CN115241170A - Manufacturing method and device of high-luminous-efficiency LED - Google Patents
Manufacturing method and device of high-luminous-efficiency LED Download PDFInfo
- Publication number
- CN115241170A CN115241170A CN202210795066.9A CN202210795066A CN115241170A CN 115241170 A CN115241170 A CN 115241170A CN 202210795066 A CN202210795066 A CN 202210795066A CN 115241170 A CN115241170 A CN 115241170A
- Authority
- CN
- China
- Prior art keywords
- substrate
- fluorescent film
- film
- led chip
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Abstract
The invention relates to the field of LED manufacturing, and particularly discloses a manufacturing method and equipment of a high-luminous-efficiency LED, wherein an LED chip is fixedly connected to a substrate by preparing a first fluorescent film; covering the substrate by using the first fluorescent film, and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip; and cutting the first fluorescent film covering the substrate by using a film cutting machine, and only reserving the first fluorescent film of the light-emitting region to obtain the high-luminous-efficiency LED. According to the invention, the substrate is firstly covered on the whole surface and then cut, the fluorescent film outside the light emitting region is removed, the alignment of the fluorescent film and the LED chip is avoided, the effect of accurately covering the LED chip by the fluorescent film is realized, the process difficulty is greatly reduced, the requirement on the equipment precision is also reduced, the fluorescent film of the non-light emitting region on the surface is cut off, light spots outside the design are also avoided, and a better light-emitting effect is achieved.
Description
Technical Field
The invention relates to the field of LED manufacturing, in particular to a manufacturing method and equipment of a high-luminous-efficiency LED.
Background
With the progress of technology, LEDs are being applied to more and more fields as a new light emitting device with high brightness and long service life.
The basic structure of the LED light-emitting device is an LED chip and a fluorescent layer covered on the LED chip, at present, two laying methods are mainly adopted for the fluorescent layer, one method is to spray fluorescent powder on the whole surface of a substrate where the LED chip is positioned, so that the LED chip is ensured to be covered by the fluorescent powder, but the defects are also obvious, namely, a non-LED chip area is also covered by a large amount of fluorescent powder, the area of invalid fluorescent powder is too large, the cost is increased, unexpected light spots can be generated during specific assembly, and the light-emitting effect is reduced; the other method is to prepare the fluorescent film with the size similar to that of the LED chip in advance and then paste the fluorescent film and the LED chip in a one-to-one correspondence mode.
By combining the two prior arts, it is not difficult to find how to realize the precise matching between the fluorescent layer and the LED chip on the premise of controlling low cost, which is a problem to be solved urgently in the prior art.
Disclosure of Invention
The invention aims to provide a manufacturing method and equipment of a high-light-efficiency LED (light-emitting diode), and aims to solve the problems that in the prior art, a fluorescent film pasting process is complex, the equipment requirement is high, the cost is high, and a fluorescent layer is difficult to match with an LED chip.
In order to solve the above technical problems, the present invention provides a method for manufacturing a high light efficiency LED, including:
preparing a first fluorescent film, and fixedly connecting the LED chip on the substrate;
covering the substrate by using the first fluorescent film, and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip;
and cutting the first fluorescent film covering the substrate by using a film cutting machine, and only reserving the first fluorescent film of the light-emitting region to obtain the high-light-efficiency LED.
Optionally, in the method for manufacturing a high light efficiency LED, the covering the substrate with the first fluorescent film and fixedly connecting the first fluorescent film and the substrate includes:
spraying an adhesive on the surface of the LED chip;
and aligning the first fluorescent film with the substrate and carrying out hot pressing to complete the covering and fixed connection of the first fluorescent film on the substrate.
Optionally, in the method for manufacturing a high light efficiency LED, the aligning and hot-pressing the first fluorescent film with the substrate includes:
adhering a thermal transfer film on the first surface of the first fluorescent film;
holding the thermal transfer film, aligning, attaching and hot-pressing the second surface of the first fluorescent film and the substrate;
and removing the heat transfer film after hot pressing.
Optionally, in the method for manufacturing a high light efficiency LED, the fixedly attaching the LED chip to the substrate includes:
fixing the LED chip and the substrate by a die bonder at one time;
and fixing the LED chip and the substrate for the second time by using a reflow soldering machine to finish the fixed connection between the LED chip and the substrate.
