CN115254797A - Method and apparatus for cleaning adhesive material, storage medium, and electronic apparatus - Google Patents
Method and apparatus for cleaning adhesive material, storage medium, and electronic apparatus Download PDFInfo
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- CN115254797A CN115254797A CN202210520970.9A CN202210520970A CN115254797A CN 115254797 A CN115254797 A CN 115254797A CN 202210520970 A CN202210520970 A CN 202210520970A CN 115254797 A CN115254797 A CN 115254797A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
Abstract
The application discloses a cleaning method and device for an adhesion material, a storage medium and an electronic device, wherein the method comprises the following steps: in the process of controlling the initial light beam to clean a target area on a material to be cleaned, detecting the residual attachment characteristics of the attached material in the target area, wherein the residual attachment characteristics are used for indicating the material properties of the residual part of the attached material in the target area; adjusting the initial light beam into a target light beam matched with the residual attachment features, wherein the cleaning quality of the target light beam on the attachment materials with the residual attachment features is higher than the target cleaning quality; by adopting the technical scheme, the problems of low cleaning quality of the adhesion material and the like in the related technology are solved, and the technical effect of improving the cleaning quality of the adhesion material is realized.
Description
Technical Field
The present disclosure relates to the field of laser, and more particularly, to a method and an apparatus for cleaning an adhesion material, a storage medium, and an electronic apparatus.
Background
In the industrial production process, in order to meet the manufacturing requirements of products, the adhesion materials on the surfaces of materials need to be cleaned completely or accurately, for example, in the manufacturing of power batteries, an aluminum metal mesh with carbon composite coatings coated on the front and back sides needs to be used, and the adhesion materials at specified positions need to be cleaned to prepare for welding conductive potentials. In order to clean the adhering material on the surface of the material, a mechanical polishing method is generally used in the related art, that is, the adhering material on the surface of the material is cleaned by directly contacting the polishing material with the processing object, but the cleaning precision of this method is poor, and the adhering material on the surface is not cleaned in place and is excessively cleaned to damage the material, so that it is difficult to control the cleaning quality of the adhering material on the surface of the material.
Aiming at the problems of low cleaning quality of the adhesion materials and the like in the related art, no effective solution is provided.
Disclosure of Invention
The embodiment of the application provides a method and a device for cleaning an adhesion material, a storage medium and an electronic device, which are used for at least solving the problems of low cleaning quality of the adhesion material and the like in the related art.
According to an embodiment of the present application, there is provided a method of cleaning an adhesion material, including: detecting the residual attachment characteristic of the attached attachment material in a target area in the process of controlling the initial light beam to clean the target area on the material to be cleaned, wherein the residual attachment characteristic is used for indicating the material property of the residual part of the attachment material in the target area; adjusting the initial light beam into a target light beam matched with the residual attachment features, wherein the target light beam has a higher cleaning quality for the attachment material with the residual attachment features than a target cleaning quality; and controlling the target light beam to clean the target area.
Optionally, the adjusting the initial beam to be a target beam matched with the remaining attachment features includes: calculating target beam parameters according to the target material characteristics and the target thickness characteristics included in the residual adhesion characteristics; adjusting the initial beam to the target beam that satisfies the target beam parameter.
Optionally, the calculating target beam parameters according to the target material characteristics and the target thickness characteristics included in the remaining attachment characteristics includes at least one of: under the condition that the target thickness characteristic is larger than or equal to a first thickness threshold value, acquiring a first light beam parameter corresponding to the target material characteristic from the adhesive material characteristic and the light beam parameter which have corresponding relation, and taking the first light beam parameter as the target light beam parameter; acquiring a reference material characteristic of the material to be cleaned under the condition that the target thickness characteristic is smaller than a first thickness threshold value; and acquiring second light beam parameters corresponding to the reference material characteristic and the target material characteristic from the material characteristic of the material to be cleaned, the material characteristic of the attached material and the light beam parameters which have corresponding relations, and taking the second light beam parameters as the target light beam parameters.
Optionally, the adjusting the initial beam to the target beam satisfying the target beam parameter includes: determining an initial beam parameter of the initial beam; determining a difference between the initial beam parameter and the target beam parameter as a beam adjustment amplitude; and adjusting the initial beam parameters according to the adjustment amplitude to obtain the target beam.
