CN115207247B - Display panel and display device - Google Patents
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- CN115207247B CN115207247B CN202210837390.2A CN202210837390A CN115207247B CN 115207247 B CN115207247 B CN 115207247B CN 202210837390 A CN202210837390 A CN 202210837390A CN 115207247 B CN115207247 B CN 115207247B
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
Abstract
The application provides a display panel and a display device, wherein the display panel comprises a plurality of pixel units, a plurality of elastic lead layers and an elastic packaging layer which are independently arranged into islands; each elastic lead layer is connected with one pixel unit; the elastic packaging layer is used for coating the pixel units and the elastic lead layers. In the stretching process of the display panel, the stretching stress acts on the elastic lead layer and the elastic packaging layer, so that the pixel unit cannot be pulled by the stress to fail.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
Today, where flexible electronic devices are emerging, stretchable screens are the next target for aiming in the display field. The stretchable screen is elastic just like a rubber band and can realize free form. Compared with flexible display screens such as bendable and foldable display screens, the application of the stretchable screen has larger freedom degree and play space, and is used in the fields of intelligent equipment, airplane and automobile display, wearable electronic products and the like.
However, in the process of stretching the stretchable panel, the pixel units, the leads, etc. in the display panel in the stretchable panel are easily pulled by stress to fail, and an effective solution needs to be found to solve the structural damage caused by deformation.
Disclosure of Invention
The embodiment of the application provides a display panel and a display device, wherein in the stretching process of the display panel, the stretching stress acts on an elastic lead layer and an elastic packaging layer, so that the pixel unit cannot be pulled by the stress to fail.
The embodiment of the application provides a display panel, which comprises:
a plurality of pixel units independently formed into islands;
a plurality of elastic lead layers, each of which is connected with one of the pixel units;
and the elastic packaging layer is used for coating the pixel units and the elastic lead layers.
In some embodiments, the elastic packaging layer includes a base and a cover plate, the elastic lead layer and the pixel unit are disposed on the base, and the cover plate covers the elastic lead layer and the pixel unit.
In some embodiments, a groove is provided on the base, and the resilient lead layer is disposed within the groove.
In some embodiments, the thickness of the base is 100 μm to 2000 μm.
In some embodiments, the pixel cell includes an OLED device layer, which is either an AMOLED device layer or a PMOLED device layer, and an encapsulation layer on the OLED device layer.
In some embodiments, the packaging layer includes a first thin film packaging layer, an organic layer and a second thin film packaging layer, wherein the first thin film packaging layer, the organic layer and the second thin film packaging layer are stacked, the OLED device layer includes an OLED array substrate and a light emitting layer group on the OLED array substrate, the first thin film packaging layer is disposed on one side of the light emitting layer group away from the OLED array substrate, the first thin film packaging layer and the OLED array substrate jointly cover the light emitting layer group, the organic layer is disposed on one side of the first thin film packaging layer away from the OLED array substrate, the second thin film packaging layer is disposed on one side of the light emitting layer group away from the OLED array substrate, and the second thin film packaging layer and the OLED array substrate jointly cover the light emitting layer group and the organic layer.
In some embodiments, the resilient lead layer includes a first lead layer and a second lead layer isolated from each other; the OLED array substrate comprises a first flexible substrate, a first liner, a second liner, a first buffer layer, a first source drain metal layer, a second source drain metal layer, an insulating layer, a first anode, a second anode, a flat layer and a conductor layer, wherein the first liner and the second liner are mutually isolated, the first liner and the second liner are arranged on the first flexible substrate, the first liner is electrically connected with the first lead layer, and the second liner is electrically connected with the second lead layer; the first buffer layer is arranged on the first liner, the second liner and the first flexible substrate; the first source drain metal layer and the second source drain metal layer are isolated from each other, the first source drain metal layer and the second source drain metal layer are arranged on one side, far away from the first flexible substrate, of the first buffer layer, the first source drain metal layer is connected with the first liner, and the second source drain metal layer is connected with the second liner; the insulating layer is arranged on one side, far away from the first flexible substrate, of the first buffer layer, and the insulating layer covers the first source drain metal layer and the second source drain metal layer; the first anode and the second anode are arranged on one side, far away from the first flexible substrate, of the insulating layer, the first anode is connected with the first source drain metal layer, and the second anode is respectively connected with the second source drain metal layer and the light-emitting layer group; the flat layer is arranged on one side of the insulating layer away from the first flexible substrate; the conductor layer is arranged on one side, far away from the first flexible substrate, of the flat layer, and is respectively connected with the first anode and the light-emitting layer group.
