CN115283835A - Defect marking method and device for PCB - Google Patents
Defect marking method and device for PCB Download PDFInfo
- Publication number
- CN115283835A CN115283835A CN202210846679.0A CN202210846679A CN115283835A CN 115283835 A CN115283835 A CN 115283835A CN 202210846679 A CN202210846679 A CN 202210846679A CN 115283835 A CN115283835 A CN 115283835A
- Authority
- CN
- China
- Prior art keywords
- preset
- pcb
- board
- area
- determining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007547 defect Effects 0.000 title claims abstract description 150
- 238000000034 method Methods 0.000 title claims abstract description 48
- 230000006378 damage Effects 0.000 claims abstract description 80
- 238000000605 extraction Methods 0.000 claims description 34
- 238000001514 detection method Methods 0.000 claims description 30
- 238000012545 processing Methods 0.000 claims description 29
- 238000012552 review Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 14
- 238000005070 sampling Methods 0.000 claims description 11
- 238000004590 computer program Methods 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000011084 recovery Methods 0.000 abstract description 2
- 230000008439 repair process Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 230000002950 deficient Effects 0.000 description 7
- 238000010009 beating Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010330 laser marking Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011897 real-time detection Methods 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/90—Determination of colour characteristics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Geometry (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The embodiment of the invention discloses a defect marking method and equipment for a PCB (printed circuit board), wherein the method comprises the following steps: obtaining image information of a PCB; determining the defect type and defect severity of the PCB according to the element information in the image information, and determining the PCB as a re-inspection board or a destruction board according to the defect type and defect severity; and controlling the marking pen to mark the rechecking plate and the destroying plate according to a preset marking mode. The defect marking method of the PCB can identify the defect type and the defect severity of the PCB and classify the defect type and the defect severity into a rechecking plate or a destroying plate, and the rechecking plate and the destroying plate are marked according to a preset marking mode, so that the defect type and the defect severity can be seen at a glance when the rechecking is carried out manually, the repair or the recovery of the defect type and the defect severity can be carried out conveniently, the cost of a factory is saved, the manual rechecking efficiency is improved, and the production efficiency is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of defect detection and marking of a PCB (printed circuit board), in particular to a method and equipment for marking defects of the PCB.
Background
In the prior art, the production process of the PCB is complex, each production link possibly generates defects, and the defective PCB is found in time and prevented from entering the next procedure. In the prior art, automatic optical inspection systems such as AOI (automated optical inspection) and the like are generally adopted to realize real-time inspection of the PCB in each production link, but the inspection can only evaluate the defect type of the PCB but cannot evaluate the defect severity of the PCB, although the manual inspection can carry out false inspection judgment during the re-inspection, if the number of daughter boards on one PCB is large, the manual inspection needs to find corresponding standard boards according to different defect types for comparison, and the time consumption is large.
The defect marking method for the PCB can identify the defect type and the defect severity of the PCB, classify the defect type and the defect severity into the reinspection board or the destruction board, mark the reinspection board and the destruction board according to a preset marking mode, facilitate the manual work to see the defect type at a glance, sort out the reinspection board and the destruction board, and improve the production efficiency.
Disclosure of Invention
The technical problem mainly solved by the embodiment of the invention is to provide a method and equipment for marking the defects of a PCB, which can solve the technical problems that the severity of the defects of the PCB cannot be evaluated, classified marking cannot be carried out, and manual review efficiency is low in the prior art.
In order to solve the technical problem, one technical scheme adopted by the embodiment of the invention is as follows: the defect marking method of the PCB comprises the following steps: acquiring image information of the PCB; determining the defect type and defect severity of the PCB according to the element information in the image information; determining the PCB board to be a rechecking board or a destroying board according to the defect type and the defect severity; marking the rechecking plate or the destroying plate in a preset marking mode.
Optionally, the acquiring image information of the PCB includes: shooting the PCB image; carrying out gray scale processing on the PCB image to obtain a gray scale image; carrying out binarization processing on the gray scale image to obtain a first gray scale binarization image; or, carrying out scaling processing on the PCB image to obtain a scaling diagram; acquiring the maximum value and the minimum value of the three-color channel pixels in the pixel area in the preset range in the proportional graph; performing logic judgment on the three-color channel pixel value of each coordinate in the proportional graph according to the maximum value and the minimum value of the three-color channel pixel in the pixel area to obtain a pixel a value of the corresponding coordinate; carrying out binarization inversion on the corresponding pixel a value to obtain a first color-extracting binarization image; or the image rotates within a preset angle range according to a preset rotation angle, and is matched with the template image to obtain a matching result, wherein the matching result comprises a matching template, a matching position and a matching rotation angle. Or acquiring a substrate color proportion of a preset detection window in the PCB image.
