CN115237228A - A temperature control method, device and readable storage medium - Google Patents

Abstract

The application discloses a temperature control method, a temperature control device and a readable storage medium, and relates to the technical field of electronics. According to the temperature control method, the current load of the PSU and the current temperature of the PSU are obtained, the corresponding operation curve is generated according to the current load and the current temperature, the operation curve and the rated curve are compared, the comparison result is obtained, the rated curve is a curve generated in advance according to the load and the corresponding temperature when the PSU normally operates, and the load of the PSU and the operation speed of the fan are regulated and controlled according to the comparison result. The temperature curve drawing is carried out on the load and the temperature inside the PSU, so that the temperature corresponding to the load can be intuitively known, the problem of server downtime caused by insufficient regulation and control of the fan and heat dissipation can be prevented, and the problem of energy waste caused by too high running speed of the fan can be prevented.

Description

A temperature control method, device and readable storage medium

technical field

The present application relates to the field of electronic technology, and in particular, to a temperature control method, device and readable storage medium.

Background technique

In recent years, with the advent of the era of big data, cloud computing and artificial intelligence, the amount of Internet business has exploded, accompanied by more power consumption, and energy saving is urgent. How to reduce energy consumption and improve efficiency in servers and data has become a top priority. As the power consumption of server core devices such as the central processing unit is increasing, and the heat dissipated during operation is increasing, the higher the fan specification required by the system, the larger the power consumption ratio of the fan in the system. , which is not conducive to improving the overall efficiency, resulting in a certain waste of resources. Due to the different heat dissipation of the internal components of the server, the temperature and airflow in each area of the server will vary. Since a power supply unit (PSU) has a built-in fan, how to allocate a system fan and a PSU fan is the focus of power optimization.

In the prior art, there is a built-in temperature sensor on the mainboard side of the server, and a temperature sensor is provided inside the board and other components, and the collected temperature is transmitted to the system through I2C communication. Generally, three temperature sensors are built in the PSU. The Microcontroller Unit (MCU) inside the PSU collects temperature data and transmits it to the system through I2C. The system adjusts the fan speed according to the collected temperature, so that the server does not exceed the temperature spec and ensures the stability of the server. However, only detecting the temperature will lead to a relatively simple situation. If it is detected that the temperature increases, the operating speed of the fan is increased, and if the temperature decreases, the operating speed of the fan is decreased. Usually, the PSU is located at the back end of the server, and there are usually high-heat chips such as the CPU in front of the PSU. Due to the different heat dissipation of each component, the temperature and air flow of each area of the server will be different. If the sensor is in a high temperature area, it will cause the system fan to run at high speed. The overall power consumption of the server goes up. If the sensor is at a low temperature, the internal temperature of the PSU may be too high, the PSU will be protected, and the server will be shut down. Therefore, reasonable cooling measures cannot be made based on the basic conditions of the PSU.

In view of the above technologies, it is an urgent problem for those skilled in the art to find a temperature control method that can perform reasonable heat dissipation based on the basic conditions of the PSU.

SUMMARY OF THE INVENTION

The purpose of this application is to provide a temperature control method so as to solve the problem that if the sensor is in a high temperature area, the system fan will run at a high speed. The overall power consumption of the server goes up. If the sensor is at a low temperature, the internal temperature of the PSU may be too high, the PSU will be protected, and the server will be down. Therefore, a reasonable cooling response cannot be made based on the basic conditions of the PSU.

In order to solve the above-mentioned technical problems, the present application provides a temperature control method, which is applied to a server motherboard, including:

Get the current load of the PSU and the current temperature of the PSU;

generating a corresponding operation curve according to the current load and the current temperature;

Comparing the operating curve and the rated curve, and obtaining a comparison result, the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU during normal operation;

If the temperature corresponding to the operating curve is greater than the temperature corresponding to the rated curve when the loads are the same, a part of the current load of the PSU is converted to other PSUs that do not exceed the rated load, and the internal temperature of the PSU is increased. the operating speed of the fan;

If the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the loads are the same, the operating speed of the fan inside the PSU is reduced.

