshold value, confirming that the defect type is the element foreign matter; if the first extraction outline area is larger than a preset tenth threshold value, judging the PCB as a destruction board; otherwise, determining the PCB as a rechecking board;

or if the substrate color area ratio of the preset detection window is larger than the preset substrate color ratio threshold value, determining that the PCB is a destruction plate.

2. The method of claim 1, wherein the pre-marking the review board or the destruction board comprises:

according to a preset reference point and a preset offset value, controlling a common pen to mark a reinspection mark on a designated position on the reinspection board;

or, according to a preset reference point and a preset motion trail, controlling the common pen to mark the destruction board with destruction marks according to the preset motion trail.

3. The method according to claim 2, wherein controlling the normal pen to mark the specified position on the reinspection board with a reinspection mark or marking the destruction board with a normal pen according to the preset motion trajectory comprises:

acquiring a sampling image of the last review board marked with the review mark or the last destruction board marked with the destruction mark;

and acquiring the characteristic information of the sampling image, comparing the characteristic information with preset characteristic information, and sending an alarm signal to remind the user to replace the common pen if the comparison result reaches a preset condition.

4. The method according to claim 3, wherein the acquiring the feature information of the sampled image, comparing the feature information with a preset feature information, and if the comparison result reaches a preset condition, sending an alarm signal to remind the replacement of the ordinary pen, includes:

performing gray level binarization processing on the sampling image to obtain a second gray level binarization graph;

performing contour extraction processing on the second gray level binarization map to obtain a contour array;

taking the maximum outline of the outline array as a marking point outline, and calculating an outline area;

and comparing the contour area with a preset area threshold, and if the contour area is smaller than the preset area threshold, sending an alarm signal to remind the replacement of the common pen.

5. The method according to claim 4, wherein the acquiring the feature information of the sampled image compares the feature information with a preset feature information, and if the comparison result reaches a preset condition, an alarm signal is sent to remind the replacement of the ordinary pen, and the method further comprises:

performing color extraction binarization processing on the sampling image to obtain a second color extraction binarization image;

performing contour extraction processing on the second color extraction binarization graph to obtain a circular track;

and comparing the area percentage with a preset percentage threshold, and if the area percentage is smaller than the preset percentage threshold, sending an alarm signal to remind the replacement of the common pen.

6. The method of claim 1, wherein the pre-marking the review board or the destruction board further comprises:

controlling a laser pen to mark a reinspection mark on a designated position on the reinspection plate according to a preset reference point and a preset offset value;

or, according to a preset reference point and a preset motion trail, controlling the laser pen to mark the destruction board with destruction marks according to the preset motion trail.

7. The method of any of claims 1-6, wherein the PCB board is a complete board or a single sub-board comprised of a plurality of sub-boards.

8. A defect marking apparatus of a PCB board, the defect marking apparatus comprising: a memory and a processor, the memory having stored therein a computer program, the processor executing the computer program to implement the method of any of claims 1-6.