CN115200838A

CN115200838A - Semiconductor measuring equipment

Info

Publication number: CN115200838A
Application number: CN202210739378.8A
Authority: CN
Inventors: 章富平; 官猛; 李仲禹
Original assignee: Shanghai Precision Measurement Semiconductor Technology Inc
Current assignee: Shanghai Precision Measurement Semiconductor Technology Inc
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-10-18

Abstract

The present invention provides a semiconductor measuring apparatus, comprising: the device comprises a rack, a beam, an optical measuring head, a beam adjusting assembly, a plurality of locking parts and a plurality of wedge blocks; the optical measuring head is arranged on the cross beam, connecting parts are arranged at two ends of the cross beam, the locking part and the cross beam adjusting component are used for installing the cross beam on the rack at the connecting parts, and the cross beam adjusting component is used for adjusting the position of the cross beam so as to adjust the position of the optical measuring head; the beam adjustment assembly includes at least three adjustment units: the adjusting device comprises a first adjusting unit arranged at a first connecting point of a first end connecting part of the beam, a second adjusting unit arranged at a second connecting point of a second end connecting part of the beam and a third adjusting unit arranged at a third connecting point of the second end connecting part of the beam, wherein the first connecting point, the second connecting point and the third connecting point are not collinear; the wedge block is fixed on the frame and arranged between the connecting part and the frame. Through the application, the accuracy requirement of the incident angle of the optical lens and the stability of the structure are met simultaneously.

Description

Semiconductor measuring equipment

Technical Field

The invention relates to the technical field of semiconductor measurement, in particular to semiconductor measurement equipment.

Background

In the field of semiconductor measuring equipment, an optical lens is a core component of semiconductor measuring equipment, in order to realize the best measuring effect on a silicon wafer (wafer), the optical lens has extremely high precision requirements on an incident angle (an included angle between an optical axis and a silicon wafer surface), if the incident angle of the installed optical lens does not reach the precision requirements, the final measuring error is greatly influenced, and the precision requirements of the incident angle cannot be directly controlled through machining precision, so that the precision of the incident angle is adjusted by using an adjusting component to meet the precision requirements of the incident angle, which is particularly important, and the stability of the structure of the optical lens is required to be ensured while the precision requirements of the incident angle of the optical lens are met.

However, when adjusting the incident angle precision of the optical lens, the semiconductor measuring apparatus in the prior art has difficulty in satisfying both the precision requirement of the incident angle of the optical lens and the structural stability.

Accordingly, there is a need to improve the measurement accuracy of the semiconductor measurement apparatus in the prior art to solve the above-mentioned problems.

Disclosure of Invention

The present invention discloses a semiconductor measuring device, which is used to solve the defects of the prior art in the measuring precision of the semiconductor measuring device, in particular to achieve the purpose of simultaneously meeting the precision requirement of the incident angle of the optical lens and the structural stability.

To achieve the above object, the present invention provides a semiconductor measuring apparatus, comprising: the device comprises a rack, a beam, an optical measuring head, a beam adjusting assembly, a plurality of locking parts and a plurality of wedge blocks;

the optical measuring head is arranged on the cross beam, connecting parts are arranged at two ends of the cross beam, the locking part and the cross beam adjusting component are used for installing the cross beam on the rack at the connecting parts, and the cross beam adjusting component is used for adjusting the position of the cross beam so as to adjust the position of the optical measuring head;

the beam adjustment assembly comprises at least three adjustment units: the adjusting device comprises a first adjusting unit arranged at a first connecting point of a first end connecting part of the cross beam, a second adjusting unit arranged at a second connecting point of a second end connecting part of the cross beam and a third adjusting unit arranged at a third connecting point of the second end connecting part of the cross beam, wherein the first connecting point, the second connecting point and the third connecting point are not collinear;

the wedge block is fixed on the frame, the wedge block is arranged between the connecting portion and the frame, the wedge block is configured to support an inclined surface of the bottom of the connecting portion, and the wedge block is correspondingly arranged between the frame and a connecting portion area of at least one connecting point of the first connecting point, the second connecting point and the third connecting point.