Preferably, after the acquiring the current load of the PSU and the current temperature of the PSU, the comparing the operating curve and the rated curve, and before acquiring the comparison result, further includes:

Determine whether the current load of the PSU is greater than the rated load;

If not, enter the step of comparing the operating curve and the rated curve to obtain the comparison result;

If so, transfer a part of the current load of the PSU to other PSUs that do not exceed the rated load, and return to the step of judging whether the current load of the PSU is greater than the rated load.

Preferably, after adjusting the load of the PSU and/or the operating speed of the fan, the method further includes:

Detecting whether the operating curve is the same as the rated curve;

If not, return to the step of comparing the running curve and the rated curve to obtain the comparison result.

Preferably, after adjusting the load of the PSU and/or the operating speed of the fan, the method further includes:

If the load of the PSU and the operating speed of the fan cannot be adjusted to adjust the operating curve to be equal to the rated curve, the system fan is turned on to perform heat dissipation.

Preferably, it also includes;

When the PSU fails, the PSU is shut down, and the load of the PSU is distributed to the other PSUs.

Preferably, the method for judging the PSU failure is as follows:

If the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the PSU fan is stopped and the load is the same, it is determined that the PSU is faulty.

In order to solve the above problems, the present application also provides a temperature control device, comprising:

an acquisition module for acquiring the current load of the PSU and the current temperature of the PSU;

a generating module, configured to generate a corresponding operating curve according to the current load and the current temperature;

a comparison module, configured to compare the operating curve and the rated curve to obtain a comparison result, where the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU during normal operation;

The first regulation module is turned on when the load is the same and the temperature corresponding to the operating curve is greater than the temperature corresponding to the rated curve, and is used to convert a part of the current load of the PSU to other PSUs that do not exceed the rated load , and increase the operating speed of the fan inside the PSU;

The second regulation module is turned on when the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the load is the same, so as to reduce the operating speed of the fan inside the PSU.

Preferably, the device further includes:

a detection module for detecting whether the operating curve is the same as the rated curve;

If not, go back to the control module.

Preferably, the device further includes:

The backup module is used for adjusting the load of the PSU and the operating speed of the fan, and if the operating curve cannot be adjusted to be equal to the rated curve, the system fan is turned on to perform heat dissipation processing.

Preferably, the device further comprises;

A failure module, configured to shut down the PSU when the PSU fails, and distribute the load of the PSU to the other PSUs.

In order to solve the above problems, the present application also provides a temperature control device, comprising a memory for storing a computer program;

The processor is configured to implement the steps of the above temperature control method when executing the computer program.

In order to solve the above problem, the present application also provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the above temperature control method are implemented.

In the temperature control method provided by the present application, by acquiring the current load of the PSU and the current temperature of the PSU, a corresponding operation curve is generated according to the current load and the current temperature, the operation curve and the rated curve are compared, and the comparison result is obtained. The curve generated by the load during normal operation and the corresponding temperature, according to the comparison result, the load of the PSU and the operating speed of the fan are regulated. By plotting the load and the temperature inside the PSU, we can intuitively understand the corresponding temperature in the corresponding load, so as to make reasonable allocation, which can not only prevent the problem of server downtime caused by insufficient fan and cooling control, It can also prevent the problem of energy waste caused by the fan running too fast. Therefore, compared with the previous temperature control method, the temperature control method provided by the present application can make reasonable heat dissipation based on the basic situation of the PSU.

The temperature control device and the computer-readable storage medium provided by the present application correspond to the above-mentioned temperature control method, and the beneficial effects are the same as above.

Description of drawings

In order to describe the embodiments of the present application more clearly, the following will briefly introduce the drawings that are used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, which are not relevant to ordinary skills in the art. As far as personnel are concerned, other drawings can also be obtained from these drawings on the premise of no creative work.

1 is a flow chart of a temperature control method provided by an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a server motherboard according to an embodiment of the present application;

3 is a schematic diagram of a temperature control device provided by an embodiment of the present application;

FIG. 4 is a structural diagram of a temperature control device provided by another embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative work fall within the protection scope of the present application.

