CN113613444B

CN113613444B - Shell, preparation method thereof and electronic equipment

Info

Publication number: CN113613444B
Application number: CN202111074868.2A
Authority: CN
Inventors: 樊泽平; 蒋正南; 蒋亚斌; 董康
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2022-12-27
Anticipated expiration: 2041-09-14
Also published as: CN113613444A

Abstract

The application provides a shell, a preparation method thereof and electronic equipment. The embodiment of the application provides a casing, it includes: a housing body; the first base material layer is arranged on the surface of the shell body, the pencil hardness of the first base material layer is HB to F, the elongation at break of the first base material layer is greater than or equal to 70%, the first base material layer comprises hardened resin, and the hardened resin is resin modified by a cyclic rigid group; and the sclerosis layer, the sclerosis layer be formed in the surface of casing body is kept away from to first substrate layer, the sclerosis layer is kept away from the surface of casing body is including continuous plain noodles district and texture district, the pencil hardness in plain noodles district is more than 2H. The utility model provides a casing, it has higher hardness, has better toughness simultaneously, can reach better balance between hardness and toughness.

Description

Shell, preparation method thereof and electronic equipment

Technical Field

The application relates to the field of electronics, in particular to a shell, a preparation method of the shell and electronic equipment.

Background

The shell of the electronic device needs to play a role in protection, and the shell needs to have certain hardness and toughness, however, the existing shell is difficult to ensure enough hardness and has higher toughness or impact strength.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a housing, which has a high hardness and a good toughness, and can achieve a better balance between the hardness and the toughness.

The embodiment of the application provides a casing, it includes:

a housing body;

the first base material layer is arranged on the surface of the shell body, the pencil hardness of the first base material layer is HB-F, the elongation at break of the first base material layer is greater than or equal to 70%, the first base material layer comprises a hardening resin, and the hardening resin is a resin modified by a cyclic rigid group; and

the sclerosis layer, the sclerosis layer form in the surface of casing body is kept away from to first substrate layer, the sclerosis layer is kept away from the surface of casing body is including plain noodles district and the texture district that links to each other, the pencil hardness in plain noodles district is more than 2H.

In addition, the embodiment of the application also provides a preparation method of the shell, which comprises the following steps:

preparing a first substrate layer;

coating hardening liquid on the surface of the first base material layer to form a hardening glue layer;

transferring a texture structure on the surface of the hardened glue layer, and performing first photocuring to cure the hardened glue layer to form a semi-cured hardened layer;

injecting a shell body on the surface of the first base material layer far away from the semi-solidified hardened layer; and

it is right the semi-solid sclerosis layer carries out the second photocuring, so that the semi-solid sclerosis layer takes place to solidify and becomes the sclerosis layer, the surface of the casing body that the sclerosis layer was kept away from includes texture region, texture region includes texture structure.

In addition, an embodiment of the present application provides an electronic device, which includes:

a display component for displaying;

the shell is provided with an accommodating space and used for bearing the display assembly; and

and the circuit board assembly is arranged in the accommodating space, is electrically connected with the display assembly and is used for controlling the display assembly to display.

The casing of this application embodiment sets up first substrate layer between casing body and sclerosis layer, and first substrate layer includes the stiffened resin, through the selection to the stiffened resin for first substrate layer has HB to F's pencil hardness, and is greater than 70% elongation at break, thereby makes the pencil hardness in the plain noodles district on the sclerosis layer surface of casing that makes reach more than 2H, has improved the hardness of the casing that makes. In addition, because the elongation at break of first substrate layer is greater than 70%, consequently, after forming half solidification sclerosis layer on the surface of first substrate layer, can adopt injection moulding's mode, mould plastics the casing body to the surface that half solidification sclerosis layer was kept away from to first substrate layer, need not to bond through hot melt adhesive, ultraviolet curing glue etc. can not increase the thickness of casing, and during injection moulding, the difficult fracture in the surface that casing body was kept away from to half solidification sclerosis layer. In addition, when the shell of the 3D structure needs to be prepared, the bending angle of the shell formed by an injection molding mode can be larger than that of hot bending, the angle is steeper, and the phenomenon that the inner side of the shell is wrinkled due to extrusion during hot bending can be avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a housing according to an embodiment of the present application.

Fig. 2 isbase:Sub>A partial sectional view of the housing of the embodiment of the present application alongbase:Sub>A-base:Sub>A direction in fig. 1.

Fig. 3 isbase:Sub>A schematic sectional view ofbase:Sub>A housing according to another embodiment of the present application, taken along the directionbase:Sub>A-base:Sub>A in fig. 1.

Fig. 4 isbase:Sub>A partial sectional view ofbase:Sub>A housing of another embodiment of the present application alongbase:Sub>A-base:Sub>A in fig. 1.

Fig. 5 is a schematic flow chart of a method for manufacturing a housing according to an embodiment of the present application.

Fig. 6 is a schematic flow chart of a method of manufacturing a housing according to yet another embodiment of the present application.

Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 8 is a schematic diagram of a partially exploded structure of an electronic device according to an embodiment of the present application.

Fig. 9 is a circuit block diagram of an electronic device according to an embodiment of the present application.

Description of reference numerals:

100-housing 71-adhesive layer

101-accommodating space 73-second substrate layer

10-housing body 75-texture layer

11-bottom 77-optical coating

13-side 79-masking layer

20-identification part 400-electronic device

30-first substrate layer 410-display module

50-hardened layer 430-circuit board assembly

51-smooth area 431-processor

53-texture region 433-memory

70-decorative film

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

In order to provide the surface of the housing of the electronic device with good hardness and wear resistance, a hardened layer may be coated on the surface of the housing (such as common carbonate PC, polymethyl methacrylate PMMA, or polyethylene terephthalate PET). About 70% of the pencil hardness of the case surface is determined by the pencil hardness of the base material layer bearing the hardened layer, and about 30% is determined by the pencil hardness of the hardened layer. When adopting polymethyl methacrylate methyl ester PMMA as the substrate layer, the hardened layer on the surface of the prepared shell has higher hardness, but PMMA is more brittle and has poorer toughness, and the shell is easy to break when falling, and when the body layer of the shell body is injected on the PMMA layer, the PMMA is easy to break during injection molding. When ordinary PC (pencil hardness of ordinary carbonate is usually about 2B and generally less than HB) or PET is used as a base material layer, the toughness of ordinary PC and PET is better, the risk of breakage of the shell when falling can be better prevented, and when the shell body needs to be injected on the PC layer or the PET layer, the PC layer or the PET layer also has enough toughness to meet the requirement of injection molding during injection molding, but the hardness of the obtained shell is still lower.

Referring to fig. 1 and fig. 2, an embodiment of the present disclosure provides a housing 100, which includes a housing body 10, a first substrate layer 30, and a hardening layer 50. The first base material layer 30 is disposed on the surface of the housing body 10, the pencil hardness of the first base material layer 30 is HB to F, the elongation at break of the first base material layer 30 is greater than or equal to 70%, the first base material layer 30 includes a hardened resin, and the hardened resin is a resin modified by a cyclic rigid group. The sclerosis layer 50 is formed at the surface that casing body 10 was kept away from to first substrate layer 30, sclerosis layer 50 is kept away from casing body 10's surface is including plain noodles district 51 and the texture district 53 that link to each other, the pencil hardness of plain noodles district 51 is more than 2H. In other words, the case body 10, the first base material layer 30, and the cured layer 50 are stacked in this order.

The term "hardened layer 50" refers to a solid film layer formed by solidifying (e.g., photo-curing or thermal-curing) a liquid or molten substance, and has good hardness and wear resistance. The term "smooth surface zone 51" refers to a smooth, non-textured area of the hardened layer 50. The term "textured region 53" herein refers to a region of the hardened layer 50 having a texture.

The optical area 51 is connected to the texture area 53, and specifically includes: the smooth area 51 is connected with the texture area 53, and the smooth area 51 is arranged around the texture area 53; or the optical surface area 51 connects the textured area 53 and the textured area 53 is disposed around the optical surface area 51; or the light surface area 51 is connected with the texture area 53, and the light surface area 51 and the texture area 53 are arranged alternately.

Optionally, the texture area 53 has a texture, which may be, but is not limited to, one or more of dermatoglyph, firestain, holographic texture, grid texture, mosaic, rainbow texture, and the like, and the type of texture is not particularly limited in the present application.

