CN115209581A - Rigid heating film of electronic product and preparation method thereof - Google Patents
Rigid heating film of electronic product and preparation method thereof Download PDFInfo
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- CN115209581A CN115209581A CN202110396665.9A CN202110396665A CN115209581A CN 115209581 A CN115209581 A CN 115209581A CN 202110396665 A CN202110396665 A CN 202110396665A CN 115209581 A CN115209581 A CN 115209581A
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
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- Resistance Heating (AREA)
Abstract
The invention discloses a rigid heating film of an electronic product and a preparation method thereof. A method for preparing a rigid heating film with high radiant heat benefit includes such steps as spraying, brushing, rolling coating, transfer printing and transfer printing on a rigid high-temperature-resistant insulating waterproof layer made of glass fiber, quartz or refractory ceramic, adding nano resin and volatile solvent, printing, high-temperature purifying, drying to volatilize solvent, and physical or chemical linking with nano inorganic resin. The invention improves the function of the high-temperature resistant heating material to the maximum extent, reduces the use cost and the limitation of the manufacturing process, improves the wide usability of the high-temperature resistant heating material in a low-cost mode, and achieves the maximization of industrial batch production.
Description
Technical Field
The invention relates to a rigid heating film of an electronic product and a preparation method thereof, in particular to a rigid heating film with high radiant heat benefit.
Background
The electric heating elements of 3C electronic products such as electric heating furnaces, electric coffee makers, and water dispensers are used as heating sources, and as shown in fig. 1A and 1B, in the electric heating elements of conventional 3C electronic products, an electric heating plate 62 is disposed on a base 61 of an electric heating furnace 60, and the electric heating plate 62 provides a heat source through an electric heating copper pipe 63 in the base 61, so that not only is power consumed, but also the arrangement of the electric heating pipe 63 is required to be matched with a heat dissipation fan 64, a control circuit 65, and other devices, which occupy more space, and result in the disadvantage that the height (thickness) of the base 61 cannot be reduced.
In recent years, due to the development of technology, electronic components are miniaturized, and the derived thermal management problem is also paid a certain attention, and many high thermal conductive materials such as silver, copper, graphite sheets and the like are widely researched by scientists. Among them, the heat conductivity of graphite sheets has received a great deal of attention, and the graphite sheets have a heat conductivity superior to that of metals due to their special two-dimensional honeycomb lattice carbon atom structure, and thus are widely used in electronic devices.
In the production process of the traditional graphite flake, firstly, chemicals are used for improving the purity and density of the graphite flake, then pressure of more than 30Mpa is applied to press the graphite flake, so that the graphite flakes are tightly combined with each other, finally, high temperature of 1800-3000 ℃ is applied, and after several hours, a graphite heat-conducting base material can be obtained, therefore, a large amount of energy is consumed, and the manufacturing time is long. Therefore, how to develop a graphite heat conduction material with simple process without using high pressure and high temperature process steps is a problem to be broken through by related technicians in the technical field.
However, the following three problems generally exist in the conventional graphene film transfer process: firstly, the graphene film is exposed to air for a long time before transfer, which results in the contamination of the surface contacting the air by airborne particles, and the conventional transfer method is to use the contaminated surface to fabricate devices. Secondly, in the traditional transfer method, the graphene film is transferred to a hard substrate, and the graphene film is easy to fall off due to the fact that the bonding force between the graphene and the substrate is only Vanderwatt force. Thirdly, the traditional transfer method needs complicated steps, and the used materials are too many in the process of transferring the graphene film from the metal substrate to the needed substrate, so that the graphene film is easy to be polluted on the surface in the transfer process, and the crystal structure of the graphene film is easy to be damaged. The three defects limit the large-scale production and utilization of the graphene film.
Therefore, chinese patent application publication No. CN102807208A discloses a graphene film transfer method for improving the problems in the graphene film transfer process. The method is characterized in that: the graphene film is directly adhered to the polymer substrate, so that the graphene film and the polymer substrate form covalent bonding, and one surface of the graphene film, which is in contact with the growth substrate, is exposed and serves as an effective surface for manufacturing a functional device. The implementation steps of the technical scheme are as follows: step 1), melting or dissolving the polymer to make the polymer in a fluid state; step 2), coating the polymer in a fluid state on a substrate on which graphene grows, and curing the polymer; and 3) corroding the metal sheet by using a ferric chloride or ferric nitrate solution, and cleaning, drying or airing the polymer film adhered with the graphene film to obtain the graphene film transferred to the polymer material.