The core of the present application is to provide a temperature control method, so as to solve the problem that if the sensor is in a high temperature area, the system fan will run at a high speed. The overall power consumption of the server goes up. If the sensor is at a low temperature, the internal temperature of the PSU may be too high, the PSU will be protected, and the server will be down. Therefore, a reasonable cooling response cannot be made based on the basic conditions of the PSU.

In order to make those skilled in the art better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

1 is a flowchart of a temperature control method provided by an embodiment of the present application, applied to a server motherboard, including:

S10: Obtain the current load of the PSU and the current temperature of the PSU;

It should be noted that the power load degree in the PSU collected by the MCU during the load in this embodiment, for example, the rated operating voltage of the PSU is 10V, and the current load voltage is 5V, then the current load is 50%, In this embodiment, the specific manner of acquiring the load and the temperature is not limited, and it can be understood that the acquisition of the temperature is generally performed by a temperature sensor. In this embodiment, the type and number of PSUs are not limited. It can be understood that generally

S11: Generate a corresponding operation curve according to the current load and the current temperature;

It should be noted that a server motherboard, also called a mainboard, a system board or a motherboard, is divided into two types: commercial motherboards and industrial motherboards. Generally speaking, the server motherboard is installed in the chassis and is one of the most basic and important components of the computer. The main board is generally a rectangular circuit board, on which the main circuit systems that make up the computer are installed, generally including BIOS chips, I/O control chips, keyboard and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components, the performance of the motherboard affects the performance of the entire microcomputer system. In this embodiment, the specific type of the motherboard is not limited. Since the load is a floating variable during the processing, the corresponding operation curve is drawn according to the fluctuation of the load as the variable and the temperature as the dependent variable.

It can be understood that the operating curve is established by a function, with load as a variable and temperature as a dependent variable, so the parameter is the heat dissipation power of the PSU.

S12: Compare the operating curve and the rated curve, and judge whether the temperature corresponding to the operating curve is greater than the temperature corresponding to the rated curve when the load is the same, if yes, go to S13, if not, go to S14;

The rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU during normal operation. Peripheral interfaces and even driving circuits are integrated on a single chip to form a chip-level computer, which can be controlled in different combinations for different applications.

S13: Transfer part of the current load of the PSU to other PSUs that do not exceed the rated load, and increase the operating speed of the fans inside the PSU;

It should be noted that the adjustment in this embodiment only needs to modulate the operating curve and the rated curve to be the same. As for the specific use of increasing the operating speed of the fan, switching the load, or a combination of the two, it is not specifically limited here. .

S14: Decrease the operating speed of the fan inside the PSU.

For example, according to the measured PSU heat dissipation data of different loads and different environments and temperatures, the data curves of the temperature of the three sensors are obtained, and the curves are stored in the MCU of the PSU. The system accesses the temperature curve in the microcontroller through I2C. Under normal circumstances, the temperature of the air inlet is the lowest, the temperature of the second inside is in the middle, and the temperature of the third is the highest. The PSU has two PSUs, PSU A and PSU B, which are used for power supply. In the previous working state, if the temperature of the air inlet of PSU A was high during normal operation, the fan inside PSU A would first increase the operating speed and increase the air flow in order to reduce the temperature. .

If the sensor of the air inlet is in a high temperature area, the temperature of the air inlet may be higher than the internal temperature. At this time, the fan of PSU A is already running at full speed, but the temperature of the air inlet is still high. At the same time, the load of the PSU is collected. If the load is lower than 50% of the rated output of the PSU, and the system detects that the three temperatures inside the A module deviate from the curve stored in the MCU, the system simultaneously determines another parallel PSU B. Check whether the module is working properly, if so, and the PSU B fan is not running at full speed. Then adjust the fans of the PSU B module, increase the running speed of the PSU B fans, and increase the air volume of the PSU air inlets. If the temperature of the PSU A module can be normalized, keep the operating speed of B. If the temperature of module A cannot be normal, reduce the fan speed of module A to allow more heat to flow out from module B. If the requirements cannot be met, the system controls the A module to shut down according to the system load, and only uses the B module to supply power. If the load is greater than 50% of the rated output of the PSU, the system can control the distribution of the PSU load to meet the temperature requirements, that is, within the curve. If the temperature of module B is normal, increase the load of module B to reduce the load of module A and ensure that the three temperatures of modules A and B will not cause the system fan to increase. If none of the above can meet the requirements, increase the fan of the system to reduce the temperature of the PSU.

