CN115214070A

CN115214070A - Shell assembly, preparation method thereof and electronic equipment

Info

Publication number: CN115214070A
Application number: CN202110415036.6A
Authority: CN
Inventors: 陈奕君; 胡梦; 李聪
Original assignee: Shenzhen Taotao Technology Co ltd; Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Shenzhen Taotao Technology Co ltd; Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-04-17
Filing date: 2021-04-17
Publication date: 2022-10-21
Anticipated expiration: 2041-04-17
Also published as: CN115214070B

Abstract

The application provides a shell assembly, a preparation method thereof and an electronic device. The housing assembly of the embodiment of the application comprises a housing body, and the method comprises the following steps: mixing the modified inorganic filler with thermoplastic resin to obtain a mixture; and performing sectional molding on the mixture to obtain the shell body; the sectional molding comprises a first section molding and a second section molding, wherein the temperature of the first section molding is higher than the glass transition temperature of the thermoplastic resin and lower than the incipient melting temperature of the thermoplastic resin. The embodiment of the application provides a shell assembly which is light in weight, high in toughness and warm and moist in hand feeling and glossiness of ceramic.

Description

Shell assembly, preparation method thereof and electronic equipment

Technical Field

The application relates to the field of electronics, in particular to a shell assembly, a preparation method of the shell assembly and electronic equipment.

Background

Ceramics have a warm and moist hand feeling and a high gloss texture, and therefore, are often used as exterior structural members of high-end electronic device housings, middle frames, decorative parts, and the like. However, ceramics have a high density, are easily broken, and have high processing costs, so that applications are greatly limited.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a method for manufacturing a housing assembly, which can manufacture a housing assembly with a light weight and a warm and moist feeling and gloss of ceramic.

The embodiment of the application provides a preparation method of a shell assembly, the shell assembly comprises a shell body, and the method comprises the following steps:

mixing the modified inorganic filler with thermoplastic resin to obtain a mixture; and

the mixture is molded in a segmented mode to obtain the shell body; the sectional molding comprises a first section molding and a second section molding; the temperature of the first section molding is higher than the glass transition temperature of the thermoplastic resin and lower than the incipient melting temperature of the thermoplastic resin.

Based on the same inventive concept, the embodiment of the application also provides a shell assembly, and the shell assembly is prepared by the preparation method of the shell assembly.

Based on the same inventive concept, a further embodiment of the present application provides an electronic device, including:

a display component for displaying;

according to the shell assembly, the shell assembly and the display assembly form an accommodating space in an enclosing mode;

and the circuit board assembly is arranged in the accommodating space, is electrically connected with the display assembly and is used for controlling the display assembly to display.

The preparation method of the shell assembly provided by the embodiment of the application adopts the sectional molding, and the temperature of the first-section molding is higher than the glass transition temperature of the thermoplastic resin and lower than the incipient melting temperature of the thermoplastic resin. In the process of molding the shell component by the segmented molding, the thermoplastic resin molecular chains are deformed for more time and move, so that the thermoplastic resin molecular chains are wound for enough time to form a three-dimensional reticular structure, and the shell component is more suitable for preparing a modified inorganic filler and thermoplastic resin mixed system with the weight content of the modified inorganic filler being higher than 80%, has better ceramic warm and moist hand feeling and glossiness, and is light in weight and higher in pencil hardness and toughness.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a housing assembly according to an embodiment of the present application.

Fig. 2 is a schematic structural view of a housing assembly according to yet another embodiment of the present application.

Fig. 3 is a schematic flow chart illustrating a method for manufacturing a housing assembly according to an embodiment of the present disclosure.

Fig. 4 is a schematic flow chart of a method for manufacturing a housing assembly according to another embodiment of the present disclosure.

Fig. 5 is a schematic flow chart of a method for manufacturing a housing assembly according to still another embodiment of the present application.

Fig. 6 is a schematic flow chart illustrating a method for manufacturing a housing assembly according to still another embodiment of the present disclosure.

Fig. 7 is a photograph of the housing assembly obtained in example 3 (left figure) of the present application and comparative example 2 (right figure).

Fig. 8 is a scanning electron microscope image of the housing assembly manufactured in example 1 (left drawing) and comparative example 3 (right drawing) of the present application.

Fig. 9 is a photograph of the case assembly manufactured in comparative example 4.

Fig. 10 is an exploded view of an electronic device according to an embodiment of the present application.

Fig. 11 is a circuit block diagram of an electronic device according to an embodiment of the present application.

Description of the reference numerals:

100-housing assembly 601-accommodating space

10-housing body 630-circuit board assembly

30-protective layer 631-processor

600-electronic device 633-memory

610-display assembly 635-power supply

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

Referring to fig. 1, a housing assembly 100 according to an embodiment of the present disclosure includes a housing body 10, and raw material components of the housing body 10 include a modified inorganic filler and a thermoplastic resin.

Alternatively, the case assembly 100 of the present application may be an outer case, a middle frame, a decoration, and the like of an electronic device. The housing assembly 100 of the embodiment of the present application may have a 2D structure, a 2.5D structure, a 3D structure, and the like. Optionally, the housing assembly 100 includes a bottom plate (not shown) and a side plate (not shown) connected to the bottom plate (not shown) in a bending manner, and the bottom plate and the side plate enclose an accommodating space for accommodating a component (e.g., a PCB).

Optionally, the weight ratio of the modified inorganic filler to the thermoplastic resin is 4:1 to 20. Specifically, the weight ratio of the modified inorganic filler to the thermoplastic resin may be, but is not limited to, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1, 10. When the content of the modified inorganic filler is too small, the wear resistance of the manufactured case assembly 100 is poor, the life of the case assembly 100 is reduced, and simultaneously, the ceramic texture of the case assembly 100 is affected due to poor surface gloss. When the content of the modified inorganic filler is too large, the housing body 10 is difficult to mold, and the prepared housing assembly 100 has poor toughness and is easy to break. When the weight ratio of the modified inorganic filler to the thermoplastic resin is 4:1-20, the prepared shell assembly 100 has better ceramic texture and hand feeling, higher pencil hardness, higher toughness and difficult breakage.