As a further improvement of the present invention, the beam includes a plate area at the middle end, and the optical measuring head is fixed on the same side of the plate area.

As a further improvement of the present invention, a first connection line is formed between the first connection point and the second connection point, a second connection line is formed between the second connection point and the third connection point, and the first connection line is perpendicular to the second connection line.

As a further improvement of the present invention, the first adjusting unit, the second adjusting unit, and the third adjusting unit are all jackscrews, and the first connecting point, the second connecting point, and the third connecting point of the cross beam are all provided with threaded ports matched with the jackscrews.

As a further improvement of the present invention, when the first adjusting unit is rotated, the first adjusting unit is used to adjust the deflection amount of the optical measuring head along the second line;

when the third adjusting unit is rotated, the deflection quantity of the optical measuring head along the first connecting line is adjusted;

and when the first adjusting unit, the second adjusting unit and the third adjusting unit are rotated simultaneously, the vertical position of the optical measuring head is adjusted.

As a further improvement of the present invention, the wedge block includes at least one separation region recessed in the inclined plane to divide the inclined plane into a plurality of sub-bearing surfaces, and the sub-bearing surfaces form a contact point with the bottom of the connecting portion to bear the beam.

As a further improvement of the present invention, the wedge blocks are correspondingly arranged between the connecting part area where the first connecting point is located, the connecting part area where the second connecting point is located, and the connecting part area where the third connecting point is located, and the rack.

As a further improvement of the invention, the contact point formed by the wedge correspondingly arranged with the connecting point and the area enclosed by the corresponding connecting point form a locking area, and the locking piece is arranged in the locking area.

As a further development of the invention, the wedges are configured in the same number as or in a larger number than the adjustment units.

As a further improvement of the present invention, an opening is provided at an end of the wedge, the wedge is fixed to the frame through the opening by a screw, a threaded groove matching with the screw is provided on the frame, and the position of the contact point formed on the inclined surface of the wedge is adjusted by adjusting the position of the screw in the threaded groove.

Compared with the prior art, the invention has the beneficial effects that:

three connecting points are formed by the three adjusting units and the cross beam, and three-point support is formed on the cross beam, and because the three adjusting units are not collinear, the position of the cross beam can be adjusted by controlling the three adjusting units so as to realize the adjustment of the optical measuring head in the directions of Rx, ry and Z three freedom degrees, so that the requirement of the accuracy of the incident angle of the optical measuring head is met.

Simultaneously, because the connecting portion region of at least one junction in the three tie point corresponds between being provided with the voussoir with the frame, make the voussoir can form the region that supplies the retaining member to install with the adjustment unit that corresponds when supporting the crossbeam, through installing the retaining member in the regional center department between voussoir and adjustment unit, can increase the steadiness that the retaining member is fixed to the crossbeam to can realize satisfying the effect of optical lens's incident angle required precision and the stability of structure simultaneously.

Drawings

FIG. 1 is a perspective view of a semiconductor measurement device of the present invention;

FIG. 2 is a partial top view of a semiconductor measurement apparatus;

FIG. 3 is a partial cross-sectional view of a semiconductor measurement device;

FIG. 4 is a partial top view of FIG. 2;

FIG. 5 is a top view of the wedge;

fig. 6 is a front view of the wedge.

Reference numerals:

1. a silicon wafer; 10. a frame; 20. a cross beam; 201. a panel area; 21. a connecting portion; 21a, a first end connection portion; 21b, a second end connection portion; 211. a connection point; 211a, a first connection point; 211c, a second connection point; 211b, a third connection point; 211ab, first connection line; 211cb, a second connection line; 30. an optical probe; 301. an exit optical assembly; 302. detecting the optical component; 40. a slide stage; 50. a beam adjustment assembly; 51. an adjustment unit; 51a, a first adjusting unit; 51b, a second adjusting unit; 51c, a third adjusting unit; 511. carrying out top thread; 512. a threaded opening; 523. an opening; 53. a locking region; 54. a locking member; 551. a thread groove; 55. a screw; 52. wedge blocks; 522. a separation region; 521. a bevel; 5211. a sub-bearing surface.

Detailed Description

The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that functional, methodological, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.

