CN115237228A - Temperature control method and device and readable storage medium - Google Patents
Temperature control method and device and readable storage medium Download PDFInfo
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Abstract
The application discloses a temperature control method, a temperature control device and a readable storage medium, and relates to the technical field of electronics. According to the temperature control method, the current load of the PSU and the current temperature of the PSU are obtained, the corresponding operation curve is generated according to the current load and the current temperature, the operation curve and the rated curve are compared, the comparison result is obtained, the rated curve is a curve generated in advance according to the load and the corresponding temperature when the PSU normally operates, and the load of the PSU and the operation speed of the fan are regulated and controlled according to the comparison result. The temperature curve drawing is carried out on the load and the temperature inside the PSU, so that the temperature corresponding to the load can be intuitively known, the problem of server downtime caused by insufficient regulation and control of the fan and heat dissipation can be prevented, and the problem of energy waste caused by too high running speed of the fan can be prevented.
Description
Technical Field
The present disclosure relates to the field of electronic technologies, and in particular, to a temperature control method and apparatus, and a readable storage medium.
Background
In recent years, with the arrival of the times of big data, cloud computing and artificial intelligence, the internet traffic has been explosively increased, and the energy conservation is not slow along with more power consumption. How to reduce energy consumption and improve efficiency in servers and data becomes important. With the increasing power consumption of the central processing unit and other server core devices, the heat emitted during the operation of the central processing unit and other server core devices is more and more, the specification of the fan required by the system is higher, and the power consumption of the fan in the system is higher, so that the overall efficiency is not improved, and certain resource waste is caused. Due to the difference of heat dissipation of internal components of the server, the temperature and the air flow of each area of the server are different. Since a Power Supply Unit (PSU) has a built-in fan, how to allocate the system fan and the PSU fan is a key point for optimizing Power consumption.
In the prior art, a temperature sensor is arranged in a server mainboard end, a board card and other components are internally provided with the temperature sensor, and the collected temperature is transmitted to a system through I2C communication. The inside of the PSU is generally provided with 3 temperature sensors, and a Micro Control Unit (MCU) in the PSU collects temperature data and transmits the temperature data to the system through I2C. The system regulates and controls the running speed of the fan according to the collected temperature, so that the server can not run beyond the temperature spec, and the stability of the server is ensured. And the situation is single only when the temperature is detected, if the temperature is detected to be increased, the operating speed of the fan is increased, and if the temperature is reduced, the operating speed of the fan is reduced. The PSU is usually located at the back end of the server, and a high heat chip such as a CPU is usually located in front of the PSU, which causes differences in temperature and air flow rate in each area of the server due to differences in heat dissipation capacity of each component. If the sensor is in a high temperature region, it will cause the system fan to operate at a high speed. The overall power consumption of the server increases. If the sensor is at a low temperature, the internal temperature of the PSU may be too high, the PSU is protected, and the server is down, so that a reasonable heat dissipation response cannot be made based on the basic situation of the PSU.
In view of the above-mentioned technologies, a need exists for a temperature control method that can reasonably dissipate heat based on the basic conditions of the PSU.
Disclosure of Invention
The present application is directed to a temperature control method for solving the problem of high-speed operation of a system fan if a sensor is located in a high-temperature region. The overall power consumption of the server increases. If the sensor is at a low temperature, the internal temperature of the PSU may be too high, the PSU is protected, and the server is down, so that the problem that reasonable heat dissipation response cannot be made based on the basic situation of the PSU is solved.
In order to solve the above technical problem, the present application provides a temperature control method, applied to a server motherboard, including:
acquiring the current load of a PSU and the current temperature of the PSU;
generating a corresponding operation curve according to the current load and the current temperature;
comparing the operation curve with a rated curve to obtain a comparison result, wherein the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU in normal operation;
if the load is the same, the temperature corresponding to the operation curve is greater than the temperature corresponding to the rated curve, converting a part of the current load of the PSU into other PSUs which do not exceed the rated load, and increasing the operation speed of a fan in the PSU;
and if the load is the same, reducing the operating speed of the fan in the PSU if the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve.
