CN115206190A - Display device - Google Patents
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- CN115206190A CN115206190A CN202210812795.0A CN202210812795A CN115206190A CN 115206190 A CN115206190 A CN 115206190A CN 202210812795 A CN202210812795 A CN 202210812795A CN 115206190 A CN115206190 A CN 115206190A
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- functional layer
- via hole
- width
- circuit board
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- 239000011241 protective layer Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 43
- 239000003292 glue Substances 0.000 claims description 37
- 239000012790 adhesive layer Substances 0.000 claims description 36
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- 206010057071 Rectal tenesmus Diseases 0.000 abstract description 8
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The present application provides a display device; this display device forms the via hole through making the at least three-layer of first functional layer, at least three-layer in the second functional layer forms the via hole, and the projection of each via hole on the basement exists the coincidence, through form the via hole in first functional layer and second functional layer so that the flexible circuit board is located the part of flexion area and receives gravity automatic bending, the flexible circuit board thickness of flexion area has been reduced, the width of via hole has been increased, the elastic modulus of flexion area flexible circuit board has been reduced, make the flexible circuit board automatic the tenesmus that appears under the action of gravity, avoid the flexible circuit board upwarp to appear interfering the damage flexible circuit board.
Description
Technical Field
The application relates to the technical field of display, in particular to a display device.
Background
In order to improve the screen occupation ratio, a curved display device can be designed for the conventional display device, and frameless display is realized by bending a frame of the display device. For example, in the existing four-curved-surface display device, each frame is bent downward and backward, so that the four-curved-surface display device is frameless. However, in the manufacturing process of the display device, the flexible circuit board is arranged at the lower frame, so that the flexible circuit board is tilted when the display panel is attached to the cover plate, interference occurs in subsequent processes, the flexible circuit board is damaged, and the flexible circuit board is failed.
Therefore, the existing four-curved-surface display device has the technical problem that the flexible circuit board is damaged due to interference caused by the tilting of the flexible circuit board.
Disclosure of Invention
The embodiment of the application provides a display device for alleviate the technical problem that the flexible circuit board is damaged due to interference caused by the flexible circuit board tilting in the existing four-curved-surface display device.
An embodiment of the present application provides a display device, which includes:
the display panel comprises a plane display area and at least one curved surface display area;
the flexible circuit board is connected with the at least one curved surface display area and comprises a first connecting area connected with the display panel, a second connecting area connected with a driving chip and a bending area positioned between the first connecting area and the second connecting area;
the flexible circuit board comprises a substrate, a first functional layer and a second functional layer, wherein the substrate is arranged between the first functional layer and the second functional layer, the first functional layer and the second functional layer comprise a plurality of film layers, at least three film layers in the first functional layer are provided with through holes, at least three film layers in the second functional layer are provided with through holes, projections of every two layers of through holes in the first functional layer and the second functional layer on the substrate are overlapped, and the parts of the flexible circuit board, which are located in the bending area, are automatically bent under the action of gravity through the through holes formed in the first functional layer and the second functional layer.
In some embodiments, the first functional layer comprises:
the first metal layer is arranged on one side of the substrate;
the first adhesive layer is arranged on one side of the first metal layer, which is far away from the substrate;
the first protective layer is arranged on one side, far away from the first metal layer, of the first adhesive layer;
the first electromagnetic-resistant layer is arranged on one side, far away from the first adhesive layer, of the first protective layer;
the first electromagnetic shielding layer is provided with a first via hole, the first protection layer is provided with a second via hole, and at least one of the first adhesive layer and the first metal layer is provided with a via hole.
In some embodiments, the first glue layer is formed with a third via hole, the first metal layer is formed with a fourth via hole, the width of the third via hole is equal to the width of the fourth via hole, the width of the third via hole is smaller than the width of the first via hole, and the width of the third via hole is smaller than the width of the second via hole.
In some embodiments, the flexible circuit board includes a first insulating portion and a second insulating portion disposed at the bending region, the first insulating portion is disposed between the second insulating portion and the substrate, the first insulating portion is made of the same material as the first adhesive layer, the second insulating portion is made of the same material as the first protective layer, and the first insulating portion and the second insulating portion are disposed at a side close to the first connection region.
In some embodiments, the second functional layer comprises:
the second metal layer is arranged on one side, far away from the first functional layer, of the substrate;
the second adhesive layer is arranged on one side of the second metal layer, which is far away from the substrate;
the second protective layer is arranged on one side, far away from the second metal layer, of the second adhesive layer;
the second electromagnetic-resistant layer is arranged on one side, far away from the second glue layer, of the second protective layer;
the second electromagnetic shielding layer is formed with a fifth via hole, the second protective layer is formed with a sixth via hole, and at least one of the second adhesive layer and the second metal layer is formed with a via hole.
