CN115200838A - Semiconductor measuring equipment - Google Patents

Abstract

The present invention provides a semiconductor measuring apparatus, comprising: the device comprises a rack, a beam, an optical measuring head, a beam adjusting assembly, a plurality of locking parts and a plurality of wedge blocks; the optical measuring head is arranged on the cross beam, connecting parts are arranged at two ends of the cross beam, the locking part and the cross beam adjusting component are used for installing the cross beam on the rack at the connecting parts, and the cross beam adjusting component is used for adjusting the position of the cross beam so as to adjust the position of the optical measuring head; the beam adjustment assembly includes at least three adjustment units: the adjusting device comprises a first adjusting unit arranged at a first connecting point of a first end connecting part of the beam, a second adjusting unit arranged at a second connecting point of a second end connecting part of the beam and a third adjusting unit arranged at a third connecting point of the second end connecting part of the beam, wherein the first connecting point, the second connecting point and the third connecting point are not collinear; the wedge block is fixed on the frame and arranged between the connecting part and the frame. Through the application, the accuracy requirement of the incident angle of the optical lens and the stability of the structure are met simultaneously.

Description

A semiconductor measuring device

technical field

The present invention relates to the technical field of semiconductor measurement, and in particular, to a semiconductor measurement device.

Background technique

In the field of semiconductor measurement equipment, the optical lens is the core component of the semiconductor measurement equipment. In order to achieve the best measurement effect on the silicon wafer, the optical lens has a certain effect on the incident angle (the angle between the optical axis and the surface of the silicon wafer). Extremely high accuracy requirements, such as the incident angle of the installed optical lens that does not meet the accuracy requirements will have a great impact on the final measurement error, and the accuracy requirements of the incident angle cannot be directly controlled by the machining accuracy, so by using the adjustment It is particularly important for the component to adjust the accuracy of the incident angle to meet the accuracy requirements of the incident angle. While meeting the accuracy requirements of the incident angle of the optical lens, it is also necessary to ensure the stability of the optical lens structure.

However, when adjusting the incident angle precision of the optical lens, the semiconductor measurement equipment in the prior art is difficult to satisfy both the precision requirements of the incident angle of the optical lens and the stability of the structure.

In view of this, it is necessary to improve the measurement accuracy of the semiconductor measurement equipment in the prior art to solve the above problems.

SUMMARY OF THE INVENTION

The purpose of the present invention is to disclose a semiconductor measurement device, which is used to solve many defects in the measurement accuracy of the semiconductor measurement device in the prior art, especially in order to meet the accuracy requirements and structure of the incident angle of the optical lens at the same time. stability.

In order to achieve the above object, the present invention provides a semiconductor measurement equipment, including: a frame, a beam, an optical probe, a beam adjustment assembly, a plurality of locking members, and a plurality of wedges;

The optical probe is mounted on the beam, and both ends of the beam are provided with connecting parts, and the locking member and the beam adjusting assembly are used to install the beam on the frame at the connecting parts above, the beam adjustment component is used to adjust the position of the beam to adjust the position of the optical probe;

The beam adjustment assembly includes at least three adjustment units: a first adjustment unit arranged at the first connection point of the first end connecting portion of the beam, and a second adjustment unit arranged at the second connection point of the second end connection portion of the beam a unit and a third adjustment unit arranged at the third connection point of the second end connection part of the beam, the first connection point, the second connection point and the third connection point are not collinear;

The wedge block is fixed on the frame, and the wedge block is arranged between the connection portion and the frame, the wedge block is configured to support the inclined surface of the bottom of the connection portion, and The wedge block is correspondingly disposed between the connection part region at at least one of the first connection point, the second connection point and the third connection point and the frame.

As a further improvement of the present invention, the beam includes a plate area at the middle end, and the optical probe is fixed on the same side of the plate area.

As a further improvement of the present invention, a first connection line is formed between the first connection point and the second connection point, and a second connection line is formed between the second connection point and the third connection point, so The first connection line is perpendicular to the second connection line.

As a further improvement of the present invention, the first adjustment unit, the second adjustment unit, and the third adjustment unit are all jack wires, and the first connection point, the second connection point of the beam and the Each of the third connection points is provided with a threaded port matched with the top screw.

