CN115209691B - Phase-change heat storage sheet and self-adaptive flexible radiating fin - Google Patents
Phase-change heat storage sheet and self-adaptive flexible radiating fin Download PDFInfo
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- CN115209691B CN115209691B CN202210684412.6A CN202210684412A CN115209691B CN 115209691 B CN115209691 B CN 115209691B CN 202210684412 A CN202210684412 A CN 202210684412A CN 115209691 B CN115209691 B CN 115209691B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a phase-change heat storage sheet and a self-adaptive flexible radiating fin, wherein the phase-change heat storage sheet comprises a film shell and a film package; the film package is fixed in the film shell and deformation cavities are reserved on two sides of the film shell; the thin film package is filled with phase change materials, and a shape memory unit fixedly connected with the upper and lower boundaries of the thin film package is arranged in the thin film package; the shape memory unit is used for extruding the phase change material from the center to the periphery by elastic force generated by shrinkage deformation when the heating temperature is higher than the modification temperature, expanding and recovering the original shape when the heating temperature is lower than the modification temperature, and re-sucking the cooled liquid phase change material to the center. The self-adaptive flexible radiating fin is formed by integrating upper and lower graphene polymer composite films and a middle phase-change heat storage fin. The invention utilizes the expansion and contraction of the phase change material and the temperature change and expansion function of the shape memory fiber to realize a contact melting mode with high heat transfer rate and constant temperature, so that the purpose of high heat flow transmission can be realized while the constant temperature of a heat source is maintained under the impact of high heat flow.
Description
Technical Field
The invention belongs to the field of electronic device heat management, and particularly relates to a self-adaptive flexible radiating fin applied to radiating a high-heat-flow device in a narrow and complicated space.
Background
With the integration, intellectualization and microminiaturization of microelectronic devices, the local heat flux density is continuously increased, and if so much heat is accumulated in a relatively narrow enclosed space, the working temperature of the device is rapidly increased, the working performance and reliability are seriously weakened, and the service life is even shortened. Therefore, how to realize efficient and reliable heat dissipation of high heat flux microelectronic devices in a narrow space has become an important bottleneck restricting the development of microelectronic technologies.
For microelectronic devices, cooling and heat dissipation face many challenges such as high heat flux density, limited cooling space, and precise temperature control. The existing cooling modes of electronic devices can be divided into active cooling and passive cooling. The active cooling has strong cooling capacity, high temperature control precision and good temperature uniformity, but requires external power input, has relatively complex structure and large system volume, and is difficult to be applied to the thermal management of micro-electronic devices in narrow and complicated space. From the economic and environmental aspects, passive cooling does not need energy loss, and has the advantages of simple structure, easy realization, economy and environmental protection. However, conventional passive cooling technologies, such as vapor chamber plates, heat pipes, etc., have gradually reached the heat dissipation bottleneck, and the heat dissipation process cannot maintain the heat source at a stable temperature, and the structural adaptation is relatively poor. In view of the foregoing, there is a strong need to develop a novel heat dissipation technology capable of maintaining stable heat source temperature and high heat dissipation efficiency to ensure the reliability of high-precision microelectronic products.
Considering that the phase change material is melted, a great amount of latent heat can be absorbed, and the temperature fluctuation is very small, so that the phase change heat storage plate made of the phase change material can realize high-efficiency heat transfer rate at constant temperature. However, although the existing phase-change heat storage sheet can temporarily stabilize a heat source at a constant temperature, the effect of the phase-change heat storage sheet cannot be always maintained, the heat dissipation rate of the phase-change heat storage sheet is also continuously reduced along with time, high heat flow impact pulsation is difficult to resist, and the working performance and the service life of a microelectronic device are seriously affected.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a phase-change heat storage sheet and a self-adaptive flexible heat sink, which can ensure that a constant temperature and a high heat transfer rate are obtained at a heat source under the impact of high heat flow.
