CN115274494A - Integrated circuit packaging part pin forming device for multi-station processing - Google Patents
Integrated circuit packaging part pin forming device for multi-station processing Download PDFInfo
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- CN115274494A CN115274494A CN202210719395.5A CN202210719395A CN115274494A CN 115274494 A CN115274494 A CN 115274494A CN 202210719395 A CN202210719395 A CN 202210719395A CN 115274494 A CN115274494 A CN 115274494A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses an integrated circuit packaging part pin forming device for multi-station processing, which comprises a lower bending die for placing a packaging part, an upper bending die for bending the packaging part pin and a guide assembly connected between the upper bending die and the lower bending die, wherein the upper bending die slides along the guide assembly, and the upper bending die corresponds to the lower bending die and is provided with a bending cavity; the upper bending die comprises an upper pressing seat, a plurality of groups of elastic pressing assemblies arranged in the upper pressing seat and a bending knife edge arranged at the side of the bottom end of the upper pressing seat, and the bending knife edge corresponds to the bending cavity; the device structure is reliable, and performance is good, and is easy and simple to handle, has effectively improved integrated circuit packaging part pin fashioned machining efficiency of bending, has avoided simultaneously pressing when bending the pin of integrated circuit packaging part and has hindered the pin and cause signal transmission's unstability to satisfy signal transmission's stability needs.
Description
Technical Field
The invention relates to the technical field of electric element manufacturing, in particular to an integrated circuit packaging part pin forming device for multi-station processing.
Background
The integrated circuit package is a common electronic component used on an airplane flight control computer, and because certain vibration is generated in the airplane flight, in order to avoid the disconnection of the internal circuit of the electronic component caused by the vibration, the working part of the electronic component is packaged into a whole by adopting a packaging material, only 3 pin wires are reserved as the input and the output of an electric signal, and a through hole with the diameter of 3.2mm is reserved on the integrated circuit package body as a mounting hole for fixing the integrated circuit on a circuit board. Three pins of the integrated circuit package are made of silver-plated copper plates with the thickness of 0.6mm, the width of 1mm (the width of the root part is 2mm, and the length of 3.5 mm) and the length of 20mm, and the silver-plated copper plates can be inserted into corresponding jacks on a circuit board to work. Because the integrated circuit package is installed on different circuit boards at different installation positions and in different forms, three pins of the integrated circuit package are processed into a shape of minus and the length of the three pins is 20mm in mass production, and the three pins of the integrated circuit package can be trimmed or bent into a shape suitable for the installation of the circuit board according to the actual situation of the circuit board during specific use.
Among the prior art, the work of bending into L shape to the pin of integrated circuit packaging part adopts the manual bending of curved wire pincers by the master worker of a worker that operating skill is super, nevertheless there is the problem of following triplex in manual bending: 1. the bending forming efficiency is too low to meet the quantity required by production; 2. the manual bending has poor size consistency, and causes difficulty in subsequent installation; 3. manual bending is difficult to achieve qualified requirements through one-time bending, and pins are often required to be bent repeatedly, so that the internal organization structure of the pin material is changed to a certain extent, and the stability of input and output electric signals is influenced to a certain extent.
Disclosure of Invention
The invention aims to provide an integrated circuit packaging part pin forming device for multi-station processing, which aims to solve the problems of low efficiency and high difficulty in the bending forming processing of the pins of the existing integrated circuit packaging part.
The technical scheme for solving the technical problems is as follows: the integrated circuit packaging part pin forming device for multi-station processing comprises a lower bending die for placing a packaging part, an upper bending die for bending the packaging part pin and a guide assembly connected between the upper bending die and the lower bending die, wherein the upper bending die slides along the guide assembly, and the upper bending die corresponds to the lower bending die and is provided with a bending cavity;
the upper bending die comprises an upper pressing seat, a plurality of groups of elastic pressing assemblies arranged inside the upper pressing seat and a bending knife edge arranged on the side of the bottom end of the upper pressing seat, and the bending knife edge corresponds to the bending cavity.
