TWI785384B - Flexible heating film for electronic products and preparation method thereof - Google Patents

Abstract

A flexible heat-generating film for electronic products and a preparation method thereof, characterized in that: a layer of high-temperature-resistant heat-generating material is set on the high-temperature-resistant insulating waterproof layer by spraying, brushing, rolling, pad printing, transfer printing, etc., and adding Nano-resin and volatile solvents, after printing, carry out high-temperature purification and drying operations to allow the solvent to volatilize, forming a physical or mixed chemical bridge or bond with the addition of nano-inorganic resins in high-temperature-resistant heating materials, and become The high-purity heating layer is attached to the high-temperature-resistant insulating and waterproof layer, and an electrode layer is pasted or printed on the heating layer and covered with a high-temperature-resistant insulating and waterproof layer to prepare a flexible heating film with high radiant heat efficiency. Its working temperature (heating range) up to 600 degrees Celsius. The present invention maximizes the function of the high-temperature-resistant heating material, reduces the cost of using the high-temperature-resistant heating material and the limitation of the manufacturing process, and widely improves the products that can be used for the high-temperature-resistant heating material through the use of low-cost methods, and conducts industrial mass production to the greatest extent.

Description

Flexible heating film for electronic products and preparation method thereof

The invention relates to a flexible heating film for electronic products and a preparation method thereof, especially to a flexible heating film with high radiant heat benefit.

By the way, 3C electronic products such as electric furnaces, electric coffee pots, and water dispensers all use electric heating elements as heating sources, while the electric heating elements of traditional 3C electronic products are shown in Figure 1A and Figure 1B. An electric heating furnace 60 has a base 61 is provided with an electric heating plate 62, and the electric heating plate 62 provides a heat source through the electric heating copper tube 63 in the base 61. In this way, not only power consumption but also the setting of the electric heating tube 63 must cooperate with the cooling fan 64 and the control circuit 65 and other equipment, so it takes up more space, resulting in shortcomings such as the height (thickness) of the base 61 can not be reduced.

In recent years, based on the evolution of technology, electronic components have been miniaturized, and the thermal management issues derived from them have also received a certain amount of attention. Many high thermal conductivity materials such as silver, copper, and graphite sheets have been widely studied by scientists. Among them, the thermal conductivity of graphite sheet has attracted great attention. Due to the special two-dimensional honeycomb lattice carbon atomic structure of graphite sheet, its thermal conductivity is better than that of metal, so it is widely used in electronic components.

In the production process of traditional graphite flakes, firstly, chemicals are used to increase the purity and density of graphite flakes, and then a pressure greater than 30Mpa is applied to press the graphite flakes so that the graphite flakes are tightly combined with each other, and finally 1800- At a high temperature of 3000 degrees C, it takes several hours to obtain a graphite heat-conducting substrate, so not only will it consume a lot of energy, but the production time will be long. Therefore, how to develop a simple manufacturing process without using high pressure, high It is a difficult problem for those skilled in the art to break through the preparation of graphite heat-conducting materials through the process steps of high temperature.

However, in the traditional graphene film transfer process, there are generally the following three problems: first: before the transfer, the graphene film is exposed to the air for a long time, causing the surface in contact with the air to be polluted by suspended particles in the air, Traditional transfer methods utilize this contaminated surface to fabricate devices. Second: The traditional transfer method transfers the graphene film to a hard substrate. The bonding force between graphene and the substrate is only van der Waals force, which makes the graphene film easy to fall off. Third: The traditional transfer method requires complex steps. In the process of transferring from the metal substrate to the desired substrate, there are too many types of materials used, and it is easy to generate pollution on the graphene surface during the transfer process. And it is easy to cause the crystal structure of the graphene film to be destroyed. The above three defects limit the large-scale production and utilization of graphene films.