Optionally, in the method for manufacturing a high light efficiency LED, after the cutting the first fluorescent film, the method further includes:
and filling a white wall glue layer in the non-light-emitting area of the substrate.
A manufacturing device of a high-luminous-efficiency LED comprises a fluorescent film making machine, a reflow welding machine, a conveying machine, a film coating machine and a film cutting machine;
the fluorescent film making machine is used for preparing a first fluorescent film;
the reflow soldering machine is used for soldering the LED chip on the substrate;
the film coating machine is used for covering the substrate by using the first fluorescent film and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip;
the film cutting machine is used for cutting the first fluorescent film covering the substrate and only reserving the first fluorescent film of the light-emitting area;
the conveyor connects the fluorescent film making machine, the reflow soldering machine, the thin film wrapping machine and the thin film cutting machine, and is used for moving the first fluorescent film from the fluorescent film making machine to the thin film wrapping machine, moving the substrate welded with the LED chip from the reflow soldering machine to the thin film wrapping machine, and moving the substrate covered with the first fluorescent film from the thin film wrapping machine to the thin film cutting machine.
Optionally, in the manufacturing apparatus for a high light efficiency LED, the film covering machine includes a gluing assembly and a hot pressing assembly;
the gluing component is used for spraying an adhesive on the surface of the LED chip;
the hot-pressing assembly is used for aligning the first fluorescent film with the substrate and carrying out hot pressing to complete the covering and fixed connection of the first fluorescent film on the substrate.
Optionally, in the manufacturing apparatus for the high light efficiency LED, the fluorescent film making machine includes a thermal transfer assembly;
the thermal transfer assembly is used for adhering a thermal transfer film on the first surface of the first fluorescent film;
correspondingly, the hot pressing assembly is used for holding the thermal transfer film, aligning, attaching and hot pressing the second surface of the first fluorescent film with the substrate.
Optionally, the manufacturing apparatus of the high light efficiency LED further comprises a die bonder;
the die bonder is used for fixing the LED chip and the substrate at one time;
correspondingly, the reflow soldering machine is used for fixing the LED chip and the substrate for the second time to complete the fixed connection between the LED chip and the substrate.
Optionally, the manufacturing equipment of the high-light-efficiency LED further comprises a glue filling machine;
the glue filling machine is used for filling a white wall glue layer in the non-light-emitting area of the substrate.
According to the manufacturing method of the high-light-efficiency LED, the LED chip is fixedly connected to the substrate by preparing the first fluorescent film; covering the substrate by using the first fluorescent film, and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip; and cutting the first fluorescent film covering the substrate by using a film cutting machine, and only reserving the first fluorescent film of the light-emitting region to obtain the high-luminous-efficiency LED.
According to the invention, the whole fluorescent film is used for covering and fixing the substrate provided with the LED chip during packaging, and then cutting is carried out to remove the fluorescent film outside the light emitting region, so that the alignment of the fluorescent film and the LED chip is avoided, the effect of accurately covering the LED chip by the fluorescent film is realized, the process difficulty is greatly reduced, the requirement on the equipment precision is also reduced, the fluorescent film of the non-light emitting region on the surface is cut off, light spots outside the design are also avoided, and a better light emitting effect is achieved. The invention also provides equipment for manufacturing the high-light-efficiency LED with the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a method for manufacturing a high-luminous-efficiency LED according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method for manufacturing a high light efficiency LED according to another embodiment of the present invention;
fig. 3 to 5 are process flow diagrams of a method for manufacturing a high light efficiency LED according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an embodiment of a manufacturing apparatus for a high light efficiency LED provided in the present invention.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the present invention is to provide a method for manufacturing a high light efficiency LED, wherein a flow diagram of a specific embodiment thereof is shown in fig. 1, which is referred to as a first specific embodiment thereof, and the method includes:
s101: and preparing a first fluorescent film, and fixedly connecting the LED chip on the substrate.
The preparation of the first fluorescent film in the step is not in sequence with the fixation of the LED chip and the substrate, and the preparation can be adjusted according to specific conditions.
Preferably, the substrate may be a ceramic substrate. Referring to fig. 3, fig. 3 is a schematic structural diagram of the LED chip fixed on the substrate in this embodiment, where the diagram includes 4 substrates, and each substrate is connected with three LED chips.