Preferably, after the obtaining the current load of the PSU and the current temperature of the PSU, the comparing the operation curve with the rated curve, and before obtaining the comparison result, the method further includes:
judging whether the current load of the PSU is greater than the rated load or not;
if not, the step of comparing the running curve with the rated curve to obtain a comparison result is carried out;
if so, converting a part of the current load of the PSU to other PSUs which do not exceed the rated load, and returning to the step of judging whether the current load of the PSU is greater than the rated load.
Preferably, after the controlling the load of the PSU and/or the operating speed of the fan, the method further comprises:
detecting whether the operation curve is the same as the rated curve;
if not, returning to the step of comparing the operation curve with the rated curve to obtain a comparison result.
Preferably, after the controlling the load of the PSU and/or the operating speed of the fan, the method further comprises:
and if the load of the PSU and the running speed of the fan cannot be adjusted to be equal to the rated curve, starting the system fan to perform heat dissipation treatment.
Preferably, also includes;
when the PSU fails, the PSU is shut down, and the load of the PSU is distributed to other PSUs.
Preferably, the method for judging the PSU failure is as follows:
and if the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the load is the same when the PSU fan stops rotating, determining that the PSU fails.
In order to solve the above problem, the present application also provides a temperature control device, including:
the system comprises an acquisition module, a control module and a control module, wherein the acquisition module is used for acquiring the current load of a PSU and the current temperature of the PSU;
the generating module is used for generating a corresponding operating curve according to the current load and the current temperature;
the comparison module is used for comparing the operation curve with a rated curve to obtain a comparison result, wherein the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU in normal operation;
the first regulation and control module is started when the load is the same and the temperature corresponding to the operation curve is higher than the temperature corresponding to the rated curve, and is used for converting one part of the current load of the PSU to other PSUs which do not exceed the rated load and increasing the operation speed of a fan inside the PSU;
and the second regulation and control module is started when the load is the same and the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve, and is used for reducing the operating speed of the fan in the PSU.
Preferably, the apparatus further comprises:
the detection module is used for detecting whether the operation curve is the same as the rated curve or not;
if not, returning to the regulation module.
Preferably, the apparatus further comprises:
and the standby module is used for regulating and controlling the load of the PSU and the running speed of the fan, and if the running curve cannot be adjusted to be equal to the rated curve, the system fan is started to carry out heat dissipation treatment.
Preferably, the device further comprises;
and the failure module is used for shutting down the PSU and distributing the load of the PSU to other PSUs when the PSU fails.
In order to solve the above problem, the present application further provides a temperature control apparatus, including a memory for storing a computer program;
a processor for implementing the steps of the temperature control method as described above when executing the computer program.
To solve the above problem, the present application further provides a computer readable storage medium, on which a computer program is stored, the computer program, when executed by a processor, implementing the steps of the temperature control method as described above.
According to the temperature control method, the current load of the PSU and the current temperature of the PSU are obtained, the corresponding operation curve is generated according to the current load and the current temperature, the operation curve and the rated curve are compared, the comparison result is obtained, the rated curve is a curve generated in advance according to the load and the corresponding temperature when the PSU normally operates, and the load of the PSU and the operation speed of the fan are regulated and controlled according to the comparison result. The temperature control method has the advantages that the load and the temperature inside the PSU are subjected to curve drawing, so that the temperature corresponding to the load can be visually known, reasonable allocation can be realized, the problem of downtime of a server caused by insufficient regulation and control of the fan and heat dissipation can be prevented, and the problem of energy waste caused by too high running speed of the fan can also be prevented, and therefore compared with the conventional temperature control method, the temperature control method can perform reasonable heat dissipation based on the basic situation of the PSU.
The temperature control device and the computer readable storage medium provided by the application correspond to the temperature control method, and the beneficial effects are the same as above.
Drawings
In order to more clearly illustrate the embodiments of the present application, the drawings needed for the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
Fig. 1 is a flowchart of a temperature control method according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram of a server motherboard structure according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a temperature control device according to an embodiment of the present disclosure;
fig. 4 is a structural diagram of a temperature control device according to another embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the present application.
The core of the application is to provide a temperature control method so as to solve the problem that if a sensor is in a high-temperature area, a system fan runs at a high speed. The overall power consumption of the server increases. If the sensor is at a low temperature, the internal temperature of the PSU may be too high, the PSU is protected, and the server is down, so that the problem that reasonable heat dissipation response cannot be made based on the basic condition of the PSU is solved.
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings.