According to the Chinese patent application with publication number CN 10589898907A, a graphene heating film and a preparation method thereof are disclosed. The technical scheme comprises the following implementation steps: 1) Manufacturing a graphene film; 2) Covering the second insulating waterproof layer with adhesive; 3) Bonding the second insulating waterproof layer and the graphene film into a whole; 4) Removing the metal matrix on the graphene film; 5) Adhering an electrode layer on the graphene film; 6) Adhering a first insulating waterproof layer on the electrode layer; 7) And connecting the electrode layer with the lead.
However, the graphene prepared by the traditional graphene preparation method has more surface defects, graphene sheets are easy to fold and curl, so that the performance of the graphene is influenced, and the surface of the reduced graphene has almost no oxidation group, so that the surface of the reduced graphene is hydrophobic, and the reduced graphene is easy to agglomerate in water and some common organic solvents and is easy to settle. At present, a plurality of methods for preparing a graphene heating film exist, but the preparation of the graphene heating film with excellent electrical properties and no pollution is difficult, and the main difficulty lies in how to transfer the graphene film to a target substrate better to prepare the complete, damage-free, stable and reliable graphene heating (heat conducting) film.
Moreover, the difficult problem of heat dissipation spraying in the graphene industry also includes the problem that the first high-purity graphene cannot be tightly arranged after being sprayed; and the problem that the radiation emission is influenced by wrapping the graphene by the common resin coating in a stirring and mixing mode.
In addition, the thickness of the graphene heating (heat conducting) film is not easy to decrease, and most of the graphene heating (heat conducting) films are not flexible, so that a plurality of problems are generated and the application of the graphene heating (heat conducting) film on a 3C product is difficult, and the industry is very troubled.
Therefore, how to solve the above problems of the conventional graphene heating (thermal conductive) film is a main subject of the present invention.
Disclosure of Invention
The invention mainly aims to provide a rigid heating film of an electronic product and a preparation method thereof, which can improve the functions of heating material particles (such as graphene) to the maximum extent and achieve the effect of high heating property.
The invention further aims to provide a rigid heating film of an electronic product and a preparation method thereof, which have the advantages of reducing the limitation of using heating material particles 20407and widely improving the products which can be used by the heating material particles by using a coating mode, thereby achieving the maximization of industrial batch production.
To achieve the above-mentioned effects, the present invention provides a method comprising the steps of:
a) Providing a first high temperature resistant insulating waterproof layer, which is selected from a rigid body formed by any one or the combination of glass fiber, quartz or refractory ceramic, and the thickness of the rigid body is between 0.015 and 0.2 mm;
b) Setting a layer of high temperature resistant heating material slurry on the first high temperature resistant insulating waterproof layer, wherein the thickness of the high temperature resistant heating material slurry is between 0.015 and 0.2mm, the high temperature resistant heating material slurry comprises heating material particles which are selected from carbon spheres, carbon fibers, graphite or particles thereof, graphene, carbon nanotubes, boron nitride, artificial diamond, alumina, zirconia, rare earth and heat conducting metal particles, wherein any one or combination of the carbon spheres, the carbon fibers, the graphite or particles thereof, the graphene, the carbon nanotubes, the boron nitride, the artificial diamond, the alumina, the zirconia, the rare earth and the heat conducting metal particles is 25 to 85 percent by weight, and is mixed with 10 to 50 percent by weight of nano resin and 5 to 25 percent by weight of solvent medium;
c) Purifying, namely drying the high-temperature-resistant heating material slurry at a heat temperature of 120-150 ℃ for 30-50 minutes to volatilize a medium and a solvent at a high temperature so as to improve the purity, carrying out physical or mixed chemical bonding or bridging on the high-temperature-resistant heating material slurry and the first high-temperature-resistant insulating waterproof layer through nano resin, exposing heating material particles on the first high-temperature-resistant insulating waterproof layer to the maximum extent, stacking the heating material particles in a tight arrangement without being wrapped, and generating silicate ions through a shrinkage polymerization reaction of the nano resin so as to stably combine the heating material particles on the first high-temperature-resistant insulating waterproof layer to form a high-purity high-temperature-resistant heating layer;
d) An electrode layer is arranged on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm;
e) Covering a second high-temperature-resistant insulating waterproof layer on the electrode layer, wherein the second high-temperature-resistant insulating waterproof layer is a rigid body with the thickness of 0.015-0.2 mm; and
f) Providing a lead electrically connected with the electrode layer to prepare a rigid heating film with the thickness within 0.6mm, wherein the working temperature can reach 600 ℃.
