CN115266948B - High-frequency thin-film ultrasonic transducer and preparation method thereof - Google Patents
High-frequency thin-film ultrasonic transducer and preparation method thereof Download PDFInfo
- Publication number
- CN115266948B CN115266948B CN202211145215.3A CN202211145215A CN115266948B CN 115266948 B CN115266948 B CN 115266948B CN 202211145215 A CN202211145215 A CN 202211145215A CN 115266948 B CN115266948 B CN 115266948B
- Authority
- CN
- China
- Prior art keywords
- film
- ultrasonic transducer
- electrode
- metal ring
- flexible piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention discloses a high-frequency thin-film ultrasonic transducer and a preparation method thereof. The invention takes the cured epoxy resin as a backing material, the piezoelectric layer adopts a flexible piezoelectric film, a metal ring is utilized to design a lead-out wire and avoid the contact of an upper electrode and a lower electrode of the film, and then the epoxy resin is used for encapsulating an internal structure and an external conductive shell. The invention solves the problems that the flexible piezoelectric film plated with the electrodes is easy to cause short circuit of an upper electrode and a lower electrode when being cut, the thin film is not beneficial to the processing of the transducer and the lead of the high-frequency film ultrasonic transducer is difficult to be led out, and the prepared high-frequency Bao Mochao ultrasonic transducer has higher frequency and wider bandwidth and can be directly applied to ultrasonic detection equipment.
Description
Technical Field
The invention relates to the field of semiconductor devices, in particular to a high-frequency thin-film ultrasonic transducer and a preparation method thereof.
Background
In recent years, ultrasonic detection equipment plays an important role in the fields of biomedical imaging, industrial nondestructive testing and the like, and particularly has wide application prospects and great industrialization requirements in the aspects of histopathology, cytology research and semiconductor defect detection. The core device of the ultrasonic detection equipment is an ultrasonic transducer, generally speaking, the key of the ultrasonic detection equipment for obtaining high-resolution imaging depends on the frequency and bandwidth of the sensor, the high frequency can realize fine detection on a small target, the detection precision and the resolution are improved, meanwhile, the detection dead angle is reduced, and the detection range is increased. At present, no mature enterprises and products related to the high-frequency ultrasonic transducer exist in China, related core technologies and markets are monopolized by foreign enterprises all the time, and the development of high-resolution ultrasonic detection equipment in China is restricted.
In order to meet the research and development requirements of high-performance high-frequency ultrasonic transducer devices, a preparation method which is excellent in sound radiation characteristics and convenient in manufacturing process is urgently needed. In recent years, many researchers at home and abroad try to prepare high-frequency ultrasonic transducers by using flexible thin-film piezoelectric materials with excellent service performance, such as PVDF thin films, P (VDF-TrFE) thin films and the like, the high-frequency ultrasonic transducers are low in acoustic impedance and high in receiving sensitivity, and the high-frequency ultrasonic transducers can be particularly used as receiving sensors of transmission-type ultrasonic detection equipment. However, the thin film used in the manufacture of the high-frequency ultrasonic transducer is thin, and in the process of processing and preparation, there are many problems, such as easy conduction of the upper and lower electrodes due to the toughness of the edge when the thin film after being plated with the electrode is cut, difficult extraction of the whole electrode lead, and other process design problems, so that the production is difficult. Therefore, the method for designing the high-frequency thin-film ultrasonic transducer has very important research significance and practical value.
Disclosure of Invention
The invention aims to provide a relatively simple high-frequency film ultrasonic transducer and a preparation method thereof aiming at the relevant difficulties of the preparation process of the current high-frequency film ultrasonic transducer, which can effectively avoid the problems of difficult processing of a film with small thickness and conduction of an upper electrode and a lower electrode, and the prepared ultrasonic transducer can be directly applied to ultrasonic detection equipment.