The housing 100 of the present application may be applied to portable electronic devices such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, a smart band, a smart watch, an electronic reader, and a game machine. Alternatively, the housing 100 of the present application may be a front cover (display screen protection cover), a rear cover (battery cover), a middle frame, a decoration, and the like of an electronic device. The housing 100 of the embodiment of the present application may have a 2D structure, a 2.5D structure, a 3D structure, or the like.

Referring to fig. 3, optionally, the housing body 10 includes a bottom 11 and a side 13 connected to the bottom 11 in a bent manner. The bottom 11 and the side 13 enclose an accommodating space 101. Optionally, the bottom portion 11 and the side portion 13 are of a unitary structure. In one embodiment, the bottom 11 is a rear cover of the electronic device, and the side 13 is a middle frame of the electronic device.

The casing 100 of this application embodiment sets up first substrate layer 30 between casing body 10 and sclerosis layer 50, and first substrate layer 30 includes the stiffened resin, through the selection to the stiffened resin for first substrate layer 30 has HB to F's pencil hardness, and is greater than 70% elongation at break, thereby makes the pencil hardness of the plain noodles district 51 on the surface of the sclerosis layer 50 of casing 100 that makes reach more than 2H, has improved the hardness of casing 100 that makes. In addition, because the elongation at break of first substrate layer 30 is greater than 70%, consequently, after forming half solidification sclerosis layer (the rete before the sclerosis layer 50 completely cured) on the surface of first substrate layer 30, can adopt injection moulding's mode, mould plastics casing body 10 to the surface that half solidification sclerosis layer was kept away from to first substrate layer 30, need not to bond through hot melt adhesive, ultraviolet curing glue (UV glues) etc. can not increase casing 100's thickness, and during injection moulding, the difficult fracture in surface that casing body 10 was kept away from to half solidification sclerosis layer. In addition, when the 3D structure casing 100 needs to be prepared, the bending angle of the casing 100 formed by injection molding may be larger than that of hot bending (for example, the bottom 11 is bent at a larger angle than the side 13), the angle is steeper, and the wrinkling phenomenon caused by extrusion on the inner side of the casing 100 during hot bending can be avoided.

In some embodiments, the material of the housing body 10 may be, but is not limited to, one or more of polymethyl methacrylate, general polycarbonate, modified polycarbonate (or hardened polycarbonate), polyethylene terephthalate, and the like. Optionally, the housing body 10 is light-transmitting, and the light transmittance of the housing body 10 may be greater than or equal to 85%, and further, the light transmittance of the housing body 10 may be greater than or equal to 90%; specifically, the light transmittance of the case body 10 may be, but is not limited to, 85%, 88%, 90%, 93%, 95%, 97%, 98%, 99%, etc. When the case body 10 is applied to a front cover of an electronic device, the higher the transmittance of the case body 10 is, the better the transmittance is, and the better the display effect of the electronic device is.

Optionally, the thickness of the housing body 10 is 0.3mm to 1mm; specifically, the thickness of the case body 10 may be, but is not limited to, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, and the like. When the housing body 10 is too thin, the supporting and protecting functions cannot be well performed, the mechanical strength cannot well meet the requirements of the electronic device housing 100, and when the housing body 10 is too thick, the weight of the electronic device is increased, the hand feeling of the electronic device is affected, and the user experience is not good.

Alternatively, the elongation at break of the first substrate layer 30 may be, but is not limited to, 70%, 80%, 90%, 100%, 110%, 120%, 130%, 140%, 150%, etc. The greater the elongation at break of the first base material layer 30, the better the toughness of the first base material layer 30, and therefore, while ensuring the pencil hardness of the first base material layer 30, the greater the elongation at break of the first base material layer 30, the better.

In some embodiments, the hardening resin is a modified polycarbonate, and the cyclic rigid group is one or more of a cyclohexane group, a bisphenol C group; when the cyclic rigid group is a cyclohexane group, the cyclohexane group is grafted on the main chain of the polycarbonate molecular chain; in other words, the stiffening resin is a modified polycarbonate grafted with cyclohexane groups, such as the modified polycarbonate of the Saebick company, model DMX 1234. When the cyclic rigid group is a bisphenol C group, the hardening resin is a block copolymer of bisphenol C and polycarbonate, such as modified polycarbonate of type 1126Z from Dijiki Co. Adopt cyclic annular rigidity group to modify polycarbonate, can make the stiffened resin have better pencil hardness, and simultaneously, adopt the modified polycarbonate of cyclic annular rigidity group, can be so that first substrate layer 30 when having higher pencil hardness, great elongation at break has, when needs keep away from the casing body 10 of moulding plastics on hardened layer 50 surface at first substrate layer 30, first substrate layer 30 and hardened layer 50 have higher hardness and toughness, can not produce the fracture when moulding plastics casing body 10.

In a specific embodiment, the hardening resin may be the following modified polycarbonate: di Nikko, model 1126Z; mitsubishi Engineering-Plastics Corp, model KH3410; sabbick company, model DMX1234 and model 1414T; the type of the synthetic new materials is B2-6.

Alternatively, the thickness of the first substrate layer 30 is 0.1mm to 0.13mm, and specifically, may be, but is not limited to, 0.1mm, 0.11mm, 0.12mm, 0.13mm, or the like. When the thickness of the first substrate layer 30 is too small (e.g., less than 0.1 mm), the pencil hardness of the first substrate layer 30 is low, and the hardened layer 50 lacks sufficient support, and when the thickness of the first substrate layer 30 is too large (e.g., greater than 0.13 mm), the thickness of the housing 100 may be increased, and the application to an electronic device is not conducive to ultra-thinning of the electronic device.

Optionally, when the first substrate layer 30 is made of modified polycarbonate, the material of the housing body 10 is one or more of ordinary polycarbonate or modified polycarbonate, so that the housing body 10 and the first substrate layer 30 have better bonding performance, and the housing body 10 and the first substrate layer 30 are better prevented from cracking in the using process.

In some embodiments, the hardened layer 50 is formed by photo-curing a photo-curing hardening liquid twice. The hardened layer 50 (i.e., the photo-photo dual-curing hardening liquid) includes urethane acrylate with a first functionality, fluorine-modified urethane acrylate with a second functionality, urethane acrylate with a third functionality, nano-silica-modified acrylate, a first photoinitiator, a second photoinitiator, a solvent, and an auxiliary agent, and a decomposition wavelength of the first photoinitiator is greater than a decomposition wavelength of the second photoinitiator; wherein the first functionality is greater than the third functionality and the second functionality is greater than the third functionality. The utility model provides an including fluorine modified urethane acrylate in the two solidification hardening liquid of light-light, can increase the water contact angle on the hardened layer 50 that forms to improve the wearing resistance on hardened layer 50 surface, in addition, can also improve hardened layer 50's demoulding performance, make hardened layer 50 demold from the texture mould more easily. In addition, the photo-photo dual-curing hardening liquid further comprises nano silica modified acrylate, so that the wear resistance of the formed hardened layer 50 can be further improved. But the sclerosis layer 50 that the two solidification hardening liquid of light-light prepared of this application can surface through 0000# steel wire fine hair, 1Kg bear a weight of, make a round trip to rub and exceed 1500 times, can not scrape the flower yet to the texture that can make casing 100 surface is also difficult to be scraped the flower through long-time the use, has longer life-span. In addition, adopt two solidification hardening liquid preparation sclerosis layer 50, carry out first photocuring earlier and form half solidification sclerosis layer, carry out the casing body 10 of injection moulding preparation 3D structure again, carry out second photocuring at last again and form sclerosis layer 50, can prevent like this that injection moulding in-process, sclerosis layer 50 from taking place the fracture. The term "functionality" as used herein refers to average functionality unless otherwise specified.

Alternatively, the first functionality is 8 to 12 functional, and the urethane acrylate of the first functionality is an 8 to 12 functional urethane acrylate, for example comprising one or more of an 8 functional urethane acrylate, a 9 functional urethane acrylate, a 10 functional urethane acrylate, an 11 functional urethane acrylate, a 12 functional urethane acrylate, and the like. The second functionality is 5-to 8-functional, and the fluorine-modified urethane acrylate of the second functionality includes 5-to 8-functional urethane acrylate, such as one or more of 5-functional urethane acrylate, 6-functional urethane acrylate, and 7-functional urethane acrylate. The third functionality is 2 to 4 functional, and the urethane acrylate of the third functionality includes 2 to 4 functional urethane acrylates, for example, including one or more of 2 functional urethane acrylate, 3 functional urethane acrylate, and 4 functional urethane acrylate.

