CN115256087B - Wafer processing thinning machine - Google Patents
Wafer processing thinning machine Download PDFInfo
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- CN115256087B CN115256087B CN202210889333.9A CN202210889333A CN115256087B CN 115256087 B CN115256087 B CN 115256087B CN 202210889333 A CN202210889333 A CN 202210889333A CN 115256087 B CN115256087 B CN 115256087B
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- 238000012545 processing Methods 0.000 title claims abstract description 59
- 230000007246 mechanism Effects 0.000 claims abstract description 57
- 230000005540 biological transmission Effects 0.000 claims description 31
- 238000005498 polishing Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 23
- 230000008569 process Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000007517 polishing process Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 59
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to a wafer processing thinning machine, and belongs to the technical field of wafer processing equipment. The device comprises a mounting box, wherein the mounting box is of a columnar structure, the bottom of the mounting box is provided with an opening and is rotationally connected with a rotating plate, and an adjusting mechanism for adjusting the rotating plate to rotate is arranged on the outer wall of one side of the mounting box; the top of the rotating plate is rotationally connected with a rotating column, and the outer wall of the top of the mounting box is fixedly connected with a driving motor. According to the invention, the fine grinding, coarse grinding and polishing processes are integrated, so that the whole processing process can be finished without transferring the wafer back and forth, the safety of the wafer is ensured, the equipment is smaller in size and simpler in operation, the fine grinding, coarse grinding and polishing processes can be realized by utilizing one power source, the manufacturing cost and the production cost are reduced to a certain extent, and the processing efficiency is also greatly improved.
Description
Technical Field
The invention belongs to the technical field of wafer processing equipment, and relates to a wafer processing thinning machine.
Background
Advances in integrated circuit fabrication technology originate first from market demand requirements and second from competing requirements. In the manufacture of integrated circuits, the semiconductor silicon material is an important base material of the integrated circuits due to the abundant resources, low manufacturing cost and good manufacturability. From the cross-sectional view of integrated circuits, most integrated circuits are fabricated on a shallow surface layer of silicon substrate material. Because of the requirements of the manufacturing process, high requirements are put on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro-lattice structure of the wafer. Therefore, in hundreds of technological processes, thinner wafers cannot be adopted, and only wafers with certain thickness can be adopted for transferring and wafer flowing in the technological process. It is often necessary to remove some thickness of the excess substrate material from the back side of the wafer prior to packaging the integrated circuit. This process is called wafer backside thinning process, and the corresponding equipment is a wafer thinning machine. The wafer substrate is thinned in a thinning mode, so that the heat dissipation effect of the chip is improved; and meanwhile, the thickness is reduced to a certain thickness, which is beneficial to the later packaging process.
The current grinding process of the wafer can be divided into the following three stages:
first, coarse grinding stage: the abrasive grain size of the used diamond grinding wheel is large, the feeding amount of each rotation of the grinding wheel is large, and the cutting depth of each single abrasive grain is larger than the critical cutting depth. Is typically a brittle domain grind. With a relatively large feed rate, improvement in processing efficiency is mainly considered. This stage accounts for about 94% of the total thinning.
Second, fine grinding stage: the grinding force of the used grinding wheel is small, the feeding amount of each rotation of the grinding wheel is small, the cutting depth of a part of abrasive particles is smaller than the critical cutting depth, and the grinding wheel belongs to ductile domain cutting. The cutting depth of the other part is larger than the critical cutting depth, and belongs to brittle domain cutting. The feeding speed is reduced, and the phenomena of damage, edge breakage and the like generated by the rough grinding of the front end can be eliminated. Accounting for 6% of this total grinding amount.
Third, polishing stage: and the last few micrometers are subjected to fine grinding and polishing, the grinding depth is smaller than 0.1um, and the ductile range processing range is reached, and the material processing is performed in a mode of chemical change of deformation and tearing.
The method comprises the specific operation steps of adhering a wafer to be processed to a thinning film, then vacuum-adsorbing the thinning film and a chip on the thinning film to a porous ceramic wafer bearing table, adjusting the center line of an inner boat and an outer boat of a working surface of a cup-shaped diamond grinding wheel to the center position of the silicon wafer, and rotating the silicon wafer and the grinding wheel around respective axes to cut in and grind.
Each step needs to relate to different grinding wheels, the existing wafer processing thinning machine divides the different grinding wheels into a plurality of different operating mechanisms which are driven by different powers, the traditional processing mode not only increases the cost in manufacture, but also has relatively complex operation, large equipment size and troublesome use, and each step can be used for re-shifting the wafer, so that the wafer is easy to cause unnecessary damage in the back and forth movement process, and the processing efficiency is low, therefore, the wafer processing thinning machine is provided for solving the problems.
Disclosure of Invention
In view of this, the invention provides a wafer processing thinning machine, which aims to solve the problems of the traditional processing mode, such as increased cost, relatively complex operation, large equipment size, troublesome use, unnecessary damage to the wafer in the back and forth movement process and low processing efficiency, and the wafer can be re-shifted in each step.