Optionally, the determining, according to the element information in the image information, the defect type and the defect severity of the PCB, and determining, according to the defect type and the defect severity, that the PCB is a review board or a destruction board, includes: respectively processing the first gray-scale binary image and the first color extraction binary image to obtain a first gray-scale outline area and a first color extraction outline area of the corresponding communication area; if the first gray scale outline area is smaller than a preset area threshold value, determining that the defect type of the PCB is an element missing part; if the element area is smaller than a preset first threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB board as a rechecking board; acquiring an external rectangular area where the area of the element is located, and calculating the offset distance between the central point of the external rectangular area and the central point of the sample; if the offset distance between the center point of the external rectangular area and the center point of the sample is larger than a preset gray scale distance threshold value, determining the defect type as element offset; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset second threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board; or calculating the offset distance between the center point of the matched template and the center point of the sample; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset matching distance threshold value, determining that the defect type is element offset; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset third threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board; if the matching rotation angle is larger than a preset deflection angle threshold value, determining that the defect type is element deflection; if the matching rotation angle is larger than a preset fourth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board; if the difference between the first gray scale outline area and the sample area is larger than a preset gray scale size threshold value, determining that the defect type is element size difference; if the difference between the first gray-scale outline area and the sample area is larger than a preset fifth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board; or if the difference between the first color extraction contour area and the sample area is larger than a preset color extraction size threshold value, determining that the defect type is the element size difference; if the difference between the area of the first color extraction contour and the area of the sample is larger than a preset sixth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board; if the area of the first gray scale outline is larger than a preset gray scale scratch threshold value, determining that the defect type is element scratch; if the area of the first gray scale outline is larger than a preset seventh threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board; or if the profile area of the first color extracting wheel is larger than a preset color extracting scratch threshold value, determining that the defect type is element scratch; if the area of the first gray scale outline is larger than a preset eighth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board; if the area of the first gray scale outline is larger than a preset gray scale foreign matter threshold value, determining that the defect type is an element foreign matter; if the first gray scale outline area is larger than a preset ninth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board; or if the profile area of the first color extracting wheel is larger than a preset color extracting foreign matter threshold value, determining that the defect type is an element foreign matter; if the first color extracting wheel outline area is larger than a preset tenth threshold value, judging that the PCB is a destroying plate; otherwise, determining the PCB board as a rechecking board; and if the substrate color area ratio of the preset detection window is larger than a preset substrate color ratio threshold, determining that the PCB is a destruction board.
Optionally, the preset marking mode marks the review board or the destruction board, including: controlling a common pen to print a recheck mark on a specified position on the recheck plate according to a preset reference point and a preset deviation value; or controlling the common pen to punch a destruction mark on the destruction plate according to a preset motion track according to a preset reference point and a preset motion track.
Optionally, the controlling a common pen to print a review mark on a designated position on the review board, or printing a destroy mark on the destroy board according to the preset motion trajectory by using a common pen, further includes: acquiring the last reinspection plate marked with the reinspection mark or the last destruction plate sampling image marked with the destruction mark; and acquiring the characteristic information of the sampled image, comparing the characteristic information with preset characteristic information, and sending an alarm signal to remind of replacing the common pen if the comparison result meets a preset condition.
Optionally, the obtaining of the feature information of the sampling image, comparing the feature information with preset feature information, and if a comparison result meets a preset condition, sending an alarm signal to remind of replacing the common pen includes: performing gray scale binarization processing on the sampling image to obtain a second gray scale binarization image; carrying out contour extraction processing on the second gray scale binary image to obtain a contour array; taking the maximum contour of the contour array as a marking point contour, and calculating the contour area; and comparing the outline area with a preset area threshold value, and if the outline area is smaller than the preset area threshold value, sending an alarm signal to remind the ordinary pen to be replaced.
Optionally, the obtaining of the feature information of the sampled image, comparing the feature information with preset feature information, and if a comparison result meets a preset condition, sending an alarm signal to remind of replacing the common pen further includes: performing color extraction binarization processing on the sampling image to obtain a second color extraction binarization image; carrying out contour extraction processing on the second color-extraction binary image to obtain a circular track; calculating the area of the circular track to obtain the area percentage of the circular track; and comparing the area percentage with a preset percentage threshold, and if the area percentage is smaller than the preset percentage threshold, sending an alarm signal to remind the ordinary pen to be replaced.
Optionally, the preset marking mode is used for marking the rechecking plate or the destroying plate, and the method further includes: controlling a laser pen to print a recheck mark on a specified position on the recheck plate according to a preset reference point and a preset deviation value; or controlling the laser pen to punch a destruction mark on the destruction plate according to a preset movement track according to a preset reference point and a preset movement track.
Optionally, the PCB board is a whole board or a single daughter board composed of a plurality of daughter boards.
In addition, in order to accomplish the above objects, a defect marking apparatus of a PCB board, the defect marking apparatus comprising: the defect marking method of the PCB comprises a memory and a processor, wherein a computer program is stored in the memory, and the processor executes the computer program to realize the defect marking method of the PCB.
Compared with the prior art, the invention has the beneficial effects that: the embodiment of the invention provides a defect marking method and equipment for a PCB (printed circuit board), wherein the method comprises the following steps: obtaining image information of a PCB; determining the defect type and the defect severity of the PCB according to the element information in the image information, and determining the PCB as a rechecking board or a destroying board according to the defect type and the defect severity; and controlling the marking pen to mark the rechecking plate and the destroying plate according to a preset marking mode. The defect marking method for the PCB can identify the defect type and the defect severity of the PCB, divide the defect type and the defect severity into the reinspection board or the destruction board, mark the reinspection board and the destruction board according to a preset marking mode, facilitate the manual work to find the defect type at a glance, sort out the reinspection board and the destruction board, and improve the production efficiency.
Drawings
Fig. 1 is a schematic flow chart of a defect marking method for a PCB provided in an embodiment of the present invention;
fig. 2 is a schematic view illustrating a detection of a destruction plate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of marking a review board according to an embodiment of the present invention;
fig. 4 is a schematic view of marking a destruction plate according to an embodiment of the present invention;
FIG. 5 is a schematic flow chart of a method for replacing a conventional marking pen according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a defect marking device for a PCB provided in an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a defect marking device for a PCB according to an embodiment of the present invention.