Fig. 1 is a flowchart of a temperature control method provided in an embodiment of the present application, applied to a server motherboard, including:
s10: acquiring the current load of the PSU and the current temperature of the PSU;
it should be noted that, in the present embodiment, the load is acquired by the MCU, for example, the rated operating voltage of the PSU is 10V, and the current load voltage is 5V, so that the current load is fifty percent. In this embodiment, the types and the number of the PSUs are not limited, and it is understood that the PSUs are generally the types and the numbers of the PSUs
S11: generating a corresponding operation curve according to the current load and the current temperature;
it should be noted that the server motherboard, also called a motherboard (main board), a system board (system board) or a motherboard (mother board), is divided into two types, namely a commercial motherboard and an industrial motherboard. Generally, a server motherboard is installed in a chassis, which is one of the most basic and important components of a microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as BIOS chip, I/O control chip, keyboard and panel control switch interface, indicator lamp plug-in unit, expansion slot, main board and direct current power supply plug-in unit of plug-in card, etc., and the performance of the main board affects the performance of the whole microcomputer system. The specific type of the main board is not limited in this embodiment. Since the load is a floating variable during the treatment process, the temperature is a dependent variable according to the floating of the load, and a corresponding operation curve is drawn.
It will be appreciated that the operating curve is a function established with load as the variable and temperature as the dependent variable, so the parameter is the power dissipated by the PSU.
S12: comparing the operation curve with the rated curve, judging whether the temperature corresponding to the operation curve is higher than the temperature corresponding to the rated curve when the load is the same, if so, entering S13, otherwise, entering S14;
the rated curve is a curve micro control unit which is generated according to the load and the corresponding temperature of the PSU in normal operation in advance, and is also called a single-chip microcomputer or a single-chip microcomputer, the frequency and the specification of a central processing unit are properly reduced, peripheral interfaces such as a memory, a counter and the like, even a driving circuit are integrated on a single chip to form a chip-level computer, and different combination control is carried out on different application occasions.
S13: converting a portion of the current load of the PSU to other PSUs that do not exceed the rated load and increasing the operating speed of fans internal to the PSU;
it should be noted that the adjustment in this embodiment only needs to adjust the operation curve to be the same as the rated curve, and as for the specific use, the method of increasing the fan operation speed or converting the load or the combination of the two methods may be used, and is not particularly limited herein.
S14: reducing the fan operating speed inside the PSU.
For example, three sensor temperature data curves are obtained according to PSU heat dissipation data measured actually under different loads and different environments and temperatures, and the curves are stored in an MCU of the PSU. The system accesses the temperature curve in the singlechip through I2C. Normally, the temperature of the air inlet is lowest, the second temperature inside the air inlet is middle, and the third temperature is highest. The PSU is provided with two PSUs including a PSU A and a PSU B for power supply, and in the prior working state, if the temperature of an air inlet of the PSU A is high in normal working, firstly, the fan in the PSU A can improve the running speed and increase the air flow so as to reduce the temperature.
If the sensor of the air inlet is in a high temperature area, the air inlet temperature may be higher than the internal temperature, and at this time, the fan of the PSU a is already in full speed operation, but the air inlet temperature is still high. And simultaneously acquiring the load of the PSU, and if the load is lower than the rated output of 50% of the PSU, and simultaneously when the system detects that the three temperatures in the module A deviate from the curve stored in the MCU, simultaneously judging whether the other parallel operation PSU B module normally works, and if the parallel operation PSU B module normally works, and the PSU B fan does not run fully. The fan of the PSU B module is regulated and controlled, the running speed of the PSU B fan is increased, and the air volume of the air inlet of the PSU is increased. If the temperature of the PSU A module can be enabled to be normal, the running speed of the B is maintained. If the temperature of the module A is not normal, the running speed of the fan of the module A is reduced, and more heat flows out of the module B. If the system can not meet the requirements, the system controls the module A to shut down according to the load of the system, and only uses the module B to supply power. If the load is greater than 50% of the rated output of the PSU, the system can then achieve the temperature requirement, i.e. within the curve, by controlling the load of the distributing PSU. If the temperature of the module B is normal, the load of the module B is increased, so that the load of the module A is reduced, and the fact that the three temperatures of the module A and the module B cannot cause the increase of a system fan is ensured. If the requirements cannot be met, the fan of the system is increased to reduce the temperature of the PSU.