In order to achieve the above purpose, the present invention provides the following technical solutions: the device comprises a mounting box, wherein the mounting box is of a columnar structure, the bottom of the mounting box is provided with an opening and is rotationally connected with a rotating plate, and an adjusting mechanism for adjusting the rotating plate to rotate is arranged on the outer wall of one side of the mounting box;
the top of the rotating plate is rotationally connected with a rotating column, the outer wall of the top of the mounting box is fixedly connected with a driving motor, an output shaft of the driving motor penetrates through the mounting box and is fixedly connected with the top of the rotating column, the top of the rotating plate is annular and equidistantly rotates to penetrate through three rotating rods with different lengths, the bottom ends of the three rotating rods are respectively and fixedly connected with a finish-grinding wheel, a rough-grinding wheel and a polishing wheel, and three groups of transmission mechanisms for respectively driving the three rotating rods to rotate are equidistantly arranged on the outer wall of the rotating column;
the top of the rotating plate is provided with three fixed plates with different heights, one sides of the tops of the three fixed plates are respectively provided with a braking mechanism and a jacking mechanism which are in transmission fit with each other, the braking mechanism is used for limiting and rotating a corresponding rotating rod, and the jacking mechanism is used for enabling the corresponding transmission mechanism to transmit the rotating rod.
Further, adjustment mechanism includes the mounting panel of fixed connection at mounting box one side outer wall, and the bottom fixedly connected with accommodate motor of mounting panel, and the fixed cover is equipped with adjusting gear on accommodate motor's the output shaft, and the outer wall fixed cover of revolving plate is equipped with the external tooth ring with adjusting gear engaged with.
Further, the transmission mechanism comprises a driving gear rotationally sleeved on the outer wall of the rotary column, a driven gear is fixedly sleeved on the top end of the rotary rod, and the driven gear is meshed with the driving gear.
Further, drive mechanism still establishes the fixed disk at the spliced pole outer wall including fixed cover, and the fixed disk is located the below of driving gear, annular notch has been seted up to the lateral wall of fixed disk, the slip cover is equipped with the slide disk that is located annular notch on the fixed disk, the top of slide disk is a plurality of draw-in levers of annular equidistance fixedly connected with, the outer wall of a plurality of draw-in levers all overlaps and is equipped with first spring, and the both ends of first spring respectively with the outer wall of draw-in lever and the top fixed connection of slide disk, the top of a plurality of draw-in levers all slides and runs through the top of fixed disk and fixedly connected with dop, the bottom of a plurality of driving gears all is equipped with a plurality of draw-in grooves that use with corresponding draw-in lever cooperation.
Further, the top of dop is round platform form, and the top of slide is equipped with a plurality of grooves of stepping down that correspond with the draw-in lever, and the bottom of draw-in lever is located the groove of stepping down.
Further, the top mechanism includes two slide bars that the symmetry slides and runs through the fixed plate inside, the one end fixedly connected with of two slide bars near the spliced pole is the same movable block, the outer wall of two slide bars all overlaps and is equipped with the second spring, one side fixed connection that the both ends of second spring are close to with fixed plate and movable block respectively, one side symmetry fixedly connected with two branches of fixed plate are kept away from to the movable block, the one end of two branches all extends to annular notch, and be located the below of slide, the equal fixedly connected with in top of two branches is used for promoting the kicking block of slide upward movement, one side inner wall fixedly connected with of mounting box is used for promoting the riser that two slide bars removed.
Further, the top surface of kicking block is equipped with inclined plane and plane one respectively, and the inclined plane is used for the jacking to the slide, and plane one is used for the rotation support to the slide, and the top surface activity of plane one inlays and is equipped with the ball.
Further, the riser is close to one side of the pivoted post and is equipped with plane two and two symmetrical arc concave surfaces respectively, and plane two is located between two arc concave surfaces, and two arc concave surfaces are used for making a round trip to flexible to the slide bar respectively, and plane two is used for the location support to the slide bar.
Further, the braking mechanism includes that fixed connection is at the drive rack of movable block one side of keeping away from the spliced pole, and the one end slip of drive rack runs through the fixed plate, and one side fixedly connected with of fixed plate props up the piece, and the top of propping up the piece rotates and is connected with the pivot, and the outer wall fixed cover of pivot is equipped with the long gear with drive rack looks meshing, and one side top fixedly connected with supporting shoe of fixed plate, and the inside slip of supporting shoe runs through has double-sided rack, and double-sided rack meshes with long gear and corresponding driven gear respectively.
Further, the double-sided rack comprises a first tooth set and a second tooth set, wherein the first tooth set is meshed with the long gear, and the second tooth set is movably meshed with the corresponding driven gear.
The invention has the beneficial effects that:
1. according to the wafer processing thinning machine disclosed by the invention, the rotating plate is driven to rotate by starting the adjusting motor, so that the positions of the fine grinding wheel, the rough grinding wheel and the polishing wheel can be correspondingly converted, different operation procedures can be realized, and the use is more flexible;
2. according to the wafer processing thinning machine disclosed by the invention, the driving motor is started to respectively perform rotation control on the fine grinding wheel, the rough grinding wheel and the polishing wheel, and when the positions of the fine grinding wheel, the rough grinding wheel and the polishing wheel are interchanged, the effects of automatic transmission and automatic braking can be realized, so that the other two grinding wheels are not interfered when any one grinding wheel is driven;
3. the wafer processing thinning machine disclosed by the invention has the advantages that the whole transmission, jacking and braking processes can be automated and mutually linked, the whole process can be realized without any electrical equipment and sensing devices, the manufacturing is simpler, and the subsequent maintenance and replacement are convenient;
4. according to the wafer processing thinning machine disclosed by the invention, the three working procedures of fine grinding, coarse grinding and polishing are integrated, so that the volume of equipment can be greatly reduced, meanwhile, the operation is simplified, an operator is more convenient and easy to operate when using, and the processing efficiency is effectively improved;
5. according to the wafer processing thinning machine disclosed by the invention, the positions of the wafers are not required to be transferred in the whole operation process, all processing procedures can be realized in the same place, the condition that the wafers are easy to damage in the back and forth transfer process is avoided, and the safety of wafer processing is greatly improved.
According to the invention, the fine grinding, coarse grinding and polishing processes are integrated, so that the whole processing process can be finished without transferring the wafer back and forth, the safety of the wafer is ensured, the equipment is smaller in size and simpler in operation, the fine grinding, coarse grinding and polishing processes can be realized by utilizing one power source, the manufacturing cost and the production cost are reduced to a certain extent, and the processing efficiency is also greatly improved.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objects and other advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the specification.
Drawings
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in the following preferred detail with reference to the accompanying drawings, in which:
FIG. 1 is a front view of the overall structure of a wafer processing and thinning machine according to the present invention;
FIG. 2 is a first front cross-sectional view showing the internal structure of a wafer processing and thinning machine according to the present invention;
FIG. 3 is a second front cross-sectional view of the internal structure of a wafer processing thinner of the present invention;
FIG. 4 is a bottom view of the overall structure of a wafer processing thinner according to the present invention;
FIG. 5 is a top cross-sectional view of the overall structure of a wafer processing thinner of the present invention;
FIG. 6 is a schematic view of the wafer processing thinner of the present invention, showing the overall structure of the wafer processing thinner of FIG. 5 with the rotating post removed;
FIG. 7 is a schematic view of the wafer processing thinner of the present invention with the brake mechanism removed from FIG. 5;
FIG. 8 is a perspective view of a transmission mechanism of a wafer processing and thinning machine according to the present invention;
FIG. 9 is a perspective view of a fixed disk structure of a wafer processing thinner according to the present invention;
FIG. 10 is a perspective view of a driving gear structure of a wafer processing and thinning machine according to the present invention;
FIG. 11 is a top view showing the overall structure of a brake mechanism of a wafer processing and thinning machine according to the present invention;
FIG. 12 is a cross-sectional view of the wafer processing thinner of FIG. 11 according to the present invention;
FIG. 13 is a perspective view showing a structure of a brake mechanism and a fixed disk of a wafer processing and thinning machine according to the present invention;
FIG. 14 is a perspective view showing the overall structure of a brake mechanism of a wafer processing and thinning machine according to the present invention;
FIG. 15 is a perspective view of a top block of a wafer processing thinner according to the present invention;
FIG. 16 is a partial perspective view of a brake mechanism of a wafer processing thinner according to the present invention;
FIG. 17 is a perspective view of a clamping bar structure of a wafer processing and thinning machine according to the present invention;
fig. 18 is a diagram showing a comparison of the connection structure of a plurality of brake mechanisms of a wafer processing and thinning machine according to the present invention.
Reference numerals: 1. a mounting box; 2. a rotating plate; 3. rotating the column; 4. a driving motor; 5. an outer toothed ring; 6. a mounting plate; 7. adjusting a motor; 8. an adjusting gear; 9. a rotating rod; 10. a fine grinding wheel; 11. rough grinding wheel; 12. a polishing wheel; 13. a driven gear; 14. a fixed plate; 15. an annular notch; 16. a slide plate; 17. a clamping rod; 171. a chuck; 18. a first spring; 19. a drive gear; 191. a clamping groove; 20. a fixing plate; 21. a slide bar; 22. a moving block; 23. a support rod; 24. a second spring; 25. a top block; 25a, inclined plane; 25b, plane one; 26. a ball; 27. a drive rack; 28. a support block; 29. a rotating shaft; 30. a long gear; 31. a support block; 32. double-sided racks; 32a, a first tooth set; 32b, a second tooth set; 33. a riser; 33a, plane two; 33b, arcuate concave surfaces.
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the illustrations provided in the following embodiments merely illustrate the basic idea of the present invention by way of illustration, and the following embodiments and features in the embodiments may be combined with each other without conflict.
Wherein the drawings are for illustrative purposes only and are shown in schematic, non-physical, and not intended to limit the invention; for the purpose of better illustrating embodiments of the invention, certain elements of the drawings may be omitted, enlarged or reduced and do not represent the size of the actual product; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numbers in the drawings of embodiments of the invention correspond to the same or similar components; in the description of the present invention, it should be understood that, if there are terms such as "upper", "lower", "left", "right", "front", "rear", etc., that indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but not for indicating or suggesting that the referred device or element must have a specific azimuth, be constructed and operated in a specific azimuth, so that the terms describing the positional relationship in the drawings are merely for exemplary illustration and should not be construed as limiting the present invention, and that the specific meaning of the above terms may be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
As shown in fig. 1-18, a wafer processing thinning machine comprises a mounting box 1, wherein the mounting box 1 is of a columnar structure, the bottom of the mounting box 1 is provided with an opening and is rotationally connected with a rotating plate 2, and an adjusting mechanism for adjusting the rotation of the rotating plate 2 is arranged on the outer wall of one side of the mounting box 1.
In the invention, the adjusting mechanism comprises an installing plate 6 fixedly connected to the outer wall of one side of the installing box 1, the bottom of the installing plate 6 is fixedly connected with an adjusting motor 7, an output shaft of the adjusting motor 7 is fixedly sleeved with an adjusting gear 8, and the outer wall of the rotating plate 2 is fixedly sleeved with an outer tooth ring 5 meshed with the adjusting gear 8.
The adjusting motor 7 is started, the rotating plate 2 can be driven to rotate through the meshing of the adjusting gear 8 and the outer gear ring 5, and then the position conversion of the fine grinding wheel 10, the rough grinding wheel 11 and the polishing wheel 12 can be adjusted, so that different thinning procedures on wafers can be realized conveniently.