The purpose of the invention is realized by the following technical scheme:
a method for manufacturing a high-frequency thin-film ultrasonic transducer comprises the following steps:
obtaining an insulating cylinder and a flexible piezoelectric film with a polarized single-sided plated electrode; the area of the flexible piezoelectric film with the polarized single-sided plated electrode is larger than the area of the end face of the insulating cylinder;
one surface of the flexible piezoelectric film electrode is coaxially fixed with the end face of the insulating cylinder;
sleeving a metal ring on the insulating column and adhering the metal ring with conductive silver paste, wherein the area of the flexible piezoelectric film of the polarized single-sided plated electrode is larger than that of the metal ring and the flexible piezoelectric film can completely cover the edge of the metal ring; then turning up the redundant part of the flexible piezoelectric film and fixing the redundant part outside the metal ring;
one side of the sample flexible piezoelectric film after the metal ring is fixed is adhered to the micro-adhesive tape for fixing, and meanwhile, the metal shell of the ultrasonic transducer is sleeved outside the sample and is adhered to the micro-adhesive tape for fixing; connecting a lead part of the coaxial cable with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, and connecting a ground wire with a metal shell; the coaxial cable is an electrode lead-out wire of the ultrasonic transducer, and the other end of the coaxial cable can be connected to an interface required by equipment, such as an SMA interface and the like, by using conductive silver paste;
and (3) packaging the ultrasonic transducer structure in the metal shell after the electrodes are led out, removing the micro adhesive tape, manufacturing another electrode on one surface of the flexible piezoelectric film, and packaging the waterproof film after the manufacturing is finished to obtain the high-frequency film ultrasonic transducer.
Further, the insulating cylinder is made of 301 epoxy AB glue, and the quantity ratio of the AB glue of 301 epoxy is 4:1. The 301 epoxy resin has lower acoustic impedance, can effectively transfer the energy of ultrasonic waves, improves the performance of the ultrasonic transducer, and specifically, the 301 epoxy resin AB glue is uniformly mixed in proportion, vacuumized to discharge air bubbles, and kept stand for 24 h to be cured.
And further, one surface of the flexible piezoelectric film electrode is coaxially fixed with the end face of the insulating cylinder by adopting an AP131 adhesion promoter. Generally, the specific process of this step is:
coating a layer of AP131 adhesion promoter on the surface of the end face of the insulating cylinder, placing the insulating cylinder in the air for 15 min, coating 301 epoxy resin mixed with AB glue on the surface of the insulating cylinder to serve as a curing agent, adhering one surface of the piezoelectric film with the electrodes, fixing and standing the piezoelectric film 24 h, and then placing the piezoelectric film in a drying box to heat 4 h at 40 ℃.
Further, the AP131 adhesion promoter is a solution of AP131 diluted in 1:1 in ethanol.
Further, the inner diameter of the metal ring is matched with the outer diameter of the insulating cylinder, and the outer diameter of the metal ring is matched with the inner diameter of the metal shell. Generally, the insulating column is a cylinder with the diameter of 4 to 20 mm and the thickness of 1 to 3 mm; the flexible piezoelectric film is a circular sheet with the diameter being 4-6 mm larger than that of the insulating cylinder; the inner diameter of the metal ring is slightly larger (larger than 1 mm) than the diameter of the insulating cylinder.
Furthermore, the redundant part of the piezoelectric film is turned up and adhered to the outer side of the metal ring by adopting insulating glue such as 502 glue, universal glue and the like, so that the fixing effect is good, and the performance of the ultrasonic transducer is not influenced.
Further, the flexible piezoelectric film is a PVDF-based film, such as a PVDF film, a P (VDF-TrFE) film, or the like.
Further, the thickness of the flexible piezoelectric film is 5 to 30 micrometers.
Further, after the electrodes are led out, the ultrasonic transducer structure in the metal shell is packaged by 301 epoxy resin mixed with AB glue after vacuumizing, and the ultrasonic transducer structure is stood for 24 h to be cured.
Further, the electrode consists of a chromium layer of 5-10 nm and a gold layer of 10-30 nm.
Further, the thickness of the waterproof film is 2~6 μm.
Further, the waterproof film is a waterproof film with a small acoustic impedance, such as a parylene waterproof film.
The high-frequency thin-film ultrasonic transducer prepared by the preparation method comprises an insulating cylinder, a metal ring, a flexible piezoelectric thin film, a metal shell and an electrode lead-out wire, wherein the metal ring is sleeved and fixed at one end of the insulating cylinder; the lead part of the electrode lead-out wire is connected with a metal ring, and the ground wire is connected with the metal shell.