In some embodiments, the display panel further includes a second flexible substrate and a second buffer layer, the second flexible substrate being disposed between the first buffer layer and the insulating layer; the second buffer layer is arranged between the second flexible substrate and the insulating layer, and the first source drain metal layer and the second source drain metal layer are arranged on one side, far away from the first flexible substrate, of the second buffer layer.
In some embodiments, the packaging layer is a third thin film packaging layer, the OLED device layer includes an OLED array substrate and a light emitting layer group located on the OLED array substrate, the third thin film packaging layer is disposed on a side of the light emitting layer group away from the OLED array substrate, and the third thin film packaging layer and the OLED array substrate jointly cover the light emitting layer group.
The embodiment of the application also provides a display device, which comprises the display panel and a chip, wherein the display panel is connected with the chip.
The display panel provided by the embodiment of the application comprises a plurality of pixel units which are independently formed into islands, a plurality of elastic lead layers and an elastic packaging layer, wherein the pixel units and the elastic lead layers connected with the pixel units are covered by the elastic packaging layer, the plurality of pixel units are protected by the elastic packaging layer, and the elastic lead layers transmit electric signals to the pixel units. Because of the effect of the elastic material packaging layer and the elastic lead layer, the elastic material packaging layer wraps the pixel units and the elastic lead layers, so that the tensile stress acts on the elastic lead layers and the elastic packaging layer when the display panel is stretched, and the pixel units cannot be pulled by the stress to fail.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a first structure of a display panel according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a second structure of a display panel according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a third structure of a display panel according to an embodiment of the present application.
Fig. 4 is a schematic diagram of a fourth structure of a display panel according to an embodiment of the present application.
Fig. 5 is a schematic view of a fifth structure of a display panel according to an embodiment of the present application.
Fig. 6 is a schematic diagram of a sixth structure of a display panel according to an embodiment of the present application.
Fig. 7 is a schematic view of a seventh structure of a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Today, where flexible electronic devices are emerging, stretchable screens are the next target for aiming in the display field. The stretchable screen is elastic just like a rubber band and can realize free form. Compared with flexible display screens such as bendable and foldable display screens, the application of the stretchable screen has larger freedom degree and play space, and is used in the fields of intelligent equipment, airplane and automobile display, wearable electronic products and the like.
In order to realize the stretching of the screen, the display panel needs to be specially designed. At present, a main scheme of a stretching screen display panel is to use metal wires with relatively good extensibility to connect pixel islands, and all inorganic layers, organic layers and brittle metal layers which are not stretch-proof among the pixel islands are removed. The metal trace shape between the pixel islands is designed into an S-shaped shape and the like. The pixel unit is basically deformation-free when stretched due to the lamination of the high-modulus film layers, and the stretching deformation mainly comes from metal wires between pixel islands. However, the stretching ratio of the suspended metal wires among the islands is low, so that the stretching ratio of the structure is difficult to increase. Because of the island-like structure of the stretching display, the development difficulty of a Micro-Light-Emitting Diode (Micro-Light-Emitting Diode) based chip is low. However, the screen based on the Micro-LED chip also has the problems of high cost, low yield, difficult improvement of PPI (pixel density) and low efficiency of the Micro-LED chip when working at low current density, so that the manufacturing of the stretchable display panel based on the OLED display technology can avoid a series of problems of stretching display based on the Micro-LED.
In the process that the stretchable screen is stretched, pixel units, leads and the like in a display panel in the stretchable screen are easily pulled by stress to fail, and an effective scheme needs to be found to solve structural damage caused by deformation.
Therefore, the embodiment of the application provides a display panel and a display device, wherein the pixel unit and the elastic lead layer cannot be pulled by stress to fail in the stretching process of the display panel. The following description is made in detail with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic diagram of a first structure of a display panel according to an embodiment of the disclosure.
The embodiment of the application provides a display panel 100, wherein the display panel 100 comprises a plurality of pixel units 110, a plurality of elastic lead layers 120 and an elastic packaging layer 130 which are independently formed into islands; each elastic lead layer 120 is connected to one pixel unit 110, and the elastic packaging layer 130 encapsulates the plurality of pixel units 110 and the plurality of elastic lead layers 120.
It can be appreciated that the film layer with poor extensibility around the pixel unit 110 is removed, for example, a film layer structure made of inorganic material, organic material or metal material. After the pixel unit 110 is connected to the elastic lead layer 120, it is encapsulated by the elastic encapsulation layer 130. Since the pixel cells 110 comprise a stack of high modulus film layers, there is substantially no deformation during stretching, the stretching deformation is mainly due to the elastic encapsulation layer 130 and the elastic lead layer 120 between the plurality of pixel cells 110 that are independently islands, and the shape can be restored at the end of stretching.
The material of the elastic encapsulation layer 130 may be PDMS (polydimethylsiloxane).
The elastic lead layer 120 has elasticity, can conduct electricity, and can be used for transmitting electric signals to the pixel unit 110. The pixel unit 110 may be one or more of RGB sub-pixels.
The display panel 100 provided in this embodiment of the present application includes a plurality of pixel units 110 that are independently formed into islands, a plurality of elastic lead layers 120 and an elastic packaging layer 130, the pixel units 110 and the elastic lead layers 120 connected with the pixel units 110 are covered by the elastic packaging layer 130, the elastic packaging layer 130 protects the plurality of pixel units 110, the elastic lead layers 120 transmit electrical signals to the pixel units 110, and due to the effect of the elastic material packaging layer 112 and the elastic lead layers 120, the tensile stress acts on the elastic lead layers 120 and the elastic packaging layer 130 in the process of being stretched, so that the pixel units 110 cannot be pulled by the stress to fail.
In some embodiments, referring to fig. 2, fig. 2 is a schematic diagram of a second structure of a display panel according to an embodiment of the present application. The elastic packaging layer 130 includes a base 131 and a cover 132, the elastic lead layer 120 and the pixel unit 110 are disposed on the base 131, and the cover 132 covers the elastic lead layer 120 and the pixel unit 110.
The specific manufacturing method of the display panel 100 may be to provide a base 131, sequentially disposing the elastic lead layer 120 and the pixel unit 110 on the base 131, disposing a cover 132 on a side of the elastic lead layer 120 and the pixel unit 110 away from the base 131, and extending the cover 132 to the base 131, so that the cover 132 and the base 131 together encapsulate the elastic lead layer 120 and the pixel unit 110.
With continued reference to fig. 2, the base 131 is provided with a groove 1311, and the elastic lead layer 120 is disposed in the groove 1311. It can be appreciated that, since the pixel unit 110 includes a stack of high modulus film layers, the pixel unit 110 is substantially free from deformation during stretching, and the elastic lead layer 120 is disposed in the groove 1311 of the elastic encapsulation layer 130, compared to the elastic lead layer 120 disposed outside the base 131, and the elastic lead layer 120 and the elastic encapsulation layer 130 are deformed together during stretching, so that stress is not generated due to different deformation amounts of the elastic lead layer 120 and the elastic encapsulation layer 130, and the relative positions of the elastic lead layer 120 and the elastic encapsulation layer 130 are changed.
Wherein the thickness of the base 131 is 100-2000 μm. The thickness of the cover 132 may also be 100-2000 μm.
In some embodiments, referring to fig. 3 and fig. 4, fig. 3 is a third structural schematic diagram of a display panel provided in an embodiment of the present application, and fig. 4 is a fourth structural schematic diagram of a display panel provided in an embodiment of the present application. The pixel unit 110 includes an OLED device layer 111 and an encapsulation layer 112 on the OLED device layer 111, and the OLED device layer 111 is an AMOLED (Active Matrix OLED, active-drive OLED) device layer, such as fig. 4, or a PMOLED (Passive Matrix OLED, passive-drive OLED) device layer.
With continued reference to fig. 4, when the OLED device layer 111 is an AMOLED device layer, the AMOLED device layer has an independent thin film transistor, so that each pixel unit 110 can continuously and independently drive to emit light, and can be driven by using low-temperature polysilicon or oxide TFT (Thin Film Transistor ) and capacitor, which has the advantages of low driving voltage and long service life.
When the OLED device layer 111 is a PMOLED device layer, the PMOLED device layer is formed in a matrix shape with a cathode and an anode, and the pixel units 110 in the array are turned on in a scanning manner, and each pixel unit 110 is operated in a short pulse mode to emit light with instantaneous high brightness. The advantage is simple structure, can effectively reduce manufacturing cost.
In some embodiments, please refer to fig. 3 and fig. 5, fig. 5 is a schematic diagram of a fifth structure of the display panel according to the embodiments of the present application. The encapsulation layer 112 includes a first thin film encapsulation layer 1121, an organic layer 1122 and a second thin film encapsulation layer 1123, which are stacked, the OLED device layer 111 includes an OLED array substrate 1111 and a light emitting layer group 1112 disposed on the OLED array substrate 1111, the first thin film encapsulation layer 1121 is disposed on a side of the light emitting layer group 1112 far away from the OLED array substrate 1111, the first thin film encapsulation layer 1121 and the OLED array substrate 1111 jointly encapsulate the light emitting layer group 1112, the organic layer 1122 is disposed on a side of the first thin film encapsulation layer 1121 far away from the OLED array substrate 1111, the second thin film encapsulation layer 1123 is disposed on a side of the light emitting layer group 1112 far away from the OLED array substrate 1111, and the second thin film encapsulation layer 1123 and the OLED array substrate 1111 jointly encapsulate the light emitting layer group 1112 and the organic layer 1122. The material of the organic layer 1122 is polymethyl methacrylate (PMMA) material (also called acrylic material, acrylic plastic). The first thin film encapsulation layer 1121 and the second thin film encapsulation layer 1123 can jointly protect the light emitting layer group 1112 from external moisture and other impurities entering the OLED device layer 111. The organic layer 1122 has stable chemical properties and good mechanical properties, and can prevent impurities such as oxygen from entering the inside of the OLED device layer 111.
The light emitting layer group 1112 includes at least all or part of layers such as a hole injection layer, a hole transport layer, a light emitting layer, a functional layer, an electron injection layer, an electron transport layer, a hole blocking layer, an electron blocking layer, and a cathode. The light emitting layer group 1112 may further include a CPL layer (capping layer) having conductivity. A CPL layer is disposed on the cathode of the light emitting layer group 1112 to improve the light output, and the material of the CPL layer has the characteristics of large refractive index and small light absorption coefficient. The light emittance, which is the light flux that the light source surface uniformly projects outward on a unit area, affects the contrast and visibility of the display panel 100.
Wherein the hole injection layer, the hole transport layer, the electron injection layer, the electron transport layer, the hole blocking layer and the electron blocking layer are used as a common layer.
In other embodiments, referring to fig. 6, fig. 6 is a schematic view of a sixth structure of a display panel according to an embodiment of the disclosure. The encapsulation layer 112 is a third thin film encapsulation layer 1124, the OLED device layer 111 includes an OLED array substrate 1111 and a light emitting layer group 1112 disposed on the OLED array substrate 1111, the third thin film encapsulation layer 1124 is disposed on a side of the light emitting layer group 1112 away from the OLED array substrate 1111, and the third thin film encapsulation layer 1124 and the OLED array substrate 1111 jointly encapsulate the light emitting layer group 1112. The third thin film encapsulation layer 1124 can collectively protect the light emitting layer group 1112 from impurities such as external moisture entering the OLED device layer 111.
In some embodiments, referring to fig. 5, the elastic lead layer 120 includes a first lead layer 121 and a second lead layer 122 isolated from each other; the OLED array substrate 1111 includes a first flexible substrate 1, a first pad 2, a second pad 3, a first buffer layer 4, a first source drain metal layer 5, a second source drain metal layer 6, an insulating layer 7, a first anode 8, a second anode 9, a flat layer 10, and a conductor layer 11, the first pad 2 and the second pad 3 are isolated from each other, the first pad 2 and the second pad 3 are disposed on the first flexible substrate 1, the first pad 2 is electrically connected with the first lead layer 121, and the second pad 3 is electrically connected with the second lead layer 122; the first buffer layer 4 is disposed on the first pad 2, the second pad 3, and the first flexible substrate 1; the first source drain metal layer 5 and the second source drain metal layer 6 are isolated from each other, the first source drain metal layer 5 and the second source drain metal layer 6 are arranged on one side of the first buffer layer 4 far away from the first flexible substrate 1, the first source drain metal layer 5 is connected with the first liner 2, and the second source drain metal layer 6 is connected with the second liner 3; the insulating layer 7 is arranged on one side of the first buffer layer 4 far away from the first flexible substrate 1, and the insulating layer 7 covers the first source drain metal layer 5 and the second source drain metal layer 6; the first anode 8 and the second anode 9 are isolated from each other, the first anode 8 and the second anode 9 are arranged on one side of the insulating layer 7 far away from the first flexible substrate 1, the first anode 8 is connected with the first source drain metal layer 5, and the second anode 9 is respectively connected with the second source drain metal layer 6 and the light-emitting layer group 1112; the flat layer 10 is provided on the side of the insulating layer 7 remote from the first flexible substrate 1; the conductor layer 11 is provided on the side of the flat layer 10 remote from the first flexible substrate 1, and the conductor layer 11 is connected to the first anode 8 and the light-emitting layer group 1112, respectively.
The first lead layer 121, the first pad 2, the first source/drain metal layer 5, the first anode 8, the conductor layer 11, and the light emitting layer group 1112 are electrically connected in this order, and the second lead layer 122, the second pad 3, the second source/drain metal layer 6, the second anode 9, and the light emitting layer group 1112 are electrically connected in this order. The light-emitting luminance of the corresponding light-emitting layer group 1112 is controlled by the difference in voltage between the voltages applied to the first and second lead layers 121 and 122 and the difference in the time period of the applied voltage.
The OLED array substrate 1111 further includes a barrier layer disposed on a side of the conductor layer 11 away from the first flexible substrate 1, where the barrier layer and the conductor layer 11 may form an undercut structure to disconnect the common layer of the light emitting layer group 1112 from the light emitting layer.
In some embodiments, referring to fig. 7, fig. 7 is a schematic diagram of a seventh structure of a display panel according to an embodiment of the present application. The display panel 100 further includes a second flexible substrate 12 and a second buffer layer 13, the second flexible substrate 12 being disposed between the first buffer layer 4 and the insulating layer 7; the second buffer layer 13 is disposed between the second flexible substrate 12 and the insulating layer 7, and the first source drain metal layer 5 and the second source drain metal layer 6 are disposed on a side of the second buffer layer 13 away from the first flexible substrate 1.
The present embodiment provides a display device including, but not limited to, the display panel 100, the chip, the polarizer, the protective film, and the like in the above embodiments. For example, the display device includes a display panel 100 and a chip connected to the display panel 100. The display device can be applied to flexible human-computer interaction display, medical display, freely-stretchable vehicle-mounted display terminals and wearable display terminal products.
The display panel 100 provided in this embodiment of the present application includes a plurality of pixel units 110 that are independently formed into islands, a plurality of elastic lead layers 120 and an elastic packaging layer 130, the pixel units 110 and the elastic lead layers 120 connected with the pixel units 110 are covered by the elastic packaging layer 130, the elastic packaging layer 130 protects the plurality of pixel units 110, the elastic lead layers 120 transmit electrical signals to the pixel units 110, and due to the effect of the elastic material packaging layer 112 and the elastic lead layers 120, the tensile stress acts on the elastic lead layers 120 and the elastic packaging layer 130 in the process of being stretched, so that the pixel units 110 cannot be pulled by the stress to fail.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.
The display panel and the display device provided in the embodiments of the present application are described in detail above. Specific examples are set forth herein to illustrate the principles and embodiments of the present application, with the description of the examples given above only to assist in understanding the present application. Meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.
Claims (8)
1. A display panel, comprising:
a plurality of pixel units which are independently formed into islands, wherein the pixel units comprise a plurality of high-modulus film layers which are stacked;
a plurality of elastic lead layers, each of which is connected with one of the pixel units;
the elastic packaging layer comprises a base and a cover plate, the pixel units are arranged on the base, a groove is formed in the base, the elastic lead layer is arranged in the groove, the cover plate covers the elastic lead layer and the pixel units, and the elastic packaging layer covers the pixel units and the elastic lead layers.
2. The display panel of claim 1, wherein the chassis has a thickness of 100 μιη to 2000 μιη.
3. The display panel of claim 1 or 2, wherein the pixel unit comprises an OLED device layer and an encapsulation layer on the OLED device layer, the OLED device layer being an AMOLED device layer or a PMOLED device layer.
4. The display panel according to claim 3, wherein the encapsulation layer comprises a first thin film encapsulation layer, an organic layer and a second thin film encapsulation layer which are stacked, the OLED device layer comprises an OLED array substrate and a light emitting layer group located on the OLED array substrate, the first thin film encapsulation layer is arranged on one side of the light emitting layer group away from the OLED array substrate, the first thin film encapsulation layer and the OLED array substrate jointly encapsulate the light emitting layer group, the organic layer is arranged on one side of the first thin film encapsulation layer away from the OLED array substrate, the second thin film encapsulation layer is arranged on one side of the light emitting layer group away from the OLED array substrate, and the second thin film encapsulation layer and the OLED array substrate jointly encapsulate the light emitting layer group and the organic layer.
5. The display panel of claim 4, wherein the elastic lead layer comprises a first lead layer and a second lead layer isolated from each other; the OLED array substrate comprises a first flexible substrate, a first liner, a second liner, a first buffer layer, a first source drain metal layer, a second source drain metal layer, an insulating layer, a first anode, a second anode, a flat layer and a conductor layer, wherein the first liner and the second liner are mutually isolated, the first liner and the second liner are arranged on the first flexible substrate, the first liner is electrically connected with the first lead layer, and the second liner is electrically connected with the second lead layer; the first buffer layer is arranged on the first liner, the second liner and the first flexible substrate; the first source drain metal layer and the second source drain metal layer are isolated from each other, the first source drain metal layer and the second source drain metal layer are arranged on one side, far away from the first flexible substrate, of the first buffer layer, the first source drain metal layer is connected with the first liner, and the second source drain metal layer is connected with the second liner; the insulating layer is arranged on one side, far away from the first flexible substrate, of the first buffer layer, and the insulating layer covers the first source drain metal layer and the second source drain metal layer; the first anode and the second anode are arranged on one side, far away from the first flexible substrate, of the insulating layer, the first anode is connected with the first source drain metal layer, and the second anode is respectively connected with the second source drain metal layer and the light-emitting layer group; the flat layer is arranged on one side of the insulating layer away from the first flexible substrate; the conductor layer is arranged on one side, far away from the first flexible substrate, of the flat layer, and is respectively connected with the first anode and the light-emitting layer group.
6. The display panel of claim 5, wherein the OLED array substrate further comprises a second flexible substrate and a second buffer layer, the second flexible substrate being disposed between the first buffer layer and the insulating layer; the second buffer layer is arranged between the second flexible substrate and the insulating layer, and the first source drain metal layer and the second source drain metal layer are arranged on one side, far away from the first flexible substrate, of the second buffer layer.
7. The display panel according to claim 3, wherein the encapsulation layer is a third thin film encapsulation layer, the OLED device layer includes an OLED array substrate and a light emitting layer group on the OLED array substrate, the third thin film encapsulation layer is disposed on a side of the light emitting layer group away from the OLED array substrate, and the third thin film encapsulation layer and the OLED array substrate jointly encapsulate the light emitting layer group.
8. A display device comprising the display panel of any one of claims 1 to 7 and a chip, the display panel being connected to the chip.
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