CN114464659A

CN114464659A - OLED display module and electronic equipment

Info

Publication number: CN114464659A
Application number: CN202210122487.5A
Authority: CN
Inventors: 税禹单; 冯佑雄; 李睿琦; 赵辉; 李尚鸿; 向炼
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2022-02-09
Filing date: 2022-02-09
Publication date: 2022-05-10

Abstract

The present disclosure provides an OLED display module assembly and electronic equipment, this display module assembly includes: a sensor layer; a control layer; a panel layer positioned between the sensor layer and the control layer; the first end of the chip on film is connected with the second end of the panel layer connected with the chip on film and is connected with the control layer, and a first bending part is arranged between the first end and the second end of the chip on film; the first end of the electromagnetic shielding layer is connected with the sensor layer, the second end of the electromagnetic shielding layer covers the second end of the flip chip film, a second bending part is arranged between the first end and the second end of the electromagnetic shielding layer, and the second bending part covers the first bending part. According to the OLED display module, the electromagnetic shielding layer is additionally arranged in the OLED display module structure, so that the coating of the chip on film is realized on the basis that the original hierarchical structure of the OLED display module is not influenced, the interference of external electromagnetic signals is avoided, and the normal display effect of the OLED display module is ensured.

Description

OLED display module and electronic equipment

Technical Field

The disclosure relates to the technical field of display, in particular to an OLED display module and electronic equipment.

Background

Organic Light Emitting Diode (OLED) display devices have the characteristics of high contrast, high brightness, bright color and flexibility, and are widely used in a variety of fields.

However, when the screen driving IC drives the screen to display, external interference signals flow into the IC terminal through a Chip On Film (COF) exposed outside, so that noise output from the IC terminal is increased, and the OLED screen has display failures such as jitter, black screen, and screen splash, which affects normal use of the OLED screen.

Disclosure of Invention

An object of the disclosed embodiment is to provide an OLED display module and an electronic device, so as to solve the problem that display failure easily occurs when an OLED screen is used in an electromagnetically complex environment in the prior art.

The embodiment of the disclosure adopts the following technical scheme: an OLED display module, comprising: a sensor layer; a control layer; a panel layer positioned between the sensor layer and the control layer; the first end of the chip on film is connected with the panel layer, the second end of the chip on film is connected with the control layer, and a first bending part is arranged between the first end and the second end of the chip on film; the first end of the electromagnetic shielding layer is connected with the sensor layer, the second end of the electromagnetic shielding layer covers the second end of the chip on film, a second bending part is arranged between the first end and the second end of the electromagnetic shielding layer, and the second bending part wraps the first bending part.

In some embodiments, a first overlapping area is formed between the first end of the electromagnetic shielding layer and the sensor layer, and when the flip-chip film and the electromagnetic shielding layer are not bent, the size of the electromagnetic shielding layer in the first direction is larger than that of the flip-chip film in the first direction, and the size of the electromagnetic shielding layer in the second direction is larger than that of the flip-chip film in the second direction; the first direction is a direction perpendicular to a long side of the first overlapping region, and the second direction is a direction perpendicular to the first direction.

In some embodiments, the electromagnetic shielding layer includes at least a first side and a second side in the first direction, a distance between the first side of the electromagnetic shielding layer and the third side of the flip-chip film is between 4 and 5 mm, and a distance between the second side of the electromagnetic shielding layer and the fourth side of the flip-chip film is between 4 and 5 mm; the third edge is an edge of the flip chip film closest to the first edge in the first direction, and the fourth edge is an edge of the flip chip film closest to the second edge in the first direction.

In some embodiments, further comprising: the flexible circuit board is used for connecting the sensor layer and the control layer, the flexible circuit board at least comprises an electromagnetic shielding film, and the electromagnetic shielding film is multiplexed to be the electromagnetic shielding layer.

In some embodiments, the first end of the electromagnetic shielding layer is divided into at least one bonded region and at least one virtual region; the binding region is connected with an input region of the sensor layer through a conductive adhesive, wherein the input region is located in the first overlapping region, and the virtual region is fixedly connected with other regions except the input region in the first overlapping region.