Optionally, the weight ratio of the sum of the weights of the first functionality polyurethane acrylate and the second functionality fluorine-modified polyurethane acrylate to the third functionality polyurethane acrylate ranges from 8:1 to 25; in particular, it may be, but is not limited to, 8: 1. 10: 1. 14, 1, 16: 1. 18: 1. 22, 1, 25. When the ratio is less than 8; when the ratio is more than 25.

Optionally, the weight ratio of the first functionality urethane acrylate to the second functionality fluoro-modified urethane acrylate is from 0.8 to 1.2; specifically, there may be, but not limited to, 0.8. When the content of the urethane acrylate of the first functionality is too low, the pencil hardness of the formed hardened layer 50 is too low, and when the content of the urethane acrylate of the first functionality is too high, the hardened layer 50 is easily cracked when the case body 10 is injection-molded.

Optionally, the first photoinitiator has a decomposition wavelength of 365nm to 400nm and the second photoinitiator has a decomposition wavelength of 300nm to 365nm.

Alternatively, the first photoinitiator may be one or more of Diphenyl- (2, 4, 6-Trimethylbenzoyl) Phosphine Oxide (Diphenyl (2, 4, 6-Trimethylbenzoyl) Phosphine Oxide, TPO), propylthioxanthone (ITX), benzophenone (Benzophenone, BP), photoinitiator 1700 (25 wt% of photoinitiator 819 and 75wt% of photoinitiator 1173), bis [2, 6-difluoro-3- (1H-pyrrolyl-1) phenyl ] titanocene (photoinitiator 784), photoinitiator 1800 (25% of photoinitiator 819 and 75% of photoinitiator 184), photoinitiator 4265 (50 TPO and 50% of photoinitiator 1173). Alternatively, the second photoinitiator may be one or more of hydroxycyclohexyl phenyl ketone (1-hydroxyethoxy phenyl ketone, photoinitiator 184), 2-Hydroxy-4- (2-hydroxyethoxy) -2-methylpropiophenone (2-Hydroxy-4' - (2-hydroxyethoxy) -2-methylpropiophenone, photoinitiator 2959), 2-Hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-methyl-1- (4-methylthiophenyl) -2-morpholinyl-1-propanone (photoinitiator 907), 2-Hydroxy-1- [4- [4- (2-Hydroxy-2-methylpropionyl) phenoxy ] phenyl ] -2-methylpropanone (photoinitiator 160).

In some embodiments, the weight ratio of the first photoinitiator to the second photoinitiator is from 1; specifically, there may be, but is not limited to, 1. When the content of the first photoinitiator is too high (the weight ratio of the first photoinitiator to the second photoinitiator is more than 1; when the content of the first photoinitiator is too low (the weight ratio of the first photoinitiator to the second photoinitiator is less than 1.

Optionally, the hardening liquid contains 0.45% to 0.55% by weight of the first photoinitiator, for example: 0.45%, 0.5%, 0.55%; the weight content of the second photoinitiator in the hardening liquid is 1.9% to 2.1%, for example: 1.9%, 2.0%, 2.1%.

Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, methyl ethyl ketone, methyl butyl ketone. The auxiliary agent comprises an antifoaming agent, a leveling agent and the like. The defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like.

In some embodiments, the photo-photo dual-curing hardening liquid includes (by weight): 20 to 25 percent of 9-functional polyurethane acrylate, 20 to 25 percent of 6-functional fluorine modified polyurethane acrylate, 2 to 5 percent of 2-functional polyurethane acrylic resin, 2 to 5 percent of nano silicon dioxide modified acrylate, 0.45 to 0.55 percent of TPO, 1.9 to 2.1 percent of photoinitiator 184, ethyl acetate and auxiliary agents.

Optionally, the thickness of the hardened layer 50 is 7 μm to 15 μm; specifically, it may be, but not limited to, 7 μm, 8 μm, 10 μm, 12 μm, 14 μm, 15 μm, or the like. The thickness of the hardened layer 50 is too thin (less than 7 mu m), so that the impression of the surface texture of the hardened layer 50 is influenced, and when the star diamond texture needs to be prepared, the texture is not completely formed, and the hand feeling is relatively astringent; if the thickness of the hardened layer 50 is too thick (greater than 15 μm), the toughness is too poor, and when the case body 10 is formed by injection molding, the hardened layer 50 may be microcracked and have a disassembly crack.

Referring to fig. 4, in some embodiments, the housing 100 of the embodiment of the present application further includes a decoration film 70, the decoration film 70 is disposed on a side of the housing body 10 away from the hardened layer 50, and the decoration film 70 is used for enabling a side of the housing body 10 close to the hardened layer 50 to observe a colorful texture effect.

In some embodiments, the housing 100 further includes a mark 20, and the mark 20 is disposed on the surface of the housing body 10 away from the hardened layer 50. When the housing body 10 needs to be adhered with the decoration film 70, the mark part 20 is printed on the surface of the housing body 10 by silk screen printing, and the decoration film 70 is adhered to the surface of the housing body 10 provided with the mark part 20 through the adhesive layer 71. Alternatively, the identification part 20 may be logo, pattern, trademark, etc., and the identification part 20 may be one or more of mirror silver, mirror gold, red, orange, yellow, green, blue, cyan, violet, gray, etc. In some embodiments, the mark portion 20 is disposed on the surface of the housing body 10 away from the hardened layer 50, and is disposed corresponding to the smooth area 51 of the hardened layer 50. This makes it possible to make the visual effect of the indicator 20 seen from the side of the housing 100 close to the hardened layer 50 better.

Referring to fig. 4 again, in some embodiments, the decorative film 70 includes an adhesive layer 71, a second substrate layer 73, a texture layer 75, an optical coating layer 77, and a shielding layer 79, which are sequentially stacked, and the adhesive layer 71 is closer to the housing body 10 than the shielding layer 79.

Alternatively, the adhesive layer 71 may be, but is not limited to, one or more of an optical adhesive layer (OCA adhesive), a hot melt adhesive, a UV adhesive, and the like, which have light transmittance.

Alternatively, the second substrate layer 73 may be, but is not limited to, one or more of polymethyl methacrylate, polycarbonate, polyethylene terephthalate, and the like. In a specific embodiment, the second substrate layer 73 is polyethylene terephthalate. The thickness of the second substrate layer 73 is 0.08mm to 0.15mm; specifically, it may be, but is not limited to, 0.08mm, 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc. When the thickness of the second substrate layer 73 is too small (smaller than 0.08 mm), the mechanical strength is not sufficient, which increases the difficulty in forming the texture layer 75, and when the thickness of the first substrate layer 30 is too large (larger than 0.15 mm), the thickness of the manufactured housing 100 is too thick, which is not favorable for the ultra-thinning of the electronic device using the housing 100.

Optionally, the texture layer 75 is a light-cured texture, such as a UV light-cured texture layer (UV texture layer). Optionally, the texture layer 75 is photo-cured (e.g., curing energy of 800 mj/cm) after being transferred by photo-curing glue (e.g., UV glue) ² To 1000mj/cm ² ) A photo-cured texture layer 75 is formed, for example, by photo-curing after transferring UV glue on the surface of the housing body 10. Optionally, the photo-curing glue comprises a polyurethane acrylate oligomer, a photoinitiator, a solvent and an auxiliary agent. In some embodiments, the photocurable glue may also include an acrylate monomer. Alternatively, the photoinitiator may be, but is not limited to, one or more of 1-hydroxycyclohexyl phenyl ketone (1-hydroxycyclohexyl phenyl ketone, photoinitiator 184), diphenyl- (2, 4, 6-Trimethylbenzoyl) oxyphosphate (Diphenyl (2, 4, 6-Trimethylbenzoyl) phenane Oxide, TPO), benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthianthrone (DETX), 2-hydroxy-2-methyl-1-phenyl acetone (photoinitiator 1173), photoinitiator 1000 (20 wt% of 1-hydroxycyclohexyl phenyl ketone and 80wt% of 2-methyl-2-hydroxy-1-phenyl-1-acetone), photoinitiator 1300 (30 wt% of photoinitiator 369 and 70wt% of photoinitiator 651 (dimethylbenzyl ketal, DMPA)), photoinitiator 1700 (25 wt% of photoinitiator BAPO (aka. Photoinitiator 819 and 75wt% of photoinitiator 1173), photoinitiator 1173 wt% of photoinitiator and 50wt% of photoinitiator 1173). Alternatively, the solvent may be, but is not limited to, one or more of n-butanol, ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropyl alcohol, methyl ethyl ketone, and the like. The auxiliary agent comprises an antifoaming agent, a leveling agent and the like. The defoaming agent can be one or more of organic silicon defoaming agent, polyether defoaming agent and the like, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like. The thickness of the texture layer 75 is 10 μm to 20 μm, and specifically, may be, but is not limited to, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 17 μm, 9 μm, 18 μm, 19 μm, 20 μm, and the like. When the thickness of the texture layer 75 is too thin, it is disadvantageous to the texture structure on the texture layer 75When the thickness of the texture layer 75 is too thick, the thickness of the housing 100 is increased, and when the electronic device is applied, the thickness and the weight of the electronic device are increased, which affects the hand feeling of the electronic device and is not beneficial to ultra-thinning of the electronic device.