In order to solve the technical problems, the invention adopts the following technical scheme:
the phase-change heat storage sheet is characterized in that: comprising the following steps: a film housing and a film package; the film package is fixed in the film shell, and deformation cavities are reserved on two sides of the film shell; phase change materials are filled in the thin film package, and shape memory units fixedly connected with the upper and lower boundaries of the thin film package are arranged in the thin film package at intervals along the height direction of the thin film package; the shape memory unit is used for extruding the phase change material from the center to the periphery by elastic force generated by shrinkage deformation when the heating temperature is higher than the modification temperature, and the shape memory unit is used for expanding and recovering to the original shape when the heating temperature is lower than the modification temperature, and re-sucking the cooled liquid phase change material to the center.
The shape memory unit is a shape memory fiber.
The shape memory fibers are arranged in the film package according to a step layout with dense middle and sparse periphery. The shape memory fibers are arranged in the film package according to a step layout with dense middle and sparse periphery, so that on one hand, the elastic force applied to the middle is large, the elastic force applied to the periphery is small, the melted liquid phase change material is guaranteed to be extruded in the direction from the center to the periphery, on the other hand, the same effect as a liquid suction core is achieved, and the cooled liquid phase change material is sucked to the middle area again.
The shape memory fibers include, but are not limited to, shape memory alloy fibers and shape memory polymer fibers.
The phase change material includes, but is not limited to, paraffins, alcohols, stearates, inorganic salts, and liquid metals.
The film shell and the film package are made of elastic and flexible high polymer materials, including but not limited to polyamides, polypropylenes and polytetrafluoroethylene.
The utility model provides a self-adaptation flexible fin, includes upper composite film and lower floor's composite film, its characterized in that: the phase change heat storage sheet is arranged between the upper layer composite film and the lower layer composite film.
The upper layer composite film is a graphene polymer composite film; the lower layer composite film is a graphene polymer composite film.
The graphene polymer composite film is formed by assembling and combining graphene and a polymer through chemical vapor deposition or bonding.
The upper layer composite film, the lower layer composite film and the phase change heat storage sheet are sealed through thermal bonding, cementing or other processes.
The thin film package of the phase-change heat storage sheet is internally provided with not only the phase-change material but also a shape memory unit. The shape memory unit has the function of self-adapting expansion along with the change of temperature, when the heated temperature is higher than the metamorphosis temperature, the shape memory unit can shrink, and when the cooled temperature is lower than the metamorphosis temperature, the shape memory unit can expand and recover to the original shape. Based on the self-adaptive function of the shape memory unit, semi-active temperature regulation and control of the phase-change heat storage sheet are realized. The invention breaks through the technical bottleneck that the temperature of the heat source is difficult to stably maintain at a constant temperature in other passive heat dissipation technologies, and can achieve the purpose of maintaining the constant temperature of the heat source and simultaneously realizing high heat flow heat transfer even under the impact of high heat flow, thereby providing a very potential technical scheme for the heat management of high heat flow devices in a narrow and complicated space.
According to whether the phase change material changes phase or not, the working modes of the self-adaptive flexible radiating fin are divided into a low heat load mode and a high heat flow impact mode; in a low heat load mode, the self-adaptive flexible radiating fin performs sensible heat storage through a heat conduction mechanism; while in the high heat flux impact mode, the adaptive flexible heat sink maintains contact with the melting mechanism for latent heat storage. As the heat source operating mode is shifted between low heat load and high heat flow impingement, the primary heat transfer mechanism of the adaptive flexible heat sink will alternate between a heat conduction mechanism and a contact melting mechanism.
The phase change material does not completely fill the phase change heat storage sheet, and gaps are reserved at the peripheral edges of the phase change heat storage sheet to accommodate the phase change material which expands when heated. The thin film shell and the thin film package of the phase-change heat storage sheet are made of flexible polymer materials with elasticity, so that the phase-change materials are allowed to expand and contract in the heating and cooling processes so as not to leak, and the reliability and the structural suitability of the self-adaptive flexible radiating sheet are improved.