In the invention, a rotating column 3 is rotationally connected to the top of a rotating plate 2, a driving motor 4 is fixedly connected to the outer wall of the top of a mounting box 1, an output shaft of the driving motor 4 penetrates through the mounting box 1 and is fixedly connected with the top of the rotating column 3, three rotating rods 9 with different lengths are annularly and equidistantly rotated and penetrate through the top of the rotating plate 2, and the bottom ends of the three rotating rods 9 are respectively and fixedly connected with a fine grinding wheel 10, a rough grinding wheel 11 and a polishing wheel 12;
in the invention, three groups of transmission mechanisms for respectively driving three rotating rods 9 to rotate are equidistantly arranged on the outer wall of a rotating column 3, each transmission mechanism comprises a driving gear 19 rotationally sleeved on the outer wall of the rotating column 3, a driven gear 13 is fixedly sleeved on the top end of each rotating rod 9, and the driven gears 13 are meshed with the driving gears 19.
When the driving gear 19 and the rotating column 3 are limited, the rotating rod 9 can be driven to rotate through the meshing of the driving gear 19 and the driven gear 13, and when the driving gear 19 and the rotating column 3 are not limited, the driving gear 19 cannot drive the rotating rod 9 to rotate through the meshing of the driving gear 19 and the driven gear 13.
In the invention, the transmission mechanism further comprises a fixed disc 14 fixedly sleeved on the outer wall of the rotary column 3, the fixed disc 14 is positioned below the driving gear 19, the side wall of the fixed disc 14 is provided with an annular notch 15, the fixed disc 14 is slidably sleeved with a sliding disc 16 positioned in the annular notch 15, the top of the sliding disc 16 is fixedly connected with a plurality of clamping rods 17 at equal intervals in an annular mode, the outer walls of the clamping rods 17 are sleeved with first springs 18, two ends of the first springs 18 are respectively fixedly connected with the outer walls of the clamping rods 17 and the top of the sliding disc 16, the top ends of the clamping rods 17 are respectively slidably penetrated through the top of the fixed disc 14 and fixedly connected with a clamping head 171, and the bottom of the driving gear 19 is provided with a plurality of clamping grooves 191 matched with the corresponding clamping rods 17.
When the sliding disc 16 slides upwards to press the first spring 18, the clamping rod 17 can be driven to move upwards, meanwhile, the clamping head 171 is driven to be clamped into the clamping groove 191, and at the moment, the driving gear 19 can be driven to rotate through the fixed disc 14 when the rotating column 3 rotates.
In the invention, the top of the rotating plate 2 is in an annular equidistant fixed connection with three fixed plates 20 with different heights, and one side of the top of each of the three fixed plates 20 is provided with a braking mechanism and a jacking mechanism which are mutually in transmission fit, wherein the braking mechanism is used for limiting and rotating a corresponding rotating rod 9, and the jacking mechanism is used for enabling a corresponding transmission mechanism to transmit the rotating rod 9.
In the invention, the jacking mechanism comprises two sliding rods 21 which symmetrically slide and penetrate through the inside of a fixed plate 20, one ends of the two sliding rods 21 close to a rotating column 3 are fixedly connected with the same moving block 22, the outer walls of the two sliding rods 21 are respectively sleeved with a second spring 24, two ends of the second spring 24 are respectively fixedly connected with one side of the fixed plate 20, which is close to the moving block 22, of the moving block 22, two supporting rods 23 are symmetrically and fixedly connected with one side of the moving block 22, which is far away from the fixed plate 20, one ends of the two supporting rods 23 extend into an annular notch 15 and are positioned below a sliding disc 16, top parts of the two supporting rods 23 are fixedly connected with a jacking block 25 for pushing the sliding disc 16 to move upwards, and a vertical plate 33 for pushing the two sliding rods 21 to move is fixedly connected with the inner wall of one side of the installation box 1.
When the rotating plate 2 rotates, the two sliding rods 21 can be driven to rotate through the fixed plate 20, when the two sliding rods 21 are in moving contact with the vertical plate 33, the moving block 22 can be pushed to move and stretch the second spring 24, meanwhile, the supporting rod 23 drives the top block 25 to move and pushes the sliding disc 16 to move upwards, when the top block 25 does not push the sliding disc 16 to ascend, the top block is located outside the annular notch 15, a part of the supporting rod 23 is located in the annular notch 15, but the rotating column 3 is not influenced to drive the fixed disc 14 and the sliding disc 16 to rotate, that is, the rotating of the sliding disc 16 cannot be influenced.
In the invention, the braking mechanism comprises a transmission rack 27 fixedly connected to one side of a moving block 22 far away from a rotating column 3, one end of the transmission rack 27 penetrates through a fixed plate 20 in a sliding manner, one side of the fixed plate 20 is fixedly connected with a supporting block 28, the top of the supporting block 28 is rotatably connected with a rotating shaft 29, a long gear 30 meshed with the transmission rack 27 is fixedly sleeved on the outer wall of the rotating shaft 29, a supporting block 31 is fixedly connected to the top of one side of the fixed plate 20, a double-sided rack 32 penetrates through the inside of the supporting block 31 in a sliding manner, and the double-sided rack 32 is respectively meshed with the long gear 30 and a corresponding driven gear 13.
Can drive the drive rack 27 and remove when movable block 22 removes to drive long gear 30 and rotate, and then drive two-sided rack 32 and then remove, drive two-sided rack 32 when movable block 22 inwards and do not mesh with driven gear 13, release the braking to driven gear 13 this moment, and then can drive driven gear 13 through driving gear 19 and rotate, drive two-sided rack 32 and driven gear 13 when movable block 22 outwards remove and mesh, can rotate spacing to driven gear 13 this moment, and then can carry out spacing to driving gear 19 with its meshing, avoid driving two other driving gears 19 and take place to rotate when the high-speed rotation of spliced pole 3.