Optionally, the optical coating layer 77 comprises In, sn, tiO ₂ 、Ti ₃ O ₅ 、NbO ₂ 、Nb ₂ O ₃ 、Nb ₂ O ₂ 、Nb ₂ O ₅ 、SiO ₂ 、ZrO ₂ Or other non-conductive oxide, and the like. Alternatively, the total thickness of the optical coating layer 77 may be, but is not limited to, 10nm to 1000nm; specifically, it may be, but not limited to, 10nm, 50nm, 100nm, 200nm, 300nm, 400nm, 600nm, 800nm, 1000nm, etc. Alternatively, the number of the optical coating layers 77 may be one or more layers. In one embodiment, the number of the optical coating layers 77 may be 3 to 15, and specifically, may be, but not limited to, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, and the like. Alternatively, each of the optical coating layers 77 may have a thickness of 3nm to 140nm, and specifically, may be, but not limited to, 3nm, 5nm, 8nm, 10nm, 15nm, 20nm, 25nm, 30nm, 35nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 120nm, 130nm, 140nm, and the like. Alternatively, the optical coating layer 77 may be formed using one or more of an evaporation coating process, a sputtering coating process, an Atomic Layer Deposition (ALD) technique, and the like.

Alternatively, the shielding layer 79 may be, but is not limited to, a light-shielding ink having an absorbing or reflecting effect on light. Alternatively, the shielding layer 79 may be black, white, or gray. The shielding layer 79 is used to prevent the hardened layer 50 side of the housing 100 from viewing the internal components of the electronic device when the housing 100 is applied to the electronic device. Alternatively, the thickness of the shielding layer 79 is 5 μm to 50 μm, and specifically, the thickness of the shielding layer 79 may be, but is not limited to, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, or the like. Alternatively, the shielding layer 79 may be a single layer or a plurality of layers, such as 2, 3, 4, or 5 layers stacked. When the shielding layer 79 is a plurality of layers, it has a better shielding effect than one layer. Alternatively, each shielding layer 79 may have a thickness of 8 μm to 12 μm, and specifically, may be, but not limited to, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, or the like. Each of the shielding layers 79 may be formed by: and coating the shading ink on the surface of the optical coating layer 77 far away from the hardened layer 50, and baking at 70-80 ℃ for 30-60 min to form a shielding layer 79.

The case 100 of the embodiment of the present application may be manufactured by the following manufacturing method of the case 100, and in addition, may be manufactured by other manufacturing methods in the related art, and the present application is not particularly limited.

In the manufacturing process of the electronic device housing 100, when it is required to manufacture the outer surface of the 3D structure having a texture structure, the texture structure is usually formed on the surface of the housing body 10, and then the housing 100 having a 3D structure and a texture effect is obtained by performing hot bending. When a texture structure of a matte consubstantial body needs to be prepared, namely, a part of no area has a texture structure (matte surface), a part of area has no texture structure (smooth surface), and a smooth surface is usually located at a specific position of the matte surface, and when hot bending molding is performed, alignment needs to be performed, so that when the shell 100 with the 3D structure is prepared, the smooth surface is at a preset position, however, when the texture structure is formed first and then hot bending molding is performed, the minimum value of corresponding deviation which can be realized by related technologies is 0.8mm, namely, the alignment deviation is usually more than +/-0.8 mm, so that the position of the smooth surface of the prepared shell 100 has a deviation more than +/-0.8 mm, and when silk printing such as pattern and logo is performed on the smooth surface, the deviation is large due to inaccurate alignment, and the appearance visual effect of the prepared shell 100 is affected. In addition, when the 3D housing 100 manufactured by the hot bending molding needs to be manufactured with a non-uniform thickness (for example, the camera is thicker than other positions), the manufacturing process is complicated, and when the hot bending arc is smaller, it is difficult to manufacture the non-uniform thickness housing 100. Furthermore, when the housing 100 is formed by hot bending, wrinkles are easily formed on the inner side of the housing by extrusion, and a CNC process is required to remove the wrinkles, thereby increasing a post-treatment process. In addition, the textured film may be formed first and then bonded to the housing body 10 by using a hot melt adhesive or a UV adhesive. When the texture membrane is attached, special hydraulic equipment is needed, auxiliary materials are more, the cost is high, the shell 100 made by CNC is attached firstly, and the risk of layering between the texture membrane and the shell 100 is high; the scheme of CNC (computer numerical control) and laminating is adopted, so that the positioning deviation between the texture membrane and the shell 100 is large, the yield is low, and the feasibility is poor; a layer of adhesive is added, and the thickness of the shell 100 is thicker.

Referring to fig. 5, an embodiment of the present application further provides a method for manufacturing the housing 100, which includes:

s201, preparing a first base material layer 30;

optionally, the hardened resin granules are directly sealed and vacuum-sucked into a drying cylinder for production, the whole process is not in contact with the outside, and the product appearance defects caused by external factors are avoided to the maximum extent. Then dehumidifying and drying for more than 4 hours at 120 ℃ to ensure thorough drying; the hardened resin pellets are then melted and extruded to form the first substrate layer 30.

Optionally, the stiffening resin is a resin modified with cyclic rigid groups. In some embodiments, the hardening resin is a modified polycarbonate, and the cyclic rigid group is one or more of a cyclohexane group, a bisphenol C group; when the cyclic rigid group is a cyclohexane group, the cyclohexane group is grafted on the main chain of the polycarbonate molecular chain; in other words, the hardening resin is a modified polycarbonate to which cyclohexane groups are grafted. When the cyclic rigid group is a bisphenol C group, the hardening resin is a block copolymer of poly bisphenol C and polycarbonate. Adopt cyclic annular rigid group to modify polycarbonate, can make the stiffened resin have better pencil hardness, simultaneously, adopt the modified polycarbonate of cyclic annular rigid group, can be so that first substrate layer 30 has higher pencil hardness in, great elongation at break, follow-up when first substrate layer 30 keeps away from hardened layer 50 surface injection moulding casing body 10, first substrate layer 30 and hardened layer 50 have higher hardness and toughness, can not produce the fracture when injection moulding casing body 10. Alternatively, the pencil hardness of the first base material layer 30 is HB to F, and the elongation at break of the first base material layer 30 is greater than or equal to 70%, and specifically, may be, but not limited to, 70%, 80%, 90%, 100%, 110%, 120%, 130%, 140%, 150%, and the like. The greater the elongation at break of the first base material layer 30, the better the toughness of the first base material layer 30, and therefore, while ensuring the pencil hardness of the first base material layer 30, the greater the elongation at break of the first base material layer 30, the better.

S202, coating hardening liquid on the surface of the first base material layer 30 to form a hardening glue layer;

optionally, roll-to-roll coating is adopted, a coating roll is rotated to drive the photo-photo dual-curing hardening liquid in the tank, the transfer amount of the photo-photo dual-curing hardening liquid is adjusted by adjusting a coating gap and a sizing amount, the photo-photo dual-curing hardening liquid is transferred onto the first substrate layer 30 by utilizing the relative rotation of the coating roll and the back roll, the baking channel is used for heating and baking to enable the photo-photo dual-curing hardening liquid to fully wet the first substrate layer 30 and enable a solvent in the photo-dual-curing hardening liquid to volatilize, so that the film forming substance is attached to the first substrate layer 30 to form a hardened glue layer. The roll-to-roll coating may be a method of applying a thin hardening liquid to a film substrate with a certain thickness by a roll-to-roll coater from a roll of the film substrate. In the related art, the hardening liquid is coated by a curtain coating method, and in order to prevent the hardening liquid from running to the other side of the housing body 10, a certain width (which needs to be removed later) needs to be reserved at the edge of the housing body 10, so that more raw materials need to be consumed for preparing the housing body 10, the hardening liquid directly flows down on the housing body 10, and the surplus part is recovered, so that a part of waste is generated, and more hardening liquid needs to be consumed. And this application adopts the mode of roll-to-roll coating, and the sclerosis liquid is extravagant less, can promote the utilization ratio of sclerosis liquid. In addition, when the shell body 10 is formed by subsequent injection molding, the edge reserved part of the shell body 10 is smaller, so that raw materials of the shell body 10 can be better saved.