The raw material components of the housing body 10 of the housing assembly 100 of the present application include the modified inorganic filler and the thermoplastic resin in a weight ratio of 4:1 to 20, which makes the manufactured housing assembly 100 have lighter weight compared with ceramics, and simultaneously have high glossiness, ceramic texture and higher pencil hardness, and at the same time, the cost of the housing assembly 100 is reduced, and the housing assembly 100 has better dielectric properties. In addition, compared with a plastic shell, the pencil has higher pencil hardness, wear resistance and ceramic texture.

In some embodiments, the modified inorganic filler comprises modified Al ₂ O ₃ Modified TiO 2 ₂ Modified ZrO ₂ Modified Si ₃ N ₄ Modified SiO ₂ One or more of (a). The modified inorganic filler may be prepared by adding an inorganic filler (e.g., al) ₂ O ₃ 、TiO ₂ 、ZrO ₂ 、Si ₃ N ₄ 、SiO ₂ ) And surface modifying with surface modifier. Alternatively, the surface modifier may be, but is not limited to, one or more of a silane coupling agent, a borate coupling agent, a titanate coupling agent. The surface modifier is adopted to modify the inorganic filler, so that the compatibility between the inorganic filler and the thermoplastic resin can be increased, the binding force between the inorganic filler and the thermoplastic resin is improved, the inorganic filler and the thermoplastic resin are mixed more uniformly, and the mixing system is more stable, so that the mechanical property of the shell body 10 is improved, and further the mechanical property of the shell assembly 100 is improved. Alternatively, the surface modifier may be added in an amount of 0.5 to 3% by weight of the inorganic filler, and specifically, the surface modifier may be added in an amount of, but not limited to, 0.5%, 0.8%, 1.0%, 1.5%, 1.8%, 2.0%, 2.3%, 2.8%, 3.0%, and the like. When the addition amount of the surface modifier is less than 0.5%, the modification of the inorganic filler is incomplete, in other words, some inorganic filler is not modified, which affects the binding force between the inorganic filler and the thermoplastic resin, and when the addition amount of the surface modifier is greater than 3%, excessive surface modifier molecules are deposited on the surface of the inorganic filler, so that the obtained modified inorganic filler is easy to agglomerate and difficult to uniformly disperse in the thermoplastic resin, which is not favorable for improving the mechanical properties of the housing assembly 100.

Alternatively, the modified inorganic filler may be prepared by:

1) Dissolving the surface modifier in alcohol, water or alcohol-water mixed solvent, and mixing uniformly; and optionally, the alcohol may be, but is not limited to, ethanol, propanol, etc., and the present application is not particularly limited.

2) Adding inorganic filler, mixing uniformly at normal temperature, and drying to obtain the modified inorganic filler.

Specifically, after the inorganic filler is added, the mixture can be placed at normal temperature, mixed by mechanical stirring or ultrasonic waves, and then subjected to flash evaporation or drying in a vacuum drying oven at 60 ℃ to 80 ℃ to obtain the modified inorganic filler.

In some embodiments, the thermoplastic resin may be, but is not limited to, one or more of Polyphenylene sulfide (PPS), polysulfone (PSU), polyethersulfone (PES), polyetherketone (PEK), polycarbonate, and polyamide. When the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, or polyetherketone, after the housing body 10 is molded, the thermoplastic resin can be subjected to chain extension and crosslinking at a temperature higher than the melting temperature of the thermoplastic resin, so that the crystallinity and the crosslinking degree of the thermoplastic resin are improved, the modified inorganic filler can be better bound in a crosslinking network of the thermoplastic resin, the bonding force between the thermoplastic resin and the modified inorganic filler is improved, and the pencil hardness and the toughness of the manufactured housing assembly 100 are improved.

In some embodiments, the raw material components of the housing body 10 further include a dispersant, and the dispersant is used to enable the thermoplastic resin and the modified inorganic filler to be mixed more uniformly, so that the mixed system is more stable. The dispersant may be, but is not limited to, liquid paraffin or the like. The addition amount of the dispersant may be 2% to 6% by weight, specifically, but not limited to, 2%, 3%, 4%, 5%, 6%, and the like, based on the total weight of the thermoplastic resin and the modified inorganic filler.

In some embodiments, the raw material composition of the housing body 10 further includes a plasticizer, which is used to enhance the plasticity and the fluidity of the thermoplastic resin in a molten state, so as to reduce the processing temperature of the housing body 10 and improve the processability of the housing assembly 100. The plasticizer may be, but is not limited to, dioctyl oxalate, and the amount of the plasticizer added may be 2 to 6% by weight, specifically, 2%, 3%, 4%, 5%, 6%, and the like, based on the total weight of the thermoplastic resin and the modified inorganic filler.

In some embodiments, the raw material components of the housing body 10 further include a pigment for providing the housing body 10 with a colored pattern or color, thereby providing the housing assembly 100 with a colored pattern or color. By controlling the color and the ratio of the pigment, the housing body 10 can present different appearance effects, so that the housing assembly 100 presents different appearance effects. Alternatively, the pigment may be added in an amount of 0.5% to 5% by weight, specifically, but not limited to, 0.5%, 1%, 2%, 3%, 4%, 5%, etc., based on the total weight of the thermoplastic resin and the modified inorganic filler.

Optionally, the thickness of the housing body 10 is 0.3mm to 1mm; specifically, the thickness of the case body 10 may be, but is not limited to, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, and the like. When the housing body 10 is too thin, the supporting and protecting functions cannot be well performed, the mechanical strength cannot well meet the requirements of the electronic device housing assembly 100, when the housing body 10 is too thick, the weight of the electronic device is increased, the hand feeling of the electronic device is affected, and the user experience is not good.

Alternatively, the surface roughness of the case body 10 is Ra 0.02 to Ra 0.08, and specifically, may be, but is not limited to, ra 0.02, ra 0.03, ra 0.04, ra 0.05, ra 0.06, ra0.07, ra 0.08, or the like. If the roughness is too large, the ceramic texture of the housing assembly 100 is affected, and if the roughness is too small, the process requirements are too strict, and the preparation cost is high.