The graphene polymer composite film is formed by combining graphene and a polymer through chemical vapor deposition or bonding assembly and other modes, on one hand, heat of a heat source can be rapidly transferred to the phase-change heat storage sheet, and on the other hand, the heat can be expanded to enlarge a heat exchange area so as to be conveniently taken away by cold air in the environment.
Under the high heat flow impact mode, the self-adaptive flexible radiating fin utilizes the elastic force generated by the heated shrinkage of the shape memory fiber to extrude the phase change material in the liquid state between the heat source and the solid-liquid phase interface to the periphery, and maintains the constant temperature and the high-efficiency heat transfer rate at the heat source based on the stable contact melting mode. The specific working principle is as follows: when the high heat flow impact is received, heat of a heat source is transferred to the phase-change heat storage piece through the upper graphene polymer composite film, wherein a part of heat is diffused through the lower graphene polymer composite film so as to be taken away by cold air, the other part of heat is absorbed by the phase-change heat storage piece and promotes the melting of the phase-change material in the phase-change heat storage piece, in the process, the shape memory fiber can extrude the liquid phase-change material at the melting front from the center to the periphery due to elastic force generated by thermal shrinkage deformation, and the stable close-range contact melting between the heat source and the solid phase-change material is maintained, so that the heat source can keep constant temperature near a phase-change point and has higher heat transfer rate. However, after the impact of high heat flow is finished, the shape memory fiber is gradually cooled and expanded to restore to the original shape by the continuous cooling effect of air convection outside the lower graphene polymer composite film, and the liquid phase change material is converged from the periphery to the central part and is a solid phase change material under the action of internal pressure difference and superelastic film encapsulation shrinkage force. Based on the phase change heat transfer mechanism, the high heat flow device can maintain the purposes of high heat transfer rate and constant temperature control even under the action of transient thermal shock, so that the service life of the high heat flow device is greatly prolonged.
Compared with the prior art, the invention has the beneficial effects that:
the invention realizes the purpose of stably maintaining high heat transfer rate and constant temperature control by utilizing the expansion and contraction of the phase change material and the temperature change and expansion function of the shape memory fiber, breaks through the technical bottleneck that the temperature of a heat source is difficult to stably maintain at constant temperature in other passive heat dissipation technologies (such as traditional phase change material films, graphene films and the like), realizes high-precision, strong-stability and constant-temperature high-heat-flow heat transport regulation and control, and becomes a very potential technical scheme in the field of heat dissipation and reinforcement of high-heat-flow devices in narrow and complicated spaces.
The invention is synthesized by using flexible polymer materials, so that compared with a heat pipe and a steam cavity flat plate radiator, the thickness is obviously reduced and the structural suitability of an application scene is improved.
The self-adaptive flexible heat dissipation diaphragm is formed by integrating thermal bonding by selecting the flexible high polymer material, so that the thickness of the diaphragm is reduced, the sealing reliability is improved, and the structural applicability of an application scene is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a phase change thermal storage sheet;
fig. 2 is a schematic diagram illustrating an operation mode and a principle of the phase-change heat storage sheet, wherein: (2a) A low thermal load mode, (2 b) a high heat flow impact mode;
FIG. 3 is a three-dimensional assembly view of an adaptive flexible heat sink;
FIG. 4 is a schematic diagram of the trend of the temperature change of the heat source on the conventional phase change heat storage sheet and the adaptive flexible heat sink;
in the figure, 1. Upper graphene polymer composite membrane; 2. phase change heat storage sheets; 3. a lower graphene polymer composite film; 4. a film housing; 5. packaging a film; 6. a solid phase change material; 7. a shape memory fiber; 8. a thermal load; 9. air convection; 10. a solid-liquid phase interface; 11. a liquid phase change material.
Detailed Description
The following is a further detailed description taken in conjunction with the accompanying drawings:
the embodiment provides a phase-change heat storage sheet, and fig. 1 is a schematic cross-sectional view of the phase-change heat storage sheet, and the phase-change heat storage sheet comprises a film shell 4, a film package 5 and a solid phase-change material 6 filled in the film package. The film housing 4 and the film package 5 are sealed by thermal bonding or other reliable process.