In one embodiment, the photo-photo curing hardening liquid can be a UV coating liquid with a model number of JS-10N-53 of Huiyang Jucheng chemical coating Co., ltd, huizhou city. Before coating, a diluent (such as a diluent of Huiyang Sanchen chemical coating Co., ltd., model number T-723) is used for photo-photo dual-curing and hardeningDiluting the solution, wherein the total amount ratio of the UV coating solution to the diluent is 1; the specific gravity is 0.93 to 0.95g/cm ³ . In one embodiment, the glue amount in roll-to-roll coating is 13.6 (the thickness of the hardened glue layer can be controlled by the glue amount); the coating line speed is 4 m/min to 6 m/min.

Optionally, the baking temperature is 70 ℃ to 85 ℃; specifically, the temperature may be, but not limited to, 55 ℃, 60 ℃, 65 ℃, 70 ℃, 75 ℃, 80 ℃ or the like. Baking for 3-30 min; specifically, it may be, but not limited to, 3min, 5min, 10min, 15min, 20min, 25min, 30min, etc. If the baking temperature is too low, the solvent is not completely volatilized, poor appearance such as whitish and fogged appearance is generated after photocuring is carried out, and the adhesion of the formed hardened layer 50 on the first base material layer 30 is influenced; the baking temperature is too high, the first base material layer 30 deforms greatly, operation and construction are not facilitated, and the yield is reduced.

For a detailed description of the photo-photo curing hardening liquid, please refer to the above embodiments, which are not repeated herein.

S203, transferring a texture structure on the surface of the hardened glue layer, and performing first photocuring to cure the hardened glue layer to form a semi-cured hardened layer;

optionally, the texture structure is transferred on the surface of the hardened glue layer far away from the first substrate layer 30 by a roll-to-roll transfer method, and the wavelength is 365nm to 400nm (for example 395 nm), and the curing energy is 900mj/cm ² To 1100mj/cm ² The light source (for example, an LED lamp) of (1) carry out the first photocuring to the hardening glue layer, make the hardening glue layer forms the semi-solid hardened layer, and make the semi-solid hardened layer keep away from the surface transfer of first substrate layer 30 has texture structure. When the first photo-curing is carried out, the first photoinitiator is decomposed into free radicals or cations and the like under the irradiation of light with the wavelength of 365nm to 400nm, and the free radicals or cations and the like initiate partial polymerization reaction of the first functionality polyurethane acrylate, the second functionality fluorine-modified polyurethane acrylate and the third functionality polyurethane acrylate, so that the macromolecular polymer is formed. "roll-to-roll transfer" may be the copying of the texture to be transferred to a nickel plate by an electroforming systemWelding the nickel plate to a metal roller of a transfer machine; in operation, the hardened glue layer is rubbed to form texture by a metal roller with texture.

Optionally, the transfer machine comprises a first roller (not shown) and a second roller (not shown). First roller includes the roller and sets up in the texture mould of roller periphery, first roller is metal rod (for example steel roller), and support texture mould that like this can be better prevents that first roller from taking place to warp at the rendition texture in-process. The second roller is a rubber roller, the Shore hardness of the rubber roller is 85 degrees, the rubber roller hardness is too low, and the air bubbles in the texture area 53 are enlarged, so that the appearance of the prepared shell 100 is influenced; the hardness of the rubber roller is too high, and air bubbles are easily formed in the smooth surface area 51 and show poor appearance;

alternatively, the curing energy may be, but is not limited to, 900mj/cm ² 、950mj/cm ² 、1000mj/cm ² 、1050mj/cm ² 、1100mj/cm ² And so on. Solidification energy is too low, be difficult to the drawing of patterns, semi-solid sclerosis layer has the part to remain and forms appearance defect on the texture board, can't continue to produce, in addition, the cross-linking density of the semi-solid sclerosis layer of formation is not enough, when carrying out casing body 10 injection moulding, texture structure on the semi-solid sclerosis layer takes place to melt easily, warp, be unfavorable for texture structure's formation, solidification energy is too high, the cross-linking density of the semi-solid sclerosis layer of formation is too high, when carrying out injection moulding, semi-solid sclerosis layer ftractures easily.

Alternatively, the pressure of the transfer is 2kgf (kilogram force) to 3kgf; specifically, it may be, but not limited to, 2kgf, 2.5kgf, 3kgf, etc. If the transfer printing pressure is too small, the texture impression is not clear; if the pressure of the transfer is too large, bubbles are likely to be accumulated at the dummy interface.

Optionally, the semi-cured hardened layer has a double bond conversion rate of 20% to 55%; specifically, it may be, but is not limited to, 20%, 30%, 40%, 50%, 55%, etc. The conversion rate of double bonds is too low in the semi-solid hardened layer, then the crosslink density on semi-solid hardened layer is not enough, when carrying out injection moulding, the semi-solid hardened layer drops from first substrate layer 30 easily, the conversion rate of double bonds is too high in the semi-solid hardened layer, then the crosslink density on semi-solid hardened layer is too high, when carrying out injection moulding, semi-solid hardened layer ftractures easily. The term "double bond conversion" as used herein refers to the conversion of functional groups involved in the reaction in the hardening fluid. The conversion rate of double bonds in the application adopts an infrared spectrum internal standard method to test the conversion rate of double bonds (functional groups).

Alternatively, when it is required to obtain the same effect of the smooth surface area 51 and the texture area 53 on the hardened layer 50, the texture mold may be set as a smooth surface at a position corresponding to the smooth surface area 51, and set as a dummy surface at a position corresponding to the texture area 53, so that the smooth surface and the dummy surface realize different reflection effects, thereby realizing the same body of the smooth surface and the dummy surface (on the same hardened layer 5030).

When the texture structure is prepared on the surface of the hardened layer 50, the texture can be processed on the steel die by adopting laser, and then the texture on the steel film is transferred to the plastic layer by adopting an injection molding mode. In the injection molding process, the plastic usually contains inorganic particles such as glass fibers, color master batches, flame retardants and the like, so that the fluidity of a plastic melt is influenced, and in addition, part of the inorganic particles are large, for example, some glass fibers with particle sizes of dozens of micrometers are difficult to enter texture gaps smaller than 10 micrometers, so that the injection molding mode is difficult to obtain fine textures with the texture sizes smaller than 10 micrometers. In addition, even if the plastic melt does not contain inorganic particles, in order to obtain a fine texture structure, the equipment is required to have the functions of rapid heating and rapid cooling, the mold is rapidly heated before injection molding, and is rapidly cooled after injection molding, otherwise, after injection molding, if the temperature is still high, the high molecular chain segment in the plastic melt still moves, the fine texture structure is difficult to maintain, the injection molding condition is more strict, and the preparation cost is greatly increased. Furthermore, in order to make the injection-molded housing 100 have better wear resistance, a hardened layer 50 is usually coated on the texture by spraying, which further reduces the fineness of the texture, and the hardened liquid used for forming the hardened layer 50 reacts with the plastic layer to corrode the plastic layer, so that the manufactured housing 100 has reduced buffering performance, increased brittleness and cracking risk in the testing and using processes.

The shell 100 of the embodiment of the application carries out texture imprinting on the hardened glue layer, and then carries out first photocuring to form a semi-cured hardened layer. The method can be used for preparing a fine texture structure (the fineness can reach 0.2 micron, and hardening liquid can enter the fine texture structure), and the preparation process is simple and the preparation cost is low. In addition, the conversion rate of double bonds of the first light curing is controlled to be 20-55%, and cracking of the semi-cured hardened layer in the subsequent injection molding process can be well prevented. Furthermore, the hardened glue layer is formed on the first substrate layer 30, rather than being directly formed on the housing body 10, so that the hardened liquid can be prevented from reacting with the housing body 10 to corrode the housing body 10, and the obtained housing body 10 has better toughness and buffering performance.

In some embodiments, after the texture structure is transferred to the surface of the hardened glue layer and the first photo-curing is performed to cure the hardened glue layer to form a semi-cured hardened layer, the method further includes: and punching the membrane prepared in the step S203, wherein the membrane comprises a first substrate layer 30 and a semi-cured hardened layer which are stacked.

