CN216956582U - Display module and electronic equipment - Google Patents

Abstract

The utility model provides a display module assembly and electronic equipment, this display module assembly includes: a display panel; the backlight module is attached to the first surface of the display panel, and the distance between the edge of the first end of the display panel and the edge of the first end of the backlight module is within a first preset range; the flexible circuit board, the first side of flexible circuit board is at least including walking line district and green oil district, walks the line district and corresponds with the golden finger district on the display panel second face and is connected, is provided with the stiffening layer on the second face of flexible circuit board, and the orthographic projection of stiffening layer covers the orthographic projection of walking line district completely to the distance between the edge of the first end of stiffening layer and the edge of the first end of display panel is between the second presets the scope. This is disclosed through the position relation between adjustment display panel and the backlight unit, restricts the reinforcement scope on strengthening layer simultaneously, makes the radius of buckling of flexible circuit board when buckling descend, realizes the reduction of display module assembly size, reaches the purpose that further reduces electronic equipment frame size.

Description

Display module and electronic equipment

Technical Field

The disclosure relates to the technical field of display, in particular to a display module and an electronic device.

Background

With the popularity of various intelligent electronic devices, the requirement of consumers on the screen occupation ratio of the devices is higher and higher, and how to realize larger screen occupation ratio and narrower frame of the devices is a problem to be solved by device manufacturers.

SUMMERY OF THE UTILITY MODEL

An object of the disclosed embodiment is to provide a display module and an electronic device, so as to solve the problem of how to implement a narrow frame of the device in the prior art.

The embodiment of the disclosure adopts the following technical scheme: a display module, comprising: a display panel; the backlight module is attached to the first surface of the display panel, and the distance between the edge of the first end of the display panel and the edge of the first end of the backlight module is within a first preset range; the flexible circuit board comprises a flexible circuit board, wherein a first surface of the flexible circuit board at least comprises a wiring area and a green oil area, the wiring area is correspondingly connected with a golden finger area on a second surface of the display panel, a strengthening layer is arranged on the second surface of the flexible circuit board, the orthographic projection of the strengthening layer completely covers the orthographic projection of the wiring area, and the distance between the edge of a first end of the strengthening layer and the edge of a first end of the display panel is within a second preset range; the second surface of the display panel is a surface opposite to the first surface of the display panel.

In some embodiments, the first side of the flexible circuit board further includes a parallel connection area disposed between the routing area and the green oil area, and a distance between an edge of a second end of the parallel connection area and an edge of the first end of the display panel is within a third preset range, where a lower limit of the third preset range is 0.

In some embodiments, the width of the merge area is between 0.1 mm and 0.25 mm.

In some embodiments, the first predetermined range is 0.2 mm to 0.35 mm.

In some embodiments, the second predetermined range is 0.1 mm to 0.35 mm.

In some embodiments, the flexible circuit board and the display panel are fixed by a wire adhesive, and the elastic modulus of the wire adhesive is between 40 mpa and 60 mpa.

In some embodiments, the substrate thickness of the flexible circuit board is 20 microns, and the base copper layer thickness and the copper plating layer thickness of the flexible circuit board are both 8 microns.

In some embodiments, the green oil zone is printed based on a photosensitive polyimide material.

The embodiment of the disclosure further provides an electronic device, which at least comprises the display module.

The beneficial effects of this disclosed embodiment lie in: through adjusting the position relation between display panel and the backlight unit, inject the reinforcement scope on strengthening layer simultaneously, make the radius of buckling of flexible circuit board when buckling descend, realize the reduction of display module assembly size, reach the purpose that further reduces electronic equipment frame size.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a cross-sectional side view of a display module according to a first embodiment of the disclosure;

fig. 2 is a schematic front view illustrating a display module according to a first embodiment of the disclosure;

fig. 3 is a schematic diagram of a second front structure of a display module according to a first embodiment of the disclosure.

Detailed Description

Various aspects and features of the disclosure are described herein with reference to the drawings.

It should be understood that various modifications may be made to the embodiments of the present application. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Other modifications will occur to those skilled in the art within the scope and spirit of the disclosure.

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.

These and other characteristics of the present disclosure will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.

It should also be understood that, although the present disclosure has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of the disclosure, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.

The above and other aspects, features and advantages of the present disclosure will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.

Specific embodiments of the present disclosure are described hereinafter with reference to the drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the disclosure that may be embodied in various forms. Well-known and/or repeated functions and structures have not been described in detail so as not to obscure the present disclosure with unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.

The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the disclosure.

In order to solve the problem of reducing the size of the frame of the electronic equipment, especially the size of the lower frame, the first embodiment of the disclosure provides a display module, and based on the position relation and the size limitation between each layer of the display module, the bending radius of a flexible circuit board in the display module is reduced, and the purposes of reducing the size of the display module and reducing the size of the frame of the electronic equipment are achieved.

Fig. 1 is a side cross-sectional view of a display module provided in this embodiment. As shown in fig. 1, the display module in this embodiment is mainly a liquid crystal display module, and at least includes a display panel 10 and a backlight module 20, and may further include a cover plate, an adhesive layer, and other layers, which are not described herein again. Specifically, the backlight module 20 is attached to a first surface of the display panel 10 (i.e. a right side surface of the display panel 10 in fig. 1) for providing a backlight source to the display panel 10; moreover, a distance H1 between an edge of the first end of the display panel 10 (i.e., the lower side of the display panel 10 in fig. 1) and an edge of the first end of the backlight module 20 (i.e., the lower side of the backlight module 20 in fig. 1) is within a first predetermined range.

In the embodiment, the first predetermined range is defined as 0.2 mm to 0.35 mm, i.e. the value of H1 is between 0.2 mm to 0.35 mm, and generally, in order to achieve the best optimization effect, the value of H1 is set to 0.2, so as to minimize the distance between the edge of the display panel 10 and the edge of the backlight module 20. It should be noted that the first end mentioned in this embodiment is an end of each layer or module that is lower in the vertical direction, and may also be referred to as a bottom end of each layer or module, and the second end corresponding to the first end is an end of each layer or module that is upper in the vertical direction, and the second ends of the display panel 10 and the backlight module 20 are not shown in fig. 1. Meanwhile, the orthographic projection of the backlight module 20 should completely cover the orthographic projection of the display panel 10, that is, the distance between the edge of the first end of the display panel 10 and the center of the display module should be smaller than the distance between the edge of the first end of the backlight module 20 and the center of the display module, so as to ensure that the display panel 10 can be protected by the backlight module 20 when the display module is manufactured.

The display module shown in fig. 1 further includes a flexible circuit board 30, one end of which is connected to the display panel 10, and the other end of which is connected to a driving IC (not shown in fig. 1), and the end connected to the driving IC is bent to a side of the backlight module 20 away from the display panel 10, so as to implement data communication between the display panel 10 and the driving IC. Fig. 2 shows a schematic front structure diagram of the display module. As shown in fig. 2, the first surface (i.e. the surface attached to the display panel 10) of the flexible circuit board 30 at least includes a wiring area 31 and a green oil area 32, where the wiring area 31 is connected to the gold finger area 11 on the second surface (the second surface of the display panel 10 is the surface opposite to the first surface of the display panel 10, for example, the left surface of the display panel 10 in fig. 1) of the display panel 10, so as to implement data communication; the distance s between the boundary between the wiring area 31 and the green oil area 32 and the edge of the first end of the display panel 10 is 0.2 mm; the green oil region 32 is covered with green oil on the corresponding region of the wiring layer (the wiring layer includes a copper-based layer and a copper-plated layer) for insulation and protection. Meanwhile, a second surface (i.e., a surface far away from the display panel 10) of the flexible circuit board 30 is provided with a reinforcing layer 40 (as shown by a shaded portion in fig. 1 and a long dashed line frame portion in fig. 2), and by setting a PI tape or other reinforcing materials with strong hardness, a fixed connection between a wiring area of the flexible circuit board and a golden finger area of the display panel is realized, so that the problem that connection effects are affected by wrinkles and the like at connection positions is avoided. It should be noted that the thicknesses of the various layers shown in the figures are merely illustrative and may be set according to design specifications and requirements in actual manufacturing.

In this embodiment, the orthographic projection of the stiffening layer 40 completely covers the orthographic projection of the wiring region 31, that is, the stiffening layer 40 completely covers the wiring region 31 of the flexible circuit board to achieve a good connection effect, meanwhile, the range covered by the stiffening layer 40 needs to exceed the wiring region 31 to a certain extent to ensure that the wiring region 31 of the flexible circuit board 30 after being bent does not have a dislocation or a falling-off condition due to stress generated during bending, and in this embodiment, the distance H2 between the edge of the first end of the stiffening layer 40 and the edge of the first end of the display panel 10 is limited within a second preset range to ensure a good stiffening effect. In some embodiments, the second predetermined range may be 0.1 mm to 0.35 mm, fig. 2 shows a schematic view of the arrangement of the reinforcing layer 40 when H2 is 0.35 mm, in which case the reinforcing layer 40 also covers the green oil region 32 with a certain width, fig. 3 shows a schematic view of the arrangement of the reinforcing layer 40 when H2 is 0.1 mm, in which case the reinforcing layer 40 does not cover the green oil region 32. In practical use, the smaller the overlapping dimension between the reinforcing layer 40 and the green oil region 32 is, the more concentrated the stress applied to the bending start position of the flexible circuit board 30 (i.e. the portion of the second surface of the flexible circuit board 20 not covered by the reinforcing layer 40) is, but the stress concentration and fracture condition caused by the decrease of the overlapping dimension does not occur in the actual bending test and the display module manufacturing, so that the dimension design of the reinforcing layer 40 can be performed according to the requirement during the actual manufacturing, and the distance between the edge of the first end of the reinforcing layer 40 and the edge of the first end of the display panel 10 is within the range of 0.1 to 0.35 mm.

As can be seen from fig. 1, the bending radius of the flexible circuit board 30 is mainly determined based on the distance H1 and the bending start position of the flexible circuit board 30, and the bending start position of the flexible circuit board 30 is determined according to the edge position of the reinforcing layer 40, in this embodiment, the value range of H1 is limited, and the distance between the edge of the first end of the reinforcing layer 40 and the edge of the first end of the display panel 10 is reduced, that is, the adjustment of H1 and the upward movement of the bending start position of the flexible circuit board 30 are simultaneously achieved, so as to achieve the purpose of reducing the bending radius of the flexible circuit board.

In some embodiments, as shown in fig. 2, the first side of the flexible circuit board 30 further includes a parallel region 33 (shown by a shaded portion in fig. 2) disposed between the routing region 31 and the green oil region 32, and the parallel region is mainly used for combining a plurality of traces (shown by a short dashed line in fig. 2) in the routing region 31, where the same signal is input, so as to reduce the number of traces disposed in the green oil region 32, so as to reduce the bounce in the bending region caused by the traces in the bending region, and further reduce the bending radius. In the present embodiment, a distance H3 between an edge of the second end of the merging region 33 (i.e., the upper side of the merging region 33 in fig. 2) and an edge of the first end of the display panel 10 is within a third preset range, and a lower limit of the third preset range may be 0, that is, the edge of the second end of the merging region 33 and the edge of the first end of the display panel 10 may coincide with each other, as shown in fig. 3; the upper limit of the third predetermined range may be designed according to the size of the reinforcing layer 40, the merging region 33 may be designed within the range covered by the reinforcing layer 40 according to actual design requirements, or may be disposed outside the range covered by the reinforcing layer 40, and in the case that the merging region 33 is disposed outside the range covered by the reinforcing layer 40, the upper limit of the third predetermined range is the distance H2 between the first end edge of the reinforcing layer 40 and the display panel 10. It should be noted that in the case shown in fig. 3, the display panel 10 and the routing area 31 completely coincide with each other, which is caused by the fact that the edge of the merging area 33 coincides with the edge of the display panel 10, and the merging area 33 may actually be a part of the routing area 31, as long as it is ensured that the edge of the merging area 33 coincides with the lower edge of the display panel 10.

In practical fabrication, the width d of the merging area 33 may be set between 0.1 mm and 0.25 mm. It should be noted that, if the merging region 33 is designed within the range covered by the stiffening layer 40, the position covered by the stiffening layer 40 is not bent, so the width of the merging region 33 cannot affect the bending radius, especially for the case where the stiffening layer 40 completely covers the merging region 33. If a partial area or a whole area of the wire merging area 33 is disposed outside the coverage of the stiffening layer 40, the width d of the wire merging area 33 may be set to be the minimum value of 0.1 when designing the wire merging area 33, so as to reduce the number of wires in the bending area of the flexible circuit board 30, and achieve the effect of reducing the bending stress.

As shown in fig. 1, when the flexible circuit board 30 and the display panel 10 are connected, in addition to attaching the wire area 31 and the gold finger area 11 by means of conductive adhesive or the like, the display panel 10 and the flexible circuit board 30 may be fixed by a wire adhesive (as shown in the black part in fig. 1). Specifically, a line glue 50 may be filled at a boundary between the bottom surface of the first end of the display panel 10 and the first surface of the flexible circuit board 30 to fix the two, and it is required to ensure that the width of the line glue 50 covering the first surface of the flexible circuit board 30 reaches a certain threshold value before the fixed connection effect is ensured. In the conventional scheme, the width of the first surface of the flexible circuit board 30 covered by the line glue 50 is usually about 0.6 mm, and the line glue 50 is usually made of common glue, but the line glue cannot be bent due to high hardness after being solidified. In some embodiments, other types of glue with an elastic modulus within 40 mpa to 60 mpa may be used as the in-line glue 50, so that the in-line glue can be bent along with the bending of the flexible circuit board 30 under the condition that the width cannot be reduced, thereby achieving the purpose of fixing and protecting the flexible circuit board 30 and the display panel 10, and meeting the requirement of reducing the bending radius of the flexible circuit board 30. Alternatively, a glue with a modulus of elasticity of 48 mpa may be selected for in-line glue 50.

In some embodiments, the thickness of the substrate and the thickness of the circuit layer of the flexible circuit board 30 may be respectively reduced, so that the partial rebound force in the layer level is reduced, which is beneficial to reducing the bending radius of the flexible circuit board 30. Specifically, the base material thickness of the flexible circuit board 30 may be set to 20 micrometers, and the thicknesses of the copper-based layer and the copper-plated layer of the flexible circuit board 30 may each be set to 8 micrometers. It should be understood that, where the manufacturing process and the manufacturing strength of the substrate and the circuit layer of the flexible circuit board allow, the corresponding thickness can be further reduced, and the thickness dimensions provided in the embodiment are only illustrative and do not limit the protection scope of the present disclosure.

In some embodiments, a photosensitive polyimide material (PSPI) may be selected to manufacture the green oil in the green oil region 32, and the manufacturing accuracy of the green oil is higher than that of a green oil coating used in the prior art, so that the size reduction of the routing region 31 of the flexible circuit board 30 and the size reduction of the stiffening layer 40 can be further achieved, and the size of the bending radius can be further reduced.

This embodiment is through adjusting position relation between display panel and the backlight unit, prescribes a limit to the reinforcement scope on strengthening layer simultaneously, makes the radius of buckling of flexible circuit board when buckling descend, realizes the reduction of display module assembly size, reaches the purpose that further reduces electronic equipment frame size.

The second embodiment of the present disclosure provides an electronic device, which may be a device with a large-sized display screen such as a smart phone or a tablet computer, and the electronic device at least includes the display module set provided by the first embodiment of the present disclosure, and because the flexible circuit board of the display module set has a smaller bending radius, a narrower frame size can be realized when the frame corresponding to the display module set is installed, so that the electronic device has a larger screen occupation ratio, and the use experience of a user is improved.

In addition, the electronic device should further include other modules or devices for implementing functions of the electronic device, such as a power device, a speaker module, a touch layer, a communication module, a camera module, and the like, and the embodiment is not particularly limited herein.

Although the present disclosure has been described in detail with reference to the specific embodiments, it should be understood that the present disclosure is not limited to those precise embodiments, and that various changes and modifications may be effected therein by one skilled in the art based on the teachings herein.

Claims (9)

1. A display module, comprising:

a display panel;

the backlight module is attached to the first surface of the display panel, and the distance between the edge of the first end of the display panel and the edge of the first end of the backlight module is within a first preset range;

the display panel comprises a flexible circuit board, wherein a first surface of the flexible circuit board at least comprises a wiring area and a green oil area, the wiring area is correspondingly connected with a golden finger area on a second surface of the display panel, a reinforcing layer is arranged on the second surface of the flexible circuit board, the orthographic projection of the reinforcing layer completely covers the orthographic projection of the wiring area, and the distance between the edge of a first end of the reinforcing layer and the edge of a first end of the display panel is within a second preset range;

the second surface of the display panel is a surface opposite to the first surface of the display panel.

2. The display module according to claim 1, wherein the first surface of the flexible circuit board further comprises a line-merging area disposed between the line-routing area and the green oil area, a distance between an edge of a second end of the line-merging area and an edge of the first end of the display panel is within a third preset range, and a lower limit of the third preset range is 0.

3. The display module of claim 2, wherein the width of the merge area is between 0.1 mm and 0.25 mm.

4. The display module of claim 2, wherein the first predetermined range is 0.2 mm to 0.35 mm.

5. The display module of claim 4, wherein the second predetermined range is 0.1 mm to 0.35 mm.

6. The display module as claimed in claim 1, wherein the flexible printed circuit board is fixed to the display panel by a wire adhesive, and the elastic modulus of the wire adhesive is between 40 mpa and 60 mpa.

7. The display module of claim 1, wherein the substrate thickness of the flexible circuit board is 20 microns, and the base copper layer thickness and the copper plating layer thickness of the flexible circuit board are both 8 microns.

8. The display module according to any one of claims 1 to 7, wherein the green oil region is printed based on a photosensitive polyimide material.

9. An electronic device, characterized by comprising at least the display module according to claim 8.

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