If the air inlet temperature sensor is in a low-temperature area, the internal temperature of the PSU triggers a fan regulation and control point, so that the running speed of the fan of the PSU is increased. And if the temperature requirement cannot be met, the running speed of the fan of the system is increased.
According to the temperature control method, the current load of the PSU and the current temperature of the PSU are obtained, the corresponding operation curve is generated according to the current load and the current temperature, the operation curve and the rated curve are compared, the comparison result is obtained, the rated curve is a curve generated in advance according to the load and the corresponding temperature when the PSU normally operates, and the load of the PSU and the operation speed of the fan are regulated and controlled according to the comparison result. The temperature control method has the advantages that the load and the temperature inside the PSU are subjected to curve drawing, so that the temperature corresponding to the load can be visually known, reasonable allocation can be realized, the problem of downtime of a server caused by insufficient regulation and control of the fan and heat dissipation can be prevented, and the problem of energy waste caused by too high running speed of the fan can also be prevented, and therefore compared with the conventional temperature control method, the temperature control method can perform reasonable heat dissipation based on the basic situation of the PSU.
In consideration of the influence on the operating state of the PSU itself during the detection, a preferred embodiment is provided herein, wherein after obtaining the current load of the PSU and the current temperature of the PSU, the comparing the operating curve with the rated curve, and before obtaining the comparison result, the method further includes:
judging whether the current load of the PSU is greater than the rated load or not;
if not, the step of comparing the running curve with the rated curve to obtain a comparison result is carried out;
if so, converting a part of the current load of the PSU to other PSUs which do not exceed the rated load, and returning to the step of judging whether the current load of the PSU is greater than the rated load.
It should be noted that, in this embodiment, it is proposed to detect in advance whether the load is greater than the rated load and pass the detected load, a specific value of the rated load is not limited in this embodiment, and it should be noted that, in this embodiment, neither a specific collection manner of the current load of the PSU nor a manner of plotting the operation curve nor a manner of plotting the rated curve is limited.
In this embodiment, a load sharing mode is performed in a cyclic manner when it is finally determined that the load of the PSU is greater than the rated load, so that it is ensured that the temperature is reasonably adjusted without starting the system fan.
After the load of the PSU and the operation speed of the fan are controlled according to the comparison result, the method further includes:
detecting whether the operation curve is the same as a rated curve or not;
if not, returning to the step of regulating and controlling the load of the PSU and the running speed of the fan according to the comparison result.
It should be noted that, in the present embodiment, the same definition of the comparison between the operation curve and the rated curve is not limited, and the same may be approximately the same here, that is, the curvatures of the curves in one interval and the like overlap, and it can be understood that the PSU itself has the curvature and the like of the curve overlap, and thus, the PSU itself has
After the load of the PSU and the operation speed of the fan are controlled according to the comparison result, the method further includes:
and if the load of the PSU and the running speed of the fan cannot be adjusted to be equal to the rated curve, starting the system fan to perform heat dissipation treatment.
Providing a priority scheme due to a potential for a failure of one of the plurality of PSUs, including;
when a PSU fails, the PSU is shut down and the load of the PSU is distributed to other PSUs.
The method for judging the PSU fault comprises the following steps:
and if the temperature corresponding to the operation curve is lower than the temperature corresponding to the rated curve when the PSU fan stops running and the load is the same, determining that the PSU fails.
Through the above scheme, the heat dissipation mode of the PSU can be summarized, fig. 2 is a schematic diagram of a server motherboard structure provided by the embodiment of the present application, as shown in fig. 2, for example, there is a corresponding PSU fan regulation and control strategy inside the PSU, and after three temperature sensors of the PSU reach a temperature control point, the PSU fan can increase the operation speed and increase the air flow so as to meet the heat dissipation requirement of the PSU. The system collects the temperature of the PSU and the load (power) of the PSU in real time. And obtaining data curves of the temperatures of the three sensors according to PSU heat dissipation data actually measured by different loads and different ring temperatures, and storing the curves into an MCU of the PSU. The system accesses the temperature profile in the MCU through I2C. Normally, the temperature of the air inlet is lowest, the second temperature in the air inlet is middle, and the third temperature is highest. If the temperature of the air inlet of the PSU A is higher in normal work, firstly, the fan in the PSU A can increase the running speed and increase the air flow so as to reduce the temperature.