Therefore, the Chinese patent application publication No. CN102807208A discloses a graphene film transfer method to improve the problems existing in the above-mentioned graphene film transfer process. It is characterized in that: the graphene film is directly adhered to the polymer substrate, so that the graphene film and the polymer substrate form a covalent bond, and the side of the graphene film contacting the growth substrate is exposed, as a base for making functional devices Effective side. The implementation steps of the technical solution are as follows: step 1), melting or dissolving the polymer to make it in a fluid state; step 2), coating the polymer in a fluid state on a substrate grown with graphene, and solidifying the polymer Step 3), use ferric chloride or ferric nitrate solution to corrode the metal flakes, and clean the polymer film adhered to the graphene film, dry or dry to obtain the graphene film transferred to the polymer material .

Next, the Chinese application publication number is CN105898907A patent, which discloses a graphene heating film and its preparation method, which is characterized in that it includes a first insulating waterproof layer, an electrode layer, a heating film layer and a second insulating waterproof layer, the first insulating The waterproof layer, the electrode layer, the heat-generating film layer and the second insulating waterproof layer are pasted into one structure, and the heat-generating film layer is a graphene film. The implementation steps of the technical solution are as follows: 1), making the graphene film; 2), covering the adhesive for bonding on the second insulating waterproof layer; 3), bonding the second insulating waterproof layer and the graphene film into one; 4), removing the metal matrix on the graphene film; 5), pasting the electrode layer on the graphene film; 6), pasting the first insulating and waterproof layer on the electrode layer; 7), connecting the electrode layer to the wire.

However, the graphene surface produced by the traditional graphene preparation method has many surface defects, and the graphene sheets are prone to folding and curling, which affects the performance of graphene, and the graphene surface obtained after reduction has almost no oxidation groups. , so its surface is hydrophobic, making it easy to agglomerate and settle in water and some common organic solvents. At present, there are many methods for preparing graphene heating film, but it is still very difficult to prepare a graphene film with excellent electrical properties and no pollution. The main difficulty lies in how to transfer the graphene film to the target substrate and prepare a complete , No damage, stable process, reliable graphene heating (heat conduction) film.

Furthermore, the graphene industry’s problems in thermal spraying also include: the problem that the highest-purity graphene cannot be arranged closely after spraying; and the problem that general resin coatings use stirring and mixing to wrap graphene, which affects radiation emission.

In addition, the thickness of the graphene heat-generating (heat-conducting) film is not easy to reduce, and most of them are not flexible. In this way, many problems will arise and it will be difficult to implement in the subsequent application of 3C products, so it is very troublesome for the industry.

Therefore, how to solve the above problems of the traditional graphene heating (heat conducting) film is the main subject of the present invention.

The main purpose of the present invention is to provide a flexible heat-generating film for electronic products and its preparation method, which can maximize the function of heat-generating material particles (such as graphene) and achieve the effect of high heat-generating properties.

Another object of the present invention is to provide a flexible heat-generating film for electronic products and its preparation method, which can reduce the limitation of using heat-generating material particles, widely increase the products that can be used with heat-generating material particles through the use of coating methods, and achieve the largest industry batch Production.

In order to achieve the above-mentioned effect, the method adopted by the present invention comprises the following steps: a). A first high temperature resistant insulating waterproof layer is provided, and the thickness of the first high temperature resistant insulating waterproof layer is flexible between 0.015 ~ 0.2mm. body; b). On the first high-temperature-resistant insulating and waterproof layer, a layer of high-temperature-resistant heating material slurry is arranged. The thickness of the high-temperature-resistant heating material slurry is between 0.015 and 0.2 mm. The high-temperature-resistant heating material slurry is selected from: Heating materials composed of carbon spheres, carbon fibers, graphite or its particles, graphene, carbon nanotubes, boron nitride, artificial diamonds, alumina, zirconia, rare earths, and heat-conducting metal particles, any of them or their combination Particles, whose weight ratio is 15-70%, mixed with nano-resin with a weight ratio of 25-60%, and a solvent medium with a weight ratio of 5-25%; c). Purification operation: drying the high-temperature-resistant heating material slurry at a temperature of 120°C~150°C for 30 to 50 minutes, volatilizing the medium and solvent at high temperature to improve the purity, and the high-temperature-resistant heating material slurry and The first high temperature resistant insulating and waterproof layer is physically or mixed chemically bonded or bridged by nano-resin, so that the exothermic material particles are exposed on the first high temperature resistant insulating and waterproof layer to the greatest extent, and are closely arranged and stacked Without being wrapped, the nano-resin produces silicate ions through shrinkage polymerization reaction, so that the heat-generating material particles are stably combined on the first high-temperature-resistant insulating waterproof layer to form a high-purity high-temperature-resistant heat-generating layer; d). An electrode layer is arranged on the heating layer, and the thickness of the electrode layer is between 0.015 ~ 0.2mm; e). A second high temperature resistant insulating waterproof layer is covered on the electrode layer, and the thickness of the second high temperature resistant insulating waterproof layer is A flexible body between 0.015mm and 0.2mm; and f). A wire is provided to electrically connect with the electrode layer to prepare a flexible heating film with a thickness within 0.6mm.