Detailed Description
In order to facilitate an understanding of the invention, reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. As used in this specification, the terms "upper," "lower," "inner," "outer," "bottom," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the invention and simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Because the production process of the PCB in the prior art is complex, each production link is possible to generate defects, and the defective PCB needs to be found in time and prevented from entering the next working procedure. The industry generally adopts automatic optical inspection systems such as AOI to realize real-time detection of the PCB in each production link, but the detection can only evaluate the defect type of the PCB but cannot evaluate the defect severity of the PCB, although the manual inspection can carry out false detection judgment during the re-inspection, if the daughter boards on one PCB are more, the manual inspection needs to find the corresponding standard boards according to different defect types for comparison, and more time is consumed. Therefore, if the defect type and the defect severity of the defective PCB can be automatically determined according to the image information of the defective PCB, and the marking can be performed on the defective PCB according to the defect type and the defect severity and according to different marking modes, the defect type and the defect severity can be seen at a glance during the re-inspection by a worker, the repair or the recovery can be performed, the factory cost can be saved, and the manual re-inspection efficiency can be improved.
The main solution of the embodiment of the invention is as follows: the method and the device for marking the defective PCB aim to solve the technical problems that in the prior art, the severity of the defects of the defective PCB cannot be evaluated, classified marking cannot be carried out, and manual review efficiency is low. Referring to fig. 1, an embodiment of the present invention provides a method for evaluating defects of a PCB, including:
s11, acquiring image information of the PCB.
In some embodiments, acquiring image information of the PCB board comprises:
controlling a machine track through a PLC (programmable logic controller) to drive a PCB to enter a specified position of a machine, and shooting an image of the PCB by using a camera to obtain an image of the PCB; carrying out gray scale processing on the PCB image to obtain a gray scale image, and carrying out binarization processing on the gray scale image to obtain a first gray scale binarization image.
Or acquiring three-color channel pixel values r, g and b of each coordinate (X, Y) in the PCB image, and processing the following steps according to a preset formula: the total = r + g + b, r1= r 100/total, g1= g 100/total, b1= b 100/total, after the processing is finished, the values of r1, g1 and b1 of the three-color channel pixels range from 0 to 100, the value of a pixel is total/3, and the value of a pixel is changed into the average value of the pixel values of the three-color channel, so that a proportional graph is obtained; selecting a pixel area with a certain size in a scaling graph to obtain the maximum value and the minimum value of the pixels of three-color channels in the area, wherein the maximum value and the minimum value are respectively R (max), R (min), G (max), G (min), B (max) and B (min); performing logic judgment on the three-color channel pixel value of each coordinate (X ', Y') in the proportional graph: setting the value of the position pixel a of each coordinate (X ', Y') in the scaling map to be 0 if the conditions of R1> R (min) and R1< R (max), G1> G (min) and G1< G (max), B1> B (min) and B1< B (max) are simultaneously satisfied; setting the value of the position pixel a of each coordinate (X ', Y') in the scaling map to be 1 if the conditions of R1> R (min) and R1< R (max), G1> G (min) and G1< G (max), B1> B (min) and B1< B (max) are simultaneously satisfied; if the conditions of R1> R (min) and R1< R (max), G1> G (min) and G1< G (max), B1> B (min) and B1< B (max) are not satisfied, the pixel a value of each coordinate (X ', Y') in the scaling map is set to be 1. After the logical judgment, the value of the pixel a in the proportional graph becomes 0 or not 0; and (4) carrying out binarization inversion on the pixel a values, wherein all 0 values are changed into 255, and all non-0 values are changed into 0, so as to obtain a first color extraction binary image.
Or, rotating the original image of the detected image every 0.1 degree according to the detection angle range set by the user, and respectively matching the original image with the template images to obtain matching results, wherein the matching results comprise a matching template, a matching position and a matching rotation angle.
Or, a user presets a detection window on the PCB board, and calculates the color area of the substrate in the preset detection window and the area proportion occupying the preset detection window.
In this embodiment, an image of a PCB is obtained, and a grayscale binarization process is performed on the image, or a template matching process is performed on the image, or a color extraction binarization process is performed on the image, or a substrate color area ratio is calculated, so as to facilitate subsequent determination that the PCB is a review board or a destruction board according to a defect type and a severity.
And S13, determining the PCB to be a rechecking board or a destroying board according to the defect type and the defect severity.
In some embodiments, the user can also perform special detection or multiple detections on the PCB by checking the detection defect type. Wherein the defect types include: component missing, component positional offset, component angular deflection, component dimensional difference, component scratching, and component foreign matter.
In some embodiments, the first gray-scale binary image and the first color extraction binary image are respectively processed by a connected region, and a first gray-scale outline area and a first color extraction outline area of the corresponding connected region are calculated;
if the first gray-scale outline area is smaller than a preset area threshold value, determining that the defect type of the PCB is an element missing part; when the defect type of the PCB is determined to be element missing, if the area of the element is smaller than a preset first threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board; the preset first threshold may be set by a user, for example, the preset first threshold is 1/2 of the preset area threshold.
Acquiring an external rectangular area where the area of the element is located, and calculating the offset distance between the central point of the external rectangular area and the central point of the sample; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset gray scale distance threshold value, determining the defect type as element offset; or calculating the offset distance between the center point of the matched template and the center point of the sample; if the offset distance between the center point of the matching template and the center point of the sample is larger than a preset matching distance threshold value, determining the defect type as element offset; when the determined defect type of the PCB is element offset, if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset second threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board. Or if the offset distance between the center point of the matched template and the center point of the sample is greater than a preset third threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board.