It should be understood that in the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered as limiting the present disclosure.

Please refer to fig. 1 to 6, which illustrate an embodiment of a semiconductor metrology apparatus. Illustratively, the semiconductor measuring apparatus may be an ellipsometry apparatus, and may perform line width, sidewall angle (SWA), critical Dimension (CD) feature such as height/depth, film thickness or global topography measurement on a two-dimensional or three-dimensional sample of a variety of process stages such as post-development inspection (ADI), post-etch inspection (AEI) on a silicon wafer (e.g., wafer).

The semiconductor measuring device disclosed in this embodiment can satisfy both the accuracy requirement of the incident angle of the optical probe 30 and the structural stability when the optical probe 30 is adjusted. The optical probe 30 includes an exit optical unit 301 that exits incident light onto the surface of the silicon wafer 1, and forms an incident angle on the surface of the silicon wafer 1 from the incident light. After the incident light is reflected by the silicon wafer 1, reflected light (and diffuse reflected light) is formed and detected by the detection optical assembly 302 to represent the surface topography data of the silicon wafer 1. The emergent optical element 301 and the detecting optical element 302 are symmetrically arranged relative to the silicon wafer 1, and the emergent optical element 301 and the detecting optical element 302 are both fixed on the beam 20. The three non-collinear adjusting units 51 adjust the optical measuring head 30 to rotate along the X axis or the Y axis in fig. 2, or to lift along the Z axis in fig. 2, so as to adjust the incident angle of the optical measuring head 30 relative to the silicon wafer 1, so that the incident angle meets the accuracy requirement, and adjust the position and size of the elliptical measuring spot formed on the surface of the silicon wafer 1 by the incident light. Meanwhile, the beam 20 is supported by the wedge 52, and the locking member 54 is installed at the center of the area between the wedge 52 and the adjusting unit 51, so that the locking member 54 can increase the stability of fixing the beam 20, thereby improving the structural stability of the optical measuring head 30. The specific implementation of a semiconductor measuring device disclosed in the present application is described in detail below.

Referring to fig. 1 and 2, in the present embodiment, the semiconductor measurement apparatus includes: the device comprises a frame 10, a beam 20, an optical measuring head 30, a beam adjusting assembly 50, a plurality of locking pieces 54 and a plurality of wedges 52; the optical measuring head 30 is mounted on the cross beam 20, the cross beam 20 is provided with connecting portions 21 at two ends, the locking member 54 and the cross beam adjusting assembly 50 are used for mounting the cross beam 20 on the rack 10 at the connecting portions 21, and the cross beam adjusting assembly 50 is used for adjusting the position of the cross beam 20 so as to adjust the position of the optical measuring head 30. The cross beam 20 is installed on the rack 10, the connecting portions 21 at the two ends of the cross beam 20 are fixed with the rack 10 through the locking piece 54 and the cross beam adjusting assembly 50, so that the cross beam 20 can be fixed on the rack 10, and the height positions of the connecting portions 21 at the two ends of the cross beam 20 are longitudinally adjusted simultaneously or independently through the cross beam adjusting assembly 50, so that the optical measuring head 30 on the cross beam 20 can be adjusted in the directions of three degrees of freedom of Rx, ry and Z, and the incident angle of the optical measuring head 30 relative to the silicon wafer 1 meets the precision requirement.

Specifically, as shown in fig. 1, 2 and 4, the beam adjustment assembly 50 includes at least three adjustment units 51: the first adjusting unit 51a is arranged at the first connecting point 211a of the first end connecting part 21a of the cross beam 20, the second adjusting unit 51b is arranged at the second connecting point 211c of the second end connecting part 21b of the cross beam 20, and the third adjusting unit 51c is arranged at the third connecting point 211b of the second end connecting part 21b of the cross beam 20, wherein the first connecting point 211a, the second connecting point 211c and the third connecting point 211b are not collinear.