In some embodiments, the electromagnetic shielding layer is an electromagnetic shielding tape, and the display module further comprises a protective layer disposed on a side of the sensor layer away from the panel layer; the first end of the electromagnetic shielding adhesive tape is positioned between the protective layer and the sensor layer, and the first end of the electromagnetic shielding adhesive tape is attached to the surface of the protective layer or the surface of the sensor layer.

In some embodiments, further comprising: a flexible circuit board for connecting the sensor layer and the control layer; in a case where the flexible circuit board and the electromagnetic shielding layer are not bent, a maximum size of the electromagnetic shielding layer in the first direction is smaller than 1/3 that is a maximum size of the flexible circuit board in the first direction.

In some embodiments, the electromagnetic shielding layer is provided with through holes, and the positions of the through holes correspond to the intervals between two adjacent flip chips.

In some embodiments, each of the through holes has the same distance between two adjacent flip chips.

The embodiment of the disclosure also provides an electronic device, which at least comprises the OLED display module.

The beneficial effects of this disclosed embodiment lie in: by adding the electromagnetic shielding layer in the OLED display module structure, the coating of the chip on film is realized on the basis of not influencing the original hierarchical structure of the OLED display module, the interference of external electromagnetic signals is avoided, and the normal display effect of the OLED display module is ensured.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and for those skilled in the art, other drawings may be obtained according to the drawings without creative efforts.

FIG. 1 is a first front view of an OLED display module according to a first embodiment of the present disclosure;

FIG. 2 is a first side view of an OLED display module according to a first embodiment of the present disclosure;

FIG. 3 is a second front view of the OLED display module according to the first embodiment of the present disclosure;

FIG. 4 is a second side view of the OLED display module according to the first embodiment of the present disclosure;

fig. 5 is a schematic diagram of an electronic device in a second embodiment of the disclosure.

Detailed Description

Various aspects and features of the disclosure are described herein with reference to the drawings.

It will be understood that various modifications may be made to the embodiments of the present application. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Other modifications will occur to those skilled in the art within the scope and spirit of the disclosure.

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.

These and other characteristics of the present disclosure will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.

It should also be understood that, although the present disclosure has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of the disclosure, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.

The above and other aspects, features and advantages of the present disclosure will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.

Specific embodiments of the present disclosure are described hereinafter with reference to the drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the disclosure that may be embodied in various forms. Well-known and/or repeated functions and structures have not been described in detail so as not to obscure the present disclosure with unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.

The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the disclosure.

Organic Light Emitting Diode (OLED) display devices have the characteristics of high contrast, high brightness, bright color and flexibility, and are widely used in a variety of fields. . For example, when the OLED screen is used as a central control display or an instrument panel of a vehicle, a better display effect and better user experience can be realized, and the flexibility of the OLED can bring more form changes, so that the display design of the automobile can be applied to more scenes, and the use experience of a driver is improved.

But the signal of the OLED screen can be interfered under the complex scene of the electromagnetic environment, and the normal use of the OLED screen is influenced. For example, when the OLED screen is used in a vehicle, electromagnetic signals in the entire vehicle environment are complex, and the generation of various control signals during the driving process of the vehicle may interfere with the signals of the OLED display screen, so that the display screen displaying the vehicle control signals, vehicle faults, the driving state of the vehicle, and other contents is interfered, and thus, a user cannot know the vehicle state accurately in time, and a safety accident may be caused seriously. The basic reason is that when the driving IC in the screen provides the display signal to the screen, the driving IC is severely interfered by the external electromagnetic signal, and the external interference signal flows into the driving IC along with the COF in the display module, so that the noise output by the driving IC is increased, which causes display failures such as jitter, black screen, and checkered screen of the OLED screen, and affects the normal use of the OLED screen.

In order to solve the above problem, a first embodiment of the present disclosure provides an OLED display module, where fig. 1 shows a front view of the display module, and fig. 2 is a corresponding side view of the display module shown in fig. 1. As shown in fig. 1 and 2, the display module mainly includes a sensor layer 20, a panel layer 30, and a control layer (not shown in the figure) disposed in this order. The sensor layer 20 may include a function layer such as a touch layer of a display; the panel layer 30 is disposed between the sensor layer 20 and the control layer, and is mainly a display panel having OLED units for displaying images; the control layer mainly includes a driving IC for controlling the panel layer 30, and may further include a processing unit for processing a sensing signal fed back by the sensor layer 20, for example, the control layer may be a printed circuit board provided with the driving IC and the processing unit; in this embodiment, the processing unit and the driving IC are represented by the control layer, and no distinction is made in the following description. In addition, as shown in fig. 1, the OLED display module generally further includes a protection layer 10 disposed on a side of the sensor layer 20 away from the panel layer 30 for protecting the hierarchical structure in the OLED module, which is generally made of glass or other hard transparent material.