Optionally, the pencil hardness of the housing body 10 is 4H to 9H; specifically, it may be, but is not limited to, 4H, 5H, 6H, 7H, 8H, 9H, etc. When the hardness of the pencil of the housing body 10 is too small, the wear resistance of the manufactured housing assembly 100 is poor, and the glossiness and the ceramic texture of the surface of the housing assembly 100 are affected after the housing assembly 100 is used for a period of time.

Referring to fig. 2, in some embodiments, the housing assembly 100 of the embodiment of the present application further includes a protective layer 30, the protective layer 30 is disposed on a surface of the housing body 10, and the protective layer 30 is used for preventing dirt and fingerprints, so as to improve the user experience of the housing assembly 100.

In some embodiments, the water contact angle of the overcoat layer 30 is greater than 105 °, specifically, may be, but is not limited to, 106 °, 110 °, 115 °, 120 °, 125 °, 130 °, 140 °, 150 °, etc., and the greater the water contact angle, the better the anti-fingerprint effect of the overcoat layer 30.

Optionally, the protective layer 30 is light transmissive, and the optical transmittance of the protective layer 30 is greater than or equal to 80%, and specifically, may be, but is not limited to, 80%, 82%, 85%, 88%, 90%, 92%, 95%, 96%, 97%, and the like. The protective layer 30 has a high transmittance, so as not to block the glossiness of the housing body 10 and affect the ceramic texture of the housing assembly 100.

In some embodiments, the raw material component of the protective layer 30 may include, but is not limited to, one or more of perfluoropolyether, perfluoropolyether derivatives, and the like, and the protective layer 30 is formed by evaporating a glue solution composed of the raw material component of the protective layer 30 on the surface of the case body 10. The perfluoropolyether and the perfluoropolyether derivative have excellent fingerprint resistance and can play a good role in fingerprint resistance and stain resistance. Alternatively, the thickness of the protective layer 30 is 5nm to 20nm, and specifically, may be, but is not limited to, 5nm, 6nm, 8nm, 10nm, 12nm, 14nm, 16nm, 18nm, 20nm, and the like. If the thickness of the protective layer 30 is too thin, the antifouling and fingerprint-proof effects cannot be achieved, and if the thickness of the protective layer 30 is too thick, the manufacturing cost of the housing assembly 100 is increased, and the hand feeling of the housing assembly 100 is also affected.

Ceramics have a warm and moist hand feeling and a high gloss texture, and therefore, are often used as exterior structural members of high-end electronic device housings, middle frames, decorative parts, and the like. However, the density of the ceramic is high, the manufactured electronic equipment appearance structural part is heavy, the pencil hardness is high, the electronic equipment appearance structural part is easy to crack, the processing difficulty is high, and in addition, the processing cost of the ceramic is high, so that the application of the ceramic is greatly limited. In order to improve the performance and cost of ceramics, in the related art, a thermoplastic resin and a ceramic powder (inorganic filler) are mixed, and injection molding is often adopted, however, when injection molding is adopted, the content of the ceramic powder is difficult to reach more than 80%, and when the content of the ceramic powder accounts for 80% of the total weight of the ceramics and the thermoplastic resin, the fluidity of the thermoplastic resin/the ceramic powder formed by mixing is poor, the resistance in the injection molding process is large, the flow marks are obvious, in addition, the injection molding time is usually short, and no sufficient time is available for moving and winding the thermoplastic resin molecular chains, which is not beneficial to improving the hardness and toughness of the finished product pencil, so that the appearance structural member obtained by injection molding has large porosity, low pencil hardness and toughness, and insufficient ceramic glossiness, and cannot meet the requirement of the appearance structural member of electronic equipment.

Referring to fig. 1 and fig. 3, in a method for manufacturing the housing assembly 100 according to an embodiment of the present disclosure, the method for manufacturing the housing assembly 100 may be applied to manufacture the housing assembly 100 according to the above embodiment. The housing assembly 100 includes a housing body 10, and the method of manufacturing the housing assembly 100 includes:

s201, mixing the modified inorganic filler with thermoplastic resin to obtain a mixture; and

specifically, the modified inorganic filler is uniformly mixed with the thermoplastic resin by dry or wet mechanical blending (e.g., ball milling, sand milling, etc.) to obtain a mixture.

Optionally, the weight ratio of the modified inorganic filler to the thermoplastic resin is 4:1 to 20.

Optionally, the modified inorganic filler comprises modified Al ₂ O ₃ Modified TiO 2 ₂ Modified ZrO ₂ Modified Si ₃ N ₄ Modified SiO ₂ One or more of (a). The modified inorganic filler may be prepared by adding an inorganic filler (e.g., al) ₂ O ₃ 、TiO ₂ 、ZrO ₂ 、Si ₃ N ₄ 、SiO ₂ ) And surface modifying with surface modifier. Alternatively, the surface modifier may be, but is not limited to, one or more of a silane coupling agent, a borate coupling agent, a titanate coupling agent. The surface modifier is added in an amount of 0.5 to 3% by weight of the inorganic filler.

Optionally, before the mixing the modified inorganic filler with the thermoplastic resin, the method further comprises: and (3) carrying out surface modification on the inorganic filler by adopting a surface modifier to obtain the modified inorganic filler.

Optionally, the surface modification of the inorganic filler with a surface modifier includes:

Specifically, after the inorganic filler is added, the mixture can be placed at normal temperature, mixed by mechanical stirring or ultrasonic waves, and then dried by flash evaporation or in a vacuum drying oven at 60 ℃ to 80 ℃ to obtain the modified inorganic filler.

Alternatively, the thermoplastic resin may be, but is not limited to, one or more of polyphenylene sulfide, polysulfone, polyethersulfone, polyetherketone, polycarbonate, and polyamide. When the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, or polyetherketone, after the housing body 10 is molded, the thermoplastic resin can be subjected to chain extension and crosslinking at a temperature higher than the melting temperature of the thermoplastic resin, so that the crystallinity and the crosslinking degree of the thermoplastic resin are improved, the modified inorganic filler can be better bound in a crosslinking network of the thermoplastic resin, the bonding force between the thermoplastic resin and the modified inorganic filler is favorably improved, the pencil hardness and the toughness of the manufactured housing body are improved, and the pencil hardness and the toughness of the housing assembly 100 are improved.