By way of example, the non-collinear state means that when the first adjustment unit 51a, the second adjustment unit 51b and the third adjustment unit 51c are respectively disposed at the first end connection portion 21a and the second end connection portion 21b of the beam 20, the first adjustment unit 51a, the second adjustment unit 51b and the third adjustment unit 51c are distributed in a triangle along the top view angle, and the maximum internal angle of the triangle may be 90 °, or greater than 90 °, or even less than 90 °, as long as the beam 20 can rotate along the first connection line 211ac or the second connection line cb when adjusting any one of the adjustment units 51, and the maximum internal angle of the triangle is preferably 90 ° in this embodiment.

For example, at least three adjustment units 51 may be provided, and three or more adjustment units 51 may also be provided, as long as any three of the adjustment units 51 are respectively arranged at two ends of the cross beam 20 and are triangular in the top view angle to realize the adjustment of the optical probe 30 in the three degrees of freedom. In the present embodiment, it is preferable that three adjusting units 51 are respectively a first adjusting unit 51a, a second adjusting unit 51b and a third adjusting unit 51c, and the three adjusting units 51 are respectively disposed on the first end connecting portion 21a and the second end connecting portion 21b of the cross beam 20 and form a first connecting point 211a, a second connecting point 211c and a third connecting point 211b. Because the first connection point 211a, the second connection point 211c and the third connection point 211b are not collinear, the beam 20 can drive the optical probe 30 to rotate along the connection line between the other two adjustment units 51 when one of the adjustment units 51 is adjusted, and the beam 20 is driven to lift the optical probe 30 along the Z axis when the three adjustment units 51 are adjusted at the same time, so that the optical probe 30 is adjusted in three degrees of freedom directions, and the incident angle of the optical probe 30 relative to the silicon wafer 1 meets the accuracy requirement.

Specifically, as shown in fig. 1 to 4, the wedge 52 is fixed to the frame 10, the wedge 52 is disposed between the connecting portion 21 and the frame 10, the wedge 52 is configured with an inclined surface 521 supporting the bottom of the connecting portion 21, and the wedge 52 is disposed between the frame 10 and a connecting region of at least one of the first connecting point 211a, the second connecting point 211c, and the third connecting point 211b. After the incident angle of the optical measuring head 30 relative to the silicon wafer 1 meets the accuracy requirement, a certain inclination angle exists between the beam 20 and the frame 10 at this time (the inclination angle is an included angle formed by the frame 10 inclining along the Y-axis direction and the connecting part 21 of the beam 20 along the Z-axis direction), a plurality of wedges 52 can be installed between the connecting part 21 and the frame 10, the inclined surface 521 of the wedge 52 is attached to the bottom of the connecting part 21 of the beam 20, so that the wedge 52 can support the connecting part 21, and the stability of the beam 20 installed on the frame 10 is improved.

For example, the inclined surface 521 may be configured as a plane or a curved surface as long as it can be attached to the bottom of the connecting portion 21 of the beam 20. The present embodiment is preferably planar, so that the wedge 52 can support the beam 20, and is advantageous for improving the adjustment accuracy in the Z-axis direction, and the adjustment has a linear effect. Optionally, the bottom of the connecting portion 21 of the beam 20 may be set to be a rounded corner, so as to increase the contact area between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, increase the friction force between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, increase the contact strength between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, prevent the beam 20 from sliding and deviating on the inclined surface 521 of the wedge 52 along the inclined direction of the inclined surface 521, and avoid the influence on the adjustment accuracy and the structural stability of the optical measuring head 30 caused by the sliding and deviating of the beam 20.

As shown in fig. 1 and 2, the beam 20 includes a plate region 201 at the middle end, and the optical probe 30 is fixed to the same side of the plate region 201. Further, as shown in fig. 2, a first connection line 211ac is formed between the first connection point 211a and the second connection point 211c, a second connection line 211cb is formed between the second connection point 211c and the third connection point 211b, and the first connection line 211ac is perpendicular to the second connection line 211 cb. When the first adjusting unit 51a at the first connection point 211a is adjusted, the beam 20 rotates along the second connection line 211cb, that is, rotates along the Y axis, so as to adjust the optical probe 30 in the Ry direction, when the third adjusting unit 51c at the third connection point 211b is adjusted, the beam 20 rotates along the first connection line 211ac, that is, rotates along the X axis, so as to adjust the optical probe 30 in the Rx direction, and when the first adjusting unit 51a, the second adjusting unit 51b and the third adjusting unit 51c are adjusted simultaneously, the beam 20 drives the optical probe 30 to move longitudinally, that is, to move in the Z direction, so as to adjust the optical probe 30 in the directions of Rx, ry and Z degrees of freedom, so that the incident angle of the optical probe 30 with respect to the silicon wafer 1 meets the precision requirement.

As shown in fig. 3, the first adjusting unit 51a, the second adjusting unit 51b, and the third adjusting unit 51c are all screws 511, and the first connection point 211a, the second connection point 211c, and the third connection point 211b of the cross beam 20 are all provided with screw openings 512 matching with the screws 511. For example, the adjusting unit 51 may be configured as a jack screw or a bolt, as long as it can move the end of the carrying beam 20 longitudinally. The top thread 511 is preferably provided in the present embodiment, and the first connection point 211a, the second connection point 211c, and the third connection point 211b of the cross beam 20 are all provided with a threaded port 512 matched with the top thread 511, so that the top thread 511 can pass through the threaded port 512, and the top thread 511 can be rotated along the Z axis to drive the end of the cross beam 20 to move longitudinally, thereby adjusting the incident angle precision of the optical measurement head 30 to make the incident angle precision meet the requirement.

As shown in fig. 2, the first adjusting unit 51a is rotated to adjust the deflection amount Ry of the optical probe 30 along the second connection line 211cb (Y axis); a third adjusting unit 51c for adjusting the deflection Rx of the optical probe 30 along the first line 211ac (X axis) when rotating; the first, second and

third adjusting units

51a, 51b and 51c are rotated simultaneously to adjust the vertical movement Z of the optical probe 30.

Specifically, the adjustment accuracy formula of Rx, ry, Z is as follows:

H＝(T/360°)×β；

R _Y ＝α _Y ＝arcran(H/L1)＝arcran((T/360°)×β/L1)；

R _x ＝α _x ＝arcran(H/L2)＝arcran((T/360°)×β/L2)；

Z＝H＝(T/360°)×β。

wherein, the parameter L1 represents the distance between the first connection point 211a and the third connection point 211b, the parameter L2 represents the distance between the first connection point 211b and the second connection point 211c, the parameter H represents the adjustment amount of the jackscrew 511, and the parameter α represents _x 、α _Y The parameters T, β and X represent the adjustment angles of the optical probe 30 along the X and Y axes, respectively, the pitch of the jack 511, and the rotation angle of the jack 511, respectively.

Specifically, the dimensions of the parameter L1 and the parameter L2 are designed according to the spatial dimension of the optical probe 30 and the required adjustment accuracy, and the adjustment accuracy is higher when the parameter T is smaller as the dimensions of the parameter L1 and the parameter L2 are larger. The parameter β is the angle of rotation of the top thread 511, which is generally easier to achieve with a rotation of 5 °. Illustratively, the adjustment accuracy calculation for a particular operating condition is given as follows: when the parameter L1=900mm, the parameter L2=200mm, the parameter T =0.5mm (minimum pitch for conventional machining), and the parameter β =5 °, then R is greater than R _X 、R _Y The adjustment resolution of Z is as follows:

R _Y ＝α _Y ＝arcran((T/360°)×β/L1)＝arcran((0.5/360°)×5°/900)＝0.000442°；

R _x ＝α _x ＝arcran((T/360°)×β/L2)＝arcran((0.5/360°)×5°/200)＝0.0019°；

Z＝(T/360°)×β＝(0.5/360°)×5°＝0.0069mm。

as shown in fig. 4 to 6, the wedge 52 includes at least one dividing region 522, the dividing region 522 is recessed in the inclined surface 521 to divide the inclined surface 521 into a plurality of sub-supporting surfaces 5211, and the sub-supporting surfaces 5211 form a contact point with the bottom of the connecting portion 21 to support the cross beam 20. Illustratively, a dividing region 522 can divide the inclined surface 521 into two sub-bearing surfaces 5211, thereby creating a distance between the two sub-bearing surfaces 5211 and further creating a distance between the contact points (not shown) formed by the sub-bearing surfaces 5211 and the end of the cross beam 20, wherein the greater the distance between the two sub-bearing surfaces 5211, the greater the stability of the locking member 54 to lock the end of the cross beam 20 when the cross beam 20 is supported by the sub-bearing surfaces 5211; when the dividing area 522 is configured to be more than one, it is able to divide the inclined plane 521 into several sub supporting planes 5211, so as to increase the contact point (not shown) formed by the inclined plane 521 and the end of the cross beam 20, and improve the stability of the locking member 54 to the end of the cross beam 20.

As shown in fig. 2, wedges 52 are provided between the frame 10 and the connection areas of the first connection point 211a, the second connection point 211c, and the third connection point 211b, respectively. Because the wedges 52 are correspondingly arranged between the connecting part areas where the three connecting points 211 are located and the rack 10, the wedges 52 can be correspondingly arranged with the adjusting units 51 located at the connecting points 211, and the locking pieces 54 located at the centers of the areas between the wedges 52 and the adjusting units 51 can enable the connecting parts 21 of the cross beams 20 to be uniformly stressed when the connecting parts 21 of the cross beams 20 are locked, so that the stability of the locking pieces 54 for locking the connecting parts 21 of the cross beams 20 is improved, and the structural stability of the optical measuring head 30 is further improved.

As shown in fig. 3 and 4, the contact point formed by the wedge 52 corresponding to the connection point 211 and the area enclosed by the corresponding connection point 211 form a locking area 53, and a locking member 54 is disposed in the locking area 53. Illustratively, since the contact points (not shown) formed by the wedge 52 and the bottom of the connecting portion 21 of the cross beam 20 are all aligned, the area enclosed by the contact points (not shown) and the connecting point 211 is triangular along the top view angle, and the plurality of dividing regions 522 divide the inclined plane 521 into a plurality of sub-bearing surfaces 5211, so that the sub-bearing surfaces 5211 and the bottom of the connecting portion 21 of the cross beam 20 form a plurality of contact points (not shown), wherein the two farthest contact points (not shown) will determine the locking region 53 to be a general triangle or an isosceles triangle or an equilateral triangle. The present embodiment is preferably an equilateral triangle. Meanwhile, the locking member 54 may be disposed at any position of the locking region 53, and in this embodiment, it is preferable that the locking member 54 is disposed at the center (not shown) of the locking region 53 in the shape of an equilateral triangle, so that when the locking member 54 locks the connecting portion 21 of the cross beam 20, the locking region 53 in the shape of an equilateral triangle, which is located at the connecting portion 21 of the cross beam 20, can be uniformly stressed, thereby increasing the stability of the locking member 54 in locking the connecting portion 21 of the cross beam 20, and further improving the structural stability of the optical measurement head 30.

As shown in fig. 1 and 2, the wedges 52 are configured to be the same as or greater than the number of the adjustment units 51. The locker 54 is configured to be the same as or greater than the number of the adjusting units 51. Exemplarily, when the wedge 52 and the locker 54 are configured to be the same as the number of the adjusting units 51, disposing the locker 54 between the wedge 52 and the adjusting units 51 can increase the stability of the locker 54 in locking the connecting portion 21 of the cross beam 20; when the wedges 52 and the locking pieces 54 are configured to be larger than the number of the adjusting units 51, the stability of supporting the beam 20 can be increased by the plurality of wedges 52 to improve the structural rigidity of the beam 20, and the stability of locking the connecting portion 21 of the beam 20 can be further increased by the plurality of locking pieces 54 to improve the structural stability of the optical measuring head 30.

As shown in fig. 3 to 6, an opening 523 is provided at an end of the wedge 52, the wedge 52 is fixed on the frame 10 through the opening 523 by a screw 55, a matching threaded groove 551 (not shown) of the screw 55 is opened on the frame 10, and the wedge 52 is guided by the screw 55 to move along the opening 523 through the opening 523 to adjust a contact point position formed on the inclined surface 521 of the wedge 52. For example, at least one opening 523 may be disposed at an end of the wedge 52, and when two or more openings 523 are disposed, the distribution directions of the two or more openings 523 in the wedge 52 are disposed in parallel, so that the wedge 52 moves along the distribution directions of the openings 523. When the wedge 52 supports the beam 20, the screw 55 is inserted into the screw groove 551 (not shown) through the opening 523, the wedge 52 is fixed to the frame 10 by tightening the screw 55, and when the position of the wedge 52 needs to be adjusted, the wedge 52 is controlled to slide on the frame 10, so that the wedge 52 moves along the distribution direction of the opening 523 under the guidance of the screw 55, and the position of the contact point formed on the inclined surface 521 of the wedge 52 is adjusted.

Illustratively, the semiconductor measuring device further comprises a stage 40, wherein the stage 40 is fixed on the frame 10 and is positioned below the bottom of the optical probe 30. The wafer carrying table 40 is used for placing the silicon wafer 1, and the wafer carrying table 40 can move along three directions of X, Y and Z in fig. 1, wherein the X and Y directions are used for the wafer carrying table 40 to drive the silicon wafer 1 to move horizontally, so that the optical measuring head 30 can measure different potentials of the silicon wafer 1, and the Z direction is used for the wafer carrying table 40 to drive the silicon wafer 1 to move to the optimal focal plane of the optical measuring head 30, so as to realize the optimal measuring effect of the optical measuring head 30 on the silicon wafer 1.

The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A semiconductor metrology apparatus, comprising:

the device comprises a rack, a cross beam, an optical measuring head, a cross beam adjusting assembly, a plurality of locking pieces and a plurality of wedge blocks;

the beam adjustment assembly comprises at least three adjustment units: the adjusting device comprises a first adjusting unit arranged at a first connecting point of a first end connecting part of the beam, a second adjusting unit arranged at a second connecting point of a second end connecting part of the beam and a third adjusting unit arranged at a third connecting point of a second end connecting part of the beam, wherein the first connecting point, the second connecting point and the third connecting point are not collinear;

the wedge block is fixed on the frame, the wedge block is arranged between the connecting portion and the frame, an inclined surface for supporting the bottom of the connecting portion is formed in the wedge block, and the wedge block is correspondingly arranged between the frame and a connecting portion area of at least one of the first connecting point, the second connecting point and the third connecting point.

2. The semiconductor metrology apparatus of claim 1, wherein the beam comprises a middle plate region, and the optical probe is fixed to the same side of the plate region.

3. The semiconductor metrology apparatus of claim 1, wherein a first line is formed between the first connection point and the second connection point, and a second line is formed between the second connection point and the third connection point, the first line being perpendicular to the second line.

4. The semiconductor measuring apparatus according to claim 3, wherein the first adjusting unit, the second adjusting unit and the third adjusting unit are all jackscrews, and the first connecting point, the second connecting point and the third connecting point of the beam are all provided with threaded ports matched with the jackscrews.

5. Semiconductor measuring device as claimed in claim 4,

when the first adjusting unit is rotated, the first adjusting unit is used for adjusting the deflection amount of the optical measuring head along the second connecting line;

6. The semiconductor measuring apparatus according to any of claims 1-5, wherein the wedge comprises at least one dividing region recessed into the inclined surface for dividing the inclined surface into sub-supporting surfaces, the sub-supporting surfaces forming contact points with the bottom of the connecting portion for supporting the beam.

7. The semiconductor metrology apparatus of claim 6, wherein the wedge is disposed between the frame and a connection region where the first connection point is located, a connection region where the second connection point is located, and a connection region where the third connection point is located.

8. The semiconductor measuring apparatus according to claim 7, wherein the contact points formed by the wedges corresponding to the connection points and the areas enclosed by the corresponding connection points form locking areas, and the locking elements are disposed in the locking areas.

9. The semiconductor metrology apparatus of claim 6, wherein the wedges are configured to be the same as or greater than the number of the tuning units.

10. The semiconductor measurement apparatus of claim 6, wherein the wedge has an opening at an end thereof, the wedge is fixed to the frame through the opening by a screw, the frame has a threaded groove matching with the screw, and the wedge is guided by the screw to move along the opening through the opening to adjust the position of the contact point formed on the inclined surface of the wedge.