According to the features disclosed above, the first high-temperature-resistant insulating and waterproof layer and the second high-temperature-resistant insulating and waterproof layer can be selected from any one of PE film, PVC film, PET film, glass fiber or ceramic fiber paper or a combination thereof. constitute.

According to the characteristics disclosed above, the nano-resin is water-based or oil-based. Wherein, the water-based nano-resin is selected from: water-based nano-epoxy-modified acrylic acid or water-based nano-organosilicon-modified polyurethane. Wherein, the oily nano-resin is selected from: solvent-based nano-epoxy-modified acrylic acid or solvent-based nano-organosilicon-modified polyurethane.

According to the features disclosed above, the high-temperature-resistant heat-conducting layer may be in the form of covering the entire surface or in the form of lines matching the shape of the electrode layer.

According to the aforementioned features, the electrode layer may be made of conductive metal material.

According to the characteristics disclosed above, the flexible heat-conducting film for electronic products produced by the present invention includes: a first high-temperature-resistant insulating and waterproof layer, the thickness of the first high-temperature-resistant insulating and waterproof layer is flexible between 0.015 and 0.2 mm. body; a high-temperature-resistant heating layer, coated on the first high-temperature-resistant insulating and waterproof layer, the thickness of the high-temperature-resistant heating layer is between 0.015 and 0.2 mm, and it has heating material particles, and the heating material particles are exposed on the The first high-temperature-resistant insulating and waterproof layer is closely arranged and stacked without being wrapped, so that the heating material particles are stably combined on the first high-temperature-resistant insulating and waterproof layer; an electrode layer is arranged on the high-temperature-resistant heating layer, The thickness of the electrode layer is between 0.015~0.2mm; a second high temperature resistant insulating and waterproof layer covering the electrode layer, the thickness of the second high temperature resistant insulating and waterproof layer is a flexible body between 0.015~0.2mm ; and a wire electrically connected to the electrode layer to form a flexible heating film with a thickness within 0.6mm.

With the help of the technical features disclosed above, the flexible heating film prepared by the present invention, the heating material particles and the nano-resin are physically or mixed chemically bonded or bridged, and the structure is stable. High-purity heating material particles, the solvent volatilizes after spraying, the heating material particles are exposed on the surface of the material, the molecules carry out effective radiation emission, radiation transfer, achieve uniform heat, heat exchange, quickly achieve the heating effect, and its working temperature (heating range) can reach 600 degrees Celsius. Furthermore, the present invention uses "purification" technology to solve the problems of heat-conducting spraying in the industry, including: solving the problem that high-purity heat-generating material particles cannot be closely arranged after spraying; launch problem.

10: The first high temperature resistant insulation and waterproof layer

20: High temperature resistant heating layer

20a: high temperature resistant heating material slurry

21: Nano resin

22: Heating material particles

30: electrode layer

31: wire

40: The second high temperature resistant insulation and waterproof layer

50: Flexible heating film

51: electric furnace

52: Insulation pad

53: floor heating

54: heating tube

FIG. 1A is a schematic view of the appearance of a conventional electric furnace.

FIG. 1B is a schematic diagram of the interior of a conventional electric furnace.

Fig. 2 is a flow chart of the preparation method of the present invention.

Fig. 3A is an exploded perspective view (1) of the first possible embodiment of the present invention.