Optionally, the controlling the target beam to clean the target area includes: determining a target cleaning speed according to the target light beam and the residual adhesion characteristics; and controlling the target light beam to clean the target area according to the target cleaning speed.
Optionally, the determining a target cleaning speed according to the target beam and the remaining attachment features includes at least one of: under the condition that the target thickness characteristic included in the residual adhesion characteristics is larger than or equal to a second thickness threshold value, acquiring a first cleaning speed corresponding to the target beam parameter and the target material characteristic included in the residual adhesion characteristics from the beam parameter, the adhesion material characteristic and the cleaning speed which have corresponding relations, and taking the first cleaning speed as the target cleaning speed; and under the condition that the target thickness characteristic included in the residual adhesion characteristic is smaller than a second thickness threshold value, acquiring a second cleaning speed corresponding to the target beam parameter, the target material characteristic included in the residual adhesion characteristic and the reference material characteristic of the material to be cleaned from the beam parameter, the adhesion material characteristic, the material characteristic to be cleaned and the cleaning speed which have corresponding relations, and taking the second cleaning speed as the target cleaning speed.
Optionally, the controlling the target beam to clean the target area according to the target cleaning speed includes: determining a dust removal speed matched with the target cleaning speed; and controlling the target light beam to clean the target area according to the target cleaning speed, and simultaneously controlling a dust removal device to clean impurities generated by cleaning the target area according to the dust removal speed.
There is also provided, in accordance with another embodiment of the present application, a cleaning apparatus for an adhesion material, including: the device comprises a detection module, a detection module and a control module, wherein the detection module is used for detecting the residual attachment characteristics of the attached materials in a target area in the process of controlling an initial light beam to clean the target area on the materials to be cleaned, and the residual attachment characteristics are used for indicating the material properties of the residual parts of the attached materials in the target area; an adjusting module for adjusting the initial light beam into a target light beam matched with the residual attachment features, wherein the cleaning quality of the target light beam on the attachment material with the residual attachment features is higher than the target cleaning quality; and the control module is used for controlling the target light beam to clean the target area.
According to still another aspect of the embodiments of the present application, there is also provided a computer-readable storage medium having a computer program stored therein, wherein the computer program is configured to execute the above cleaning method for an attached material when executed.
According to another aspect of the embodiments of the present application, there is provided an electronic apparatus, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the above cleaning method for the adhesive material by using the computer program.
In the embodiment of the application, in the process of controlling the initial light beam to clean the target area on the material to be cleaned, the remaining attachment characteristics of the attached attachment material in the target area are detected, wherein the remaining attachment characteristics are used for indicating the material properties of the remaining part of the attachment material in the target area; adjusting the initial light beam into a target light beam matched with the residual attachment features, wherein the cleaning quality of the target light beam on the attachment materials with the residual attachment features is higher than the target cleaning quality; the target light beam is controlled to clean the target area, namely the light beam is used for cleaning the attached materials on the surface of the material to be cleaned, in the process of cleaning the attached materials in the target area on the surface of the material to be cleaned by using the light beam, the light beam used for cleaning the remaining attached materials can be adjusted according to the detected remaining attachment characteristics of the remaining attached materials in the target area, so that the adjusted target light beam is matched with the remaining attachment characteristics, and the cleaning quality of the target light beam on the attached materials with the remaining attachment characteristics is higher than that of the target cleaning quality, so that the cleaning quality of the attached materials on the surface of the material to be cleaned can be ensured to be higher than that of the target cleaning quality when the target light beam is controlled to clean the target area. By adopting the technical scheme, the problems of low cleaning quality of the adhesion materials and the like in the related technology are solved, and the technical effect of improving the cleaning quality of the adhesion materials is realized.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
FIG. 1 is a schematic diagram of a hardware environment for a method of cleaning an adherent material according to an embodiment of the application;
FIG. 2 is a flow chart of a method of cleaning an adherent material according to an embodiment of the application;
FIG. 3 is a schematic illustration of an alternative attachment material cleaning in accordance with an embodiment of the present application;
FIG. 4 is a schematic view of an alternative attached material cleaning apparatus according to an embodiment of the present application;
FIG. 5 is a flow diagram of an alternative attachment material cleaning process according to an embodiment of the present application;
fig. 6 is a block diagram of a cleaning apparatus for an attached material according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The method provided by the embodiment of the application can be executed in a computer terminal, a device terminal or a similar operation device. For example, when the cleaning device is operated on a computer terminal, fig. 1 is a hardware environment diagram of a cleaning method for an attached material according to an embodiment of the present application. As shown in fig. 1, the computer terminal may include one or more (only one shown in fig. 1) processors 102 (the processors 102 may include, but are not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data, and in an exemplary embodiment, may also include a transmission device 106 for communication functions and an input-output device 108. It will be understood by those skilled in the art that the structure shown in fig. 1 is only an illustration and is not intended to limit the structure of the computer terminal. For example, a computer terminal may also include more or fewer components than shown in FIG. 1, or have a different configuration with equivalent functionality to that shown in FIG. 1 or more functionality than that shown in FIG. 1.
