CN115236372A - Multifunctional probe - Google Patents
Multifunctional probe Download PDFInfo
- Publication number
- CN115236372A CN115236372A CN202211021482.XA CN202211021482A CN115236372A CN 115236372 A CN115236372 A CN 115236372A CN 202211021482 A CN202211021482 A CN 202211021482A CN 115236372 A CN115236372 A CN 115236372A
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- CN
- China
- Prior art keywords
- layer
- probe
- optical fiber
- probe body
- optical
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0207—Details of measuring devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Abstract
The invention provides a multifunctional probe, and relates to the technical field of semiconductor detection. The multifunctional probe comprises a photoelectric probe body, wherein the photoelectric probe body comprises: a core layer of an optical fiber; the optical fiber cladding is wrapped outside the optical fiber core layer; the first conducting layer is wrapped outside the optical fiber wrapping layer and serves as an electric interface end; the photoelectric probe body comprises a first end part and a second end part, wherein the optical fiber core layer, the optical fiber cladding layer and the first conducting layer are coaxially arranged at the first end part to serve as an external optical interface end; at the second end, the first conductive layer is wrapped outside the fiber cladding as an electrical test end, and the fiber core layer is exposed at a predetermined distance from the second end through the fiber cladding and the first conductive layer at an outer sidewall of the first conductive layer as an optical test end. The multifunctional probe integrates the optical probe and the electric probe into the same instrument, and simultaneously detects the electric signal and the optical signal of the chip.
Description
The application is CN 202210681406.5, which is filed on 16.6.2022 and is entitled as a divisional application of a photoelectric probe assembly.
Technical Field
The invention relates to the technical field of semiconductor detection, in particular to a multifunctional probe.
Background
Optical devices and electrical devices are integrated into an existing chip, where the optical devices generally include coupling gratings, optical waveguides, photodetectors, optical modulators, etc., and the electrical devices generally include laser drivers, controllers, amplifiers, modulator drivers, clock signals, communication interfaces, etc. During the production of chips containing optical and electrical devices, the optical and electrical performance of the chips need to be tested in order to ensure that the devices can be used normally when shipped out of a factory. The conventional detection of the chip is to respectively test the optical performance and the electrical performance of the chip by using an optical probe and an electric probe. Therefore, two probe instruments are needed, and because the electrical interface and the optical interface of the chip are relatively close, the two instruments cannot be directly used for simultaneously detecting the optical performance and the electrical performance of the chip, and the detection efficiency is reduced.
Disclosure of Invention
An object of the first aspect of the present invention is to provide a multifunctional probe, which solves the technical problem in the prior art that an optical probe and an electrical probe are not integrated in the same instrument.
It is a further object of the first aspect of the invention to solve the problem of the prior art that the detection of the optical and electrical properties of the chip is inefficient.
In particular, the present invention provides a multifunction probe comprising an optoelectronic probe body comprising:
a core layer of an optical fiber;
the optical fiber cladding is wrapped outside the optical fiber core layer; and
the first conducting layer is wrapped outside the optical fiber wrapping layer and serves as an electrical interface end;
wherein the optoelectronic probe body comprises a first end portion and a second end portion, and at the first end portion, the optical fiber core layer, the optical fiber cladding layer and the first conductive layer are coaxially arranged to serve as an external optical interface end; at the second end, the first conductive layer is wrapped outside the fiber cladding as an electrical test end, and the fiber core layer is exposed at a predetermined distance from the second end through the fiber cladding and the first conductive layer at an outer sidewall of the first conductive layer as an optical test end.
Optionally, an angle formed by an axis of the optical testing end of the optical fiber core layer and an axis of the electrical testing end of the optical fiber cladding wrapped with the first conductive layer is greater than 0 ° and less than 90 °.
Optionally, the first conductive layer is made of gold.
Optionally, the method further comprises:
a PCB board;
and the cover plate fixes and electrically connects the photoelectric probe body and the PCB.