In some embodiments, the preset second threshold and the preset third threshold may be set by a user, for example, the preset second threshold is 3/2 of the preset grayscale distance threshold, and the preset third threshold is 3/2 of the preset matching distance threshold.
If the matching rotation angle is larger than a preset deflection angle threshold value, determining the defect type as element deflection; when the determined defect type of the PCB is element deflection, if the matching rotation angle is larger than a preset fourth threshold value, the PCB is judged to be a destruction plate; otherwise, determining the PCB as a rechecking board.
In some embodiments, the preset fourth threshold may be set by the user, for example, the preset fourth threshold is 3/2 of the preset deflection angle.
If the difference between the first gray-scale outline area and the sample area is larger than a preset gray-scale size threshold value, determining that the defect type is an element size difference; or if the difference between the first extraction color outline area and the sample area is larger than a preset extraction color size threshold value, determining that the defect type is the element size difference. When the determined defect type of the PCB is element size difference, if the difference between the first gray-scale outline area and the sample area is larger than a preset fifth threshold value, the PCB is judged to be a destruction plate; otherwise, determining the PCB as a rechecking board. Or if the difference between the first extracting color wheel profile area and the sample area is larger than a preset sixth threshold value, judging that the PCB is a destroying plate; otherwise, determining the PCB as a rechecking board.
In some embodiments, the preset fifth threshold and the preset sixth threshold may be set by a user, for example, the preset fifth threshold may be 3/2 of the preset gray scale size threshold, and the preset sixth threshold may be 3/2 of the preset color extraction size threshold.
If the area of the first gray scale outline is larger than a preset gray scale scratch threshold value, determining that the defect type is element scratch; or if the first color extracting wheel profile area is larger than a preset color extracting scratch threshold value, determining that the defect type is element scratch. When the determined defect type of the PCB is scratch of the element, if the area of the first gray-scale outline is larger than a preset seventh threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board. Or if the first gray scale outline area is larger than a preset eighth threshold value, the PCB is judged to be a destruction plate; otherwise, determining the PCB board as a rechecking board.
In some embodiments, the preset seventh threshold and the preset eighth threshold may be set by a user, for example, the seventh threshold may be 3/2 of the preset grayscale scratch threshold, and the eighth threshold may be 3/2 of the preset color drawing scratch threshold.
If the first gray scale outline area is larger than a preset gray scale foreign matter threshold value, determining that the defect type is an element foreign matter; or if the first extraction color wheel profile area is larger than a preset extraction color foreign matter threshold value, determining that the defect type is an element foreign matter. When the determined defect type of the PCB is an element foreign matter, if the first gray-scale outline area is larger than a preset ninth threshold value, the PCB is judged to be a destruction board; otherwise, determining the PCB as a rechecking board; or if the first color extracting wheel contour area is larger than a preset tenth threshold value, judging that the PCB is a destroying plate; otherwise, determining the PCB board as a rechecking board.
In some embodiments, the preset ninth threshold and the preset tenth threshold may be set by a user, for example, the preset ninth threshold may be 3/2 of the preset grayscale threshold, and the tenth threshold may be 3/2 of the preset threshold of the color bleeding foreign matter.
In some embodiments, a user presets a detection window on the PCB, and calculates the color area size of the substrate in the preset detection window and the area proportion occupying the preset detection window. And if the substrate color area ratio of the preset detection window is larger than a preset substrate color ratio threshold value, determining that the PCB is a destruction board. For example, referring to fig. 2, a preset detection window is defined on the PCB, the preset detection window may be determined by a user, the detection window includes a certain number of elements, and the color of the element is different from the color of the PCB substrate, for example, the element color is blue, and the color of the PCB substrate is green, the green area ratio in the detection window is calculated, and if the ratio is greater than a preset substrate color ratio threshold, the PCB is determined to be a destruction plate.
In the prior art, intelligent defect detection systems such as AOI and ADC are adopted, so that real-time detection of PCB produced on line can be realized, and defects in the production process can be found in time. However, these defect detection techniques can only detect the type of defect and cannot evaluate the severity of the defect.
In this embodiment, a user can detect the defect type and evaluate the defect severity by presetting an area threshold, a gray scale distance threshold, a matching distance threshold, a deflection angle threshold, a color size threshold and a color threshold, and can determine whether the PCB board is a rechecking board or a destroying board according to the defect type and the defect severity, so that the rechecking board and the destroying board can be marked conveniently according to a preset marking mode.
S15, marking the rechecking plate and the destroying plate according to a preset marking mode.
In some embodiments, the preset marking mode marks the review board or the destruction board, including:
and controlling a common pen to print a recheck mark on the designated position on the recheck plate according to the preset reference point and the preset deviation value.
Or controlling a common pen to punch the destruction mark on the destruction plate according to the preset movement track according to the preset reference point and the preset movement track.
Or controlling the laser pen to print the recheck mark on the designated position on the recheck plate according to the preset datum point and the preset deviation value.
Or controlling a laser pen to punch a destruction mark on the destruction plate according to the preset movement track according to the preset reference point and the preset movement track.