If the sensor of the inlet is in a high temperature region, it may happen that the inlet temperature is greater than the internal temperature, at which point the fan of the PSU a is already in full speed operation, but the inlet temperature is still high. And simultaneously collecting the load of the PSU, if the load is lower than 50% of the rated output of the PSU, and simultaneously when the system detects that the three temperatures in the module A deviate from the curve stored in the MCU, the system simultaneously judges whether the other parallel operation PSU B module works normally, and if the parallel operation PSU B module works normally, the PSU B fan does not run fully. The fan of the PSU B module is regulated and controlled, the running speed of the PSU B fan is increased, and the air volume of the air inlet of the PSU is increased. If the temperature of the PSU A module can be enabled to be normal, the running speed of the B is maintained. If the temperature of the module A is not normal, the running speed of the fan of the module A is reduced, and more heat flows out of the module B. If the requirement cannot be met, the system controls the module A to be shut down according to the load of the system, and only the module B is used for supplying power. If the load is greater than 50% the rated output of the PSU, the system can then achieve the temperature requirement, i.e., within the curve, by controlling the load of the distributed PSU. If the temperature of the module B is normal, the load of the module B is increased, so that the load of the module A is reduced, and the fact that the three temperatures of the module A and the module B cannot cause the increase of a system fan is ensured. If the requirements cannot be met, the fan of the system is increased to reduce the temperature of the PSU.
In the above embodiments, the temperature control method is described in detail, and the present application also provides embodiments corresponding to the temperature control device. It should be noted that the present application describes the embodiments of the apparatus portion from two perspectives, one is from the perspective of the function module, and the other is from the perspective of the hardware.
Fig. 3 is a schematic view of a temperature control apparatus according to an embodiment of the present application, and as shown in fig. 3, the apparatus includes:
an obtaining module 10, configured to obtain a current load of the PSU and a current temperature of the PSU;
the generating module 11 is configured to generate a corresponding operating curve according to the current load and the current temperature;
the comparison module 12 is configured to compare the operation curve with a rated curve to obtain a comparison result, where the rated curve is a curve generated in advance according to a load and a corresponding temperature when the PSU normally operates;
the first regulation and control module 13 is turned on when the load is the same and the temperature corresponding to the operation curve is higher than the temperature corresponding to the rated curve, and is used for converting a part of the current load of the PSU to other PSUs which do not exceed the rated load and increasing the operation speed of the fan in the PSU;
and the second regulation and control module 14 is started when the load is the same and the temperature corresponding to the operation curve is lower than the temperature corresponding to the rated curve, and is used for reducing the operation speed of the fan in the PSU.
Preferably, the apparatus further comprises:
the detection module is used for detecting whether the operation curve is the same as the rated curve or not;
if not, returning to the regulation module.
Preferably, the apparatus further comprises:
and the standby module is used for regulating and controlling the load of the PSU and the running speed of the fan, and if the running curve cannot be adjusted to be equal to the rated curve, the system fan is started to perform heat dissipation treatment.
Preferably, the device further comprises;
and the failure module is used for turning off the PSU and distributing the load of the PSU to other PSUs when the PSU fails.
Since the embodiment of the apparatus portion and the embodiment of the method portion correspond to each other, please refer to the description of the embodiment of the method portion for the embodiment of the apparatus portion and the corresponding beneficial effects, which is not repeated herein.
The temperature control device provided by this embodiment has an obtaining module, a generating module, a comparing module, a first regulating module, and a second regulating module, and generates a corresponding operating curve according to a current load and a current temperature of a PSU by obtaining the current load of the PSU and the current temperature of the PSU, compares the operating curve with a rated curve to obtain a comparison result, where the rated curve is a curve generated in advance according to the load and the corresponding temperature when the PSU normally operates, and regulates and controls the load of the PSU and the operating speed of the fan according to the comparison result. The temperature control method has the advantages that the temperature which should correspond to the load can be intuitively known through curve drawing of the load and the temperature inside the PSU, so that reasonable allocation can be carried out, the problem of server downtime caused by insufficient regulation and control of the fan and heat dissipation can be solved, the problem of energy waste caused by too high running speed of the fan can be solved, and reasonable heat dissipation can be carried out based on the basic condition of the PSU.