Optionally, the shape of the membrane is punched by laser etching or a stamping die, and the die adopts a side fan-shaped gate; after punching or radium cutting is finished, removing burrs or dust at the edge of the membrane by ultrasonic cleaning, and preventing the burrs or dust from falling and adhering to the surface of the membrane to form bad appearance of a fixed point; and after cleaning, coating a protective film or completely wrapping a tensile film for dust prevention and transferring to an injection molding workshop. Optionally, a positioning hole is formed in the membrane.

Optionally, when punching the film, the size of the film is 1mm to 5mm wider than the size of the shell 100 to be prepared; specifically, it may be, but is not limited to, 1mm, 2mm, 3mm, 4mm, 5mm, etc. In other words, the outer periphery of the diaphragm is 1mm to 5mm wider than the outer periphery of the housing 100. The punched membrane is too large and is easy to form wrinkles at corners, and the punched membrane is too small, so that when the injection molding is carried out to prepare the shell body 10, the melt adhesive forming the shell body 10 is easy to run to the semi-curing hardened layer side of the membrane (namely, the glue is easy to turn over).

In some embodiments, after the texture structure is transferred to the surface of the hardened glue layer and the first photo-curing is performed to cure the hardened glue layer to form a semi-cured hardened layer, before the injection molding of the housing body 10 on the surface of the first substrate layer 30 away from the semi-cured hardened layer, the method further includes: the semi-solidified hardened layer is far away from the surface of the first base material layer 30 is provided with a protective film so as to protect the texture structure on the surface of the semi-solidified hardened layer.

Alternatively, the protective film may be, but not limited to, a film layer made of Polyimide (PI) or the like, which is resistant to high temperature and has a certain adhesion.

S204, injection molding the shell body 10 on the surface, far away from the semi-solidified hardened layer, of the first base material layer 30; and

optionally, drying the plastic particles with a dehumidifying or hot air dryer at a drying temperature of 100 ℃ to 120 ℃ for 4h to 6h to ensure that the water content in the plastic particles is not more than 0.05%. An injection molding machine (for example, a transparent injection molding special compressor table with the tonnage of 180T, which has a compression mold) is adopted to perform injection molding to form the housing body 10 on the surface of the first substrate layer 30 away from the semi-cured hardened layer. The compression mould includes front mould and back mould, and during the time of moulding plastics, the surface that first substrate layer 30 was kept away from to the semi-solid stiffening layer is close to the front mould and sets up. Optionally, the housing body 10 is of a 3D structure, the injection mold is provided with a positioning pin, the positioning pin is matched with the positioning hole during injection molding to position the diaphragm, and when the housing body 10 is formed by injection molding, the position deviation between the light surface area 51 and the texture area 53 on the semi-cured hardened layer can be controlled within ± 0.3 mm.

Optionally, the temperature of the front mold is 65 ℃ to 75 ℃ during injection molding; the temperature of the rear mold is 75 ℃ to 85 ℃. The reason for setting the front mold temperature is to solve the problem of orange peel in the smooth surface area 51 of the product after injection molding, and when the front mold temperature is higher than 80 ℃, the orange peel in the smooth surface area 51 is more obvious.

The temperature of the injection molding material is 340-350 ℃. The injection pressure is 2000mpa to 2500mpa; the shooting speed is 650cm ³ S; the injection molding cycle was 42s, and the dwell pressure after injection molding was 10kgf/c.

S205, it is right the semi-solid sclerosis layer carries out the second photocuring, so that the semi-solid sclerosis layer takes place the solidification to become sclerosis layer 50, the surface of casing body 10 that sclerosis layer 50 kept away from includes texture region 53, texture region 53 includes texture structure.

Alternatively, the curing energy is 1200mj/cm at a wavelength of 300nm to 365nm ² To 1600mj/cm ² The curing light intensity is 80mw/cm ² To 220mw/cm ² The semi-cured hardened layer is subjected to second photo-curing by a light source (e.g., a mercury lamp) so that the semi-cured hardened layer forms a hardened layer 50. During the second photo-curing, the second photoinitiator is decomposed into free radicals or cations under the irradiation of light with the wavelength of 300nm to 365nm, and the free radicals or cations initiate the polymerization reaction of the remaining polyurethane acrylate with the first functionality, the fluorine-modified polyurethane acrylate with the second functionality and the polyurethane acrylate with the third functionality, so that the macromolecular polymer is formed.

Alternatively, the curing energy may be, but is not limited to, 1200mj/cm ² 、1300mj/cm ² 、1400mj/cm ² 、1500mj/cm ² 、1600mj/cm ² And the like. The curing energy is too low, the crosslinking density is insufficient, the abrasion resistance of the prepared hardened layer 50 is poor, and the adhesion of the hardened layer 50 on the first base material layer 30 is insufficient; the curing energy is too high, and the first substrate layer 30 or the case body 10 is easily deformed by heat.

Optionally, the double bond conversion of the hardened layer 50 is 70% to 80%; specifically, it may be, but is not limited to, 70%, 72%, 75%, 78%, 80%, etc. When the conversion rate of the double bonds in the hardened layer 50 is too low, the hardness of the resulting shell 100 is low and the wear resistance is poor. The conversion rate of the double bonds in the hardened layer 50 refers to the conversion rate of the functional groups participating in the reaction in the hardened glue layer in the two-time photo-curing process.

Optionally, the method for preparing the shell 100 of the present application further comprises: the shell 100 is subjected to CNC machining (including computer numerical control precision machining, CNC machining lathe, CNC machining milling machine, CNC machining boring and milling machine and the like), redundant leftover materials are milled, and the shell 100 with the final required assembly matching size is obtained. In some embodiments, the parameters of the CNC machining are: rotating speed: 50000 +/-5000 r/min, rough milling feed: 3000 +/-1000/min, finish milling and feeding: 3000 +/-1000/min, tool life: a combined knife 2000pcs and a chamfering knife 6000pcs.

For the parts of this embodiment that are not described in detail and are the same as the parts of the embodiment, please refer to the description of the embodiment, and further description is omitted here.

Optionally, the surface of the hardened layer 50 away from the shell body 10 further includes a light surface area 51, the light surface area 51 is connected to the texture area 53, and the shell 100 is a 3D structure. Optionally, the hardened layer 50 includes urethane acrylate of a first functionality, fluorine-modified urethane acrylate of a second functionality, urethane acrylate of a third functionality, and nano silica-modified acrylate; wherein the first functionality is greater than the third functionality and the second functionality is greater than the third functionality. For a detailed description of the hardened layer 50, please refer to the detailed description of the corresponding parts of the above embodiments, which will not be repeated herein.

For a detailed description of the same features of this embodiment as those of the above embodiment, please refer to the above embodiment, which is not repeated herein.

In the preparation method of the housing 100 according to the embodiment of the application, the semi-cured hardened layer is prepared on the first substrate layer 30, and then the housing body 10 is injection molded on the surface of the first substrate layer 30 far away from the semi-cured hardened layer by using an injection molding method, when a 3D structure needs to be prepared and the surface of the hardened layer 50 is provided with the housing 100 with the smooth surface area 51 (smooth surface) and the texture area 53 (matte surface), the alignment of the smooth surface area 51 and the texture area 53 on the housing 100 prepared by using the preparation method according to the embodiment of the application is more accurate, the position deviation of the smooth surface area 51 and the texture area 53 can be controlled within ± 0.3mm, compared with the 3D housing 100 prepared by using the hot bending molding process, the alignment is more accurate, the position deviation is smaller, and the appearance visual effect of the prepared housing 100 is better. In addition, when the shell 100 with different thicknesses needs to be prepared, the process is simpler and more convenient by adopting injection molding compared with hot bending. Furthermore, in the case 100 manufactured by injection molding, the surface of the case body 10 away from the hardened layer 50 is not prone to wrinkle, and CNC machining is not required to be performed on the bent portion, thereby simplifying the post-processing process.

Referring to fig. 6, an embodiment of the present application further provides a method for manufacturing the housing 100, which includes:

s301, preparing a first substrate layer 30;

s302, coating a hardening liquid on the surface of the first substrate layer 30 to form a hardened glue layer;

s303, transferring a texture structure on the surface of the hardened glue layer, and performing first photocuring to cure the hardened glue layer to form a semi-cured hardened layer;

s304, arranging a protective film on the surface of the semi-solidified hardened layer, which is far away from the first base material layer 30;

s305, injection molding the shell body 10 on the surface, far away from the semi-solidified hardened layer, of the first base material layer 30;

s306, performing second photocuring on the semi-solidified hardened layer to solidify the semi-solidified hardened layer to form a hardened layer 50, wherein the surface, far away from the hardened layer 50, of the shell body 10 comprises a texture area 53, and the texture area 53 comprises the texture structure;

for detailed descriptions of step S301 to step S306, please refer to the corresponding parts of the above embodiments, which are not repeated herein.