Fig. 3B is an exploded perspective view (2) of the first possible embodiment of the present invention.

Fig. 3C is an assembled perspective view of the first possible embodiment of the present invention.

FIG. 4A is an exploded perspective view (1) of the second possible embodiment of the present invention.

Fig. 4B is an exploded perspective view (2) of the second possible embodiment of the present invention.

Fig. 4C is an assembled perspective view of the second possible embodiment of the present invention.

Fig. 5A is a reference diagram (1) of the use state of the flexible heating film of the present invention.

Fig. 5B is a reference diagram (2) of the use state of the flexible heating film of the present invention.

Fig. 6 is a cross-sectional view of the structure of the flexible heating film of the present invention.

FIG. 7A is a sectional view of section 7A-7A in FIG. 6 .

FIG. 7B is an enlarged schematic view of a part of the structure in FIG. 7A .

Fig. 8 is a cross-sectional view of the high temperature heat-resistant layer of the present invention.

Fig. 9 is a schematic diagram of the temperature and time for the purification operation of the high-temperature-resistant heat-generating layer of the present invention.

Fig. 10 is an electron micrograph of the high temperature resistant heat generating layer of the present invention.

Fig. 11 is a reference view of the flexible heating film of the present invention used in an electric furnace.

Fig. 12 is a reference diagram of the state of using the flexible heating film of the present invention on a thermal insulation pad.

Fig. 13 is a reference view of the flexible heating film of the present invention used in floor heating.

Fig. 14 is a reference view of the state of the flexible heating film used in the heating pipe of the present invention.

The implementation of the present invention is described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

First of all, please refer to Figures 1 to 14, a method for preparing a flexible heating film for electronic products according to the present invention includes the following steps:

a). Provide a first high temperature resistant insulating and waterproof layer 10, the thickness of the first high temperature resistant insulating and waterproof layer 10 is a flexible body between 0.015 and 0.2mm; in this embodiment, the first high temperature resistant insulating and waterproof layer 10, selected from: a PE film, PVC film, PET film, glass fiber or ceramic fiber paper any one of them or a combination thereof, but not limited thereto. In this embodiment, the glass fiber (Fibreglass) is an inorganic non-metallic material with excellent performance, which has the advantages of good insulation, strong heat resistance, good corrosion resistance, and high mechanical strength. Its softening point is 500~750°C, boiling point is 1000°C, density is 2.4~2.76g/cm3, tensile strength is 6.3~6.9g/d in standard state, 5.4~5.8g/d in wet state, density 2.54g/cm3 cm3, good heat resistance, no effect on strength when the temperature reaches 300°C, excellent electrical insulation, is an advanced electrical insulation material, and is also used for heat insulation materials. Therefore, it is an excellent choice to use glass fiber as the first high-temperature-resistant insulating and waterproof layer 10 .

b). As shown in Figure 3A ~ Figure 3C, on the first high temperature resistant insulating waterproof layer 10, a layer of high temperature resistant heat generating material slurry 20a is set, and the "setting" method described below in the present invention includes: spraying, brushing , roll coating, pad printing, transfer printing, etc., will not be described in detail, and are not limited thereto.

The thickness of the high-temperature-resistant heating material slurry 20a is between 0.015 and 0.2mm, and the high-temperature-resistant heating material slurry 20a contains: carbon spheres, carbon fibers, graphite or its particles, graphene, nano Carbon tubes, boron nitride, artificial diamonds, alumina, zirconia, rare earth, heat-conducting metal particles, any one of them or a combination thereof constitutes heat-generating material particles 22, the weight ratio of which is 15-70%, and mixed with a weight ratio of 25~60% nano resin 21, and a solvent medium with a weight ratio of 5~25%; in this embodiment, the nano resin 21 can be water-based or oily; wherein the water-based nano-resin 21 is selected from: water-based Nano-epoxy modified acrylic or water-based nano-organosilicon modified polyurethane...etc. The oil-based nano resin is selected from: solvent-based nano-epoxy-modified acrylic or solvent-based nano-organosilicon-modified polyurethane. The solvent is selected from esters, ketones, and alcohols, and the components are adjusted according to the prepared method.