Fig. 4 is a structural diagram of a temperature control device according to another embodiment of the present application, and as shown in fig. 4, the temperature control device includes: a memory 20 for storing a computer program;
a processor 21 for implementing the steps of the temperature control method as mentioned in the above embodiments when executing the computer program.
The temperature control device provided by the embodiment may include, but is not limited to, a smart phone, a tablet computer, a notebook computer, or a desktop computer.
The processor 21 may include one or more processing cores, such as a 4-core processor, an 8-core processor, and the like. The Processor 21 may be implemented in at least one hardware form of Digital Signal Processor (DSP), field-Programmable Gate Array (FPGA), and Programmable Logic Array (PLA). The processor 21 may also include a main processor and a coprocessor, where the main processor is a processor for Processing data in a wake state, and is also called a Central Processing Unit (CPU); a coprocessor is a low power processor for processing data in a standby state. In some embodiments, the processor 21 may be integrated with a Graphics Processing Unit (GPU) which is responsible for rendering and drawing the content required to be displayed on the display screen. In some embodiments, the processor 21 may further include an Artificial Intelligence (AI) processor for processing computational operations related to machine learning.
The memory 20 may include one or more computer-readable storage media, which may be non-transitory. Memory 20 may also include high speed random access memory, as well as non-volatile memory, such as one or more magnetic disk storage devices, flash memory storage devices. In this embodiment, the memory 20 is at least used for storing the following computer program 201, wherein after being loaded and executed by the processor 21, the computer program can implement the relevant steps of the temperature control method disclosed in any of the foregoing embodiments. In addition, the resources stored in the memory 20 may also include the operation method 202, the data 203, and the like, and the storage manner may be a transient storage or a permanent storage. The operation method 202 may include Windows, unix, linux, and the like. Data 203 may include, but is not limited to, data involved in the temperature control methods described above, and the like.
In some embodiments, the temperature control device may further include a display 22, an input/output interface 23, a communication interface 24, a power supply 25, and a communication bus 26.
Those skilled in the art will appreciate that the configuration shown in FIG. 4 is not intended to be limiting of temperature control devices and may include more or fewer components than those shown.
The temperature control device provided by the embodiment of the application comprises a memory and a processor, wherein when the processor executes a program stored in the memory, the following method can be realized: the temperature control method referred to in the above embodiments.
The temperature control device comprises a memory and a processor, wherein when a stored program in the memory is executed by the processor, the current load and the current temperature of a PSU can be obtained, a corresponding operation curve is generated according to the current load and the current temperature, the operation curve is compared with a rated curve, a comparison result is obtained, the rated curve is a curve generated in advance according to the load and the corresponding temperature when the PSU normally operates, and the load of the PSU and the operation speed of a fan are regulated and controlled according to the comparison result. The temperature control method has the advantages that the temperature which should correspond to the load can be intuitively known through curve drawing of the load and the temperature inside the PSU, so that reasonable allocation can be carried out, the problem of server downtime caused by insufficient regulation and control of the fan and heat dissipation can be solved, the problem of energy waste caused by too high running speed of the fan can be solved, and reasonable heat dissipation can be carried out based on the basic condition of the PSU.
Since the embodiment of the apparatus portion and the embodiment of the method portion correspond to each other, please refer to the description of the embodiment of the method portion for the embodiment of the apparatus portion and the corresponding beneficial effects, which is not repeated herein.
Finally, the application also provides a corresponding embodiment of the computer readable storage medium. The computer-readable storage medium has stored thereon a computer program which, when being executed by a processor, carries out the steps as set forth in the above-mentioned method embodiments.
It is to be understood that if the method in the above embodiments is implemented in the form of software functional units and sold or used as a stand-alone product, it can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application, which are essential or part of the prior art, or all or part of the technical solutions may be embodied in the form of a software product, which is stored in a storage medium and executes all or part of the steps of the methods of the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
Since the embodiment of the readable storage medium portion corresponds to the embodiment of the method portion, please refer to the description of the embodiment of the method portion for the embodiment of the apparatus portion, which is not repeated here.
When the computer-readable storage medium provided by the application is executed by a computer program, the load of the PSU and the running speed of the fan can be regulated and controlled according to the comparison result by acquiring the current load of the PSU and the current temperature of the PSU, generating a corresponding running curve according to the current load and the current temperature, comparing the running curve with a rated curve, and acquiring the comparison result, wherein the rated curve is a curve generated in advance according to the load and the corresponding temperature when the PSU normally runs. The temperature control method has the advantages that the temperature which should correspond to the load can be intuitively known through curve drawing of the load and the temperature inside the PSU, so that reasonable allocation can be carried out, the problem of server downtime caused by insufficient regulation and control of the fan and heat dissipation can be solved, the problem of energy waste caused by too high running speed of the fan can be solved, and reasonable heat dissipation can be carried out based on the basic condition of the PSU.
A temperature control method, an apparatus and a computer readable storage medium provided by the present application are described in detail above. The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a component of' 8230; \8230;" does not exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.
Claims (9)
1. A temperature control method is applied to a server mainboard and comprises the following steps:
acquiring the current load of a PSU and the current temperature of the PSU;
generating a corresponding operation curve according to the current load and the current temperature;
comparing the operation curve with a rated curve to obtain a comparison result, wherein the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU in normal operation;
if the loads are the same, and the temperature corresponding to the operation curve is greater than the temperature corresponding to the rated curve, converting a part of the current load of the PSU into other PSUs which do not exceed the rated load, and increasing the operation speed of a fan of the PSU;
and if the load is the same, the temperature corresponding to the operation curve is lower than the temperature corresponding to the rated curve, and the operation speed of the fan of the PSU is reduced.
2. The method according to claim 1, wherein after the obtaining the current load of the PSU and the current temperature of the PSU, the comparing the operation curve with the rated curve, and before obtaining the comparison result, further comprises:
judging whether the current load of the PSU is greater than the rated load or not;
if not, the step of comparing the operation curve with the rated curve to obtain a comparison result is carried out;
if so, converting a part of the current load of the PSU to other PSUs which do not exceed the rated load, and returning to the step of judging whether the current load of the PSU is greater than the rated load.
3. The method of claim 2, further comprising, after regulating the load of the PSU and/or the operating speed of the fan:
detecting whether the operation curve is the same as the rated curve;
if not, returning to the step of comparing the running curve with the rated curve to obtain a comparison result.
4. The method of claim 3, further comprising, after regulating the load of the PSU and/or the operating speed of the fan:
and if the load of the PSU and the running speed of the fan of the PSU cannot be adjusted to be equal to the rated curve, starting the system fan to perform heat dissipation treatment.
5. The temperature control method according to any one of claims 1 to 4, characterized by further comprising;
when the PSU fails, the PSU is shut down, and the load of the PSU is distributed to other PSUs.
6. The temperature control method according to claim 5, wherein the method of determining the PSU failure is as follows:
and if the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the fan of the PSU stops rotating and the load is the same, determining that the PSU has a fault.
7. A temperature control apparatus, comprising:
the system comprises an acquisition module, a control module and a control module, wherein the acquisition module is used for acquiring the current load of a PSU and the current temperature of the PSU;
the generating module is used for generating a corresponding operating curve according to the current load and the current temperature;
the comparison module is used for comparing the operation curve with a rated curve to obtain a comparison result, wherein the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU in normal operation;
the first regulation and control module is started when the load is the same and the temperature corresponding to the operation curve is higher than the temperature corresponding to the rated curve, and is used for converting one part of the current load of the PSU to other PSUs which do not exceed the rated load and increasing the operation speed of a fan inside the PSU;
and the second regulation and control module is started when the load is the same and the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve, and is used for reducing the operating speed of the fan in the PSU.
8. A temperature control apparatus comprising a memory for storing a computer program;
a processor for implementing the steps of the temperature control method according to any one of claims 1 to 6 when executing the computer program.
9. A computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, which computer program, when being executed by a processor, carries out the steps of the temperature control method according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210939344.3A CN115237228A (en) | 2022-08-05 | 2022-08-05 | Temperature control method and device and readable storage medium |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210939344.3A CN115237228A (en) | 2022-08-05 | 2022-08-05 | Temperature control method and device and readable storage medium |
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| CN115237228A true CN115237228A (en) | 2022-10-25 |
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| CN202210939344.3A Pending CN115237228A (en) | 2022-08-05 | 2022-08-05 | Temperature control method and device and readable storage medium |
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