S102: covering the substrate by using the first fluorescent film, and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip.
In this step, the substrate may be covered by the first fluorescent film, which may be completely covered or partially covered, but in any case, the LED chip should be completely covered by the first fluorescent film. Referring to fig. 4, the first fluorescent film in fig. 4 completely covers the four substrates.
S103: and cutting the first fluorescent film covering the substrate by using a film cutting machine, and only reserving the first fluorescent film of the light-emitting region to obtain the high-luminous-efficiency LED.
The light-emitting area refers to an area corresponding to the LED chip, and the size of the light-emitting area can be adjusted according to actual needs, and can be completely consistent with the size and the position of the LED chip, but preferably, the light-emitting area can be an area whose position is consistent with the LED chip, but the edge position exceeds the edge of the LED chip by 0.1 mm. Referring to fig. 5, the first phosphor film of fig. 4 is cut in fig. 5, leaving 4 light emitting areas on 4 substrates.
In addition, as a specific embodiment, the fixedly connecting the LED chip to the substrate includes:
a1: and fixing the LED chip and the substrate by using a die bonder at one time.
And carrying out die bonding between the LED chip and the substrate through the die bonding machine, wherein the LED chip is temporarily attached to the substrate, and at the moment, the fixed position between the LED chip and the substrate can be checked, and if the fixed relative position between the LED chip and the substrate deviates, the LED chip can be detached, repositioned and die bonded.
A2: and fixing the LED chip and the substrate for the second time by using a reflow soldering machine to finish the fixed connection between the LED chip and the substrate.
When the position between the LED chip and the substrate is accurate, the LED chip and the substrate can be permanently welded in a reflow soldering mode.
In the specific embodiment, the fixing between the LED chip and the substrate is divided into two steps, namely, the primary fixing for readjusting the position and the secondary fixing for permanent connection, so that a calibration window is reserved in the process steps, the situation that the alignment fails in one welding process and cannot be recovered is avoided, the LED chip and the substrate directly become the worst condition of waste parts, and the yield of finished products is greatly improved.
In addition, after the first fluorescent film is cut, the method further includes:
and filling a white wall glue layer in the non-light-emitting area of the substrate.
The non-light-emitting area is an area of the substrate except the light-emitting area, in the present embodiment, the white wall glue layer is completely filled in the non-light-emitting area, and the white wall glue layer is silica gel added with titanium dioxide particles, is white, has high reflectivity, good light and heat stability, and good adhesion. White wall glue film is filled around the LED chip to increase light-emitting efficiency and ensure light-emitting light type.
According to the manufacturing method of the high-luminous-efficiency LED, the LED chip is fixedly connected to the substrate by preparing the first fluorescent film; covering the substrate by using the first fluorescent film, and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip; and cutting the first fluorescent film covering the substrate by using a film cutting machine, and only reserving the first fluorescent film of the light-emitting region to obtain the high-luminous-efficiency LED. According to the invention, the substrate provided with the LED chip is covered and fixed by using the whole fluorescent film during packaging, and then cut to remove the fluorescent film outside the light emitting region, so that the alignment of the fluorescent film and the LED chip is avoided, the effect of accurately covering the LED chip by the fluorescent film is realized, the process difficulty is greatly reduced, the requirement on the equipment precision is also reduced, the fluorescent film of the non-light emitting region on the surface is cut off, light spots outside the design are also avoided, and a better light emitting effect is achieved.
On the basis of the first embodiment, the arrangement manner of the first fluorescent film is further limited to obtain a second embodiment, a flow chart of which is shown in fig. 2, and includes:
s201: and preparing a first fluorescent film, and fixedly connecting the LED chip on the substrate.
S202: and spraying an adhesive on the surface of the LED chip.
S203: and adhering a thermal transfer film on the first surface of the first fluorescent film.
There is no strict sequence between step S202 and step S203, and the thermal transfer film refers to
S204: holding the thermal transfer film, aligning, attaching and hot-pressing the second surface of the first fluorescent film with the substrate, and finishing the covering and fixed connection of the first fluorescent film on the substrate; wherein the first fluorescent film completely covers the LED chip.