The invention has the beneficial effects that: according to the invention, through the design of a series of preparation process flows, the application of the thin flexible piezoelectric film to the high-frequency ultrasonic transducer is realized, wherein the metal ring with good conductivity is introduced, the edge part of the film is attached to the outer side of the metal ring, and the contact of the upper electrode and the lower electrode of the film is avoided in the subsequent electrode plating process; meanwhile, the metal ring is adhered to one surface of the electrode of the film through conductive silver paste and can be led out through a lead connected with an internal electrode; in addition, the micro adhesive tape is used for fixing the integral structure during sample preparation, so that the integral film is not damaged during processing after epoxy resin is packaged. The prepared high-frequency Bao Mochao acoustic transducer has excellent and stable performance, higher central frequency and wider bandwidth, can change the internal size and the shell shape of a device according to the required parameters of ultrasonic detection equipment, and can be directly applied to the equipment. Taking a film ultrasonic transducer prepared by a flexible piezoelectric film P (VDF-TrFE) with the thickness of 20 μm as an example, the center frequency is 32.7 MHz, the bandwidth is 82%, the thickness of the film and the center frequency are approximately in a linear inverse proportion relationship, and the minimum film thickness applicable to the preparation method of the invention is about 5 μm.
Drawings
FIG. 1 is a schematic view of the internal structure of a high-frequency thin-film ultrasonic transducer prepared in example 1;
FIG. 2 is a pulse-echo response plot of the high frequency Bao Mochao acoustic transducer prepared in example 1;
figure 3 is a graph of the pulse-echo response fast fourier transform of the high frequency Bao Mochao acoustic transducer prepared in example 1.
Detailed Description
The technical scheme of the invention is further illustrated by the following specific examples.
Unless otherwise specified, the experimental procedures described in the following examples are conventional and the reagents and materials, unless otherwise specified, are commercially available.
Example 1
A preparation method of a high-frequency thin-film ultrasonic transducer comprises the following steps:
1) 4 g of 301 epoxy resin A glue and 1 g of B glue are uniformly mixed, then vacuum pumping is carried out to discharge air bubbles, standing is carried out for 24 h to be solidified, and the mixture is processed into a cylinder with the diameter of 10 mm and the thickness of 3 mm to be used as an insulating cylinder.
2) A P (VDF-TrFE) film of the single-sided gold-plated electrode after polarization with a thickness of 20 μm was cut into a wafer with a diameter of 15 mm.
3) Coating a layer of AP131 adhesion promoter diluted by ethanol 1:1 on the surface of one end of the epoxy resin cylinder in the step 1), placing the epoxy resin cylinder in the air for 15 min, coating AB glue 4:1 mixed 301 epoxy resin on the surface to serve as a curing agent, adhering the epoxy resin cylinder to one side of the film with the electrode in the step 2), fixing and standing 24 h, and then placing the epoxy resin cylinder in a drying box to heat 4 h at 40 ℃.
4) A copper ring with the inner diameter of 11 mm and the outer diameter of 13 mm is sleeved on the outer side of the cylinder, and is adhered by conductive silver paste and stands for 24 h.
5) The excess part of the film is turned up and stuck to the outside of the metal ring by 502 glue.
6) And 5) adhering the sample obtained in the step 5) on a micro adhesive tape, and simultaneously sleeving the copper shell of the ultrasonic transducer outside the sample and adhering the sample on the micro adhesive tape.
7) Connecting the lead part of the coaxial cable with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, connecting the ground wire with the metal shell, and connecting the other end of the coaxial cable with the SMA interface by the conductive silver paste;
8) And encapsulating the ultrasonic transducer structure in the metal shell by using the 301 epoxy resin mixed with the AB glue 4:1 after vacuumizing, and standing for 24 h for curing.
9) The prepared sample is torn off from the micro-adhesive tape, and 10 nm chromium and 30 nm gold are sputtered on the exposed part of the film on the surface of the sample to serve as an electrode.
10 The prepared ultrasonic transducer was deposited with a parylene waterproof film having a thickness of 4 μm in a film coater.