A shape memory fiber 7 is also arranged in the film package 5, and two ends of the shape memory fiber 7 are fixed at the upper and lower boundaries inside the film package 5.
The fixing mode of the film package 5 and the shape memory fiber 7 adopts a thermal bonding method.
The film housing 4 and the film package 5 are made of super-elastic flexible materials, so that the phase change materials are allowed to expand and contract without leakage in the heating and cooling processes, and the reliability and the structural suitability of the self-adaptive flexible radiating fin are improved. The shape memory fiber 7 has the function of self-adapting expansion along with the change of temperature, when the heated temperature is higher than the metamorphosis temperature, the shape memory fiber 7 can shrink, and when the cooled temperature is lower than the metamorphosis temperature, the shape memory fiber 7 can expand and restore to the original shape.
The shape memory fibers 7 are arranged in the film package 5 according to a step layout of dense middle and sparse periphery, which on one hand makes the middle part receive large elastic force and the periphery receives small elastic force, and on the other hand also plays the same role as the liquid absorption core.
Fig. 2 is a schematic diagram of the working mode and principle of the phase change heat storage sheet, and is divided into a low heat load mode (see fig. 2 a) and a high heat flow impact mode (see fig. 2 b).
When the device is in the low heat load operation mode, the generated heat load 8 is not large, so that the device temperature can be controlled in a stable state through the coupling effect of sensible heat storage of the solid phase change material 6 based on a heat conduction mechanism and the cooling effect of air convection 9 in the environment.
When the device is in a high heat flow impact mode, a great heat load 8 is generated in a short time, the solid phase change material 6 starts to melt for latent heat storage, the heated temperature of the shape memory fiber 7 is continuously increased, after the temperature of the shape memory fiber is higher than the metamorphosis temperature, the shape memory fiber 7 can extrude the liquid phase change material 11 near the solid-liquid phase interface 10 from the center to the periphery due to the elastic force generated by shrinkage deformation, and the stable close contact melting between the device and the solid phase change material 6 is maintained, so that the temperature of the device can be stabilized at a constant temperature near the phase change point, and the device has a higher heat transfer rate. When the impact of high heat flow is over, the shape memory fiber 7 is gradually cooled and expanded to restore to the original shape by the cooling effect of the air convection 9, and the liquid phase change material 11 is converged from the periphery to the center and is cooled again to form the solid phase change material 6 under the action of the internal pressure difference and the elastic shrinkage force of the film package 5. As the heat source operating mode is shifted between low heat load and high heat flow impingement, the primary heat transfer mechanism of the adaptive flexible heat sink will alternate between a heat conduction mechanism and a contact melting mechanism.
Fig. 3 is a three-dimensional diagram of the self-adaptive flexible radiating fin, which comprises an upper graphene polymer composite film 1, a phase-change heat storage sheet 2 and a lower graphene polymer composite film 3, wherein the three layers of films are made of flexible polymer materials and are integrally formed through a thermal bonding process, so that the total thickness of the self-adaptive flexible radiating film is reduced, and the sealing reliability is improved.
From the schematic diagrams of the trend of the heat source temperature change on the conventional phase change heat storage sheet and the adaptive flexible heat dissipation sheet, it can be seen that, for the conventional phase change heat storage sheet, as the melting progress of the phase change material in the conventional phase change heat storage sheet advances, the solid-liquid phase interface gradually gets away from the heat source, the thickening of the liquid phase change material causes the thermal resistance to be continuously increased, and therefore the heat source temperature only maintains a short constant temperature stage; the self-adaptive flexible radiating fin provided by the invention realizes a high heat transfer rate and constant temperature contact melting mode by utilizing the heat expansion and cold contraction of the phase change material and the temperature change and expansion function of the shape memory fiber, breaks through the technical bottleneck that the temperature of a heat source on the traditional phase change heat storage fin is difficult to stably maintain at a constant temperature, achieves the aim of maintaining the high heat transfer rate and constant temperature control even under the action of instantaneous thermal shock, and provides a very potential technical scheme for the thermal management of high heat flow devices in a narrow and complicated space.