In some embodiments, the second glue layer is formed with a seventh via, the width of the fifth via is equal to the width of the sixth via, and the width of the fifth via is equal to the width of the seventh via.
In some embodiments, the width of the via in the second functional layer is greater than or equal to the width of the via in the first functional layer.
In some embodiments, a seventh via hole is formed in the second glue layer, an eighth via hole is formed in the second metal layer, the width of the seventh via hole is equal to the width of the eighth via hole, the width of the seventh via hole is smaller than the width of the fifth via hole, and the width of the seventh via hole is smaller than the width of the sixth via hole.
In some embodiments, the flexible circuit board includes a third insulating portion and a fourth insulating portion disposed at the bending region, the third insulating portion is disposed between the fourth insulating portion and the substrate, the third insulating portion is made of the same material as the second adhesive layer, the fourth insulating portion is made of the same material as the second protective layer, and the third insulating portion and the fourth insulating portion are disposed at a side close to the first connection region.
In some embodiments, the widths of the at least two vias in the first functional layer are not equal, the widths of the vias in the second functional layer are equal, and the width of the via in the second functional layer is equal to the maximum width of the via in the first functional layer.
In some embodiments, the width of the via in the second functional layer is greater than 6 millimeters.
In some embodiments, the via hole of any one of the first functional layer and the second functional layer is disposed in the bending region.
In some embodiments, the flexible circuit board further includes an ink layer, the ink layer includes a first ink layer and a second ink layer, the first ink layer is disposed in the via hole of the first functional layer, and the second ink layer is disposed in the via hole of the second functional layer.
Has the beneficial effects that: the present application provides a display device; the display device comprises a display panel and a flexible circuit board, wherein the display panel comprises a plane display area and at least one curved surface display area, the flexible circuit board is connected with the display panel in the at least one curved surface display area, the flexible circuit board comprises a first connecting area connected with the display panel, a second connecting area connected with a driving chip and a bending area located between the first connecting area and the second connecting area, the flexible circuit board comprises a substrate, a first functional layer and a second functional layer, the substrate is arranged between the first functional layer and the second functional layer, the first functional layer and the second functional layer comprise a plurality of film layers, at least three film layers in the first functional layer are provided with through holes, at least three film layers in the second functional layer are provided with through holes, projections of every two layers of through holes in the first functional layer and the second functional layer on the substrate are overlapped, and the part of the flexible circuit board located in the bending area is automatically bent under the action of gravity through the through holes formed in the first functional layer and the second functional layer. This application forms the via hole through the at least three-layer that makes first functional layer, at least three-layer in the second functional layer forms the via hole, and the projection of each via hole on the basement exists the coincidence, through form the via hole in first functional layer and second functional layer so that the flexible circuit board is located the part of flexion and receives gravity automatic buckling, the flexible circuit board thickness of flexion has been reduced, the width of via hole has been increased, the elastic modulus of flexion flexible circuit board has been reduced, make the automatic tenesmus that appears of flexible circuit board under the action of gravity, avoid the flexible circuit board to upwarp and appear interfering the damage flexible circuit board.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic view of a display device according to an embodiment of the present disclosure.
Fig. 2 is a first schematic view of a flexible circuit board according to an embodiment of the present disclosure.
Fig. 3 is a schematic diagram of a conventional four-curved-surface display device.
Fig. 4 is a second schematic diagram of a flexible circuit board according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application aims at the technical problem that the flexible circuit board is damaged due to interference caused by the fact that the flexible circuit board tilts in the existing four-curved-surface display device, and provides the display device and the mobile terminal for relieving the technical problem.
As shown in fig. 1 and 2, an embodiment of the present application provides a display device, where the display device 3 includes:
the display panel 21 comprises a flat display area 241 and at least one curved display area 242;
a flexible circuit board 1 connected to the at least one curved display region 242, wherein the flexible circuit board 1 includes a first connection region 151 connected to the display panel 21, a second connection region 152 connected to the driving chip 23, and a bending region 153 between the first connection region 151 and the second connection region 152;
the flexible circuit board 1 comprises a substrate 11, a first functional layer 12 and a second functional layer 13, the substrate is arranged between the first functional layer 12 and the second functional layer 13, the first functional layer 12 and the second functional layer 13 comprise a plurality of film layers, at least three film layers in the first functional layer 12 are provided with via holes 125, at least three film layers in the second functional layer are provided with via holes 135, and the projections of the via holes of each of the first functional layer 12 and the second functional layer 13 on the substrate are overlapped (for example, the first anti-electromagnetic layer 124 is provided with a first via hole 125a, the first protective layer 123 is provided with a second via hole 125b, the projections of the first via hole 125a and the second via hole 125b on the substrate 11 are overlapped; the second anti-electromagnetic layer 134 is provided with a fifth via hole 135c, the second protective layer 133 is provided with a sixth via hole 135b, the projections of the fifth via hole 135c and the sixth via hole 135b on the substrate 11 are overlapped, and the projections of the first via hole 125a fifth via hole 135c and the fifth via hole 135c on the substrate 11 exist), so that the flexible circuit board 1 is bent by the gravity of the first via hole 153 and the second functional layer 13.