If the air inlet temperature sensor is in a low temperature area, the internal temperature of the PSU will trigger the fan control point, which means that the fan running speed of the PSU increases. If the temperature requirements cannot be met, increase the fan speed of the system.

In the temperature control method provided by the present application, by acquiring the current load of the PSU and the current temperature of the PSU, a corresponding operation curve is generated according to the current load and the current temperature, the operation curve and the rated curve are compared, and the comparison result is obtained. The curve generated by the load during normal operation and the corresponding temperature, according to the comparison result, the load of the PSU and the operating speed of the fan are regulated. By plotting the load and the temperature inside the PSU, we can intuitively understand the corresponding temperature in the corresponding load, so as to make reasonable allocation, which can not only prevent the problem of server downtime caused by insufficient fan and cooling control, It can also prevent the problem of energy waste caused by the fan running too fast. Therefore, compared with the previous temperature control method, the temperature control method provided by the present application can make reasonable heat dissipation based on the basic situation of the PSU.

Considering the influence on the operating state of the PSU itself during the detection, a preferred solution is provided here. After obtaining the current load of the PSU and the current temperature of the PSU, compare the operating curve with the rated curve, and before obtaining the comparison result, also include:

Determine whether the current load of the PSU is greater than the rated load;

If not, enter the step of comparing the running curve and the rated curve to obtain the comparison result;

If so, transfer part of the current load of the PSU to other PSUs that do not exceed the rated load, and return to the step of judging whether the current load of the PSU is greater than the rated load.

It should be noted that, in this embodiment, it is proposed to detect whether the load is greater than the rated load in advance and pass the test. In this embodiment, the specific value of the rated load is not limited. It should be noted that in this embodiment, the above-mentioned The specific collection method of the current load of the PSU and the drawing method of the operation curve and the rated curve are not limited.

In this embodiment, the cycle method is used, so that when the load of the PSU is finally determined to be greater than the rated load, the load sharing method is performed, so as to ensure reasonable temperature adjustment without starting the system fan.

After adjusting the load of the PSU and the operating speed of the fan according to the comparison results, it also includes:

Check whether the running curve is the same as the rated curve;

If not, go back to the step of adjusting the load of the PSU and the operating speed of the fan according to the comparison result.

It should be noted that, in this embodiment, the way of defining the same comparison between the operating curve and the rated curve is not limited, and the same here can also be approximately the same, that is, the curvatures of the curves in an interval overlap, that is, Yes, it is understandable that since the PSU itself has

After adjusting the load of the PSU and the operating speed of the fan according to the comparison results, it also includes:

If the load of the PSU and the running speed of the fan cannot be adjusted and the running curve cannot be adjusted to be equal to the rated curve, turn on the system fan for heat dissipation.

Due to the possibility of encountering the failure of one of the multiple PSUs, priority solutions are provided here, including;

When a PSU fails, shut down the PSU and distribute the load of the PSU to other PSUs.

The methods for judging the PSU fault are as follows:

If the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the PSU fan is stopped and the load is the same, it is determined that the PSU is faulty.

Through the above solution, the heat dissipation method of the PSU can be summarized. FIG. 2 is a schematic structural diagram of a server motherboard provided by an embodiment of the application, as shown in FIG. 2 , for example, the PSU has a corresponding PSU fan control strategy, and the three After each temperature sensor reaches the temperature control point, the PSU fan will increase the operating speed and increase the air flow to meet the PSU cooling requirements. The system collects the temperature of the PSU and the load (power) of the PSU in real time. According to the PSU heat dissipation data measured by different loads and different ambient temperatures, the data curves of the three sensor temperatures are obtained, and the curves are stored in the MCU of the PSU. The system accesses the temperature profile in the MCU through I2C. Under normal circumstances, the temperature of the air inlet is the lowest, the temperature of the second inside is in the middle, and the temperature of the third is the highest. In normal operation, if the temperature of the air inlet of PSU A is high, first the internal fan of PSU A will increase the operating speed and increase the air flow in order to reduce the temperature.