In this embodiment, the panel layer 30 and the control layer are mainly connected through a Chip On Film (COF) 40, wherein a first end of the chip on film 40 is attached to the panel layer 30, a second end of the chip on film 40 is attached to the control layer, and a first bending portion is disposed between the first end and the second end of the chip on film 40. Specifically, the chip on film 40 has a certain number of signal lines, which are respectively connected to the signal lines in the panel layer 30 and the control layer, so as to transmit the control signal output by the control layer, and enable the panel layer 30 to display an image. In practical use, one display module usually has a plurality of flip-chip films 40, each flip-chip film 40 is used for transmitting signals for controlling different panel layer areas, the display module shown in fig. 1 includes 4 flip-chip films 40, when the size or the requirement of the display module changes, the number of the flip-chip films 40 can be adjusted accordingly, and the embodiment is not limited specifically.

Further, the display module in this embodiment further includes an electromagnetic shielding film 50. Referring to fig. 1, the electromagnetic shielding film 50 includes a first end, a second end and a second bending portion, wherein the first end of the electromagnetic shielding film 50 is fixedly connected to the sensor layer, the second end of the electromagnetic shielding film covers the second end of the chip on film 40, and is also connected to the control layer, the second bending portion is located between the first end and the second end of the electromagnetic shielding film 50, when the display module is manufactured, the first bending portion is coated by the second bending portion, and then the external electromagnetic signal interferes with the chip on film 40 through the electromagnetic shielding film 50, so as to shield the external interference signal.

Specifically, in the process of manufacturing the display module, the first end of the flip-chip film 40 is connected with the panel layer 30, the first end of the electromagnetic shielding film 50 is connected with the sensor layer, the second end of the flip-chip film 40 is connected with the control layer, the second end of the electromagnetic shielding film 50 covers the second end of the flip-chip film 40, the control layer is bent to one side of the panel layer 30 far away from the sensor layer 20, so that the connection area between the first end and the second end of the flip-chip film 40 and the connection area between the second end and the second end of the electromagnetic shielding film 50 are bent at the same time to form a first bending area and a second bending area, and the second bending part covers the first bending part according to the connection position of the electromagnetic shielding film 50, so as to shield the interference signal.

It should be noted that there is a first overlapping area 21 (shown by a shaded portion in fig. 1) between the first end of the electromagnetic shielding layer 50 and the sensor layer 20, that is, an area where the first end of the electromagnetic shielding layer 50 is fixedly connected to an edge of the sensor layer 20, a width of the first overlapping area 21 is an attachment width between the first end of the electromagnetic shielding layer 50 and the sensor layer 20, and a length of the first overlapping area 21 is generally the same as a length of the electromagnetic shielding layer 50. Fig. 1 also shows a schematic diagram of the dimension between the flip-chip 40 and the electromagnetic shielding layer 50 under the condition that the flip-chip 40 and the electromagnetic shielding layer 50 are not bent. Specifically, the first direction is defined as a direction perpendicular to the long side of the first overlapping area 21 (i.e. the vertical direction in fig. 1), and the second direction is defined as a direction perpendicular to the first direction (i.e. the horizontal direction in fig. 1), as can be seen from fig. 1, the dimension of the electromagnetic shielding layer 50 in the first direction is larger than the dimension of the flip-chip film in the first direction, and the dimension of the electromagnetic shielding layer 50 in the second direction is also larger than the dimension of the flip-chip film in the second direction, at this time, after the flip-chip film 40 and the electromagnetic shielding layer 50 are bent, the second bent portion with a larger dimension can cover the first bent portion, so as to isolate the external interference signal.