In some embodiments, when the adopted marking pen is a common pen, the clamping jaw is controlled by the motion control device to drive the common marking pen to move above the designated position of the rechecking board, and according to the vertical direction motion distance set by a user, the clamping jaw controls the marking pen to perform downward pressing and upward lifting actions in the vertical direction to perform point contact marking, so that the graphs of the respective upper left corners of the daughter board 1 and the daughter board 3 in fig. 3 are formed, and fig. 3 is a marking schematic diagram of the rechecking board. When the marking pen is a laser pen, the laser marking pen is driven to move to the position above the designated position of the reinspection board through the motion control device, the laser pen is controlled to be opened and closed to conduct firing marking, the patterns of the upper left corners of the daughter board 1 and the daughter board 3 in the figure 3 are formed, and the figure 3 is a marking schematic diagram of the reinspection board. When the adopted marking pen is a common pen, the clamping jaw is controlled by the motion control device to drive the common marking pen to move to the position above the reference point of the destruction plate, the clamping jaw controls the marking pen to press down in the direction perpendicular to the reference point of the destruction plate according to the motion track rule set by a user, and then the marking pen moves according to the motion track to form a track graph as shown in fig. 4, wherein fig. 4 is a marking schematic diagram of the destruction plate. When the adopted marking pen is a laser marking pen, the laser pen is controlled to be started at the reference point position of the destruction plate, the motion control device controls and drives the laser marking pen to move according to the motion track rule set by a user, a track graph as shown in fig. 4 is formed, and fig. 4 is a marking schematic diagram of the destruction plate.
In the prior art, although the defect types of the PCB can be detected based on the AOI intelligent defect detection system or the ADC intelligent defect detection system, the detection can only evaluate the defect types of the PCB but cannot evaluate the defect severity of the PCB, and manual re-inspection is required. In this embodiment, mark operation is beaten according to predetermineeing the mark mode to reinspection board and destruction board, the staff who is responsible for the reinspection can see defect type and defect severity at a glance according to the special mark on the PCB board, and destroy the board and probably need abandon, do not need artifical reinspection, in order to improve the detection speed of back process, need mark the destruction board in advance, and sort out reinspection board and destruction board with this, realize the recycle to reinspection board and destruction board, thereby reduce the expense of mill, improve production efficiency.
In some embodiments, referring to fig. 5, controlling a normal pen to mark a review mark on a designated position on the review board, or using the normal pen to mark a destruction mark on the destruction board according to a preset motion trajectory includes:
s151, obtaining the last reinspection plate marked with the reinspection mark or the last destruction plate sample image marked with the destruction mark;
in some embodiments, the motion control device controls the camera to move to the last bad plate marking position, and performs an image capturing operation to obtain a sampling image of the last re-inspection plate marked with the re-inspection mark or a sampling image of the last destruction plate marked with the destruction mark.
And S153, acquiring characteristic information of the sampling image.
In some embodiments, the sampled image is subjected to gray scale binarization processing to obtain a second gray scale binarization image; carrying out contour extraction processing on the second gray-scale binary image to obtain a contour array; taking the maximum outline of the outline array as the outline of the marking point, and calculating the area of the outline;
or, performing color extraction binarization processing on the sampling image to obtain a second color extraction binarization image; carrying out contour extraction processing on the second color-extraction binary image to obtain a circular track;
calculating the area of the circular track to obtain the area percentage of the circular track;
and S155, comparing the characteristic information with preset characteristic information.
In some embodiments, the contour area is compared to a preset area threshold. Or, comparing the area percentage with a preset percentage threshold.
And S157, alarming to remind of replacing the marking pen.
In some embodiments, if the contour area is smaller than the preset area threshold, the test is stopped, and an alarm signal is sent to remind the replacement of the ordinary pen. For example, the preset area threshold is 10 pixels, if the calculated outline area is less than 10 pixels, the test is stopped, and meanwhile, the PLC alarm processing is performed to remind a user to replace the marking pen.
Or if the area percentage is smaller than the preset percentage threshold value, stopping the test, and simultaneously performing PLC alarm processing to remind a user to replace the marking pen.
Through the above description, it is easy to find that when a common pen is used, such as a marker for a rechecking plate or a destroying plate, ink consumption is depleted, and the like, the consumption condition of the common pen is judged based on the comparison between the characteristic information and the preset characteristic information, and an alarm can be given to remind a worker of replacing the common pen based on the consumption condition. Specifically, this embodiment is through obtaining the last sample image of beating the reinspection board of reinspection mark or the last sample image of beating the destruction board of destroying the mark, compare characteristic information with preset characteristic information, judge the consumption condition of ordinary pen, and remind the workman to need to change ordinary marking pen, solved and beaten the mark in-process at consumables such as using ordinary pen, because the unable mark of beating that the ink consumption waits the problem to bring or beat technical problem such as mark unclear, thereby efficiency and the mark precision of beating have been improved.
As shown in fig. 6, based on the same inventive principle, an embodiment of the present invention further provides a defect marking apparatus 60 for a PCB, including:
the image processing module 601 is used for acquiring a PCB image and detecting elements in the image;
the defect judgment module 603 is configured to judge whether the PCB is a review board or a destruction board according to the type and severity of the detection result;
the marking control module 605 is configured to mark the recheck plate or the destruction plate according to a preset marking mode;
it should be noted that, in the embodiment, each module in the defect evaluation apparatus for a PCB corresponds to each step in the defect marking method for a PCB in the foregoing embodiment one by one, and therefore, the specific implementation and the achieved technical effect of the present embodiment may refer to the implementation of the defect marking method for a PCB, which is not described herein again.
