CN115256244A - Physical cleaning method for electrolytic nickel plate - Google Patents
Physical cleaning method for electrolytic nickel plate Download PDFInfo
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- CN115256244A CN115256244A CN202210969541.XA CN202210969541A CN115256244A CN 115256244 A CN115256244 A CN 115256244A CN 202210969541 A CN202210969541 A CN 202210969541A CN 115256244 A CN115256244 A CN 115256244A
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 265
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 132
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004140 cleaning Methods 0.000 title claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000005488 sandblasting Methods 0.000 claims abstract description 30
- 238000001035 drying Methods 0.000 claims abstract description 20
- 238000005406 washing Methods 0.000 claims abstract description 20
- 238000003723 Smelting Methods 0.000 claims description 22
- 238000010894 electron beam technology Methods 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000004576 sand Substances 0.000 claims description 13
- 238000010008 shearing Methods 0.000 claims description 13
- 238000005422 blasting Methods 0.000 claims description 7
- 239000012153 distilled water Substances 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 4
- 239000006004 Quartz sand Substances 0.000 claims description 3
- 239000010431 corundum Substances 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 238000007605 air drying Methods 0.000 claims description 2
- 239000008237 rinsing water Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000012535 impurity Substances 0.000 description 11
- 239000002253 acid Substances 0.000 description 9
- 229910052717 sulfur Inorganic materials 0.000 description 8
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 7
- 239000011593 sulfur Substances 0.000 description 7
- 239000013077 target material Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002912 waste gas Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
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- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009854 hydrometallurgy Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- LVIYYTJTOKJJOC-UHFFFAOYSA-N nickel phthalocyanine Chemical compound [Ni+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 LVIYYTJTOKJJOC-UHFFFAOYSA-N 0.000 description 1
- FGHSTPNOXKDLKU-UHFFFAOYSA-N nitric acid;hydrate Chemical compound O.O[N+]([O-])=O FGHSTPNOXKDLKU-UHFFFAOYSA-N 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WWNBZGLDODTKEM-UHFFFAOYSA-N sulfanylidenenickel Chemical compound [Ni]=S WWNBZGLDODTKEM-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
- B24C1/086—Descaling; Removing coating films
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B23/00—Heating arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Engineering & Computer Science (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The invention provides a physical cleaning method for an electrolytic nickel plate, which is characterized in that the electrolytic nickel plate to be cleaned is subjected to sand blasting, water washing and drying in sequence to obtain the cleaned electrolytic nickel plate.
Description
Technical Field
The invention relates to the technical field of nickel target material manufacturing, in particular to a physical cleaning method for an electrolytic nickel plate.
Background
Physical Vapor Deposition (PVD) techniques are used in a variety of applications to provide thin film material deposits of precise thickness with atomically smooth surfaces using sputtering target assemblies. The target assembly is composed of a target material which accords with sputtering performance and a back plate which is suitable for being combined with the target material and has certain strength. During sputtering, the target assembly is mounted to a sputtering station and a target located in a chamber filled with an inert gas atmosphere is exposed to an electric field to create a plasma. The plasma of the plasma collides with the surface of the sputtering target, thereby evolving atoms from the surface of the target, and the voltage difference between the target and the substrate to be coated causes the evolving atoms to form the desired thin film on the surface of the substrate.
The high-purity nickel target material is a very important metal target material in the semiconductor industry, and is generally obtained by producing a high-purity (not less than 4N) nickel ingot in an Electron Beam (EB) smelting mode and then performing thermoplastic deformation processing on the high-purity nickel ingot. For example, CN102409184a discloses a method for preparing a pure nickel slab, which comprises: (1) Putting electrolytic nickel with the mass purity of not less than 99% into a medium-frequency vacuum induction furnace to be smelted to prepare a pure nickel ingot; (2) Welding more than two pure nickel cast ingots in a vacuum consumable arc furnace, then carrying out 1-2 times of vacuum consumable arc melting on the welded pure nickel cast ingots, cutting off a riser and an ingot bottom, and removing skin air holes to obtain finished cast ingots; (3) And heating and preserving heat of the finished cast ingot by adopting an electric furnace, and then forging the finished cast ingot by adopting a free forging mode for multiple times to obtain a pure nickel slab. The method adopts a vacuum consumable arc melting mode to melt the finished product ingot, can solve the problems of final ingot crystal grain growth and poor subsequent processing performance caused by overheating of molten metal in the electroslag remelting process, and can also avoid the increase of the content of harmful impurity S, P, O, H in the ingot. The prepared pure nickel plate blank has good surface quality, no crack, low impurity content and fine and uniform tissue.
CN112609087A discloses a cold bed electron beam melting method of a high purity nickel ingot, which comprises the following steps: s1, selecting a high-purity electrolytic nickel plate as a raw material, polishing, cleaning and drying the high-purity electrolytic nickel plate by using a cleaning solution, recording the weight, orderly filling the high-purity electrolytic nickel plate into a bin of an electron beam furnace, fixing the high-purity electrolytic nickel plate, and vacuumizing the electron beam furnace; s2, preheating and powering an electron gun, starting a material pushing mechanism after the electron gun is stabilized, sequentially pushing the high-purity electrolytic nickel plates in the bin fixed in the step S1 into a cooling bed to be completely melted to form a nickel melt, staying the nickel melt on the cooling bed for 2-4min, and making the nickel melt flow into an ingot casting crucible after the nickel melt is fully deflated to prepare a nickel ingot; and S3, closing the electron gun and the vacuum system in sequence, opening the electron beam furnace, and taking out the nickel ingot prepared in the step S2. The method solves the problem of internal defects of the nickel ingot in the smelting process, and improves the product percent of pass and the production efficiency.
CN106399721A discloses a preparation process of a high-purity nickel ingot with low content of impurity elements, namely a preparation process of a high-purity nickel ingot for a semiconductor target material, which mainly comprises the steps of material preparation, furnace charging and multiple smelting, namely smelting by adopting an electron beam furnace, and maintaining the vacuum degree of a hearth to be less than or equal to 1.0 multiplied by 10 -2 Heating and smelting at Pa, and controlling the smelting temperature to be more than or equal to 2130 ℃; controlling the smelting speed to be less than or equal to 20.1kg/h, and fully melting the electrolytic nickel plate; and cooling the nickel ingot formed after smelting in a hearth for 6-12 h, and discharging. Parameters such as smelting speed, temperature and time are selected according to the mass of materials, the precise distribution of the electron beams is controlled in the smelting process, and the purity of metal and the volatilization removal of impurities can be controlled to the maximum degree; the high-purity metallic nickel has no air holes and no impurities, and is suitable for subsequent utilization and processing of the target material.
As can be seen from the prior art, the mode of smelting by adopting Electron Beams (EB) is adopted to produce high-purity (more than or equal to 4N) nickel ingots, and electrolytic nickel plates are often used as raw materials. For example, CN103498169A discloses a preparation method for reducing sulfur as an electrolytic nickel impurity, belonging to the technical field of hydrometallurgy. The high nickel matte is cast into an anode plate, the anode plate is placed in an electrolytic bath for direct electrolysis of a nickel sulfide anode, the cathode is a nickel starting sheet produced by a seed plate bath, the cathode is placed in a diaphragm bag, the purified electrolyte enters a cathode chamber, and the liquid level of the cathode chamber is higher than that of the anode chamber, so that the anolyte cannot enter the cathode chamber. Electrifying in the electrolytic cell to produce electrolytic nickel. The anolyte purification adopts four-stage purification of extraction decoppering, oxidation neutralization deferrization, extraction decobalt and sulfur reduction. The impurity sulfur in the electrolytic nickel produced after normal electrolysis was <0.001%, with an average content of 0.0005%. The invention uses a normal soluble anode as a template, and reduces the content of sulfur impurity in the cathode solution, thereby reducing the content of sulfur impurity in the electrolytic nickel plate and obtaining the electrolytic nickel finished product with extremely low content of sulfur impurity. The process method is simple, can effectively control the content of impurity sulfur in electrolytic nickel, and obtains high-quality electrolytic nickel finished products with wide application.
However, the electrolytic nickel plate has a relatively large size, which is more than 1m × 1m, and the feeding port for electron beam melting is small, so that the electrolytic nickel plate needs to be cut by using a plate shearing machine to obtain a proper long electrolytic nickel strip. The surface of the first electrolytic nickel strip is provided with a layer of oxide skin (nickelous trioxide), and secondly, the steel plate can be stained with oil stains when being sheared by the plate shearing machine. The common method is an acid washing mode aiming at oxide skins and oil stains on the surfaces of electrolytic nickel strips, but the electrolytic nickel strips are inconvenient to wash due to long length, and a large amount of waste acid and waste gas are generated due to the acid washing mode, so that the environment is polluted, and the personal safety of operators is also harmed.
In view of the above, there is a need to develop a novel cleaning method for electrolytic nickel plates.
Disclosure of Invention
In view of the problems in the prior art, the invention provides a physical cleaning method for an electrolytic nickel plate, wherein the electrolytic nickel plate to be cleaned is subjected to sand blasting, water washing and drying in sequence to obtain the cleaned electrolytic nickel plate.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention aims to provide a physical cleaning method for an electrolytic nickel plate, which comprises the following steps: and (3) carrying out sand blasting, water washing and drying on the electrolytic nickel plate to be cleaned in sequence to obtain the cleaned electrolytic nickel plate.
Sandblasting is a process that utilizes the impact of a high velocity stream of sand to clean and roughen the surface of a substrate. Compressed air is used as power to form a high-speed spray beam to spray a spray material with a certain particle size to the surface of a workpiece to be processed at a high speed, so that the outer surface or the shape of the surface of the workpiece is changed, and the surface of the workpiece obtains certain cleanliness and different roughness due to the impact and cutting action of the spray material on the surface of the workpiece, so that the mechanical property of the surface of the workpiece is improved, and the fatigue resistance of the workpiece is improved.
The physical cleaning method comprises the steps of effectively removing oxide skins and oil stains on the surface of the electrolytic nickel plate to be cleaned by sand blasting, cleaning residual sand grains on the surface by using high-pressure water washing, and finally removing residual water by drying to obtain the cleaned electrolytic nickel plate. The physical cleaning method disclosed by the invention can effectively remove oxide skin and oil stains on the electrolytic nickel plate to be cleaned, can also avoid waste acid and waste gas generated in a pickling mode, has the advantages of convenience, rapidness, simplicity in operation, environmental friendliness, safety and the like, and is convenient to popularize and use.
As the preferable technical scheme of the invention, the electrolytic nickel plate is subjected to shearing treatment according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned.
It is worth explaining that the electrolytic nickel plate to be cleaned needs to be obtained by shearing according to the size of a feed inlet of a subsequent electron beam smelting furnace, and then the cleaned electrolytic nickel plate obtained by physical cleaning according to the invention is directly subjected to electron beam smelting treatment, so that the problem of secondary cleaning caused by oil stain introduced into the cleaned electrolytic nickel plate again after shearing is solved.
Preferably, the electrolytic nickel plate to be cleaned has a width of 70-100mm, such as 70mm, 75mm, 80mm, 85mm, 90mm, 95mm or 100mm, etc., and a length of 1000-1200mm, such as 1000mm, 1050mm, 1100mm, 1150mm or 1200mm, etc., but is not limited to the recited values, and other values not recited in the above-mentioned range of values are also applicable.
As a preferable technical scheme of the invention, the sand blasting is carried out by a sand blasting machine.
As a preferable technical scheme of the invention, the sand grains used for sand blasting comprise any one of quartz sand, white corundum sand and carborundum sand.
Preferably, the grit used in the blasting has a particle size of 60 to 150 mesh, such as 60 mesh, 70 mesh, 80 mesh, 90 mesh, 100 mesh, 110 mesh, 120 mesh, 130 mesh, 140 mesh or 150 mesh, but not limited to the recited values, and other values not recited within the above range of values are also applicable.
In a preferred embodiment of the present invention, the pressure of the blasting is 1.5 to 7MPa, for example, 1.5MPa, 2MPa, 2.5MPa, 3MPa, 3.5MPa, 4MPa, 4.5MPa, 5MPa, 5.5MPa, 6MPa, 6.5MPa or 7MPa, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned range of values are also applicable.
Preferably, the blasting time is 5-10min, such as 5min, 6min, 7min, 8min, 9min or 10min, but not limited to the recited values, and other values not recited in the above range of values are equally applicable.
As a preferable technical scheme of the invention, the water washing is water gun washing and distilled water is adopted.
In a preferred embodiment of the present invention, the water pressure of the water washing is 0.5 to 1.5MPa, for example, 0.5MPa, 0.7MPa, 0.9MPa, 1MPa, 1.1MPa, 1.3MPa or 1.5MPa, but the present invention is not limited to the above-mentioned values, and other values not listed in the above-mentioned numerical range are also applicable.
Preferably, the time for rinsing with water is 3-5min, such as 3min, 3.2min, 3.5min, 3.7min, 4min, 4.3min, 4.5min, 4.8min or 5min, etc., but is not limited to the recited values, and other values not recited in the above range of values are equally applicable.
As the preferable technical scheme of the invention, the drying mode comprises any one or the combination of at least two of air gun blowing, air cooler blowing and air drying, and the skilled person can reasonably select the drying mode according to the actual situation as long as no flowing water exists on the surface of the dried electrolytic nickel plate.
In a preferred embodiment of the present invention, the drying temperature is 20 to 35 ℃, for example, 20 ℃, 21 ℃, 23 ℃, 25 ℃, 27 ℃, 30 ℃, 31 ℃, 33 ℃ or 35 ℃, but the drying temperature is not limited to the recited values, and other values not recited in the above-mentioned numerical range are also applicable.
Preferably, the drying time is 30-60min, such as 30min, 35min, 40min, 45min, 50min, 55min or 60min, but not limited to the recited values, and other values not recited in the above range of values are also applicable.
As a preferable technical solution of the present invention, the physical cleaning method includes:
shearing the electrolytic nickel plate according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned, wherein the width of the electrolytic nickel plate to be cleaned is 70-100mm, the length of the electrolytic nickel plate to be cleaned is 1000-1200mm, sand grains with the grain size of 60-150 meshes are firstly subjected to sand blasting by a sand blasting machine, the air pressure of the sand blasting is controlled to be 1.5-7MPa, the time is 5-10min, then a distilled water gun is used for washing, the water pressure is controlled to be 0.5-1.5MPa, the time is 3-5min, and finally, the electrolytic nickel plate is dried at 20-35 ℃ for 30-60min to obtain the cleaned electrolytic nickel plate.
Compared with the prior art, the invention at least has the following beneficial effects:
the invention provides a physical cleaning method for an electrolytic nickel plate, which is characterized in that the electrolytic nickel plate to be cleaned is subjected to sand blasting, water washing and drying in sequence to obtain the cleaned electrolytic nickel plate.
Drawings
FIG. 1 is a flow chart of a physical cleaning method according to the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
To better illustrate the invention and to facilitate the understanding of the technical solutions thereof, typical but non-limiting examples of the invention are as follows:
as shown in fig. 1, the physical cleaning method of the present invention includes: the method comprises the following steps of shearing an electrolytic nickel plate according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned, effectively removing oxide skin and oil stains on the surface of the electrolytic nickel plate to be cleaned by sand blasting, washing with water to remove residual sand grains on the surface, and finally drying to remove residual moisture to obtain the cleaned electrolytic nickel plate.
Example 1
The embodiment provides a physical cleaning method for an electrolytic nickel plate, which comprises the following steps:
shearing the electrolytic nickel plate according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned, wherein the width of the electrolytic nickel plate to be cleaned is 70mm, the length of the electrolytic nickel plate to be cleaned is 1000mm, sand blasting is performed on quartz sand with the particle size of 100 meshes by using a sand blasting machine, the air pressure of the sand blasting is controlled to be 3MPa, the time of the sand blasting is controlled to be 7.5min, then, washing is performed by using a water gun by using distilled water, the water pressure is controlled to be 1MPa, the time of the sand blasting is controlled to be 3min, and finally, drying is performed for 45min at 25 ℃ to obtain the cleaned electrolytic nickel plate.
And (3) observing the surface of the cleaned electrolytic nickel plate with naked eyes to find that no oxide scale and oil stain remain, which indicates that the oxide scale and the oil stain on the electrolytic nickel plate to be cleaned are effectively removed.
Example 2
The embodiment provides a physical cleaning method for an electrolytic nickel plate, which comprises the following steps:
shearing an electrolytic nickel plate according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned, wherein the width of the electrolytic nickel plate to be cleaned is 100mm, the length of the electrolytic nickel plate to be cleaned is 1200mm, sand blasting is performed on carborundum with the grain size of 60 meshes by using a sand blasting machine, the air pressure of the sand blasting is controlled to be 1.5MPa, the time is 10min, then a water gun is used for washing, the water pressure is controlled to be 0.5MPa, the time is 5min, and finally, the electrolytic nickel plate is dried for 60min at the temperature of 20 ℃ to obtain the cleaned electrolytic nickel plate.
And (3) observing the surface of the cleaned electrolytic nickel plate with naked eyes to find that no oxide scale and oil stain remain, which indicates that the oxide scale and the oil stain on the electrolytic nickel plate to be cleaned are effectively removed.
Example 3
The embodiment provides a physical cleaning method for an electrolytic nickel plate, which comprises the following steps:
shearing the electrolytic nickel plate according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned, wherein the width of the electrolytic nickel plate to be cleaned is 80mm, the length of the electrolytic nickel plate to be cleaned is 1100mm, sand blasting is carried out on white corundum sand with the particle size of 150 meshes by using a sand blasting machine, the air pressure of the sand blasting is controlled to be 7MPa, the time is controlled to be 5min, then, washing is carried out by using a distilled water gun, the water pressure is controlled to be 1.5MPa, the time is controlled to be 3min, and finally, drying is carried out for 30min at 35 ℃ to obtain the cleaned electrolytic nickel plate.
And observing the surface of the cleaned electrolytic nickel plate with naked eyes to find that no oxide scale and oil stain remain, which indicates that the oxide scale and the oil stain on the electrolytic nickel plate to be cleaned are effectively removed.
Comparative example 1
The present comparative example provides a chemical pickling method for an electrolytic nickel plate, the chemical pickling method including:
shearing the electrolytic nickel plate according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned, wherein the width of the electrolytic nickel plate to be cleaned is 70mm, the length of the electrolytic nickel plate to be cleaned is 1000mm,
and immersing the sheared electrolytic nickel plate to be cleaned in a cleaning tank filled with dilute nitric acid water solution with the mass concentration of 15% for acid cleaning, controlling the acid cleaning temperature to be normal temperature (about 25 ℃), cleaning the electrolytic nickel plate for 30min, then cleaning the electrolytic nickel plate by using distilled water, and finally drying the electrolytic nickel plate for 45min at 60 ℃ to obtain the cleaned electrolytic nickel plate.
The surface of the cleaned electrolytic nickel plate is observed by naked eyes, and no oxide scale and oil stain remain, but waste gas such as nitrogen dioxide and the like and waste acid after acid cleaning are generated in the acid cleaning process, so that the environment is polluted, and the health of operators is damaged.
In conclusion, the invention provides a physical cleaning method for an electrolytic nickel plate, which comprises the steps of sequentially carrying out sand blasting, water washing and drying on the electrolytic nickel plate to be cleaned to obtain the cleaned electrolytic nickel plate.
The present invention is described in detail with reference to the above embodiments, but the present invention is not limited to the above detailed structural features, that is, the present invention is not meant to be implemented only by relying on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are all within the protection scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. A physical cleaning method for an electrolytic nickel plate, characterized by comprising: and (3) carrying out sand blasting, water washing and drying on the electrolytic nickel plate to be cleaned in sequence to obtain the cleaned electrolytic nickel plate.
2. The physical cleaning method according to claim 1, shearing the electrolytic nickel plate according to the size of a feed port of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned;
preferably, the width of the electrolytic nickel plate to be cleaned is 70-100mm, and the length is 1000-1200mm.
3. A physical cleaning method according to claim 1 or 2, wherein the blasting is performed using a sand blaster.
4. A physical cleaning method according to any one of claims 1 to 3, wherein the sand used for the blasting comprises any one of quartz sand, white corundum sand or silicon carbide;
preferably, the sand used for sand blasting has a grain size of 60-150 meshes.
5. The physical cleaning method according to any one of claims 1 to 4, wherein the air pressure of the blasting is 1.5 to 7MPa;
preferably, the blasting time is 5-10min.
6. A physical cleaning method according to any one of claims 1 to 5, wherein said water rinsing is water gun rinsing and distilled water is used.
7. The physical cleaning method according to any one of claims 1 to 6, wherein the water pressure of the water washing is 0.5 to 1.5MPa;
preferably, the time of the water washing is 3-5min.
8. A physical cleaning method according to any one of claims 1 to 7, wherein the drying is performed by any one or a combination of at least two of air gun blowing, air cooler blowing and air drying.
9. The physical cleaning method according to any one of claims 1 to 8, wherein the temperature of the drying is 20 to 35 ℃;
preferably, the drying time is 30-60min.
10. The physical cleaning method of any one of claims 1-9, wherein the physical cleaning method comprises:
shearing the electrolytic nickel plate according to the size of a feed inlet of an electron beam smelting furnace to obtain the electrolytic nickel plate to be cleaned, wherein the width of the electrolytic nickel plate to be cleaned is 70-100mm, the length of the electrolytic nickel plate to be cleaned is 1000-1200mm, sand grains with the grain size of 60-150 meshes are firstly subjected to sand blasting by a sand blasting machine, the air pressure of the sand blasting is controlled to be 1.5-7MPa, the time is 5-10min, then a distilled water gun is used for washing, the water pressure is controlled to be 0.5-1.5MPa, the time is 3-5min, and finally, the electrolytic nickel plate is dried at 20-35 ℃ for 30-60min to obtain the cleaned electrolytic nickel plate.
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| US4585538A (en) * | 1983-08-17 | 1986-04-29 | Kaiser Aluminium Europe Inc. | Method and apparatus of cleaning residual anodes employed for fused-salt electrolysis |
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| CL2018003625A1 (en) * | 2018-12-14 | 2019-04-22 | Rafart Mouthon Horacio | Shot blasting process for lead anode plates for electro zinc acquisition. |
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| CN114082705A (en) * | 2021-11-16 | 2022-02-25 | 宁波江丰电子材料股份有限公司 | Surface cleaning method for high-purity manganese |
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- 2022-08-12 CN CN202210969541.XA patent/CN115256244A/en active Pending
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| US4585538A (en) * | 1983-08-17 | 1986-04-29 | Kaiser Aluminium Europe Inc. | Method and apparatus of cleaning residual anodes employed for fused-salt electrolysis |
| CN1880509A (en) * | 2005-06-14 | 2006-12-20 | 中国船舶重工集团公司第七二五研究所 | Method for preprocessing metal oxide anode substrate |
| CL2018003625A1 (en) * | 2018-12-14 | 2019-04-22 | Rafart Mouthon Horacio | Shot blasting process for lead anode plates for electro zinc acquisition. |
| CN111804674A (en) * | 2020-04-27 | 2020-10-23 | 安徽富乐德科技发展股份有限公司 | Method for cleaning pollutants on surface of anode oxidation part in ETCH (electronic toll Collection) equipment |
| CN111993287A (en) * | 2020-07-31 | 2020-11-27 | 上海富乐德智能科技发展有限公司 | Regeneration method of anodic oxidation part in dry etching equipment for semiconductor |
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