The memory 104 may be used to store computer programs, for example, software programs and modules of application software, such as a computer program corresponding to the message pushing sending method in the embodiment of the present invention, and the processor 102 executes various functional applications and data processing by running the computer programs stored in the memory 104, that is, implements the method described above. The memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 can further include memory located remotely from the processor 102, which can be connected to a computer terminal over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The transmission device 106 is used for receiving or transmitting data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider of the computer terminal. In one example, the transmission device 106 includes a Network adapter (NIC), which can be connected to other Network devices through a base station so as to communicate with the internet. In one example, the transmission device 106 may be a Radio Frequency (RF) module, which is used for communicating with the internet in a wireless manner.
In this embodiment, a method is provided, which is applied to the computer terminal, and fig. 2 is a flowchart of a method for cleaning an adhesive material according to an embodiment of the present application, where the method includes the following steps:
step S202, in the process of controlling the initial light beam to clean a target area on a material to be cleaned, detecting the residual attachment characteristics of the attached material in the target area, wherein the residual attachment characteristics are used for indicating the material properties of the residual part of the attached material in the target area;
step S204, adjusting the initial light beam into a target light beam matched with the residual adhesion characteristics, wherein the cleaning quality of the target light beam on the adhesion materials with the residual adhesion characteristics is higher than the target cleaning quality;
and step S206, controlling the target light beam to clean the target area.
Through the steps, the material to be cleaned is cleaned by using the light beam, in the process of cleaning the attached material in the target area on the surface of the material to be cleaned by using the light beam, the light beam used for cleaning the residual attached material can be adjusted according to the detected residual attachment characteristics of the residual attached material in the target area, so that the adjusted target light beam is matched with the residual attachment characteristics, and the cleaning quality of the target light beam on the attached material with the residual attachment characteristics is higher than the target cleaning quality, so that the cleaning quality of the attached material on the surface of the material to be cleaned can be ensured to be higher than the target cleaning quality when the target light beam is controlled to clean the target area. By adopting the technical scheme, the problems of low cleaning quality of the adhesion materials and the like in the related technology are solved, and the technical effect of improving the cleaning quality of the adhesion materials is realized.
In the technical solution provided in the above step S202, the target area is an irradiation area of the initial beam.
Optionally, in this embodiment, the material to be cleaned may be not limited to a metal material or a non-metal material, for example, the target material may be a metal material such as iron and aluminum, or a non-metal material such as plastic and wood, and this scheme is not limited to this.
Alternatively, in this embodiment, the remaining attachment features may be limited to include material type, material thickness, material hardness, and the like.
Optionally, in this embodiment, the attachment species in the target region may be one or more.
In the technical solution provided in the above step S204, the cleaning quality may not be limited to indicating the residual amount of the deposit on the surface of the material after cleaning, the damage condition of the substrate of the material to be cleaned, and the like.
Alternatively, in this embodiment, the adjusting of the initial beam to the target beam may be by using a different beam generating device to generate target beams matching different remaining features, or may also be by using a beam shaping device to beam-shape beams generated by the same beam generating device to obtain target beams matching different remaining features.
In the technical solution provided in step S206, when the target area is cleaned by controlling the target beam, the cleaning may be performed but not limited to a cleaning manner matching with the remaining adhesion characteristics, where the cleaning manner may include but is not limited to a cleaning speed, a cleaning direction (moving direction of the beam), and the like, and this solution is not limited thereto.