Claims (8)
1. The phase-change heat storage sheet is characterized in that: comprising the following steps: a film housing and a film package; the film package is fixed in the film shell, and deformation cavities are reserved on two sides of the film shell; phase change materials are filled in the thin film package, and shape memory units fixedly connected with the upper and lower boundaries of the thin film package are arranged in the thin film package at intervals along the height direction of the thin film package; the shape memory unit is used for extruding the phase change material from the center to the periphery by elastic force generated by shrinkage deformation when the heating temperature is higher than the modification temperature, and is used for expanding and recovering to the original shape when the heating temperature is lower than the modification temperature, and re-sucking the cooled liquid phase change material to the center; the shape memory unit is a shape memory fiber; the shape memory fibers are arranged in the film package according to a step layout with dense middle and sparse periphery.
2. The phase change thermal storage sheet of claim 1, wherein: the shape memory fibers include, but are not limited to, shape memory alloy fibers and shape memory polymer fibers.
3. The phase change thermal storage sheet of claim 1, wherein: the phase change material includes, but is not limited to, paraffins, alcohols, stearates, inorganic salts, and liquid metals.
4. The phase change thermal storage sheet of claim 1, wherein: the film shell and the film package are made of elastic and flexible high polymer materials, including but not limited to polyamides, polypropylenes and polytetrafluoroethylene.
5. The utility model provides a self-adaptation flexible fin, includes upper composite film and lower floor's composite film, its characterized in that: a phase change heat storage sheet according to any one of claims 1 to 4 is provided between the upper layer composite film and the lower layer composite film.
6. An adaptive flexible heat sink according to claim 5, wherein: the upper layer composite film is a graphene polymer composite film; the lower layer composite film is a graphene polymer composite film.
7. An adaptive flexible heat sink according to claim 6, wherein: the graphene polymer composite film is formed by assembling and combining graphene and a polymer through chemical vapor deposition or bonding.
8. An adaptive flexible heat sink according to claim 6, wherein: the upper layer composite film, the lower layer composite film and the phase change heat storage sheet are sealed through a thermal bonding or cementing process.
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Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06163758A (en) * | 1992-11-19 | 1994-06-10 | Nec Eng Ltd | Heat-dissipating structure by ic socket using spring made of shape memory alloy |
| US5836066A (en) * | 1996-07-22 | 1998-11-17 | Innovative Dynamics, Inc. | Process for the production of two-way shape memory alloys |
| CN1684251A (en) * | 2004-04-15 | 2005-10-19 | 鸿富锦精密工业（深圳）有限公司 | Heat interface material and its producing method |
| CN1924051A (en) * | 2006-09-28 | 2007-03-07 | 北京航空航天大学 | Titanium-zirconium-iron shape memory alloy material |
| JP2011148653A (en) * | 2010-01-21 | 2011-08-04 | Tokyo Institute Of Technology | Shape memory material, method for manufacturing the same, and method for using the same |
| JP2012069725A (en) * | 2010-09-24 | 2012-04-05 | Toyota Motor Corp | Cooling device |
| CN203733777U (en) * | 2014-02-13 | 2014-07-23 | 中国科学院工程热物理研究所 | Micro channel phase change heat transfer device |
| CN105674780A (en) * | 2016-04-06 | 2016-06-15 | 中国科学院工程热物理研究所 | Anti-gravity heat pipe |
| CN205843451U (en) * | 2016-04-06 | 2016-12-28 | 中国科学院工程热物理研究所 | A kind of antigravity heat pipe |