As another aspect of the embodiments of the present invention, an embodiment of the present invention provides a defect marking apparatus for a PCB. Referring to fig. 7, which is a schematic diagram of a hardware structure of a defect marking apparatus 70 for a PCB, referring to fig. 7, the defect marking apparatus for a PCB includes: one or more processors 701 and a memory 702, one processor 701 being illustrated in fig. 7.
The processor 701 and the memory 702 may be connected by a bus or other means, such as the bus connection shown in fig. 7.
The memory 702 is a non-volatile computer-readable storage medium and can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as program instructions/modules corresponding to the defect marking device of the PCB in the embodiment of the present application (for example, the image processing module 601, the defect determining module 603, and the marking control module 605 shown in fig. 6). The processor 701 executes various functional applications and data processing of the defect marking device of the PCB by running the nonvolatile software program, instructions and modules stored in the memory 702, that is, the defect marking method of the PCB is implemented according to the above embodiment.
The memory 702 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to use of the controller, and the like. Further, the memory 702 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device. In some embodiments, memory 702 may optionally include memory remotely located from processor 701, which may be connected to a defect marking device of a PCB board over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The one or more modules are stored in the memory 702 and, when executed by the one or more processors 701, perform the defect marking method of the PCB in any of the method embodiments described above, e.g., performing the method steps S11-S15 in fig. 1, S151-S157 in fig. 5 described above; the functionality of blocks 601-605 in fig. 6.
The product can execute the method provided by the embodiment of the application, and has the corresponding functional modules and beneficial effects of the execution method. For technical details that are not described in detail in this embodiment, reference may be made to the methods provided in the embodiments of the present application.
Embodiments of the present invention also provide a non-transitory computer-readable storage medium storing computer-executable instructions for causing a chip to perform the hardware driving method as described above.
An embodiment of the present invention provides a computer program product comprising a computer program stored on a non-volatile computer-readable storage medium, the computer program comprising program instructions that, when executed by a chip, cause the chip to perform the hardware driving method as described above.
The above-described embodiments of the apparatus or device are merely illustrative, wherein the unit modules described as separate parts may or may not be physically separate, and the parts displayed as module units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network module units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment may be implemented by software plus a general hardware platform, and may also be implemented by hardware. Based on such understanding, the above technical solutions substantially or contributing to the related art may be embodied in the form of a software product, which may be stored in a computer-readable storage medium, such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method according to the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A marking method of a PCB is characterized by comprising the following steps:
acquiring image information of a PCB;
determining the defect type and defect severity of the PCB according to the element information in the image information; determining the PCB board to be a rechecking board or a destroying board according to the defect type and the defect severity;
marking the rechecking plate or the destroying plate in a preset marking mode.
2. The method of claim 1, wherein the obtaining image information of the PCB board comprises:
shooting the PCB image;
carrying out gray scale processing on the PCB image to obtain a gray scale image; carrying out binarization processing on the gray scale image to obtain a first gray scale binarization image;
or, carrying out scaling processing on the PCB image to obtain a scaling graph; acquiring the maximum value and the minimum value of the three-color channel pixels in the pixel area in the preset range in the proportional graph; performing logic judgment on the three-color channel pixel value of each coordinate in the proportional graph according to the maximum value and the minimum value of the three-color channel pixel in the pixel area to obtain a pixel a value of the corresponding coordinate; carrying out binarization inversion on the corresponding pixel a value to obtain a first color-extracting binarization image;
or, the image is rotated within a preset angle range according to a preset rotation angle, and is matched with the template image to obtain a matching result, wherein the matching result comprises a matching template, a matching position and a matching rotation angle;
or acquiring the substrate color area proportion of a preset detection window in the PCB image.
3. The method of claim 2, wherein the determining the defect type and defect severity of the PCB board according to the component information in the image information, and the determining the PCB board as a review board or a destruction board according to the defect type and defect severity comprise:
respectively processing the first gray-scale binary image and the first color extraction binary image to obtain a first gray-scale outline area and a first color extraction outline area of the corresponding communication area;
if the first gray scale outline area is smaller than a preset area threshold value, determining that the defect type of the PCB is an element missing part; if the element area is smaller than a preset first threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;
acquiring an external rectangular area where the area of the element is located, and calculating the offset distance between the central point of the external rectangular area and the central point of the sample; if the offset distance between the central point of the external rectangular area and the central point of the sample is greater than a preset gray scale distance threshold value, determining the defect type as element offset; if the offset distance between the center point of the external rectangular area and the center point of the sample is greater than a preset second threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board;
or calculating the offset distance between the center point of the matched template and the center point of the sample; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset matching distance threshold value, determining that the defect type is element offset; if the offset distance between the center point of the matching template and the center point of the sample is greater than a preset third threshold value, determining that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board;
if the matching rotation angle is larger than a preset deflection angle threshold value, determining that the defect type is element deflection; if the matching rotation angle is larger than a preset fourth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board;
if the difference between the first gray scale outline area and the sample area is larger than a preset gray scale size threshold value, determining that the defect type is element size difference; if the difference between the first gray-scale outline area and the sample area is larger than a preset fifth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board;
or if the difference between the first color extraction contour area and the sample area is larger than a preset color extraction size threshold value, determining that the defect type is the element size difference; if the difference between the area of the first color extraction contour and the area of the sample is larger than a preset sixth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB board as a rechecking board;
if the area of the first gray scale outline is larger than a preset gray scale scratch threshold value, determining that the defect type is element scratch; if the area of the first gray-scale outline is larger than a preset seventh threshold value, determining that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;
or if the first color extracting wheel profile area is larger than a preset color extracting scratch threshold value, determining that the defect type is element scratch; if the area of the first gray scale outline is larger than a preset eighth threshold value, judging that the PCB is a destruction board; otherwise, determining the PCB as a rechecking board;
if the area of the first gray scale outline is larger than a preset gray scale foreign matter threshold value, determining that the defect type is an element foreign matter; if the first gray scale outline area is larger than a preset ninth threshold value, judging that the PCB is a destruction plate; otherwise, determining the PCB as a rechecking board;
or if the profile area of the first color extracting wheel is larger than a preset color extracting foreign matter threshold value, determining that the defect type is an element foreign matter; if the first color extracting wheel outline area is larger than a preset tenth threshold value, judging that the PCB is a destroying plate; otherwise, determining the PCB board as a rechecking board;
and if the substrate color area ratio of the preset detection window is larger than a preset substrate color ratio threshold, determining that the PCB is a destruction board.
4. The method of claim 1, wherein the pre-determined marking pattern marks the review board or the destruction board, comprising:
controlling a common pen to print a recheck mark on a designated position on the recheck plate according to a preset datum point and a preset offset value;
or controlling the common pen to punch a destruction mark on the destruction plate according to a preset motion track according to a preset reference point and a preset motion track.
5. The method according to claim 4, wherein the controlling a common pen to print a review mark on a designated position on the review board or to print a destroy mark on the destroy board according to the preset motion track comprises:
acquiring the last reinspection plate marked with the reinspection mark or the last destruction plate sampling image marked with the destruction mark;
and acquiring the characteristic information of the sampled image, comparing the characteristic information with preset characteristic information, and if the comparison result reaches a preset condition, sending an alarm signal to remind the ordinary pen to be replaced.
6. The method according to claim 5, wherein the obtaining of the feature information of the sampled image, comparing the feature information with preset feature information, and if the comparison result reaches a preset condition, sending an alarm signal to remind the replacement of the ordinary pen comprises:
performing gray scale binarization processing on the sampling image to obtain a second gray scale binarization image;
carrying out contour extraction processing on the second gray scale binary image to obtain a contour array;
taking the maximum contour of the contour array as a marking point contour, and calculating the contour area;
and comparing the outline area with a preset area threshold value, and if the outline area is smaller than the preset area threshold value, sending an alarm signal to remind the ordinary pen to be replaced.
7. The method according to claim 6, wherein the obtaining of the feature information of the sampled image, the comparing of the feature information with preset feature information, and the sending of an alarm signal to remind the replacement of the ordinary pen if the comparison result meets a preset condition further comprises:
performing color extraction binarization processing on the sampling image to obtain a second color extraction binarization image;
carrying out contour extraction processing on the second color extraction binary image to obtain a circular track;
calculating the area of the circular track to obtain the area percentage of the circular track;
and comparing the area percentage with a preset percentage threshold, and if the area percentage is smaller than the preset percentage threshold, sending an alarm signal to remind the ordinary pen to be replaced.
8. The method of claim 1, wherein the predetermined marking pattern marks the review board or the destruction board, further comprising:
controlling a laser pen to print a recheck mark on a specified position on the recheck plate according to a preset reference point and a preset deviation value;
or controlling the laser pen to punch a destruction mark on the destruction plate according to a preset movement track according to a preset reference point and a preset movement track.
9. The method of any of claims 1-8, wherein the PCB board is a full board comprised of a plurality of sub-boards or a single sub-board.
10. A defect marking device of a PCB board, characterized in that, defect marking device includes: a memory having a computer program stored therein and a processor executing the computer program to implement the method of any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210846679.0A CN115283835B (en) | 2022-07-05 | 2022-07-05 | Defect marking method and device for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210846679.0A CN115283835B (en) | 2022-07-05 | 2022-07-05 | Defect marking method and device for PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115283835A true CN115283835A (en) | 2022-11-04 |
| CN115283835B CN115283835B (en) | 2023-10-20 |
Family
ID=83824756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210846679.0A Active CN115283835B (en) | 2022-07-05 | 2022-07-05 | Defect marking method and device for PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115283835B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116503401A (en) * | 2023-06-26 | 2023-07-28 | 成都数联云算科技有限公司 | PCB (printed circuit board) connection board target detection method, device, equipment and medium |
| CN117169336A (en) * | 2023-09-07 | 2023-12-05 | 常熟中佳新材料有限公司 | Copper pipe defect marking system of copper pipe rewinder |
| CN117169246A (en) * | 2023-09-01 | 2023-12-05 | 深圳市索亿电子有限公司 | Fault detection method and device for PCBA circuit board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08180191A (en) * | 1994-10-25 | 1996-07-12 | Fuji Mach Mfg Co Ltd | Device and method for processing image |
| CA2174179A1 (en) * | 1995-04-14 | 1996-10-15 | Yoshie Nakata | Liquid Ejecting Head, Liquid Ejecting Device and Liquid Ejecting Method |
| US20060257015A1 (en) * | 2005-03-17 | 2006-11-16 | Omron Corporation | Board inspection apparatus and method and apparatus for setting inspection logic thereof |
| CN101121330A (en) * | 2006-08-11 | 2008-02-13 | 精工爱普生株式会社 | A liquid container having a bubble trapping passage and detection unit |