Example two
This embodiment is a further improvement over the previous embodiment: as shown in fig. 1-18, a wafer processing thinning machine comprises a mounting box 1, wherein the mounting box 1 is of a columnar structure, the bottom of the mounting box 1 is provided with an opening and is rotationally connected with a rotating plate 2, and an adjusting mechanism for adjusting the rotation of the rotating plate 2 is arranged on the outer wall of one side of the mounting box 1.
In the invention, the adjusting mechanism comprises an installing plate 6 fixedly connected to the outer wall of one side of the installing box 1, the bottom of the installing plate 6 is fixedly connected with an adjusting motor 7, an output shaft of the adjusting motor 7 is fixedly sleeved with an adjusting gear 8, and the outer wall of the rotating plate 2 is fixedly sleeved with an outer tooth ring 5 meshed with the adjusting gear 8.
The adjusting motor 7 is started, the rotating plate 2 can be driven to rotate through the meshing of the adjusting gear 8 and the outer gear ring 5, and then the position conversion of the fine grinding wheel 10, the rough grinding wheel 11 and the polishing wheel 12 can be adjusted, so that different thinning procedures on wafers can be realized conveniently.
In the invention, a rotating column 3 is rotationally connected to the top of a rotating plate 2, a driving motor 4 is fixedly connected to the outer wall of the top of a mounting box 1, an output shaft of the driving motor 4 penetrates through the mounting box 1 and is fixedly connected with the top of the rotating column 3, three rotating rods 9 with different lengths are annularly and equidistantly rotated and penetrate through the top of the rotating plate 2, and the bottom ends of the three rotating rods 9 are respectively and fixedly connected with a fine grinding wheel 10, a rough grinding wheel 11 and a polishing wheel 12;
in the invention, three groups of transmission mechanisms for respectively driving three rotating rods 9 to rotate are equidistantly arranged on the outer wall of a rotating column 3, each transmission mechanism comprises a driving gear 19 rotationally sleeved on the outer wall of the rotating column 3, a driven gear 13 is fixedly sleeved on the top end of each rotating rod 9, and the driven gears 13 are meshed with the driving gears 19.
When the driving gear 19 and the rotating column 3 are limited, the rotating rod 9 can be driven to rotate through the meshing of the driving gear 19 and the driven gear 13, and when the driving gear 19 and the rotating column 3 are not limited, the driving gear 19 cannot drive the rotating rod 9 to rotate through the meshing of the driving gear 19 and the driven gear 13.
In the invention, the transmission mechanism further comprises a fixed disc 14 fixedly sleeved on the outer wall of the rotary column 3, the fixed disc 14 is positioned below the driving gear 19, the side wall of the fixed disc 14 is provided with an annular notch 15, the fixed disc 14 is slidably sleeved with a sliding disc 16 positioned in the annular notch 15, the top of the sliding disc 16 is fixedly connected with a plurality of clamping rods 17 at equal intervals in an annular mode, the outer walls of the clamping rods 17 are sleeved with first springs 18, two ends of the first springs 18 are respectively fixedly connected with the outer walls of the clamping rods 17 and the top of the sliding disc 16, the top ends of the clamping rods 17 are respectively slidably penetrated through the top of the fixed disc 14 and fixedly connected with a clamping head 171, and the bottom of the driving gear 19 is provided with a plurality of clamping grooves 191 matched with the corresponding clamping rods 17.
When the sliding disc 16 slides upwards to press the first spring 18, the clamping rod 17 can be driven to move upwards, meanwhile, the clamping head 171 is driven to be clamped into the clamping groove 191, and at the moment, the driving gear 19 can be driven to rotate through the fixed disc 14 when the rotating column 3 rotates.
In the present invention, the top end of the chuck 171 is in a shape of a truncated cone, the top of the slide plate 16 is provided with a plurality of relief grooves corresponding to the clamping rods 17, and the bottom ends of the clamping rods 17 are positioned in the relief grooves.
When the clamping head 171 is not correspondingly inserted into the clamping groove 191, the clamping head 171 is abutted against the bottom of the driving gear 19 and drives the bottom end of the clamping rod 17 to move downwards in the yielding groove, meanwhile, the first spring 18 is stretched, when the rotating column 3 rotates and drives the fixed disc 14 to rotate, the clamping head 171 can be driven to rotate, and when the clamping head 171 rotates to correspond to the clamping groove 191, the clamping head 171 can be driven to extend into the clamping groove 191 through the first spring 18, so that the automatic clamping effect is achieved.
In the invention, the top of the rotating plate 2 is in an annular equidistant fixed connection with three fixed plates 20 with different heights, and one side of the top of each of the three fixed plates 20 is provided with a braking mechanism and a jacking mechanism which are mutually in transmission fit, wherein the braking mechanism is used for limiting and rotating a corresponding rotating rod 9, and the jacking mechanism is used for enabling a corresponding transmission mechanism to transmit the rotating rod 9.