One or more kinds of adhesive materials may be attached to the surface of the material to be cleaned, and in order to ensure the cleaning quality of the adhesive materials, the light beam needs to be adjusted in real time according to the attachment characteristics of the remaining adhesive materials on the surface of the material to be cleaned, fig. 3 is an optional adhesive material cleaning schematic diagram according to an embodiment of the present application, as shown in fig. 3, two kinds of adhesive materials remain on the surface of the material to be cleaned, and the light beam generator can generate light beams with different light beam parameters.
As an alternative embodiment, the adjusting the initial beam to a target beam matching the remaining attachment features comprises:
calculating target beam parameters according to the target material characteristics and the target thickness characteristics included in the residual adhesion characteristics;
adjusting the initial beam to the target beam that satisfies the target beam parameter.
Alternatively, in the present embodiment, the target parameters may include, but are not limited to, beam frequency, beam power, spot size irradiated on the surface of the remaining material, beam type, energy density, and the like.
Optionally, in this embodiment, the target material characteristic may include, but is not limited to, a material name, a beam property of the light beam (such as an absorption rate, a reflectivity, and the like of the light beam), a material hardness, and the like, which is not limited in this embodiment.
Through the steps, after the residual adhesion characteristics of the adhesion materials are changed, target light beam parameters matched with the residual adhesion characteristics are obtained through calculation of the target material characteristics and the target thickness characteristics of the residual adhesion materials, and the light beam parameters of the light beam for cleaning the adhesion materials are matched with the residual adhesion characteristics through adjustment of the light beam parameters of the initial light beam, so that the cleaning quality of the adhesion materials is ensured.
As an alternative embodiment, the calculating the target beam parameter according to the target material characteristic and the target thickness characteristic included in the remaining attachment characteristics includes at least one of:
under the condition that the target thickness characteristic is larger than or equal to a first thickness threshold value, acquiring a first light beam parameter corresponding to the target material characteristic from the adhesive material characteristic and the light beam parameter which have corresponding relation, and taking the first light beam parameter as the target light beam parameter;
acquiring a reference material characteristic of the material to be cleaned under the condition that the target thickness characteristic is smaller than a first thickness threshold value; and acquiring second light beam parameters corresponding to the reference material characteristics and the target material characteristics from the material characteristics of the material to be cleaned, the material characteristics of the attached material and the light beam parameters which have corresponding relations, and taking the second light beam parameters as the target light beam parameters.
Optionally, in this embodiment, the reference material characteristic of the material to be cleaned may include, but is not limited to, a material hardness of the material to be cleaned, an optical property of the light beam (such as an absorption rate, a reflection rate, and the like of the light beam), a material thickness, and the like, and this is not limited in this embodiment.
Optionally, in this embodiment, the first thickness threshold may be, but is not limited to, determined according to a reference material characteristic of the material to be cleaned, for example, when the hardness of the material to be cleaned is different, the determined first thickness threshold is also different, which is not limited in this embodiment.
Through the steps, the target thickness characteristic of the residual adhesive material is compared with the first thickness threshold, and when the target thickness characteristic is smaller than or equal to the first thickness threshold, the beam parameters of the target beam are determined according to the reference material characteristic and the target material characteristic of the material to be cleaned, so that the surface of the base material of the material to be cleaned is not damaged on the premise of ensuring the cleaning quality of the adhesive material.
As an alternative embodiment, the adjusting the initial beam to the target beam satisfying the target beam parameter includes:
determining an initial beam parameter of the initial beam;
determining a difference between the initial beam parameter and the target beam parameter as a beam adjustment amplitude;
and adjusting the initial beam parameters according to the adjustment amplitude value to obtain the target beam.
Alternatively, in this embodiment, the initial beam parameter and the target beam parameter may be the same, and the beam adjustment amplitude is zero when the initial beam parameter and the target beam parameter are the same.
Optionally, in this embodiment, the initial beam and the target beam may be single beams or may be combined beams, for example, the initial beam may be a combined beam composed of a pulse beam and a continuous beam, or may include only a pulse beam or a combined beam, which is not limited in this embodiment.
As an alternative embodiment, the controlling the target beam to clean the target area includes:
determining a target cleaning speed according to the target light beam and the residual adhesion characteristics;
and controlling the target light beam to clean the target area according to the target cleaning speed.
Alternatively, in this embodiment, the target cleaning speed is used to indicate the moving speed of the target spot of the target beam for cleaning the material with respect to the surface of the attached material.