When the raw material components of the housing body 10 further include one or more of a dispersant, a plasticizer, and a pigment, the step S201 further includes mixing the one or more of a dispersant, a plasticizer, and a pigment with the modified inorganic filler and the thermoplastic resin.

For the description of the modified inorganic filler and other characteristics of the thermoplastic resin, please refer to the description of the corresponding parts of the above embodiments, which are not repeated herein.

S202, performing segmented molding on the mixture to obtain the shell body; the sectional molding comprises a first section molding and a second section molding; the temperature of the first section molding is higher than the glass transition temperature of the thermoplastic resin and lower than the incipient melting temperature (T) of the thermoplastic resin _ms )。

The term "incipient melting temperature" herein refers to the temperature at which a thermoplastic resin begins to melt. The term "sectional molding" in this application means that molding is performed in a plurality of sections, and at least one of the conditions of temperature, pressure, and the like of molding is different for each section. The glass transition temperature (Tg) is the temperature at which the glass state of a thermoplastic resin is transformed into a high elastic state.

Optionally, the segmented formation is a segmented embossing.

Optionally, the first section molding is compression molding, and the first section molding includes: and (3) carrying out die pressing on the mixture at the temperature and the pressure of the first-stage forming.

Alternatively, the temperature range for the first stage molding may be Tg to Tg +70 ℃, where Tg is the glass transition temperature of the thermoplastic resin. Specifically, the Tg, tg +5 ℃, tg +10 ℃, tg +15 ℃, tg +20 ℃, tg +25 ℃, tg +30 ℃, tg +35 ℃, tg +40 ℃, tg +45 ℃, tg +50 ℃, tg +55 ℃, tg +60 ℃, tg +65 ℃ and Tg +70 ℃ can be used, but not limited thereto.

Optionally, the temperature of the first stage forming ranges from Tg to Tg +40 ℃. Specifically, the temperature of the first stage molding may range from, but is not limited to, tg +5 deg.C, tg +10 deg.C, tg +15 deg.C, tg +20 deg.C, tg +25 deg.C, tg +30 deg.C, tg +35 deg.C, tg +40 deg.C, and the like. For example, when the thermoplastic resin is polyphenylene sulfide, the temperature of the first stage molding may be 120 ℃ to 160 ℃, and specifically, the temperature of the first stage molding may be, but is not limited to, 120 ℃, 125 ℃, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, 155 ℃, 160 ℃, and the like. When the temperature of the first section is in the range of Tg to Tg +40 ℃, the thermoplastic resin can be transformed from a glass state to a high elastic state to be softened, and adjacent thermoplastic resin molecules are deformed to be bonded, so that the adhesive force between the thermoplastic resin and the modified inorganic filler is increased. When the temperature of the first stage molding is lower than Tg, the thermoplastic resin is still in a glass state, and it is difficult to cause adhesion between thermoplastic resin particles even under high pressure, which is not favorable for improving the pencil hardness and toughness of the produced housing body. When the temperature of the first stage molding is higher than Tg +40 ℃, it is not favorable to maintain the original shape and size under high pressure.

Optionally, the first section molding pressure ranges from 100Mpa to 200Mpa; specifically, it may be, but not limited to, 100MPa, 110MPa, 120MPa, 140MPa, 150MPa, 160MPa, 170MPa, 180MPa, 190MPa, 200MPa, etc. When the pressure of the first stage molding is in this range, the densification between the thermoplastic resin and the modified inorganic filler can be enhanced, which helps to eliminate pores in the mixed system of the thermoplastic resin and the modified inorganic filler and to enhance the force acting between the thermoplastic resin and the modified inorganic filler. The pressure of the first section forming is too low, the mould blank is difficult to compact, and the forming is not facilitated, and when the pressure of the first section forming is too high, the requirement on equipment is too strict, and the operation risk coefficient is increased.

Optionally, the first stage molding time ranges from 30min to 2h, and specifically, may be, but is not limited to, 30min, 45min, 60min, 75min, 90min, 105min, 120min, and the like. When the time of the first-stage molding is less than 30min, the molecules of the thermoplastic resin have insufficient time to deform, which is not beneficial to the adhesion between the thermoplastic resin and the modified inorganic filler and the molding of the thermoplastic resin, and when the molding time is more than 2h, the thermoplastic resin and the modified inorganic filler are preformed, and the molding is continuously carried out at the temperature and the pressure of the first-stage molding, so that the influence on the molding of the thermoplastic resin and the modified inorganic filler is very small.

In some embodiments, the second section is formed by compression molding. The second stage of forming includes: and carrying out die pressing at the temperature of the second-stage forming and the pressure of the second forming.

Optionally, the temperature at which the second section is formed is higher than the temperature at which the first section is formed. Therefore, the molecular chains of the thermoplastic resin have better fluidity during the second-stage molding, and the formation of a three-dimensional network structure is more facilitated.

Optionally, the second section molding temperature is in the range of the initial melting temperature (T) of the thermoplastic resin _ms ) To the final melting temperature (T) of the thermoplastic resin _me ) 20 ℃ above, specifically, may be, but is not limited to, T _ms And T _me At any temperature in between, or T _me +5℃、T _me +10℃、T _me +15℃、T _me +20 ℃ and the like. When the thermoplastic resin is in the temperature range, the thermoplastic resin starts to melt and flow, and the molecular chains of the thermoplastic resin move and are wound together to form a three-dimensional through network structure, so that the bonding force among the molecules of the thermoplastic resin and between the thermoplastic resin and the modified inorganic filler is increased, and meanwhile, the modified inorganic filler can be wrapped in the network structure formed by the thermoplastic resin, so that the pencil hardness and the toughness of the formed shell body 10 are increased. When the temperature of the second-stage molding is lower than the initial melting temperature of the thermoplastic resin, molecular chains of the thermoplastic resin are difficult to melt, the flowability is poor, the molecular chains are difficult to wind, and a three-dimensional through network structure is formed. When the temperature of the second molding is higher than T _me At the temperature of +20 ℃, if the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyether sulfone and polyether ketone, the chain extension, crosslinking and other reactions occur among the molecular chains of the thermoplastic resin in advance, so that the fluidity of the thermoplastic resin is reduced, and the mutual winding among the molecular chains of the thermoplastic resin is not facilitated to form a three-dimensional network structure.