If the sensor of the air inlet is in a high temperature area, the temperature of the air inlet may be higher than the internal temperature. At this time, the fan of PSU A is already running at full speed, but the temperature of the air inlet is still high. At the same time, the load of the PSU is collected. If the load is lower than 50% of the rated output of the PSU, and the system detects that the three temperatures inside the A module deviate from the curve stored in the MCU, the system simultaneously judges another parallel PSU module B. Whether it is working normally, if it is working normally, and the fan of PSU B is not running at full speed. Then adjust the fans of the PSU B module, increase the running speed of the PSU B fans, and increase the air volume of the PSU air inlets. If the temperature of the PSU A module can be normalized, keep the operating speed of B. If the temperature of module A cannot be normal, reduce the fan speed of module A to allow more heat to flow out of module B. If the requirements cannot be met, the system controls the A module to shut down according to the system load, and only uses the B module to supply power. If the load is greater than 50% of the rated output of the PSU, the system can control the distribution of the PSU load to meet the temperature requirements, that is, within the curve. If the temperature of module B is normal, increase the load of module B to reduce the load of module A and ensure that the three temperatures of modules A and B will not cause the system fan to increase. If none of the above can meet the requirements, increase the fan of the system to reduce the temperature of the PSU.

In the above embodiments, the temperature control method is described in detail, and the present application also provides corresponding embodiments of the temperature control device. It should be noted that this application describes the embodiments of the device part from two perspectives, one is based on the perspective of functional modules, and the other is based on the perspective of hardware.

FIG. 3 is a schematic diagram of a temperature control device provided by an embodiment of the application. As shown in FIG. 3 , the device includes:

an acquisition module 10 for acquiring the current load of the PSU and the current temperature of the PSU;

A generating module 11 is used to generate a corresponding operating curve according to the current load and the current temperature;

The comparison module 12 is used to compare the operation curve and the rated curve, and obtain the comparison result, and the rated curve is a curve generated in advance according to the load and the corresponding temperature during the normal operation of the PSU;

The first control module 13 is turned on when the load is the same and the temperature corresponding to the operating curve is greater than the temperature corresponding to the rated curve, and is used to convert a part of the current load of the PSU to other PSUs that do not exceed the rated load, and increase the fan inside the PSU running speed;

The second regulation module 14 is turned on when the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the load is the same, so as to reduce the operating speed of the fan inside the PSU.

Preferably, the device further includes:

Detection module, used to detect whether the running curve is the same as the rated curve;

If not, go back to the control module.

Preferably, the device further includes:

The backup module is used to control the load of the PSU and the running speed of the fan. If the running curve cannot be adjusted to be equal to the rated curve, the system fan is turned on for heat dissipation.

Preferably, the device further comprises;

The fault module is used to shut down the PSU when the PSU fails, and distribute the load of the PSU to other PSUs.

Since the embodiments of the apparatus part and the embodiments of the method part correspond to each other, the embodiments of the apparatus part and the corresponding beneficial effects may refer to the description of the embodiments of the method part, which will not be repeated here.

The temperature control device provided in this embodiment has an acquisition module, a generation module, a comparison module, a first regulation module, and a second regulation module. By acquiring the current load of the PSU and the current temperature of the PSU, a corresponding module is generated according to the current load and the current temperature. Compare the operating curve with the rated curve to obtain the comparison result. The rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU during normal operation. According to the comparison result, the load of the PSU and the operating speed of the fan are regulated. By plotting the load and the temperature inside the PSU, we can intuitively understand the corresponding temperature in the corresponding load, so as to make reasonable allocation, which can not only prevent the problem of server downtime caused by insufficient fan and cooling control, It can also prevent the problem of energy waste caused by the fan running too fast. Therefore, compared with the previous temperature control method, the temperature control method provided by the present application can make reasonable heat dissipation based on the basic situation of the PSU.

FIG. 4 is a structural diagram of a temperature control device provided by another embodiment of the application. As shown in FIG. 4 , the temperature control device includes: a memory 20 for storing a computer program;

The processor 21 is configured to implement the steps of the temperature control method mentioned in the above embodiments when executing the computer program.