The holding of the thermal transfer film refers to taking the thermal transfer film as a gripper, in other words, applying an external force to the first fluorescent film through the thermal transfer film for transferring the first fluorescent film, for example, adsorbing the thermal transfer film through a vacuum chuck, and further transferring the first fluorescent film through the vacuum chuck.
S205: and removing the heat transfer film after hot pressing.
In this embodiment mode, the thermal transfer film is removed before the first fluorescent film is cut, but in actual operation, the thermal transfer film may be removed after the first fluorescent film is cut, and may be selected according to actual needs.
S206: and cutting the first fluorescent film covering the substrate by using a film cutting machine, and only reserving the first fluorescent film of the light-emitting region to obtain the high-luminous-efficiency LED.
The difference between this embodiment and the above embodiment is that this embodiment further improves the transferring manner of the first fluorescent layer, and the remaining steps are the same as those in the above embodiment, and are not described again here.
In this embodiment, a specific method for transferring the first fluorescent film is provided, where the thermal transfer film is disposed on the first fluorescent film, a single surface of the thermal transfer film is glued, and the surface exposed outside is not glued, so that the first fluorescent film can be moved by relying on the thermal transfer film, and after the first fluorescent film is aligned with the substrate and subjected to a hot-pressing step, the adhesiveness of the thermal transfer film is invalid and easy to peel off, so that the light-emitting performance of a subsequent device is not affected, the production difficulty is greatly reduced, and the process flow is simplified.
The LED chip is quickly and stably bonded with the substrate in a gluing and hot-pressing mode, the bonding strength is high, the process is simple, and the production efficiency is high.
The invention also provides a manufacturing device of the high-light-efficiency LED, the structural schematic diagram of one specific implementation mode of the manufacturing device is shown in FIG. 6, and the manufacturing device comprises a fluorescent film making machine 01, a reflow soldering machine 02, a conveyer 05, a film coating machine 03 and a film cutting machine 04;
the fluorescent film making machine 01 is used for preparing a first fluorescent film;
the reflow soldering machine 02 is used for soldering the LED chip on the substrate;
the film coating machine 03 is configured to cover the substrate with the first fluorescent film and fixedly connect the first fluorescent film to the substrate; wherein the first fluorescent film completely covers the LED chip;
the film cutting machine 04 is used for cutting the first fluorescent film covering the substrate and only keeping the first fluorescent film of the light-emitting region;
the conveyor 05 connects the fluorescent film manufacturing machine 01, the reflow soldering machine 02, the film wrapping machine 03, and the film cutting machine 04, and is configured to move the first fluorescent film from the fluorescent film manufacturing machine 01 to the film wrapping machine 03, move the substrate on which the LED chip is soldered from the reflow soldering machine 02 to the film wrapping machine 03, and move the substrate on which the first fluorescent film is covered from the film wrapping machine 03 to the film cutting machine 04.
As a preferred embodiment, the film wrapping machine 03 comprises a gluing assembly and a hot-pressing assembly;
the gluing component is used for spraying an adhesive on the surface of the LED chip;
the hot-pressing assembly is used for aligning the first fluorescent film with the substrate and performing hot pressing to complete the covering and fixed connection of the first fluorescent film on the substrate.
The manufacturing apparatus of the high luminous efficiency LED provided in this embodiment corresponds to the manufacturing method of the high luminous efficiency LED in the foregoing, and can be compared with the foregoing, and therefore, the details are not repeated herein.
As a preferred embodiment, the fluorescent film-making machine 01 includes a thermal transfer unit;
the thermal transfer assembly is used for adhering a thermal transfer film on the first surface of the first fluorescent film;
correspondingly, the hot pressing assembly is used for holding the thermal transfer film, aligning, attaching and hot pressing the second surface of the first fluorescent film with the substrate.
As a preferred embodiment, the device also comprises a die bonder;
the die bonder is used for fixing the LED chip and the substrate at one time;
correspondingly, the reflow soldering machine 02 is configured to fix the LED chip and the substrate for a second time, so as to complete the fixed connection between the LED chip and the substrate.
Additionally, the reflow soldering machine 02 may include a eutectic furnace.
As a preferred embodiment, the device also comprises a glue filling machine;
the glue filling machine is used for filling a white wall glue layer in the non-light-emitting area of the substrate.