Furthermore, the suppressing component comprises a plug screw and a pressing block which are respectively arranged in the cavity inside the upper pressing seat and a pressure spring arranged between the plug screw and the pressing block, and the bottom of the pressing block extends out of the bottom surface of the upper pressing seat.
Further, the briquetting is including the cylinder that is the cylinder structure and set up the layering that just is the cuboid structure in the cylinder below, with pressure spring's end connection on the cylinder, the bottom surface of last pressure seat is stretched out to the bottom of layering.
Furthermore, the lower bending die comprises a positioning seat, a limiting assembly arranged on the positioning seat and used for limiting the packaging part and a boss arranged on the side of the positioning seat and used for placing pins of the packaging part, the bending cavity is located on the side of the positioning seat, and the limiting assembly corresponds to the pressing block.
Further, spacing subassembly is formed with between the adjacent spacing boss and is used for spacing chamber to packaging part circumference including setting up a plurality of spacing posts and a plurality of spacing boss on the positioning seat respectively, and spacing post is connected with the through-hole cooperation on the packaging part.
Further, the height of the part for limiting the position of the packaging part on the limiting boss is higher than the thickness of the packaging part.
Furthermore, the guide assembly comprises a guide post arranged between the upper pressure seat and the positioning seat and a thrust spring sleeved on the guide post, one end of the thrust spring is connected with the upper pressure seat, and the other end of the thrust spring is connected with the positioning seat.
Furthermore, the corners of the lug boss of the lower bending die, which are used for supporting the pins of the packaging part, are set to be smooth arc surfaces, and the radius of each arc surface is 0.8.
Furthermore, a bending knife edge of the upper bending die is provided with a smooth arc surface for pressing and bending the pins of the packaging part, and the radius of the arc surface is 0.5.
Further, a gland is arranged on the upper pressure seat.
The invention has the following beneficial effects: the invention provides an integrated circuit package pin forming device for multi-station processing,
(1) The structure is reliable, the use performance is good, and according to the size and shape characteristics of the integrated circuit packaging piece, the hole positioning and the circumferential ring surface positioning are adopted, so that the stability of the packaging piece pins placed on the positioning seats is greatly improved;
(2) According to the invention, the lower bending die and the upper bending die are connected into a whole by adopting two groups of guide assemblies, a thrust spring is arranged outside the guide post, and after the whole device finishes the bending work of the pins of the integrated circuit packaging part, the thrust spring pushes the lower bending die and the upper bending die away along the guide post when the external force is removed, so that the integrated circuit packaging part can be taken out and a new integrated circuit packaging part can be loaded into the integrated circuit packaging part for the bending work of the pins of the next batch of integrated circuit packaging parts, and the working efficiency is high;
(3) According to the invention, the slidable press block is added on the upper bending die, so that when the upper bending die is pressed down, the press block can pre-press the pins of the integrated circuit packaging part, and the condition that the integrated circuit pins are stressed to cause open circuit in the pressing process of the upper bending die is avoided. Meanwhile, the spring arranged on the upper part of the pressing block can pre-adjust the pressure of the pressing block on the pins of the integrated circuit package, so that the pressure is in the optimal state when the pressing block presses the pins of the integrated circuit package, the pins of the integrated circuit package cannot be crushed due to too large pressure, and the situation that the pins move due to stress when the pins of the integrated circuit package are bent under the combined action of the upper bending die and the lower bending die due to too small pressure is avoided;