Alternatively, in this embodiment, the method for controlling the cleaning speed may be to fixedly control the moving speed of the target beam on the material to be cleaned, or to simultaneously control the moving speeds of the material to be cleaned and the target beam, which is not limited in this embodiment.
As an alternative embodiment, said determining a target cleaning speed based on said target beam and said remaining adhesion characteristics comprises at least one of:
under the condition that the target thickness characteristic included in the residual adhesion characteristics is larger than or equal to a second thickness threshold value, acquiring a first cleaning speed corresponding to the target beam parameter and the target material characteristic included in the residual adhesion characteristics from the beam parameter, the adhesion material characteristic and the cleaning speed which have corresponding relations, and taking the first cleaning speed as the target cleaning speed;
and under the condition that the target thickness characteristic included in the residual adhesion characteristic is smaller than a second thickness threshold value, acquiring a second cleaning speed corresponding to the target beam parameter, the target material characteristic included in the residual adhesion characteristic and the reference material characteristic of the material to be cleaned from the beam parameter, the adhesion material characteristic, the material characteristic to be cleaned and the cleaning speed which have corresponding relations, and taking the second cleaning speed as the target cleaning speed.
Optionally, in this embodiment, the second thickness threshold may be, but is not limited to, determined according to a reference material characteristic of the material to be cleaned, for example, when the hardness of the material to be cleaned is different, the determined second thickness threshold is also different, which is not limited in this scheme.
Optionally, in this embodiment, values of the second thickness threshold and the first thickness threshold may be the same or different, and this is not limited in this embodiment.
As an alternative embodiment, the controlling the target beam to clean the target area at the target cleaning speed includes:
determining a dust removal speed matched with the target cleaning speed;
and controlling the target light beam to clean the target area according to the target cleaning speed, and simultaneously controlling a dust removal device to clean impurities generated by cleaning the target area according to the dust removal speed.
Optionally, in this embodiment, the dust removal may be performed by one or more of wind dust removal, electrostatic dust removal, magnetic dust removal, and the like. For example, the wind power dust removal is to collect dust through a dust collector, and the adsorption pressure is adjustable; the electrostatic dust removal is to electrify the material, so that static electricity is generated on the fragments, the fragments in the holes are removed through the electrostatic action, and the dust removal speed is controlled by controlling the size of the static electricity; the magnetic dust removal is to remove the scrap iron in the holes by the attraction of magnetic force to the scrap iron, and the speed of cleaning the scrap iron is controlled by controlling the magnitude of the magnetic force.
In the process of cleaning the adhesive material on the surface of the material by using the light beam, the residual adhesive characteristics of the adhesive material can change in real time along with the cleaning process, so that the cleaning quality of the adhesive material cannot be guaranteed by using a single cleaning light beam and a cleaning mode, therefore, in order to guarantee the cleaning quality of the adhesive material, the cleaning light beam needs to be changed in real time according to the residual characteristics of the adhesive material, fig. 4 is a schematic diagram of optional adhesive material cleaning equipment according to the embodiment of the application, the equipment can be but is not limited to cleaning a metal net surface coating by using laser, so that the problems of low efficiency and poor precision of a mechanical polishing method are solved, as shown in fig. 4, the adhesive material cleaning equipment can be but is not limited to comprise a laser (for example, a laser with a wavelength of 1064nm, a repetition frequency of 200 kHz-1000 kHz, a laser with a power of 50W-200W and a pulse width of 30 ns-350 ns), a tool module and a dust removal device, the tool module comprises an adsorption and a high-precision automatic lifting table, the material to be placed on the adsorption tool, the high-precision lifting table, the high-precision scanning laser is placed on the adsorption tool, and then enters the high-precision scanning field-scanning laser scanning mirror, and the laser is matched with the laser scanning field scanning mirror. When laser continuously processes a single pattern, the lifting platform rises at a uniform and slow speed, and the residual adhesion characteristics of the adhesion materials are continuously changed along with the cleaning process of the adhesion materials by the laser, so that the parameters of the light beam output by the laser also need to be correspondingly changed (for example, the parameters of the light beam output by the laser are matched by using a high-efficiency wide pulse width and a low-damage narrow pulse width in the cleaning process, so that the reticular base material is greatly protected from being damaged). A large amount of dust is generated in the process of laser cleaning materials attached to the surfaces of the materials to be cleaned, dust is sucked away by adopting dust removal equipment, the dust flying into the air is prevented from interfering the light path, and the dust falling on the materials is prevented from being processed again to influence the processing quality. In the process, the material is adsorbed and fixed through the adsorption holes and the clamping grooves on the jig, and the material is prevented from moving in the machining process.