The temperature control device provided in this embodiment may include, but is not limited to, a smart phone, a tablet computer, a notebook computer, or a desktop computer.

The processor 21 may include one or more processing cores, such as a 4-core processor, an 8-core processor, and the like. The processor 21 may be implemented by at least one hardware form among digital signal processing (Digital Signal Processor, DSP), field-programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). . The processor 21 may also include a main processor and a coprocessor. The main processor is a processor used to process data in the wake-up state, also called a central processing unit (CPU); A low-power processor for processing data in a standby state. In some embodiments, the processor 21 may be integrated with a graphics processor (Graphics Processing Unit, GPU), and the GPU is used for rendering and drawing the content that needs to be displayed on the display screen. In some embodiments, the processor 21 may further include an artificial intelligence (Artificial Intelligence, AI) processor for processing computing operations related to machine learning.

Memory 20 may include one or more computer-readable storage media, which may be non-transitory. Memory 20 may also include high-speed random access memory, as well as non-volatile memory, such as one or more magnetic disk storage devices, flash storage devices. In this embodiment, the memory 20 is at least used to store the following computer program 201 , where, after the computer program is loaded and executed by the processor 21 , the relevant steps of the temperature control method disclosed in any of the foregoing embodiments can be implemented. In addition, the resources stored in the memory 20 may also include an operation method 202 and data 203, etc., and the storage mode may be short-term storage or permanent storage. The operation method 202 may include Windows, Unix, Linux, and the like. The data 203 may include, but is not limited to, the data involved in the above temperature control method, and the like.

In some embodiments, the temperature control device may further include a display screen 22 , an input/output interface 23 , a communication interface 24 , a power supply 25 and a communication bus 26 .

Those skilled in the art can understand that the structure shown in FIG. 4 does not constitute a limitation on the temperature control device, and may include more or less components than those shown in the drawings.

The temperature control device provided by the embodiment of the present application includes a memory and a processor, and when the processor executes a program stored in the memory, the processor can implement the following method: the temperature control method involved in the foregoing embodiments.

The temperature control device provided by the present application includes a memory and a processor, and when a program stored in the memory is executed by the processor, the current load of the PSU and the current temperature of the PSU can be obtained, and the corresponding current load and current temperature can be generated according to the current load and the current temperature. Compare the operating curve with the rated curve to obtain the comparison result. The rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU during normal operation. According to the comparison result, the load of the PSU and the operating speed of the fan are regulated. By plotting the load and the temperature inside the PSU, we can intuitively understand the corresponding temperature in the corresponding load, so as to make reasonable allocation, which can not only prevent the problem of server downtime caused by insufficient fan and cooling control, It can also prevent the problem of energy waste caused by the fan running too fast. Therefore, compared with the previous temperature control method, the temperature control method provided by the present application can make reasonable heat dissipation based on the basic situation of the PSU.

Since the embodiments of the apparatus part and the embodiments of the method part correspond to each other, the embodiments of the apparatus part and the corresponding beneficial effects may refer to the description of the embodiments of the method part, which will not be repeated here.

Finally, the present application also provides an embodiment corresponding to a computer-readable storage medium. A computer program is stored on the computer-readable storage medium, and when the computer program is executed by the processor, the steps described in the foregoing method embodiments are implemented.

It can be understood that, if the methods in the above embodiments are implemented in the form of software functional units and sold or used as independent products, they may be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the present application can be embodied in the form of software products in essence, or the parts that contribute to the prior art, or all or part of the technical solutions, and the computer software products are stored in a storage medium , to execute all or part of the steps of the methods in the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), magnetic disk or optical disk and other media that can store program codes .

Since the embodiments of the readable storage medium part correspond to the embodiments of the method part, the embodiments of the apparatus part refer to the description of the embodiments of the method part, which will not be repeated here.