In some embodiments, the electromagnetic shielding layer 50 at least includes a first side and a second side in the first direction (for example, the sides of the electromagnetic shielding layer 50 on the left and right sides in the vertical direction in fig. 1), a distance between the first side of the electromagnetic shielding layer 50 and the third side of the flip-chip film 40 is between 4 and 5 mm, and a distance between the second side and the fourth side of the flip-chip film 40 is also between 4 and 5 mm, so as to ensure a good shielding effect of the second bending portion on the first bending portion, where the third side of the flip-chip film 40 is the side of the flip-chip film 40 closest to the first side in the first direction, and the fourth side is the side of the flip-chip film 40 closest to the second side in the first direction. For example, in fig. 1, the left side of the electromagnetic shielding layer 50 in the vertical direction is a first side, the right side is a second side, and the number of the flip-chip films 40 is 4, so that the third side is the left side of the leftmost flip-chip film 40 among all the flip-chip films 40, and the fourth side is the right side of the rightmost flip-chip film 40 among all the flip-chip films; if the number of the flip-chip films 40 is only one, the third side and the fourth side can be determined according to the position relationship between the first side and the second side. It should be noted that the size, shape, and the like of each hierarchy shown in the drawings are merely used for explaining the positional relationship between the hierarchies, and do not indicate the specific dimensional relationship of each hierarchy.

In actual manufacturing, the electromagnetic shielding layer 50 may be manufactured by using an electromagnetic shielding tape (EMI tape), or an electromagnetic shielding film in a flexible circuit board (FPC) is multiplexed into the electromagnetic shielding layer 50 for use, wherein the flexible circuit board (FPC) is mainly used for connecting the sensor layer 20 and the control layer to realize signal transmission between the sensor layer 20 and the control layer. In addition, when the electromagnetic shielding film of the FPC is used as the electromagnetic shielding layer 50, the first end of the electromagnetic shielding layer 50 is the first end of the FPC, the second end of the electromagnetic shielding layer 50 is the second end of the FPC, and it is necessary to ensure that the second end of the FPC is connected to the control layer to realize signal transmission.

In practical implementation, considering that the FPC has a large size, a pressure head portion corresponding to the first end of the FPC is difficult to accurately correspond to the input area of the sensor layer 20, and the signal transmission effect is easy to reduce, therefore, in some embodiments, the first end of the FPC may be divided into at least one binding area 51 and at least one virtual (dummy) area 52, where the FPC pressure head corresponding to the binding area 51 may be bound and connected to the input area of the sensor layer 20 to meet the signal transmission precision, and the input area is located in the first overlapping area 21, so as to implement signal transmission while the first end is connected to the sensor layer 20; the dummy area 52 has a pressure head, but the pressure head for receiving signals from the sensor layer 20 is not provided in the other area of the corresponding first overlapping area 21 except the input area, and therefore, the dummy area 52 and the other area of the first overlapping area 21 except the input area can be secured in close contact.

The first end of the FPC shown in fig. 1 is divided into three regions, wherein the central region is a bonding region 51, and the two side regions are virtual regions 52, and when the FPC is connected to the sensor layer 20, the bonding connection of the bonding region 51 should be performed first to ensure the signal transmission effect, and then the fixed connection of the virtual regions 52 is performed. It should be noted that the specific number of the binding areas 51 and the virtual areas 52 is not limited in this embodiment, and may be adjusted according to the size of the screen and the setting manner of the input area of the sensor layer 20, and will not be described in detail herein.

In some embodiments, electromagnetic shield layer 50 may be implemented using EMI tape composed of mylar and conductive cloth, and fig. 3 and 4 show front and side views of the display module using the EMI tape as the electromagnetic shield layer.

It should be noted that, for the display module, in order to realize the signal transmission between the sensor layer 20 and the control layer, an FPC (not shown in fig. 3) is necessarily connected between the sensor layer 20 and the control layer of the display module, and when the FPC is not required to be used as the electromagnetic shielding layer, the size of the FPC can be directly set according to the size of the input area of the sensor layer, so as to ensure that the signal transmission is stable. At this time, due to the arrangement of the FPC, the EMI tape needs to be connected between the protection layer 10 and the sensor layer 20, and it may be selectively attached on the surface of the protection layer 10 or the surface of the sensor layer 20 according to actual conditions, it should be noted that, when the EMI tape is attached on the surface of the sensor layer 20, it should be firstly ensured that the input area of the FPC and the sensor layer 20 is completely bound, and the first end of the EMI tape may be attached above the FPC, so as to further fix the FPC.

It should be noted that, as shown in fig. 4, after the display module is manufactured, the bending portion of the FPC covers the bending portion of the COF, and after the electromagnetic shielding layer 50 is bent, the FPC and the COF need to be covered, and the full coverage of the COF is ensured. Therefore, in the case that the FPC and the electromagnetic shielding layer 50 are not bent, the maximum size of the electromagnetic shielding layer 50 in the first direction (i.e. the vertical direction in fig. 1) needs to be smaller than the maximum size 1/3 of the FPC in the same direction, so as to avoid that the length of the EMI tape after bending is too long, which affects the combination effect of the OLED display module when combined with other components in the device.

Further, as shown in fig. 4, the protection layer 10 and the sensor layer 20 are fixedly connected through the optical adhesive OCA layer 11 to satisfy the reliability of the OLED display module, and in order to avoid the too small attaching width between the electromagnetic shielding layer 50 and the protection layer 10 or the sensor layer 20, the OCA layer 11 may be retracted to ensure that the gaps between the edge of the OCA layer 11 and the edge of the protection layer 10 or the sensor layer 20 all satisfy the attaching of the electromagnetic shielding layer 50. Specifically, the vertical distance between the fifth side of the OCA layer 11 close to the EMI tape (i.e., the lower side of the OCA layer 11 in fig. 4) and the sixth side of the sensor layer 20 close to the EMI tape (i.e., the lower side of the sensor layer 20 in fig. 4) is within a preset range, the preset range can be set according to practical situations, typically 2 to 6 millimeters, and it is required to ensure that the OCA layer 11 is retracted toward the center of the OLED display module, that is, for the display module shown in fig. 3, the orthographic projection of the sensor layer 20 can completely cover the orthographic projection of the OCA layer 11, and the orthographic projection area of the OCA layer 11 is smaller than that of the sensor layer 20.

It should be understood that, compared to the way of using the EMI tape as the electromagnetic shielding layer 50, the way of using the electromagnetic shielding film of the FPC as the electromagnetic shielding layer 50 does not add extra levels in the display module and does not affect the thickness of the display module, but the cost of manufacturing the FPC is increased, and the FPC can be selected according to the requirement in practical use.

In some embodiments, especially for a large-sized OLED display module, wrinkles may occur when the long electromagnetic shielding layer 50 is fixed or bent, so that stress distribution in the electromagnetic shielding layer 50 is not uniform, which may cause a falling-off condition, and especially when an electromagnetic shielding film of an FPC is used as the electromagnetic shielding layer 50, the binding precision between the binding region and the input region may be reduced, which may affect the signal transmission effect. Therefore, in some embodiments, at least one through hole 53 may be formed in the electromagnetic shielding layer 50 to reduce the problem of uneven stress distribution in the electromagnetic shielding layer 50, and avoid wrinkles occurring during bending, but it is necessary to ensure that the position where the through hole 53 is formed is located at the interval between any two adjacent COFs, so as to avoid that the COFs leak out from the through hole position after the through hole 53 is formed, which affects the shielding effect. In general, it is possible to define the via 53 to be located right in the middle between two adjacent COFs, that is, the distance between the via 53 and its adjacent COFs is the same, so as to avoid the via 53 being closer to one of the COFs and causing the electromagnetic shielding effect to be reduced. In actual manufacturing, the number and specific positions of the through holes 53 can be adjusted according to factors such as the size of the OLED display module, the number of COFs, and the COF pitch, which is not particularly limited in this embodiment.

It should be noted that, in the case that the electromagnetic shielding film of the FPC is used as the electromagnetic shielding layer 50 and the through hole 53 needs to be provided, it needs to be ensured that the FPC does not have the routing at the position where the through hole 53 is provided, and the routing interruption through the bonding area due to the through hole arrangement is prevented, so that the signal transmission function is lost.

In the embodiment, the electromagnetic shielding layer is added in the OLED display module structure, so that the coating of the chip on film is realized on the basis of not influencing the original hierarchical structure of the OLED display module, the interference of external electromagnetic signals on the chip on film is avoided, and the normal display effect of the OLED display module is ensured.