c). Purification operation: drying the high-temperature-resistant heat-generating material slurry 20a at a temperature of 120°C to 150°C for 30 to 50 minutes, volatilizing solvents and other media at high temperature to improve the purity, and the high-temperature-resistant heat-generating material slurry 20a and the first high temperature resistant insulating waterproof layer 10 are physically or mixed chemically bonded or bridged by nano resin 21, so that the exothermic material particles 22 are exposed on the first high temperature resistant insulating waterproof layer 10 to the greatest extent. , and are closely arranged and stacked without being wrapped, and the nano-resin 21 produces silicate ions through shrinkage polymerization (as shown in the following chemical reaction formula):

Accordingly, the thermal material particles 22 are stably combined on the first high-temperature-resistant insulating and waterproof layer 10, as shown in FIG. 3B, forming a high-purity high-temperature-resistant heating layer 20; It is formed by drying and purifying the high-temperature-resistant heat-generating material slurry 20a.

The "purification" operation mentioned above is the most important technical feature of the present invention. The so-called "purification" (Purify) refers to separating the impurities in the mixture to improve its purity. Fig. 9 is a schematic diagram of the temperature and time of the purification operation of the high-temperature heat-resistant layer of the present invention; The particle 22 is originally 100% pure, but because it needs to be attached to the first high-temperature-resistant insulating and waterproof layer 10, it is necessary to add nano-resin 21, solvents, additives... and other media to be attached by spraying or printing. The heat-resistant heating material slurry 20a is dried for 30 to 50 minutes at a high temperature of ℃~150℃, so that the purification operation of the present invention can volatilize the medium and solvent, so that the purity of the heating material particles 22 can reach more than 95%. If the temperature and time are not properly controlled, the effect of the purification operation will be affected, and the heat-generating material particles 22 and the nano-resin 21 cannot be bridged through chemical reactions to achieve a stable structure.

Furthermore, as shown in Figure 8, after the high-purity graphene 22 is sprayed, the medium such as the solvent volatilizes, and the graphene 22 is exposed and adhered to the surface of the first high-temperature-resistant insulating and waterproof layer 10 (material) by the nano-resin 21. The particles 22 of the heating material carry out effective radiation emission and radiation transfer to achieve uniform heating and heat exchange to quickly achieve the heating effect. Therefore, the most important "purification" technical means of the present invention can solve the problems of thermal spraying in the industry, including: first, solving the problem that the high-purity heating material particles 22 cannot be closely arranged after spraying. Second, solve the problem that the general resin paint wraps the heat-generating material particles 22 by stirring and mixing, which affects the radiation emission.

d). Paste or print an electrode layer 30 on the high temperature resistant heating layer 20, the thickness of the electrode layer is between 0.015~0.2mm; in this embodiment, the electrode layer 30 is made of conductive metal material, which can be It can be achieved by pasting copper foil or printing silver paste, but not limited thereto.

In the first embodiment, as shown in FIG. 3A to FIG. 3C , the high-temperature-resistant heat-generating layer 20 is in the form of covering the entire surface, but it is not limited thereto. As another example in the second embodiment, as shown in Figures 4A to 4C, the high temperature resistant heat generating layer 20 can be in the shape of a line matching the shape of the electrode layer 30 state. This is because the high-temperature-resistant heat-generating layer 20 has excellent thermal conductivity and can radiate heat energy, so the line shape can also perform effective radiation emission.

e). Covering the electrode layer 30 with a second high temperature resistant insulating waterproof layer 40, the second high temperature resistant insulating waterproof layer 40 is a flexible body with a thickness between 0.015mm and 0.2mm; in this embodiment, the second high temperature resistant insulating waterproof layer 40 is a flexible body; The second high temperature resistant insulating and waterproof layer 40 is selected from any one of PE film, PVC film, PET film, glass fiber or ceramic fiber paper or a combination thereof, but is not limited thereto.

f). Provide a wire 31 to electrically connect with the electrode layer 30. The wire 31 connects the anode and the cathode, conducts a short circuit and generates heat, and prepares a flexible heat-conducting film 50 with a thickness within 0.6 mm.