According to the characteristics of the former disclosure, the second high temperature resistant insulating waterproof layer includes a part of the electronic product to be heated, and the part of the electronic product to be heated is an insulator, and the electrode layer is directly attached to the part of the electronic product to be heated.
According to a feature of the disclosure, the nano-resin comprises a water-based or oil-based nano-resin. Wherein the waterborne nano resin is selected from any one of waterborne nano epoxy modified acrylic acid or waterborne nano organic silicon (silicon) modified polyurethane or the combination thereof. Wherein the oily nano resin is selected from solvent type nano epoxy modified acrylic acid or solvent type nano organic silicon (silicon) modified polyurethane or any one or the combination thereof.
According to the characteristics of the previous disclosure, the high temperature heat-conducting layer can be a full surface or a line shape matching the shape of the electrode layer.
According to the aforementioned features, the electrode layer may be formed of a conductive metal material.
According to the characteristics disclosed in the foregoing, the flexible heat-conducting film for electronic products comprises a first high-temperature-resistant insulating waterproof layer, a rigid body and a second rigid body, wherein the thickness of the first high-temperature-resistant insulating waterproof layer is 0.015-0.2 mm; a high temperature resistant heating layer coated on the first high temperature resistant insulating waterproof layer, the thickness of the high temperature resistant heating layer is between 0.015-0.2 mm, the high temperature resistant heating layer is provided with heating material particles, and the heating material particles are exposed on the first high temperature resistant insulating waterproof layer, are closely arranged and stacked without being wrapped, so that the heating material particles are stably combined on the first high temperature resistant insulating waterproof layer; an electrode layer, set up on the high temperature resistant heating layer, the thickness of the electrode layer is between 0.015-0.2 mm; the second high-temperature-resistant insulating waterproof layer covers the electrode layer, and the thickness of the second high-temperature-resistant insulating waterproof layer is a rigid body between 0.015 and 0.2 mm; and a lead wire electrically connected with the electrode layer to form a rigid heating film with a thickness within 0.6mm and a working temperature of 600 ℃.
By means of the technical characteristics, the rigid heating film prepared by the invention has stable structure because the heating material particles and the nano resin are bonded or connected through physical or mixed chemical bonding. The high-purity heating material particles are sprayed, the solvent is volatilized, the heating material particles are exposed on the surface of a material, molecules carry out effective radiation emission and radiation transmission to achieve uniform heating and heat exchange, the heating effect is rapidly achieved, and the working temperature (heating range) can reach 600 ℃. Furthermore, the invention solves the problem of heat-conducting spraying in the industry by the technical means of purification, and comprises the following steps of solving the problem that the high-purity heating material particles cannot be tightly arranged after being sprayed; and the problem that radiation emission is influenced because the heating material particles are wrapped by the common resin coating in a stirring and mixing mode is solved.
Drawings
Fig. 1A is an external view of a conventional electric heating furnace.
Fig. 1B is an internal schematic view of a conventional electric heating furnace.
FIG. 2 is a flow chart of the preparation process of the present invention.
Fig. 3A is an exploded perspective view (one) of the first possible embodiment of the present invention.
Fig. 3B is an exploded perspective view (two) of the first possible embodiment of the present invention.
Fig. 3C is a combined perspective view of the first possible embodiment of the present invention.
Fig. 4A is an exploded perspective view (one) of a second possible embodiment of the present invention.
Fig. 4B is an exploded perspective view (two) of a second possible embodiment of the present invention.
Fig. 4C is an assembled perspective view of a second possible embodiment of the present invention.
FIG. 5A is a reference view (I) showing the state of use of the rigid heat-generating film of the present invention.
FIG. 5B is a reference view showing the state of use of the rigid heat-generating film of the present invention.
Fig. 6 is a structural sectional view of the rigid heat generating film of the present invention.
Fig. 7A is a cross-sectional view of fig. 6 taken along line 7A-7A.
Fig. 7B is an enlarged schematic view of a portion of the structure in fig. 7A.
Fig. 8 is a sectional view of the high temperature resistant heat generating layer of the present invention.
FIG. 9 is a schematic view showing the temperature and time for the purification operation of the high temperature resistant heat generating layer of the present invention.
FIG. 10 is an electron microscope photograph of the high temperature resistant heat generating layer of the present invention.
FIG. 11 is a reference diagram of the rigid heating film of the present invention in use in an electric heating furnace.
FIG. 12 is a reference view showing a state where the rigid heat-generating film of the present invention is used in a thermal insulating mattress.
Fig. 13 is a reference view showing a state that the rigid heating film of the present invention is used in a floor heating system.
Description of the symbols:
10. a first high temperature resistant insulating waterproof layer
20. High temperature resistant layer that generates heat
20a high-temperature-resistant heat-generating material slurry
21. Nano resin
22. Exothermic material particles
30. Electrode layer
31. Conducting wire
40. Second high-temperature resistant insulating waterproof layer
Heating place of 40A electronic product
50. Rigid heating film
51. Electric heating stove
52. Thermal insulation pad
53. Floor heating
Detailed Description
The following description is provided for illustrative purposes and is not intended to limit the invention to the particular embodiments disclosed. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
First, referring to fig. 1 to 13, a method for manufacturing a rigid heat generating film of an electronic product according to the present invention includes the following steps:
a) Providing a first high temperature resistant insulating waterproof layer 10, wherein the first high temperature resistant insulating waterproof layer 10 is selected from a rigid body composed of any one or a combination of glass fiber, quartz or refractory ceramic, but is not limited thereto; a rigid body with the thickness of 0.015-0.2 mm. In this embodiment, the glass fiber glass) is an inorganic non-metallic material with excellent properties, and has the advantages of good insulation, strong heat resistance, good corrosion resistance, and high mechanical strength. It has a softening point of 500-750 deg.C, boiling point of 1000 deg.C, density of 2.4-2.76 g/cm3, tensile strength of 6.3-6.9 g/d in standard state, wet state of 5.4-5.8 g/d, density of 2.54g/cm3, good heat resistance, no influence on strength at 300 deg.C, excellent electric insulation, and is a high-grade electric insulating material and also used for heat insulating material. Therefore, the glass fiber is the best choice for the first high temperature resistant insulating waterproof layer 10.
b) As shown in fig. 3A to 3C, a layer of the heat-resistant and heat-generating material slurry 20a is disposed on the first heat-resistant insulating and water-proof layer 10, and the following methods of the present invention include spraying, brushing, rolling, pad printing, and transfer printing, which are not repeated and are not limited thereto.
The thickness of the high temperature resistant heating material slurry 20a is between 0.015-0.2 mm, the high temperature resistant heating material slurry 20a comprises heating material particles 22 which are selected from carbon spheres, carbon fibers, graphite or particles thereof, graphene, carbon nanotubes, boron nitride, artificial diamond, alumina, zirconia, rare earth and heat conducting metal particles, wherein any one or the combination of the carbon spheres, the carbon fibers, the graphite or the particles thereof is 25-85% by weight, and is mixed with 10-50% by weight of nanometer resin and 5-25% by weight of solvent medium; in this embodiment, the nano resin 21 may be an aqueous or oily nano resin; the waterborne nano resin 21 is selected from any one of waterborne nano epoxy modified acrylic acid or waterborne nano organic silicon (silicon) modified polyurethane or the combination thereof. The oily nano resin is selected from any one of solvent type nano epoxy modified acrylic acid or solvent type nano organic silicon (silicon) modified polyurethane or the combination thereof. The solvent is selected from esters, ketones and alcohols, and the components are adjusted according to the preparation method.
