WO2021031007A1

WO2021031007A1 - Display panel, manufacturing method therefor, and electronic device

Info

Publication number: WO2021031007A1
Application number: PCT/CN2019/101180
Authority: WO
Inventors: 袁泽; 康佳昊
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2019-08-16
Filing date: 2019-08-16
Publication date: 2021-02-25
Also published as: CN113383425A

Abstract

A display panel (10), a manufacturing method therefor, and an electronic device. The display panel (10) comprises multiple sub-display panels (100), adjacent two sub-display panels (100) are electrically connected with each other via a flexible structure (200). Each sub-display panel (100) comprises a substrate (110), a light-emitting functional layer (120) provided on one side of the substrate (110), and a packaging layer (130) provided at the side of the light-emitting functional layer (120) away from the substrate (110). The orthographic projection of the packaging layer (120) completely falls on the substrate (110). The orthographic projection of the light-emitting functional layer (120) on the substrate (110) completely falls within the orthographic projection of the packaging layer (130) on the substrate (120). The packaging layer (130) fits the substrate (110) so as to package the light-emitting layer (120). The packaging layer of the display panel is divided and not entirely packaged on the display panel, thus increasing the overall stretchability of the display panel.

Description

Display panel and preparation method thereof, and electronic device

Technical field

The invention belongs to the field of display technology, and specifically relates to a display panel, a preparation method thereof, and an electronic device.

Background technique

With the development of organic electroluminescence display panels, flexible organic electroluminescence display panels have very good application prospects in various media, games, multimedia teaching, aircraft, and engineering vehicle operation control. However, the organic light-emitting material layer, electrode layer and encapsulation layer in the traditional flexible organic electroluminescence display panel all adopt the structure of coating on the whole surface. The structure of these layers cannot be stretched, which limits the flexible organic electroluminescence. The stretchability of the display panel makes the current flexible organic electroluminescent display panel not stretchable.

Summary of the invention

In view of this, the present invention provides a display panel capable of improving stretch performance. The specific technical solution is as follows.

A display panel, the display panel includes a plurality of sub-display panels, and two adjacent sub-display panels are electrically connected by an elastic structure;

Each of the sub-display panels includes a substrate, a light-emitting function layer provided on one side of the substrate, and an encapsulation layer provided on the side of the light-emitting function layer away from the substrate, and the encapsulation layer is positioned on the substrate. The projection completely falls on the substrate, the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the encapsulation layer on the substrate, and the encapsulation layer cooperates with the substrate to combine The light-emitting function layer is packaged.

The present invention also provides a method for manufacturing a display panel, the method for manufacturing the display panel includes:

Provide a plurality of substrates, and connect two adjacent substrates through an elastic body;

Forming a light-emitting function layer on one side of each of the substrates;

An encapsulation layer is formed on the side of the light-emitting function layer away from the substrate, the orthographic projection of the encapsulation layer on the substrate completely falls on the substrate, and the light-emitting function layer is on the substrate. The projection falls completely into the orthographic projection of the packaging layer on the substrate.

The present invention also provides an electronic device including the above-mentioned display panel.

The beneficial effects of the present invention: The display panel provided by the present invention encapsulates the light-emitting function layer in each sub-display panel by providing an encapsulation layer in each sub-display panel, so that the encapsulation layer of the entire display panel is divided, instead of being encapsulated in the entire display panel. On the display panel, the encapsulation layer forms multiple independent regions and can be stretched, thereby improving the overall stretchability of the display panel.

Description of the drawings

In order to explain the technical solutions in the embodiments of the present invention more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative labor, other drawings can be obtained from these drawings.

FIG. 1 is a top view of a display panel provided by the first embodiment of the present invention.

2 is a cross-sectional view of the first display panel provided by the first embodiment of the invention.

3 is a cross-sectional view of a second type of display panel provided by the first embodiment of the invention.

4 is a cross-sectional view of a third display panel provided by the first embodiment of the invention.

5 is a cross-sectional view of the first display panel provided by the second embodiment of the present invention.

FIG. 6 is a top view of the first display panel provided by the second embodiment of the present invention.

FIG. 7 is a top view of a second type of display panel provided by the second embodiment of the present invention.

FIG. 8 is a cross-sectional view of a second type of display panel provided by the second embodiment of the present invention.

FIG. 9 is a cross-sectional view of the first display panel provided by the third embodiment of the present invention.

10 is a cross-sectional view of a second type of display panel provided by the third embodiment of the invention.

FIG. 11 is a cross-sectional view of a display panel provided by the fourth embodiment of the present invention.

FIG. 12 is a cross-sectional view of a display panel provided by a fifth embodiment of the invention.

FIG. 13 is a schematic structural diagram of an electronic device provided by the present invention.

FIG. 14 is a flowchart of the first manufacturing method of the display panel provided by the present invention.

FIG. 15 is a flowchart of the second method for manufacturing the display panel provided by the present invention.

FIG. 16 is a flowchart of a third method for manufacturing a display panel provided by the present invention.

FIG. 17 is a flowchart of the fourth method for manufacturing a display panel provided by the present invention.

FIG. 18 is a flowchart of the fifth method for manufacturing a display panel provided by the present invention.

FIG. 19 is a flowchart of the sixth method for manufacturing a display panel provided by the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

The terms "first" and "second" in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes unlisted steps or units, or optionally also includes Other steps or units inherent to these processes, methods, products or equipment.

Reference to "embodiments" herein means that a specific feature, structure or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art clearly and implicitly understand that the embodiments described herein can be combined with other embodiments.

Referring to FIGS. 1 and 2, the first embodiment of the present invention provides a display panel 10. The display panel 10 includes a plurality of sub-display panels 100, and two adjacent sub-display panels 100 are electrically connected by an elastic structure 200. The elastic structure 200 refers to a structure that is stretchable and can be electrically connected, and the electrical connection includes transmitting control signals, power signals, or data signals.

Each sub-display panel 100 includes a substrate 110, a light-emitting function layer 120 disposed on the side of the substrate 110, and an encapsulation layer 130 disposed on the side of the light-emitting function layer 120 away from the substrate 110. The orthographic projection of the encapsulation layer 130 on the substrate 110 is completely On the substrate 110, the orthographic projection of the light-emitting function layer 120 on the substrate 110 completely falls into the orthographic projection of the encapsulation layer 130 on the substrate 110, and the encapsulation layer 130 cooperates with the substrate 110 to encapsulate the light-emitting function layer 120. That is, the light-emitting function layer 120 can be completely encapsulated between the encapsulation layer 130 and the substrate 110.

In this embodiment, the sub-display panels 100 are electrically connected through the elastic structure 200 so that the sub-display panels 100 can be stretched, and the elastic structure 200 can transmit control signals, power signals, or data signals, so that the The display can be continuous, so that the display screen of the entire display panel 10 is integrated. In addition, in this embodiment, the light-emitting function layer 120 on each sub-display panel 100 is individually packaged by arranging a corresponding encapsulation layer 130, so that the package in the entire display panel 10 is split, instead of being encapsulated in the entire display panel 10 On the display panel 10, the encapsulation layer 120 split on each sub-display panel 100 does not affect the stretchability of the entire display panel 10, that is, the encapsulation layer 130 is correspondingly disposed on each sub-display panel 100, and The display panels 100 are connected by the elastic structure 200 to improve the stretchability of the entire display panel 10.

The display panel 10 provided by the present invention encapsulates the light-emitting function layer 120 in each sub-display panel 100 by arranging an encapsulation layer 130 in each sub-display panel 100, so that the encapsulation layer 130 of the entire display panel 10 is divided instead of being encapsulated in the whole On the display panel 10, the encapsulation layer 130 forms a plurality of independent regions and can be stretched, thereby improving the overall stretchability of the display panel 10.

In a further embodiment, the elastic structure 200 includes an elastic body 210 and an electrical connection line 220 disposed therein, and two adjacent sub-display panels 100 are electrically connected through the electrical connection line 220. The elastic body 210 is connected to the substrate 110 or the two are integrally formed. The substrate 110 and the elastic body 210 in all the sub-display panels 100 constitute the base 300 of the entire display panel 10. The elastic body 210 may be made of elastic materials such as rubber glue, and the length of the electrical connection line 220 may be significantly longer than the length between the two sub-display panels 100 when the display panel 10 is not stretched. In some embodiments, the elastic structure 200 may be composed of a coil type or wave type electrical connection line 220, that is, the electrical connection line 220 itself constitutes a stretchable coil type or a wave type stretchable structure, There is no need to additionally provide the elastic body 210, that is to say, the electrical connection line 220 is stretchable and can provide control signals, power signals or data signals. In some other embodiments, the elastic structure 200 is the elastic body 210 itself, and the elastic body 210 has stretchability and can provide electrical connection, and no additional electrical connection wire 220 is required.

Referring to FIG. 3, in a further embodiment, each sub-display panel 100 further includes a thin film transistor layer 190, and the thin film transistor layer 190 is disposed between the substrate 110 and the light emitting function layer 120. The light-emitting function layer 120 is driven to emit light by the thin film transistor layer 190. The thin film transistor layers 190 in two adjacent sub-display panels 100 are electrically connected through the electrical connection line 220, so as to achieve the continuity of the display images of all the sub-display panels 100.

4, in a further embodiment, the light-emitting function layer 120 includes a first electrode layer 121, a light-emitting layer 122, and a second electrode layer 123. The first electrode layer 121 is disposed on the side of the thin film transistor layer 190 away from the substrate 110. The light emitting layer 122 is disposed on the side of the first electrode layer 121 away from the thin film transistor layer 190, and the second electrode layer 123 is disposed on the side of the light emitting layer 122 away from the first electrode layer 121.

The light-emitting functional layer 120 includes a light-emitting area 124 and a non-light-emitting area 125 adjacent to the light-emitting area 124. The light-emitting layer 122 is disposed in the light-emitting area 124. The first electrode layer 121 and the second electrode layer 123 cover the light-emitting area 124 and the non-light-emitting area. 125. The first electrode layer 121 and the second electrode layer 123 are electrically connected through a portion disposed in the non-light emitting area 124, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190. Wherein, the electrical connection between the first electrode layer 121 and the second electrode layer 123 can be that conductive vias 126 are provided in the non-light emitting region 124 of the first electrode layer 121 and the second electrode layer 123 to connect the first electrode layer 121 and the second electrode layer 123 are electrically connected. The conductive through hole 126 may be a through hole containing a conductive material, or a through hole provided with a conductive pillar. In some embodiments, a voltage node is provided in the thin film transistor layer 190, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190 by being connected to the voltage node.

It can be understood that the display panel 10 is provided with a driving circuit, which is electrically connected to the thin film transistor layer 190, and the driving circuit controls the display of the display panel 10 by driving the thin film transistor layer 190.

Referring to FIG. 5, the second embodiment of the present invention provides a display panel 10a. The difference from the first embodiment is that in the display panel 10a, the sub-display panel 100 further includes a first barrier layer 140 and a first barrier layer 140. The light-emitting functional layer 120 is arranged on the same side of the substrate 110, and the first barrier layer 140 is provided with at least one first channel 150 penetrating the first barrier layer 140. The light-emitting functional layer 120 includes at least one sub-pixel light-emitting device 160, The at least one sub-pixel light-emitting device 160 is respectively disposed in the at least one first channel 150 and embedded in the first barrier layer 140.

The material of the first barrier layer 140 can be an organic material or an inorganic material. The size of the first channel 150 in the middle of the first barrier layer 140 can be set according to the size of the sub-pixel light-emitting device 160. In the first channel 150 in the first barrier layer 140, the first barrier layer 140 can block external moisture from penetrating into the sub-pixel light-emitting device 160 from the side of the sub-pixel light-emitting device 160 to protect the sub-pixel light-emitting device 160 from being damaged. Water vapor damage. When the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, the first barrier layer 140 can also block the overflow of the preparation material of the sub-pixel light-emitting device 160 during the inkjet printing preparation process.

In addition, when the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, when the material of the sub-pixel light-emitting device 160 is dropped into the first channel 150 in the first barrier layer 140, the material of the sub-pixel light-emitting device 160 drops The contact angle of the contact surface with the first barrier layer 140 is greater than 90°, which can prevent the material of the sub-pixel light emitting device 160 from overflowing from the first barrier layer 140. On the other hand, a suitable material of the first barrier layer 140 can be selected so that the material of the sub-pixel light-emitting device 160 will not overflow after being dropped.

It is worth mentioning that when the light-emitting function layer 120 in the sub-display panel 100 includes only one sub-pixel light-emitting device 160, the first barrier layer 140 surrounds the sub-pixel light-emitting device 160 in a circumferential direction. When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160 (see FIG. 6), the number of the first channels 150 in the first barrier layer 140 is at least the same as the number of the plurality of sub-pixel light-emitting devices 160. Correspondingly, preferably, the first channel 150 corresponds to the sub-pixel light-emitting device 160 one-to-one.

Wherein, the sub-pixel light-emitting device 160 includes the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123. When the light-emitting function layer 120 includes a plurality of sub-pixel light-emitting devices 160, the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123 respectively include a plurality of corresponding regions to form a plurality of sub-pixel light-emitting devices 160.

Please refer to FIG. 5 again. In a further embodiment, the encapsulation layer 130 includes a first inorganic layer 131 disposed on a side of the at least one sub-pixel light-emitting device 160 away from the substrate 110, and the at least one sub-pixel The orthographic projection of the light emitting device 160 on the substrate 110 completely falls into the orthographic projection of the first inorganic layer 131 on the substrate 110.

In this embodiment, the encapsulation layer 130 only includes the first inorganic layer 131, that is, only the first inorganic layer 131 is used to encapsulate the sub-pixel light emitting device 160. Wherein, when the sub-display panel 100 only includes one sub-pixel light-emitting device 160, the first inorganic layer 131 may only cover the sub-pixel light-emitting device 160. For better packaging, the first inorganic layer 131 may cover the first barrier. The layer 140 prevents water and oxygen from penetrating (see FIG. 5). When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160, the first inorganic layer 131 may include a plurality of first inorganic regions 1311 (see FIGS. 7 and 8), and each The first inorganic regions 1311 cover one sub-pixel light-emitting device 160 respectively. The first inorganic layer 131 may also be a whole. The first inorganic layer 131 covers all the sub-pixel light-emitting devices 160 in each sub-display panel 100 and covers the first blocking layer 140.

In this embodiment, the first barrier layer 140 and the first inorganic layer 131 are provided in each sub-display panel 100. The first barrier layer 140 and the first inorganic layer 131 do not cover the entire display panel 10a, so that the entire display is not affected. The stretchability of the panel 10a. The first barrier layer 140 and the first inorganic layer 131 can be prepared by a patterning method when preparing the first barrier layer 140 and the first inorganic layer 131. The specific preparation method can refer to the following preparation method.

Referring to FIG. 9, the third embodiment of the present invention provides a display panel 10b. Different from the second embodiment, in the display panel 10b, the encapsulation layer 130 in each sub-display panel 100 further includes a first organic layer 132. The first organic layer 132 is disposed on the surface of the first inorganic layer 131 away from the sub-pixel light emitting device 160. The first organic layer 132 includes at least one organic region 1321 (refer to FIG. 10), and the at least one organic region 1321 is respectively disposed In the at least one first channel 150, the first organic layer 132 includes a first surface 1322 facing away from the substrate 110 (see FIG. 9), the first barrier layer 140 includes a second surface 141 facing away from the substrate 110, and the first surface The distance L1 between 1322 and the substrate 110 is less than or equal to the distance L2 between the second surface 141 and the substrate 110. In this embodiment, the first organic layer 132 is added to further protect the sub-pixel light-emitting devices 160, and each sub-pixel light-emitting device 160 corresponds to an organic region 1321.

Please refer to FIG. 9 again. In a further embodiment, the encapsulation layer 130 further includes a second inorganic layer 133, and the second inorganic layer 133 is disposed on a side of the first organic layer 132 away from the sub-pixel light emitting device 160. The addition of the second inorganic layer 133 further protects the sub-pixel light emitting device 160. The second inorganic layer 133 covers at least the first organic layer 132. For better packaging, the second inorganic layer 133 can be provided to cover the first barrier layer 140.

Similarly, in this embodiment, the first organic layer 132 and the second inorganic layer 133 are provided in each sub-display panel 100. The first organic layer 132 and the second inorganic layer 133 do not cover the entire display panel, so that the The stretchability of the entire display panel 10b is affected. The first organic layer 132 and the second inorganic layer 133 can be prepared by a patterning method when preparing the first organic layer 132 and the second inorganic layer 133. The specific preparation method can refer to the following preparation method.

Referring to FIG. 11, the fourth embodiment of the present invention provides a display panel 10c. The difference from the second embodiment is that in the display panel 10c, the encapsulation layer 130 in each sub-display panel 100 includes a second organic layer 134 The second organic layer 134 is disposed on the side of the sub-pixel light-emitting device 160 away from the substrate 110, and the orthographic projection of the sub-pixel light-emitting device 160 on the substrate 110 completely falls into the orthographic projection of the second organic layer 134 on the substrate 110. In this embodiment, the second organic layer 134 is directly packaged on the sub-pixel light-emitting device 160. The material of the second organic layer 134 is incompatible with the material of the sub-pixel light-emitting device 160, or the material of the second organic layer 134 does not react with the material of the sub-pixel light-emitting device 160, so that the sub-pixel will not be damaged. Light emitting device 160.

Similarly, in this embodiment, the second organic layer 134 is provided in each sub-display panel 100, and the second organic layer 134 does not cover the entire display panel, so that the stretchability of the entire display panel 10c is not affected. When preparing the second organic layer 134, it can be prepared by a patterning method, and the specific preparation method can refer to the following preparation method.

Referring to FIG. 12, the fifth embodiment of the present invention provides a display panel 10d. The difference from the second embodiment is that each sub-display panel 100 in the display panel 10d further includes a second barrier layer 170. The layer 170 and the first barrier layer 140 are arranged on the same side of the substrate 110, and the second barrier layer 170 is arranged outside the first barrier layer 140, and a second channel 180 is provided between the second barrier layer 170 and the first barrier layer 140 . The second barrier layer 170 and the first barrier layer 140 may be formed of the same material at the same time, or may be formed at different times.

The encapsulation layer 130 further includes a third organic layer 135. The third organic layer 135 is disposed on the side of the first inorganic layer 131 away from the substrate 110. The orthographic projection of the first barrier layer 140 and the at least one sub-pixel light emitting device 160 on the substrate 110 It falls into the orthographic projection of the third organic layer 135 on the substrate 110, and at least part of the edge of the third organic layer 135 is located in the second channel 180. In this embodiment, the third organic layer 135 completely covers the first barrier layer 140 and the sub-pixel light-emitting device 160 to further protect the sub-pixel light-emitting device 160.

In a further embodiment, the encapsulation layer 130 further includes a third inorganic layer 136, the third inorganic layer 136 is disposed on the side of the third organic layer 135 away from the substrate 110, and the orthographic projection of the third organic layer 135 on the substrate 110 It falls into the orthographic projection of the third inorganic layer 136 on the substrate 110. That is, the third inorganic layer 136 completely covers the third organic layer 135 to further protect the sub-pixel light-emitting device 160.

In this example, disposing the above-mentioned encapsulation layer 130 in each sub-display panel 100 can not only better encapsulate the sub-pixel light-emitting device 160, but also does not affect the stretchability of the entire display panel 10d.

Please refer to FIG. 13, the present invention also provides an electronic device 20. The electronic device 20 includes the display panel 10 as described in any of the foregoing embodiments. The electronic device 20 may be, but is not limited to, an e-book, a smart phone (such as an Android phone, an iOS phone, a Windows Phone phone, etc.), a tablet computer, a flexible handheld computer, a flexible notebook computer, and a mobile Internet device (MID, Mobile Internet Devices). ) Or wearable devices, etc., or may be organic light-emitting diodes (OLED) display devices, active matrix organic light emitting diodes (Active Matrix Organic Light Emitting Diode, AMOLED) electronic devices.

Referring to FIG. 14, FIG. 1 and FIG. 2, the present invention also provides a first method for manufacturing the display panel 10. The method for manufacturing the display panel 10 includes step S100, step S200 and step S300. The detailed steps are as follows.

In step S100, a plurality of substrates 110 are provided, and two adjacent substrates 110 are connected by an elastic body 210. A plurality of substrates 110 are connected to each other to form a base 300 of the entire display panel 10. The base 300 has stretchability. The elastic body 210 can be integrally formed with the substrate 100 or formed separately. The tensile strength is greater than the tensile strength of the substrate 100, so that the substrate 300 can be better stretched in the horizontal and vertical directions. The elastic body 210 has stretchability and can provide electrical connections, and the electrical connections include transmission of control signals, power signals or data signals.

In step S200, a light-emitting function layer 120 is formed on one side of each substrate 110.

In step S300, the encapsulation layer 130 is formed on the side of the light-emitting function layer 120 away from the substrate 110, the orthographic projection of the encapsulation layer 130 on the substrate 110 completely falls on the substrate 110, and the orthographic projection of the luminous function layer 120 on the substrate 110 completely falls on the substrate 110. Into the orthographic projection of the packaging layer 130 on the substrate 110. An encapsulation layer 130 spaced apart from each other is formed on each substrate 110, and each substrate 110, the light-emitting function layer 120 and the encapsulation layer 130 constitute a sub-display panel 100.

The manufacturing method of the display panel 10 provided by the present invention encapsulates the light-emitting function layer 120 therein by forming an encapsulation layer 130 in each sub-display panel 100, so that the encapsulation layer 130 of the entire display panel 10 is divided instead of The entire encapsulation is on the display panel 10, so that the encapsulation layer 130 of the entire display panel 10 forms a plurality of independent regions and can be stretched, thereby improving the overall stretchability of the display panel 10.

In a further embodiment, the method for forming the light-emitting functional layer 120 includes an inkjet printing method, a vacuum coating method or a coating method. The forming of the encapsulation layer 130 includes an inkjet printing method, a vacuum coating method, a coating method or an etching method.

Referring to FIGS. 15 and 3, the present invention also provides a second method for manufacturing the display panel 10. The difference from that shown in FIG. 14 is that between step S100 and step S200, step S100a and step S100b are further included.

In step S100a, a thin film transistor layer 190 is formed on one side of each substrate 110.

In step S100b, an electrical connection line 220 is formed in the elastic body 210, and the thin film transistor layer 190 on each substrate 110 is electrically connected by the electrical connection line 220. Wherein, the electrical connection line 220 is used to transmit control signals, power signals or data signals. In this preparation method, the elastic body 210 is made of a stretchable material and can be stretched. The electrical connection line 220 and the elastic body 210 constitute an elastic structure 200, and the elastic structure 200 electrically connects two adjacent sub-display panels 100.

The step S200 includes step S200-I.

In step S200-I, the light emitting function layer 120 is formed on the side of the thin film transistor layer 190 away from the substrate 110.

4, in a further embodiment, the step S200-I specifically includes: forming a first electrode layer 121 on the side of the thin film transistor layer 190 away from the substrate 110, and on the first electrode layer 121 away from the thin film transistor layer 190 The light-emitting layer 122 is formed on the side of the light-emitting layer 122, and the second electrode layer 123 is formed on the side of the light-emitting layer 122 away from the first electrode layer 121. That is, the optical function layer 120 is composed of a first electrode layer 121, a light emitting layer 122, and a second electrode layer 123.

The light-emitting functional layer 120 includes a light-emitting area 124 and a non-light-emitting area 125 adjacent to the light-emitting area 124. The light-emitting layer 122 is formed in the light-emitting area 124. The first electrode layer 121 and the second electrode layer 123 cover the light-emitting area 124 and the non-light-emitting area. 125. The first electrode layer 121 and the second electrode layer 123 are electrically connected through a portion formed in the non-light emitting region 124, and the first electrode layer 121 and the thin film transistor layer 190 are electrically connected. Wherein, the electrical connection between the first electrode layer 121 and the second electrode layer 123 may be that conductive vias 126 are formed in the non-light emitting region 124 of the first electrode layer 121 and the second electrode layer 123 to connect the first electrode layer 121 and the second electrode layer 123 are electrically connected. The conductive through hole 126 may be a through hole containing a conductive material, or a through hole provided with a conductive pillar. In some embodiments, a voltage node is formed in the thin film transistor layer 190, and the first electrode layer 121 is electrically connected to the thin film transistor layer 190 by being connected to the voltage node.

Referring to FIGS. 16 and 5, the present invention also provides a third method for manufacturing the display panel 10. The difference from that shown in FIG. 14 is that step S400 is further included between step S100 and step S200.

In step S400, a first barrier layer 140 is formed on one side of the substrate 110, and at least one first channel 150 penetrating the first barrier layer 140 is formed in the first barrier layer 140.

The step S200 includes step S200-II.

In step S200-II, a light-emitting functional layer 120 is formed on one side of each substrate 110, and the light-emitting functional layer 120 and the first barrier layer 140 are formed on the same side of the substrate 110, and the light-emitting functional layer 120 includes at least one sub-pixel light-emitting device 160 The at least one sub-pixel light-emitting device 160 is respectively formed in the at least one first channel 150 and embedded in the first barrier layer 140.

The material of the first barrier layer 140 can be an organic material or an inorganic material. The size of the first channel 150 in the middle of the first barrier layer 140 can be set according to the size of the sub-pixel light-emitting device 160, and the sub-pixel light-emitting device 160 is formed on In the first channel 150 in the first barrier layer 140, the first barrier layer 140 can block external moisture from penetrating into the sub-pixel light-emitting device 160 from the side of the sub-pixel light-emitting device 160 to protect the sub-pixel light-emitting device 160 from being damaged. Water vapor damage. When the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, the first barrier layer 140 can also block the overflow of the preparation material of the sub-pixel light-emitting device 160 during the preparation process.

In addition, when the sub-pixel light-emitting device 160 is prepared by the inkjet printing method, when the material of the sub-pixel light-emitting device 160 is dropped into the first channel 150 in the first barrier layer 140, the material of the sub-pixel light-emitting device 16 drops The contact angle of the contact surface with the first barrier layer 140 is greater than 90°, which can prevent the material of the sub-pixel light emitting device 160 from overflowing from the first barrier layer 140. On the other hand, a suitable material of the first barrier layer 140 can be selected so that the material of the sub-pixel light-emitting device 160 will not overflow after being dropped.

It is worth mentioning that when the light-emitting function layer 120 in the sub-display panel 100 includes only one sub-pixel light-emitting device 160, the first barrier layer 140 surrounds the sub-pixel light-emitting device 160 in a circumferential direction. When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160 (see FIG. 6), the first channel 150 in the first barrier layer 140 at least corresponds to the number of the plurality of sub-pixel light-emitting devices 160 Preferably, the first channel 150 corresponds to the sub-pixel light emitting device 160 one to one.

Wherein, the sub-pixel light-emitting device 160 includes the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123. When the light-emitting function layer 120 includes a plurality of sub-pixel light-emitting devices 160, the first electrode layer 121, the light-emitting layer 122, and the second electrode layer 123 are correspondingly divided into a plurality of regions to form a plurality of sub-pixel light-emitting devices 160.

In a further embodiment, the step S300 includes step S310.

In step S310, a first inorganic layer 131 is formed on the side of the at least one sub-pixel light-emitting device 160 away from the substrate 110. The orthographic projection of the first inorganic layer 131 on the substrate 110 completely falls on the substrate 110, and the at least one sub-pixel light-emitting device 160 All the orthographic projections on the substrate 110 completely fall into the orthographic projections of the first inorganic layer 131 on the substrate 110.

In this embodiment, the encapsulation layer 130 only includes a first inorganic layer 131, that is, only the first inorganic layer 131 is used to encapsulate the sub-pixel light-emitting device 160. Wherein, when the sub-display panel 100 includes only one sub-pixel light-emitting device 160, the first inorganic layer 131 may only cover the sub-pixel light-emitting device 160 (see FIG. 8). For better packaging, the first inorganic layer 131 may Cover to the first barrier layer 140 to avoid penetration of water and oxygen (see FIG. 5). When the light-emitting function layer 120 in the sub-display panel 100 includes a plurality of sub-pixel light-emitting devices 160, the first inorganic layer 131 may include a plurality of first inorganic regions 1311 (see FIG. 8), and each first inorganic layer The regions 1311 cover one sub-pixel light-emitting device 160 respectively. The first inorganic layer 131 may also be a whole. The first inorganic layer 131 covers all the sub-pixel light-emitting devices 160 and covers the first blocking layer 140.

In this embodiment, the first barrier layer 140 and the first inorganic layer 131 do not cover the entire display panel, but are formed on each substrate 110 so as not to affect the stretchability of the entire display panel 10.

Referring to FIG. 17, FIG. 9, and FIG. 10, the present invention also provides a fourth method for manufacturing the display panel 10. The difference from FIG. 16 is that step S310 is followed by step S320.

In step S320, a first organic layer 132 is formed on the surface of the first inorganic layer 131 away from the sub-pixel light emitting device 160. The first organic layer 132 includes at least one organic region 1321, and the at least one organic region 1321 is respectively formed on the at least one In a first channel 150, the first organic layer 132 includes a first surface 1322 facing away from the substrate 110, and the first barrier layer 140 includes a second surface 141 facing away from the substrate 110. The distance L1 between the first surface 1322 and the substrate 110 is less than or It is equal to the distance L2 between the second surface 1322 and the substrate 110. In this embodiment, the first organic layer 132 is additionally formed to further protect the sub-pixel light-emitting devices 160, and each sub-pixel light-emitting device 160 corresponds to an organic region 1321.

In this embodiment, the height of the formed first barrier layer 140 is at least 1 μm, and when the material of the first organic layer 132 is dropped into the first channel 150 by an inkjet printing method, it will not overflow. The material of the first organic layer 132 accurately controls the volume of the droplet and the drop position, and then is dried and repaired to form a flat first organic layer 132.

In a further embodiment, step S330 is further included after step S320.

In step S330, a second inorganic layer 133 is formed on the side of the first organic layer 132 away from the sub-pixel light emitting device 160. The addition of the second inorganic layer 133 further protects the sub-pixel light emitting device 160. The second inorganic layer 133 covers at least the first organic layer 132. For better packaging, the second inorganic layer 133 may be provided to cover the first barrier layer 140.

Referring to FIGS. 18 and 11, the present invention also provides a fifth method for manufacturing the display panel 10. The difference from FIG. 16 is that step S310 is replaced with step S340.

In step S340, a second organic layer 134 is formed on the side of the sub-pixel light-emitting device 160 away from the substrate 110. The orthographic projection of the second organic layer 134 on the substrate 110 completely falls on the substrate 110, and the sub-pixel light-emitting device 160 is on the substrate 110. The orthographic projection of the second organic layer 134 completely falls into the orthographic projection of the second organic layer 134 on the substrate 110.

In this embodiment, the second organic layer 134 is directly encapsulated and formed on the sub-pixel light emitting device 160, and the second organic layer 134 does not cover the entire display panel, so that the stretchability of the entire display panel 10 is not affected. The material of the second organic layer 134 is incompatible with the material of the sub-pixel light-emitting device 160, or the material of the second organic layer 134 does not react with the material of the sub-pixel light-emitting device 160, so that the sub-pixel will not be damaged. Light emitting device 160.

Referring to FIGS. 19 and 12, the present invention also provides a sixth method for manufacturing the display panel 10. The difference from FIG. 16 is that step S500 is further included between step S400 and step S200-II.

In step S500, a second barrier layer 170 is formed on one side of the substrate 110. The second barrier layer 170 and the first barrier layer 140 are formed on the same side of the substrate 110, and the second barrier layer 170 is disposed outside the first barrier layer 140. A second channel 180 is formed between the second barrier layer 170 and the first barrier layer 140. In other embodiments, the second barrier layer 170 and the first barrier layer 140 may be formed of the same material at the same time.

Step S350 is also included after the step S310.

In step S350, a third organic layer 135 is formed on the side of the first inorganic layer 131 away from the substrate 110. The orthographic projection of the first barrier layer 140 and the at least one sub-pixel light emitting device 160 on the substrate 110 falls into the third organic layer 135. In the orthographic projection on the substrate 110, at least part of the edge of the third organic layer 135 is located in the second channel 180. In this embodiment, the third organic layer 135 completely covers the first barrier layer 140 and the sub-pixel light-emitting device 160 to further protect the sub-pixel light-emitting device 160. When the material droplets of the third organic layer 135 drip into the first channel 150 and the first barrier layer 140, the second barrier layer 170 can prevent the material droplets of the third organic material 135 from overflowing, and finally form the third organic material. At least a part of the edge of the layer 135 falls into the second trench 180.

In a further embodiment, step S360 is further included after the step S350.

In step S360, a third inorganic layer 136 is formed on the side of the third organic layer 135 away from the substrate 110, and the orthographic projection of the third organic layer 135 on the substrate 110 falls into the orthographic projection of the third inorganic layer 136 on the substrate 110. That is, the third inorganic layer 136 completely covers the third organic layer 135 to further protect the sub-pixel light-emitting device 160.

It is worth mentioning that the preparation methods of each film layer in the encapsulation layer 130 in the above embodiments can be formed by inkjet printing, vacuum coating, coating or etching, because each encapsulation layer 130 is right Each sub-display panel 100 is packaged. For the entire display panel 10, the entire package is divided, so the stretchability of the entire display panel 10 can be improved.

The above-mentioned embodiments only express several embodiments of the present invention, and the descriptions are relatively specific and detailed, but they should not be interpreted as limiting the scope of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

A display panel, characterized in that, the display panel includes a plurality of sub-display panels, and two adjacent sub-display panels are electrically connected by an elastic structure;

Each of the sub-display panels includes a substrate, a light-emitting function layer provided on one side of the substrate, and an encapsulation layer provided on the side of the light-emitting function layer away from the substrate, and the encapsulation layer is positioned on the substrate. The projection completely falls on the substrate, the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the encapsulation layer on the substrate, and the encapsulation layer cooperates with the substrate to combine The light-emitting function layer is packaged.
7. The display panel of claim 1, wherein the sub-display panel further comprises a first barrier layer, the first barrier layer and the light-emitting function layer are disposed on the same side of the substrate, and the The first barrier layer is provided with at least one first channel penetrating the first barrier layer, the light-emitting function layer includes at least one sub-pixel light-emitting device, and the at least one sub-pixel light-emitting device is respectively disposed on the at least one The first channel is embedded in the first barrier layer.
3. The display panel of claim 2, wherein the encapsulation layer comprises a first inorganic layer, and the first inorganic layer is disposed on a side of the at least one sub-pixel light-emitting device away from the substrate, and The orthographic projection of at least one sub-pixel light-emitting device on the substrate completely falls into the orthographic projection of the first inorganic layer on the substrate.
3. The display panel of claim 3, wherein the encapsulation layer further comprises a first organic layer, and the first organic layer is disposed on a surface of the first inorganic layer away from the sub-pixel light emitting device, The first organic layer includes at least one organic region, the at least one organic region is respectively provided in the at least one first channel, the first organic layer includes a first surface facing away from the substrate, the first The barrier layer includes a second surface facing away from the substrate, and the distance between the first surface and the substrate is less than or equal to the distance between the second surface and the substrate.
5. The display panel of claim 4, wherein the encapsulation layer further comprises a second inorganic layer, and the second inorganic layer is disposed on a side of the first organic layer away from the sub-pixel light emitting device.
7. The display panel of claim 2, wherein the encapsulation layer comprises a second organic layer, and the second organic layer is disposed on a side of the sub-pixel light-emitting device away from the substrate, and the sub-pixel The orthographic projection of the light emitting device on the substrate completely falls into the orthographic projection of the second organic layer on the substrate.
5. The display panel of claim 3, wherein the display panel further comprises a second barrier layer, the second barrier layer and the first barrier layer are disposed on the same side of the substrate, and the The second barrier layer is arranged outside the first barrier layer, and a second channel is provided between the second barrier layer and the first barrier layer;

The encapsulation layer further includes a third organic layer, the third organic layer is disposed on a side of the first inorganic layer away from the substrate, and the first barrier layer and the at least one sub-pixel light-emitting device are in the The orthographic projection on the substrate falls into the orthographic projection of the third organic layer on the substrate, and at least part of the edge of the third organic layer is located in the second channel.
7. The display panel of claim 7, wherein the encapsulation layer further comprises a third inorganic layer, the third inorganic layer is disposed on a side of the third organic layer away from the substrate, and the The orthographic projection of the third organic layer on the substrate falls into the orthographic projection of the third inorganic layer on the substrate.
8. The display panel of claim 1, wherein the sub-display panel further comprises a thin film transistor layer, and the thin film transistor layer is disposed between the substrate and the light-emitting function layer.
9. The display panel of claim 9, wherein the light-emitting function layer comprises a first electrode layer, a light-emitting layer, and a second electrode layer, and the first electrode layer is disposed on the thin film transistor layer away from the substrate. On one side, the light-emitting layer is provided on the side of the first electrode layer away from the thin film transistor layer, and the second electrode layer is provided on the light-emitting layer away from the first electrode layer;

The light-emitting functional layer includes a light-emitting area and a non-light-emitting area arranged adjacent to the light-emitting area, the light-emitting layer is arranged in the light-emitting area, and the first electrode layer and the second electrode layer cover the light-emitting area. The first electrode layer and the second electrode layer are electrically connected through a portion provided in the non-light emitting area, and the first electrode layer is electrically connected to the thin film transistor layer.
A method for preparing a display panel, characterized in that, the method for preparing the display panel includes:

Provide a plurality of substrates, and connect two adjacent substrates through an elastic body;

Forming a light-emitting function layer on one side of each of the substrates;

An encapsulation layer is formed on the side of the light-emitting function layer away from the substrate, the orthographic projection of the encapsulation layer on the substrate completely falls on the substrate, and the light-emitting function layer is on the substrate. The projection falls completely into the orthographic projection of the packaging layer on the substrate.
11. The method of manufacturing a display panel according to claim 11, wherein said "providing a plurality of substrates and connecting two adjacent substrates through an elastomer" and said "providing a plurality of substrates Between the light-emitting functional layer formed on one side of the substrate, the method for manufacturing the display panel further includes:

Forming a first barrier layer on one side of the substrate, and at least one first channel penetrating the first barrier layer is formed in the first barrier layer;

The "forming a light-emitting function layer on one side of each of the substrates" includes:

A light-emitting functional layer is formed on one side of each substrate, and the light-emitting functional layer and the first barrier layer are formed on the same side of the substrate, and the light-emitting functional layer includes at least one sub-pixel light-emitting device, The at least one sub-pixel light-emitting device is respectively formed in the at least one first channel and embedded in the first barrier layer.
12. The method for manufacturing a display panel according to claim 12, wherein the “encapsulation layer is formed on the side of the light-emitting function layer away from the substrate, and the orthographic projection of the encapsulation layer on the substrate is completely On the substrate, and the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the packaging layer on the substrate" includes:

A first inorganic layer is formed on the side of the at least one sub-pixel light-emitting device away from the substrate, the orthographic projection of the first inorganic layer on the substrate completely falls on the substrate, and the at least one sub-pixel The orthographic projection of the light emitting device on the substrate completely falls into the orthographic projection of the first inorganic layer on the substrate.
15. The method for manufacturing a display panel according to claim 13, wherein said "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further comprises:

A first organic layer is formed on the surface of the first inorganic layer away from the sub-pixel light-emitting device, the first organic layer includes at least one organic region, and the at least one organic region is respectively formed on the at least one first In the channel, the first organic layer includes a first surface facing away from the substrate, the first barrier layer includes a second surface facing away from the substrate, and the distance between the first surface and the substrate is less than or equal to The distance between the second surface and the substrate.
15. The method for manufacturing a display panel according to claim 14, wherein the "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further comprises:

A second inorganic layer is formed on the side of the first organic layer away from the sub-pixel light emitting device.
12. The method for manufacturing a display panel according to claim 12, wherein said "a packaging layer is formed on the side of the light-emitting function layer away from the substrate, and the orthographic projection of the packaging layer on the substrate is completely On the substrate, and the orthographic projection of the light-emitting function layer on the substrate completely falls into the orthographic projection of the packaging layer on the substrate" includes:

The sub-pixel light-emitting device forms a second organic layer on the side away from the substrate, the orthographic projection of the second organic layer on the substrate completely falls on the substrate, and the sub-pixel light-emitting device is on the substrate. The orthographic projection on the substrate completely falls into the orthographic projection of the second organic layer on the substrate.
The method for manufacturing a display panel according to claim 13, wherein a first barrier layer is formed on one side of the substrate, and at least one barrier layer is formed in the first barrier layer. Between the “first channel of the layer” and the “form a light-emitting function layer on one side of each of the substrates”, the method for manufacturing the display panel further includes:

A second barrier layer is formed on one side of the substrate, the second barrier layer and the first barrier layer are formed on the same side of the substrate, and the second barrier layer is arranged outside the first barrier layer , Forming a second channel between the second barrier layer and the first barrier layer;

The "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further includes:

A third organic layer is formed on the side of the first inorganic layer away from the substrate, and the orthographic projection of the first barrier layer and the at least one sub-pixel light emitting device on the substrate falls into the third organic layer. The layer is in an orthographic projection on the substrate, and at least part of the edge of the third organic layer is located in the second channel.
17. The method for manufacturing a display panel according to claim 17, wherein said "forming an encapsulation layer on the side of the light-emitting function layer away from the substrate" further comprises:

A third inorganic layer is formed on the side of the third organic layer away from the substrate, and the orthographic projection of the third organic layer on the substrate falls into the orthographic projection of the third inorganic layer on the substrate in.
11. The method for manufacturing a display panel according to claim 11, wherein the steps between “providing a plurality of substrates and connecting two adjacent substrates through an elastic structure” and “on one side of each substrate Before forming the light-emitting functional layer", the manufacturing method of the display panel further includes:

Forming a thin film transistor layer on one side of each substrate;

Forming electrical connection lines in the elastic structure, and the thin film transistor layers in each substrate are electrically connected through the electrical connection lines;

The "forming a light-emitting function layer on one side of each of the substrates" includes:

A light-emitting function layer is formed on the side of the thin film transistor layer away from the substrate.
An electronic device, wherein the electronic device comprises the display panel according to claims 1-10.