Through the control of the above attached material cleaning apparatus, the cleaning process of the attached material on the surface of the material to be cleaned is improved on the premise of ensuring that the base layer of the material to be cleaned is not damaged, and fig. 5 is an optional attached material cleaning flow chart according to an embodiment of the present application, as shown in fig. 5, which may include, but is not limited to, the following:
s501, when the surface attachments of the material to be cleaned need to be cleaned, dividing the area on the material to be cleaned, to which the attachments are attached, into a plurality of target areas, and generating an initial light beam with light beam parameters matching the attachments according to the attachments (thickness, type, etc.) of the attachments in the target areas.
S502, after the initial light beam is generated, the corresponding initial cleaning speed is determined according to the material characteristics of the attached materials, so that the initial light beam is controlled to clean the attached materials with the characteristics according to the initial cleaning speed, and in the cleaning process, the dust removal equipment is controlled to remove dust according to the dust removal speed matched with the initial cleaning speed, so that the influence of dust generated in the cleaning process on the light beam is avoided.
S503, since the adhesion characteristics of the adhesion material are continuously changed during the cleaning process, in order to ensure the cleaning quality of the adhesion material, the initial light beam needs to be adjusted according to the remaining adhesion characteristics of the remaining adhesion material during the cleaning process, so that the beam parameters of the target light beam for cleaning the remaining adhesion material of the remaining adhesion characteristics are matched with the remaining adhesion characteristics.
And S503, after the initial light beam is adjusted to be the target light beam matched with the residual adhering materials, determining a target cleaning speed matched with the residual adhering characteristics, further controlling the target light beam to clean the residual adhering materials with the residual adhering characteristics according to the target cleaning speed, and removing dust according to the dust removal speed matched with the target cleaning speed.
Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but the former is a better implementation mode in many cases. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, or a network device) to execute the method of the embodiments of the present application.
FIG. 6 is a block diagram of a cleaning apparatus for an attached material according to an embodiment of the present application; as shown in fig. 6, includes: a detection module 62, configured to detect a remaining attachment characteristic of an attached attachment material in a target area on a material to be cleaned in a process of controlling an initial light beam to clean the target area, where the remaining attachment characteristic is used to indicate a material property of a remaining portion of the attachment material in the target area; an adjusting module 64 for adjusting the initial light beam to a target light beam matching the remaining attachment features, wherein the target light beam has a higher cleaning quality for the attachment material with the remaining attachment features than a target cleaning quality; and a control module 66 for controlling the target beam to clean the target area.
Through the embodiment, the light beam is used for cleaning the attached materials on the surface of the material to be cleaned, in the process of cleaning the attached materials in the target area on the surface of the material to be cleaned by using the light beam, the light beam used for cleaning the residual attached materials can be adjusted according to the detected residual attachment characteristics of the residual attached materials in the target area, so that the adjusted target light beam is matched with the residual attachment characteristics, and the cleaning quality of the target light beam on the attached materials with the residual attachment characteristics is higher than that of the target cleaning quality, so that the cleaning quality of the attached materials on the surface of the material to be cleaned can be ensured to be higher than that of the target cleaning quality when the target light beam is controlled to clean the target area. By adopting the technical scheme, the problems of low cleaning quality of the adhesion materials and the like in the related technology are solved, and the technical effect of improving the cleaning quality of the adhesion materials is realized.
Optionally, the adjusting module includes: the calculation unit is used for calculating target beam parameters according to the target material characteristics and the target thickness characteristics included in the residual adhesion characteristics; an adjusting unit for adjusting the initial beam to the target beam satisfying the target beam parameter.
Optionally, the computing unit is configured to perform at least one of the following operations: under the condition that the target thickness characteristic is larger than or equal to a first thickness threshold value, acquiring a first light beam parameter corresponding to the target material characteristic from the adhesion material characteristic and the light beam parameter which have corresponding relations, and taking the first light beam parameter as the target light beam parameter; acquiring a reference material characteristic of the material to be cleaned under the condition that the target thickness characteristic is smaller than a first thickness threshold value; and acquiring second light beam parameters corresponding to the reference material characteristics and the target material characteristics from the material characteristics of the material to be cleaned, the material characteristics of the attached material and the light beam parameters which have corresponding relations, and taking the second light beam parameters as the target light beam parameters.
Optionally, the adjusting unit is configured to: determining an initial beam parameter of the initial beam; determining a difference between the initial beam parameter and the target beam parameter as a beam adjustment amplitude; and adjusting the initial beam parameters according to the adjustment amplitude value to obtain the target beam.
Optionally, the control module includes: a determination unit for determining a target cleaning speed based on the target beam and the remaining adhesion characteristics; and the control unit is used for controlling the target light beam to clean the target area according to the target cleaning speed.
Optionally, the determining unit is configured to perform at least one of the following operations: under the condition that the target thickness characteristic included in the residual adhesion characteristics is larger than or equal to a second thickness threshold value, acquiring a first cleaning speed corresponding to the target beam parameter and the target material characteristic included in the residual adhesion characteristics from the beam parameter, the adhesion material characteristic and the cleaning speed which have corresponding relations, and taking the first cleaning speed as the target cleaning speed; and under the condition that the target thickness characteristic included in the residual adhesion characteristic is smaller than a second thickness threshold value, acquiring a second cleaning speed corresponding to the target beam parameter, the target material characteristic included in the residual adhesion characteristic and the reference material characteristic of the material to be cleaned from the beam parameter, the adhesion material characteristic, the material characteristic of the material to be cleaned and the cleaning speed which have corresponding relations, and taking the second cleaning speed as the target cleaning speed.
Optionally, the determining unit is configured to: determining a dust removal speed matched with the target cleaning speed; and controlling the target light beam to clean the target area according to the target cleaning speed, and simultaneously controlling a dust removal device to clean impurities generated by cleaning the target area according to the dust removal speed.
Embodiments of the present application further provide a storage medium including a stored program, where the program executes the method of any one of the above.
Alternatively, in the present embodiment, the storage medium may be configured to store program codes for performing the following steps: detecting the residual attachment characteristics of the attached attaching materials in a target area in the process of controlling the initial light beam to clean the target area on the materials to be cleaned, wherein the residual attachment characteristics are used for indicating the material properties of the remaining part of the attaching materials in the target area; adjusting the initial beam to a target beam that matches the remaining attachment features, wherein the target beam has a higher cleaning quality for the attachment material with the remaining attachment features than a target cleaning quality; and controlling the target light beam to clean the target area.
Embodiments of the present application further provide an electronic device, comprising a memory in which a computer program is stored and a processor configured to execute the computer program to perform the steps in any of the method embodiments described above.
Optionally, the electronic apparatus may further include a transmission device and an input/output device, wherein the transmission device is connected to the processor, and the input/output device is connected to the processor.
Optionally, in this embodiment, the processor may be configured to execute the following steps by a computer program: detecting the residual attachment characteristics of the attached attaching materials in a target area in the process of controlling the initial light beam to clean the target area on the materials to be cleaned, wherein the residual attachment characteristics are used for indicating the material properties of the remaining part of the attaching materials in the target area; adjusting the initial light beam into a target light beam matched with the residual attachment features, wherein the target light beam has a higher cleaning quality for the attachment material with the residual attachment features than a target cleaning quality; and controlling the target light beam to clean the target area.
Optionally, in this embodiment, the storage medium may include but is not limited to: various media capable of storing program codes, such as a usb disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic disk, or an optical disk.
Optionally, for a specific example in this embodiment, reference may be made to the examples described in the above embodiment and optional implementation, and this embodiment is not described herein again.
It will be apparent to those skilled in the art that the modules or steps of the present application described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and alternatively, they may be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present application is not limited to any specific combination of hardware and software.
The foregoing is only a preferred embodiment of the present application and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.
Claims (10)
1. A method for cleaning an adhering material, comprising:
detecting the residual attachment characteristics of the attached attaching materials in a target area in the process of controlling the initial light beam to clean the target area on the materials to be cleaned, wherein the residual attachment characteristics are used for indicating the material properties of the remaining part of the attaching materials in the target area;
adjusting the initial light beam into a target light beam matched with the residual attachment features, wherein the target light beam has a higher cleaning quality for the attachment material with the residual attachment features than a target cleaning quality;
and controlling the target light beam to clean the target area.
2. The method of claim 1, wherein the adjusting the initial beam to a target beam that matches the remaining attachment features comprises:
calculating target beam parameters according to the target material characteristics and the target thickness characteristics included in the residual adhesion characteristics;
adjusting the initial beam to the target beam that satisfies the target beam parameter.
3. The method of claim 2, wherein calculating target beam parameters from the target material characteristics and target thickness characteristics included in the remaining attachment features comprises at least one of:
under the condition that the target thickness characteristic is larger than or equal to a first thickness threshold value, acquiring a first light beam parameter corresponding to the target material characteristic from the adhesion material characteristic and the light beam parameter which have corresponding relations, and taking the first light beam parameter as the target light beam parameter;
acquiring a reference material characteristic of the material to be cleaned under the condition that the target thickness characteristic is smaller than a first thickness threshold value; and acquiring second light beam parameters corresponding to the reference material characteristic and the target material characteristic from the material characteristic of the material to be cleaned, the material characteristic of the attached material and the light beam parameters which have corresponding relations, and taking the second light beam parameters as the target light beam parameters.
4. The method of claim 2, wherein said adjusting said initial beam to said target beam satisfying said target beam parameter comprises:
determining an initial beam parameter of the initial beam;
determining a difference between the initial beam parameter and the target beam parameter as a beam adjustment amplitude;
and adjusting the initial beam parameters according to the adjustment amplitude value to obtain the target beam.
5. The method of claim 1, wherein said controlling the target beam to clean the target area comprises:
determining a target cleaning speed according to the target light beam and the residual adhesion characteristics;
and controlling the target light beam to clean the target area according to the target cleaning speed.
6. The method of claim 5, wherein determining a target cleaning speed from the target beam and the remaining adhesion characteristics comprises at least one of:
under the condition that the target thickness characteristic included in the residual adhesion characteristic is larger than or equal to a second thickness threshold value, acquiring a first cleaning speed corresponding to the target beam parameter and the target material characteristic included in the residual adhesion characteristic from the beam parameter, the adhesion material characteristic and the cleaning speed which have corresponding relations, and taking the first cleaning speed as the target cleaning speed;
and under the condition that the target thickness characteristic included in the residual adhesion characteristic is smaller than a second thickness threshold value, acquiring a second cleaning speed corresponding to the target beam parameter, the target material characteristic included in the residual adhesion characteristic and the reference material characteristic of the material to be cleaned from the beam parameter, the adhesion material characteristic, the material characteristic to be cleaned and the cleaning speed which have corresponding relations, and taking the second cleaning speed as the target cleaning speed.
7. The method of claim 6, wherein said controlling said target beam to clean said target area at said target cleaning speed comprises:
determining a dust removal speed matched with the target cleaning speed;
and controlling the target light beam to clean the target area according to the target cleaning speed, and simultaneously controlling a dust removal device to clean impurities generated by cleaning the target area according to the dust removal speed.
8. A cleaning device for adherent materials, comprising:
the device comprises a detection module, a detection module and a control module, wherein the detection module is used for detecting the residual adhesion characteristics of adhesion materials adhered to a target area in the process of controlling an initial light beam to clean the target area on the materials to be cleaned, and the residual adhesion characteristics are used for indicating the material properties of the residual part of the adhesion materials in the target area;
an adjusting module, configured to adjust the initial light beam to a target light beam matching the remaining attachment features, wherein a cleaning quality of the attachment material with the remaining attachment features by the target light beam is higher than a target cleaning quality;
and the control module is used for controlling the target light beam to clean the target area.
9. A computer-readable storage medium, comprising a stored program, wherein the program when executed performs the method of any one of claims 1 to 7.
10. An electronic device comprising a memory and a processor, characterized in that the memory has stored therein a computer program, the processor being arranged to execute the method of any of claims 1 to 7 by means of the computer program.
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| CN202210520970.9A CN115254797A (en) | 2022-05-13 | 2022-05-13 | Method and apparatus for cleaning adhesive material, storage medium, and electronic apparatus |
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| CN202210520970.9A CN115254797A (en) | 2022-05-13 | 2022-05-13 | Method and apparatus for cleaning adhesive material, storage medium, and electronic apparatus |
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