S307, preparing an identification part 20 on the surface of the shell body 10 far away from the hardened layer 50;

optionally, printing ink (e.g., mirror-surface silver ink) is silk-screened on the surface of the housing body 10 away from the hardened layer 50 to form the identification portion 20, wherein the identification portion 20 is disposed corresponding to the smooth surface area 51 of the hardened layer 50. Specifically, a screen (380 meshes, screen tension is 6N, and screen angle is 22.5 °) is disposed on one side of the housing body 10 away from the hardened layer 50, the distance between the screen and the housing body 10 is 3mm to 5mm, ink is applied to the surface of the screen by a doctor blade, the screen is left standing for 60min to 90min, and then the screen is baked at 60 ℃ for 60min, so as to form the mark portion 20 on the surface of the housing body 10. Wherein the Shore hardness of the scraper is 75-80 degrees, the angle of the scraper is 32-38 degrees, the scraper speed is 180mm/s, and the air pressure is 4.7-5.3 Bar when the ink is scraped.

In one embodiment, the operation steps for preparing the label 20 are as follows: before production, making a first piece of the color and the position, checking whether the jig and the screen are clamped firmly, and starting to put into production after OK; the printing surface of the product needs to be ensured to have no grease and dust marks, and the grease or residual dust impurities on the surface of the product need to be removed by using a solvent (or blowing by a wind gun) for the product with grease or dust; 1, placing 1 product on a jig, lightly taking and placing the product when positioning, and enabling each product to lean in place so as to avoid influencing the printing position precision; taking out the printed products from the jig, putting the printed products on a specified tray in order, and replacing the products with the products to be printed; in the checking process, the sample plate and the first piece are referred, and the defect is found and fed back in time; good products and defective products are distinguished and marked clearly, and the quality of each product is ensured; standing for 60-90 min after the mirror silver is printed, and baking in an oven (baking according to baking conditions) after the mirror silver effect appears; the operator wears the electrostatic clothes and the electrostatic gloves.

And S308, forming a decorative film 70 on the surface of the shell body 10 far away from the hardened layer 50.

Optionally, the decorative film 70 is bonded to the surface of the housing body 10 away from the hardened layer 50, and defoaming is performed in a defoaming machine to avoid bubbles from affecting the bonding performance of the decorative film 70 and the appearance of the manufactured housing 100, wherein the second substrate layer 73 is closer to the housing body 10 than the shielding layer 79. Alternatively, the decorative film 70 may be a commercially available decorative film 70, or may be a self-made decorative film 70, and the present application is not particularly limited. When removing bubbles, the temperature of removing bubbles is 45 ℃ to 55 ℃, the pressure is 1.6MPa to 1.8MPa, and the time is 30min to 60min.

The housing 100 of the present application is further described below with reference to specific embodiments.

Example 1 and comparative example 1

Example 1 and comparative example 1 were prepared by the following procedure:

1) Preparing a first substrate layer 30: example 1 and comparative example 3 a first substrate layer 30 was prepared using hardened PC pellets of teijin 1126Z, and comparative example 1 a first substrate layer 30 was prepared using ordinary polycarbonate (sapick corporation, model 1414T);

2) Coating hardening liquid on the surface of the first substrate layer 30 to form a hardening glue layer, wherein the hardening liquid comprises the following components in parts by weight: 25% of 9-functional polyurethane acrylic resin, 20% of 6-functional fluorine-modified polyurethane acrylic resin, 3% of 2-functional polyurethane acrylic resin, 4% of nano silica modified acrylate, 0.5% of TPO (first photoinitiator), 2% of photoinitiator 184 (second photoinitiator), and ethyl acetate.

3) Transferring texture structure on the surface of the hardened adhesive layer by adopting a wavelength of 365nm to 400nm and curing energy of 900mj/cm ² To 1100mj/cm ² The LED lamp is subjected to first photocuring; so that the hardened glue layer is cured to form a semi-cured hardened layer;

4) Adopting common polycarbonate (Saebick company, model 1414T), and performing injection molding on the surface of the first substrate layer 30, which is far away from the semi-solidified hardened layer, to form a shell body 10;

5) Adopt full-wave band's mercury lamp, carry out the second photocuring, so that semi-solid sclerosis layer takes place the solidification to become sclerosis layer 50, obtains casing 100, and wherein, casing body 10's thickness is 0.5mm, and first substrate layer 30's thickness is 0.1mm, and sclerosis layer 50's thickness is 10 μm, casing body 10's that sclerosis layer 50 kept away from surface includes texture area 53 and plain noodles district 51.

Comparative example 2

1) Providing a shell body 10, wherein the shell body 10 is made of common polycarbonate (Sabbick company, model 1414T);

2) Coating hardening liquid on the surface of the shell body 10 to form a hardening glue layer, wherein the hardening liquid comprises the following components in parts by weight: 25% of 9-functional polyurethane acrylic resin, 20% of 6-functional fluorine-modified polyurethane acrylic resin, 3% of 2-functional polyurethane acrylic resin, 4% of nano-silica modified acrylate, 0.5% of TPO (first photoinitiator), 2% of photoinitiator 184 (second photoinitiator), and ethyl acetate.

3) The adopted wavelength is 365nm to 400nm, and the curing energy is 900mj/cm ² To 1100mj/cm ² The LED lamp is subjected to first photocuring; so that the hardened glue layer is solidified to form a semi-solidified hardened layer;

4) Performing hot bending molding at 200 deg.C and 50bar for 1min; and

5) And (2) performing second photocuring by using a full-waveband mercury lamp, so that the semi-solidified hardened layer is solidified to become the hardened layer 50, and obtaining the shell 100, wherein the thickness of the shell body 10 is 0.6mm, the thickness of the hardened layer 50 is 10 micrometers, and the surface of the shell body 10 away from the hardened layer 50 comprises a texture area 53 and a smooth area 51.

Comparative examples 3 to 5

Comparative examples 3 to 5 were prepared by the following steps:

1) Preparing the first substrate layer 30: preparing a first substrate layer 30 from hardened PC granules of emperor 1126Z;

2) Coating a hardening liquid on the surface of the first substrate layer 30 to form a hardened glue layer;

the hardening liquid of comparative example 3 comprises the following components in parts by weight: 25% of 9-functional urethane acrylic resin, 20% of 6-functional urethane acrylic resin, 3% of 2-functional urethane acrylic resin, 4% of acrylate, 0.5% of TPO (first photoinitiator), 2% of photoinitiator 184 (second photoinitiator), and ethyl acetate;

the hardening liquid of comparative example 4 comprises the following components in parts by weight: 25% of 9-functional polyurethane acrylic resin, 20% of 6-functional fluorine-modified polyurethane acrylic resin, 3% of 2-functional polyurethane acrylic resin, 4% of acrylate, 0.5% of TPO (first photoinitiator), 2% of photoinitiator 184 (second photoinitiator), and ethyl acetate;

the hardening liquid of comparative example 5 includes the following components in parts by weight: 25% of 9-functional polyurethane acrylic resin, 20% of 6-functional polyurethane acrylic resin, 3% of 2-functional polyurethane acrylic resin, 4% of nano silica modified acrylate, 0.5% of TPO (first photoinitiator), 2% of photoinitiator 184 (second photoinitiator), and ethyl acetate;

3) Transfer printing texture structure on the surface of the hardened glue layer, wherein the wavelength is 365nm to 400nm, and the curing energy is 900mj/cm ² To 1100mj/cm ² The LED lamp is subjected to first photocuring; so that the hardened glue layer is cured to form a semi-cured hardened layer;

4) Adopting common polycarbonate (Sabbick company, model 1414T), and performing injection molding on the surface of the first substrate layer 30, which is far away from the semi-cured hardened layer, to form a housing body 10;

5) Adopt the mercury lamp of full wave band, carry out the second photocuring, so that the solidification takes place to become sclerosis layer 50 in the semi-solid sclerosis layer, obtains casing 100, and wherein, casing body 10's thickness is 0.5mm, and the thickness of first substrate layer 30 is 0.1mm, and the thickness of sclerosis layer 50 is 10 mu m, casing body 10's that sclerosis layer 50 kept away from surface includes texture district 53 and plain noodles district 51.

The housings 100 obtained in the above examples and comparative examples were subjected to the following tests:

1) And (3) wear resistance test: the appearance surface of the shell 100 assembly 100 is rubbed back and forth by using 0000# steel wool and a load of 1Kg, and the wear resistance of the shell 100 assembly 100 is stronger as the number of rubbing is larger before the appearance surface of the shell 100 assembly 100 is scratched.

2) Plain area 51 pencil hardness test: the hardness of the 1kg pencil was measured using GB/T6739-2006.

3) Ball drop height (impact test): the shell body 10 is made into a flat sheet with the size of 150mm multiplied by 73 mm; the samples of the above-mentioned embodiment and comparative example were respectively supported on jigs (four sides of the casing 100 were each supported by a jig having a height of 3mm, and the middle portion was suspended), a stainless steel ball having a weight of 110g was freely dropped from a certain height onto the surface of the casing 100 to be measured, five points in the four corners and the center of the casing body 10 were respectively measured, each point was measured 5 times until the casing body 10 was broken, and the height when the casing body 10 was broken was the ball drop height. The higher ball drop height indicates the higher impact strength and the better toughness of the housing 100, and the less likely it will crack.

The measured properties of the case 100 are shown in table 1 below.

TABLE 1 Performance parameters of the casings 100 of the examples and comparative examples

Examples of the invention

Example 1

Comparative example 1

Comparative example 2

Comparative example 3

Comparative example 4

Comparative example 5

First base material layer

Hardened PC

Ordinary PC

Is free of

Hardened PC

Shell body

Ordinary PC

Resistance to abrasion (times)

1500

500

1000

800

Pencil hardness in polished area

2H

HB

2H

Ball height (cm)

60

＞100

60

As can be seen from example 1 and comparative example 1 in table 1, the case 100 made of the first substrate layer 30 using the hardened PC has higher hardness and relatively lower impact strength than the case made of the ordinary PC, but still maintains higher impact strength and higher toughness. As can be seen from comparative examples 2 and 3, when the structures, thicknesses and components of the respective film layers are the same, the wear resistance, pencil hardness and impact resistance of the housing 100 manufactured by injection molding and hot bending are comparable to those of the smooth area 51. As can be seen from example 1 and comparative examples 3 to 5, when the fluorine-modified urethane acrylic resin or the nano silica-modified acrylate is added to the hardening liquid, the wear resistance of the hardened layer 50 can be improved, and when the fluorine-modified urethane acrylic resin or the nano silica-modified acrylate is added at the same time, the wear resistance is the highest.

Referring to fig. 7 to 9, an electronic device 400 is further provided in the embodiment of the present application, and includes: a display assembly 410, a housing 100 according to an embodiment of the present application, and a circuit board assembly 430. The display component 410 is for displaying; the housing 100 has an accommodating space 101, and the housing 100 is used for carrying the display component 410; the circuit board assembly 430 is disposed in the accommodating space 101, electrically connected to the display assembly 410, and configured to control the display assembly 410 to display. In some embodiments, the display component 410 is further used for closing the accommodating space 101; in other words, the housing 100 and the display component 410 enclose a closed accommodating space 101.

The electronic device 400 of the embodiment of the present application may be, but is not limited to, a portable electronic device such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, a smart bracelet, a smart watch, an electronic reader, and a game console.

For a detailed description of the housing 100, please refer to the description of the corresponding parts of the above embodiments, which is not repeated herein.

Alternatively, the display module 410 may be, but is not limited to, one or more of a liquid crystal display module, a light emitting diode display module (LED display module), a micro light emitting diode display module (micro LED display module), a sub-millimeter light emitting diode display module (MiniLED display module), an organic light emitting diode display module (OLED display module), and the like.

Referring also to fig. 9, optionally, the circuit board assembly 430 may include a processor 431 and a memory 433. The processor 431 is electrically connected to the display component 410 and the memory 433, respectively. The processor 431 is configured to control the display component 410 to display, and the memory 433 is configured to store program codes required by the processor 431 to operate, program codes required by the display component 410 to be controlled, display contents of the display component 410, and the like.

Optionally, processor 431 includes one or more general-purpose processors 431, where general-purpose processor 431 may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU), a microprocessor, a microcontroller, a host processor, a controller, an ASIC, and so forth. Processor 431 is configured to execute various types of digitally stored instructions, such as software or firmware programs stored in memory 433, which enable the computing device to provide a wide variety of services.

Alternatively, the Memory 433 may include a Volatile Memory (RAM), such as a Random Access Memory (Random Access Memory); the Memory 433 may also include a Non-volatile Memory (NVM), such as a Read-Only Memory (ROM), a Flash Memory (FM), a Hard Disk Drive (HDD), or a Solid-State Drive (SSD). The memory 433 may also include a combination of memories of the above-described kinds.

Reference in the present application to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by a person skilled in the art that the embodiments described herein can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the embodiments of the present application may be combined arbitrarily without contradiction between them to form another embodiment without departing from the spirit and scope of the present application.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or substituted by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A housing, comprising:

a housing body;

the first base material layer is arranged on the surface of the shell body, the pencil hardness of the first base material layer is HB to F, the elongation at break of the first base material layer is greater than or equal to 70%, the first base material layer comprises hardened resin, and the hardened resin is resin modified by a cyclic rigid group; the hardening resin is modified polycarbonate, and the cyclic rigid group comprises one or more of cyclohexane group and bisphenol C group; and

2. The housing of claim 1, wherein when the cyclic rigid group is a cyclohexane group, the cyclohexane group is grafted to a polycarbonate molecular chain backbone; when the cyclic rigid group is a bisphenol C group, the hardening resin is a block copolymer of poly bisphenol C and polycarbonate.

3. The housing according to claim 1, wherein the hardened layer comprises urethane acrylate of a first functionality, fluorine-modified urethane acrylate of a second functionality, urethane acrylate of a third functionality, nano-silica-modified acrylate, a first photoinitiator and a second photoinitiator, the first photoinitiator having a decomposition wavelength greater than a decomposition wavelength of the second photoinitiator; wherein the first functionality is greater than the third functionality and the second functionality is greater than the third functionality.

4. The housing of claim 3, wherein the ratio of the sum of the weight of the first functionality urethane acrylate and the second functionality fluorine-modified urethane acrylate to the weight of the third functionality urethane acrylate ranges from 8:1 to 25; the weight ratio of the urethane acrylate of the first functionality to the fluorine-modified urethane acrylate of the second functionality is from 0.8 to 1.2; the weight ratio of the first photoinitiator to the second photoinitiator is from 1.

5. The housing according to any one of claims 1 to 4, further comprising a decorative film disposed on a side of the housing body remote from the hardened layer; the decorative film comprises a bonding layer, a second base material layer, a texture layer, an optical coating layer and a shielding layer which are sequentially stacked, wherein the bonding layer is close to the shell body compared with the shielding layer.

6. A method of making a housing, comprising:

preparing a first base material layer, wherein the pencil hardness of the first base material layer is HB-F, the elongation at break of the first base material layer is greater than or equal to 70%, the first base material layer comprises a hardened resin, and the hardened resin is a resin modified by a cyclic rigid group; the hardening resin is modified polycarbonate, and the cyclic rigid group comprises one or more of cyclohexane group and bisphenol C group;

7. The method for manufacturing a shell according to claim 6, wherein the surface of the hardened layer far away from the shell body further comprises an optical surface area, the optical surface area is connected with the texture area, and the shell is of a 3D structure.

8. The method of manufacturing a housing according to claim 6, wherein when the cyclic rigid group is a cyclohexane group, the cyclohexane group is grafted to a polycarbonate molecular chain main chain; when the cyclic rigid group is a bisphenol C group, the hardening resin is a block copolymer of poly bisphenol C and polycarbonate.

9. The method for manufacturing a housing according to claim 6, wherein the hardened layer includes urethane acrylate of a first functionality, fluorine-modified urethane acrylate of a second functionality, urethane acrylate of a third functionality, nanosilica-modified acrylate, a first photoinitiator, and a second photoinitiator, and a decomposition wavelength of the first photoinitiator is longer than a decomposition wavelength of the second photoinitiator; wherein the first functionality is greater than the third functionality and the second functionality is greater than the third functionality.

10. The method for producing a housing according to any one of claims 6 to 9, wherein the double bond conversion of the semi-cured hardened layer is 20% to 55%; the double bond conversion rate of the hardened layer is 70% to 80%.

11. A housing, characterized in that it is produced by the production method according to any one of claims 6 to 10.

12. An electronic device, comprising:

a display component for displaying;

the housing of any one of claims 1 to 5 or claim 11, having an accommodating space for carrying the display assembly; and