As a further improvement of the present invention, when the first adjustment unit is rotated, it is used to adjust the deflection of the optical probe along the second connection line;

When the third adjusting unit is rotated, it is used to adjust the deflection of the optical probe along the first connecting line;

When rotating the first adjusting unit, the second adjusting unit and the third adjusting unit at the same time, it is used to adjust the vertical position of the optical probe.

As a further improvement of the present invention, the wedge block includes at least one separation area, and the separation area is recessed in the inclined surface to divide the inclined surface into a plurality of sub-supporting surfaces, the sub-supporting surface and the A contact point is formed at the bottom of the connecting portion to support the beam.

As a further improvement of the present invention, the connection part area where the first connection point is located, the connection part area where the second connection point is located, and the connection part area where the third connection point is located are related to the rack The wedges are correspondingly arranged therebetween.

As a further improvement of the present invention, the contact points formed by the wedges disposed corresponding to the connection points and the area enclosed by the corresponding connection points form a locking area, and the locking area is provided with the locking piece.

As a further improvement of the present invention, the number of the wedges is configured to be the same as or larger than the number of the adjustment units.

As a further improvement of the present invention, an opening is provided at the end of the wedge block, and the wedge block is fixed on the frame by a screw through the opening, and the frame is provided with a thread matching the screw The position of the contact point formed on the inclined surface of the wedge is adjusted by adjusting the position of the screw on the threaded groove.

Compared with the prior art, the beneficial effects of the present invention are:

Three adjustment units are used to form three connection points with the beam and form three-point support for the beam. Since the three adjustment units are not collinear, the position of the beam can be adjusted by controlling the three adjustment units to realize the optical probe in Rx, Ry, Z is adjusted in three degrees of freedom directions to meet the accuracy requirements of the incident angle of the optical probe.

At the same time, since a wedge block is correspondingly arranged between the connection part area at at least one of the three connection points and the frame, the wedge block can support the beam and at the same time form a corresponding adjustment unit for the locking member to be installed. By installing the locking member at the center of the area between the wedge and the adjustment unit, the stability of the locking member to the beam can be increased, so that the accuracy requirements of the incident angle of the optical lens and the stability of the structure can be met at the same time. sexual effect.

Description of drawings

1 is a perspective view of a semiconductor measuring device of the present invention;

FIG. 2 is a partial top view of the semiconductor measurement equipment;

3 is a partial cross-sectional view of a semiconductor measuring device;

Fig. 4 is the partial top view in Fig. 2;

Figure 5 is a top view of the wedge;

Figure 6 is a front view of the wedge.

Reference number:

1, silicon wafer; 10, rack; 20, beam; 201, plate area; 21, connection part; 21a, first end connection part; 21b, second end connection part; 211, connection point; 211a, first connection point; 211c, second connection point; 211b, third connection point; 211ab, first connection; 211cb, second connection; 30, optical probe; 301, exit optical assembly; 302, detection optical assembly; 40, Slide stage; 50, beam adjustment assembly; 51, adjustment unit; 51a, first adjustment unit; 51b, second adjustment unit; 51c, third adjustment unit; 511, top wire; 512, screw opening; 523, opening; 53, locking area; 54, locking piece; 551, thread groove; 55, screw; 52, wedge; 522, separation area; 521, inclined surface;

Detailed ways

The present invention will be described in detail below with reference to the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments do not limit the present invention. Equivalent transformations or substitutions all fall within the protection scope of the present invention.

It should be understood that in this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear" , "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", etc. indicate the orientation or position relationship as Based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing the technical solution and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot It is understood as a limitation to the technical solution.

Please refer to a specific implementation manner of a semiconductor measurement apparatus disclosed in FIGS. 1 to 6 . Illustratively, the semiconductor metrology equipment can be an ellipsometric equipment, and can perform post-development inspection (ADI), post-etch inspection (AEI), and other two-dimensional measurements of various process segments on silicon wafers (eg, wafers). Or critical dimension (CD) features such as linewidth, sidewall angle (SWA), height/depth, film thickness or overall topography measurements of 3D samples.