Optionally, a groove is formed in the cover plate, a second conductive layer is arranged on the inner side wall of the groove, and the second conductive layer and a third conductive layer of the PCB are connected and conductive with each other;
when the photoelectric probe body is fixed with the PCB through the cover plate, the photoelectric probe body is arranged at the groove, and the first conducting layer and the second conducting layer are in contact conduction with each other.
Optionally, an inner sidewall of the groove is in partial or full contact with an outer surface of the optoelectronic probe body.
Optionally, the cross section of the groove is in a V-shaped structure, and the size of the groove is adapted to the size of the optoelectronic probe body.
Optionally, the number of the photoelectric probe bodies and the number of the grooves are the same, and the number of the grooves is one or more.
Optionally, the number of the photoelectric probe body and the number of the grooves are both multiple and are arranged side by side.
The multifunctional probe of the scheme can comprise a photoelectric probe body, the photoelectric probe body can comprise an optical fiber core layer, an optical fiber cladding layer and a first conducting layer, the optical fiber core layer is used for transmitting optical signals, and the first conducting layer outside the optical fiber cladding layer can be used for transmitting electrical signals. Since the second end of the optical fiber cladding layer of the present solution is wrapped by the first conductive layer, the end can be used as an external electrical interface of the electrical probe. The optical fiber core layer penetrates through the optical fiber cladding layer and the side wall of the first conducting layer from the position close to the second end part of the multifunctional probe to be exposed outside, so that the optical fiber core layer can be used as an external optical interface of the optical probe, and the optical probe and the electric probe can be integrated in the same instrument by the aid of the structural design of the optical fiber core layer, the optical fiber cladding layer and the first conducting layer only, so that electric signals and optical signals of chips can be detected simultaneously.
The multifunctional probe of this scheme still includes PCB board and apron, utilizes the apron to carry out electric connection with photoelectric probe body and PCB board to make this multifunctional probe can integrate on same PCB board, realize improving efficiency of software testing to the test of the electrical property and the optical property of same chip simultaneously.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
FIG. 1 is a schematic block diagram of a multifunctional probe according to one embodiment of the present invention;
FIG. 2 is a schematic block diagram of a plurality of optoelectronic probe bodies in accordance with a specific embodiment of the present invention;
FIG. 3 is a schematic block diagram of a body of an optoelectronic probe in accordance with a specific embodiment of the present invention;
FIG. 4 is a schematic block diagram of a cross-section of a body of an optoelectronic probe in accordance with a specific embodiment of the present invention;
FIG. 5 is a partially schematic block diagram of an optoelectronic probe body in accordance with a specific embodiment of the present invention;
FIG. 6 is a front view of a multifunctional probe in accordance with an exemplary embodiment of the present invention;
FIG. 7 is a partially enlarged schematic view of a multifunctional probe according to one specific embodiment of the present invention.
Detailed Description
As a specific embodiment of the present invention, as shown in FIGS. 1-5, the present embodiment provides a multifunctional probe 100. The multi-function probe 100 can be used to test optical and electrical signals of a chip under test. The multi-purpose probe 100 may include an optoelectronic probe body 10. The optoelectronic probe body 10 may include a fiber core layer 11, a fiber cladding layer 12, and a first conductive layer 13. Wherein, the optical fiber cladding 12 is wrapped outside the optical fiber core layer 11. The first conductive layer 13 is wrapped around the fiber cladding 12 as an electrical interface end. The optoelectronic probe body 10 includes a first end 14 and a second end 15, where at the first end 14, the optical fiber core layer 11, the optical fiber cladding layer 12 and the first conductive layer 13 are coaxially disposed to serve as an external optical interface end. At the second end 15, the first conductive layer 13 is wrapped outside the fiber cladding 12 as an electrical test end, and the fiber core layer 11 is exposed at an outer sidewall of the first conductive layer 13 through the fiber cladding 12 and the first conductive layer 13 at a predetermined distance from the second end 15 as an optical test end.