As shown in Figure 6, the flexible heating film 50 for electronic products made according to the features disclosed above in the present invention includes: a first high temperature resistant insulating and waterproof layer 10, the thickness of the first high temperature resistant insulating and waterproof layer 10 is between 0.015 A flexible body between ~0.2 mm; a high temperature resistant heating layer 20, coated on the first high temperature resistant insulating waterproof layer 10, the thickness of the high temperature resistant heating layer 20 is between 0.015 ~ 0.2 mm, and heat The material particles 22 are exposed on the first high-temperature-resistant insulating and waterproof layer 10, and are closely arranged and stacked without being wrapped, so that the heat-generating material particles 22 are stably combined on the first high-temperature-resistant insulating and waterproof layer 10; an electrode layer 30 is pasted Or printed on the high-temperature-resistant heating layer 20, the thickness of the electrode layer is between 0.015~0.2mm; a second high-temperature-resistant insulating and waterproof layer 40 covers the electrode layer 30, and the second high-temperature-resistant insulating and waterproof layer 40 is a flexible body with a thickness between 0.015 and 0.2mm; and a wire 31 is electrically connected to the electrode layer 30 to form a flexible body with a thickness within 0.6mm. The heating film 50 has an operating temperature (heating range) of up to 600 degrees Celsius, so it is an excellent heating material.

Based on the above preparation method, the flexible heating film 50 prepared by the present invention has the following effects to be clarified:

1. The flexible heating film 50 of the present invention is physically or mixed chemically bonded or bridged by the heating material particles 22 and the nano-resin 21, so the structure is stable; high-purity graphene, after spraying, the solvent volatilizes and generates heat The material particles 22 are exposed on the surface of the material, and the molecules carry out effective radiation emission and radiation transfer to achieve uniform heating and heat exchange to achieve an excellent heating effect, and its working temperature (heating range) can reach 600 degrees Celsius. Therefore, the present invention uses "purification" technology to solve the problems of thermal spraying in the industry, including: solving the problem that the traditional high-purity heating material particles 22 cannot be closely arranged after coating; package, while affecting radiation emission issues.

2. The thickness of the flexible heat-conducting film 50 of the present invention can be within 0.6 mm, which is thin and flexible. Therefore, it can be bent as shown in FIG. 5A, or can be rolled into a circular tubular use state as shown in FIG. 5B. In this way, the product applicability of the flexible heat-conducting film 50 of the present invention can be widely expanded. . For example: as disclosed in Figure 11, the reference diagram of the state of the flexible heating film 50 used in the electric furnace 51; or as disclosed in Figure 12, the reference diagram of the state of the flexible heating film 50 used in the insulation pad 52; or As shown in Figure 13, this flexible heat-generating film 50 is used in the state reference diagram of floor heating 53; Of course, it can also be disclosed in Figure 14, this flexible heat-conducting film 50 is used in the state reference diagram of heating pipe 54; The heat-generating film 50 can be rolled into a circular tube shape, so the heating tube 54 of the water heater can be heated. Therefore, the flexible heat-generating film 50 of the present invention can replace the traditional heating method of copper tube or clay, which is more convenient to use and lower in cost to improve the effect.

To sum up, the technical means disclosed in the present invention do have the requirements of invention patents such as "novelty", "progressiveness" and "suitable for industrial use". I pray that the Jun Bureau will grant patents to encourage inventions. sense of virtue.

However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those who are familiar with the art according to the spirit of this case should still be included in the scope of the patent application of this case.

Claims (9)

A method for preparing a flexible heating film for an electronic product, comprising the following steps: a). Providing a first high temperature resistant insulating waterproof layer, the thickness of the first high temperature resistant insulating waterproof layer is a flexible body between 0.015 mm and 0.2 mm, And the first high-temperature-resistant insulating waterproof layer can be selected from: a PE film, PVC film, PET film, glass fiber or ceramic fiber paper, or any combination thereof; b). In the first high-temperature-resistant insulating On the waterproof layer, a layer of high-temperature-resistant heating material slurry is arranged. The thickness of the high-temperature-resistant heating material slurry is between 0.015 and 0.2 mm. Graphene, carbon nanotubes, boron nitride, artificial diamonds, alumina, zirconia, rare earth, heat-conducting metal particles, any one of them or a combination thereof constitutes heat-generating material particles, the weight ratio of which is 15-70%, and It is composed of nano-resin with a weight ratio of 25~60% and a solvent medium with a weight ratio of 5~25%; c). Purification operation: the high temperature resistant heating material slurry is processed at a temperature of 120°C~150°C Dry for 30 to 50 minutes, volatilize the medium and solvent at high temperature to improve the purity, and the high temperature resistant heating material slurry and the first high temperature resistant insulating waterproof layer are physically or mixed chemically bonded or bonded by nano-resin Bracketing, so that the exothermic material particles are exposed on the first high temperature resistant insulating waterproof layer to the greatest extent, and are closely arranged and stacked without being wrapped, and the nano-resin produces silicate ions through shrinkage polymerization reaction, so that the exothermic material particles are stable Combined with the first high-temperature-resistant insulating and waterproof layer to form a high-purity high-temperature-resistant heating layer; d). An electrode layer is arranged on the heating layer, and the thickness of the electrode layer is between 0.015 and 0.2 mm; e) .The electrode layer is covered with a second high temperature resistant insulating waterproof layer, the thickness of the second high temperature resistant insulating waterproof layer is a flexible body between 0.015~0.2mm, and the second high temperature resistant insulating waterproof layer The water layer can be selected from and include: a PE film, PVC film, PET film, glass fiber or ceramic fiber paper, any one of them or a combination thereof; and f). A wire is provided to be electrically connected to the electrode layer to prepare a Flexible heating film with thickness within 0.6mm. The method for preparing a flexible heat-generating film for electronic products as claimed in claim 1, wherein, in step b), the nano-resin is water-based or oil-based. The method for preparing a flexible heat-generating film for electronic products as described in Claim 2, wherein the water-based nano-resin is selected from: water-based nano-epoxy-modified acrylic acid or water-based nano-organosilicon-modified polyurethane. The method for preparing a flexible heat-generating film for electronic products as described in Claim 2, wherein the oily nano-resin is selected from: solvent-based nano-epoxy-modified acrylic acid or solvent-based nano-organosilicon-modified polyurethane. The method for preparing a flexible heat-generating film for electronic products as described in claim 1, wherein, in step c), the high-temperature-resistant heat-generating layer includes a pattern covering the entire surface or a pattern of lines matching the shape of the electrode layer . The method for preparing a flexible heat-generating film for electronic products according to claim 1, wherein, in step d), the electrode layer is made of conductive metal material. A flexible heating film for electronic products made by any one of claims 1 to 6, comprising: the first high temperature resistant insulating and waterproof layer, the thickness of the first high temperature resistant insulating and waterproof layer is 0.015~ Flexible body between 0.2mm; The high-temperature-resistant heating layer is coated on the first high-temperature-resistant insulating and waterproof layer, the thickness of the high-temperature-resistant heating layer is between 0.015 and 0.2 mm, and it has heating material particles, and the heating material particles are exposed on the first high-temperature-resistant heating layer. A high-temperature-resistant insulating and waterproof layer is closely arranged and stacked without being wrapped, so that the heating material particles are stably combined on the first high-temperature-resistant insulating and waterproof layer; the electrode layer is arranged on the high-temperature-resistant heating layer. The thickness of the layer is between 0.015~0.2mm; the second high temperature resistant insulating and waterproof layer is covered on the electrode layer, and the thickness of the second high temperature resistant insulating and waterproof layer is a flexible body between 0.015~0.2mm; and The wire is electrically connected with the electrode layer, so as to form the flexible heating film with a thickness within 0.6 mm. The flexible heat-generating film for electronic products according to claim 7, wherein the high-temperature-resistant heat-generating layer is in the form of covering the entire surface or in the form of lines matching the shape of the electrode layer. The flexible heating film for electronic products according to claim 7, wherein the electrode layer is made of conductive metal material.

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