c) And purifying, namely drying the high-temperature-resistant heating material slurry 20a at a heat temperature of 120-150 ℃ for 30-50 minutes to volatilize media such as a solvent at a high temperature so as to improve the purity, wherein the high-temperature-resistant heating material slurry 20a and the first high-temperature-resistant insulating waterproof layer 10 are physically or mixed and chemically bonded or bridged through nano resin 21, so that the heating material particles 22 are exposed on the first high-temperature-resistant insulating waterproof layer 10 to the maximum extent and are stacked in a close arrangement without being wrapped, and the nano resin 21 generates silicate ions through a glycidyl polymerization reaction (shown in the following chemical reaction formula):
accordingly, the thermal material particles 22 are stably bonded to the first high temperature resistant insulating waterproof layer 10, as shown in fig. 3B, to form a high purity high temperature resistant heat generating layer 20; in this embodiment, the high temperature resistant heating layer 20 is formed by drying and purifying the high temperature resistant heating material slurry 20 a.
The most important technical feature of the present invention is the "purification", which means to separate the impurities in the mixture to improve the purity. FIG. 9 is a schematic view showing the temperature and time for the purification operation of the high temperature resistant heat generating layer according to the present invention; since the purity of the heat generating material particles 22 is one hundred percent, the heat generating material particles 22 are attached to the first high temperature-resistant insulating and waterproof layer 10, and thus, a medium such as a nano resin 21, a solvent, an auxiliary agent 8230, and the like must be added to the heat generating material particles by spraying or printing, and after the attachment, the high temperature-resistant heat generating material slurry 20a is dried at a high temperature of 120 to 150 ℃ for 30 to 50 minutes, so that the medium and the solvent are volatilized by the purification operation of the present invention, and the purity of the heat generating material particles 22 is more than 95%. If the temperature and time are not controlled properly, the effect of the purification operation is affected, and the heat-generating material particles 22 and the nano-resin 21 cannot be bridged by chemical reaction, thereby achieving the effect of stable structure.
Furthermore, as shown in fig. 8, after the high-purity graphene 22 is sprayed, the solvent and other media volatilize, the graphene 22 is exposed and attached to the surface of the first high-temperature-resistant insulating and waterproof layer 10 (material) by the nano resin 21, and the molecules of the heating material particles 22 perform effective radiation emission and radiation transmission to achieve uniform heating and heat exchange, thereby rapidly achieving the heating effect. Therefore, the most important technical means of the present invention, which is "purification", can solve the problems of heat dissipation spraying in the industry, including the first, solving the problem that the high-purity heating material particles 22 cannot be tightly arranged after spraying. Secondly, the problem that radiation emission is affected by the fact that the heating material particles 22 are wrapped by common resin coating in a stirring and mixing mode is solved.
d) An electrode layer 30 is pasted or printed on the high temperature resistant heating layer 20, and the thickness of the electrode layer is between 0.015 and 0.2 mm; in the present embodiment, the electrode layer 30 is made of a conductive metal material, and may be formed by means of attaching a copper foil or printing a silver paste, but is not limited thereto.
In the first embodiment, as shown in fig. 3A to 3C, the high temperature resistant heating layer 20 is fully distributed, but not limited thereto. As another example, in the second embodiment, as shown in fig. 4A to 4C, the high temperature resistant heating layer 20 may be in a line shape matching the shape of the electrode layer 30. This is because the high temperature resistant heating layer 20 has excellent thermal conductivity and can radiate heat energy, so that the line pattern can also perform effective radiation emission.
e) Covering a second high temperature resistant insulating waterproof layer 40 on the electrode layer 30, wherein the second high temperature resistant insulating waterproof layer 40 is selected from a rigid body formed by any one or combination of glass fiber, quartz or ceramic, and a rigid body with the thickness of 0.015-0.2 mm; in the present embodiment, however, the present invention is not limited thereto. That is, the second high temperature resistant insulating waterproof layer 40, as shown in fig. 5A and 5B, includes a part 40A to be heated of the product, and the part 40A to be heated of the electronic product is an insulator, such as ceramic, glass fiber or quartz, and the electrode layer 30 is directly attached to the part 40A to be heated of the product.
f) Providing a lead 31 electrically connected to the electrode layer 30, the lead 31 connecting the anode and the cathode, conducting electricity and then short-circuiting to generate heat, preparing a rigid heat-conducting film 50 with a thickness within 0.6mm, and the working temperature can reach 600 ℃.