The multifunctional probe 100 of the present embodiment may include an optoelectronic probe body 10, where the optoelectronic probe body 10 may include an optical fiber core layer 11, an optical fiber cladding layer 12, and a first conductive layer 13, where the optical fiber core layer 11 is used for transmitting optical signals, and the first conductive layer 13 outside the optical fiber cladding layer 12 is used for transmitting electrical signals. Since the second end 15 of the optical fiber cladding 12 of this embodiment is wrapped by the first conductive layer 13, this end can be used as an external electrical interface of the electrical probe, and in addition, the optical fiber core layer 11 of this embodiment is exposed outside through the optical fiber cladding 12 and the side wall of the first conductive layer 13 from a position close to the second end 15 of the multifunctional probe 100, so that the optical fiber core layer can be used as an external electrical interface of the optical probe.
The preset distance of this embodiment is related to the structure of probe and the optical interface and the electrical interface of the chip to be tested, and different probe structures are different in preset distance. In addition, the preset distance can be designed according to the actual structure of the chip to be tested, and different preset distances can be designed for different chips to be tested.
As a specific embodiment of the present invention, as shown in fig. 5, an angle α formed by an axis of an optical testing end of the optical fiber core layer 11 and an axis of an electrical testing end of the optical fiber cladding layer 12 wrapped with the first conductive layer 13 is between 0 ° and 90 °. Specifically, the included angle α does not include 0 ° nor 90 °. Preferably, the included angle α may be 10 ° to 45 °. The design of the included angle is related to the preset distance and the positions of the electrical detection point and the optical interface of the chip, and the design can be carried out according to actual requirements. Of course, when actually designing the angle of the exit end of the light core layer 11, the angle and the predetermined distance should be designed in combination.
As a specific embodiment of the present invention, the material of the first conductive layer 13 in this embodiment is gold. In an actual production process, the first conductive layer 13 of this embodiment may be formed by plating a gold layer on the outside of the optical fiber cladding 12 to form a gold-plated layer as a conductive medium.
As a specific embodiment of the present invention, as shown in fig. 1 and 6, the multi-function probe 100 of the present embodiment may further include a PCB board 20 and a cover plate 30. The cover plate 30 fixes and electrically connects the photoelectric probe body 10 and the PCB 20.
Specifically, the optoelectronic probe body 10 of the present embodiment is fixed to the PCB 20 by the cover plate 30, so that the transmission of light and electricity can be performed well.
As a specific embodiment of the present invention, as shown in fig. 6 and 7, a groove 31 is disposed at the cover plate 30 of the present embodiment, a second conductive layer is disposed at an inner sidewall of the groove 31, and the second conductive layer is electrically connected to a third conductive layer of the PCB 20. Wherein, when the photoelectric probe body 10 is fixed with the PCB board 20 by the cover plate 30, the photoelectric probe body 10 is disposed at the groove 31, and the first conductive layer 13 and the second conductive layer are in contact with each other for conduction.
Specifically, in this embodiment, when the PCB 20 and the cover plate 30 are fastened to each other, a space for placing the photoelectric probe body 10 is reserved. Therefore, in the present embodiment, a groove 31 is provided at the cap plate 30. The groove 31 is configured such that the optoelectric probe body 10 can be disposed at the PCB board 20, and an outer surface of the optoelectric probe body 10 is in contact with an outer surface of the groove 31, so that the first conductive layer 13 at the optoelectric probe body 10 and the second conductive layer 311 coated on an inner surface of the groove 31 are in contact with each other. The second conductive layer 311 on the inner wall of the groove 31 can be connected and conducted with the third conductive layer 21 on the PCB 20, so that the electrical signal on the PCB 20 can be transmitted to the photo-probe body 10, and the electrical performance of the chip can be detected by the photo-probe body 10.
As a specific embodiment of the present invention, the inner sidewall of the groove 31 of the present embodiment is partially or entirely in contact with the outer surface of the photoelectric probe body 10. And the space formed by the groove 31 and the PCB 20 can prevent the photoelectric probe body 10 from loosening.
Specifically, the sectional structure of the groove 31 of the present embodiment may be in a "V" shape, a semicircular shape, a plate-elliptical shape, or the like. The groove 31 can clamp and fix the circular photoelectric probe body 10 on the PCB 20, and the inner side wall of the groove 31 is partially in contact with the photoelectric probe body 10.