The semiconductor measurement device disclosed in this embodiment can simultaneously satisfy the accuracy requirements of the incident angle of the optical probe 30 and the stability of the structure when adjusting the optical probe 30 . The optical probe 30 includes an exit optical component 301 for exiting the incident light to the surface of the silicon wafer 1 , and the incident light forms an incident angle on the surface of the silicon wafer 1 . After the incident light is reflected by the silicon wafer 1 , the reflected light (and the diffusely reflected light) is formed, and the reflected light (and the diffusely reflected light) is detected by the detection optical component 302 to characterize the surface topography data of the silicon wafer 1 . The outgoing optical component 301 and the detecting optical component 302 are symmetrically disposed with respect to the silicon wafer 1 , and both the outgoing optical component 301 and the detecting optical component 302 are fixed on the beam 20 . Adjust the optical probe 30 to rotate along the X-axis or the Y-axis in FIG. 2 , or to move up and down along the Z-axis in FIG. 2 through the three non-collinear adjustment units 51 , so as to adjust the incident angle of the optical probe 30 relative to the silicon wafer 1 , so that the incident angle meets the accuracy requirements, and the position and size of the elliptical measuring spot formed by the incident light on the surface of the silicon wafer 1 are adjusted. At the same time, the cross beam 20 is supported by the wedge block 52, and then the locking member 54 is installed at the center of the area between the wedge block 52 and the adjustment unit 51, so that the locking member 54 can increase the stability of fixing the cross beam 20, In order to improve the stability of the optical probe 30 structure. The specific implementation of the semiconductor measurement device disclosed in the present application will be described in detail below.

1 and 2, in this embodiment, the semiconductor measurement equipment includes: a frame 10, a beam 20, an optical probe 30, a beam adjustment assembly 50, a plurality of locking members 54, and a plurality of wedges 52; The optical probe 30 is installed on the beam 20, the two ends of the beam 20 are provided with connecting parts 21, the locking member 54 and the beam adjusting assembly 50 are used to install the beam 20 on the frame 10 at the connecting part 21, and the beam adjusting assembly 50 is used for The position of the beam 20 is adjusted to adjust the position of the optical probe 30 . Install the beam 20 on the frame 10, and then fix the connecting parts 21 at both ends of the beam 20 to the frame 10 through the locking member 54 and the beam adjustment assembly 50, so that the beam 20 can be fixed on the frame 10, and then The height positions of the connecting parts 21 at both ends of the beam 20 are longitudinally adjusted by the beam adjustment assembly 50 at the same time or separately, so that the optical probe 30 on the beam 20 can be adjusted in the three degrees of freedom directions of Rx, Ry, and Z, so that the optical The incident angle of the probe 30 with respect to the silicon wafer 1 meets the accuracy requirement.

Specifically, as shown in FIGS. 1 , 2 and 4 , the beam adjustment assembly 50 includes at least three adjustment units 51 : a first adjustment unit 51 a disposed at the first connection point 211 a of the first end connecting portion 21 a of the beam 20 , a first adjustment unit 51 a , a The second adjustment unit 51b at the second connection point 211c of the second end connecting portion 21b of the beam 20 and the third adjustment unit 51c disposed at the third connection point 211b of the second end connecting portion 21b of the beam 20, the first connection point 211a, the third adjustment unit 51c The second connection point 211c and the third connection point 211b are not collinear.

Exemplarily, non-collinearity means that when the first adjustment unit 51a, the second adjustment unit 51b and the third adjustment unit 51c are respectively disposed on the first end connecting portion 21a and the second end connecting portion 21b of the beam 20, the first adjustment The unit 51a, the second adjustment unit 51b and the third adjustment unit 51c are distributed in a triangle along the top view angle, and the maximum inner angle of the triangle can be 90°, or greater than 90°, or even less than 90°, as long as it can be achieved in the When adjusting any one of the adjusting units 51 , the beam 20 can be rotated along the first connecting line 211ac or the second connecting line cb. In this embodiment, the maximum interior angle of the triangle is preferably 90°.

Exemplarily, at least three adjustment units 51 may be provided, or more than three adjustment units 51 may be provided, as long as any three of the adjustment units 51 are respectively arranged at both ends of the beam 20 and form a triangle along the top view angle, so that the optical probe 30 can be positioned in a triangular shape. It can be adjusted in three degrees of freedom directions. In this embodiment, there are preferably three adjustment units 51 , which are a first adjustment unit 51 a , a second adjustment unit 51 b and a third adjustment unit 51 c respectively. The two-terminal connection portion 21b forms a first connection point 211a, a second connection point 211c and a third connection point 211b correspondingly. Since the first connection point 211 a , the second connection point 211 c and the third connection point 211 b are not collinear, when adjusting one of the adjustment units 51 , the beam 20 can drive the optical probe 30 along the distance between the other two adjustment units 51 . The connection is rotated, and when the three adjustment units 51 are adjusted at the same time, the beam 20 will be driven to move the optical probe 30 up and down along the Z-axis, so that the optical probe 30 can be adjusted in three degrees of freedom directions, so that the optical probe 30 The incident angle with respect to the silicon wafer 1 meets the accuracy requirements.

Specifically, as shown in FIGS. 1 to 4 , the wedge block 52 is fixed on the frame 10 , and the wedge block 52 is arranged between the connecting portion 21 and the frame 10 , and the wedge block 52 is configured to support the connecting portion 21 . A wedge 52 is correspondingly provided between the inclined surface 521 of the bottom, and the connecting portion area at at least one of the first connecting point 211 a , the second connecting point 211 c and the third connecting point 211 b and the rack 10 . After the incident angle of the optical probe 30 relative to the silicon wafer 1 meets the accuracy requirements, there is a certain inclination angle between the beam 20 and the frame 10 at this time (the inclination angle is that the frame 10 is connected to the beam 20 along the Y-axis direction) The angle formed by the inclination of the part 21 along the Z-axis direction), a number of wedges 52 can be installed between the connecting part 21 and the frame 10, and the inclined surfaces 521 of the wedges 52 are in close contact with the bottom of the connecting part 21 of the beam 20, so that The wedge block 52 can support the connecting portion 21 to improve the stability of the installation of the beam 20 on the frame 10 .

Exemplarily, the inclined surface 521 may be configured as a flat surface or a curved surface, as long as it can achieve close contact with the bottom of the connecting portion 21 of the beam 20 . This embodiment is preferably flat, so that the wedge block 52 can play a supporting role on the beam 20, which is beneficial to the improvement of the adjustment accuracy along the Z-axis direction, and the adjustment has a linear effect. Optionally, the bottom of the connecting portion 21 of the beam 20 can be set to be rounded to increase the contact area between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, and increase the frictional force between the bottom of the connecting portion 21 of the beam 20 and the inclined surface 521, In order to increase the contact strength between the bottom of the connecting portion 21 of the cross beam 20 and the inclined surface 521, the cross beam 20 can be prevented from sliding and offset on the inclined surface 521 of the wedge 52 along the inclined direction of the inclined surface 521, thereby avoiding the sliding offset of the cross beam 20. This affects the adjustment accuracy of the optical probe 30 and the stability of the structure.

As shown in FIG. 1 and FIG. 2 , the beam 20 includes a plate area 201 at the middle end, and the optical probe 30 is fixed on the same side of the plate area 201 . Further, as shown in FIG. 2 , a first connection line 211ac is formed between the first connection point 211a and the second connection point 211c, and a second connection line 211cb is formed between the second connection point 211c and the third connection point 211b. A connecting line 211ac is perpendicular to the second connecting line 211cb. When adjusting the first adjustment unit 51a located at the first connection point 211a, the beam 20 will rotate along the second connection line 211cb, that is, rotate along the Y axis, so as to realize the adjustment of the optical probe 30 in the Ry direction. When the third adjustment unit 51c of the third connection point 211b is used, the beam 20 will rotate along the first connection line 211ac, that is, rotate along the X axis, so as to realize the adjustment of the optical probe 30 in the Rx direction. When the first adjustment unit 51a, When the second adjustment unit 51b and the third adjustment unit 51c are adjusted at the same time, the beam 20 will drive the optical probe 30 to move longitudinally, that is, move along the Z direction, so that the optical probe 30 can be adjusted in the Z direction. Based on the aforementioned technology The solution is to realize the adjustment of the optical probe 30 in the three-degree-of-freedom directions of Rx, Ry, and Z, so that the incident angle of the optical probe 30 relative to the silicon wafer 1 meets the accuracy requirements.

As shown in FIG. 3 , the first adjustment unit 51 a , the second adjustment unit 51 b , and the third adjustment unit 51 c are all jack wires 511 , and the first connection point 211 a , the second connection point 211 c and the third connection point 211 b of the beam 20 are Both are provided with screw openings 512 matching with the jacking wire 511 . Exemplarily, the adjusting unit 51 may be configured as a jack screw or a bolt, as long as the end of the beam 20 can be driven to move longitudinally. This embodiment is preferably the top wire 511, because the first connection point 211a, the second connection point 211c and the third connection point 211b of the beam 20 are all provided with threaded ports 512 matching the top wire 511, so that the top wire 511 can pass through The screw opening 512 can drive the end of the beam 20 to move longitudinally by rotating the top wire 511 along the Z axis, so as to adjust the incident angle accuracy of the optical probe 30 so that the incident angle accuracy meets the requirements.

As shown in FIG. 2, when the first adjusting unit 51a is rotated, it is used to adjust the deflection amount Ry of the optical probe 30 along the second connecting line 211cb (Y-axis); when the third adjusting unit 51c is rotated, it is used to adjust the optical probe 30 The deflection amount Rx along the first connecting line 211ac (X axis); when rotating the first adjusting unit 51a, the second adjusting unit 51b, and the third adjusting unit 51c at the same time, it is used to adjust the vertical movement amount Z of the optical probe 30.

Specifically, the formulas for the adjustment accuracy of Rx, Ry, and Z are as follows:

H=(T/360°)×β;

R _Y =α _Y =arcran(H/L1)=arcran((T/360°)×β/L1);

R _x =α _x =arcran(H/L2)=arcran((T/360°)×β/L2);

Z=H=(T/360°)×β.

Wherein, the parameter L1 represents the distance between the first connection point 211a and the third connection point 211b, the parameter L2 represents the distance between the first connection point 211b and the second connection point 211c, the parameter H represents the adjustment amount of the top wire 511, the parameters _αx , α _Y represents the adjustment angle of the optical probe 30 along the X and Y axes respectively, the parameter T represents the pitch of the top wire 511 , and the parameter β represents the rotation angle of the top wire 511 .

Specifically, the size of the parameter L1 and the parameter L2 are designed according to the space size of the optical probe 30 and the required adjustment accuracy. When the size of the parameter L1 and the parameter L2 is larger and the parameter T is smaller, the adjustment accuracy is higher. . The parameter β is the rotation angle of the top wire 511, which is generally easier to achieve by rotating 5°. Exemplarily, the calculation of the adjustment accuracy under a specific working condition is given as follows: when the parameter L1=900mm, the parameter L2=200mm, the parameter T=0.5mm (the minimum pitch of conventional machining), and the parameter β=5°, then R The adjustment resolutions of _X , R _Y , and Z are as follows:

R _Y =α _Y =arcran((T/360°)×β/L1)=arcran((0.5/360°)×5°/900)=0.000442°;

R _x =α _x = arcran((T/360°)×β/L2)=arcran((0.5/360°)×5°/200)=0.0019°;

Z=(T/360°)×β=(0.5/360°)×5°=0.0069mm.

As shown in FIG. 4 to FIG. 6 , the wedge block 52 includes at least one separation area 522 , and the separation area 522 is recessed in the inclined surface 521 for dividing the inclined surface 521 into a plurality of sub-supporting surfaces 5211 , the sub-supporting surface 5211 and the connecting portion 21 . The bottom forms contact points to support the beam 20 . Exemplarily, a separation area 522 can divide the inclined surface 521 into two sub-supporting surfaces 5211, so as to create a distance between the two sub-supporting surfaces 5211, and then make the contact point formed by the sub-supporting surface 5211 and the end of the beam 20. There is also a distance between the two sub-supporting surfaces 5211 (not shown), and if the distance between the two sub-supporting surfaces 5211 is larger, the locking member 54 will firmly lock the end of the cross-beam 20 when the sub-supporting surface 5211 supports the cross-beam 20 . When the separation area 522 is configured as more than one, the inclined surface 521 can be divided into several sub-supporting surfaces 5211, so as to increase the contact point (not shown) formed by the inclined surface 521 and the end of the beam 20, and improve the locking effect. The stability of the locking piece 54 to the end of the beam 20 .

As shown in FIG. 2 , the connection part area where the first connection point 211a is located, the connection part area where the second connection point 211c is located, and the connection part area where the third connection point 211b is located are correspondingly provided between the rack 10 There are wedges 52. Because the wedge blocks 52 are correspondingly disposed between the connection portion regions where the three connection points 211 are located and the frame 10 , the wedge blocks 52 can be correspondingly arranged with the adjustment unit 51 located at the connection points 211 , so that the wedge blocks 52 The locking member 54 at the center of the area between the adjustment unit 51 can make the connecting portion 21 of the beam 20 evenly stressed when locking the connecting portion 21 of the beam 20 , thereby increasing the locking of the locking member 54 to the connecting portion 21 of the beam 20 . tight stability, thereby improving the structural stability of the optical probe 30 .

As shown in FIG. 3 and FIG. 4 , the contact points formed by the wedge blocks 52 corresponding to the connection points 211 and the area enclosed by the corresponding connection points 211 form a locking area 53 , and a locking member is arranged in the locking area 53 54. Exemplarily, since the contact points (not shown) formed by the wedge block 52 and the bottom of the connection part 21 of the beam 20 are all on a straight line, the contact point (not shown) and the connection point 211 enclosed by the contact point (not shown) are formed. The area is in the shape of a triangle along the top view angle. At the same time, a plurality of separation areas 522 divide the inclined surface 521 into a plurality of sub-supporting surfaces 5211, so that the sub-supporting surfaces 5211 and the bottom of the connecting portion 21 of the beam 20 form a number of contact points (not shown), The two most distant two contact points (not shown) will determine whether the locking area 53 is a normal triangle or an isosceles triangle or an equilateral triangle. This embodiment is preferably an equilateral triangle. At the same time, the locking member 54 can be arranged at any position of the locking area 53. In this embodiment, the locking member 54 is preferably arranged at the center of the locking area 53 in the shape of an equilateral triangle (not shown), So that when the locking member 54 locks the connecting portion 21 of the beam 20, the equilateral triangle-shaped locking region 53 located in the connecting portion 21 of the beam 20 can be uniformly stressed, thereby increasing the connection of the locking member 54 to the beam 20. The stability of the locking of the part 21 is improved, thereby improving the structural stability of the optical probe 30 .

As shown in FIGS. 1 and 2 , the wedges 52 are configured to be the same as or larger than the number of the adjustment units 51 . The locking pieces 54 are configured to be the same as or larger than the number of the adjustment units 51 . Exemplarily, when the wedge block 52 and the locking member 54 are both configured to have the same number as the adjustment unit 51, the locking member 54 is arranged between the wedge block 52 and the adjustment unit 51, and the number of the locking member 54 can be increased. The stability of the locking of the connecting portion 21 of the beam 20; when the wedge blocks 52 and the locking members 54 are both configured to be larger than the number of the adjustment units 51, the stability of the support to the beam 20 can be increased by a number of wedge blocks 52, so as to improve the beam The rigidity of the structure of the optical probe 30 can be further increased through the plurality of locking members 54 to further increase the locking stability of the connecting portion 21 of the beam 20 , so as to improve the structural stability of the optical probe 30 .

As shown in FIG. 3 to FIG. 6 , an opening 523 is provided at the end of the wedge block 52 , and the wedge block 52 is fixed on the frame 10 by the screw 55 through the opening 523 , and the frame 10 is provided with a matching thread groove 551 for the screw 55 (not shown), the wedge 52 is guided by the screw 55 to move along the opening 523 through the opening 523 to adjust the position of the contact point formed on the inclined surface 521 of the wedge 52 . Exemplarily, at least one opening 523 may be provided at the end of the wedge block 52. When two or more openings 523 are provided, the distribution directions of the two or more openings 523 in the wedge block 52 are parallel to provide the wedge block 52. The blocks 52 move along the distribution direction of the openings 523 . When the wedge block 52 supports the beam 20, the wedge block 52 can be fixed on the frame 10 by tightening the screw 55 by passing the screw 55 through the opening 523 and inserting it into the threaded groove 551 (not shown). When adjusting the position of the wedge block 52, by controlling the wedge block 52 to slide on the frame 10, the wedge block 52 will move along the distribution direction of the opening 523 under the guidance of the screw 55, so as to realize the adjustment on the inclined surface 521 of the wedge block 52. Formed contact point location.

Exemplarily, the semiconductor measurement equipment further includes a wafer stage 40 , which is fixed on the frame 10 and located under the bottom of the optical probe 30 . The wafer stage 40 is used to place the silicon wafer 1, and the wafer stage 40 can move along the three directions of X, Y, and Z in FIG. Move, so that the optical probe 30 can measure the different potentials of the silicon wafer 1, and the Z direction is used for the stage 40 to drive the silicon wafer 1 to move to the best focal plane of the optical probe 30, so as to realize the optical probe 30 to the silicon wafer 1. the best measurement results.

The series of detailed descriptions listed above are only specific descriptions for the feasible embodiments of the present invention, and they are not used to limit the protection scope of the present invention. Changes should all be included within the protection scope of the present invention.

It will be apparent to those skilled in the art that the present invention is not limited to the details of the above-described exemplary embodiments, but that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments are to be regarded in all respects as illustrative and not restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, which are therefore intended to fall within the scope of the appended claims. All changes within the meaning and range of the equivalents of , are included in the present invention. Any reference signs in the claims shall not be construed as limiting the involved claim.

In addition, it should be understood that although this specification is described in terms of embodiments, not each embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole , the technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims (10)

1. A semiconductor measuring device, characterized in that, comprising: Frame, beam, optical probe, beam adjustment assembly, some locking parts, some wedges; The optical probe is mounted on the beam, and both ends of the beam are provided with connecting parts, and the locking member and the beam adjusting assembly are used to install the beam on the frame at the connecting parts above, the beam adjustment component is used to adjust the position of the beam to adjust the position of the optical probe; The beam adjustment assembly includes at least three adjustment units: a first adjustment unit arranged at the first connection point of the first end connecting portion of the beam, and a second adjustment unit arranged at the second connection point of the second end connection portion of the beam a unit and a third adjustment unit arranged at the third connection point of the second end connection part of the beam, the first connection point, the second connection point and the third connection point are not collinear; The wedge block is fixed on the frame, and the wedge block is arranged between the connection portion and the frame, the wedge block is configured to support the inclined surface of the bottom of the connection portion, and The wedge block is correspondingly disposed between the connection part region at at least one of the first connection point, the second connection point and the third connection point and the frame. 2 . The semiconductor measuring device according to claim 1 , wherein the beam comprises a plate area at the middle end, and the optical probe is fixed on the same side of the plate area. 3 . 3 . The semiconductor measuring device according to claim 1 , wherein a first connection line is formed between the first connection point and the second connection point, and the second connection point and the third connection point are formed. 4 . A second connection line is formed between the connection points, and the first connection line is perpendicular to the second connection line. 4 . The semiconductor measuring device according to claim 3 , wherein the first adjustment unit, the second adjustment unit, and the third adjustment unit are all jack wires, and the first adjustment unit of the beam A connection point, the second connection point and the third connection point are all provided with screw openings matching with the top screw. 5. The semiconductor measuring device according to claim 4, wherein: When the first adjusting unit is rotated, it is used to adjust the deflection of the optical probe along the second connecting line; When the third adjusting unit is rotated, it is used to adjust the deflection of the optical probe along the first connecting line; When rotating the first adjusting unit, the second adjusting unit and the third adjusting unit at the same time, it is used to adjust the vertical position of the optical probe. 6 . The semiconductor measurement apparatus according to claim 1 , wherein the wedge block comprises at least one separation area, and the separation area is recessed in the inclined surface to separate the The inclined surface is divided into several sub-supporting surfaces, and the sub-supporting surfaces form contact points with the bottom of the connecting portion to support the beam. 7 . The semiconductor measurement apparatus according to claim 6 , wherein the connection part area where the first connection point is located, the connection part area where the second connection point is located, and the third connection point The wedge blocks are correspondingly disposed between the connecting portion area and the frame. 8 . The semiconductor measuring device according to claim 7 , wherein the contact points formed by the wedges disposed corresponding to the connection points and the area enclosed by the corresponding connection points form a lock. 9 . area, and the locking member is arranged in the locking area. 9 . The semiconductor measurement apparatus according to claim 6 , wherein the wedges are configured to be the same as or larger than the number of the adjustment units. 10 . 10 . The semiconductor measuring device according to claim 6 , wherein an opening is provided at the end of the wedge, and the wedge is fixed on the frame by screws through the opening, and the frame is 10 . A thread groove matched with the screw is provided on the upper part, and the wedge block moves along the opening under the guidance of the screw through the opening to adjust the position of the contact point formed on the inclined surface of the wedge block.

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