(4) According to the invention, the bending knife edge of the upper bending die and the boss corner of the lower bending die are both arranged to be arc surface structures, so that the stability of electric signal transmission is facilitated, and the instability of electric signal transmission caused by crushing pins when the upper bending die bends the pins of the integrated circuit packaging part is avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a side view of an integrated circuit package pin forming apparatus according to the present invention;
FIG. 3 is a schematic cross-sectional view taken along line B-B in FIG. 2;
FIG. 4 is a schematic cross-sectional view taken along line C-C of FIG. 2;
FIG. 5 is a schematic diagram of a compact structure according to the present invention;
FIG. 6 is a side view of the integrated circuit package with the molding apparatus positioned vertically prior to bending the pins of the package in accordance with the present invention;
FIG. 7 is an isometric view of an IC package pin prior to being bent and loaded into a molding apparatus in accordance with the present invention;
FIG. 8 is an isometric view of the integrated circuit package of the present invention in a ready to process position in the molding apparatus;
FIG. 9 is a side view of the press block having pressed against the leads before the leads of the IC package are bent, but the upper bending die has not yet contacted the leads in accordance with the present invention;
FIG. 10 is a side view of the press block having pressed against the leads during bending of the integrated circuit package pins and the upper bending die having just contacted the leads in accordance with the present invention;
FIG. 11 is a side view of the upper bending mold pressing to the bottom end during the bending molding of the IC package pins according to the present invention;
FIG. 12 is a side view of the die returning to its initial position under the action of the thrust spring when the external force is removed after the integrated circuit package pin is bent and molded in accordance with the present invention;
fig. 13 is a side view of the integrated circuit package taken out from the gap between the upper bending die and the lower bending die after the integrated circuit package pins are bent according to the present invention.
The reference numerals shown in fig. 1 to 13 are respectively expressed as: 1-lower bending die, 2-upper bending die, 3-guide assembly, 4-bending cavity, 20-upper pressing seat, 21-elastic pressing assembly, 22-bending knife edge, 210-plug screw, 211-pressing block, 212-pressure spring, 2110-cylinder, 2111-pressing strip, 10-positioning seat, 11-limiting assembly, 12-boss, 110-limiting column, 111-limiting boss, 30-guide column, 31-thrust spring and 23-pressing cover.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
As shown in fig. 1 to 13, an integrated circuit package pin forming device for multi-station processing includes a lower bending die 1 for placing a package, an upper bending die 2 for bending a package pin, and a guide assembly 3 connected between the upper bending die 2 and the lower bending die 1, wherein the upper bending die 2 slides along the guide assembly 3, the upper bending die 2 corresponds to the lower bending die 1 and is formed with a bending cavity 4, and a pressing cover 23 is arranged on an upper pressing base 20. The guide assemblies 3 are two groups and are respectively positioned on two sides of the lower bending die 1 and the upper bending die 2, and the upper bending die 2 can slide up and down conveniently through the guide assemblies 3. Along with the continuous downward movement of the upper bending die 2, the bending knife edge 22 of the upper bending die 2 and the bending knife edge 22 of the lower bending die 1 jointly act to complete the bending and forming work of the integrated circuit package part pins.
The upper bending die 2 comprises an upper pressing base 20, a plurality of groups of elastic pressing assemblies 21 arranged in the upper pressing base 20 and a bending knife edge 22 arranged on the side of the bottom end of the upper pressing base 20, and the bending knife edge 22 corresponds to the bending cavity 4. The elastic pressing components 21 can be one group, two groups or multiple groups, and are installed according to actual use requirements. For example: when the number of the elastic pressing assemblies 21 is three, the three pressing blocks 211 of the device independently press the pins of one group of integrated circuit packaging parts when working, so that the pins of one group or two groups or three groups of integrated circuit packaging parts can be bent at one time, and the situation that only the pins of one group of integrated circuit packaging parts are required to be bent or the pins of two groups of integrated circuit packaging parts are required to be bent in a batch of processing can not be caused.
The elastic pressing component 21 comprises a plug screw 210 and a pressing block 211 which are respectively arranged in a cavity inside the upper pressing seat 20, and a pressure spring 212 arranged between the plug screw 210 and the pressing block 211, wherein the bottom of the pressing block 211 extends out of the bottom surface of the upper pressing seat 20, so that before a bending knife edge 22 part for bending at the lower end surface of the upper bending die 2 contacts with an integrated circuit package pin, the pressing block 211 and the upper end surface of the lower bending die 1 compress the integrated circuit package pin together, along with the continuous downward movement of the upper bending die 2, the bending knife edge 22 of the upper bending die 2 and the bending knife edge 22 of the lower bending die 1 jointly act to complete the bending forming work of the integrated circuit package pin, then the pressure applied on the pressing block is removed, the upper bending die 2 pushes the upper bending die 2 to move upwards along the guide column 30 under the action of the thrust spring 31 to complete the automatic separation of the upper bending die 2 and the lower bending die 1, and the integrated circuit package is manually taken down from the bending cavity 4 between the upper bending die 2 and the lower bending die 1. In addition, the pressing block 211 is adopted to pre-press the pins of the integrated circuit package part to be bent, so that when the pins of the integrated circuit package part are bent under the combined action of the upper bending die 2 and the lower bending die 1, the pressing block 211 can pre-press the pins of the integrated circuit package part, and the situation that the integrated circuit pins are stressed to cause open circuit in the process of pressing down the upper bending die 2 is avoided. Meanwhile, the upper part of the pressing block 211 is provided with a spring and a screw plug 210 which can pre-adjust the pressure applied by the pressing block 211 on the pins of the integrated circuit package, so that the pressure is in the best state when the pressing block 211 presses the pins of the integrated circuit package, the pins of the integrated circuit package cannot be crushed due to too large pressure, and the situation that the pins are stressed to move when the pins of the integrated circuit package are bent under the combined action of the upper bending die 2 and the lower bending die 1 due to too small pressure is avoided. After the pressing block 211 compresses the pins of the integrated circuit package together with the upper end face of the lower bending die 1, when the upper bending die 2 continues to move downwards to bend the pins of the integrated circuit package, the pressing block 211 can slide in the cavity inside the upper bending die 2, so that the pressing block 211 cannot block the downward movement of the upper bending die 2, and can keep the compression state of the pins of the integrated circuit package. When the external force is removed, the pressing block 211 slides to the original position along the cavity inside the upper bending die 2 under the pressure of the pressure spring 212. The initial pressure exerted on the pressing block 211 by the pressure spring 212 can be adjusted by the screw plug 210 at the upper end of the pressure spring 212.
As shown in fig. 5, the pressing block 211 includes a cylinder 2110 having a cylindrical structure and a pressing bar 2111 disposed below the cylinder 2110 and having a rectangular parallelepiped structure, the cylinder 2110 is connected to an end of the pressure spring 212, and a bottom end of the pressing bar 2111 extends out of a bottom surface of the upper pressing seat 20. The cuboid at the lower end of the pressing block 211 can be consistent with the shape of the top end of the lower bending die 1, pins of an integrated circuit package piece are well pressed, and the upper end of the pressing block 211 is a cylinder and is convenient for installing the pressure spring 212.