As a specific example, the cross section of the groove 31 of the present embodiment is a "V" shaped structure, and the size of the groove is adapted to the size of the optoelectronic probe body 10.
The groove 31 of the V-shaped structure of this embodiment enables the cover plate 30 to form a triangular cavity for the photoelectric probe body 10 to accommodate when the cover plate and the PCB 20 are disposed in contact with each other, and the inner side walls of the two V-shaped structures of the groove 31 just can be in contact with the photoelectric probe body 10, so as to ensure that the first conductive layer 13 and the second conductive layer 311 of the photoelectric probe body 10 are connected and conductive. And the V-shaped groove 31 makes the cover plate 30 convenient and simple to form.
Specifically, since the optoelectronic probe body 10 of the present embodiment is adapted to the PCB 20 and the cover plate 30 of the present embodiment, and the optoelectronic probe body 10 needs to detect the performance of the chip placed on a certain platform, the end of the optoelectronic probe body 10 should extend downward or obliquely downward in general. Therefore, each of the photo-probe bodies 10 of the present embodiment includes three portions (as shown in fig. 3), the first portion 16 is a portion parallel to the PCB 20 and is used for being fixed to the PCB 20 by the cover 30, the second portion 17 is a transition section, the photo-probe body 10 is extended by the transition section, and the third portion 18 is a detection section. The end of the probe section of this embodiment extends directly vertically downward. The optical fiber core layer 11 is exposed outside at the intermediate position of the second portion 17 and the third portion 18 directly through the optical fiber cladding layer 12 and the first conductive layer 13, so that light is extracted to be used for detecting an optical signal of the chip.
As a specific embodiment of the present invention, the number of the optoelectronic probe body 10 and the number of the grooves 31 are the same, and they are one or more. Specifically, the number of the optoelectronic probe bodies 10 in this embodiment corresponds to the number of chips to be detected, and each probe may correspond to one of the chips to be detected, so the number thereof is also adjusted according to the number of the chips to be detected.
As a specific embodiment, the number of the optoelectronic probe body 10 and the number of the grooves 31 are multiple and are arranged side by side. Specifically, the number of the optoelectronic probe bodies 10 can be 16, and the 16 optoelectronic probe bodies 10 are arranged side by side, so that the test of 16 chip optical signals and electrical signals can be simultaneously performed.
Thus, it should be appreciated by those skilled in the art that while various exemplary embodiments of the invention have been shown and described in detail herein, many other variations or modifications which are consistent with the principles of this invention may be determined or derived directly from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.
Claims (9)
1. A multifunctional probe, comprising an optoelectronic probe body, the optoelectronic probe body comprising:
a fiber core layer;
the optical fiber cladding is wrapped outside the optical fiber core layer; and
the first conducting layer is wrapped outside the optical fiber wrapping layer and serves as an electrical interface end;
wherein the optoelectronic probe body comprises a first end portion and a second end portion, and at the first end portion, the optical fiber core layer, the optical fiber cladding layer and the first conductive layer are coaxially arranged to serve as an external optical interface end; at the second end, the first conductive layer is wrapped outside the fiber cladding as an electrical test end, and the fiber core layer is exposed through the fiber cladding and the first conductive layer at a predetermined distance from the second end as an optical test end at an outer sidewall of the first conductive layer; the photoelectric probe body comprises a first part, a second part and a third part, and an included angle between the extending direction of the second part and the extending direction of the third part is larger than 0 degree.
2. The multifunctional probe of claim 1,
and an included angle formed by the axis of the optical test end of the optical fiber core layer and the axis of the electrical test end of the optical fiber cladding layer wrapped by the first conductive layer is larger than 0 degree and smaller than 90 degrees.
3. The multifunctional probe according to claim 2,
the first conducting layer is made of gold.
4. The multifunctional probe according to any one of claims 1 to 3,
further comprising:
a PCB board; and
and the cover plate fixes and electrically connects the photoelectric probe body and the PCB.