The internal structure of the high-frequency P (VDF-TrFE) film ultrasonic transducer prepared by the method is shown in figure 1, has a complete ultrasonic transducer structure, and can be directly connected with ultrasonic detection equipment. The prepared ultrasonic transducer connection test system is placed in pure water, a signal transmitting and receiving test is carried out on the metal aluminum block at the position with the distance of 7.5 mm, as shown in fig. 2, the pulse-echo response signal of the transducer is stable, the residual wave is less, and after Fourier fast transformation is carried out on the signal, as shown in fig. 3, the central frequency is 32.7 MHz, the bandwidth is 82%, and the performance is excellent.
Example 2
A preparation method of a high-frequency thin-film ultrasonic transducer comprises the following steps:
1) 4 g of 301 epoxy resin A glue and 1 g of B glue are uniformly mixed, then vacuum pumping is carried out to discharge air bubbles, standing is carried out for 24 h to be cured, and the mixture is processed into a cylinder with the diameter of 10 mm and the thickness of 3 mm to be used as an insulating cylinder.
2) A P (VDF-TrFE) film of the single-sided gold-plated electrode after polarization with a thickness of 10 μm was cut into a wafer with a diameter of 15 mm.
3) Coating a layer of AP131 adhesion promoter diluted by ethanol 1:1 on the surface of one end of the epoxy resin cylinder in the step 1), placing the cylinder in the air for 15 min, coating 301 epoxy resin mixed by AB glue 4:1 on the surface, adhering the epoxy resin to one side of the film with the electrode in the step 2), fixing and standing 24 h, and placing the cylinder in a drying box to heat 4 h at 40 ℃.
4) A copper ring with the inner diameter of 11 mm and the outer diameter of 13 mm is sleeved on the outer side of the cylinder, conductive silver paste is used for adhesion, and the cylinder is placed still for 24 h.
5) The excess part of the film is turned up and stuck to the outside of the metal ring by 502 glue.
6) And 5) adhering the sample obtained in the step 5) on the micro adhesive tape, and simultaneously sleeving the copper shell of the ultrasonic transducer outside the sample and adhering the copper shell on the micro adhesive tape.
7) The conducting wire part of the coaxial cable is connected with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, the ground wire is connected with the metal shell, and the other end of the coaxial cable is also connected with the SMA interface by the conductive silver paste.
8) And encapsulating the ultrasonic transducer structure in the metal shell by using the 301 epoxy resin mixed with the AB glue 4:1 after vacuumizing, and standing for 24 h for curing.
9) The prepared sample is torn off from the micro-adhesive tape, and 10 nm chromium and 30 nm gold are sputtered on the exposed part of the film on the surface of the sample to be used as an electrode.
10 The prepared ultrasonic transducer was deposited with a parylene waterproof film having a thickness of 4 μm in a film coater.
The high-frequency P (VDF-TrFE) film ultrasonic transducer with the center frequency of about 60 MHz is prepared by the method.
Example 3
A preparation method of a high-frequency thin-film ultrasonic transducer comprises the following steps:
1) 4 g of 301 epoxy resin A glue and 1 g of B glue are uniformly mixed, then vacuum pumping is carried out to discharge air bubbles, standing is carried out for 24 h to be cured, and the mixture is processed into a cylinder with the diameter of 10 mm and the thickness of 3 mm to be used as an insulating cylinder.
2) A P (VDF-TrFE) film of the single-sided gold-plated electrode after polarization with a thickness of 5 μm was cut into a wafer with a diameter of 15 mm.
3) Coating a layer of AP131 adhesion promoter diluted by ethanol 1:1 on the surface of one end of the epoxy resin cylinder in the step 1), placing the cylinder in the air for 15 min, coating 301 epoxy resin mixed by AB glue 4:1 on the surface, adhering the epoxy resin to one side of the film with the electrode in the step 2), fixing and standing 24 h, and placing the cylinder in a drying box to heat 4 h at 40 ℃.
4) A copper ring with the inner diameter of 11 mm and the outer diameter of 13 mm is sleeved on the outer side of the cylinder, conductive silver paste is used for adhesion, and the cylinder is placed still for 24 h.
5) The excess part of the film is turned up and stuck to the outside of the metal ring by 502 glue.
6) And 5) adhering the sample obtained in the step 5) on the micro adhesive tape, and simultaneously sleeving the copper shell of the ultrasonic transducer outside the sample and adhering the copper shell on the micro adhesive tape.
7) The conducting wire part of the coaxial cable is connected with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, the ground wire is connected with the metal shell, and the other end of the coaxial cable is also connected with the SMA interface by the conductive silver paste.
8) And encapsulating the ultrasonic transducer structure in the metal shell by using the 301 epoxy resin mixed with the AB glue 4:1 after vacuumizing, and standing for 24 h for curing.
9) The prepared sample is torn off from the micro-adhesive tape, and 10 nm chromium and 30 nm gold are sputtered on the exposed part of the film on the surface of the sample to be used as an electrode.
10 The prepared ultrasonic transducer was deposited with a parylene waterproof film in a thickness of 4 μm in a coater.
The high-frequency P (VDF-TrFE) film ultrasonic transducer with the center frequency of more than 100MHz is prepared by the method.
Example 4
A preparation method of a high-frequency thin-film ultrasonic transducer comprises the following steps:
1) 4 g of 301 epoxy resin A glue and 1 g of B glue are uniformly mixed, then vacuum pumping is carried out to discharge air bubbles, standing is carried out for 24 h to be cured, and the mixture is processed into a cylinder with the diameter of 10 mm and the thickness of 3 mm to be used as an insulating cylinder.
2) Cutting a polarized P (VDF-TrFE) film with the thickness of 30 mu m and the single-sided gold-plated electrode into a wafer with the diameter of 15 mm;
3) Coating a layer of AP131 adhesion promoter diluted by ethanol 1:1 on the surface of one end of the epoxy resin cylinder in the step 1), placing the epoxy resin cylinder in the air for 15 min, coating 301 epoxy resin mixed by AB glue 4:1 on the surface, adhering the epoxy resin cylinder to one side of the film with the electrode in the step 2), fixing and placing the film in a drying box after standing for 24 h, and heating for 4 h at 40 ℃.
4) A copper ring with the inner diameter of 11 mm and the outer diameter of 13 mm is sleeved on the outer side of the cylinder, and is adhered by conductive silver paste and stands for 24 h.
5) The excess part of the film is turned up and stuck to the outside of the metal ring by 502 glue.
6) And 5) adhering the sample obtained in the step 5) on the micro adhesive tape, and simultaneously sleeving the copper shell of the ultrasonic transducer outside the sample and adhering the copper shell on the micro adhesive tape.
7) The conducting wire part of the coaxial cable is connected with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, the ground wire is connected with the metal shell, and the other end of the coaxial cable is also connected with the SMA interface by the conductive silver paste.
8) And encapsulating the ultrasonic transducer structure in the metal shell by using the 301 epoxy resin mixed with the AB glue 4:1 after vacuumizing, and standing for 24 h for curing.
9) The prepared sample is torn off from the micro-adhesive tape, and 10 nm chromium and 30 nm gold are sputtered on the exposed part of the film on the surface of the sample to be used as an electrode.
10 The prepared ultrasonic transducer was deposited with a parylene waterproof film having a thickness of 6 μm in a film coater.
The high-frequency P (VDF-TrFE) film ultrasonic transducer with the center frequency of about 20 MHz is prepared by the method.
Example 5
A preparation method of a high-frequency thin-film ultrasonic transducer comprises the following steps:
1) 2 g of 301 epoxy resin A glue and 0.5 g of B glue are uniformly mixed, then vacuum pumping is carried out to discharge air bubbles, standing is carried out for 24 h to be cured, and the mixture is processed into a cylinder with the diameter of 4 mm and the thickness of 1mm to be used as an insulating cylinder.
2) A P (VDF-TrFE) film of the single-sided gold-plated electrode after polarization with a thickness of 20 μm was cut into a wafer with a diameter of 9 mm.
3) Coating a layer of AP131 adhesion promoter diluted by ethanol 1:1 on the surface of one end of the epoxy resin cylinder in the step 1), placing the cylinder in the air for 15 min, coating 301 epoxy resin mixed by AB glue 4:1 on the surface, adhering the epoxy resin to one side of the film with the electrode in the step 2), fixing and standing 24 h, and placing the cylinder in a drying box to heat 4 h at 40 ℃.
4) And sleeving a copper ring with the inner diameter of 5 mm and the outer diameter of 7 mm on the outer side of the cylinder, adhering the copper ring with conductive silver paste, and standing the copper ring at 24 h.
5) The excess part of the film is turned up and stuck to the outside of the metal ring by 502 glue.
6) And 5) adhering the sample obtained in the step 5) on the micro adhesive tape, and simultaneously sleeving the copper shell of the ultrasonic transducer outside the sample and adhering the copper shell on the micro adhesive tape.
7) The conducting wire part of the coaxial cable is connected with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, the ground wire is connected with the metal shell, and the other end of the coaxial cable is also connected with the SMA interface by the conductive silver paste.
8) And encapsulating the ultrasonic transducer structure in the metal shell by using the 301 epoxy resin mixed with the AB glue 4:1 after vacuumizing, and standing for 24 h for curing.
9) The prepared sample is torn off from the micro-adhesive tape, 5 nm chromium and 10 nm gold are sputtered on the exposed part of the film on the surface of the sample to serve as an electrode.
10 The prepared ultrasonic transducer was deposited with a parylene waterproof film having a thickness of 2 μm in a film coater.
The high-frequency P (VDF-TrFE) film ultrasonic transducer with the center frequency of about 30 MHz is prepared by the method.
Example 6
A preparation method of a high-frequency thin-film ultrasonic transducer comprises the following steps:
1) Uniformly mixing 4 g of 301 epoxy resin A glue and 1 g of B glue, vacuumizing to discharge air bubbles, standing for 24 h for curing, and processing into a cylinder with the diameter of 10 mm and the thickness of 3 mm.
2) The PVDF film of the polarized single-sided gold-plated electrode with the thickness of 20 mu m is cut into a circular sheet with the diameter of 15 mm.
3) Coating a layer of AP131 adhesion promoter diluted by ethanol 1:1 on the surface of the epoxy resin cylinder in the step 1), placing the cylinder in the air for 15 min, coating 301 epoxy resin mixed by AB glue 4:1 on the surface, adhering the epoxy resin to one side of the film with the electrodes in the step 2), fixing and standing 24 h, and placing the film in a drying box to heat 4 h at 40 ℃.
4) A copper ring with the inner diameter of 11 mm and the outer diameter of 13 mm is sleeved on the outer side of the cylinder, and is adhered by conductive silver paste and stands for 24 h.
5) The excess part of the film is turned up and stuck to the outside of the metal ring by 502 glue.
6) And 5) adhering the sample obtained in the step 5) on the micro adhesive tape, and simultaneously sleeving the copper shell of the ultrasonic transducer outside the sample and adhering the copper shell on the micro adhesive tape.
7) The conducting wire part of the coaxial cable is connected with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, the ground wire is connected with the metal shell, and the other end of the coaxial cable is also connected with the SMA interface by the conductive silver paste.
8) And encapsulating the ultrasonic transducer structure in the metal shell by using the 301 epoxy resin mixed with the AB glue 4:1 after vacuumizing, and standing for 24 h for curing.
9) The prepared sample is torn off from the micro-adhesive tape, and 10 nm chromium and 30 nm gold are sputtered on the exposed part of the film on the surface of the sample to be used as an electrode.
10 The prepared ultrasonic transducer was deposited with a parylene waterproof film having a thickness of 4 μm in a film coater.
The high-frequency PVDF film ultrasonic transducer with the central frequency of about 30 MHz is prepared by the method.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should all embodiments be exhaustive. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.
Claims (10)
1. A method for manufacturing a high-frequency thin-film ultrasonic transducer is characterized by comprising the following steps:
obtaining an insulating cylinder and a flexible piezoelectric film with a polarized single-sided plated electrode;
one surface of the flexible piezoelectric film electrode is coaxially fixed with the end surface of the insulating cylinder;
sleeving a metal ring on the insulating column and adhering the metal ring with conductive silver paste, wherein the area of the flexible piezoelectric film of the polarized single-sided plated electrode is larger than that of the metal ring and the flexible piezoelectric film can completely cover the edge of the metal ring; then turning up the redundant part of the flexible piezoelectric film and fixing the redundant part outside the metal ring;
one side of the sample flexible piezoelectric film after the metal ring is fixed is adhered to the micro-adhesive tape for fixing, and meanwhile, the metal shell of the ultrasonic transducer is sleeved outside the sample and is adhered to the micro-adhesive tape for fixing; connecting a lead part of the coaxial cable with a metal ring by conductive silver paste to be taken as an electrode wire to be led out, and connecting a ground wire with a metal shell;
and (3) packaging the ultrasonic transducer structure in the metal shell after the electrodes are led out, removing the micro adhesive tape, manufacturing another electrode on one surface of the flexible piezoelectric film, and packaging the waterproof film after the manufacturing is finished to obtain the high-frequency film ultrasonic transducer.
2. The method of claim 1, wherein the insulating cylinder is made of 301 epoxy AB glue, and the AB glue mass ratio of 301 epoxy is 4:1.
3. The method of claim 1, wherein the flexible piezoelectric thin film electrode is fixed coaxially with the end face of the insulating cylinder on one side by an AP131 adhesion promoter.
4. The preparation method of claim 3, wherein the AP131 adhesion promoter is a solution of AP131 diluted in 1:1 in ethanol.
5. The method of claim 1, wherein the inner diameter of the metal ring is matched to the outer diameter of the insulating cylinder, and the outer diameter of the metal ring is matched to the inner diameter of the metal shell.
6. The production method according to claim 1, wherein the flexible piezoelectric film is a PVDF-based film.
7. The production method according to claim 1, wherein the thickness of the flexible piezoelectric film is 5 to 30 μm.
8. The preparation method of the electrode according to claim 1, wherein the electrode consists of 5 to 10 nm of chromium layer and 10 to 30 nm of gold layer.
9. The method of claim 1, wherein the waterproof film has a thickness of 2~6 μ ι η.
10. A high-frequency thin-film ultrasonic transducer produced by the production method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211145215.3A CN115266948B (en) | 2022-09-20 | 2022-09-20 | High-frequency thin-film ultrasonic transducer and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211145215.3A CN115266948B (en) | 2022-09-20 | 2022-09-20 | High-frequency thin-film ultrasonic transducer and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115266948A CN115266948A (en) | 2022-11-01 |
| CN115266948B true CN115266948B (en) | 2023-02-17 |
Family
ID=83757200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211145215.3A Active CN115266948B (en) | 2022-09-20 | 2022-09-20 | High-frequency thin-film ultrasonic transducer and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115266948B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1818634A (en) * | 2006-01-24 | 2006-08-16 | 北京工业大学 | Nondestructive supersonic sensor for carbon steel point quality |
| JP2009097367A (en) * | 2007-10-15 | 2009-05-07 | Alps Electric Co Ltd | Piezoelectric pump |
| CN201804553U (en) * | 2010-06-18 | 2011-04-20 | 华南理工大学 | Flexible integrated ultrasonic transducer |
| CN104771841A (en) * | 2015-04-10 | 2015-07-15 | 西安交通大学 | Double-frequency double-layer power enhanced annular HIFU (high-intensity focused ultrasound) transducer |
| CN109332141A (en) * | 2018-10-12 | 2019-02-15 | 华东理工大学 | A kind of point focusing Air Coupling ultrasonic transducer based on Piezoelectric Film for Designing |
| CN113182157A (en) * | 2021-04-27 | 2021-07-30 | 之江实验室 | Flexible piezoelectric ultrasonic transducer |