The lower bending die 1 comprises a positioning seat 10, a limiting assembly 11 arranged on the positioning seat 10 and used for limiting the packaging part, and a boss 12 arranged on the side of the positioning seat 10 and used for placing pins of the packaging part, wherein a bending cavity 4 is arranged on the side of the positioning seat 10, and the limiting assembly 11 and a pressing block 211 correspond to each 3 groups. The limiting assembly 11 comprises a plurality of limiting columns 110 and a plurality of limiting bosses 111 which are respectively arranged on the positioning seat 10, a limiting cavity for limiting the circumferential direction of the packaging part is formed between the adjacent limiting bosses 111, and the limiting columns 110 are matched and connected with through holes in the packaging part. The limiting columns 110 and the limiting bosses 111 are positioning pins, the positions of the integrated circuit packaging parts placed on the lower bending die 1 are determined by inserting the limiting columns 110 installed on the lower bending die 1 into through holes with the diameter of 3.2mm in the integrated circuit packaging parts, after the integrated circuit packaging parts are positioned by the limiting columns 110, the integrated circuit packaging parts can only rotate by taking the limiting columns 110 as circle centers, meanwhile, the circumference of the integrated circuit packaging parts is limited by limiting cavities formed among the limiting bosses 111, so that the integrated circuit packaging parts are limited in a specified area, in addition, when the upper bending die 2 moves downwards to enable pressing blocks 211 to be in contact with pins of the integrated circuit packaging parts, the pins of the integrated circuit packaging parts continuously move downwards to realize a clamping function, the pins of the integrated circuit packaging parts can be bent by continuously moving downwards the subsequent upper bending die 2, a three-way limiting structure is formed, the pins of the integrated circuit packaging parts are bent at the moment, and the size consistency after the pins are bent and formed can be ensured. In addition, the height of the part for limiting the position of the package on the limiting boss 111 is higher than the thickness of the package, that is, the upper end of the limiting column 110 is higher than the upper end of the integrated circuit package, so that the upper bending die 2 is prevented from continuously descending when the upper bending die 2 descends to contact with the top end of the limiting boss 111, and the integrated circuit package is prevented from being crushed when the upper bending die 2 descends. The limiting boss 111 not only limits the rotation of the integrated circuit package, so that the integrated circuit package is limited at a fixed position, and the sizes of the L-shaped pins of the integrated circuit package processed by the device are consistent, but also plays a role in protecting the integrated circuit package from being crushed by the upper bending die 2. The limiting bosses 111 respectively limit the integrated circuit package in the circumferential direction from two sides, and belong to over-positioning, so that processing errors caused by the fact that an operator does not pay attention to the deflection of the integrated circuit package when one limiting boss 111 is adopted can be effectively avoided, and the over-positioning mode can ensure that the integrated circuit package is placed in an allowed range, namely the integrated circuit package is allowed to deflect in a range meeting the use requirements.
The guiding assembly 3 comprises a guiding column 30 arranged between the upper pressing seat 20 and the positioning seat 10 and a thrust spring 31 sleeved on the guiding column 30, wherein one end of the thrust spring 31 is connected with the upper pressing seat 20, and the other end is connected with the positioning seat 10. Adopt two sets of guide assembly 3 to bend mould 1 and the mould 2 of bending on with down and link into a whole, install a thrust spring 31 outside guide post 30, accomplish the work of bending to integrated circuit packaging part pin at whole device after, thrust spring 31 pushes down mould 1 of bending and mould 2 of bending on along guide post 30 when unloading external force and pushes open, so that take out the integrated circuit packaging part and pack into new integrated circuit packaging part and carry out the work of bending of next batch of integrated circuit packaging part pin, and the work efficiency is improved, and the processing time is saved.
The corner of the boss 12 of the lower bending die 1, which is used for supporting the pins of the packaging part, is set to be a smooth arc surface, the radius of the arc surface is 0.8, the bending knife edge 22 of the upper bending die 2 is provided with the smooth arc surface used for pressing and bending the pins of the packaging part, and the radius of the arc surface is 0.5. The bending knife edge 22 of the upper bending die 2 and the corner of the boss 12 of the lower bending die 1 are both set to be arc surface structures, so that the stability of electric signal transmission is facilitated, and the instability of electric signal transmission caused by the fact that the pins are crushed by the upper bending die 2 when the pins of the integrated circuit packaging part are bent is avoided.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The integrated circuit packaging part pin forming device for multi-station processing is characterized by comprising a lower bending die (1) for placing a packaging part, an upper bending die (2) for bending the packaging part pin and a guide assembly (3) connected between the upper bending die (2) and the lower bending die (1), wherein the upper bending die (2) slides along the guide assembly (3), and the upper bending die (2) corresponds to the lower bending die (1) and is provided with a bending cavity (4);
the upper bending die (2) comprises an upper pressing seat (20), a plurality of groups of elastic pressing assemblies (21) arranged in the upper pressing seat (20) and a bending knife edge (22) arranged at the bottom end edge side of the upper pressing seat (20), and the bending knife edge (22) corresponds to the bending cavity (4).