5. The multifunctional probe according to claim 4,
a groove is formed in the cover plate, a second conducting layer is arranged on the inner side wall of the groove, and the second conducting layer and a third conducting layer of the PCB are mutually connected and conduct electricity;
when the photoelectric probe body is fixed with the PCB through the cover plate, the photoelectric probe body is arranged at the groove, and the first conducting layer and the second conducting layer are in contact conduction with each other.
6. The multifunctional probe according to claim 5,
the inner side wall of the groove is partially or completely contacted with the outer surface of the photoelectric probe body.
7. The multifunctional probe according to claim 5,
the cross section of the groove is in a V-shaped structure, and the size of the groove is matched with that of the photoelectric probe body.
8. The multifunctional probe according to claim 5,
the number of the photoelectric probe bodies is the same as that of the grooves, and the number of the photoelectric probe bodies is one or more.
9. The multifunctional probe of claim 8,
the photoelectric probe body and the grooves are multiple in number and are arranged side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211021482.XA CN115236372A (en) | 2022-06-16 | 2022-06-16 | Multifunctional probe |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211021482.XA CN115236372A (en) | 2022-06-16 | 2022-06-16 | Multifunctional probe |
| CN202210681406.5A CN114778907B (en) | 2022-06-16 | 2022-06-16 | Photoelectric probe assembly |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210681406.5A Division CN114778907B (en) | 2022-06-16 | 2022-06-16 | Photoelectric probe assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115236372A true CN115236372A (en) | 2022-10-25 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211021482.XA Pending CN115236372A (en) | 2022-06-16 | 2022-06-16 | Multifunctional probe |
| CN202210681406.5A Active CN114778907B (en) | 2022-06-16 | 2022-06-16 | Photoelectric probe assembly |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210681406.5A Active CN114778907B (en) | 2022-06-16 | 2022-06-16 | Photoelectric probe assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN115236372A (en) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI265294B (en) * | 2005-08-02 | 2006-11-01 | Chia Sheng Technology Co Ltd | Test probe for display panel |
| US20080036464A1 (en) * | 2006-07-27 | 2008-02-14 | Qc Solutions, Inc. | Probes and methods for semiconductor wafer analysis |
| US7847575B2 (en) * | 2008-07-28 | 2010-12-07 | Globalfoundries Inc. | Method and apparatus for nano probing a semiconductor chip |
| CN102384991A (en) * | 2010-09-01 | 2012-03-21 | 陈建宏 | Coaxial probe for wafer probe cards and spider using same |
| WO2014034655A1 (en) * | 2012-08-31 | 2014-03-06 | 日本電気株式会社 | Optical probe, inspection device, and inspection method |
| US11125780B2 (en) * | 2018-10-18 | 2021-09-21 | International Business Machines Corporation | Test probe assembly with fiber optic leads and photodetectors |
| CN211293358U (en) * | 2019-12-31 | 2020-08-18 | 安徽光纤光缆传输技术研究所(中国电子科技集团公司第八研究所) | SC type photoelectric coaxial simultaneous transmission connector |
| JP2021182113A (en) * | 2020-05-20 | 2021-11-25 | 株式会社日本マイクロニクス | Optical probe, optical probe array, optical probe card, and method for manufacturing optical probe |
| JP2022028468A (en) * | 2020-08-03 | 2022-02-16 | 株式会社日本マイクロニクス | Measurement system and measurement method |
| CN114624483B (en) * | 2022-05-13 | 2022-08-02 | 苏州联讯仪器有限公司 | Telescopic chip probe and chip test system |
-
2022
- 2022-06-16 CN CN202211021482.XA patent/CN115236372A/en active Pending
- 2022-06-16 CN CN202210681406.5A patent/CN114778907B/en active Active
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| Publication number | Publication date |
|---|---|
| CN114778907A (en) | 2022-07-22 |
| CN114778907B (en) | 2022-09-13 |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Applicant after: Suzhou Lianxun Instrument Co.,Ltd. Address before: 215129 Building 1, No. 1508, Xiangjiang Road, Suzhou high tech Zone, Suzhou, Jiangsu Province Applicant before: STELIGHT INSTRUMENT Inc. |
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