As a specific embodiment, the film cutting machine 04 includes a machine vision assembly;
the machine vision assembly is used to determine the edges of the lighted area. In other words, the film cutting machine 04 of the invention is a cutting machine which performs positioning through machine vision, the precision can reach below 0.1 mm, the yield of finished products is greatly improved, and the light-emitting effect is improved.
The invention provides a manufacturing device of a high-light-efficiency LED, which comprises a fluorescent film making machine 01, a reflow welding machine 02, a conveyer 05, a film coating machine 03 and a film cutting machine 04; the fluorescent film making machine 01 is used for preparing a first fluorescent film; the reflow soldering machine 02 is used for soldering the LED chip on the substrate; the thin film coating machine 03 is configured to cover the substrate with the first fluorescent film and fixedly connect the first fluorescent film to the substrate; wherein the first fluorescent film completely covers the LED chip; the film cutting machine 04 is used for cutting the first fluorescent film covering the substrate and only keeping the first fluorescent film of the light-emitting region; the conveyor 05 connects the fluorescent film manufacturing machine 01, the reflow soldering machine 02, the film wrapping machine 03, and the film cutting machine 04, and is configured to move the first fluorescent film from the fluorescent film manufacturing machine 01 to the film wrapping machine 03, move the substrate on which the LED chip is soldered from the reflow soldering machine 02 to the film wrapping machine 03, and move the substrate on which the first fluorescent film is covered from the film wrapping machine 03 to the film cutting machine 04. According to the invention, the substrate provided with the LED chip is covered and fixed by using the whole fluorescent film during packaging, and then cut to remove the fluorescent film outside the light emitting region, so that the alignment of the fluorescent film and the LED chip is avoided, the effect of accurately covering the LED chip by the fluorescent film is realized, the process difficulty is greatly reduced, the requirement on the equipment precision is also reduced, the fluorescent film of the non-light emitting region on the surface is cut off, light spots outside the design are also avoided, and a better light emitting effect is achieved.
In the present specification, the embodiments are described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same or similar parts between the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It should be noted that, in the present specification, relational terms such as first and second, and the like are used only for distinguishing one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The method and the device for manufacturing the high-luminous-efficiency LED provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, it is possible to make various improvements and modifications to the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A method for manufacturing a high-luminous-efficiency LED is characterized by comprising the following steps:
preparing a first fluorescent film, and fixedly connecting the LED chip on the substrate;
covering the substrate by using the first fluorescent film, and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip;
and cutting the first fluorescent film covering the substrate by using a film cutting machine, and only reserving the first fluorescent film of the light-emitting region to obtain the high-luminous-efficiency LED.
2. The method of claim 1, wherein the covering the substrate with the first phosphor layer and the fixedly connecting the first phosphor layer to the substrate comprises:
spraying an adhesive on the surface of the LED chip;
and aligning the first fluorescent film with the substrate and carrying out hot pressing to complete the covering and fixed connection of the first fluorescent film on the substrate.
3. The method of claim 2, wherein the aligning and thermo-pressing the first phosphor film with the substrate comprises:
adhering a thermal transfer film on the first surface of the first fluorescent film;
holding the thermal transfer film, aligning, attaching and hot-pressing the second surface of the first fluorescent film and the substrate;
and removing the heat transfer film after hot pressing.
4. The method of claim 1, wherein the attaching the LED chip to the substrate comprises:
fixing the LED chip and the substrate by a die bonder for one time;
and fixing the LED chip and the substrate for the second time by using a reflow soldering machine to complete the fixed connection between the LED chip and the substrate.
5. The method of claim 1, further comprising, after the cutting the first phosphor film:
and filling a white wall glue layer in the non-light-emitting area of the substrate.
6. A manufacturing device of a high-light-efficiency LED is characterized by comprising a fluorescent film making machine, a reflow welding machine, a conveyer, a film coating machine and a film cutting machine;
the fluorescent film making machine is used for preparing a first fluorescent film;
the reflow soldering machine is used for soldering the LED chip on the substrate;
the film coating machine is used for covering the substrate by using the first fluorescent film and fixedly connecting the first fluorescent film with the substrate; wherein the first fluorescent film completely covers the LED chip;
the film cutting machine is used for cutting the first fluorescent film covering the substrate and only reserving the first fluorescent film of the light-emitting area;
the conveyor connects the fluorescent film making machine, the reflow soldering machine, the thin film wrapping machine and the thin film cutting machine, and is used for moving the first fluorescent film from the fluorescent film making machine to the thin film wrapping machine, moving the substrate welded with the LED chip from the reflow soldering machine to the thin film wrapping machine, and moving the substrate covered with the first fluorescent film from the thin film wrapping machine to the thin film cutting machine.