The term "final melting temperature" herein refers to the temperature at which the thermoplastic resin is completely melted.

For example, when the thermoplastic resin is polyphenylene sulfide (PPS), the temperature at which the second stage is molded ranges from 250 ℃ to 300 ℃; specifically, the temperature range of the second stage molding may be, but is not limited to, 250 ℃, 260 ℃, 270 ℃, 280 ℃, 290 ℃, 300 ℃ and the like.

Optionally, the second section molding pressure ranges from 20Mpa to 50Mpa; specifically, it may be, but not limited to, 20MPa, 25MPa, 30MPa, 35MPa, 40MPa, 45MPa, 50MPa, etc. In this pressure range, the thermoplastic resin molecular chains and the thermoplastic resin molecules and the modified inorganic filler can be bonded more tightly, which is favorable for improving the pencil hardness and toughness of the formed housing body 10. The second stage molding is carried out in a molten state, and when the pressure for the second stage molding is lower than 20Mpa, the shape retention is not facilitated. When the pressure for forming the second section is higher than 50Mpa, the requirement on equipment is high.

Optionally, the second section is formed for a time greater than the time for forming the first section. Therefore, when the second section is formed, the molecular chain of the thermoplastic resin has enough time to move and wind, and the formation of a three-dimensional network is facilitated.

Alternatively, the second stage molding time may range from 0.5h to 5h, and specifically, may be, but is not limited to, 0.5h, 1h, 1.5h, 2h, 2.5h, 3h, 3.5h, 4h, 4.5h, 5h, and the like. If the third-stage molding time is too short, there is not enough time for movement between the thermoplastic resin molecular chains to affect the formation of the three-dimensional network structure, so that the performance of the subsequently manufactured shell body 10 is affected, and if the third-stage molding time is too long, the effect on the manufactured shell body 10 is not changed greatly, but the requirement on equipment is high.

In some embodiments, after the housing body 10 is manufactured, the housing assembly 10 is machined by Computer Numerical Control (CNC) machining, and surface grinding and polishing are performed to obtain the housing assembly 100 conforming to the specifications of the electronic device.

In the process of molding the shell assembly 100 by high-temperature and high-pressure segmentation, the thermoplastic resin molecular chains are deformed for more time and move, so that the thermoplastic resin molecular chains are wound for sufficient time to form a three-dimensional network structure, and meanwhile, the high pressure enables densification among the thermoplastic resin molecular chains, between the thermoplastic resin molecular chains and the modified inorganic filler and between the modified inorganic filler to be more realized, so that the shell assembly is more suitable for a system with the weight content of the modified inorganic filler higher than 80 percent, and the prepared shell body 10 has better ceramic warm-moist hand feeling and glossiness, is lighter in weight and has higher pencil hardness and toughness, so that the prepared shell assembly 100 has better ceramic warm-moist hand feeling and glossiness, and is light in weight and higher in pencil hardness and toughness.

In some embodiments, when the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, or polyetherketone, the step-molding further comprises a step of third step-molding, the third step-molding being compression molding.

Alternatively, the third stage forming is carried out in an air or oxygen atmosphere. Specifically, the third stage forming includes: and carrying out die pressing in air or oxygen atmosphere at the temperature and the pressure of the third-stage forming.

Optionally, the temperature at which the third section is formed is higher than the temperature at which the second section is formed. Thus, when the thermoplastic resin molecular chains are formed in the third section, a chain extension reaction and a crosslinking reaction can be performed, so that the degree of crosslinking of the three-dimensional network structure is increased, and the hardness and toughness of the prepared shell body 10 are improved.

Optionally, the temperature of the third stage molding is in the range of the final melting temperature (T) of the thermoplastic resin _me ) Above 30 ℃ to the final melting temperature (T) of the thermoplastic resin _me ) Above 70 ℃. In other words, the temperature range of the third stage forming is T _me +30 ℃ to T _me +70 ℃; specifically, the temperature of the third stage forming may be, but is not limited to, T _me +30℃、T _me +35℃、T _me +40℃、T _me +45℃、T _me +50℃、T _me +55℃、T _me +60℃、T _me +65℃、T _me +70 ℃ and the like. When the temperature is within this range, a chain extension reaction occurs between molecules of the thermoplastic resin (e.g., polyphenylene sulfide), and in addition, an oxidative crosslinking reaction occurs between molecules of the thermoplastic resin under the action of oxygen, thereby increasing the molecular weight and the degree of crosslinking of the thermoplastic resin, and further increasing the pencil hardness and toughness of the manufactured case assembly 10. At the same time, the user can select the desired position,the forming temperature of the third section is controlled to be T _me Below +70 ℃, the occurrence of the chain extension reaction and the crosslinking reaction is not too fast, so that the crosslinking degree is controlled within a certain range, the crystallinity and the crosslinking degree of the thermoplastic resin in the formed shell body 10 are effectively controlled, and the toughness of the shell body 10 is not reduced due to too high crosslinking degree.