In the invention, the jacking mechanism comprises two sliding rods 21 which symmetrically slide and penetrate through the inside of a fixed plate 20, one ends of the two sliding rods 21 close to a rotating column 3 are fixedly connected with the same moving block 22, the outer walls of the two sliding rods 21 are respectively sleeved with a second spring 24, two ends of the second spring 24 are respectively fixedly connected with one side of the fixed plate 20, which is close to the moving block 22, of the moving block 22, two supporting rods 23 are symmetrically and fixedly connected with one side of the moving block 22, which is far away from the fixed plate 20, one ends of the two supporting rods 23 extend into an annular notch 15 and are positioned below a sliding disc 16, top parts of the two supporting rods 23 are fixedly connected with a jacking block 25 for pushing the sliding disc 16 to move upwards, and a vertical plate 33 for pushing the two sliding rods 21 to move is fixedly connected with the inner wall of one side of the installation box 1.
When the rotating plate 2 rotates, the two sliding rods 21 can be driven to rotate through the fixed plate 20, when the two sliding rods 21 are in moving contact with the vertical plate 33, the moving block 22 can be pushed to move and stretch the second spring 24, meanwhile, the supporting rod 23 drives the top block 25 to move and pushes the sliding disc 16 to move upwards, when the top block 25 does not push the sliding disc 16 to ascend, the top block is located outside the annular notch 15, a part of the supporting rod 23 is located in the annular notch 15, but the rotating column 3 is not influenced to drive the fixed disc 14 and the sliding disc 16 to rotate, that is, the rotating of the sliding disc 16 cannot be influenced.
In the present invention, the top surface of the top block 25 is respectively provided with an inclined surface 25a and a plane one 25b, the inclined surface 25a is used for lifting the slide plate 16, the plane one 25b is used for supporting the slide plate 16 in a rotating manner, and the top surface of the plane one 25b is movably embedded with the balls 26.
When the top block 25 moves, the slide plate 16 can be pushed to move upwards by the inclined surface 25a, the slide plate 16 finally stays on the first plane 25b to be rotatably supported, and when the slide plate 16 rotates along with the rotating column 3, the rotating friction force between the slide plate 16 and the top block 25 can be reduced by the balls 26, so that the rotation of the slide plate 16 is facilitated.
In the invention, a second plane 33a and two symmetrical arc concave surfaces 33b are respectively arranged on one side of the vertical plate 33, which is close to the rotating column 3, and the second plane 33a is positioned between the two arc concave surfaces 33b, the two arc concave surfaces 33b are respectively used for stretching and retracting the sliding rod 21, and the second plane 33a is used for positioning and supporting the sliding rod 21.
When the rotating plate 2 rotates, the two sliding rods 21 can be driven to rotate through the fixing plate 20, when the two sliding rods 21 are in moving contact with one of the arc-shaped concave surfaces 33b, the sliding rods 21 can be pushed to move inwards and stretch the second spring 24, meanwhile, the two sliding rods 21 are positioned and supported through the plane two 33a, and when the two sliding rods 21 rotate along with the fixing plate 20 again, the two sliding rods 21 can be abducted through the other arc-shaped concave surface 33b, so that the two sliding rods outwards move and reset under the action of the elastic force of the second spring 24.
In the invention, the braking mechanism comprises a transmission rack 27 fixedly connected to one side of a moving block 22 far away from a rotating column 3, one end of the transmission rack 27 penetrates through a fixed plate 20 in a sliding manner, one side of the fixed plate 20 is fixedly connected with a supporting block 28, the top of the supporting block 28 is rotatably connected with a rotating shaft 29, a long gear 30 meshed with the transmission rack 27 is fixedly sleeved on the outer wall of the rotating shaft 29, a supporting block 31 is fixedly connected to the top of one side of the fixed plate 20, a double-sided rack 32 penetrates through the inside of the supporting block 31 in a sliding manner, and the double-sided rack 32 is respectively meshed with the long gear 30 and a corresponding driven gear 13.
Can drive the drive rack 27 and remove when movable block 22 removes to drive long gear 30 and rotate, and then drive two-sided rack 32 and then remove, drive two-sided rack 32 when movable block 22 inwards and do not mesh with driven gear 13, release the braking to driven gear 13 this moment, and then can drive driven gear 13 through driving gear 19 and rotate, drive two-sided rack 32 and driven gear 13 when movable block 22 outwards remove and mesh, can rotate spacing to driven gear 13 this moment, and then can carry out spacing to driving gear 19 with its meshing, avoid driving two other driving gears 19 and take place to rotate when the high-speed rotation of spliced pole 3.
In the present invention, the double-sided rack 32 includes a first tooth set 32a and a second tooth set 32b, the first tooth set 32a is engaged with the long gear 30, and the second tooth set 32b is movably engaged with the corresponding driven gear 13.
The first tooth set 32a is always engaged with the long gear 30, and the second tooth set 32b is movably engaged with the driven gear 13, so that the driven gear 13 is rotationally limited when engaged, and the limit is released when disengaged.
Working principle: the driving motor 4 is started to drive the rotating column 3 to rotate, three fixed plates 14 can be driven to rotate simultaneously, only one fixed plate 14 can drive the corresponding driving gear 19 to rotate and drive the driven gear 13 meshed with the fixed plate 14 to rotate, then the coarse grinding wheel 11 is driven to rotate through the rotating rod 9 to perform coarse grinding on a wafer, after the coarse grinding stage is finished, the driving motor 4 is closed, the adjusting motor 7 is started, the rotating plate 2 is driven to rotate through the meshing of the adjusting gear 8 and the outer gear ring 5, the position of the fine grinding wheel 10 to the coarse grinding wheel 11 is adjusted (the adjusting motor 7 is closed after the rotating plate 2 rotates for 120 degrees), in the rotating process of the rotating plate 2, the three fixed plates 20 can be driven to synchronously rotate, the fixed plates 20 drive the sliding rod 21 to rotate, when the sliding rod 21 is in moving contact with one arc-shaped concave 33b, the sliding rod 21 can be pushed to move inwards and stretch the second spring 24, the slide bar 21 pushes the moving block 22 to move, meanwhile drives the supporting rod 23 to move, and drives the top block 25 to push the corresponding slide disc 16 to move upwards, the slide disc 16 drives the clamping rod 17 to move upwards, and the clamping head 171 is clamped in the clamping groove 191, so that the clamping and positioning of the fixed disc 14 and the driving gear 19 are completed, the driving rack 27 can be driven to move when the moving block 22 moves, the double-sided rack 32 is driven to move through the meshing with the long gear 30, the double-sided rack 32 is separated from the meshing with the corresponding driven gear 13, at the moment, the driving motor 4 is started again to drive the rotating column 3 to rotate, the rotating rod 9 is driven to rotate through the meshing of the other driving gear 19 and the corresponding driven gear 13, further the finish grinding wheel 10 is driven to rotate, after the finish grinding is completed, the finish grinding is repeated, the previous operation is carried out to enable the rotating plate 2 to rotate 120 degrees, the polishing wheel 12 is adjusted to the position of the fine grinding wheel 10, so that the polishing processing of the wafer is realized, all procedures of rough grinding, fine grinding and polishing can be finished without transferring the wafer in the whole processing process, and the polishing device can be realized by one power source and is simpler in operation.
However, as well known to those skilled in the art, the working principles and wiring methods of the driving motor 4 and the adjusting motor 7 are common, which are all conventional means or common general knowledge, and are not described herein in detail, and any choice can be made by those skilled in the art according to their needs or convenience.
Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the present invention, which is intended to be covered by the claims of the present invention.
Claims (8)
1. The wafer processing thinning machine comprises an installation box (1), and is characterized in that the installation box (1) is of a columnar structure, the bottom of the installation box (1) is provided with an opening and is rotationally connected with a rotating plate (2), and an adjusting mechanism for adjusting the rotating plate (2) to rotate is arranged on the outer wall of one side of the installation box (1);
the top of the rotating plate (2) is rotationally connected with a rotating column (3), the outer wall of the top of the mounting box (1) is fixedly connected with a driving motor (4), an output shaft of the driving motor (4) penetrates through the mounting box (1) and is fixedly connected with the top of the rotating column (3), the top of the rotating plate (2) is annular and is rotationally provided with three rotating rods (9) with different lengths in an equidistant mode, the bottom ends of the three rotating rods (9) are respectively and fixedly connected with a fine grinding wheel (10), a rough grinding wheel (11) and a polishing wheel (12), and three groups of transmission mechanisms for respectively driving the three rotating rods (9) to rotate are equidistantly arranged on the outer wall of the rotating column (3);
the top of the rotating plate (2) is in annular equidistant fixed connection with three fixed plates (20) with different heights, one sides of the tops of the three fixed plates (20) are respectively provided with a braking mechanism and a jacking mechanism which are mutually in transmission fit, the braking mechanism is used for limiting and rotating a corresponding rotating rod (9), and the jacking mechanism is used for enabling a corresponding transmission mechanism to transmit the rotating rod (9);
the top connection mechanism comprises two sliding rods (21) which symmetrically slide and penetrate through the inside of the fixed plate (20), one end, close to the rotating column (3), of each sliding rod (21) is fixedly connected with a same moving block (22), second springs (24) are sleeved on the outer walls of the two sliding rods (21), two ends of each second spring (24) are fixedly connected with one side, close to the fixed plate (20) and the moving block (22), of each moving block (22), two supporting rods (23) are symmetrically and fixedly connected with one side, far away from the fixed plate (20), of each moving block (22), one end of each supporting rod (23) extends into an annular notch (15) and is located below the sliding disc (16), top blocks (25) for pushing the sliding disc (16) to move upwards are fixedly connected to the tops of the two supporting rods (23), and a vertical plate (33) for pushing the two sliding rods (21) to move is fixedly connected to the inner wall of one side of the installation box (1).
The braking mechanism comprises a transmission rack (27) fixedly connected to one side, far away from the rotary column (3), of the movable block (22), one end of the transmission rack (27) penetrates through the fixed plate (20) in a sliding mode, one side of the fixed plate (20) is fixedly connected with a supporting block (28), the top of the supporting block (28) is rotationally connected with a rotating shaft (29), the outer wall of the rotating shaft (29) is fixedly sleeved with a long gear (30) meshed with the transmission rack (27), one side top of the fixed plate (20) is fixedly connected with a supporting block (31), a double-sided rack (32) is penetrated through the inside of the supporting block (31) in a sliding mode, and the double-sided rack (32) is meshed with the long gear (30) and a corresponding driven gear (13) respectively.
2. A wafer processing thinning machine according to claim 1, wherein the adjusting mechanism comprises an installing plate (6) fixedly connected to the outer wall of one side of the installing box (1), an adjusting motor (7) is fixedly connected to the bottom of the installing plate (6), an adjusting gear (8) is fixedly sleeved on an output shaft of the adjusting motor (7), and an outer tooth ring (5) meshed with the adjusting gear (8) is fixedly sleeved on the outer wall of the rotating plate (2).
3. A wafer processing thinning machine according to claim 1, wherein the transmission mechanism comprises a driving gear (19) rotatably sleeved on the outer wall of the rotary column (3), a driven gear (13) is fixedly sleeved on the top end of the rotary rod (9), and the driven gear (13) is meshed with the driving gear (19).
4. A wafer processing thinning machine according to claim 3, wherein the transmission mechanism further comprises a fixed disc (14) fixedly sleeved on the outer wall of the rotary column (3), the fixed disc (14) is located below the driving gear (19), the side wall of the fixed disc (14) is provided with an annular notch (15), the fixed disc (14) is slidably sleeved with a sliding disc (16) located in the annular notch (15), the top of the sliding disc (16) is fixedly connected with a plurality of clamping rods (17) at equal intervals in an annular shape, the outer walls of the plurality of clamping rods (17) are respectively sleeved with a first spring (18), two ends of the first springs (18) are respectively fixedly connected with the outer walls of the clamping rods (17) and the top of the sliding disc (16), the top ends of the plurality of clamping rods (17) are respectively slidably penetrated through the top of the fixed disc (14) and are fixedly connected with clamping heads (171), and the bottoms of the plurality of the driving gears (19) are respectively provided with a plurality of clamping grooves (191) matched with the corresponding clamping rods (17).
5. The wafer processing and thinning machine according to claim 4, wherein the top end of the chuck (171) is in a shape of a circular table, a plurality of abdication grooves corresponding to the clamping rods (17) are arranged at the top of the sliding disc (16), and the bottom ends of the clamping rods (17) are positioned in the abdication grooves.
6. A wafer processing thinning machine according to claim 4, wherein the top surface of the top block (25) is respectively provided with an inclined surface (25 a) and a plane one (25 b), the inclined surface (25 a) is used for lifting the slide plate (16), the plane one (25 b) is used for rotatably supporting the slide plate (16), and the top surface of the plane one (25 b) is movably embedded with a ball (26).
7. The wafer processing and thinning machine according to claim 6, wherein a plane two (33 a) and two symmetrical arc concave surfaces (33 b) are respectively arranged on one side of the vertical plate (33) close to the rotating column (3), the plane two (33 a) is located between the two arc concave surfaces (33 b), the two arc concave surfaces (33 b) are respectively used for stretching and retracting the sliding rod (21), and the plane two (33 a) is used for positioning and supporting the sliding rod (21).
8. A wafer processing and thinning machine according to claim 6 wherein the double-sided rack (32) comprises a first set of teeth (32 a) and a second set of teeth (32 b), the first set of teeth (32 a) being in mesh with the long gear (30) and the second set of teeth (32 b) being in movable mesh with the corresponding driven gear (13).
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB190103285A (en) * | 1901-02-15 | 1901-05-11 | Oliver Perry Shaver | Improvements in Changeable Speed and Reversible Gearing. |
| CN101352828A (en) * | 2008-08-01 | 2009-01-28 | 无锡开源机床集团有限公司 | Device for surface cleaning and polishing semiconductor chip and suction disc |
| CN110303415A (en) * | 2019-07-09 | 2019-10-08 | 张宇 | A kind of intelligence polishing machine |
| CN111515850A (en) * | 2020-05-08 | 2020-08-11 | 深圳市晶龙达光学实业有限公司 | Lens thickness processing system and processing technology thereof |
| CN211439504U (en) * | 2019-12-18 | 2020-09-08 | 成都迈科科技有限公司 | Glass wafer polishing machine |
| CN113561053A (en) * | 2021-08-03 | 2021-10-29 | 青岛佳恩半导体有限公司 | Preparation equipment and method of ultrathin silicon carbide single crystal substrate |
| CN214685630U (en) * | 2021-04-23 | 2021-11-12 | 无锡市芯通电子科技有限公司 | Semiconductor wafer thinning device convenient for replacing grinding wheel |
| CN113894635A (en) * | 2021-11-03 | 2022-01-07 | 安徽格楠机械有限公司 | Self-learning-based intelligent silicon-based wafer ultra-precision grinding and polishing machine |
| CN114714234A (en) * | 2022-05-13 | 2022-07-08 | 安徽微芯长江半导体材料有限公司 | Silicon carbide wafer thinning device and method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110605629B (en) * | 2019-09-19 | 2022-11-18 | 西安奕斯伟材料科技有限公司 | Grinding device |
-
2022
- 2022-07-27 CN CN202210889333.9A patent/CN115256087B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB190103285A (en) * | 1901-02-15 | 1901-05-11 | Oliver Perry Shaver | Improvements in Changeable Speed and Reversible Gearing. |
| CN101352828A (en) * | 2008-08-01 | 2009-01-28 | 无锡开源机床集团有限公司 | Device for surface cleaning and polishing semiconductor chip and suction disc |
| CN110303415A (en) * | 2019-07-09 | 2019-10-08 | 张宇 | A kind of intelligence polishing machine |
| CN211439504U (en) * | 2019-12-18 | 2020-09-08 | 成都迈科科技有限公司 | Glass wafer polishing machine |
| CN111515850A (en) * | 2020-05-08 | 2020-08-11 | 深圳市晶龙达光学实业有限公司 | Lens thickness processing system and processing technology thereof |
| CN214685630U (en) * | 2021-04-23 | 2021-11-12 | 无锡市芯通电子科技有限公司 | Semiconductor wafer thinning device convenient for replacing grinding wheel |
| CN113561053A (en) * | 2021-08-03 | 2021-10-29 | 青岛佳恩半导体有限公司 | Preparation equipment and method of ultrathin silicon carbide single crystal substrate |
| CN113894635A (en) * | 2021-11-03 | 2022-01-07 | 安徽格楠机械有限公司 | Self-learning-based intelligent silicon-based wafer ultra-precision grinding and polishing machine |
| CN114714234A (en) * | 2022-05-13 | 2022-07-08 | 安徽微芯长江半导体材料有限公司 | Silicon carbide wafer thinning device and method |
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