| CN113640392A (en) * | 2021-07-29 | 2021-11-12 | 华南师范大学 | High-sensitivity full-transparent photoacoustic detector based on transparent flexible composite electrode and endoscopic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102706436B (en) * | 2012-05-16 | 2014-05-07 | 北京工业大学 | Point focusing ultrasonic transducer used for detecting wave speed of surface wave |
| US20140180117A1 (en) * | 2012-12-21 | 2014-06-26 | Volcano Corporation | Preparation and Application of a Piezoelectric Film for an Ultrasound Transducer |
| US20200171544A1 (en) * | 2018-11-29 | 2020-06-04 | Ascent Ventures, Llc | High Frequency Ultrasonic Transducer and Method of Fabrication |
-
2022
- 2022-09-20 CN CN202211145215.3A patent/CN115266948B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1818634A (en) * | 2006-01-24 | 2006-08-16 | 北京工业大学 | Nondestructive supersonic sensor for carbon steel point quality |
| JP2009097367A (en) * | 2007-10-15 | 2009-05-07 | Alps Electric Co Ltd | Piezoelectric pump |
| CN201804553U (en) * | 2010-06-18 | 2011-04-20 | 华南理工大学 | Flexible integrated ultrasonic transducer |
| CN104771841A (en) * | 2015-04-10 | 2015-07-15 | 西安交通大学 | Double-frequency double-layer power enhanced annular HIFU (high-intensity focused ultrasound) transducer |
| CN109332141A (en) * | 2018-10-12 | 2019-02-15 | 华东理工大学 | A kind of point focusing Air Coupling ultrasonic transducer based on Piezoelectric Film for Designing |
| CN113182157A (en) * | 2021-04-27 | 2021-07-30 | 之江实验室 | Flexible piezoelectric ultrasonic transducer |
| CN113640392A (en) * | 2021-07-29 | 2021-11-12 | 华南师范大学 | High-sensitivity full-transparent photoacoustic detector based on transparent flexible composite electrode and endoscopic device |
Non-Patent Citations (1)
| Title |
|---|
| 医用PVdF压电薄膜换能器的进展;马乐山;《中国医疗器械杂志》;19831231(第06期);27-32 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115266948A (en) | 2022-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105413997B (en) | Flexibility capacitance type micromachined ultrasonic transducer and preparation method thereof | |
| CN101354298B (en) | Piezoresistive transducer probe based on electric conduction high molecule sensitivity membrane and preparation method thereof | |
| CN201804553U (en) | Flexible integrated ultrasonic transducer | |
| CN105758562A (en) | Flexible pressure sensor and preparation method thereof | |
| CN201516405U (en) | Piezoelectric mono-crystal composite material high-frequency ultrasonic transducer | |
| CN101524682A (en) | High-frequency ultrasonic transducer made of piezoelectric monocrystalline composite material as well as manufacturing method and application thereof | |
| CN101894855A (en) | Flexible integrated ultrasonic transducer and preparation method thereof | |
| CN205199868U (en) | Flexibility capacitanc microfabrication ultrasonic transducer | |
| CN106501376A (en) | A kind of flexible passive wireless surface acoustic wave sensor and preparation method thereof | |
| CN109085204B (en) | Transparent flexible humidity sensor and preparation method thereof | |
| CN111504520A (en) | Integrated flexible stretchable touch sensor based on super-capacitor sensing principle | |
| CN114235226B (en) | Off-electric wireless passive flexible pressure sensor, preparation and application | |
| CN115266948B (en) | High-frequency thin-film ultrasonic transducer and preparation method thereof | |
| CN112604930A (en) | Piezoelectric flexible ultrasonic transducer based on MEMS technology and preparation method | |
| CN106571423A (en) | Preparation method for preparing novel piezoelectric composite film in acicular underwater acoustic transducer | |
| CN110849508A (en) | Flexible pressure sensor based on discrete contact structure and preparation method thereof | |
| CN106549100A (en) | A kind of preparation method of new Piezoelectric anisotropy thin film sensor | |
| WO2021196453A1 (en) | Dielectric test system and method for micro-nano patterned thin film array | |
| WO2024103819A1 (en) | Flexible elastic thin film sensing array and manufacturing method therefor | |
| CN110793562B (en) | Detector module packaging structure and method for diamond sensor test | |
| DE102019218336B4 (en) | HIGH FREQUENCY ULTRASONIC TRANSDUCER AND METHOD OF MANUFACTURE | |
| CN110954496B (en) | Sample signal amplification method using terahertz waveband graphene absorber | |
| CN109764981B (en) | Flexible force-heat integrated sensor | |
| CN203929258U (en) | A kind of thin film sensor for transient temperature measuring | |
| CN102706436A (en) | Point focusing ultrasonic transducer used for detecting wave speed of surface wave |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |