CN115256218A - Pneumatic control device for polishing head and polishing equipment thereof - Google Patents
Pneumatic control device for polishing head and polishing equipment thereof Download PDFInfo
- Publication number
- CN115256218A CN115256218A CN202210701556.8A CN202210701556A CN115256218A CN 115256218 A CN115256218 A CN 115256218A CN 202210701556 A CN202210701556 A CN 202210701556A CN 115256218 A CN115256218 A CN 115256218A
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- China
- Prior art keywords
- air
- air control
- adapter
- control module
- polishing head
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
Abstract
The invention provides an air control device for a polishing head and polishing equipment thereof, belonging to the technical field of polishing, wherein the air control device comprises: a box body; the air control module is provided with a plurality of air control modules which are integrated in the chamber of the box body, the air control modules are provided with nitrogen connectors and a plurality of groups of air inlet/outlet connectors, and the air control modules are used for controlling the pressure parameters of the air; the adapter plate is connected to the box body, and the adapter plate is provided with an adapter which is communicated with the nitrogen connector and the air inlet/outlet connector. The distributed pneumatic control modules are gathered in one box body, the electric system wires are distributed through the adapter plate and then are concentrated in the box body, the directions of the wires can be clearly distinguished on the adapter plate, the wires are prevented from being disordered to influence subsequent maintenance, and the debugging and data reading can be conveniently and independently finished by a single person; when the air control device is arranged above the polishing head, compared with a dispersed air control module, the air control device can save the space at the upper part of the polishing head, is beneficial to compressing the volume of the whole equipment and enables the structure of the equipment to be more compact.
Description
Technical Field
The invention relates to the technical field of polishing, in particular to an air control device for a polishing head and polishing equipment thereof.
Background
Chemical Mechanical Polishing (CMP) is a key process for achieving wafer surface planarization in the fabrication of integrated circuits, and is a combined technique of synergistic effects of chemical etching and mechanical grinding. The basic principle is that under the condition of the existence of grinding and polishing liquid, a wafer carried at the bottom of a polishing head rotates in the same direction relative to a polishing pad, and certain pressure is applied at the same time. The surface layer of the wafer is chemically reacted with the grinding and polishing solution to generate a reaction film which is relatively easy to remove, and the surface layer is mechanically abraded by the grinding agent in the polishing solution and the polishing pad moving relatively under the action of grinding pressure.
The polishing head mainly performs polishing work of the wafer, the wafer is fixed in place by the polishing head through a fixing ring in the polishing process, and the wafer is pressed on the polishing pad by the polishing head through an air bag structure by controllable air pressure; because the polishing head needs to provide multi-zone pressure for the back of the wafer, a multi-air bag zone structure is arranged in the structure of the polishing head. Currently, an HPU (Head Pressure Unit) system is provided above the rotary joint of each set of spindles, and the HPU system is used to control the Pressure of the polishing Head retaining ring, the polishing Pressure, and the vacuum; one HPU system corresponds to one polishing head, 3-7 air paths are required for one polishing head according to different requirements of equipment, and each air path needs a corresponding control unit, so that the HPU systems with different volume sizes need to be arranged above the rotary joint due to different numbers of the control units in the HPU systems.
As the number of polishing heads increases, when a plurality of polishing heads are required to perform polishing activities simultaneously, an HPU system needs to be equipped above each spindle; due to the dispersion of the pneumatic control structure, the corresponding electric control system also needs to be correspondingly dispersed above each polishing head, so that the wiring of the electric system is messy and complicated, and the later maintenance is difficult; in addition, the structure of the device is dispersed during operation and debugging, so that a single person cannot independently finish debugging and data reading, and the debugging and data reading can be finished by matching with a plurality of persons.
Disclosure of Invention
Therefore, the invention provides an integrated air control device suitable for a plurality of polishing heads and polishing equipment thereof.
In order to solve the above technical problems, the present invention provides an air control device for a polishing head, comprising:
a box body;
the air control module is provided with a plurality of air control modules integrated in the chamber of the box body, the air control module is provided with a nitrogen connector and a plurality of groups of air inlet/outlet connectors, and the air control module is used for controlling the pressure parameters of air;
the adapter plate is connected to the box body, and an adapter which is communicated with the nitrogen connector and the air inlet/outlet connector is arranged on the adapter plate.
Further, the adapter on the adapter plate includes:
the first adapter is suitable for being communicated with the air outlet joint on the air control module;
the second adapter is suitable for being respectively communicated with the nitrogen connectors on the air control modules, and air sequentially flows through the second adapter (11), the air control modules, the retaining rings on the polishing heads and the air bags to respectively apply positive pressure to the retaining rings and the wafers;
the third adapter is suitable for being communicated with the air inlet connector on the air control module, and air sequentially flows through the third adapter, the air control module, the first adapter and the retaining ring on the polishing head so as to apply negative pressure to the retaining ring;
and the fourth adapter is suitable for being communicated with the air inlet connector on the air control module, and air sequentially flows through the fourth adapter, the air control module, the first adapter and the air bag on the polishing head so as to apply negative pressure to the wafer.
Furthermore, a gas path shunting structure is arranged on the box body, a gas inlet end of the gas path shunting structure is communicated with the fourth adapter, and a shunting end of the gas path shunting structure is communicated with a gas inlet connector on the gas control module.
Further, the gas path flow dividing structure is an intake manifold.
Furthermore, the pneumatic control module is provided with four control units, and each control unit is provided with an air inlet joint and an air outlet joint correspondingly;
at least two air control modules which are adjacently arranged are combined into one air control module, and the air control module controls an air path on one polishing head.
Further, the chamber of box is cut apart into first chamber and the second chamber of interval setting around, gas accuse module is integrated in the first chamber, with the pipeline of gas accuse module butt joint holds to in the second chamber.
Furthermore, the first chamber and the second chamber are partitioned by partition plates, each partition plate is provided with a plurality of partition plates which are arranged at intervals from top to bottom, and a wiring space is reserved between every two adjacent partition plates.
A polishing apparatus having the air control device for a polishing head according to any one of the above aspects.
Further, the air control device is installed on the outer top wall of the equipment shell.
The technical scheme of the invention has the following advantages:
1. according to the pneumatic control device for the polishing head, the dispersed pneumatic control modules are gathered in one box body, the wiring of an electric system is distributed through the adapter plate and then is concentrated in the box body, the wiring directions of the wiring can be clearly distinguished on the adapter plate, the wiring disorder is avoided so as to influence the subsequent maintenance, and the debugging and the data reading can be conveniently and independently completed by a single person; when the air control device is arranged above the polishing head, compared with a dispersed air control module, the air control device can save the space at the upper part of the polishing head, is beneficial to compressing the volume of the whole equipment and enables the structure of the equipment to be more compact.
2. According to the pneumatic control device for the polishing head, due to the arrangement of the air path shunting structure, repeated wiring is reduced, wiring of an electric system is clearer, and the assembly efficiency is improved.
3. According to the air control device for the polishing head, provided by the invention, two or more air control modules can be flexibly matched and combined, so that the air control device is suitable for the polishing head with three to seven or more air channels, the compatibility of the air control device is improved, and the requirements of different customers can be met.
4. According to the polishing equipment provided by the invention, the pneumatic control device is arranged on the outer top wall of the equipment, and the pneumatic control device is not required to be drilled into the equipment for maintenance and overhaul, so that the maintenance and overhaul are more convenient.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural view of an air control device provided in the present invention.
Fig. 2 is a schematic structural diagram of the pneumatic control module.
Description of reference numerals:
1. a box body; 2. an air control template; 3. a patch panel; 4. a nitrogen gas joint; 5. an air inlet joint; 6. an air outlet joint; 7. a first chamber; 8. a second chamber; 9. a partition plate; 10. a first adapter; 11. a second adapter; 12. a third adapter; 13. a fourth adapter; 14. an intake manifold.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Furthermore, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example one
The air control device for the polishing head provided by the embodiment comprises a box body 1, an air control template 2 and an adapter plate 3.
In this embodiment, a plurality of pneumatic control modules are integrated in the cavity of the box body 1, the pneumatic control modules are provided with nitrogen connectors 4 and a plurality of groups of air inlet/outlet connectors, and the pneumatic control modules are used for controlling pressure parameters of air. An adapter plate 3 is arranged on the box body 1, and an adapter which is communicated with the nitrogen connector 4 and the air inlet/outlet connector is arranged on the adapter plate 3; the air source is connected with the adapter on the adapter plate 3 and then is connected to the air control module by tapping of the adapter.
In the embodiment, the dispersed pneumatic control modules are gathered in one box body 1, the electric system wires are distributed through the adapter plate 3 and then are concentrated in the box body 1, the routing directions of the wires can be clearly distinguished on the adapter plate 3, the problem that the wires are disordered to influence subsequent maintenance is avoided, and the debugging and data reading can be finished independently by a single person; in addition, when the air control device is arranged above the polishing head, compared with a dispersed air control module, the air control device can save the space at the upper part of the polishing head, is beneficial to compressing the volume of the whole equipment and enables the structure of the equipment to be more compact.
As shown in fig. 1, the box body 1 has a rectangular structure with an open top end and an open front end, and the chamber of the box body 1 is divided into a first chamber 7 and a second chamber 8 by a partition 9; the partition plates 9 are provided with a plurality of blocks which are arranged at intervals up and down, and a wiring space is reserved between every two adjacent partition plates 9; the adapter plate 3 is connected to the front end opening position of the first chamber 7, the adapter plate 3 is connected with the pneumatic control module located in the first chamber 7 through a pipeline, and the pipeline connecting the adapter plate 3 and the pneumatic control module is contained in the second chamber 8.
As shown in fig. 1 and 2, in the present embodiment, four pneumatic control modules are integrated in the first chamber 7, and are installed on the inner wall of the first chamber 7 in a 2 × 2 arrangement manner, and the inner wall is also arranged opposite to the partition plate 9; each pneumatic control module is internally provided with four control units, each control unit is correspondingly provided with an air inlet/outlet joint, and the control units are used for adjusting gas pressure parameters on corresponding pipelines; each pneumatic control module is also provided with a nitrogen connector 4, and nitrogen passes through each control unit through the nitrogen connector 4. The adapter on the keysets 3 includes: a first adapter 10, a second adapter 11, a third adapter 12 and a fourth adapter 13; the first adapter 10 is communicated with the air outlet joint 6 on the air control module through a pipeline, the second adapter 11 is respectively communicated with the nitrogen joints 4 on the four air control modules through pipelines, and gas sequentially flows through the second adapter 11, the air control module, the retaining ring and the air bag on the polishing head so as to respectively apply positive pressure to the retaining ring and the wafer; the third adapter 12 is communicated with the air inlet connector 5 on the air control module through a pipeline, and air sequentially flows through the third adapter 12, the air control module, the first adapter 10 and the retaining ring on the polishing head to apply negative pressure to the retaining ring; the fourth adapter 13 is communicated with the air inlet connector 5 on the air control module through a pipeline, and air sequentially flows through the fourth adapter 13, the air control module, the first adapter 10 and an air bag on the polishing head so as to apply negative pressure to the wafer.
As shown in fig. 1 and 2, an air path shunting structure is arranged on the side wall in the second chamber 8, and the air path shunting structure is an air inlet manifold 14; the air inlet end of the air inlet manifold 14 is communicated with the fourth adapter 13, and the flow distribution end of the air inlet manifold 14 is communicated with the air inlet joint 5 on the air control module. The arrangement of the air inlet manifold 14 can clearly and effectively assemble the pipelines, errors are not easy to occur, repeated wiring is reduced, wiring of an electric system is clearer, and the assembling efficiency is improved.
As shown in fig. 1 and 2, the four pneumatic control modules in the figure are matched with polishing heads to be controlled; one control unit on each pneumatic control module is used for controlling the gas pressure at the polishing head retaining ring, and the other three control units respectively correspondingly control the gas pressure at the polishing head air bag; the air control device can simultaneously control the four polishing heads, and the air path of each polishing head is provided with three paths.
As shown in fig. 1 and 2, four pneumatic control modules in the figure are divided into two pneumatic control modules adjacent to each other on the left and right, two pneumatic control modules adjacent to each other on the upper and lower sides are combined into one pneumatic control module, and each pneumatic control module corresponds to one polishing head to be controlled. Each pneumatic control module is provided with eight control units, wherein one control unit is used for controlling the gas pressure at the position of the retaining ring, and the other seven control units respectively control the gas pressure at the position of the polishing head air bag correspondingly; the air control device can simultaneously control the two polishing heads, and the air path of each polishing head has three to seven paths.
As an alternative embodiment, more pneumatic control modules can be integrated in the chamber of the box body 1, and the pneumatic control modules can be combined at will to be suitable for polishing heads with different air path requirements.
Example two
The polishing apparatus provided by the present embodiment includes: the polishing device comprises a device shell, an air control device and a plurality of polishing heads; the air control device is arranged above the polishing heads to control the air path of each polishing head.
In order to conveniently maintain and overhaul the air control device, the air control device is arranged on the outer top wall of the equipment shell, and a maintainer does not need to drill into the equipment to maintain and overhaul the air control device.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications derived therefrom are intended to be within the scope of the invention.
Claims (9)
1. An air control device for a polishing head, comprising:
a box body (1);
the air control module is provided with a plurality of air control modules integrated in the cavity of the box body (1), the air control module is provided with a nitrogen connector (4) and a plurality of groups of air inlet/outlet connectors, and the air control module is used for controlling the pressure parameters of air;
the adapter plate (3) is connected to the box body (1), and an adapter which is used for being communicated with the nitrogen connector (4) and the air inlet/outlet connector is arranged on the adapter plate (3).
2. An air control device for a polishing head according to claim 1, wherein the adapter on the adapter plate (3) comprises:
the first adapter (10) is suitable for being communicated with the air outlet connector (6) on the air control module;
the second adapter (11) is suitable for being respectively communicated with the nitrogen connectors (4) on the air control modules, and air sequentially flows through the second adapter (11), the air control modules, the retaining rings and the air bags on the polishing heads so as to respectively apply positive pressure to the retaining rings and the wafers;
the third adapter (12) is suitable for being communicated with the air inlet connector (5) on the air control module, and air sequentially flows through the third adapter (12), the air control module, the first adapter (10) and the retaining ring on the polishing head to apply negative pressure to the retaining ring;
and the fourth adapter (13) is suitable for being communicated with the air inlet connector (5) on the air control module, and air sequentially flows through the fourth adapter (13), the air control module, the first adapter (10) and an air bag on the polishing head so as to apply negative pressure to the wafer.
3. The air control device for the polishing head according to claim 2, wherein an air path shunting structure is arranged on the box body (1), an air inlet end of the air path shunting structure is communicated with the fourth adapter (13), and a shunting end of the air path shunting structure is communicated with an air inlet joint (5) on the air control module.
4. The air control device for the polishing head as claimed in claim 3, wherein the air path branching structure is an air intake manifold (14).
5. The pneumatic control device for the polishing head as claimed in claim 1, wherein the pneumatic control module has four control units, each control unit corresponding to an air inlet/outlet joint;
at least two air control modules which are adjacently arranged are combined into an air control module, and the air control module controls an air path on a polishing head.
6. An air control device for a polishing head according to claim 1, wherein the chamber of the box body (1) is divided into a first chamber (7) and a second chamber (8) which are arranged at a distance from each other, the air control module is integrated in the first chamber (7), and a pipeline butted with the air control module is accommodated in the second chamber (8).
7. An air control device for a polishing head according to claim 6, wherein the first chamber (7) and the second chamber (8) are divided by a partition plate (9), the partition plate (9) has a plurality of blocks arranged at intervals up and down, and a routing space is reserved between two adjacent partition plates (9).
8. A polishing apparatus characterized by having the air control device for a polishing head as set forth in any one of claims 1 to 7.
9. The polishing apparatus according to claim 8, wherein said air control means is mounted on an outer top wall of the apparatus housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210701556.8A CN115256218A (en) | 2022-06-20 | 2022-06-20 | Pneumatic control device for polishing head and polishing equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210701556.8A CN115256218A (en) | 2022-06-20 | 2022-06-20 | Pneumatic control device for polishing head and polishing equipment thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115256218A true CN115256218A (en) | 2022-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210701556.8A Pending CN115256218A (en) | 2022-06-20 | 2022-06-20 | Pneumatic control device for polishing head and polishing equipment thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115256218A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003071705A (en) * | 2001-08-27 | 2003-03-12 | Applied Materials Inc | Chemical mechanical polishing apparatus |
| US20030061865A1 (en) * | 2001-09-28 | 2003-04-03 | Bong Choi | Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same |
| CN102133731A (en) * | 2011-01-06 | 2011-07-27 | 清华大学 | Pressure control system for plurality of chambers of CMP (chemical mechanical polishing) head |
| CN102133729A (en) * | 2011-01-06 | 2011-07-27 | 清华大学 | Pressure control system for CMP (Chemical Mechanical Polishing) head |
| CN212544332U (en) * | 2020-06-19 | 2021-02-12 | 广东华章数据技术有限公司 | Cold channel integrated control box |
| CN112469231A (en) * | 2020-12-28 | 2021-03-09 | 合肥翔飞生产力促进中心有限公司 | Block chain server is with walking line heat dissipation installation cabinet |
| CN112847138A (en) * | 2021-04-25 | 2021-05-28 | 杭州众硅电子科技有限公司 | Polishing head detection device and method for detecting air tightness of cavity and sensor effectiveness |
-
2022
- 2022-06-20 CN CN202210701556.8A patent/CN115256218A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003071705A (en) * | 2001-08-27 | 2003-03-12 | Applied Materials Inc | Chemical mechanical polishing apparatus |
| US20030061865A1 (en) * | 2001-09-28 | 2003-04-03 | Bong Choi | Method for assembling a polishing head and apparatus for detecting air leakage in the polishing head while assembling the same |
| CN102133731A (en) * | 2011-01-06 | 2011-07-27 | 清华大学 | Pressure control system for plurality of chambers of CMP (chemical mechanical polishing) head |
| CN102133729A (en) * | 2011-01-06 | 2011-07-27 | 清华大学 | Pressure control system for CMP (Chemical Mechanical Polishing) head |
| CN212544332U (en) * | 2020-06-19 | 2021-02-12 | 广东华章数据技术有限公司 | Cold channel integrated control box |
| CN112469231A (en) * | 2020-12-28 | 2021-03-09 | 合肥翔飞生产力促进中心有限公司 | Block chain server is with walking line heat dissipation installation cabinet |
| CN112847138A (en) * | 2021-04-25 | 2021-05-28 | 杭州众硅电子科技有限公司 | Polishing head detection device and method for detecting air tightness of cavity and sensor effectiveness |
Non-Patent Citations (1)
| Title |
|---|
| 吕利平: "北京谱仪（BESIII）的设计与研制", 西南交通大学出版社, pages: 148 - 60 * |
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Address after: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Applicant after: Beijing Jingyi Precision Technology Co.,Ltd. Address before: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Applicant before: Beijing ShuoKe precision electronic equipment Co.,Ltd. |
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