The computer-readable storage medium provided by the present application, when executed by a computer program, can obtain the current load of the PSU and the current temperature of the PSU, generate a corresponding operating curve according to the current load and the current temperature, and compare the operating curve and the rated curve. , and obtain the comparison result. The rated curve is a curve generated in advance according to the load of the PSU during normal operation and the corresponding temperature. According to the comparison result, the load of the PSU and the operating speed of the fan are regulated. By plotting the load and the temperature inside the PSU, we can intuitively understand the corresponding temperature in the corresponding load, so as to make reasonable allocation, which can not only prevent the problem of server downtime caused by insufficient fan and cooling control, It can also prevent the problem of energy waste caused by the fan running too fast. Therefore, compared with the previous temperature control method, the temperature control method provided by the present application can make reasonable heat dissipation based on the basic situation of the PSU.

The temperature control method, device and computer-readable storage medium provided by the present application have been described in detail above. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other. As for the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant part can be referred to the description of the method. It should be pointed out that for those of ordinary skill in the art, without departing from the principles of the present application, several improvements and modifications can also be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these entities or operations. There is no such actual relationship or sequence between operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article, or device that includes the element.

Claims (9)

1. a temperature control method, is characterized in that, is applied to server mainboard, comprises: Get the current load of the PSU and the current temperature of the PSU; generating a corresponding operation curve according to the current load and the current temperature; Comparing the operating curve and the rated curve, and obtaining a comparison result, the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU during normal operation; If the temperature corresponding to the operating curve is greater than the temperature corresponding to the rated curve when the loads are the same, a part of the current load of the PSU is converted to other PSUs that do not exceed the rated load, and the PSU is increased the operating speed of the fan; If the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the loads are the same, the operating speed of the fan of the PSU is reduced. 2 . The temperature control method according to claim 1 , wherein, after the acquiring the current load of the PSU and the current temperature of the PSU, the comparing the operating curve and the rated curve, and before acquiring the comparison result, 2 . Also includes: Determine whether the current load of the PSU is greater than the rated load; If not, enter the step of comparing the operating curve and the rated curve to obtain the comparison result; If so, transfer a part of the current load of the PSU to other PSUs that do not exceed the rated load, and return to the step of judging whether the current load of the PSU is greater than the rated load. 3. The temperature control method according to claim 2, characterized in that, after regulating the load of the PSU and/or the operating speed of the fan, further comprising: Detecting whether the operating curve is the same as the rated curve; If not, return to the step of comparing the running curve and the rated curve to obtain the comparison result. 4. The temperature control method according to claim 3, wherein after adjusting the load of the PSU and/or the operating speed of the fan, the method further comprises: If the operating curve of the PSU cannot be adjusted to be equal to the rated curve by adjusting the load of the PSU and the operating speed of the fan of the PSU, the system fan is turned on to perform heat dissipation processing. 5. The temperature control method according to any one of claims 1 to 4, characterized in that, further comprising: When the PSU fails, the PSU is shut down, and the load of the PSU is distributed to the other PSUs. 6. temperature control method according to claim 5, is characterized in that, the method for judging described PSU failure is as follows: If the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the fan of the PSU is stopped and the load is the same, it is determined that the PSU is faulty. 7. A temperature control device, characterized in that, comprising: an acquisition module for acquiring the current load of the PSU and the current temperature of the PSU; a generating module, configured to generate a corresponding operating curve according to the current load and the current temperature; a comparison module, configured to compare the operating curve and the rated curve to obtain a comparison result, where the rated curve is a curve generated in advance according to the load and the corresponding temperature of the PSU during normal operation; The first regulation module is turned on when the load is the same and the temperature corresponding to the operating curve is greater than the temperature corresponding to the rated curve, and is used to convert a part of the current load of the PSU to other PSUs that do not exceed the rated load , and increase the operating speed of the fan inside the PSU; The second regulation module is turned on when the temperature corresponding to the operating curve is lower than the temperature corresponding to the rated curve when the load is the same, so as to reduce the operating speed of the fan inside the PSU. 8. A temperature control device, comprising a memory for storing a computer program; The processor is configured to implement the steps of the temperature control method according to any one of claims 1 to 6 when executing the computer program. 9. A computer-readable storage medium, wherein a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the temperature according to any one of claims 1 to 6 is realized The steps of the control method.

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