7. The apparatus of claim 6, wherein the film coater comprises a glue applicator and a heat press;
the gluing component is used for spraying an adhesive on the surface of the LED chip;
the hot-pressing assembly is used for aligning the first fluorescent film with the substrate and performing hot pressing to complete the covering and fixed connection of the first fluorescent film on the substrate.
8. The apparatus according to claim 7, wherein the fluorescent film maker comprises a thermal transfer unit;
the thermal transfer assembly is used for adhering a thermal transfer film on the first surface of the first fluorescent film;
correspondingly, the hot pressing assembly is used for holding the thermal transfer film, aligning, attaching and hot pressing the second surface of the first fluorescent film with the substrate.
9. The apparatus of claim 6, further comprising a die bonder;
the die bonder is used for fixing the LED chip and the substrate at one time;
correspondingly, the reflow soldering machine is used for fixing the LED chip and the substrate for the second time to complete the fixed connection between the LED chip and the substrate.
10. The apparatus according to claim 6, further comprising a glue filling machine;
the glue filling machine is used for filling a white wall glue layer in the non-light-emitting area of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210795066.9A CN115241170A (en) | 2022-07-07 | 2022-07-07 | Manufacturing method and device of high-luminous-efficiency LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210795066.9A CN115241170A (en) | 2022-07-07 | 2022-07-07 | Manufacturing method and device of high-luminous-efficiency LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115241170A true CN115241170A (en) | 2022-10-25 |
Family
ID=83671817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210795066.9A Pending CN115241170A (en) | 2022-07-07 | 2022-07-07 | Manufacturing method and device of high-luminous-efficiency LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115241170A (en) |
-
2022
- 2022-07-07 CN CN202210795066.9A patent/CN115241170A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105895785B (en) | Light source assembly structure of flip LED chips integration packaging and preparation method thereof | |
| CN111540820A (en) | Die bonding method of LED chip and display device | |
| CN105845809A (en) | LED Packaging Structure And Method For Manufacturing The Same | |
| CN114823996A (en) | LED chip transfer method and display panel | |
| CN109273579A (en) | LED lamp bead preparation method | |
| CN115241170A (en) | Manufacturing method and device of high-luminous-efficiency LED | |
| CN106960902A (en) | A kind of SMD flip LED light source and preparation method thereof and LED array | |
| CN217544614U (en) | Manufacturing equipment for high-luminous-efficiency LED | |
| CN104091878B (en) | Package-free LED light source module manufacturing method | |
| CN114121764A (en) | LED chip transfer method, device manufacturing method, device, module and display | |
| CN110212073B (en) | Single-sided CSP and method for manufacturing same | |
| JP2020080401A (en) | Method for pasting electronic components | |
| CN202267007U (en) | COB (Chip on Board) light source of LED (Light Emitting Diode) fluorescent lamp | |
| CN209963082U (en) | Single-sided CSP | |
| CN110854258B (en) | Manufacturing method of three-color LED lamp bead | |
| CN209947868U (en) | Packaging structure of surface mount type light emitting diode | |
| CN110729203B (en) | Packaging process of open electrocardiogram sensor | |
| CN220553444U (en) | UVLED lamp pearl and UVLED lamps and lanterns | |
| CN206460955U (en) | Flip LED car light | |
| CN110854030A (en) | Manufacturing process of synchronizer signal processing module | |
| CN105374924B (en) | The preparation method of the preparation facilities of glued membrane, preparation method and flip LED chips | |
| CN217468431U (en) | Luminous chip packaging structure capable of changing bonding pad | |
| CN108461604A (en) | A kind of LED light integrated encapsulation method and encapsulating structure | |
| TWI726812B (en) | Die bonding method of prearranged block | |
| JP7475735B2 (en) | Method for joining and transferring die packages |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |