WO2021031007A1 - Display panel, manufacturing method therefor, and electronic device - Google Patents

Display panel, manufacturing method therefor, and electronic device Download PDF

Info

Publication number
WO2021031007A1
WO2021031007A1 PCT/CN2019/101180 CN2019101180W WO2021031007A1 WO 2021031007 A1 WO2021031007 A1 WO 2021031007A1 CN 2019101180 W CN2019101180 W CN 2019101180W WO 2021031007 A1 WO2021031007 A1 WO 2021031007A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
substrate
light
display panel
sub
Prior art date
Application number
PCT/CN2019/101180
Other languages
French (fr)
Chinese (zh)
Inventor
袁泽
康佳昊
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201980090251.4A priority Critical patent/CN113383425A/en
Priority to PCT/CN2019/101180 priority patent/WO2021031007A1/en
Publication of WO2021031007A1 publication Critical patent/WO2021031007A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • H10K59/8731Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates

Definitions

  • the invention belongs to the field of display technology, and specifically relates to a display panel, a preparation method thereof, and an electronic device.
  • organic electroluminescence display panels With the development of organic electroluminescence display panels, flexible organic electroluminescence display panels have very good application prospects in various media, games, multimedia teaching, aircraft, and engineering vehicle operation control.
  • the organic light-emitting material layer, electrode layer and encapsulation layer in the traditional flexible organic electroluminescence display panel all adopt the structure of coating on the whole surface. The structure of these layers cannot be stretched, which limits the flexible organic electroluminescence. The stretchability of the display panel makes the current flexible organic electroluminescent display panel not stretchable.
  • the present invention provides a display panel capable of improving stretch performance.
  • the specific technical solution is as follows.
  • a display panel the display panel includes a plurality of sub-display panels, and two adjacent sub-display panels are electrically connected by an elastic structure;
  • Each of the sub-display panels includes a substrate, a light-emitting function layer provided on one side of the substrate, and an encapsulation layer provided on the side of the light-emitting function layer away from the substrate, and the encapsulation layer is positioned on the substrate.
  • the projection completely falls on the substrate, the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the encapsulation layer on the substrate, and the encapsulation layer cooperates with the substrate to combine
  • the light-emitting function layer is packaged.
  • the present invention also provides a method for manufacturing a display panel, the method for manufacturing the display panel includes:
  • An encapsulation layer is formed on the side of the light-emitting function layer away from the substrate, the orthographic projection of the encapsulation layer on the substrate completely falls on the substrate, and the light-emitting function layer is on the substrate. The projection falls completely into the orthographic projection of the packaging layer on the substrate.
  • the present invention also provides an electronic device including the above-mentioned display panel.
  • the display panel provided by the present invention encapsulates the light-emitting function layer in each sub-display panel by providing an encapsulation layer in each sub-display panel, so that the encapsulation layer of the entire display panel is divided, instead of being encapsulated in the entire display panel.
  • the encapsulation layer forms multiple independent regions and can be stretched, thereby improving the overall stretchability of the display panel.
  • FIG. 1 is a top view of a display panel provided by the first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the first display panel provided by the first embodiment of the invention.
  • FIG 3 is a cross-sectional view of a second type of display panel provided by the first embodiment of the invention.
  • FIG. 4 is a cross-sectional view of a third display panel provided by the first embodiment of the invention.
  • FIG. 5 is a cross-sectional view of the first display panel provided by the second embodiment of the present invention.
  • FIG. 6 is a top view of the first display panel provided by the second embodiment of the present invention.
  • FIG. 7 is a top view of a second type of display panel provided by the second embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of a second type of display panel provided by the second embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of the first display panel provided by the third embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of a second type of display panel provided by the third embodiment of the invention.
  • FIG. 11 is a cross-sectional view of a display panel provided by the fourth embodiment of the present invention.
  • FIG. 12 is a cross-sectional view of a display panel provided by a fifth embodiment of the invention.
  • FIG. 13 is a schematic structural diagram of an electronic device provided by the present invention.
  • FIG. 14 is a flowchart of the first manufacturing method of the display panel provided by the present invention.
  • FIG. 15 is a flowchart of the second method for manufacturing the display panel provided by the present invention.
  • FIG. 16 is a flowchart of a third method for manufacturing a display panel provided by the present invention.
  • FIG. 17 is a flowchart of the fourth method for manufacturing a display panel provided by the present invention.
  • FIG. 18 is a flowchart of the fifth method for manufacturing a display panel provided by the present invention.
  • FIG. 19 is a flowchart of the sixth method for manufacturing a display panel provided by the present invention.
  • the first embodiment of the present invention provides a display panel 10.
  • the display panel 10 includes a plurality of sub-display panels 100, and two adjacent sub-display panels 100 are electrically connected by an elastic structure 200.
  • the elastic structure 200 refers to a structure that is stretchable and can be electrically connected, and the electrical connection includes transmitting control signals, power signals, or data signals.
  • Each sub-display panel 100 includes a substrate 110, a light-emitting function layer 120 disposed on the side of the substrate 110, and an encapsulation layer 130 disposed on the side of the light-emitting function layer 120 away from the substrate 110.
  • the orthographic projection of the encapsulation layer 130 on the substrate 110 is completely On the substrate 110, the orthographic projection of the light-emitting function layer 120 on the substrate 110 completely falls into the orthographic projection of the encapsulation layer 130 on the substrate 110, and the encapsulation layer 130 cooperates with the substrate 110 to encapsulate the light-emitting function layer 120. That is, the light-emitting function layer 120 can be completely encapsulated between the encapsulation layer 130 and the substrate 110.
  • the sub-display panels 100 are electrically connected through the elastic structure 200 so that the sub-display panels 100 can be stretched, and the elastic structure 200 can transmit control signals, power signals, or data signals, so that the The display can be continuous, so that the display screen of the entire display panel 10 is integrated.
  • the light-emitting function layer 120 on each sub-display panel 100 is individually packaged by arranging a corresponding encapsulation layer 130, so that the package in the entire display panel 10 is split, instead of being encapsulated in the entire display panel 10
  • the encapsulation layer 120 split on each sub-display panel 100 does not affect the stretchability of the entire display panel 10, that is, the encapsulation layer 130 is correspondingly disposed on each sub-display panel 100, and
  • the display panels 100 are connected by the elastic structure 200 to improve the stretchability of the entire display panel 10.
  • the display panel 10 provided by the present invention encapsulates the light-emitting function layer 120 in each sub-display panel 100 by arranging an encapsulation layer 130 in each sub-display panel 100, so that the encapsulation layer 130 of the entire display panel 10 is divided instead of being encapsulated in the whole On the display panel 10, the encapsulation layer 130 forms a plurality of independent regions and can be stretched, thereby improving the overall stretchability of the display panel 10.
  • the elastic structure 200 includes an elastic body 210 and an electrical connection line 220 disposed therein, and two adjacent sub-display panels 100 are electrically connected through the electrical connection line 220.
  • the elastic body 210 is connected to the substrate 110 or the two are integrally formed.
  • the substrate 110 and the elastic body 210 in all the sub-display panels 100 constitute the base 300 of the entire display panel 10.
  • the elastic body 210 may be made of elastic materials such as rubber glue, and the length of the electrical connection line 220 may be significantly longer than the length between the two sub-display panels 100 when the display panel 10 is not stretched.
  • the elastic structure 200 may be composed of a coil type or wave type electrical connection line 220, that is, the electrical connection line 220 itself constitutes a stretchable coil type or a wave type stretchable structure, There is no need to additionally provide the elastic body 210, that is to say, the electrical connection line 220 is stretchable and can provide control signals, power signals or data signals.
  • the elastic structure 200 is the elastic body 210 itself, and the elastic body 210 has stretchability and can provide electrical connection, and no additional electrical connection wire 220 is required.
  • each sub-display panel 100 further includes a thin film transistor layer 190, and the thin film transistor layer 190 is disposed between the substrate 110 and the light emitting function layer 120.
  • the light-emitting function layer 120 is driven to emit light by the thin film transistor layer 190.
  • the thin film transistor layers 190 in two adjacent sub-display panels 100 are electrically connected through the electrical connection line 220, so as to achieve the continuity of the display images of all the sub-display panels 100.
  • the light-emitting function layer 120 includes a first electrode layer 121, a light-emitting layer 122, and a second electrode layer 123.
  • the first electrode layer 121 is disposed on the side of the thin film transistor layer 190 away from the substrate 110.
  • the light emitting layer 122 is disposed on the side of the first electrode layer 121 away from the thin film transistor layer 190, and the second electrode layer 123 is disposed on the side of the light emitting layer 122 away from the first electrode layer 121.
  • the light-emitting functional layer 120 includes a light-emitting area 124 and a non-light-emitting area 125 adjacent to the light-emitting area 124.
  • the light-emitting layer 122 is disposed in the light-emitting area 124.
  • the first electrode layer 121 and the second electrode layer 123 cover the light-emitting area 124 and the non-light-emitting area. 125.
  • the first electrode layer 121 and the second electrode layer 123 are electrically connected through a portion disposed in the non-light emitting area 124, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190.
  • the electrical connection between the first electrode layer 121 and the second electrode layer 123 can be that conductive vias 126 are provided in the non-light emitting region 124 of the first electrode layer 121 and the second electrode layer 123 to connect the first electrode layer 121 and the second electrode layer 123 are electrically connected.
  • the conductive through hole 126 may be a through hole containing a conductive material, or a through hole provided with a conductive pillar.
  • a voltage node is provided in the thin film transistor layer 190, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190 by being connected to the voltage node.
  • the display panel 10 is provided with a driving circuit, which is electrically connected to the thin film transistor layer 190, and the driving circuit controls the display of the display panel 10 by driving the thin film transistor layer 190.
  • the second embodiment of the present invention provides a display panel 10a.
  • the sub-display panel 100 further includes a first barrier layer 140 and a first barrier layer 140.
  • the light-emitting functional layer 120 is arranged on the same side of the substrate 110, and the first barrier layer 140 is provided with at least one first channel 150 penetrating the first barrier layer 140.
  • the light-emitting functional layer 120 includes at least one sub-pixel light-emitting device 160, The at least one sub-pixel light-emitting device 160 is respectively disposed in the at least one first channel 150 and embedded in the first barrier layer 140.
  • the material of the first barrier layer 140 can be an organic material or an inorganic material.
  • the size of the first channel 150 in the middle of the first barrier layer 140 can be set according to the size of the sub-pixel light-emitting device 160.
  • the first barrier layer 140 can block external moisture from penetrating into the sub-pixel light-emitting device 160 from the side of the sub-pixel light-emitting device 160 to protect the sub-pixel light-emitting device 160 from being damaged. Water vapor damage.
  • the first barrier layer 140 can also block the overflow of the preparation material of the sub-pixel light-emitting device 160 during the inkjet printing preparation process.
  • the material of the sub-pixel light-emitting device 160 when the material of the sub-pixel light-emitting device 160 is dropped into the first channel 150 in the first barrier layer 140, the material of the sub-pixel light-emitting device 160 drops
  • the contact angle of the contact surface with the first barrier layer 140 is greater than 90°, which can prevent the material of the sub-pixel light emitting device 160 from overflowing from the first barrier layer 140.
  • a suitable material of the first barrier layer 140 can be selected so that the material of the sub-pixel light-emitting device 160 will not overflow after being dropped.
  • the first barrier layer 140 surrounds the sub-pixel light-emitting device 160 in a circumferential direction.
  • the number of the first channels 150 in the first barrier layer 140 is at least the same as the number of the plurality of sub-pixel light-emitting devices 160.
  • the first channel 150 corresponds to the sub-pixel light-emitting device 160 one-to-one.
  • the sub-pixel light-emitting device 160 includes the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123.
  • the light-emitting function layer 120 includes a plurality of sub-pixel light-emitting devices 160
  • the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123 respectively include a plurality of corresponding regions to form a plurality of sub-pixel light-emitting devices 160.
  • the encapsulation layer 130 includes a first inorganic layer 131 disposed on a side of the at least one sub-pixel light-emitting device 160 away from the substrate 110, and the at least one sub-pixel The orthographic projection of the light emitting device 160 on the substrate 110 completely falls into the orthographic projection of the first inorganic layer 131 on the substrate 110.
  • the encapsulation layer 130 only includes the first inorganic layer 131, that is, only the first inorganic layer 131 is used to encapsulate the sub-pixel light emitting device 160.
  • the first inorganic layer 131 may only cover the sub-pixel light-emitting device 160.
  • the first inorganic layer 131 may cover the first barrier.
  • the layer 140 prevents water and oxygen from penetrating (see FIG. 5).
  • the first inorganic layer 131 may include a plurality of first inorganic regions 1311 (see FIGS. 7 and 8), and each The first inorganic regions 1311 cover one sub-pixel light-emitting device 160 respectively.
  • the first inorganic layer 131 may also be a whole.
  • the first inorganic layer 131 covers all the sub-pixel light-emitting devices 160 in each sub-display panel 100 and covers the first blocking layer 140.
  • the first barrier layer 140 and the first inorganic layer 131 are provided in each sub-display panel 100.
  • the first barrier layer 140 and the first inorganic layer 131 do not cover the entire display panel 10a, so that the entire display is not affected.
  • the first barrier layer 140 and the first inorganic layer 131 can be prepared by a patterning method when preparing the first barrier layer 140 and the first inorganic layer 131.
  • the specific preparation method can refer to the following preparation method.
  • the third embodiment of the present invention provides a display panel 10b.
  • the encapsulation layer 130 in each sub-display panel 100 further includes a first organic layer 132.
  • the first organic layer 132 is disposed on the surface of the first inorganic layer 131 away from the sub-pixel light emitting device 160.
  • the first organic layer 132 includes at least one organic region 1321 (refer to FIG. 10), and the at least one organic region 1321 is respectively disposed In the at least one first channel 150, the first organic layer 132 includes a first surface 1322 facing away from the substrate 110 (see FIG.
  • the first barrier layer 140 includes a second surface 141 facing away from the substrate 110, and the first surface The distance L1 between 1322 and the substrate 110 is less than or equal to the distance L2 between the second surface 141 and the substrate 110.
  • the first organic layer 132 is added to further protect the sub-pixel light-emitting devices 160, and each sub-pixel light-emitting device 160 corresponds to an organic region 1321.
  • the encapsulation layer 130 further includes a second inorganic layer 133, and the second inorganic layer 133 is disposed on a side of the first organic layer 132 away from the sub-pixel light emitting device 160.
  • the addition of the second inorganic layer 133 further protects the sub-pixel light emitting device 160.
  • the second inorganic layer 133 covers at least the first organic layer 132.
  • the second inorganic layer 133 can be provided to cover the first barrier layer 140.
  • the first organic layer 132 and the second inorganic layer 133 are provided in each sub-display panel 100.
  • the first organic layer 132 and the second inorganic layer 133 do not cover the entire display panel, so that the The stretchability of the entire display panel 10b is affected.
  • the first organic layer 132 and the second inorganic layer 133 can be prepared by a patterning method when preparing the first organic layer 132 and the second inorganic layer 133.
  • the specific preparation method can refer to the following preparation method.
  • the fourth embodiment of the present invention provides a display panel 10c.
  • the encapsulation layer 130 in each sub-display panel 100 includes a second organic layer 134
  • the second organic layer 134 is disposed on the side of the sub-pixel light-emitting device 160 away from the substrate 110, and the orthographic projection of the sub-pixel light-emitting device 160 on the substrate 110 completely falls into the orthographic projection of the second organic layer 134 on the substrate 110.
  • the second organic layer 134 is directly packaged on the sub-pixel light-emitting device 160.
  • the material of the second organic layer 134 is incompatible with the material of the sub-pixel light-emitting device 160, or the material of the second organic layer 134 does not react with the material of the sub-pixel light-emitting device 160, so that the sub-pixel will not be damaged.
  • Light emitting device 160 is incompatible with the material of the sub-pixel light-emitting device 160, or the material of the second organic layer 134 does not react with the material of the sub-pixel light-emitting device 160, so that the sub-pixel will not be damaged.
  • the second organic layer 134 is provided in each sub-display panel 100, and the second organic layer 134 does not cover the entire display panel, so that the stretchability of the entire display panel 10c is not affected.
  • the second organic layer 134 can be prepared by a patterning method, and the specific preparation method can refer to the following preparation method.
  • each sub-display panel 100 in the display panel 10d further includes a second barrier layer 170.
  • the layer 170 and the first barrier layer 140 are arranged on the same side of the substrate 110, and the second barrier layer 170 is arranged outside the first barrier layer 140, and a second channel 180 is provided between the second barrier layer 170 and the first barrier layer 140 .
  • the second barrier layer 170 and the first barrier layer 140 may be formed of the same material at the same time, or may be formed at different times.
  • the encapsulation layer 130 further includes a third organic layer 135.
  • the third organic layer 135 is disposed on the side of the first inorganic layer 131 away from the substrate 110.
  • the orthographic projection of the first barrier layer 140 and the at least one sub-pixel light emitting device 160 on the substrate 110 It falls into the orthographic projection of the third organic layer 135 on the substrate 110, and at least part of the edge of the third organic layer 135 is located in the second channel 180.
  • the third organic layer 135 completely covers the first barrier layer 140 and the sub-pixel light-emitting device 160 to further protect the sub-pixel light-emitting device 160.
  • the encapsulation layer 130 further includes a third inorganic layer 136, the third inorganic layer 136 is disposed on the side of the third organic layer 135 away from the substrate 110, and the orthographic projection of the third organic layer 135 on the substrate 110 It falls into the orthographic projection of the third inorganic layer 136 on the substrate 110. That is, the third inorganic layer 136 completely covers the third organic layer 135 to further protect the sub-pixel light-emitting device 160.
  • disposing the above-mentioned encapsulation layer 130 in each sub-display panel 100 can not only better encapsulate the sub-pixel light-emitting device 160, but also does not affect the stretchability of the entire display panel 10d.
  • the present invention also provides an electronic device 20.
  • the electronic device 20 includes the display panel 10 as described in any of the foregoing embodiments.
  • the electronic device 20 may be, but is not limited to, an e-book, a smart phone (such as an Android phone, an iOS phone, a Windows Phone phone, etc.), a tablet computer, a flexible handheld computer, a flexible notebook computer, and a mobile Internet device (MID, Mobile Internet Devices). ) Or wearable devices, etc., or may be organic light-emitting diodes (OLED) display devices, active matrix organic light emitting diodes (Active Matrix Organic Light Emitting Diode, AMOLED) electronic devices.
  • OLED organic light-emitting diodes
  • AMOLED Active Matrix Organic Light Emitting Diode
  • the present invention also provides a first method for manufacturing the display panel 10.
  • the method for manufacturing the display panel 10 includes step S100, step S200 and step S300. The detailed steps are as follows.
  • step S100 a plurality of substrates 110 are provided, and two adjacent substrates 110 are connected by an elastic body 210.
  • a plurality of substrates 110 are connected to each other to form a base 300 of the entire display panel 10.
  • the base 300 has stretchability.
  • the elastic body 210 can be integrally formed with the substrate 100 or formed separately. The tensile strength is greater than the tensile strength of the substrate 100, so that the substrate 300 can be better stretched in the horizontal and vertical directions.
  • the elastic body 210 has stretchability and can provide electrical connections, and the electrical connections include transmission of control signals, power signals or data signals.
  • step S200 a light-emitting function layer 120 is formed on one side of each substrate 110.
  • step S300 the encapsulation layer 130 is formed on the side of the light-emitting function layer 120 away from the substrate 110, the orthographic projection of the encapsulation layer 130 on the substrate 110 completely falls on the substrate 110, and the orthographic projection of the luminous function layer 120 on the substrate 110 completely falls on the substrate 110.
  • An encapsulation layer 130 spaced apart from each other is formed on each substrate 110, and each substrate 110, the light-emitting function layer 120 and the encapsulation layer 130 constitute a sub-display panel 100.
  • the manufacturing method of the display panel 10 provided by the present invention encapsulates the light-emitting function layer 120 therein by forming an encapsulation layer 130 in each sub-display panel 100, so that the encapsulation layer 130 of the entire display panel 10 is divided instead of The entire encapsulation is on the display panel 10, so that the encapsulation layer 130 of the entire display panel 10 forms a plurality of independent regions and can be stretched, thereby improving the overall stretchability of the display panel 10.
  • the method for forming the light-emitting functional layer 120 includes an inkjet printing method, a vacuum coating method or a coating method.
  • the forming of the encapsulation layer 130 includes an inkjet printing method, a vacuum coating method, a coating method or an etching method.
  • the present invention also provides a second method for manufacturing the display panel 10.
  • the difference from that shown in FIG. 14 is that between step S100 and step S200, step S100a and step S100b are further included.
  • step S100a a thin film transistor layer 190 is formed on one side of each substrate 110.
  • an electrical connection line 220 is formed in the elastic body 210, and the thin film transistor layer 190 on each substrate 110 is electrically connected by the electrical connection line 220.
  • the electrical connection line 220 is used to transmit control signals, power signals or data signals.
  • the elastic body 210 is made of a stretchable material and can be stretched.
  • the electrical connection line 220 and the elastic body 210 constitute an elastic structure 200, and the elastic structure 200 electrically connects two adjacent sub-display panels 100.
  • the step S200 includes step S200-I.
  • step S200-I the light emitting function layer 120 is formed on the side of the thin film transistor layer 190 away from the substrate 110.
  • the step S200-I specifically includes: forming a first electrode layer 121 on the side of the thin film transistor layer 190 away from the substrate 110, and on the first electrode layer 121 away from the thin film transistor layer 190
  • the light-emitting layer 122 is formed on the side of the light-emitting layer 122
  • the second electrode layer 123 is formed on the side of the light-emitting layer 122 away from the first electrode layer 121. That is, the optical function layer 120 is composed of a first electrode layer 121, a light emitting layer 122, and a second electrode layer 123.
  • the light-emitting functional layer 120 includes a light-emitting area 124 and a non-light-emitting area 125 adjacent to the light-emitting area 124.
  • the light-emitting layer 122 is formed in the light-emitting area 124.
  • the first electrode layer 121 and the second electrode layer 123 cover the light-emitting area 124 and the non-light-emitting area. 125.
  • the first electrode layer 121 and the second electrode layer 123 are electrically connected through a portion formed in the non-light emitting region 124, and the first electrode layer 121 and the thin film transistor layer 190 are electrically connected.
  • the electrical connection between the first electrode layer 121 and the second electrode layer 123 may be that conductive vias 126 are formed in the non-light emitting region 124 of the first electrode layer 121 and the second electrode layer 123 to connect the first electrode layer 121 and the second electrode layer 123 are electrically connected.
  • the conductive through hole 126 may be a through hole containing a conductive material, or a through hole provided with a conductive pillar.
  • a voltage node is formed in the thin film transistor layer 190, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190 by being connected to the voltage node.
  • the present invention also provides a third method for manufacturing the display panel 10.
  • step S400 is further included between step S100 and step S200.
  • a first barrier layer 140 is formed on one side of the substrate 110, and at least one first channel 150 penetrating the first barrier layer 140 is formed in the first barrier layer 140.
  • the step S200 includes step S200-II.
  • a light-emitting functional layer 120 is formed on one side of each substrate 110, and the light-emitting functional layer 120 and the first barrier layer 140 are formed on the same side of the substrate 110, and the light-emitting functional layer 120 includes at least one sub-pixel light-emitting device 160 The at least one sub-pixel light-emitting device 160 is respectively formed in the at least one first channel 150 and embedded in the first barrier layer 140.
  • the material of the first barrier layer 140 can be an organic material or an inorganic material.
  • the size of the first channel 150 in the middle of the first barrier layer 140 can be set according to the size of the sub-pixel light-emitting device 160, and the sub-pixel light-emitting device 160 is formed on In the first channel 150 in the first barrier layer 140, the first barrier layer 140 can block external moisture from penetrating into the sub-pixel light-emitting device 160 from the side of the sub-pixel light-emitting device 160 to protect the sub-pixel light-emitting device 160 from being damaged. Water vapor damage.
  • the first barrier layer 140 can also block the overflow of the preparation material of the sub-pixel light-emitting device 160 during the preparation process.
  • the material of the sub-pixel light-emitting device 160 when the material of the sub-pixel light-emitting device 160 is dropped into the first channel 150 in the first barrier layer 140, the material of the sub-pixel light-emitting device 16 drops
  • the contact angle of the contact surface with the first barrier layer 140 is greater than 90°, which can prevent the material of the sub-pixel light emitting device 160 from overflowing from the first barrier layer 140.
  • a suitable material of the first barrier layer 140 can be selected so that the material of the sub-pixel light-emitting device 160 will not overflow after being dropped.
  • the first barrier layer 140 surrounds the sub-pixel light-emitting device 160 in a circumferential direction.
  • the first channel 150 in the first barrier layer 140 at least corresponds to the number of the plurality of sub-pixel light-emitting devices 160
  • the first channel 150 corresponds to the sub-pixel light emitting device 160 one to one.
  • the sub-pixel light-emitting device 160 includes the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123.
  • the light-emitting function layer 120 includes a plurality of sub-pixel light-emitting devices 160
  • the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123 are correspondingly divided into a plurality of regions to form a plurality of sub-pixel light-emitting devices 160.
  • step S300 includes step S310.
  • a first inorganic layer 131 is formed on the side of the at least one sub-pixel light-emitting device 160 away from the substrate 110.
  • the orthographic projection of the first inorganic layer 131 on the substrate 110 completely falls on the substrate 110, and the at least one sub-pixel light-emitting device 160 All the orthographic projections on the substrate 110 completely fall into the orthographic projections of the first inorganic layer 131 on the substrate 110.
  • the encapsulation layer 130 only includes a first inorganic layer 131, that is, only the first inorganic layer 131 is used to encapsulate the sub-pixel light-emitting device 160.
  • the first inorganic layer 131 may only cover the sub-pixel light-emitting device 160 (see FIG. 8).
  • the first inorganic layer 131 may Cover to the first barrier layer 140 to avoid penetration of water and oxygen (see FIG. 5).
  • the first inorganic layer 131 may include a plurality of first inorganic regions 1311 (see FIG. 8), and each first inorganic layer The regions 1311 cover one sub-pixel light-emitting device 160 respectively.
  • the first inorganic layer 131 may also be a whole.
  • the first inorganic layer 131 covers all the sub-pixel light-emitting devices 160 and covers the first blocking layer 140.
  • the first barrier layer 140 and the first inorganic layer 131 do not cover the entire display panel, but are formed on each substrate 110 so as not to affect the stretchability of the entire display panel 10.
  • the present invention also provides a fourth method for manufacturing the display panel 10.
  • step S310 is followed by step S320.
  • a first organic layer 132 is formed on the surface of the first inorganic layer 131 away from the sub-pixel light emitting device 160.
  • the first organic layer 132 includes at least one organic region 1321, and the at least one organic region 1321 is respectively formed on the at least one In a first channel 150, the first organic layer 132 includes a first surface 1322 facing away from the substrate 110, and the first barrier layer 140 includes a second surface 141 facing away from the substrate 110.
  • the distance L1 between the first surface 1322 and the substrate 110 is less than or It is equal to the distance L2 between the second surface 1322 and the substrate 110.
  • the first organic layer 132 is additionally formed to further protect the sub-pixel light-emitting devices 160, and each sub-pixel light-emitting device 160 corresponds to an organic region 1321.
  • the height of the formed first barrier layer 140 is at least 1 ⁇ m, and when the material of the first organic layer 132 is dropped into the first channel 150 by an inkjet printing method, it will not overflow.
  • the material of the first organic layer 132 accurately controls the volume of the droplet and the drop position, and then is dried and repaired to form a flat first organic layer 132.
  • step S330 is further included after step S320.
  • a second inorganic layer 133 is formed on the side of the first organic layer 132 away from the sub-pixel light emitting device 160.
  • the addition of the second inorganic layer 133 further protects the sub-pixel light emitting device 160.
  • the second inorganic layer 133 covers at least the first organic layer 132.
  • the second inorganic layer 133 may be provided to cover the first barrier layer 140.
  • the present invention also provides a fifth method for manufacturing the display panel 10.
  • step S310 is replaced with step S340.
  • a second organic layer 134 is formed on the side of the sub-pixel light-emitting device 160 away from the substrate 110.
  • the orthographic projection of the second organic layer 134 on the substrate 110 completely falls on the substrate 110, and the sub-pixel light-emitting device 160 is on the substrate 110.
  • the orthographic projection of the second organic layer 134 completely falls into the orthographic projection of the second organic layer 134 on the substrate 110.
  • the second organic layer 134 is directly encapsulated and formed on the sub-pixel light emitting device 160, and the second organic layer 134 does not cover the entire display panel, so that the stretchability of the entire display panel 10 is not affected.
  • the material of the second organic layer 134 is incompatible with the material of the sub-pixel light-emitting device 160, or the material of the second organic layer 134 does not react with the material of the sub-pixel light-emitting device 160, so that the sub-pixel will not be damaged. Light emitting device 160.
  • step S500 is further included between step S400 and step S200-II.
  • a second barrier layer 170 is formed on one side of the substrate 110.
  • the second barrier layer 170 and the first barrier layer 140 are formed on the same side of the substrate 110, and the second barrier layer 170 is disposed outside the first barrier layer 140.
  • a second channel 180 is formed between the second barrier layer 170 and the first barrier layer 140.
  • the second barrier layer 170 and the first barrier layer 140 may be formed of the same material at the same time.
  • Step S350 is also included after the step S310.
  • a third organic layer 135 is formed on the side of the first inorganic layer 131 away from the substrate 110.
  • the orthographic projection of the first barrier layer 140 and the at least one sub-pixel light emitting device 160 on the substrate 110 falls into the third organic layer 135.
  • at least part of the edge of the third organic layer 135 is located in the second channel 180.
  • the third organic layer 135 completely covers the first barrier layer 140 and the sub-pixel light-emitting device 160 to further protect the sub-pixel light-emitting device 160.
  • the second barrier layer 170 can prevent the material droplets of the third organic material 135 from overflowing, and finally form the third organic material. At least a part of the edge of the layer 135 falls into the second trench 180.
  • step S360 is further included after the step S350.
  • step S360 a third inorganic layer 136 is formed on the side of the third organic layer 135 away from the substrate 110, and the orthographic projection of the third organic layer 135 on the substrate 110 falls into the orthographic projection of the third inorganic layer 136 on the substrate 110. That is, the third inorganic layer 136 completely covers the third organic layer 135 to further protect the sub-pixel light-emitting device 160.
  • each film layer in the encapsulation layer 130 in the above embodiments can be formed by inkjet printing, vacuum coating, coating or etching, because each encapsulation layer 130 is right
  • Each sub-display panel 100 is packaged. For the entire display panel 10, the entire package is divided, so the stretchability of the entire display panel 10 can be improved.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

A display panel (10), a manufacturing method therefor, and an electronic device. The display panel (10) comprises multiple sub-display panels (100), adjacent two sub-display panels (100) are electrically connected with each other via a flexible structure (200). Each sub-display panel (100) comprises a substrate (110), a light-emitting functional layer (120) provided on one side of the substrate (110), and a packaging layer (130) provided at the side of the light-emitting functional layer (120) away from the substrate (110). The orthographic projection of the packaging layer (120) completely falls on the substrate (110). The orthographic projection of the light-emitting functional layer (120) on the substrate (110) completely falls within the orthographic projection of the packaging layer (130) on the substrate (120). The packaging layer (130) fits the substrate (110) so as to package the light-emitting layer (120). The packaging layer of the display panel is divided and not entirely packaged on the display panel, thus increasing the overall stretchability of the display panel.

Description

显示面板及其制备方法、电子装置Display panel and preparation method thereof, and electronic device 技术领域Technical field
本发明属于显示技术领域,具体涉及一种显示面板及其制备方法、电子装置。The invention belongs to the field of display technology, and specifically relates to a display panel, a preparation method thereof, and an electronic device.
背景技术Background technique
随着有机电致发光显示面板的发展,柔性有机电致发光显示面板在各种传媒、游戏、多媒体教学、飞机、工程车辆操作控制等具有非常好的应用前景。但传统的柔性有机电致发光显示面板中的有机发光材料层、电极层以及封装层都采用整面镀膜的结构,从这些膜层的结构是无法进行拉伸的,限制了柔性有机电致发光显示面板的拉伸性,使得目前的柔性有机电致发光显示面板不具备可拉伸性。With the development of organic electroluminescence display panels, flexible organic electroluminescence display panels have very good application prospects in various media, games, multimedia teaching, aircraft, and engineering vehicle operation control. However, the organic light-emitting material layer, electrode layer and encapsulation layer in the traditional flexible organic electroluminescence display panel all adopt the structure of coating on the whole surface. The structure of these layers cannot be stretched, which limits the flexible organic electroluminescence. The stretchability of the display panel makes the current flexible organic electroluminescent display panel not stretchable.
发明内容Summary of the invention
有鉴于此,本发明提供一种能够提升拉伸性能的显示面板。具体技术方案如下所述。In view of this, the present invention provides a display panel capable of improving stretch performance. The specific technical solution is as follows.
一种显示面板,所述显示面板包括多个子显示面板,相邻两个所述子显示面板之间通过弹性结构电连接;A display panel, the display panel includes a plurality of sub-display panels, and two adjacent sub-display panels are electrically connected by an elastic structure;
每一所述子显示面板包括基板、设置于所述基板一侧的发光功能层以及设置在所述发光功能层远离所述基板一侧的封装层,所述封装层在所述基板上的正投影完全落在所述基板上,所述发光功能层在所述基板上的正投影完全落入所述封装层在所述基板上的正投影中,所述封装层与所述基板配合而将所述发光功能层进行封装。Each of the sub-display panels includes a substrate, a light-emitting function layer provided on one side of the substrate, and an encapsulation layer provided on the side of the light-emitting function layer away from the substrate, and the encapsulation layer is positioned on the substrate. The projection completely falls on the substrate, the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the encapsulation layer on the substrate, and the encapsulation layer cooperates with the substrate to combine The light-emitting function layer is packaged.
本发明还提供一种显示面板的制备方法,所述显示面板的制备方法包括:The present invention also provides a method for manufacturing a display panel, the method for manufacturing the display panel includes:
提供多个基板,将相邻两个所述基板之间通过弹性体连接;Provide a plurality of substrates, and connect two adjacent substrates through an elastic body;
在每个所述基板的一侧形成发光功能层;Forming a light-emitting function layer on one side of each of the substrates;
在所述发光功能层远离所述基板的一侧形成封装层,所述封装层在所述基板上的正投影完全落在所述基板上,且所述发光功能层在所述基板上的正投影完全落入所述封装层在所述基板上的正投影中。An encapsulation layer is formed on the side of the light-emitting function layer away from the substrate, the orthographic projection of the encapsulation layer on the substrate completely falls on the substrate, and the light-emitting function layer is on the substrate. The projection falls completely into the orthographic projection of the packaging layer on the substrate.
本发明还提供一种电子装置,所述电子装置包括上述显示面板。The present invention also provides an electronic device including the above-mentioned display panel.
本发明的有益效果:本发明提供的显示面板通过在每一子显示面板中设置封装层来对其中的发光功能层进行封装,从而使得整个显示面板的封装层是分割的,而不是整个封装在显示面板上,使得封装层形成了多个独立区域而可以拉伸的,进而提升显示面板的整体拉伸性。The beneficial effects of the present invention: The display panel provided by the present invention encapsulates the light-emitting function layer in each sub-display panel by providing an encapsulation layer in each sub-display panel, so that the encapsulation layer of the entire display panel is divided, instead of being encapsulated in the entire display panel. On the display panel, the encapsulation layer forms multiple independent regions and can be stretched, thereby improving the overall stretchability of the display panel.
附图说明Description of the drawings
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。In order to explain the technical solutions in the embodiments of the present invention more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative labor, other drawings can be obtained from these drawings.
图1为本发明第一实施例提供的一种显示面板的俯视图。FIG. 1 is a top view of a display panel provided by the first embodiment of the present invention.
图2为本发明第一实施例提供的第一种显示面板的剖面图。2 is a cross-sectional view of the first display panel provided by the first embodiment of the invention.
图3为本发明第一实施例提供的第二种显示面板的剖面图。3 is a cross-sectional view of a second type of display panel provided by the first embodiment of the invention.
图4为本发明第一实施例提供的第三种显示面板的剖面图。4 is a cross-sectional view of a third display panel provided by the first embodiment of the invention.
图5为本发明第二实施例提供的第一种显示面板的剖面图。5 is a cross-sectional view of the first display panel provided by the second embodiment of the present invention.
图6为本发明第二实施例提供的第一种显示面板的俯视图。FIG. 6 is a top view of the first display panel provided by the second embodiment of the present invention.
图7为本发明第二实施例提供的第二种显示面板的俯视图。FIG. 7 is a top view of a second type of display panel provided by the second embodiment of the present invention.
图8为本发明第二实施例提供的第二种显示面板的剖面图。FIG. 8 is a cross-sectional view of a second type of display panel provided by the second embodiment of the present invention.
图9为本发明第三实施例提供的第一种显示面板的剖面图。FIG. 9 is a cross-sectional view of the first display panel provided by the third embodiment of the present invention.
图10为本发明第三实施例提供的第二种显示面板的剖面图。10 is a cross-sectional view of a second type of display panel provided by the third embodiment of the invention.
图11为本发明第四实施例提供的一种显示面板的剖面图。FIG. 11 is a cross-sectional view of a display panel provided by the fourth embodiment of the present invention.
图12为本发明第五实施例提供的一种显示面板的剖面图。FIG. 12 is a cross-sectional view of a display panel provided by a fifth embodiment of the invention.
图13为本发明提供的一种电子装置的结构示意图。FIG. 13 is a schematic structural diagram of an electronic device provided by the present invention.
图14为本发明提供的第一种显示面板的制备方法的流程图。FIG. 14 is a flowchart of the first manufacturing method of the display panel provided by the present invention.
图15为本发明提供的第二种显示面板的制备方法的流程图。FIG. 15 is a flowchart of the second method for manufacturing the display panel provided by the present invention.
图16为本发明提供的第三种显示面板的制备方法的流程图。FIG. 16 is a flowchart of a third method for manufacturing a display panel provided by the present invention.
图17为本发明提供的第四种显示面板的制备方法的流程图。FIG. 17 is a flowchart of the fourth method for manufacturing a display panel provided by the present invention.
图18为本发明提供的第五种显示面板的制备方法的流程图。FIG. 18 is a flowchart of the fifth method for manufacturing a display panel provided by the present invention.
图19为本发明提供的第六种显示面板的制备方法的流程图。FIG. 19 is a flowchart of the sixth method for manufacturing a display panel provided by the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
本发明的说明书和权利要求书及所述附图中的术语“第一”、“第二”等是用于区别不同对象,而不是用于描述特定顺序。此外,术语“包括”和“具有”以及它们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元,而是可选地还包括没有列出的步骤或单元,或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或单元。The terms "first" and "second" in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes unlisted steps or units, or optionally also includes Other steps or units inherent to these processes, methods, products or equipment.
在本文中提及“实施例”意味着,结合实施例描述的特定特征、结构或特性可以包含在本发明的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例,也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是,本文所描述的实施例可以与其它实施例相结合。Reference to "embodiments" herein means that a specific feature, structure or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art clearly and implicitly understand that the embodiments described herein can be combined with other embodiments.
请参阅图1和图2,本发明第一实施例提供一种显示面板10,显示面板10包括多个子显示面板100,相邻两个子显示面板100之间通过弹性结构200电连接。其中所述弹性结构200是指具有可拉伸性且可电性连接的结构,所述电性连接包括传输控制信号、电源信号或者数据信号。Referring to FIGS. 1 and 2, the first embodiment of the present invention provides a display panel 10. The display panel 10 includes a plurality of sub-display panels 100, and two adjacent sub-display panels 100 are electrically connected by an elastic structure 200. The elastic structure 200 refers to a structure that is stretchable and can be electrically connected, and the electrical connection includes transmitting control signals, power signals, or data signals.
每一子显示面板100包括基板110、设置于基板110一侧的发光功能层120以及设置在发光功能层120远离基板110一侧的封装层130,封装层130在基板110上的正投影完全落在基板110上,发光功能层120在基板110上的正投影完全落入封装层130在基板110上的正投影中,封装层130与基板110 配合而将发光功能层120进行封装。即发光功能层120能够完全地被封装在封装层130和基板110之间。Each sub-display panel 100 includes a substrate 110, a light-emitting function layer 120 disposed on the side of the substrate 110, and an encapsulation layer 130 disposed on the side of the light-emitting function layer 120 away from the substrate 110. The orthographic projection of the encapsulation layer 130 on the substrate 110 is completely On the substrate 110, the orthographic projection of the light-emitting function layer 120 on the substrate 110 completely falls into the orthographic projection of the encapsulation layer 130 on the substrate 110, and the encapsulation layer 130 cooperates with the substrate 110 to encapsulate the light-emitting function layer 120. That is, the light-emitting function layer 120 can be completely encapsulated between the encapsulation layer 130 and the substrate 110.
本实施例中,将子显示面板100通过弹性结构200电连接使得子显示面板100之间可以拉伸,并且弹性结构200可传输控制信号、电源信号或者数据信号而使子显示面板100之间的显示可以连续,进而使得整个显示面板10的显示画面是整体的。另外,在本实施例中,每一子显示面板100上的发光功能层120均通过设置对应的封装层130进行单独封装,使得整个显示面板10中的封装是被割裂的,而非整个封装在显示面板10上,被割裂在每一子显示面板100上的封装层120不影响整个显示面板10的拉伸性,也就是说将封装层130对应设置在每一子显示面板100上,且子显示面板100之间通过弹性结构200连接,可以提升整个显示面板10的拉伸性。In this embodiment, the sub-display panels 100 are electrically connected through the elastic structure 200 so that the sub-display panels 100 can be stretched, and the elastic structure 200 can transmit control signals, power signals, or data signals, so that the The display can be continuous, so that the display screen of the entire display panel 10 is integrated. In addition, in this embodiment, the light-emitting function layer 120 on each sub-display panel 100 is individually packaged by arranging a corresponding encapsulation layer 130, so that the package in the entire display panel 10 is split, instead of being encapsulated in the entire display panel 10 On the display panel 10, the encapsulation layer 120 split on each sub-display panel 100 does not affect the stretchability of the entire display panel 10, that is, the encapsulation layer 130 is correspondingly disposed on each sub-display panel 100, and The display panels 100 are connected by the elastic structure 200 to improve the stretchability of the entire display panel 10.
本发明提供的显示面板10通过在每一子显示面板100中设置封装层130来对其中的发光功能层120进行封装,从而使得整个显示面板10的封装层130是分割的,而不是整个封装在显示面板10上,使得封装层130形成了多个独立区域而可以拉伸,进而提升显示面板10的整体拉伸性。The display panel 10 provided by the present invention encapsulates the light-emitting function layer 120 in each sub-display panel 100 by arranging an encapsulation layer 130 in each sub-display panel 100, so that the encapsulation layer 130 of the entire display panel 10 is divided instead of being encapsulated in the whole On the display panel 10, the encapsulation layer 130 forms a plurality of independent regions and can be stretched, thereby improving the overall stretchability of the display panel 10.
在进一步的实施例中,弹性结构200包括弹性体210以及设置于其中的电连接线220,相邻两个子显示面板100通过电连接线220来进行电连接。其中弹性体210与基板110相连接,或者两者为一体成型的,所有子显示面板100中的基板110与弹性体210构成整个显示面板10的基底300。所述弹性体210可为橡皮胶等弹性材料制成,所述电连接线220的长度可显著长于显示面板10未拉伸时两个子显示面板100之间的长度。在一些实施例中,所述弹性结构200可为簧圈式或波浪式的电连接线220构成,即,电连接线220本身构成可拉伸的簧圈式或波浪式的可拉伸结构,而无需额外设置弹性体210,也就是说电连接线220具有拉伸性且能提供控制信号、电源信号或者数据信号。在另一些实施例中,所述弹性结构200为弹性体210本身,所述弹性体210即具有拉伸性又能够提供电性连接,无需额外设置电连接线220。In a further embodiment, the elastic structure 200 includes an elastic body 210 and an electrical connection line 220 disposed therein, and two adjacent sub-display panels 100 are electrically connected through the electrical connection line 220. The elastic body 210 is connected to the substrate 110 or the two are integrally formed. The substrate 110 and the elastic body 210 in all the sub-display panels 100 constitute the base 300 of the entire display panel 10. The elastic body 210 may be made of elastic materials such as rubber glue, and the length of the electrical connection line 220 may be significantly longer than the length between the two sub-display panels 100 when the display panel 10 is not stretched. In some embodiments, the elastic structure 200 may be composed of a coil type or wave type electrical connection line 220, that is, the electrical connection line 220 itself constitutes a stretchable coil type or a wave type stretchable structure, There is no need to additionally provide the elastic body 210, that is to say, the electrical connection line 220 is stretchable and can provide control signals, power signals or data signals. In some other embodiments, the elastic structure 200 is the elastic body 210 itself, and the elastic body 210 has stretchability and can provide electrical connection, and no additional electrical connection wire 220 is required.
请参阅图3,在进一步的实施例中,每一子显示面板100中还包括薄膜晶体管层190,薄膜晶体管层190设置在基板110与发光功能层120之间。通过薄膜晶体管层190驱动发光功能层120发光。相邻两个子显示面板100中的薄膜晶体管层190通过电连接线220来进行电连接,以此来实现所有子显示面板100显示画面的连续性。Referring to FIG. 3, in a further embodiment, each sub-display panel 100 further includes a thin film transistor layer 190, and the thin film transistor layer 190 is disposed between the substrate 110 and the light emitting function layer 120. The light-emitting function layer 120 is driven to emit light by the thin film transistor layer 190. The thin film transistor layers 190 in two adjacent sub-display panels 100 are electrically connected through the electrical connection line 220, so as to achieve the continuity of the display images of all the sub-display panels 100.
请参阅图4,在进一步的实施例中,发光功能层120包括第一电极层121、发光层122以及第二电极层123,第一电极层121设置在薄膜晶体管层190远离基板110的一侧,发光层122设置在第一电极层121远离薄膜晶体管层190的一侧,第二电极层123设置在发光层122远离第一电极层121的一侧。4, in a further embodiment, the light-emitting function layer 120 includes a first electrode layer 121, a light-emitting layer 122, and a second electrode layer 123. The first electrode layer 121 is disposed on the side of the thin film transistor layer 190 away from the substrate 110. The light emitting layer 122 is disposed on the side of the first electrode layer 121 away from the thin film transistor layer 190, and the second electrode layer 123 is disposed on the side of the light emitting layer 122 away from the first electrode layer 121.
发光功能层120包括发光区124和与发光区124邻接设置的非发光区125,发光层122设置在发光区124中,第一电极层121与第二电极层123覆盖发光区124和非发光区125,第一电极层121与第二电极层123通过设置在非发光区124的部分电连接,第一电极层121与薄膜晶体管层190电连接。其中,第一电极层121与第二电极层123的电连接方式,可为在第一电极层121和第二电极层123的非发光区124的部分设置导电通孔126而将第一电极层121和第二电极层123电连接。所述导电通孔126可为容置有导电材料的通孔,或者设置有导电柱的通孔。在一些实施例中,薄膜晶体管层190中设有电压节点,第一电极层121通过与电压节点连接而电连接薄膜晶体管层190。The light-emitting functional layer 120 includes a light-emitting area 124 and a non-light-emitting area 125 adjacent to the light-emitting area 124. The light-emitting layer 122 is disposed in the light-emitting area 124. The first electrode layer 121 and the second electrode layer 123 cover the light-emitting area 124 and the non-light-emitting area. 125. The first electrode layer 121 and the second electrode layer 123 are electrically connected through a portion disposed in the non-light emitting area 124, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190. Wherein, the electrical connection between the first electrode layer 121 and the second electrode layer 123 can be that conductive vias 126 are provided in the non-light emitting region 124 of the first electrode layer 121 and the second electrode layer 123 to connect the first electrode layer 121 and the second electrode layer 123 are electrically connected. The conductive through hole 126 may be a through hole containing a conductive material, or a through hole provided with a conductive pillar. In some embodiments, a voltage node is provided in the thin film transistor layer 190, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190 by being connected to the voltage node.
可以理解的是,显示面板10设有驱动电路,驱动电路与薄膜晶体管层190电性连接,驱动电路通过驱动薄膜晶体管层190来控制显示面板10显示。It can be understood that the display panel 10 is provided with a driving circuit, which is electrically connected to the thin film transistor layer 190, and the driving circuit controls the display of the display panel 10 by driving the thin film transistor layer 190.
请参阅图5,本发明第二实施例提供一种显示面板10a,与第一实施例不同的是,在显示面板10a中,子显示面板100还包括第一阻挡层140,第一阻挡层140与发光功能层120设置在基板110的同侧,且第一阻挡层140中设有至少一个贯穿第一阻挡层140的第一沟道150,发光功能层120包括至少一个子像素发光器件160,所述至少一个子像素发光器件160分别设置在所述至少一个第一沟道150中而嵌设于第一阻挡层140中。Referring to FIG. 5, the second embodiment of the present invention provides a display panel 10a. The difference from the first embodiment is that in the display panel 10a, the sub-display panel 100 further includes a first barrier layer 140 and a first barrier layer 140. The light-emitting functional layer 120 is arranged on the same side of the substrate 110, and the first barrier layer 140 is provided with at least one first channel 150 penetrating the first barrier layer 140. The light-emitting functional layer 120 includes at least one sub-pixel light-emitting device 160, The at least one sub-pixel light-emitting device 160 is respectively disposed in the at least one first channel 150 and embedded in the first barrier layer 140.
其中第一阻挡层140的材料可以为有机材料或者无机材料,第一阻挡层140中间的第一沟道150的尺寸可以根据子像素发光器件160的尺寸来设置,将子像素发光器件160设于第一阻挡层140中的第一沟道150中,第一阻挡层140可以阻挡外部水汽从子像素发光器件160的侧向渗入到子像素发光器件160中,以保护子像素发光器件160不被水汽损坏。当采用喷墨打印方法制备子像素发光器件160时,第一阻挡层140还可以在喷墨打印制备过程中阻挡子像素发光器件160的制备材料的溢流。The material of the first barrier layer 140 can be an organic material or an inorganic material. The size of the first channel 150 in the middle of the first barrier layer 140 can be set according to the size of the sub-pixel light-emitting device 160. In the first channel 150 in the first barrier layer 140, the first barrier layer 140 can block external moisture from penetrating into the sub-pixel light-emitting device 160 from the side of the sub-pixel light-emitting device 160 to protect the sub-pixel light-emitting device 160 from being damaged. Water vapor damage. When the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, the first barrier layer 140 can also block the overflow of the preparation material of the sub-pixel light-emitting device 160 during the inkjet printing preparation process.
另外,当采用喷墨打印方法制备子像素发光器件160时,将子像素发光器件160的材料滴入于第一阻挡层140中的第一沟道150时,子像素发光器件160的材料液滴与第一阻挡层140的接触面的接触角 大于90°,进而可以防止子像素发光器件160的材料从第一阻挡层140外溢。另一方面可以选择合适的第一阻挡层140的材料,使得子像素发光器件160的材料滴入后不会外溢。In addition, when the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, when the material of the sub-pixel light-emitting device 160 is dropped into the first channel 150 in the first barrier layer 140, the material of the sub-pixel light-emitting device 160 drops The contact angle of the contact surface with the first barrier layer 140 is greater than 90°, which can prevent the material of the sub-pixel light emitting device 160 from overflowing from the first barrier layer 140. On the other hand, a suitable material of the first barrier layer 140 can be selected so that the material of the sub-pixel light-emitting device 160 will not overflow after being dropped.
值得一提的是,当子显示面板100中的发光功能层120只包括一个子像素发光器件160时,所述第一阻挡层140将该子像素发光器件160的周向包围。当子显示面板100中的发光功能层120中包括多个子像素发光器件160时(参阅图6),第一阻挡层140中的第一沟道150的数量至少与多个子像素发光器件160的数量对应,优选的是,第一沟道150与子像素发光器件160一一对应。It is worth mentioning that when the light-emitting function layer 120 in the sub-display panel 100 includes only one sub-pixel light-emitting device 160, the first barrier layer 140 surrounds the sub-pixel light-emitting device 160 in a circumferential direction. When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160 (see FIG. 6), the number of the first channels 150 in the first barrier layer 140 is at least the same as the number of the plurality of sub-pixel light-emitting devices 160. Correspondingly, preferably, the first channel 150 corresponds to the sub-pixel light-emitting device 160 one-to-one.
其中,所述子像素发光器件160包括所述第一电极层121、发光层122以及第二电极层123。当发光功能层120中包括多个子像素发光器件160时,所述第一电极层121、发光层122以及第二电极层123分别包括对应的多个区域,而形成多个子像素发光器件160。Wherein, the sub-pixel light-emitting device 160 includes the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123. When the light-emitting function layer 120 includes a plurality of sub-pixel light-emitting devices 160, the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123 respectively include a plurality of corresponding regions to form a plurality of sub-pixel light-emitting devices 160.
请再次参阅图5,在进一步的实施例中,封装层130包括第一无机层131,第一无机层131设置在至少一个子像素发光器件160远离基板110的一侧,所述至少一个子像素发光器件160在基板110上的正投影均完全落入第一无机层131在基板110上的正投影中。Please refer to FIG. 5 again. In a further embodiment, the encapsulation layer 130 includes a first inorganic layer 131 disposed on a side of the at least one sub-pixel light-emitting device 160 away from the substrate 110, and the at least one sub-pixel The orthographic projection of the light emitting device 160 on the substrate 110 completely falls into the orthographic projection of the first inorganic layer 131 on the substrate 110.
在本实施例中,封装层130只包括第一无机层131,即只用第一无机层131来对子像素发光器件160进行封装。其中,当子显示面板100只包括一个子像素发光器件160时,第一无机层131可只覆盖所述子像素发光器件160,为了更好地封装,第一无机层131可覆盖到第一阻挡层140以避免水氧渗入(参阅图5)。当子显示面板100中的发光功能层120中包括多个子像素发光器件160时,所述第一无机层131可以包括多个第一无机区域1311(参阅图7和图8),所述每个第一无机区域1311分别覆盖一个子像素发光器件160。所述第一无机层131也可以为整体,第一无机层131覆盖每一子显示面板100中的所有子像素发光器件160,以及覆盖第一阻挡层140。In this embodiment, the encapsulation layer 130 only includes the first inorganic layer 131, that is, only the first inorganic layer 131 is used to encapsulate the sub-pixel light emitting device 160. Wherein, when the sub-display panel 100 only includes one sub-pixel light-emitting device 160, the first inorganic layer 131 may only cover the sub-pixel light-emitting device 160. For better packaging, the first inorganic layer 131 may cover the first barrier. The layer 140 prevents water and oxygen from penetrating (see FIG. 5). When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160, the first inorganic layer 131 may include a plurality of first inorganic regions 1311 (see FIGS. 7 and 8), and each The first inorganic regions 1311 cover one sub-pixel light-emitting device 160 respectively. The first inorganic layer 131 may also be a whole. The first inorganic layer 131 covers all the sub-pixel light-emitting devices 160 in each sub-display panel 100 and covers the first blocking layer 140.
本实施例中,在每一子显示面板100中设置第一阻挡层140和第一无机层131,第一阻挡层140和第一无机层131没有覆盖整个显示面板10a,从而不会影响整个显示面板10a的拉伸性。在制备第一阻挡层140和第一无机层131时可通过图案化方法来制备,具体制备方法可参阅下述制备方法。In this embodiment, the first barrier layer 140 and the first inorganic layer 131 are provided in each sub-display panel 100. The first barrier layer 140 and the first inorganic layer 131 do not cover the entire display panel 10a, so that the entire display is not affected. The stretchability of the panel 10a. The first barrier layer 140 and the first inorganic layer 131 can be prepared by a patterning method when preparing the first barrier layer 140 and the first inorganic layer 131. The specific preparation method can refer to the following preparation method.
请参阅图9,本发明第三实施例提供一种显示面板10b,与第二实施例不同的在,在显示面板10b中,每一子显示面板100中的封装层130还包括第一有机层132,第一有机层132设置在第一无机层131 远离子像素发光器件160的表面上,第一有机层132包括至少一个有机区域1321(参阅图10),所述至少一个有机区域1321分别设于所述至少一个第一沟道150中,第一有机层132包括背离基板110的第一表面1322(参阅图9),第一阻挡层140包括背离基板110的第二表面141,第一表面1322距离基板110的距离L1小于或者等于第二表面141距离基板110的距离L2。在本实施例中,增加第一有机层132进一步保护子像素发光器件160,且每一子像素发光器件160对应一个有机区域1321。Referring to FIG. 9, the third embodiment of the present invention provides a display panel 10b. Different from the second embodiment, in the display panel 10b, the encapsulation layer 130 in each sub-display panel 100 further includes a first organic layer 132. The first organic layer 132 is disposed on the surface of the first inorganic layer 131 away from the sub-pixel light emitting device 160. The first organic layer 132 includes at least one organic region 1321 (refer to FIG. 10), and the at least one organic region 1321 is respectively disposed In the at least one first channel 150, the first organic layer 132 includes a first surface 1322 facing away from the substrate 110 (see FIG. 9), the first barrier layer 140 includes a second surface 141 facing away from the substrate 110, and the first surface The distance L1 between 1322 and the substrate 110 is less than or equal to the distance L2 between the second surface 141 and the substrate 110. In this embodiment, the first organic layer 132 is added to further protect the sub-pixel light-emitting devices 160, and each sub-pixel light-emitting device 160 corresponds to an organic region 1321.
请再次参阅图9,在进一步的实施例中,封装层130还包括第二无机层133,第二无机层133设置在第一有机层132远离子像素发光器件160的一侧。增加第二无机层133进一步保护子像素发光器件160。其中第二无机层133至少覆盖第一有机层132,为了更好的封装,可以设置将第二无机层133覆盖到第一阻挡层140。Please refer to FIG. 9 again. In a further embodiment, the encapsulation layer 130 further includes a second inorganic layer 133, and the second inorganic layer 133 is disposed on a side of the first organic layer 132 away from the sub-pixel light emitting device 160. The addition of the second inorganic layer 133 further protects the sub-pixel light emitting device 160. The second inorganic layer 133 covers at least the first organic layer 132. For better packaging, the second inorganic layer 133 can be provided to cover the first barrier layer 140.
同样的,在本实施例中,在每一子显示面板100中设置第一有机层132和第二无机层133,第一有机层132和第二无机层133没有覆盖整个显示面板,从而不会影响整个显示面板10b的拉伸性。在制备第一有机层132和第二无机层133时可通过图案化方法来制备,具体制备方法可参阅下述制备方法。Similarly, in this embodiment, the first organic layer 132 and the second inorganic layer 133 are provided in each sub-display panel 100. The first organic layer 132 and the second inorganic layer 133 do not cover the entire display panel, so that the The stretchability of the entire display panel 10b is affected. The first organic layer 132 and the second inorganic layer 133 can be prepared by a patterning method when preparing the first organic layer 132 and the second inorganic layer 133. The specific preparation method can refer to the following preparation method.
请参阅图11,本发明第四实施例提供一种显示面板10c,与第二实施例不同的是,在显示面板10c中,每一子显示面板100中的封装层130包括第二有机层134,第二有机层134设置在子像素发光器件160远离基板110的一侧,子像素发光器件160在基板110上的正投影完全落入第二有机层134在基板110上的正投影中。在本实施例中,采用第二有机层134直接封装在子像素发光器件160上。其中所述第二有机层134的材料与子像素发光器件160的材料是不相容的,或者第二有机层134的材料与子像素发光器件160的材料不发生反应,从而不会损坏子像素发光器件160。Referring to FIG. 11, the fourth embodiment of the present invention provides a display panel 10c. The difference from the second embodiment is that in the display panel 10c, the encapsulation layer 130 in each sub-display panel 100 includes a second organic layer 134 The second organic layer 134 is disposed on the side of the sub-pixel light-emitting device 160 away from the substrate 110, and the orthographic projection of the sub-pixel light-emitting device 160 on the substrate 110 completely falls into the orthographic projection of the second organic layer 134 on the substrate 110. In this embodiment, the second organic layer 134 is directly packaged on the sub-pixel light-emitting device 160. The material of the second organic layer 134 is incompatible with the material of the sub-pixel light-emitting device 160, or the material of the second organic layer 134 does not react with the material of the sub-pixel light-emitting device 160, so that the sub-pixel will not be damaged. Light emitting device 160.
同样的,在本实施例中,在每一子显示面板100中设置第二有机层134,第二有机层134没有覆盖整个显示面板,从而不会影响整个显示面板10c的拉伸性。在制备第二有机层134时可通过图案化方法来制备,具体制备方法可参阅下述制备方法。Similarly, in this embodiment, the second organic layer 134 is provided in each sub-display panel 100, and the second organic layer 134 does not cover the entire display panel, so that the stretchability of the entire display panel 10c is not affected. When preparing the second organic layer 134, it can be prepared by a patterning method, and the specific preparation method can refer to the following preparation method.
请参阅图12,本发明第五实施例提供一种显示面板10d,与第二实施例不同的是,在显示面板10d中每一子显示面板100中还包括第二阻挡层170,第二阻挡层170与第一阻挡层140设置在基板110的同侧,且第二阻挡层170外包第一阻挡层140设置,第二阻挡层170与第一阻挡层140之间设有第二沟 道180。其中第二阻挡层170与第一阻挡层140可以采用同一种材料同时形成,也可以不同时形成。Referring to FIG. 12, the fifth embodiment of the present invention provides a display panel 10d. The difference from the second embodiment is that each sub-display panel 100 in the display panel 10d further includes a second barrier layer 170. The layer 170 and the first barrier layer 140 are arranged on the same side of the substrate 110, and the second barrier layer 170 is arranged outside the first barrier layer 140, and a second channel 180 is provided between the second barrier layer 170 and the first barrier layer 140 . The second barrier layer 170 and the first barrier layer 140 may be formed of the same material at the same time, or may be formed at different times.
封装层130还包括第三有机层135,第三有机层135设置在第一无机层131远离基板110的一侧,第一阻挡层140和至少一个子像素发光器件160在基板110上的正投影落入第三有机层135在基板110上的正投影中,且至少部分第三有机层135的边缘位于第二沟道180中。在本实施例中,第三有机层135完全包覆第一阻挡层140、子像素发光器件160,进一步保护子像素发光器件160。The encapsulation layer 130 further includes a third organic layer 135. The third organic layer 135 is disposed on the side of the first inorganic layer 131 away from the substrate 110. The orthographic projection of the first barrier layer 140 and the at least one sub-pixel light emitting device 160 on the substrate 110 It falls into the orthographic projection of the third organic layer 135 on the substrate 110, and at least part of the edge of the third organic layer 135 is located in the second channel 180. In this embodiment, the third organic layer 135 completely covers the first barrier layer 140 and the sub-pixel light-emitting device 160 to further protect the sub-pixel light-emitting device 160.
在进一步的实施例中,封装层130还包括第三无机层136,第三无机层136设置在第三有机层135远离基板110的一侧,且第三有机层135在基板110上的正投影落入第三无机层136在基板110上的正投影中。即第三无机层136完全包覆第三有机层135,进一步保护子像素发光器件160。In a further embodiment, the encapsulation layer 130 further includes a third inorganic layer 136, the third inorganic layer 136 is disposed on the side of the third organic layer 135 away from the substrate 110, and the orthographic projection of the third organic layer 135 on the substrate 110 It falls into the orthographic projection of the third inorganic layer 136 on the substrate 110. That is, the third inorganic layer 136 completely covers the third organic layer 135 to further protect the sub-pixel light-emitting device 160.
在本实例中,在每一子显示面板100中设置上述封装层130,不仅能够较好封装子像素发光器件160,并且不影响整个显示面板10d的拉伸性。In this example, disposing the above-mentioned encapsulation layer 130 in each sub-display panel 100 can not only better encapsulate the sub-pixel light-emitting device 160, but also does not affect the stretchability of the entire display panel 10d.
请参阅图13,本发明还提供一种电子装置20,电子装置20包括如上述任一实施例所述的显示面板10。所述电子装置20可以为但不仅限于为电子书、智能手机(如Android手机、iOS手机、Windows Phone手机等)、平板电脑、柔性掌上电脑、柔性笔记本电脑、移动互联网设备(MID,Mobile Internet Devices)或穿戴式设备等,或者可以为有机电致发光二极管(Organic light-emitting diodes,OLED)显示装置、有源矩阵有机发光二极管(Active Matrix Organic Light Emitting Diode,AMOLED)电子装置。Please refer to FIG. 13, the present invention also provides an electronic device 20. The electronic device 20 includes the display panel 10 as described in any of the foregoing embodiments. The electronic device 20 may be, but is not limited to, an e-book, a smart phone (such as an Android phone, an iOS phone, a Windows Phone phone, etc.), a tablet computer, a flexible handheld computer, a flexible notebook computer, and a mobile Internet device (MID, Mobile Internet Devices). ) Or wearable devices, etc., or may be organic light-emitting diodes (OLED) display devices, active matrix organic light emitting diodes (Active Matrix Organic Light Emitting Diode, AMOLED) electronic devices.
请参阅图14、图1和图2,本发明还提供第一种显示面板10的制备方法,显示面板10的制备方法包括步骤S100、步骤S200和步骤S300。详细步骤如下所述。Referring to FIG. 14, FIG. 1 and FIG. 2, the present invention also provides a first method for manufacturing the display panel 10. The method for manufacturing the display panel 10 includes step S100, step S200 and step S300. The detailed steps are as follows.
步骤S100,提供多个基板110,将相邻两个基板110之间通过弹性体210连接。其中多个基板110相互连接而构成整个显示面板10的基底300,所述基底300具有拉伸性,所述弹性体210可以与基板100两者一体成型,也可以分开形成,其中弹性体210的拉伸强度大于基板100的拉伸强度,以使基底300能够较好地在横纵方向拉伸。其中弹性体210具有拉伸性且能够提供电性连接,所述电性连接包括传输控制信号、电源信号或者数据信号。In step S100, a plurality of substrates 110 are provided, and two adjacent substrates 110 are connected by an elastic body 210. A plurality of substrates 110 are connected to each other to form a base 300 of the entire display panel 10. The base 300 has stretchability. The elastic body 210 can be integrally formed with the substrate 100 or formed separately. The tensile strength is greater than the tensile strength of the substrate 100, so that the substrate 300 can be better stretched in the horizontal and vertical directions. The elastic body 210 has stretchability and can provide electrical connections, and the electrical connections include transmission of control signals, power signals or data signals.
步骤S200,在每个基板110的一侧形成发光功能层120。In step S200, a light-emitting function layer 120 is formed on one side of each substrate 110.
步骤S300,在发光功能层120远离基板110的一侧形成封装层130,封装层130在基板110上的正 投影完全落在基板110上,且发光功能层120在基板110上的正投影完全落入封装层130在基板110上的正投影中。在每一个基板110上形成彼此相间隔的封装层130,每一基板110、发光功能层120以及封装层130构成一个子显示面板100。In step S300, the encapsulation layer 130 is formed on the side of the light-emitting function layer 120 away from the substrate 110, the orthographic projection of the encapsulation layer 130 on the substrate 110 completely falls on the substrate 110, and the orthographic projection of the luminous function layer 120 on the substrate 110 completely falls on the substrate 110. Into the orthographic projection of the packaging layer 130 on the substrate 110. An encapsulation layer 130 spaced apart from each other is formed on each substrate 110, and each substrate 110, the light-emitting function layer 120 and the encapsulation layer 130 constitute a sub-display panel 100.
本发明提供的显示面板10的制备方法通过在每一子显示面板100中形成封装层130来对其中的发光功能层120进行封装,从而使得整个显示面板10的封装层130是分割的,而不是整个封装在显示面板10上,使得整个显示面板10的封装层130形成了多个独立区域而可以拉伸,进而提升显示面板10的整体拉伸性。The manufacturing method of the display panel 10 provided by the present invention encapsulates the light-emitting function layer 120 therein by forming an encapsulation layer 130 in each sub-display panel 100, so that the encapsulation layer 130 of the entire display panel 10 is divided instead of The entire encapsulation is on the display panel 10, so that the encapsulation layer 130 of the entire display panel 10 forms a plurality of independent regions and can be stretched, thereby improving the overall stretchability of the display panel 10.
在进一步的实施例中,所述形成发光功能层120的方法包括喷墨打印法、真空镀膜法或者涂布法。所述形成封装层130包括喷墨打印法、真空镀膜法、涂布法或者蚀刻法。In a further embodiment, the method for forming the light-emitting functional layer 120 includes an inkjet printing method, a vacuum coating method or a coating method. The forming of the encapsulation layer 130 includes an inkjet printing method, a vacuum coating method, a coating method or an etching method.
请参阅图15和图3,本发明还提供第二种显示面板10的制备方法,与图14所示不同的是,在步骤S100和步骤S200之间,还包括步骤S100a和步骤S100b。Referring to FIGS. 15 and 3, the present invention also provides a second method for manufacturing the display panel 10. The difference from that shown in FIG. 14 is that between step S100 and step S200, step S100a and step S100b are further included.
步骤S100a,在每个基板110的一侧形成薄膜晶体管层190。In step S100a, a thin film transistor layer 190 is formed on one side of each substrate 110.
步骤S100b,在弹性体210中形成电连接线220,每个基板110上的薄膜晶体管层190通过电连接线220电连接。其中,电连接线220用于传输控制信号、电源信号或者数据信号,在该制备方法中,所述弹性体210由可拉伸性的材料制成而能够拉伸。电连接线220与弹性体210构成弹性结构200,该弹性结构200将相邻的两个子显示面板100电连接。In step S100b, an electrical connection line 220 is formed in the elastic body 210, and the thin film transistor layer 190 on each substrate 110 is electrically connected by the electrical connection line 220. Wherein, the electrical connection line 220 is used to transmit control signals, power signals or data signals. In this preparation method, the elastic body 210 is made of a stretchable material and can be stretched. The electrical connection line 220 and the elastic body 210 constitute an elastic structure 200, and the elastic structure 200 electrically connects two adjacent sub-display panels 100.
所述步骤S200包括步骤S200-Ⅰ。The step S200 includes step S200-I.
步骤S200-Ⅰ,在薄膜晶体管层190远离基板110的一侧形成发光功能层120。In step S200-I, the light emitting function layer 120 is formed on the side of the thin film transistor layer 190 away from the substrate 110.
请参阅图4,在进一步的实施例中,所述步骤S200-Ⅰ具体包括:在薄膜晶体管层190远离基板110的一侧形成第一电极层121,在第一电极层121远离薄膜晶体管层190的一侧形成发光层122,在发光层122远离第一电极层121的一侧形成第二电极层123。即,所述光功能层120由第一电极层121、发光层122以及第二电极层123构成。4, in a further embodiment, the step S200-I specifically includes: forming a first electrode layer 121 on the side of the thin film transistor layer 190 away from the substrate 110, and on the first electrode layer 121 away from the thin film transistor layer 190 The light-emitting layer 122 is formed on the side of the light-emitting layer 122, and the second electrode layer 123 is formed on the side of the light-emitting layer 122 away from the first electrode layer 121. That is, the optical function layer 120 is composed of a first electrode layer 121, a light emitting layer 122, and a second electrode layer 123.
发光功能层120包括发光区124和与发光区124邻接设置的非发光区125,发光层122形成在发光区124中,第一电极层121与第二电极层123覆盖发光区124和非发光区125,第一电极层121与第二 电极层123通过形成在非发光区124的部分电连接,第一电极层121与薄膜晶体管层190电连接。其中,第一电极层121与第二电极层123的电连接方式,可为在第一电极层121和第二电极层123的非发光区124的部分形成导电通孔126而将第一电极层121和第二电极层123电连接。所述导电通孔126可为容置有导电材料的通孔,或者设置有导电柱的通孔。在一些实施例中,薄膜晶体管层190中形成有电压节点,第一电极层121通过与电压节点连接而电连接薄膜晶体管层190。The light-emitting functional layer 120 includes a light-emitting area 124 and a non-light-emitting area 125 adjacent to the light-emitting area 124. The light-emitting layer 122 is formed in the light-emitting area 124. The first electrode layer 121 and the second electrode layer 123 cover the light-emitting area 124 and the non-light-emitting area. 125. The first electrode layer 121 and the second electrode layer 123 are electrically connected through a portion formed in the non-light emitting region 124, and the first electrode layer 121 and the thin film transistor layer 190 are electrically connected. Wherein, the electrical connection between the first electrode layer 121 and the second electrode layer 123 may be that conductive vias 126 are formed in the non-light emitting region 124 of the first electrode layer 121 and the second electrode layer 123 to connect the first electrode layer 121 and the second electrode layer 123 are electrically connected. The conductive through hole 126 may be a through hole containing a conductive material, or a through hole provided with a conductive pillar. In some embodiments, a voltage node is formed in the thin film transistor layer 190, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190 by being connected to the voltage node.
请参阅图16和图5,本发明还提供第三种显示面板10的制备方法,与图14所示不同的是,在步骤S100和步骤S200之间还包括步骤S400。Referring to FIGS. 16 and 5, the present invention also provides a third method for manufacturing the display panel 10. The difference from that shown in FIG. 14 is that step S400 is further included between step S100 and step S200.
步骤S400,在基板110的一侧形成第一阻挡层140,且第一阻挡层140中形成至少一个贯穿第一阻挡层140的第一沟道150。In step S400, a first barrier layer 140 is formed on one side of the substrate 110, and at least one first channel 150 penetrating the first barrier layer 140 is formed in the first barrier layer 140.
所述步骤S200包括步骤S200-Ⅱ。The step S200 includes step S200-II.
步骤S200-Ⅱ,在每个基板110的一侧形成发光功能层120,且发光功能层120与第一阻挡层140形成在基板110的同侧,发光功能层120包括至少一个子像素发光器件160,所述至少一个子像素发光器件160分别形成在所述至少一个第一沟道150中而嵌设于第一阻挡层140中。In step S200-II, a light-emitting functional layer 120 is formed on one side of each substrate 110, and the light-emitting functional layer 120 and the first barrier layer 140 are formed on the same side of the substrate 110, and the light-emitting functional layer 120 includes at least one sub-pixel light-emitting device 160 The at least one sub-pixel light-emitting device 160 is respectively formed in the at least one first channel 150 and embedded in the first barrier layer 140.
其中第一阻挡层140的材料可以为有机材料或者无机材料,第一阻挡层140中间的第一沟道150的尺寸可以根据子像素发光器件160的尺寸来设置,将子像素发光器件160形成于第一阻挡层140中的第一沟道150中,第一阻挡层140可以阻挡外部水汽从子像素发光器件160的侧向渗入到子像素发光器件160中,以保护子像素发光器件160不被水汽损坏。当采用喷墨打印方法制备子像素发光器件160时,第一阻挡层140还可以在制备过程中阻挡子像素发光器件160的制备材料的溢流。The material of the first barrier layer 140 can be an organic material or an inorganic material. The size of the first channel 150 in the middle of the first barrier layer 140 can be set according to the size of the sub-pixel light-emitting device 160, and the sub-pixel light-emitting device 160 is formed on In the first channel 150 in the first barrier layer 140, the first barrier layer 140 can block external moisture from penetrating into the sub-pixel light-emitting device 160 from the side of the sub-pixel light-emitting device 160 to protect the sub-pixel light-emitting device 160 from being damaged. Water vapor damage. When the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, the first barrier layer 140 can also block the overflow of the preparation material of the sub-pixel light-emitting device 160 during the preparation process.
另外,当采用喷墨打印方法制备子像素发光器件160时,将子像素发光器件160的材料滴入与第一阻挡层140中的第一沟道150时,子像素发光器件16的材料液滴与第一阻挡层140的接触面的接触角大于90°,进而可以防止子像素发光器件160的材料从第一阻挡层140外溢。另一方面可以选择合适的第一阻挡层140的材料,使得子像素发光器件160的材料滴入后不会外溢。In addition, when the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, when the material of the sub-pixel light-emitting device 160 is dropped into the first channel 150 in the first barrier layer 140, the material of the sub-pixel light-emitting device 16 drops The contact angle of the contact surface with the first barrier layer 140 is greater than 90°, which can prevent the material of the sub-pixel light emitting device 160 from overflowing from the first barrier layer 140. On the other hand, a suitable material of the first barrier layer 140 can be selected so that the material of the sub-pixel light-emitting device 160 will not overflow after being dropped.
值得一提的是,当子显示面板100中的发光功能层120只包括一个子像素发光器件160时,所述第一阻挡层140将该子像素发光器件160的周向包围。当子显示面板100中的发光功能层120中包括多个 子像素发光器件160时(参阅图6),第一阻挡层140中的第一沟道150的至少与多个子像素发光器件160的数量对应,优选的是,第一沟道150与子像素发光器件160一一对应。It is worth mentioning that when the light-emitting function layer 120 in the sub-display panel 100 includes only one sub-pixel light-emitting device 160, the first barrier layer 140 surrounds the sub-pixel light-emitting device 160 in a circumferential direction. When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160 (see FIG. 6), the first channel 150 in the first barrier layer 140 at least corresponds to the number of the plurality of sub-pixel light-emitting devices 160 Preferably, the first channel 150 corresponds to the sub-pixel light emitting device 160 one to one.
其中,所述子像素发光器件160包括所述第一电极层121、发光层122以及第二电极层123。当发光功能层120中包括多个子像素发光器件160时,所述第一电极层121、发光层122以及第二电极层123对应分成多个区域,而形成多个子像素发光器件160。Wherein, the sub-pixel light-emitting device 160 includes the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123. When the light-emitting function layer 120 includes a plurality of sub-pixel light-emitting devices 160, the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123 are correspondingly divided into a plurality of regions to form a plurality of sub-pixel light-emitting devices 160.
在进一步的实施例中,所述步骤S300包括步骤S310。In a further embodiment, the step S300 includes step S310.
步骤S310,在至少一个子像素发光器件160远离基板110的一侧形成第一无机层131,第一无机层131在基板110上的正投影完全落在基板110上,至少一个子像素发光器件160在基板110上的正投影均完全落入第一无机层131在基板110上的正投影中。In step S310, a first inorganic layer 131 is formed on the side of the at least one sub-pixel light-emitting device 160 away from the substrate 110. The orthographic projection of the first inorganic layer 131 on the substrate 110 completely falls on the substrate 110, and the at least one sub-pixel light-emitting device 160 All the orthographic projections on the substrate 110 completely fall into the orthographic projections of the first inorganic layer 131 on the substrate 110.
在本实施例中,封装层130只包括一层第一无机层131,即只用第一无机层131来对子像素发光器件160进行封装。其中,当子显示面板100只包括一个子像素发光器件160时,第一无机层131可只覆盖所述子像素发光器件160(参阅图8),为了更好地封装,第一无机层131可覆盖到第一阻挡层140以避免水氧深入(参阅图5)。当子显示面板100中的发光功能层120中包括多个子像素发光器件160时,所述第一无机层131可以包括多个第一无机区域1311(参阅图8),所述每个第一无机区域1311分别覆盖一个子像素发光器件160。所述第一无机层131也可以为整体,第一无机层131覆盖所有子像素发光器件160,以及覆盖第一阻挡层140。In this embodiment, the encapsulation layer 130 only includes a first inorganic layer 131, that is, only the first inorganic layer 131 is used to encapsulate the sub-pixel light-emitting device 160. Wherein, when the sub-display panel 100 includes only one sub-pixel light-emitting device 160, the first inorganic layer 131 may only cover the sub-pixel light-emitting device 160 (see FIG. 8). For better packaging, the first inorganic layer 131 may Cover to the first barrier layer 140 to avoid penetration of water and oxygen (see FIG. 5). When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160, the first inorganic layer 131 may include a plurality of first inorganic regions 1311 (see FIG. 8), and each first inorganic layer The regions 1311 cover one sub-pixel light-emitting device 160 respectively. The first inorganic layer 131 may also be a whole. The first inorganic layer 131 covers all the sub-pixel light-emitting devices 160 and covers the first blocking layer 140.
本实施例中,第一阻挡层140和第一无机层131没有覆盖整个显示面板,而是形成在每一基板110上从而不会影响整个显示面板10的拉伸性。In this embodiment, the first barrier layer 140 and the first inorganic layer 131 do not cover the entire display panel, but are formed on each substrate 110 so as not to affect the stretchability of the entire display panel 10.
请参阅图17、图9和图10,本发明还提供第四种显示面板10的制备方法,与图16不同的是,所述步骤S310后面还包括步骤S320。Referring to FIG. 17, FIG. 9, and FIG. 10, the present invention also provides a fourth method for manufacturing the display panel 10. The difference from FIG. 16 is that step S310 is followed by step S320.
步骤S320,在第一无机层131远离子像素发光器件160的表面上形成第一有机层132,第一有机层132包括至少一个有机区域1321,所述至少一个有机区域1321分别形成于所述至少一个第一沟道150中,第一有机层132包括背离基板110的第一表面1322,第一阻挡层140包括背离基板110的第二表面141,第一表面1322距离基板110的距离L1小于或者等于第二表面1322距离基板110的距离L2。在本 实施例中,增加形成第一有机层132进一步保护子像素发光器件160,且每一子像素发光器件160对应一个有机区域1321。In step S320, a first organic layer 132 is formed on the surface of the first inorganic layer 131 away from the sub-pixel light emitting device 160. The first organic layer 132 includes at least one organic region 1321, and the at least one organic region 1321 is respectively formed on the at least one In a first channel 150, the first organic layer 132 includes a first surface 1322 facing away from the substrate 110, and the first barrier layer 140 includes a second surface 141 facing away from the substrate 110. The distance L1 between the first surface 1322 and the substrate 110 is less than or It is equal to the distance L2 between the second surface 1322 and the substrate 110. In this embodiment, the first organic layer 132 is additionally formed to further protect the sub-pixel light-emitting devices 160, and each sub-pixel light-emitting device 160 corresponds to an organic region 1321.
在本实施例中,所形成的第一阻挡层的140的高度至少为1μm,当采用喷墨打印方法将第一有机层132的材料滴入第一沟道150中时不会溢流。第一有机层132的材料通过准确控制住液滴的体积和滴入的位置,然后经过干燥、修复形成平坦的第一有机层132。In this embodiment, the height of the formed first barrier layer 140 is at least 1 μm, and when the material of the first organic layer 132 is dropped into the first channel 150 by an inkjet printing method, it will not overflow. The material of the first organic layer 132 accurately controls the volume of the droplet and the drop position, and then is dried and repaired to form a flat first organic layer 132.
在进一步的实施例中,在所述步骤S320后面还包括步骤S330。In a further embodiment, step S330 is further included after step S320.
步骤S330,在第一有机层132远离子像素发光器件160的一侧形成第二无机层133。增加第二无机层133进一步保护子像素发光器件160。其中第二无机层133至少覆盖所述第一有机层132,为了更好的封装,可以设置将第二无机层133覆盖到第一阻挡层140。In step S330, a second inorganic layer 133 is formed on the side of the first organic layer 132 away from the sub-pixel light emitting device 160. The addition of the second inorganic layer 133 further protects the sub-pixel light emitting device 160. The second inorganic layer 133 covers at least the first organic layer 132. For better packaging, the second inorganic layer 133 may be provided to cover the first barrier layer 140.
请参阅图18和图11,本发明还提供第五种显示面板10的制备方法,与图16不同的是,所述步骤S310替换为步骤S340。Referring to FIGS. 18 and 11, the present invention also provides a fifth method for manufacturing the display panel 10. The difference from FIG. 16 is that step S310 is replaced with step S340.
步骤S340,在子像素发光器件160远离基板110的一侧形成第二有机层134,第二有机层134在基板110上的正投影完全落在基板110上,子像素发光器件160在基板110上的正投影完全落入第二有机层134在基板110上的正投影中。In step S340, a second organic layer 134 is formed on the side of the sub-pixel light-emitting device 160 away from the substrate 110. The orthographic projection of the second organic layer 134 on the substrate 110 completely falls on the substrate 110, and the sub-pixel light-emitting device 160 is on the substrate 110. The orthographic projection of the second organic layer 134 completely falls into the orthographic projection of the second organic layer 134 on the substrate 110.
在本实施例中,采用第二有机层134直接封装形成在子像素发光器件160上,且第二有机层134没有覆盖整个显示面板,从而不会影响整个显示面板10的拉伸性。其中所述第二有机层134的材料与子像素发光器件160的材料是不相容的,或者第二有机层134的材料与子像素发光器件160的材料不发生反应,从而不会损坏子像素发光器件160。In this embodiment, the second organic layer 134 is directly encapsulated and formed on the sub-pixel light emitting device 160, and the second organic layer 134 does not cover the entire display panel, so that the stretchability of the entire display panel 10 is not affected. The material of the second organic layer 134 is incompatible with the material of the sub-pixel light-emitting device 160, or the material of the second organic layer 134 does not react with the material of the sub-pixel light-emitting device 160, so that the sub-pixel will not be damaged. Light emitting device 160.
请参阅图19和图12,本发明还提供第六种显示面板10的制备方法,与图16不同的是,在步骤S400和步骤S200-Ⅱ之间还包括步骤S500。Referring to FIGS. 19 and 12, the present invention also provides a sixth method for manufacturing the display panel 10. The difference from FIG. 16 is that step S500 is further included between step S400 and step S200-II.
步骤S500,在基板110的一侧形成第二阻挡层170,第二阻挡层170与第一阻挡层140形成在基板110的同侧,且第二阻挡层170外包第一阻挡层140设置,第二阻挡层170与第一阻挡层140之间形成第二沟道180。在其他实施例中,第二阻挡层170和第一阻挡层140可以采用同一种材料同时形成。In step S500, a second barrier layer 170 is formed on one side of the substrate 110. The second barrier layer 170 and the first barrier layer 140 are formed on the same side of the substrate 110, and the second barrier layer 170 is disposed outside the first barrier layer 140. A second channel 180 is formed between the second barrier layer 170 and the first barrier layer 140. In other embodiments, the second barrier layer 170 and the first barrier layer 140 may be formed of the same material at the same time.
在所述步骤S310后面还包括步骤S350。Step S350 is also included after the step S310.
步骤S350,在第一无机层131远离基板110的一侧形成第三有机层135,第一阻挡层140和至少一个子像素发光器件160在基板110上的正投影落入第三有机层135在基板110上的正投影中,且至少部分第三有机层135的边缘位于第二沟道180中。在本实施例中,第三有机层135完全包覆第一阻挡层140、子像素发光器件160,进一步保护子像素发光器件160。当第三有机层135的材料液滴滴入到第一沟道150以及第一阻挡层140后,第二阻挡层170可以阻挡第三有机材料135的材料液滴外溢,最终形成的第三有机层135的边缘至少有一部分是落入第二沟道180中。In step S350, a third organic layer 135 is formed on the side of the first inorganic layer 131 away from the substrate 110. The orthographic projection of the first barrier layer 140 and the at least one sub-pixel light emitting device 160 on the substrate 110 falls into the third organic layer 135. In the orthographic projection on the substrate 110, at least part of the edge of the third organic layer 135 is located in the second channel 180. In this embodiment, the third organic layer 135 completely covers the first barrier layer 140 and the sub-pixel light-emitting device 160 to further protect the sub-pixel light-emitting device 160. When the material droplets of the third organic layer 135 drip into the first channel 150 and the first barrier layer 140, the second barrier layer 170 can prevent the material droplets of the third organic material 135 from overflowing, and finally form the third organic material. At least a part of the edge of the layer 135 falls into the second trench 180.
在进一步的实施例中,在所述步骤S350后面还包括步骤S360。In a further embodiment, step S360 is further included after the step S350.
步骤S360,在第三有机层135远离基板110的一侧形成第三无机层136,第三有机层135在基板110上的正投影落入第三无机层136在基板110上的正投影中。即第三无机层136完全包覆第三有机层135,进一步保护子像素发光器件160。In step S360, a third inorganic layer 136 is formed on the side of the third organic layer 135 away from the substrate 110, and the orthographic projection of the third organic layer 135 on the substrate 110 falls into the orthographic projection of the third inorganic layer 136 on the substrate 110. That is, the third inorganic layer 136 completely covers the third organic layer 135 to further protect the sub-pixel light-emitting device 160.
值得一提的是,上述各实施例中封装层130中各膜层的制备方法均可采用喷墨打印法、真空镀膜法、涂布法或者蚀刻法来形成,由于各封装层130均是对每一子显示面板100进行封装,对于整个显示面板10而言,整个封装是分割的,因而可提升整个显示面板10的拉伸性。It is worth mentioning that the preparation methods of each film layer in the encapsulation layer 130 in the above embodiments can be formed by inkjet printing, vacuum coating, coating or etching, because each encapsulation layer 130 is right Each sub-display panel 100 is packaged. For the entire display panel 10, the entire package is divided, so the stretchability of the entire display panel 10 can be improved.
以上所述实施例仅表达了本发明的几种实施方式,其描述较为具体和详细,但并不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干变形和改进,这些都属于本发明的保护范围。因此,本发明专利的保护范围应以所附权利要求为准。The above-mentioned embodiments only express several embodiments of the present invention, and the descriptions are relatively specific and detailed, but they should not be interpreted as limiting the scope of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (20)

  1. 一种显示面板,其特征在于,所述显示面板包括多个子显示面板,相邻两个所述子显示面板之间通过弹性结构电连接;A display panel, characterized in that, the display panel includes a plurality of sub-display panels, and two adjacent sub-display panels are electrically connected by an elastic structure;
    每一所述子显示面板包括基板、设置于所述基板一侧的发光功能层以及设置在所述发光功能层远离所述基板一侧的封装层,所述封装层在所述基板上的正投影完全落在所述基板上,所述发光功能层在所述基板上的正投影完全落入所述封装层在所述基板上的正投影中,所述封装层与所述基板配合而将所述发光功能层进行封装。Each of the sub-display panels includes a substrate, a light-emitting function layer provided on one side of the substrate, and an encapsulation layer provided on the side of the light-emitting function layer away from the substrate, and the encapsulation layer is positioned on the substrate. The projection completely falls on the substrate, the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the encapsulation layer on the substrate, and the encapsulation layer cooperates with the substrate to combine The light-emitting function layer is packaged.
  2. 如权利要求1所述的显示面板,其特征在于,所述子显示面板还包括第一阻挡层,所述第一阻挡层与所述发光功能层设置在所述基板的同侧,且所述第一阻挡层中设有至少一个贯穿所述第一阻挡层的第一沟道,所述发光功能层包括至少一个子像素发光器件,所述至少一个子像素发光器件分别设置在所述至少一个第一沟道中而嵌设于所述第一阻挡层中。7. The display panel of claim 1, wherein the sub-display panel further comprises a first barrier layer, the first barrier layer and the light-emitting function layer are disposed on the same side of the substrate, and the The first barrier layer is provided with at least one first channel penetrating the first barrier layer, the light-emitting function layer includes at least one sub-pixel light-emitting device, and the at least one sub-pixel light-emitting device is respectively disposed on the at least one The first channel is embedded in the first barrier layer.
  3. 如权利要求2所述的显示面板,其特征在于,所述封装层包括第一无机层,所述第一无机层设置在所述至少一个子像素发光器件远离所述基板的一侧,所述至少一个子像素发光器件在所述基板上的正投影均完全落入所述第一无机层在所述基板上的正投影中。3. The display panel of claim 2, wherein the encapsulation layer comprises a first inorganic layer, and the first inorganic layer is disposed on a side of the at least one sub-pixel light-emitting device away from the substrate, and The orthographic projection of at least one sub-pixel light-emitting device on the substrate completely falls into the orthographic projection of the first inorganic layer on the substrate.
  4. 如权利要求3所述的显示面板,其特征在于,所述封装层还包括第一有机层,所述第一有机层设置在所述第一无机层远离所述子像素发光器件的表面上,所述第一有机层包括至少一个有机区域,所述至少一个有机区域分别设于所述至少一个第一沟道中,所述第一有机层包括背离所述基板的第一表面,所述第一阻挡层包括背离所述基板的第二表面,所述第一表面距离所述基板的距离小于或者等于所述第二表面距离所述基板的距离。3. The display panel of claim 3, wherein the encapsulation layer further comprises a first organic layer, and the first organic layer is disposed on a surface of the first inorganic layer away from the sub-pixel light emitting device, The first organic layer includes at least one organic region, the at least one organic region is respectively provided in the at least one first channel, the first organic layer includes a first surface facing away from the substrate, the first The barrier layer includes a second surface facing away from the substrate, and the distance between the first surface and the substrate is less than or equal to the distance between the second surface and the substrate.
  5. 如权利要求4所述的显示面板,其特征在于,所述封装层还包括第二无机层,所述第二无机层设置在所述第一有机层远离所述子像素发光器件的一侧。5. The display panel of claim 4, wherein the encapsulation layer further comprises a second inorganic layer, and the second inorganic layer is disposed on a side of the first organic layer away from the sub-pixel light emitting device.
  6. 如权利要求2所述的显示面板,其特征在于,所述封装层包括第二有机层,所述第二有机层设置在所述子像素发光器件远离所述基板的一侧,所述子像素发光器件在所述基板上的正投影完全落入所述第二有机层在所述基板上的正投影中。7. The display panel of claim 2, wherein the encapsulation layer comprises a second organic layer, and the second organic layer is disposed on a side of the sub-pixel light-emitting device away from the substrate, and the sub-pixel The orthographic projection of the light emitting device on the substrate completely falls into the orthographic projection of the second organic layer on the substrate.
  7. 如权利要求3所述的显示面板,其特征在于,所述显示面板还包括第二阻挡层,所述第二阻挡层与所述第一阻挡层设置在所述基板的同侧,且所述第二阻挡层外包所述第一阻挡层设置,所述第二阻挡层与所述第一阻挡层之间设有第二沟道;5. The display panel of claim 3, wherein the display panel further comprises a second barrier layer, the second barrier layer and the first barrier layer are disposed on the same side of the substrate, and the The second barrier layer is arranged outside the first barrier layer, and a second channel is provided between the second barrier layer and the first barrier layer;
    所述封装层还包括第三有机层,所述第三有机层设置在所述第一无机层远离所述基板的一侧,所述第一阻挡层和所述至少一个子像素发光器件在所述基板上的正投影落入所述第三有机层在所述基板上的正投影中,且至少部分所述第三有机层的边缘位于所述第二沟道中。The encapsulation layer further includes a third organic layer, the third organic layer is disposed on a side of the first inorganic layer away from the substrate, and the first barrier layer and the at least one sub-pixel light-emitting device are in the The orthographic projection on the substrate falls into the orthographic projection of the third organic layer on the substrate, and at least part of the edge of the third organic layer is located in the second channel.
  8. 如权利要求7所述的显示面板,其特征在于,所述封装层还包括第三无机层,所述第三无机层设置在所述第三有机层远离所述基板的一侧,且所述第三有机层在所述基板上的正投影落入所述第三无机层在所述基板上的正投影中。7. The display panel of claim 7, wherein the encapsulation layer further comprises a third inorganic layer, the third inorganic layer is disposed on a side of the third organic layer away from the substrate, and the The orthographic projection of the third organic layer on the substrate falls into the orthographic projection of the third inorganic layer on the substrate.
  9. 如权利要求1所述的显示面板,其特征在于,所述子显示面板还包括薄膜晶体管层,所述薄膜晶体管层设置在所述基板与所述发光功能层之间。8. The display panel of claim 1, wherein the sub-display panel further comprises a thin film transistor layer, and the thin film transistor layer is disposed between the substrate and the light-emitting function layer.
  10. 如权利要求9所述的显示面板,其特征在于,所述发光功能层包括第一电极层、发光层以及第二电极层,所述第一电极层设置在所述薄膜晶体管层远离所述基板的一侧,所述发光层设置在所述第一电极层远离所述薄膜晶体管层的一侧,所述第二电极层设置在所述发光层远离所述第一电极层的一层;9. The display panel of claim 9, wherein the light-emitting function layer comprises a first electrode layer, a light-emitting layer, and a second electrode layer, and the first electrode layer is disposed on the thin film transistor layer away from the substrate. On one side, the light-emitting layer is provided on the side of the first electrode layer away from the thin film transistor layer, and the second electrode layer is provided on the light-emitting layer away from the first electrode layer;
    所述发光功能层包括发光区和与所述发光区邻接设置的非发光区,所述发光层设置在所述发光区中,所述第一电极层与所述第二电极层覆盖所述发光区和非发光区,所述第一电极层与所述第二电极层通过设置在所述非发光区的部分电连接,所述第一电极层与所述薄膜晶体管层电连接。The light-emitting functional layer includes a light-emitting area and a non-light-emitting area arranged adjacent to the light-emitting area, the light-emitting layer is arranged in the light-emitting area, and the first electrode layer and the second electrode layer cover the light-emitting area. The first electrode layer and the second electrode layer are electrically connected through a portion provided in the non-light emitting area, and the first electrode layer is electrically connected to the thin film transistor layer.
  11. 一种显示面板的制备方法,其特征在于,所述显示面板的制备方法包括:A method for preparing a display panel, characterized in that, the method for preparing the display panel includes:
    提供多个基板,将相邻两个所述基板之间通过弹性体连接;Provide a plurality of substrates, and connect two adjacent substrates through an elastic body;
    在每个所述基板的一侧形成发光功能层;Forming a light-emitting function layer on one side of each of the substrates;
    在所述发光功能层远离所述基板的一侧形成封装层,所述封装层在所述基板上的正投影完全落在所述基板上,且所述发光功能层在所述基板上的正投影完全落入所述封装层在所述基板上的正投影中。An encapsulation layer is formed on the side of the light-emitting function layer away from the substrate, the orthographic projection of the encapsulation layer on the substrate completely falls on the substrate, and the light-emitting function layer is on the substrate. The projection falls completely into the orthographic projection of the packaging layer on the substrate.
  12. 如权利要求11所述的显示面板的制备方法,其特征在于,在所述“提供多个基板,将相邻两个所述基板之间通过弹性体连接”和所述“在每个所述基板的一侧形成发光功能层”之间,所述显示面 板的制备方法还包括:11. The method of manufacturing a display panel according to claim 11, wherein said "providing a plurality of substrates and connecting two adjacent substrates through an elastomer" and said "providing a plurality of substrates Between the light-emitting functional layer formed on one side of the substrate, the method for manufacturing the display panel further includes:
    在所述基板的一侧形成第一阻挡层,所述第一阻挡层中形成至少一个贯穿所述第一阻挡层的第一沟道;Forming a first barrier layer on one side of the substrate, and at least one first channel penetrating the first barrier layer is formed in the first barrier layer;
    所述“在每个所述基板的一侧形成发光功能层”包括:The "forming a light-emitting function layer on one side of each of the substrates" includes:
    在每个所述基板的一侧形成发光功能层,且所述发光功能层与所述第一阻挡层形成在所述基板的同侧,且所述发光功能层包括至少一个子像素发光器件,所述至少一个子像素发光器件分别形成在所述至少一个第一沟道中而嵌设于所述第一阻挡层中。A light-emitting functional layer is formed on one side of each substrate, and the light-emitting functional layer and the first barrier layer are formed on the same side of the substrate, and the light-emitting functional layer includes at least one sub-pixel light-emitting device, The at least one sub-pixel light-emitting device is respectively formed in the at least one first channel and embedded in the first barrier layer.
  13. 如权利要求12所述的显示面板的制备方法,其特征在于,所述“在所述发光功能层远离所述基板的一侧形成封装层,所述封装层在所述基板上的正投影完全落在所述基板上,且所述发光功能层在所述基板上的正投影完全落入所述封装层在所述基板上的正投影中”包括:12. The method for manufacturing a display panel according to claim 12, wherein the “encapsulation layer is formed on the side of the light-emitting function layer away from the substrate, and the orthographic projection of the encapsulation layer on the substrate is completely On the substrate, and the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the packaging layer on the substrate" includes:
    在所述至少一个子像素发光器件远离所述基板的一侧形成第一无机层,所述第一无机层在所述基板上的正投影完全落在所述基板上,所述至少一个子像素发光器件在所述基板上的正投影均完全落入所述第一无机层在所述基板上的正投影中。A first inorganic layer is formed on the side of the at least one sub-pixel light-emitting device away from the substrate, the orthographic projection of the first inorganic layer on the substrate completely falls on the substrate, and the at least one sub-pixel The orthographic projection of the light emitting device on the substrate completely falls into the orthographic projection of the first inorganic layer on the substrate.
  14. 如权利要求13所述的显示面板的制备方法,其特征在于,所述“在所述发光功能层远离所述基板的一侧形成封装层”还包括:15. The method for manufacturing a display panel according to claim 13, wherein said "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further comprises:
    在所述第一无机层远离所述子像素发光器件的表面上形成第一有机层,所述第一有机层包括至少一个有机区域,所述至少一个有机区域分别形成于所述至少一个第一沟道中,所述第一有机层包括背离所述基板的第一表面,所述第一阻挡层包括背离所述基板的第二表面,所述第一表面距离所述基板的距离小于或者等于所述第二表面距离所述基板的距离。A first organic layer is formed on the surface of the first inorganic layer away from the sub-pixel light-emitting device, the first organic layer includes at least one organic region, and the at least one organic region is respectively formed on the at least one first In the channel, the first organic layer includes a first surface facing away from the substrate, the first barrier layer includes a second surface facing away from the substrate, and the distance between the first surface and the substrate is less than or equal to The distance between the second surface and the substrate.
  15. 如权利要求14所述的显示面板的制备方法,其特征在于,所述“在所述发光功能层远离所述基板的一侧形成封装层”还包括:15. The method for manufacturing a display panel according to claim 14, wherein the "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further comprises:
    在所述第一有机层远离所述子像素发光器件的一侧形成第二无机层。A second inorganic layer is formed on the side of the first organic layer away from the sub-pixel light emitting device.
  16. 如权利要求12所述的显示面板的制备方法,其特征在于,所述“在所述发光功能层远离所述基板的一侧形成封装层,所述封装层在所述基板上的正投影完全落在所述基板上,且所述发光功能层在 所述基板上的正投影完全落入所述封装层在所述基板上的正投影中”包括:12. The method for manufacturing a display panel according to claim 12, wherein said "a packaging layer is formed on the side of the light-emitting function layer away from the substrate, and the orthographic projection of the packaging layer on the substrate is completely On the substrate, and the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the packaging layer on the substrate" includes:
    所述子像素发光器件远离所述基板的一侧形成第二有机层,所述第二有机层在所述基板上的正投影完全落在所述基板上,所述子像素发光器件在所述基板上的正投影完全落入所述第二有机层在所述基板上的正投影中。The sub-pixel light-emitting device forms a second organic layer on the side away from the substrate, the orthographic projection of the second organic layer on the substrate completely falls on the substrate, and the sub-pixel light-emitting device is on the substrate. The orthographic projection on the substrate completely falls into the orthographic projection of the second organic layer on the substrate.
  17. 如权利要求13所述的显示面板的制备方法,其特征在于,在所述“在所述基板的一侧形成第一阻挡层,所述第一阻挡层中形成至少一个贯穿所述第一阻挡层的第一沟道”和所述“在每个所述基板的一侧形成发光功能层”之间,所述显示面板的制备方法还包括:The method for manufacturing a display panel according to claim 13, wherein a first barrier layer is formed on one side of the substrate, and at least one barrier layer is formed in the first barrier layer. Between the “first channel of the layer” and the “form a light-emitting function layer on one side of each of the substrates”, the method for manufacturing the display panel further includes:
    在所述基板的一侧形成第二阻挡层,所述第二阻挡层与所述第一阻挡层形成在所述基板的同侧,且所述第二阻挡层外包所述第一阻挡层设置,所述第二阻挡层与所述第一阻挡层之间形成第二沟道;A second barrier layer is formed on one side of the substrate, the second barrier layer and the first barrier layer are formed on the same side of the substrate, and the second barrier layer is arranged outside the first barrier layer , Forming a second channel between the second barrier layer and the first barrier layer;
    所述“在所述发光功能层远离所述基板的一侧形成封装层”还包括:The "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further includes:
    在所述第一无机层远离所述基板的一侧形成第三有机层,所述第一阻挡层和所述至少一个子像素发光器件在所述基板上的正投影落入所述第三有机层在所述基板上的正投影中,且至少部分所述第三有机层的边缘位于所述第二沟道中。A third organic layer is formed on the side of the first inorganic layer away from the substrate, and the orthographic projection of the first barrier layer and the at least one sub-pixel light emitting device on the substrate falls into the third organic layer. The layer is in an orthographic projection on the substrate, and at least part of the edge of the third organic layer is located in the second channel.
  18. 如权利要求17所述的显示面板的制备方法,其特征在于,所述“在所述发光功能层远离所述基板的一侧形成封装层”还包括:17. The method for manufacturing a display panel according to claim 17, wherein said "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further comprises:
    在所述第三有机层远离所述基板的一侧形成第三无机层,所述第三有机层在所述基板上的正投影落入所述第三无机层在所述基板上的正投影中。A third inorganic layer is formed on the side of the third organic layer away from the substrate, and the orthographic projection of the third organic layer on the substrate falls into the orthographic projection of the third inorganic layer on the substrate in.
  19. 如权利要求11所述的显示面板的制备方法,其特征在于,在“提供多个基板,将相邻两个所述基板之间通过弹性结构连接”和“在每个所述基板的一侧形成发光功能层”之间,所述显示面板的制备方法还包括:11. The method for manufacturing a display panel according to claim 11, wherein the steps between “providing a plurality of substrates and connecting two adjacent substrates through an elastic structure” and “on one side of each substrate Before forming the light-emitting functional layer", the manufacturing method of the display panel further includes:
    在每个所述基板的一侧形成薄膜晶体管层;Forming a thin film transistor layer on one side of each substrate;
    在所述弹性结构中形成电连接线,每个所述基板中的薄膜晶体管层通过所述电连接线电连接;Forming electrical connection lines in the elastic structure, and the thin film transistor layers in each substrate are electrically connected through the electrical connection lines;
    所述“在每个所述基板的一侧形成发光功能层”包括:The "forming a light-emitting function layer on one side of each of the substrates" includes:
    在所述薄膜晶体管层远离所述基板的一侧形成发光功能层。A light-emitting function layer is formed on the side of the thin film transistor layer away from the substrate.
  20. 一种电子装置,其特征在于,所述电子装置包括如权利要求1-10所述的显示面板。An electronic device, wherein the electronic device comprises the display panel according to claims 1-10.
PCT/CN2019/101180 2019-08-16 2019-08-16 Display panel, manufacturing method therefor, and electronic device WO2021031007A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201980090251.4A CN113383425A (en) 2019-08-16 2019-08-16 Display panel, preparation method thereof and electronic device
PCT/CN2019/101180 WO2021031007A1 (en) 2019-08-16 2019-08-16 Display panel, manufacturing method therefor, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/101180 WO2021031007A1 (en) 2019-08-16 2019-08-16 Display panel, manufacturing method therefor, and electronic device

Publications (1)

Publication Number Publication Date
WO2021031007A1 true WO2021031007A1 (en) 2021-02-25

Family

ID=74660383

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/101180 WO2021031007A1 (en) 2019-08-16 2019-08-16 Display panel, manufacturing method therefor, and electronic device

Country Status (2)

Country Link
CN (1) CN113383425A (en)
WO (1) WO2021031007A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115207247A (en) * 2022-07-15 2022-10-18 武汉华星光电半导体显示技术有限公司 Display panel and display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140299844A1 (en) * 2013-04-03 2014-10-09 Samsung Display Co., Ltd. Organic light emitting diode display device
CN107731866A (en) * 2016-08-11 2018-02-23 三星显示有限公司 Stretchable display device
CN109256484A (en) * 2018-08-31 2019-01-22 云谷(固安)科技有限公司 A kind of display panel and preparation method thereof, display
CN109686842A (en) * 2018-12-26 2019-04-26 厦门天马微电子有限公司 A kind of stretchable flexible display panels and display device
CN110164950A (en) * 2019-06-27 2019-08-23 上海天马微电子有限公司 Stretchable flexible display panel and display device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106653818B (en) * 2017-01-23 2019-11-08 上海天马有机发光显示技术有限公司 A kind of preparation method of display panel, display device and the display panel

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140299844A1 (en) * 2013-04-03 2014-10-09 Samsung Display Co., Ltd. Organic light emitting diode display device
CN107731866A (en) * 2016-08-11 2018-02-23 三星显示有限公司 Stretchable display device
CN109256484A (en) * 2018-08-31 2019-01-22 云谷(固安)科技有限公司 A kind of display panel and preparation method thereof, display
CN109686842A (en) * 2018-12-26 2019-04-26 厦门天马微电子有限公司 A kind of stretchable flexible display panels and display device
CN110164950A (en) * 2019-06-27 2019-08-23 上海天马微电子有限公司 Stretchable flexible display panel and display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115207247A (en) * 2022-07-15 2022-10-18 武汉华星光电半导体显示技术有限公司 Display panel and display device
CN115207247B (en) * 2022-07-15 2024-01-19 武汉华星光电半导体显示技术有限公司 Display panel and display device

Also Published As

Publication number Publication date
CN113383425A (en) 2021-09-10

Similar Documents

Publication Publication Date Title
US11367769B2 (en) Display device comprising data line arrangement around a through portion
US11600797B2 (en) Organic light-emitting display apparatus having peripheral dam containing metal-containing layer
US11720213B2 (en) Display apparatus
US10514137B2 (en) Joining structure of light emitting units
US11963415B2 (en) Display device including a power supply line that overlaps a driving circuit
US20210193777A1 (en) Display substrate and display device
EP3051589B1 (en) Organic light emitting diode display and method of manufacturing the same
EP3163646B1 (en) Organic light emitting display device
KR102253531B1 (en) Display device and method for manufacturing the same
KR102664207B1 (en) Stretchable display device and manufacturing method the same
US9773854B2 (en) Display device
KR102307432B1 (en) Display device
KR102652324B1 (en) Stretchable display device
KR102574483B1 (en) Display device
US20210305351A1 (en) Display device
US12082469B2 (en) Display apparatus and method of manufacturing the same
US20230263009A1 (en) Display device
KR20150019951A (en) Organic light emitting diode display
WO2021031007A1 (en) Display panel, manufacturing method therefor, and electronic device
KR20210039531A (en) Display device
US11903292B2 (en) Organic light emitting display device and method for manufacturing the same
WO2023077545A1 (en) Tiled display panel and display device
WO2023077546A1 (en) Spliced display panel and display apparatus
KR20240038213A (en) Display device
KR20240009016A (en) Display device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19942056

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19942056

Country of ref document: EP

Kind code of ref document: A1