The embodiment of the application provides a display device, this display device forms the via hole through making the at least three-layer of first functional layer, at least three-layer in the second functional layer forms the via hole, and the projection of each via hole on the basement exists the coincidence, through form the via hole in first functional layer and second functional layer so that the part that the flexible circuit board is located the bending zone receives gravity and buckles automatically, the thickness of the flexible circuit board in bending zone has been reduced, the width of via hole has been increased, the elastic modulus of bending zone flexible circuit board has been reduced, make the flexible circuit board automatic the tenesmus appear under the action of gravity, avoid the flexible circuit board upwarp to appear interfering the damage flexible circuit board.
It should be noted that, after the flexible circuit board is bound to the display panel, the through holes are formed in the first functional layer and the second functional layer, so that the portion, located in the bending area, of the flexible circuit board is automatically bent under the action of gravity, because the through holes are formed in at least three film layers of the first functional layer, the through holes are formed in at least three film layers of the second functional layer, and projections of the through holes of each two layers of the first functional layer and the second functional layer on the substrate overlap, the flexible circuit board can fall down under the action of self gravity, and the portion, located in the bending area, of the flexible circuit board is bent, and the portion, located in the second connection area, of the flexible circuit board falls down.
In one embodiment, the width of the via hole of any one of the first functional layers is greater than a preset value, the width of the via hole of any one of the second functional layers is greater than the preset value, and the preset value is a value of the flexible circuit board when the flexible circuit board is automatically bent under the action of gravity.
It should be noted that, the width of the via hole of any one film layer in the first functional layer and the width of the via hole of any film layer in the second functional layer are greater than a same preset value, where the preset value is a value that enables the flexible circuit board to be automatically bent by gravity, for example, the smaller the thickness of the flexible circuit board and the larger the width of the via hole of the flexible circuit board, the smaller the stress required for bending the flexible circuit board is, that is, the smaller the elastic modulus of the flexible circuit board is, the more the flexible circuit board is easily bent, and therefore, the preset value is determined according to the thickness of the bending area of the flexible circuit board and the width of the via hole, when the film layer of the flexible circuit board forms the via hole, for example, when the width of the via hole of the first functional layer is 6 mm, the elastic modulus of the flexible circuit board is reduced to that the flexible circuit board can be automatically bent by gravity, and the preset value may be 6 mm.
As shown in fig. 2, the via hole of the first functional layer has a width L1, and the via hole of the second functional layer has a width L2.
Specifically, as shown in fig. 3, in the current four-curved-surface flexible display device, the flexible circuit board 34 is firstly attached to the display panel 36, and then the display panel 36 is attached to the four-curved-surface cover plate 35, when the display panel 36 is attached to the four-curved-surface cover plate 35, the flexible circuit board 34 is warped due to a large elastic modulus of the flexible circuit board, and in a subsequent process, the flexible circuit board 34 is easily interfered with a machine or a jig, so that the flexible circuit board is damaged, and the four-curved-surface display device is easily failed.
In the display device provided by the embodiment of the application, the thickness of the flexible circuit board is smaller (the flexible circuit board is referred to as a bending area in the application) due to the fact that the flexible circuit board has a partial area (at least three layers of the first functional layer and at least three layers of the second functional layer form the via holes), so that the flexible circuit board only has an area from one layer to three layers of the flexible circuit board without the via holes, the width of the via holes on two sides of the substrate is larger, the elastic modulus of the flexible circuit board is smaller, the flexible circuit board has an area which is easy to bend, in the attaching process of the cover plate and the display panel, the flexible circuit board can automatically droop due to gravity, and the flexible circuit board is prevented from being damaged due to interference caused by upwarp of the flexible circuit board.
In the embodiment of the application, the first functional layer and the second functional layer have a coincidence in the projection of every two-layer via hole on the base, namely, the projection of any two-layer via hole formed with the via hole in the first functional layer on the base, the projection of any two-layer via hole formed with the via hole in the second functional layer on the base, and the via hole formed with the film layer of the via hole in the first functional layer and the via hole formed with the film layer of the via hole in the second functional layer on the base have a coincidence, and by making the projection of the via hole of the first functional layer on the base and the projection of the via hole of the second functional layer on the base coincide, the position where the via hole is formed on the flexible circuit board coincides, the thickness of the flexible circuit board in the area of the via hole is relatively smaller, and the width of the via hole of the flexible circuit board is relatively smaller, so that the elastic modulus of the flexible circuit board in the bending area can be further reduced, and the possibility of falling of the flexible circuit board is improved.
In one embodiment, the via hole of any one of the first functional layer and the second functional layer is disposed in the bending region. Through setting up the via hole with any rete in first functional layer and the second functional layer in the bending zone for the flexible circuit board can follow the automatic tenesmus in bending zone, avoids the flexible circuit board upwarping to appear interfering the damage flexible circuit board, and the flexible circuit board can normally set up with the part that display panel and driver chip are connected, avoids appearing crooked and leads to impaired.
In one embodiment, as shown in fig. 2, the first functional layer comprises:
a first metal layer 121 disposed on one side of the substrate 11;
a first glue layer 122 disposed on a side of the first metal layer 121 away from the substrate 11;
a first protection layer 123 disposed on a side of the first glue layer 122 away from the first metal layer 121;
the first electromagnetic-proof layer 124 is arranged on one side, away from the first glue layer 122, of the first protection layer 123;
wherein, the first anti-electromagnetic layer 124 is formed with a first via hole 125a, the first protection layer 123 is formed with a second via hole 125b, and at least one of the first glue layer 122 and the first metal layer 121 is formed with a via hole. Through forming the first anti-electromagnetic layer and the first protective layer into the via hole, at least one of the first glue layer and the first protective layer is formed into the via hole, so that the thickness of the first functional layer in the bending area is smaller, the thickness of the flexible circuit board in the bending area is reduced, the width of the via hole of the flexible circuit board in the bending area is increased, the stiffness of the flexible circuit board is reduced, the flexible circuit board can fall down due to self gravity, and the flexible circuit board is prevented from being damaged due to interference.
Specifically, first anti-electromagnetic layer is formed with first via hole, first protective layer is formed with the second via hole, first glue film is formed with the third via hole, forms the via hole through making first anti-electromagnetic layer, first protective layer and first glue film for flexible circuit board is less at the thickness in bending area, reduces flexible circuit board's stiffness, makes flexible circuit board can be because of self gravity tenesmus, avoids flexible circuit board to appear interfering and leads to the damage.
Specifically, the first electromagnetic shielding layer is formed with a first via hole, the first protective layer is formed with a second via hole, the first metal layer is formed with a third via hole, and the first electromagnetic shielding layer, the first protective layer and the first metal layer are formed with the via holes, so that the thickness of the flexible circuit board in the bending area is smaller, the stiffness of the flexible circuit board is reduced, the flexible circuit board can fall due to self gravity, and the flexible circuit board is prevented from being damaged due to interference.
Specifically, when the first electromagnetic shielding layer forms the first via hole, the first protective layer forms the second via hole, and the first metal layer forms the third via hole, the first adhesive layer may not form the via hole, specifically, the first metal layer may be etched to form the third via hole after the first metal layer is formed, then the third via hole is filled with the flexible material, then the first adhesive layer is prepared on the first metal layer and the flexible material, the first protective layer and the first electromagnetic-proof layer are prepared on the first adhesive layer, and the first protective layer and the first electromagnetic-proof layer are etched to form the first via hole and the second via hole.
Forming vias for the three film layers in the first functional layer still suffers from the problem of the flex region of the flexible circuit board being thicker. In one embodiment, as shown in fig. 2, the first electromagnetic shielding layer 124 is formed with a first via 125a, the first protection layer 123 is formed with a second via 125b, the first glue layer 122 is formed with a third via 125c, the first metal layer 121 is formed with a fourth via 125d, the width of the third via 125c is equal to the width of the fourth via 125d (for example, L3 in fig. 2), the width L3 of the third via 125c is smaller than the width L1 of the first via 125a, and the width L3 of the third via 125c is smaller than the width L1 of the second via 125 b. Through making first anti-electromagnetic layer form first via hole, first protection layer forms the second via hole, first glue film forms the third via hole, first metal layer forms the fourth via hole, make each rete all can form the via hole in the first functional layer, thereby reduce the flexible circuit board thickness that is located the flexion area, and make the width of third via hole equal to the width of fourth via hole, and the width of third via hole is less than the width of first via hole, the width of third via hole is less than the width of second via hole, can make first glue film and first protection layer remain partial material in the flexion area, play insulating and anticorrosive effect through the material of retaining, protect first metal layer, avoid first functional layer damage.
In one embodiment, as shown in fig. 2, the flexible circuit board 1 includes a first insulating portion 122a and a second insulating portion 123a disposed on the bending region 153, the first insulating portion 122a is disposed between the second insulating portion 123a and the substrate 11, the first insulating portion 122a is made of the same material as the first glue layer 122, the second insulating portion 123a is made of the same material as the first protective layer 123, and the first insulating portion 122a and the second insulating portion 123a are disposed on a side close to the first connection region 151. When setting up first insulating part and second insulating part and protecting first functional layer, can make first glue film and first protective layer remain partly in the etching process, obtain first insulating part and second insulating part, because first metal layer is formed with the via hole, first insulating part and second insulating part can fall, make in fact first insulating part set up at first metal layer, second insulating part sets up at first glue film, but first insulating part is first glue film whereabouts part, second insulating part is first protective layer whereabouts part, in order to reduce technology, improve preparation efficiency.
The problem that the flexible circuit board is warped upwards and damaged due to the fact that the stiffness of the flexible circuit board is large due to the fact that the width of a through hole of a second functional layer of a current display device is small is solved. In one embodiment, as shown in fig. 2, the second functional layer 13 comprises:
a second metal layer 131 disposed on a side of the substrate 11 away from the first functional layer 12;
the second glue layer 132 is disposed on a side of the second metal layer 131 away from the substrate 11;
a second passivation layer 133 disposed on a side of the second adhesive layer 132 away from the second metal layer 131;
a second anti-electromagnetic layer 134 arranged on the side of the second protective layer 133 far from the second glue layer 132;
wherein, the second anti-electromagnetic layer 134 is formed with a fifth via hole 135c, the second protection layer 133 is formed with a sixth via hole 135b, and at least one of the second glue layer 132 and the second metal layer 131 is formed with a via hole. Through making the second glue film form the fifth via hole, the second protective layer forms the sixth via hole, and at least one in second glue film and the second metal level forms the via hole for flexible circuit board is less at the thickness of bending zone, and is great at the width of the via hole of bending zone, makes flexible circuit board's stiffness reduce, makes flexible circuit board can fall because of self gravity, avoids flexible circuit board to appear interfering and leads to the damage.
In one embodiment, as shown in fig. 2, the second glue layer 132 is formed with a seventh via hole 135a, the width of the fifth via hole 135c is equal to the width of the sixth via hole 135b, and the width of the fifth via hole 135c is equal to the width of the seventh via hole 135 a. The width of the via hole of the second glue layer, the second protective layer and the second anti-electromagnetic layer is equal, so that the width of the via hole of each layer in the second functional layer is large, the width of the via hole of the flexible circuit board in the bending area is increased, the stiffness of the flexible circuit board is reduced, the flexible circuit board can fall down due to self gravity, and the flexible circuit board is prevented from being damaged due to interference.
In one embodiment, the width of the via hole in the second functional layer is greater than or equal to the width of the via hole in the first functional layer. Because the second metal layer in the second functional layer does not form the via hole, make the width of via hole in the second functional layer be greater than or equal to the width of via hole in the first functional layer, further reduce the stiffness of flexible circuit board, make the flexible circuit board because of self gravity tenesmus, avoid the flexible circuit board to appear interfering and lead to the damage.
Forming vias for the three film layers in the second functional layer still suffers from the problem of the flex region of the flexible circuit board being thicker. In an embodiment, as shown in fig. 4, the second glue layer 132 is formed with a seventh via hole 135a, the second metal layer 131 is formed with an eighth via hole 135d, a width of the seventh via hole 135a is equal to a width of the eighth via hole 135d (both L4 in fig. 4), a width L4 of the seventh via hole 135a is smaller than a width L2 of the fifth via hole 135c, and a width L4 of the seventh via hole 135a is smaller than a width L2 of the sixth via hole 135 b. Through making the second anti-electromagnetic layer form the fifth via hole, the second protective layer forms the sixth via hole, the second glue film forms the seventh via hole, the second metal layer forms the eighth via hole, make each rete all can form the via hole in the second functional layer, thereby reduce the thickness of the flexible circuit board who is located the bending zone, and make the width of seventh via hole equal to the width of eighth via hole, and the width of seventh via hole is less than the width of eighth via hole, can make second glue film and second protective layer reserve partial material in the bending zone, play insulating and anticorrosive effect through the material of reserving, protect the second metal layer, avoid the damage of second functional layer.
In one embodiment, as shown in fig. 4, the flexible circuit board 1 includes a third insulating portion 132a and a fourth insulating portion 133a disposed on the bending region 153, the third insulating portion 132a is disposed between the fourth insulating portion 133a and the substrate 11, the third insulating portion 132a is made of the same material as the second adhesive layer 132, the fourth insulating portion 133a is made of the same material as the second protective layer 133, and the third insulating portion 132a and the fourth insulating portion 133a are disposed on a side close to the first connection region 151. When the third insulating part and the fourth insulating part are arranged to protect the second functional layer, a part of the second adhesive layer and a part of the second protective layer can be reserved in the etching process to obtain the third insulating part and the fourth insulating part, the third insulating part and the fourth insulating part can fall down due to the fact that the second metal layer is provided with the through hole, the third insulating part is actually arranged on the second metal layer, the fourth insulating part is arranged on the second adhesive layer, the third insulating part is the second adhesive layer falling part, the fourth insulating part is the second protective layer falling part, the process is reduced, and the preparation efficiency is improved.
In one embodiment, the widths of at least two via holes in the first functional layer are not equal, the widths of the via holes in the second functional layer are equal, and the width of the via hole in the second functional layer is equal to the maximum width of the via hole in the first functional layer. The width of the via hole of the second functional layer is larger than that of the first functional layer, so that the width of the via hole of the flexible circuit board in the bending area is larger, the stiffness of the flexible circuit board can be reduced, the flexible circuit board can fall down due to self gravity, and the flexible circuit board is prevented from being interfered to cause damage. So that part of the film layer of the first functional layer is reserved, the first functional layer is protected, and the first functional layer is prevented from being damaged.
Specifically, when the via hole is formed in the flexible circuit board, the width of the via hole is made as large as possible to reduce the elastic modulus of the flexible circuit board as small as possible, but because the first metal layer in the first functional layer may form the via hole, the first metal layer needs to be protected, so that the width of the via hole in the first functional layer may be inconsistent, and the second functional layer may not open the hole in the second metal layer, so that the opening of the second functional layer may be larger than the opening of the first functional layer, but it is considered that if the opening of the second functional layer is not opened in the first functional layer, the change of the elastic modulus of the flexible circuit board is small, and therefore, the width of the via hole in the second functional layer is made equal to the maximum width of the via hole in the first functional layer.
Specifically, as shown in fig. 2, it can be seen that the widths of the fifth via hole 135c of the second electromagnetic shielding layer 134, the sixth via hole 135b of the second protective layer 133, and the seventh via hole 135a of the second glue layer 132 in the second functional layer 13 are all L2, the widths of the first via hole 125a of the first electromagnetic shielding layer 124 and the second via hole 125b of the first protective layer 123 in the first functional layer 12 are L1, the widths of the third via hole 125c of the first glue layer 122 and the fourth via hole 125d of the first metal layer 121 are L3, since the first metal layer and the first glue layer are provided with insulating materials in the bending region, L3 is smaller than L1, and in order to reduce the elastic modulus of the flexible circuit board and avoid the influence of the excessive via hole on the normal via hole of the flexible circuit board, L2 is made equal to the maximum width L1 of the first functional layer 12.
Specifically, the width of the via hole in the second functional layer is greater than 6 millimeters, that is, the preset value can be 6 millimeters, by making the width of the via hole in the first functional layer and the second functional layer greater than 6 millimeters, when the display device is manufactured, the proportion of the flexible circuit board that warps up can be reduced to 0, that is, the maximum width of the via hole in the first functional layer is equal to the width of the via hole in the second functional layer, and when the width of the via hole in the second functional layer is greater than 6 millimeters, the proportion of the flexible circuit board that is automatically dropped by gravity is 100%, and the proportion of the flexible circuit board that warps up in the current four-curved-surface display device is 70%, that is, the proportion of the flexible circuit board that is compared with the current flexible circuit board that warps up is reduced by 70%, and the proportion of the flexible circuit board that warps up is 0, the problem that the flexible circuit board that interference causes damage due to upwarps up is solved, and the yield of the display device is improved.
In one embodiment, the width of the via hole of the second functional layer is less than 10 mm, and in order to avoid the width of the via hole from affecting the package, space and circuit arrangement of the flexible circuit board, the width of the via hole is set to be less than 10 mm.
Forming vias for flexible circuit boards can lead to water and oxygen ingress problems. In one embodiment, as shown in fig. 2, the flexible circuit board 1 further includes an ink layer 14, the ink layer 14 includes a first ink layer 141 and a second ink layer 142, the first ink layer 141 is disposed in the via hole 125 of the first functional layer 12, and the second ink layer 142 is disposed in the via hole 135 of the second functional layer 13. Through set up first printing ink layer and second printing ink layer in the via hole of first functional layer and second functional layer respectively for first printing ink layer and second printing ink layer can carry out the separation to water oxygen, avoid water oxygen invasion to influence flexible circuit board's electrical property.
Specifically, first functional layer includes first metal level, first printing ink layer set up in the via hole of first metal level through making first printing ink layer set up in the via hole of first metal level for first printing ink layer can protect first metal level, avoids the invasion of water oxygen.
Specifically, the thickness of the first ink layer is smaller than that of the first metal layer, the stiffness of the flexible circuit board is prevented from being influenced by the overlarge thickness of the first ink layer by enabling the thickness of the first ink layer to be smaller than that of the first metal layer, the flexible circuit board can be descended by self gravity, and the flexible circuit board is prevented from being damaged due to interference.
In one embodiment, the first functional layer comprises:
the first metal layer is arranged on one side of the substrate;
the first adhesive layer is arranged on one side of the first metal layer, which is far away from the substrate;
the first protective layer is arranged on one side, far away from the first metal layer, of the first adhesive layer;
the first electromagnetic-resistant layer is arranged on one side, far away from the first adhesive layer, of the first protective layer;
the first electromagnetic shielding layer is formed with a first via hole, the first protection layer is formed with a second via hole, the first adhesive layer is formed with a third via hole, the first metal layer is formed with a fourth via hole, the width of the third via hole is equal to the width of the fourth via hole, the width of the third via hole is smaller than the width of the first via hole, the width of the third via hole is smaller than the width of the second via hole the flexible circuit board comprises a first insulating part and a second insulating part which are arranged in the bending area, the first insulating part is arranged between the second insulating part and the substrate, the material of the first insulating part is the same as that of the first adhesive layer, the material of the second insulating part is the same as that of the first protection layer, the first insulating part and the second insulating part are arranged on one side close to the first connection area, and the first ink layer is arranged adjacent to the first insulating part. The first functional layer is protected through the first insulating part, the second insulating part and the first ink layer, water and oxygen invasion is avoided, corrosion is avoided, and the electric property of the flexible circuit board is prevented from being influenced.
Specifically, the second functional layer comprises a second metal layer and a second adhesive layer, the second metal layer is arranged between the substrate and the second adhesive layer, a through hole is formed in the second adhesive layer, the second ink layer is arranged in the through hole of the second adhesive layer, and the second ink layer is arranged in the through hole of the second adhesive layer, so that the second ink layer covers the second metal layer, the second ink layer can protect the second metal layer, and the electric property of the flexible circuit board is prevented from being influenced by water and oxygen invasion.
Specifically, the thickness on second printing ink layer is less than the thickness on second glue film, and through making the thickness on second printing ink layer be less than the thickness on second glue film, avoids the too big stiff nature that influences the flexible circuit board of thickness on second printing ink layer for the flexible circuit board can receive self gravity tenesmus, avoids the flexible circuit board to appear interfering and leads to the damage.
In one embodiment, the material of the first metal layer comprises copper.
In one embodiment, the material of the second metal layer comprises copper.
In one embodiment, the material of the first protective layer comprises polyimide.
In one embodiment, the material of the second protective layer comprises polyimide.
In one embodiment, the material of the substrate comprises polyimide.
In one embodiment, as shown in fig. 1, the display device 3 further includes a cover plate 22 and a driving chip 23, the cover plate 22 is disposed on a side of the display panel 21 away from the flexible circuit board 1, and the driving chip 23 is connected to the flexible circuit board 1.
According to the above embodiments:
the embodiment of the application provides a display device; the display device comprises a display panel and a flexible circuit board, wherein the display panel comprises a plane display area and at least one curved surface display area, the flexible circuit board is connected with the display panel in the at least one curved surface display area, the flexible circuit board comprises a first connecting area connected with the display panel, a second connecting area connected with a driving chip and a bending area located between the first connecting area and the second connecting area, the flexible circuit board comprises a substrate, a first functional layer and a second functional layer, the substrate is arranged between the first functional layer and the second functional layer, the first functional layer and the second functional layer comprise a plurality of film layers, at least three film layers in the first functional layer are provided with through holes, at least three film layers in the second functional layer are provided with through holes, projections of every two layers of through holes in the first functional layer and the second functional layer on the substrate are overlapped, and the part of the flexible circuit board located in the bending area is automatically bent under the action of gravity through the through holes formed in the first functional layer and the second functional layer. This application forms the via hole through making the at least three-layer of first functional layer, at least three-layer in the second functional layer forms the via hole, and the projection of each via hole on the basement exists the coincidence, through form the via hole in first functional layer and second functional layer so that the part that the flexible circuit board is located the bending zone receives gravity automatic buckling, the flexible circuit board thickness of bending zone has been reduced, the width of via hole has been increased, the elastic modulus of bending zone flexible circuit board has been reduced, make the flexible circuit board automatic tenesmus that appears under the action of gravity, avoid the flexible circuit board upwarp to appear interfering the damage flexible circuit board.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.
The display device provided by the embodiment of the present application is described in detail above, and the principle and the implementation of the present application are explained in the present application by applying specific examples, and the description of the above embodiment is only used to help understanding the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (13)
1. A display device, comprising:
the display panel comprises a plane display area and at least one curved surface display area;
the flexible circuit board is connected with the at least one curved surface display area and comprises a first connecting area connected with the display panel, a second connecting area connected with a driving chip and a bending area positioned between the first connecting area and the second connecting area;
the flexible circuit board comprises a substrate, a first functional layer and a second functional layer, wherein the substrate is arranged between the first functional layer and the second functional layer, the first functional layer and the second functional layer comprise a plurality of films, at least three films in the first functional layer are provided with via holes, at least three films in the second functional layer are provided with via holes, projections of every two layers of via holes in the first functional layer and the second functional layer on the substrate are overlapped, and the flexible circuit board is enabled to be automatically bent under the action of gravity by forming the via holes in the first functional layer and the second functional layer.
2. The display device of claim 1, wherein the first functional layer comprises:
the first metal layer is arranged on one side of the substrate;
the first adhesive layer is arranged on one side of the first metal layer, which is far away from the substrate;
the first protective layer is arranged on one side, far away from the first metal layer, of the first adhesive layer;
the first electromagnetic-resistant layer is arranged on one side, far away from the first adhesive layer, of the first protective layer;
the first electromagnetic shielding layer is formed with a first via hole, the first protective layer is formed with a second via hole, and at least one of the first adhesive layer and the first metal layer is formed with a via hole.
3. The display device of claim 2, wherein the first glue layer is formed with a third via, the first metal layer is formed with a fourth via, a width of the third via is equal to a width of the fourth via, the width of the third via is less than the width of the first via, and the width of the third via is less than the width of the second via.
4. The display device according to claim 3, wherein the flexible circuit board includes a first insulating portion and a second insulating portion disposed at the bending region, the first insulating portion is disposed between the second insulating portion and the substrate, a material of the first insulating portion is the same as a material of the first adhesive layer, a material of the second insulating portion is the same as a material of the first protective layer, and the first insulating portion and the second insulating portion are disposed at a side near the first connection region.
5. The display device according to claim 1, wherein the second functional layer comprises:
the second metal layer is arranged on one side, far away from the first functional layer, of the substrate;
the second adhesive layer is arranged on one side of the second metal layer, which is far away from the substrate;
the second protective layer is arranged on one side, far away from the second metal layer, of the second adhesive layer;
the second electromagnetic-resistant layer is arranged on one side, far away from the second glue layer, of the second protective layer;
the second electromagnetic shielding layer is formed with a fifth via hole, the second protective layer is formed with a sixth via hole, and at least one of the second adhesive layer and the second metal layer is formed with a via hole.
6. The display device according to claim 5, wherein the second glue layer is formed with a seventh via, a width of the fifth via is equal to a width of the sixth via, and the width of the fifth via is equal to the width of the seventh via.
7. The display device of claim 6, wherein a width of the via in the second functional layer is greater than or equal to a width of the via in the first functional layer.
8. The display device according to claim 5, wherein a seventh via is formed in the second glue layer, an eighth via is formed in the second metal layer, a width of the seventh via is equal to a width of the eighth via, a width of the seventh via is smaller than a width of the fifth via, and a width of the seventh via is smaller than a width of the sixth via.
9. The display device according to claim 8, wherein the flexible circuit board includes a third insulating portion and a fourth insulating portion disposed in the bending region, the third insulating portion is disposed between the fourth insulating portion and the substrate, a material of the third insulating portion is the same as a material of the second adhesive layer, a material of the fourth insulating portion is the same as a material of the second protective layer, and the third insulating portion and the fourth insulating portion are disposed on a side close to the first connection region.
10. The display device of claim 1, wherein the widths of at least two vias in the first functional layer are not equal, the widths of each via in the second functional layer are equal, and the width of a via in the second functional layer is equal to the maximum width of a via in the first functional layer.
11. The display device of claim 10, wherein the width of the via in the second functional layer is greater than 6 millimeters.
12. The display device according to claim 1, wherein the via hole of any one of the first functional layer and the second functional layer is provided in the bending region.
13. The display device of claim 1, wherein the flexible circuit board further comprises an ink layer, the ink layer comprising a first ink layer and a second ink layer, the first ink layer disposed within the via hole of the first functional layer, the second ink layer disposed within the via hole of the second functional layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210812795.0A CN115206190B (en) | 2022-07-11 | 2022-07-11 | display device |
| PCT/CN2022/114782 WO2024011719A1 (en) | 2022-07-11 | 2022-08-25 | Display apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210812795.0A CN115206190B (en) | 2022-07-11 | 2022-07-11 | display device |
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| CN115206190A true CN115206190A (en) | 2022-10-18 |
| CN115206190B CN115206190B (en) | 2023-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210812795.0A Active CN115206190B (en) | 2022-07-11 | 2022-07-11 | display device |
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| CN (1) | CN115206190B (en) |
| WO (1) | WO2024011719A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN115206190B (en) | 2023-11-28 |
| WO2024011719A1 (en) | 2024-01-18 |
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