2. The device for forming the pins of the ic package for the multi-station processing according to claim 1, wherein the pressing assembly (21) comprises a plug screw (210) and a pressing block (211) respectively disposed in a cavity inside the upper pressing base (20), and a pressure spring (212) disposed between the plug screw (210) and the pressing block (211), and a bottom of the pressing block (211) protrudes from a bottom surface of the upper pressing base (20).
3. The device for forming the pin of the ic package for the multi-station process according to claim 2, wherein the pressing block (211) includes a cylinder (2110) having a cylindrical structure and a pressing strip (2111) disposed below the cylinder (2110) and having a rectangular parallelepiped structure, the cylinder (2110) is connected to an end of the pressure spring (212), and a bottom end of the pressing strip (2111) extends out of a bottom surface of the upper pressing seat (20).
4. The device for forming the pins of the integrated circuit package for the multi-station processing according to claim 2, wherein the lower bending die (1) comprises a positioning seat (10), a limiting component (11) which is arranged on the positioning seat (10) and used for limiting the package, and a boss (12) which is arranged at the side of the positioning seat (10) and used for placing the pins of the package, the bending cavity (4) is located at the side of the positioning seat (10), and the limiting component (11) corresponds to the pressing block (211).
5. The device for forming the pins of the multi-station processing ic package piece according to claim 4, wherein the limiting component (11) includes a plurality of limiting posts (110) and a plurality of limiting bosses (111) respectively disposed on the positioning seat (10), a limiting cavity for limiting the circumferential direction of the package piece is formed between adjacent limiting bosses (111), and the limiting posts (110) are connected to the through holes of the package piece in a fitting manner.
6. The device for forming the leads of the IC packages according to claim 5, wherein the height of the position limiting portions of the limiting bosses (111) is higher than the thickness of the packages.
7. The device for forming the pins of the integrated circuit package for the multi-station processing according to claim 5 or 6, wherein the guide assembly (3) comprises a guide post (30) disposed between the upper pressing seat (20) and the positioning seat (10) and a thrust spring (31) sleeved on the guide post (30), and one end of the thrust spring (31) is connected with the upper pressing seat (20), and the other end is connected with the positioning seat (10).
8. The device for forming the pins of the integrated circuit package for the multi-station processing according to claim 4, wherein the corners of the bosses (12) of the lower bending die (1) for supporting the pins of the package are smooth arc surfaces, and the radius of the arc surfaces is 0.8.
9. The device for forming the pins of the integrated circuit package for the multi-station processing according to claim 1, wherein the bending knife edge (22) of the upper bending die (2) is provided with a smooth arc surface for pressing and bending the pins of the package, and the radius of the arc surface is 0.5.
10. The device for forming the leads of the ic packages for multi-station processing according to claim 1, wherein the upper pressing base (20) is provided with a pressing cover (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210719395.5A CN115274494A (en) | 2022-06-23 | 2022-06-23 | Integrated circuit packaging part pin forming device for multi-station processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210719395.5A CN115274494A (en) | 2022-06-23 | 2022-06-23 | Integrated circuit packaging part pin forming device for multi-station processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115274494A true CN115274494A (en) | 2022-11-01 |
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ID=83762623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210719395.5A Pending CN115274494A (en) | 2022-06-23 | 2022-06-23 | Integrated circuit packaging part pin forming device for multi-station processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115274494A (en) |
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2022
- 2022-06-23 CN CN202210719395.5A patent/CN115274494A/en active Pending
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