As shown in fig. 6, the rigid heat generating film 50 of electronic products manufactured according to the features of the present invention comprises a first high temperature resistant insulating waterproof layer 10, a rigid body with a thickness of 0.015-0.2 mm of the first high temperature resistant insulating waterproof layer 10; a high temperature resistant heating layer 20 coated on the first high temperature resistant insulating waterproof layer 10, the thickness of the high temperature resistant heating layer 20 is between 0.015 mm to 0.2mm, and the heating material particles 22 are exposed on the first high temperature resistant insulating waterproof layer 10, closely arranged and stacked without being wrapped, so that the heating material particles 22 are stably combined on the first high temperature resistant insulating waterproof layer 10; an electrode layer 30 adhered or printed on the high temperature resistant heating layer 20, the thickness of the electrode layer is between 0.015 and 0.2 mm; a second high temperature resistant insulating waterproof layer 40 covering the electrode layer 30, the second high temperature resistant insulating waterproof layer 40 being a rigid body with a thickness of 0.015-0.2 mm; and a lead wire 31 electrically connected to the electrode layer 30 to form a rigid heat generating film 50 having a thickness of 0.6mm or less and a working temperature (heating range) of 600 ℃, thereby being an excellent heat generating material.
Based on the preparation method, the rigid heating film 50 prepared by the invention has the following effects:
1. the rigid heating film 50 of the present invention is bonded or bridged physically or chemically by the heating material particles 22 and the nano resin 21, so that the structure is stable; after the high-purity graphene is sprayed, the solvent is volatilized, the heating material particles 22 are exposed on the surface of the material, molecules are subjected to effective radiation emission and radiation transfer to achieve uniform heating and heat exchange to achieve an excellent heating effect, and the working temperature (heating range) of the high-purity graphene can reach 600 ℃. Therefore, the invention solves the problem of heat-conducting spraying in the industry by the technical means of purification, and comprises the following steps of solving the problem that the traditional high-purity heating material particles 22 cannot be tightly arranged after being coated; and solves the problem that radiation emission is influenced by the fact that the heating material particles 22 are wrapped by common resin coating in a stirring and mixing mode.
2. The rigid heat-conducting film 50 of the present invention has a thickness of 0.6mm or less, and is thin and rigid. Thus, the product applicability of the rigid thermally conductive film 50 of the present invention can be widely extended. For example, as shown in FIG. 11, a reference diagram of a state that the rigid heating film 50 is used in an electric heating furnace 51; or as disclosed in FIG. 12, the state of the rigid heating film 50 used in the heat insulating pad 52 is shown in the figure; or as disclosed in fig. 13, the rigid heating film 50 is used in a floor heating 53. Therefore, the rigid heating film 50 of the present invention can replace the conventional copper tube or rare earth heating method, and is more convenient to use and has a lower cost.
However, the drawings and descriptions disclosed above are only for the purpose of illustrating the preferred embodiments of the invention, and are not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A preparation method of a rigid heating film of an electronic product is characterized by comprising the following steps:
a) Providing a first high temperature resistant insulating waterproof layer, which is a rigid body formed by any one or the combination of glass fiber, quartz or refractory ceramic, and the thickness of the rigid body is between 0.015 and 0.2 mm;
b) Arranging a layer of high-temperature-resistant heating material slurry on the first high-temperature-resistant insulating waterproof layer, wherein the thickness of the high-temperature-resistant heating material slurry is 0.015-0.2 mm, the high-temperature-resistant heating material slurry comprises heating material particles which are formed by any one or a combination of carbon spheres, carbon fibers, graphite or particles thereof, graphene, carbon nanotubes, boron nitride, artificial diamond, alumina, zirconia, rare earth and heat-conducting metal particles, the weight ratio of the heating material particles is 25-85%, 10-50% of nano resin and 5-25% of solvent medium are mixed;
c) Performing purification operation, namely drying the high-temperature-resistant heating material slurry at the heat temperature of 120-150 ℃ for 30-50 minutes to volatilize a medium and a solvent at high temperature so as to improve the purity, performing physical or mixed chemical bonding or bridging on the high-temperature-resistant heating material slurry and the first high-temperature-resistant insulating waterproof layer through nano resin, exposing heating material particles on the first high-temperature-resistant insulating waterproof layer to the maximum extent, stacking the heating material particles in a close arrangement without being wrapped, and generating silicate ions through a shrinkage polymerization reaction on the nano resin so that the heating material particles are stably combined on the first high-temperature-resistant insulating waterproof layer to form a high-purity high-temperature-resistant heating layer;
d) An electrode layer is arranged on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm;
e) Covering a second high-temperature-resistant insulating waterproof layer on the electrode layer, wherein the second high-temperature-resistant insulating waterproof layer is a rigid body with the thickness of 0.015-0.2 mm; and
f) Providing a lead electrically connected with the electrode layer to prepare a rigid heating film with the thickness within 0.6mm, wherein the working temperature can reach 600 ℃.