A second embodiment of the present disclosure provides an electronic device, a schematic diagram of which is shown in fig. 5, the electronic device has the OLED display module provided in the first embodiment of the present disclosure, so that the OLED display module has a strong electromagnetic signal shielding function, is suitable for an environment with complex electromagnetic signals, and is particularly suitable for a complex vehicle-mounted environment, thereby ensuring an accurate display effect of the electronic device and avoiding a display failure. In addition, the electronic device may further include other components or elements for implementing necessary functions or other functions required by the user, for example, the electronic device may further include a power module, a sound module, a communication module, and the like.

While the present disclosure has been described in detail with reference to the embodiments, the present disclosure is not limited to the specific embodiments, and those skilled in the art can make various modifications and alterations based on the concept of the present disclosure, and the modifications and alterations should fall within the scope of the present disclosure as claimed.

Claims

1. An OLED display module, comprising:

a sensor layer;

a control layer;

a panel layer positioned between the sensor layer and the control layer;

the first end of the chip on film is connected with the panel layer, the second end of the chip on film is connected with the control layer, and a first bending part is arranged between the first end and the second end of the chip on film;

the first end of the electromagnetic shielding layer is connected with the sensor layer, the second end of the electromagnetic shielding layer covers the second end of the chip on film, a second bending part is arranged between the first end and the second end of the electromagnetic shielding layer, and the second bending part wraps the first bending part.

2. The OLED display module set forth in claim 1, wherein a first overlapping area is provided between the first end of the electromagnetic shielding layer and the sensor layer, and when the flip-chip film and the electromagnetic shielding layer are not folded, a dimension of the electromagnetic shielding layer in the first direction is greater than a dimension of the flip-chip film in the first direction, and a dimension of the electromagnetic shielding layer in the second direction is greater than a dimension of the flip-chip film in the second direction; wherein the content of the first and second substances,

the first direction is a direction perpendicular to a long side of the first overlapping region, and the second direction is a direction perpendicular to the first direction.

3. The OLED display module assembly of claim 2, wherein the electromagnetic shielding layer includes at least a first side and a second side in the first direction, a distance between the first side of the electromagnetic shielding layer and the third side of the flip-chip film is between 4 and 5 mm, and a distance between the second side of the electromagnetic shielding layer and the fourth side of the flip-chip film is between 4 and 5 mm;

the third edge is an edge of the flip chip film closest to the first edge in the first direction, and the fourth edge is an edge of the flip chip film closest to the second edge in the first direction.

4. The OLED display module of claim 2, further comprising:

the flexible circuit board is used for connecting the sensor layer and the control layer, the flexible circuit board at least comprises an electromagnetic shielding film, and the electromagnetic shielding film is multiplexed to be the electromagnetic shielding layer.

5. The OLED display module of claim 4, wherein the first end of the electromagnetic shielding layer is divided into at least one binding region and at least one virtual region;

the binding region is connected with an input region of the sensor layer through a conductive adhesive, wherein the input region is located in the first overlapping region, and the virtual region is fixedly connected with other regions except the input region in the first overlapping region.

6. The OLED display module of claim 2, wherein the electromagnetic shielding layer is an electromagnetic shielding tape, and the display module further comprises a protective layer disposed on a side of the sensor layer away from the panel layer;

the first end of the electromagnetic shielding adhesive tape is positioned between the protective layer and the sensor layer, and the first end of the electromagnetic shielding adhesive tape is attached to the surface of the protective layer or the surface of the sensor layer.

7. The OLED display module of claim 6, further comprising:

a flexible circuit board for connecting the sensor layer and the control layer;

in a case where the flexible circuit board and the electromagnetic shielding layer are not bent, a maximum size of the electromagnetic shielding layer in the first direction is smaller than 1/3 that is a maximum size of the flexible circuit board in the first direction.

8. The OLED display module of any one of claims 1 to 7,

the electromagnetic shielding layer is provided with through holes, and the positions of the through holes correspond to the intervals between two adjacent chip on films.

9. The OLED display module of claim 8, wherein each through hole has the same distance to two adjacent flip-chip films of the through hole.

10. An electronic device, characterized by comprising at least the OLED display module of any one of claims 1 to 9.