Taking the thermoplastic resin as polyphenylene sulfide (PPS) as an example, when the thermoplastic resin is polyphenylene sulfide (PPS), the temperature for forming the third section ranges from 320 ℃ to 360 ℃; specifically, it may be, but not limited to, 320 ℃, 325 ℃, 330 ℃, 335 ℃, 340 ℃, 345 ℃, 350 ℃, 360 ℃ or the like. At this time, the main chemical reaction equation occurring between the molecular chains of the thermoplastic resin is as follows:

optionally, the third-stage forming pressure is 50Mpa to 100Mpa; specifically, it may be, but not limited to, 50MPa, 55MPa, 60MPa, 65MPa, 70MPa, 75MPa, 80MPa, 85MPa, 90MPa, 100MPa, etc. When the pressure of the third-stage molding is within this range, the time movement of the thermoplastic resin molecular chains can be accelerated, so that the combination between the thermoplastic resin molecular chains and between the thermoplastic resin molecules and the modified inorganic filler is further densified, which is beneficial to further improving the pencil hardness and toughness of the manufactured casing body 10, thereby improving the pencil hardness and toughness of the manufactured casing assembly 100. When the pressure for the third stage molding is less than 50Mpa, the shape retention of the thermoplastic resin and the modified inorganic filler is not facilitated, and when it is more than 100Mpa, the contribution to molding is small, and the requirements on equipment are severe.

Alternatively, the time range of the third stage molding may be 1h to 12h, and specifically, may be, but is not limited to, 1h, 2h, 3h, 4h, 5h, 6h, 7h, 8h, 9h, 10h, 11h, 12h, and the like. The third-stage molding time is too short, the degrees of chain extension reaction and crosslinking reaction of the thermoplastic resin are too low, and the toughness of the formed shell body 10 is reduced; too long time for the third stage of molding causes too high degree of crosslinking of the thermoplastic resin, and the formed shell body has too large brittleness and insufficient toughness.

It should be understood that, when the first stage forming, the second stage forming, and the third stage forming are performed, they may be performed at a certain temperature point in their respective temperature ranges, and each stage forming may also be performed by gradually increasing the temperature in another temperature range, and when the temperature satisfies the above range, which manner is specifically adopted, and the present application is not limited specifically.

Referring to fig. 1 and 4, another embodiment of the present application provides a method for manufacturing a housing assembly 100, and the method for manufacturing the housing assembly 100 can be applied to manufacture the housing assembly 100 of the above embodiment. The shell assembly 100 comprises a shell body 10, the sectional molding comprises a first section molding and a second section molding, and the preparation method of the shell assembly 100 comprises the following steps:

s301, mixing the modified inorganic filler with the thermoplastic resin to obtain a mixture;

s302, forming a first section: molding the mixture at a temperature of Tg to Tg +40 ℃ and a pressure of 100MPa to 200MPa; and

s303, second-stage forming: at a temperature of the incipient melting temperature (T) of the thermoplastic resin _ms ) To 20 ℃ above the final melting temperature of the thermoplastic resin (T) _me And (c) at 20 to 50Mpa, and molding to obtain the housing body 10.

For the description of the features in steps S301 to S303 that are the same as those in the above embodiments, please refer to the above embodiments, which are not described herein again.

Referring to fig. 1 and 5, another embodiment of the present application provides a method for manufacturing a housing assembly 100, and the method for manufacturing the housing assembly 100 can be applied to manufacture the housing assembly 100 of the above embodiments. The shell assembly 100 comprises a shell body 10, the segmented molding comprises a first segment molding, a second segment molding and a third segment molding, and the preparation method of the shell assembly 100 comprises the following steps:

s401, mixing the modified inorganic filler with thermoplastic resin to obtain a mixture;

s402, forming a first section: molding the mixture at a temperature of Tg to Tg +40 ℃ and a pressure of 100MPa to 200MPa;

s403, second-stage forming: at a temperature of the incipient melting temperature (T) of the thermoplastic resin _ms ) To 20 ℃ above the final melting temperature of the thermoplastic resin (T) _me Molding at 20-50 MPa pressure; and

for the description of the features in steps S401 to S403 that are the same as those in the above embodiment, reference is made to the above embodiment, and details are not repeated herein.

S404, third-stage forming: at a temperature of 30 ℃ or higher than the final melting temperature of the thermoplastic resin (T) _me +30 ℃ to 70 ℃ above the final melting temperature of the thermoplastic resin (T) _me And 70 deg.C, and molding under 50-100 Mpa to obtain the shell body 10.

For the description of the same parts of the step S404 as those of the above embodiment and other embodiments, please refer to the above embodiment, which is not repeated herein.

Referring to fig. 2 and fig. 6, another embodiment of the present application provides a method for manufacturing a housing assembly 100, and the method for manufacturing the housing assembly 100 can be applied to manufacture the housing assembly 100 of the above embodiments. The shell assembly 100 includes a shell body 10 and a protective layer 30, the protective layer 30 is disposed on a surface of the shell body 10, and the preparation method of the shell assembly 100 includes:

s501, mixing the modified inorganic filler with thermoplastic resin to obtain a mixture;

s502, performing sectional molding on the mixture to obtain the shell body 10; and

optionally, in some embodiments the segmented shaping comprises a first segment shaping and a second segment shaping. In other embodiments, the segmented forming includes a first segment forming, a second segment forming, and a third segment forming.

For details of the same portions of step S501 and step S502 as those of the above embodiment, please refer to the corresponding portions of the above embodiment, which are not repeated herein.

In some embodiments, after the housing body 10 is manufactured, the housing assembly 10 is machined by computer numerical control precision machining (CNC machining) and polished before the protective layer 30 is formed.

S503, forming the protective layer 30 on the surface of the case body 10.

In particular, the protective layer 30 is used for stain and fingerprint resistance to enhance the user experience of the housing assembly 100.

Optionally, the protective layer 30 is light transmissive, and the optical transmittance of the protective layer 30 is greater than or equal to 80%, and specifically, may be, but is not limited to, 80%, 82%, 85%, 88%, 90%, 92%, 95%, 96%, 97%, and the like. The protective layer 30 has a high transmittance, so that the glossiness of the housing body 10 is not blocked, and the ceramic texture of the housing assembly 100 is not affected.

The housing assembly manufactured in the examples of the present application will be further described below by way of specific examples and comparative examples.

Examples 1 to 4 three-stage Press Molding

The housing assemblies of examples 1-4 were prepared by the following steps:

1) respectively weighing modified alumina and polyphenylene sulfide in weight ratios of 4:1 (example 1), 17 (example 2), 9:1 (example 3) and 19 (example 4), wherein the alumina is modified by 2wt% of a silane coupling agent, the polyphenylene sulfide has a glass transition temperature of 90 ℃, an initial melting temperature of 260 ℃ and a final melting temperature of 295 ℃;

2) Mixing the modified alumina with the polyphenylene sulfide to obtain a mixture;

3) Molding the mixture at 120 ℃ and 150Mpa for 1h to obtain a mold blank;

4) Molding at 280 deg.C and 40Mpa for 2 hr;

5) Molding at 350 deg.C and 70Mpa in air atmosphere for 3 hr to obtain a shell assembly with thickness of 0.8 mm.

Comparative examples 1 and 2 injection Molding

The housing assemblies of comparative examples 1 and 2 were prepared by the following steps:

1) Respectively weighing modified alumina and polyphenylene sulfide in a weight ratio of 4:1 (comparative example 1) and 9:1 (comparative example 2), wherein the alumina is modified by 2wt% of a silane coupling agent, and the polyphenylene sulfide has a glass transition temperature of 90 ℃, an initial melting temperature of 260 ℃ and a final melting temperature of 295 ℃;

3) Keeping the mixture at 140 ℃ for 4h;

4) The following temperature sections are adopted in an injection molding machine, and the temperature is gradually increased for injection molding: the first temperature range is 270 ℃ to 290 ℃, the second temperature range is 290 ℃ to 310 ℃, the third temperature range is 310 ℃ to 330 ℃, the fourth temperature range is 330 ℃ to 350 ℃, and the head temperature is 330 ℃ to 350 ℃; temperature of the die: 160 ℃; a housing assembly with a thickness of 0.8mm was obtained.

Comparative examples 3 and 4 Single temperature Press Molding

The housing assemblies of comparative examples 3 and 4 were prepared by the following steps:

1) Weighing modified alumina and polyphenylene sulfide in a weight ratio of 4:1, wherein the alumina is modified by 2wt% of silane coupling agent, the polyphenylene sulfide has a glass transition temperature of 90 ℃, an initial melting temperature of 260 ℃ and a final melting temperature of 295 ℃;

3) The mixture was molded at a temperature of 120 ℃ (comparative example 3) or 350 ℃ (comparative example 4) under a pressure of 150Mpa for 6 hours, respectively, to obtain a housing assembly.

The housing assemblies obtained in examples 1 to 4 and the housing assemblies obtained in comparative examples 1 and 4 were subjected to the molding condition, pencil hardness and falling ball height tests as follows:

1) And (3) testing the molding condition: whether the shape of the prepared housing assembly is complete or not is observed by taking a photograph, and the molding conditions of example 3 and comparative example 2 are shown in fig. 7 (left figure example 3, right figure comparative example 2). The molding of comparative example 4 is shown in FIG. 9.

2) And (3) testing pencil hardness: GB/T6739-1996.

3) Falling ball impact test: making the shell assembly into a flat sheet with the size of 150mm multiplied by 73mm multiplied by 0.8 mm; the samples of the above examples 1 to 4, 1 and 3 are respectively supported on a jig (four sides of the shell assembly are respectively supported by a jig with a height of 3mm, and the middle part of the shell assembly is suspended), a stainless steel ball with a weight of 32g is freely dropped onto the surface of the shell assembly to be measured from a certain height, five points of four corners and the center of the shell assembly are respectively measured, each point is measured for 5 times until the shell assembly is broken, and the height when the shell assembly is broken is the height of the dropped ball. The higher the ball drop height, the more ductile the housing assembly is and the less likely it will fracture.

4) Scanning Electron Microscope (SEM): the surface morphology of example 1 and comparative example 3 was examined by scanning electron microscopy and the results are shown in fig. 8 (left panel example 1, right panel comparative example 3).

The specific test results of examples 1 to 4, comparative example 1, and comparative example 2 are shown in table 1, fig. 7, and fig. 8 below.

Fig. 7 is a photograph showing the case units obtained in example 3 (left view in fig. 7) and comparative example 2 (right view in fig. 7), and it can be seen from fig. 7 that the case units obtained by the case unit preparation method of the present application can be well molded when the modified alumina content is 90% by weight, whereas the case units obtained by the conventional injection molding method cannot be molded into complete shapes when the modified alumina content is 90% by weight. The housing assembly 100 manufactured by the method of the embodiment of the present application is more suitable for the housing assembly 100 in which the content of the modified inorganic filler is higher than 80%, even higher than 90%, and the housing assembly 100 having better ceramic hand feeling and glossiness, higher hardness, and better toughness can be manufactured.

As can be seen from table 1 below, the housing assembly prepared by the preparation method of the present application has a gradually increased pencil hardness and a gradually decreased ball drop height as the content of the modified alumina increases. In addition, the housing assemblies prepared in examples 1 to 4 by the method of the present application can be prepared to have a higher weight part of modified alumina than the conventional injection molding method in comparative examples 1 and 2, so that the housing assembly having a higher modified inorganic filler can be prepared, and the housing assembly having a higher pencil hardness, a milder ceramic texture and a ceramic gloss can be prepared on the premise of satisfying the toughness requirement of the housing.

As can be seen from table 1, the shell assembly obtained by three-stage compression molding has a higher ball drop height and thus better toughness than that obtained by single-temperature compression molding. Fig. 8 is a scanning electron microscope image of the housing assemblies prepared in example 1 (left image in fig. 8) and comparative example 3 (right image in fig. 8), and as shown in fig. 8, the surface appearance of the housing assembly prepared in example 1 is denser than that of the housing assembly prepared in comparative example 3, which indicates that the housing assembly prepared in example 1 has better bonding performance between polyphenylene sulfide and modified alumina, and further indicates that the housing assembly prepared by three-stage compression molding has better toughness and pencil hardness than the housing assembly prepared by single-temperature compression molding.

As can be seen from fig. 9, in comparative example 4, the case assembly having a regular shape could not be obtained by performing the one-temperature press molding in a molten state of the thermoplastic resin. After mixing the thermoplastic resin and the modified inorganic filler, the mixture is directly subjected to compression molding at a temperature higher than the melting temperature and under a high pressure, the thermoplastic resin and the modified inorganic filler are not preformed, and a three-dimensional network structure is not formed in the thermoplastic resin, so that the thermoplastic resin is rapidly deformed to a great extent, and a sample with an expected shape and size cannot be obtained.

TABLE 1 Molding of housing Assembly, pencil hardness and ball drop height of examples and comparative examples

Examples of the invention	Modified Al ₂ O ₃ : PPS (weight ratio)	Hardness of pencil	Ball height (cm)	Whether can be molded
					Example 1	4:1	4H	70	Is that
Example 2	17:3	5H	50	Is that
					Example 3	9:1	7H	40	Is that
Example 4	19:1	9H	30	Is that
					Comparative example 1	4:1	4H	70	Is that
Comparative example 2	9:1	/	/	Whether or not
					Comparative example 3	4:1	/	＜15	Is that
Comparative example 4	4:1	/	/	Whether or not

Referring to fig. 10, an embodiment of the present application further provides an electronic device 600, which includes: a display component 610 for displaying; in the housing assembly 100 according to the embodiment of the present application, the housing assembly 100 and the display assembly 610 enclose an accommodating space 601; the circuit board assembly 630 is disposed in the accommodating space 601, electrically connected to the display assembly 610, and configured to control the display assembly 610 to display.

The electronic device 600 according to the embodiment of the present application may be, but is not limited to, a portable electronic device such as a mobile phone, a tablet, a notebook, a desktop, a smart band, a smart watch, an electronic reader, and a game console.

For a detailed description of the housing assembly 100, please refer to the description of the corresponding parts of the above embodiments, which is not repeated herein.

Alternatively, the display module 610 may be, but is not limited to, one or more of a liquid crystal display module, a light emitting diode display module (LED display module), a micro light emitting diode display module (micro LED display module), a sub-millimeter light emitting diode display module (MiniLED display module), an organic light emitting diode display module (OLED display module), and the like.

Referring also to fig. 11, optionally, the circuit board assembly 630 may include a processor 631, a memory 633 and a power supply 635. The processor 631 is electrically connected to the display module 610, the memory 633 and the power supply 635 respectively. The processor 631 is configured to control the display component 610 to display, and the memory 633 is configured to store program codes required by the processor 631 to operate, program codes required by the display component 610 to control, display contents of the display component 610, and the like. The power supply 635 is used for supplying power for the processor 631 to operate.

Alternatively, processor 631 comprises one or more general-purpose processors, wherein a general-purpose processor may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU), a microprocessor, a microcontroller, a main processor, a controller, an ASIC, and the like. The processor 631 is operative to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 633, which enable the computing device to provide a wide variety of services.

Alternatively, the Memory 633 may include a Volatile Memory (Volatile Memory), such as a Random Access Memory (RAM); the Memory 633 may also include a Non-volatile Memory (NVM), such as a Read-Only Memory (ROM), a Flash Memory (FM), a Hard Disk (HDD), or a Solid-State Drive (SSD). The memory 633 may also comprise a combination of the above-mentioned kinds of memories.

Alternatively, the power supply 635 may be, but is not limited to, a battery, a power supply circuit, and the like.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method of making a housing assembly, the housing assembly comprising a housing body, the method comprising:

2. The method of manufacturing a housing assembly according to claim 1, wherein the first stage molding is compression molding, the first stage molding temperature ranges from Tg to Tg +40 ℃, wherein Tg is the glass transition temperature of the thermoplastic resin, and the first stage molding pressure ranges from 100Mpa to 200Mpa.

3. The method of manufacturing a housing assembly of claim 1, wherein the second section is molded by compression molding at a temperature in the range of T _ms To T _me +20 ℃ wherein, T _ms Is the initial melting temperature, T, of the thermoplastic resin _me Is the final melting temperature of the thermoplastic resin; the second section is shaped at a pressure in the range of 20Mpa to 50Mpa.

4. The method of making a housing assembly of any of claims 1-3, wherein the segmented forming further comprises a third segment forming, the third segment forming being a compression molding, the third segment forming comprising:

at a temperature T _me +30 ℃ to T _me Molding at 70 deg.C and 50-100 Mpa in air or oxygen atmosphere.

5. The method of manufacturing a housing assembly of claim 4, wherein the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, and polyetherketone.

6. The method of manufacturing a housing assembly according to claim 5, wherein when the thermoplastic resin is polyphenylene sulfide, the temperature of the first stage molding ranges from 120 ℃ to 160 ℃, and the temperature of the second stage molding ranges from 250 ℃ to 300 ℃; the temperature of the third section forming is in the range of 320-360 ℃.

7. The method of manufacturing a housing assembly according to any one of claims 1 to 3, wherein the weight ratio of the modified inorganic filler to the thermoplastic resin is 4:1 to 20.

8. The method of manufacturing a housing assembly of claim 7, wherein the thermoplastic resin is one or more of polyphenylene sulfide, polysulfone, polyethersulfone, polyetherketone, polycarbonate, and polyamide.

9. The method of making a housing assembly of claim 7, wherein the modified inorganic filler comprises modified Al ₂ O ₃ Modified TiO 2 ₂ Modified ZrO ₂ Modified Si ₃ N ₄ Modified SiO ₂ One or more of (a).

10. The method for producing a housing assembly according to any one of claims 1 to 3, 5, 6, 8 and 9, wherein before the mixing of the modified inorganic filler with the thermoplastic resin, the method further comprises: the surface modifying agent is adopted to carry out surface modification on the inorganic filler to obtain the modified inorganic filler, wherein the surface modifying agent is one or more of silane coupling agent, borate coupling agent and titanate coupling agent, and the addition amount of the surface modifying agent is 0.5-3% of the weight of the inorganic filler.

11. The method of manufacturing a housing assembly according to any one of claims 1 to 3, 5, 6, 8 and 9, wherein the housing assembly further comprises a protective layer disposed on a surface of the housing body, the method further comprising:

and forming the protective layer on the surface of the shell body.

12. A housing component, characterized in that it is produced by a method for producing a housing component according to any one of claims 1-11.

13. An electronic device, comprising:

a display component for displaying;

the housing assembly of claim 12, enclosing a receiving space with the display assembly;