| CN206210777U (en) * | 2016-11-23 | 2017-05-31 | 广东合一新材料研究院有限公司 | Ultra-thin phase-change heat piece |
| CN108329893A (en) * | 2018-03-11 | 2018-07-27 | 深圳市驭晟新能源科技有限公司 | A kind of compliant thermal interface phase transformation compound foil material and preparation method thereof |
| CN108777927A (en) * | 2018-06-26 | 2018-11-09 | 联想(北京)有限公司 | A kind of radiator, method and electronic equipment |
| CN109973342A (en) * | 2019-03-12 | 2019-07-05 | 中国人民解放军军事科学院国防科技创新研究院 | Shape memory drive-type software driver and its control method, production method |
| CN112937013A (en) * | 2021-01-28 | 2021-06-11 | 上海大学 | High-thermal-conductivity and three-level shape memory multilayer structure flexible film and preparation method thereof |
| CN113115559A (en) * | 2021-03-11 | 2021-07-13 | 西安交通大学 | Heat dissipation device and heat dissipation method based on shape memory alloy |
| CN113223985A (en) * | 2021-04-28 | 2021-08-06 | 浙江大学 | Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method |
| DE102020001380A1 (en) * | 2020-03-04 | 2021-09-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Latent heat storage |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9659908B1 (en) * | 2015-11-10 | 2017-05-23 | Intel Corporation | Systems and methods for package on package through mold interconnects |
-
2022
- 2022-06-16 CN CN202210684412.6A patent/CN115209691B/en active Active
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06163758A (en) * | 1992-11-19 | 1994-06-10 | Nec Eng Ltd | Heat-dissipating structure by ic socket using spring made of shape memory alloy |
| US5836066A (en) * | 1996-07-22 | 1998-11-17 | Innovative Dynamics, Inc. | Process for the production of two-way shape memory alloys |
| CN1684251A (en) * | 2004-04-15 | 2005-10-19 | 鸿富锦精密工业（深圳）有限公司 | Heat interface material and its producing method |
| CN1924051A (en) * | 2006-09-28 | 2007-03-07 | 北京航空航天大学 | Titanium-zirconium-iron shape memory alloy material |
| JP2011148653A (en) * | 2010-01-21 | 2011-08-04 | Tokyo Institute Of Technology | Shape memory material, method for manufacturing the same, and method for using the same |
| JP2012069725A (en) * | 2010-09-24 | 2012-04-05 | Toyota Motor Corp | Cooling device |
| CN203733777U (en) * | 2014-02-13 | 2014-07-23 | 中国科学院工程热物理研究所 | Micro channel phase change heat transfer device |
| CN205843451U (en) * | 2016-04-06 | 2016-12-28 | 中国科学院工程热物理研究所 | A kind of antigravity heat pipe |
| CN105674780A (en) * | 2016-04-06 | 2016-06-15 | 中国科学院工程热物理研究所 | Anti-gravity heat pipe |
| CN206210777U (en) * | 2016-11-23 | 2017-05-31 | 广东合一新材料研究院有限公司 | Ultra-thin phase-change heat piece |
| CN108329893A (en) * | 2018-03-11 | 2018-07-27 | 深圳市驭晟新能源科技有限公司 | A kind of compliant thermal interface phase transformation compound foil material and preparation method thereof |
| CN108777927A (en) * | 2018-06-26 | 2018-11-09 | 联想(北京)有限公司 | A kind of radiator, method and electronic equipment |
| CN109973342A (en) * | 2019-03-12 | 2019-07-05 | 中国人民解放军军事科学院国防科技创新研究院 | Shape memory drive-type software driver and its control method, production method |
| DE102020001380A1 (en) * | 2020-03-04 | 2021-09-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Latent heat storage |
| CN112937013A (en) * | 2021-01-28 | 2021-06-11 | 上海大学 | High-thermal-conductivity and three-level shape memory multilayer structure flexible film and preparation method thereof |
| CN113115559A (en) * | 2021-03-11 | 2021-07-13 | 西安交通大学 | Heat dissipation device and heat dissipation method based on shape memory alloy |
| CN113223985A (en) * | 2021-04-28 | 2021-08-06 | 浙江大学 | Shape memory polymer transfer printing stamp with air pressure regulation and control and transfer printing method |
Non-Patent Citations (1)
| Title |
|---|
| 卢涛,姜培学.封装有相变材料的热沉结构对电子器件高温保护的传热分析.电子器件.2005,(02),正文全文. * |
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