2. The method for preparing a rigid heat-generating film for electronic products as claimed in claim 1, wherein in step e), the second high temperature-resistant insulating and waterproof layer includes a portion of the electronic product to be heated, and the portion of the electronic product to be heated is an insulator, and the electrode layer is directly attached to the portion of the product to be heated.
3. The method for preparing a rigid heating film for electronic products according to claim 1, wherein the nano resin in step b) comprises an aqueous or oily nano resin.
4. The method for preparing the rigid heating film of the electronic product as claimed in claim 3, wherein the aqueous nano resin is selected from any one or a combination of aqueous nano epoxy modified acrylic acid or aqueous nano organosilicon (silicon) modified polyurethane.
5. The method for preparing the rigid heating film of the electronic product as claimed in claim 3, wherein the oil-based nano resin is selected from any one of solvent-based nano epoxy modified acrylic acid or solvent-based nano silicone (silicon) modified polyurethane or a combination thereof.
6. The method according to claim 1, wherein in step c), the high temperature resistant heating layer is in a full-surface pattern or a line pattern matching the shape of the electrode layer, and in step d), the electrode layer is made of a conductive metal material.
7. An electronic product rigid heat-generating film prepared by the preparation method of any one of claims 1 to 7, comprising:
the first high-temperature-resistant insulating waterproof layer is a rigid body with the thickness of 0.015-0.2 mm;
a high temperature resistant heating layer coated on the first high temperature resistant insulating waterproof layer, the thickness of the high temperature resistant heating layer is between 0.015-0.2 mm, the high temperature resistant heating layer is provided with heating material particles, and the heating material particles are exposed on the first high temperature resistant insulating waterproof layer, are closely arranged and stacked without being wrapped, so that the heating material particles are stably combined on the first high temperature resistant insulating waterproof layer;
an electrode layer, set up on the high temperature resistant heating layer, the thickness of the electrode layer is between 0.015-0.2 mm;
the second high-temperature-resistant insulating waterproof layer covers the electrode layer, and is a rigid body with the thickness of 0.015-0.2 mm; and
a lead electrically connected with the electrode layer to form a rigid heating film with a thickness within 0.6mm and a working temperature of 600 ℃.
8. The rigid heat-generating film for electronic products of claim 7, wherein the second heat-resistant insulating and waterproof layer comprises a portion of the electronic product to be heated, and the electrode layer is directly attached to the portion of the electronic product to be heated.
9. The rigid heat generating film as claimed in claim 7, wherein the heat conducting layer is a full surface or a line shape matching the shape of the electrode layer.
10. The electronic product rigid heat generating film according to claim 7, wherein the electrode layer is made of a conductive metal material.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102730675A (en) * | 2012-07-13 | 2012-10-17 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conducting graphite membrane and preparation method thereof |
| CN105898907A (en) * | 2016-06-12 | 2016-08-24 | 杭州白熊科技有限公司 | Graphene heating film and preparation method thereof |
| JP2020047519A (en) * | 2018-09-20 | 2020-03-26 | 株式会社樫の木製作所 | Flexible sheet heating element |
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2021
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102730675A (en) * | 2012-07-13 | 2012-10-17 | 深圳市鸿富诚屏蔽材料有限公司 | High-heat-conducting graphite membrane and preparation method thereof |
| CN105898907A (en) * | 2016-06-12 | 2016-08-24 | 杭州白熊科技有限公司 | Graphene heating film and preparation method thereof |
| JP2020047519A (en) * | 2018-09-20 | 2020-03-26 | 株式会社樫の木製作所 | Flexible sheet heating element |
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