| US20100253732A1 (en) * | 2009-04-07 | 2010-10-07 | Xerox Corporation | System And Method For Detecting Weak And Missing Ink Jets In An Ink Jet Printer |
| CN110446023A (en) * | 2018-05-04 | 2019-11-12 | 深圳市圆周率软件科技有限责任公司 | Detect the method and detection system of electronic ink screen |
| CN114216915A (en) * | 2021-12-15 | 2022-03-22 | 江门市浩远科技有限公司 | Method for detecting and classifying types of stains and defects of circuit board based on class level |
| US20220309639A1 (en) * | 2019-12-30 | 2022-09-29 | Goertek Inc. | Product defect detection method, device and system |
-
2022
- 2022-07-05 CN CN202210846679.0A patent/CN115283835B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08180191A (en) * | 1994-10-25 | 1996-07-12 | Fuji Mach Mfg Co Ltd | Device and method for processing image |
| CA2174179A1 (en) * | 1995-04-14 | 1996-10-15 | Yoshie Nakata | Liquid Ejecting Head, Liquid Ejecting Device and Liquid Ejecting Method |
| US20060257015A1 (en) * | 2005-03-17 | 2006-11-16 | Omron Corporation | Board inspection apparatus and method and apparatus for setting inspection logic thereof |
| CN101121330A (en) * | 2006-08-11 | 2008-02-13 | 精工爱普生株式会社 | A liquid container having a bubble trapping passage and detection unit |
| US20100253732A1 (en) * | 2009-04-07 | 2010-10-07 | Xerox Corporation | System And Method For Detecting Weak And Missing Ink Jets In An Ink Jet Printer |
| CN110446023A (en) * | 2018-05-04 | 2019-11-12 | 深圳市圆周率软件科技有限责任公司 | Detect the method and detection system of electronic ink screen |
| US20220309639A1 (en) * | 2019-12-30 | 2022-09-29 | Goertek Inc. | Product defect detection method, device and system |
| CN114216915A (en) * | 2021-12-15 | 2022-03-22 | 江门市浩远科技有限公司 | Method for detecting and classifying types of stains and defects of circuit board based on class level |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116503401A (en) * | 2023-06-26 | 2023-07-28 | 成都数联云算科技有限公司 | PCB (printed circuit board) connection board target detection method, device, equipment and medium |
| CN116503401B (en) * | 2023-06-26 | 2023-09-22 | 成都数联云算科技有限公司 | PCB (printed circuit board) connection board target detection method, device, equipment and medium |
| CN117169246A (en) * | 2023-09-01 | 2023-12-05 | 深圳市索亿电子有限公司 | Fault detection method and device for PCBA circuit board |
| CN117169336A (en) * | 2023-09-07 | 2023-12-05 | 常熟中佳新材料有限公司 | Copper pipe defect marking system of copper pipe rewinder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115283835B (en) | 2023-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115283835A (en) | Defect marking method and device for PCB | |
| CN109767445B (en) | High-precision PCB defect intelligent detection method | |
| CN112577969B (en) | Defect detection method and defect detection system based on machine vision | |
| CN111537517A (en) | Unmanned intelligent stamping defect identification method | |
| WO2017080282A1 (en) | Circuit board inspection method and apparatus | |
| CN109829911B (en) | PCB surface detection method based on contour out-of-tolerance algorithm | |
| CN112053318A (en) | Two-dimensional PCB defect real-time automatic detection and classification device based on deep learning | |
| CN113325001A (en) | Automatic distinguishing and detecting equipment and method for surface appearance flaws of copper foil | |
| CN116168218A (en) | Circuit board fault diagnosis method based on image recognition technology | |
| CN114612471B (en) | Method for detecting surface defects of complex-texture ceramic tiles | |
| JP2007285880A (en) | Sample image registration method in board inspection, and sample image producing system | |
| CN114813783A (en) | Chip surface flaw detection method | |
| CN114066890A (en) | Gear defect detection method and device, computer equipment and storage medium | |
| CN109086643B (en) | Color box label detection method and system based on machine vision | |
| CN107797517B (en) | Method and system for realizing steel belt punching processing detection by adopting machine vision | |
| CN114226262A (en) | Flaw detection method, flaw classification method and flaw detection system | |
| CN116681677A (en) | Lithium battery defect detection method, device and system | |
| CN115546140A (en) | Display panel detection method and system and electronic device | |
| KR20190119801A (en) | Vehicle Headlight Alignment Calibration and Classification, Inspection of Vehicle Headlight Defects | |
| TWI722861B (en) | Classification method and a classification system | |
| CN112288782A (en) | PCB defect detection method based on boundary segment number value | |
| CN115375610A (en) | Detection method and device, detection equipment and storage medium | |
| CN114392940A (en) | Stitch detection method and device for special-shaped component | |
| CN113628232A (en) | Method for eliminating interference points in fit line, visual recognition equipment and storage medium | |
| JP5133762B2 (en) | Golf ball appearance inspection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518000 Floor 5-6, Unit B, Building B4, Guangming Science Park, China Merchants Bureau, Fenghuang Community, Fenghuang Street, Guangming District, Shenzhen, Guangdong Patentee after: Shenzhen Mingrui Ideal Technology Co.,Ltd. Country or region after: China Address before: 518000 floor 6, unit B, building B4, Guangming science and Technology Park, China Merchants Bureau, sightseeing Road, Fenghuang community, Fenghuang street, Guangming District, Shenzhen, Guangdong Province Patentee before: SHENZHEN MAGIC-RAY TECHNOLOGY Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |