CN115195304A - Thermal print head, method of manufacturing the same, and thermal printer - Google Patents
Thermal print head, method of manufacturing the same, and thermal printer Download PDFInfo
- Publication number
- CN115195304A CN115195304A CN202210383281.8A CN202210383281A CN115195304A CN 115195304 A CN115195304 A CN 115195304A CN 202210383281 A CN202210383281 A CN 202210383281A CN 115195304 A CN115195304 A CN 115195304A
- Authority
- CN
- China
- Prior art keywords
- protective film
- heating resistor
- print head
- thermal print
- common electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 230000001681 protective effect Effects 0.000 claims abstract description 136
- 238000010438 heat treatment Methods 0.000 claims abstract description 112
- 238000005338 heat storage Methods 0.000 claims abstract description 56
- 239000012212 insulator Substances 0.000 claims abstract description 21
- 244000126211 Hericium coralloides Species 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 45
- 238000010304 firing Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000007639 printing Methods 0.000 abstract description 38
- 230000020169 heat generation Effects 0.000 description 17
- 239000002904 solvent Substances 0.000 description 15
- 239000011521 glass Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002168 ethanoic acid esters Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 230000007815 allergy Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- HQLDMXVRNLDMQL-UHFFFAOYSA-N benzene;4-methylpentan-2-one Chemical compound C1=CC=CC=C1.CC(C)CC(C)=O HQLDMXVRNLDMQL-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 235000012041 food component Nutrition 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3359—Manufacturing processes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electronic Switches (AREA)
Abstract
The invention provides a thermal print head capable of ensuring good printing performance. In addition, a method of manufacturing the thermal print head is provided. And to provide a thermal printer having the thermal head. The thermal print head (100) includes: an insulator; a heat storage layer (33) disposed on the insulator; a protective film (34A) which is arranged on the heat storage layer (33) and has a groove (38); and a heating resistor (40) disposed on the heat storage layer (33) and embedded in the groove (38); an individual electrode (31) electrically connected to the heating resistor (40); a common electrode (32) having a comb-tooth portion (32A) and electrically connected to the heating resistor (40); and a protective film (34B) covering the heating resistor (40) and the protective film (34A), wherein the individual electrode (31) is spaced apart from the comb-teeth (32A) of the common electrode (32) and faces the comb-teeth (32A).
Description
Technical Field
The present embodiment relates to a thermal print head, a method of manufacturing the same, and a thermal printer.
Background
The thermal head has a large number of heat generating portions arranged in the main scanning direction on a main substrate, for example. Each of the heat generating portions is formed by partially exposing a resistor layer formed on the main substrate with a glaze layer interposed therebetween, and laminating a common electrode and an individual electrode so that their ends face each other. When current is passed between the common electrode and the individual electrodes, the exposed portion (heat-generating portion) of the resistor layer generates heat by joule heat. Printing on a print medium is completed by transferring this heat to the print medium (thermal paper for producing barcode paper or receipts, etc.).
For example, in a distribution center or the like, classification of articles, details of contents, and an invoice number are printed on a label, and by using the label, simplification and high efficiency of product inspection work can be achieved.
However, in recent years, traceability has been emphasized, so-called information such as manufacturer-specific marks, the date of manufacture, and the time of consumption has been required to be recorded on a printing medium such as a label or a receipt, and the amount of printing information and the amount of label printing have tended to increase in the distribution field with respect to obligation of display of nutritional components such as foods, change of allergy indications, and the like.
In order to realize a large amount of printing that is increasing, a thermal head is required to print information on a printing medium at high speed and with high definition. In order to perform printing at high speed and with high definition (to improve printing performance), the pitch of the heat generating portion needs to be narrowed.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2006-159866.
Disclosure of Invention
Problems to be solved by the invention
The heating portion is formed on an upwardly bulging portion of the glaze layer, and the protective film is disposed so as to cover the heating portion. However, in order to completely cover the end of the heat generating portion with the protective film, the protective film needs to be formed thick in consideration of the coverage of the end of the heat generating portion. In order to transfer heat generated from the heat generating portion to the printing medium through the protective film, if the protective film is too thick, the heat cannot be efficiently transferred to the printing medium, and printing performance may be deteriorated. One embodiment of the present embodiment provides a thermal print head that ensures good printing performance. Another embodiment of the present invention provides a method for manufacturing the thermal head. Another embodiment of the present invention provides a thermal printer including the thermal head.
Means for solving the problems
In the present embodiment, the first protective film having the groove portion is used to form the heating resistor electrically connected to the individual electrode and the common electrode in the groove portion, and the second protective film covering the heating resistor is formed to be thin, whereby the printing performance of the thermal head can be improved. One embodiment of the present embodiment is as follows.
A thermal print head according to one embodiment of the present invention includes: an insulator; a heat storage layer disposed on the insulator; a first protective film disposed on the heat storage layer and having a groove portion; a heat generating resistor disposed on the heat storage layer and embedded in the groove; an independent electrode electrically connected to the heating resistor; a common electrode having a comb-tooth portion electrically connected to the heating resistor; and a second protective film covering the heating resistor and the first protective film, wherein the individual electrode is spaced apart from the comb-teeth portion of the common electrode and faces the comb-teeth portion.
Another embodiment of the present invention is a thermal printer including the thermal head.
Another embodiment of the present invention is a method of manufacturing a thermal head, including forming a heat storage layer on an insulator, forming a common electrode and an individual electrode having a comb-tooth portion on the heat storage layer, forming a resist on the heat storage layer, the individual electrode, and the comb-tooth portion, forming a first protective film having a groove portion using the resist, forming a heating resistor electrically connected to the individual electrode and the common electrode in the groove portion, and forming a second protective film covering the heating resistor and the first protective film, wherein the individual electrode is opposed to the comb-tooth portion of the common electrode with a gap therebetween.
Another embodiment of the present invention is a method of manufacturing a thermal head, including forming a heat storage layer on an insulator, forming a resist on the heat storage layer, forming a first protective film having a groove portion using the resist, forming a heating resistor on the groove portion, forming a common electrode and an individual electrode having comb teeth portions on the heating resistor and the first protective film, and forming a second protective film covering the heating resistor, the first protective film, the common electrode, and the individual electrode, wherein the individual electrode is opposed to the comb teeth portions of the common electrode with a gap therebetween.
Effects of the invention
According to the present embodiment, a thermal head ensuring good printing performance can be provided. In addition, a method of manufacturing the thermal head can be provided. Also, a thermal printer having the thermal head can be provided.
Drawings
Fig. 1 is a partial perspective view illustrating a thermal head according to a first embodiment.
Fig. 2 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 1 in the main scanning direction X.
Fig. 3 is a partial sectional view along the line B-B of fig. 1 in the sub-scanning direction Y.
Fig. 4 is an enlarged cross-sectional view of the periphery of the heating resistor.
Fig. 5 is an enlarged perspective view of the heating resistor.
Fig. 6 is (one of) a partial perspective view illustrating a method of manufacturing the thermal head of the first embodiment.
Fig. 7 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 6 in the main scanning direction X.
Fig. 8 is a partial sectional view along the line B-B of fig. 6 in the sub-scanning direction Y.
Fig. 9 is a partial perspective view (two) illustrating a method of manufacturing the thermal head according to the first embodiment.
Fig. 10 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 9 in the main scanning direction X.
Fig. 11 is a partial sectional view along the line B-B of fig. 9 in the sub-scanning direction Y.
Fig. 12 is a partial perspective view (iii) illustrating a method of manufacturing a thermal head according to the first embodiment.
Fig. 13 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 12 in the main scanning direction X.
Fig. 14 is a partial sectional view taken along line B-B of fig. 12 in the sub-scanning direction Y.
Fig. 15 is a partial perspective view (fourth) illustrating a method of manufacturing the thermal head according to the first embodiment.
Fig. 16 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 15 in the main scanning direction X.
Fig. 17 is a partial sectional view taken along line B-B of fig. 15 in the sub-scanning direction Y.
Fig. 18 is a partial perspective view (fifthly) illustrating a method of manufacturing the thermal head according to the first embodiment.
Fig. 19 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 18 in the main scanning direction X.
Fig. 20 is a partial sectional view taken along line B-B of fig. 18 in the sub-scanning direction Y.
Fig. 21 illustrates a partial perspective view (sixteenth) of the method of manufacturing the thermal head according to the first embodiment.
Fig. 22 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 21 in the main scanning direction X.
Fig. 23 is a partial sectional view taken along line B-B of fig. 21 in the sub-scanning direction Y.
Fig. 24 is a sectional view illustrating a thermal head of a second embodiment.
Fig. 25 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 24 in the main scanning direction X.
Fig. 26 is a partial sectional view taken along line B-B of fig. 24 in the sub-scanning direction Y.
Fig. 27 is a partial perspective view (one of) illustrating a method of manufacturing a thermal head according to a second embodiment.
Fig. 28 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 27 in the main scanning direction X.
Fig. 29 is a partial sectional view along the line B-B of fig. 27 in the sub-scanning direction Y.
Fig. 30 is a partial perspective view (two) illustrating a method of manufacturing the thermal head according to the second embodiment.
Fig. 31 isbase:Sub>A partial sectional view taken along linebase:Sub>A-base:Sub>A of fig. 30 in the main scanning direction X.
Fig. 32 is a partial sectional view along the line B-B of fig. 30 in the sub-scanning direction Y.
Fig. 33 is a partial perspective view (iii) illustrating a method of manufacturing a thermal head according to the second embodiment.
Fig. 34 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 33 in the main scanning direction X.
Fig. 35 is a partial sectional view along the line B-B of fig. 33 in the sub-scanning direction Y.
Fig. 36 is a partial perspective view (fourth) illustrating a method of manufacturing a thermal head according to the second embodiment.
Fig. 37 isbase:Sub>A partial sectional view taken along linebase:Sub>A-base:Sub>A of fig. 36 in the main scanning direction X.
Fig. 38 is a partial sectional view taken along line B-B of fig. 36 in the sub-scanning direction Y.
Fig. 39 is a sectional view illustrating a thermal head.
Description of reference numerals
5. Connection substrate
7. Driver IC
8. Heat dissipation component
15. Substrate
30. Wiring layer
31. Independent electrode
32. Common electrode
33. Heat storage layer
34A, 34B protective film
36. Resist and method for producing the same
38. Groove part
40. Heating resistor
40A curved surface
41. Heating resistor unit
59. Connector with a locking member
81. Conducting wire
82. Resin part
91. Paper pressing roller
92. Printing medium
100. 100A thermal print head
Detailed Description
Next, the present embodiment will be described with reference to the drawings. In the description of the drawings to be described below, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and it should be noted that the relationship between the thickness and the planar dimension of each component is different from the actual relationship between the thickness and the planar dimension. Therefore, the thickness and the size should be judged with reference to the following description. It is to be noted that the drawings naturally include portions having different dimensional relationships and ratios from each other.
The embodiments described below are examples illustrating apparatuses and methods for embodying technical ideas, and are not intended to limit the material, shape, structure, arrangement, and the like of each component. The present embodiment can be variously modified within the scope of the present invention.
A specific embodiment of the present embodiment is as follows.
<1> a thermal print head comprising: an insulator; a heat storage layer disposed on the insulator; a first protective film disposed on the heat storage layer and having a groove portion; a heat generating resistor disposed on the heat storage layer and embedded in the groove; an independent electrode electrically connected to the heating resistor; a common electrode having a comb-tooth portion electrically connected to the heating resistor; and a second protective film covering the heating resistor and the first protective film, wherein the individual electrode is spaced apart from the comb-teeth portion of the common electrode and faces the comb-teeth portion.
<2> in the thermal head according to <1>, the heating resistors are disposed on the individual electrodes and the comb-teeth portions.
<3> in the thermal head according to <1>, the individual electrodes and the common electrode are disposed on the heating resistor and the first protective film.
<4> in the thermal head according to any one of <1> to <3>, a boundary surface between the heating resistor and the second protective film is located closer to the insulator than a boundary surface between the first protective film and the second protective film.
<5> in the thermal head according to any one of <1> to <4>, a portion of the main surface of the second protective film on the side opposite to the side on which the first protective film is provided, which portion overlaps with the heating resistor when viewed from a normal direction of the main surface, is a flat surface.
<6> in the thermal head according to any one of <1> to <5>, a main surface of the heating resistor on a side where the second protective film is provided has a concave curved surface.
<7> in the thermal head according to any one of <1> to <6>, the insulator is a substrate.
<8> in the thermal head according to <7>, the substrate is made of ceramic.
<9> a thermal printer having the thermal head according to any one of <1> to <8 >.
<10> a method for manufacturing a thermal head, comprising forming a heat storage layer on an insulator, forming a common electrode and an individual electrode having a comb tooth portion on the heat storage layer, forming a resist on the heat storage layer, the individual electrode and the comb tooth portion, forming a first protective film having a groove portion using the resist, forming a heat generating resistor body electrically connected to the individual electrode and the common electrode in the groove portion, and forming a second protective film covering the heat generating resistor body and the first protective film, wherein the individual electrode is opposed to the comb tooth portion of the common electrode with a space therebetween.
<11> a method of manufacturing a thermal head, comprising forming a heat storage layer on an insulator, forming a resist on the heat storage layer, forming a first protective film having a groove portion using the resist, forming a heating resistor on the groove portion, forming a common electrode and an individual electrode having a comb-tooth portion on the heating resistor and the first protective film, and forming a second protective film covering the heating resistor, the first protective film, the common electrode, and the individual electrode, wherein the individual electrode is opposed to the comb-tooth portion of the common electrode with a gap therebetween.
<12> in the method of manufacturing a thermal head according to <10> or <11>, the first protection film is formed by baking a material paste to be the first protection film.
<13> in the method of manufacturing a thermal head according to any one of <10> to <12>, the heating resistor is formed by embedding a resistor paste in the groove portion of the first protection film and baking the resistor paste.
<14> in the method of manufacturing a thermal head according to any one of <10> to <13>, the heating resistor is formed by screen printing.
<15> in the method of manufacturing a thermal head according to any one of <10> to <13>, the heating resistor is formed using a mask.
<16> the method of manufacturing a thermal head according to <15>, wherein the mask is a stencil mask.
<17> in the method of manufacturing a thermal head according to any one of <10> to <16>, the first protective film is formed through a firing step, and the resist is removed through one or more steps selected from the firing step and an organic peeling step.
<18> in the method of manufacturing a thermal head according to any one of <10> to <17>, a main surface of the heating resistor on a side where the second protective film is provided has a concave curved surface.
< thermal print head >
(first embodiment)
The thermal print head according to the present embodiment will be described with reference to the drawings.
Fig. 1 is a partial perspective view showing a thermal head. Fig. 2 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 1 in the main scanning direction X. Fig. 3 is a partial sectional view along the line B-B of fig. 1 in the sub-scanning direction Y. Fig. 1 to 3 show a part of a thermal head (corresponding to 1 thermal head), and in the present embodiment, the 1 thermal head is a single-sheet thermal head 100. The thermal print head 100 includes: a substrate 15 as an insulator; a heat storage layer 33 on the substrate 15; a plurality of individual electrodes 31 on the heat storage layer 33; a common electrode 32 on the heat storage layer 33; a protective film 34A having a groove portion 38 on the heat storage layer 33, the plurality of individual electrodes 31, and the common electrode 32; a plurality of heating resistors 40 disposed on the heat storage layer 33, on the individual electrodes 31, and on the common electrode 32, and embedded in the groove portions 38; and a protective film 34B covering the plurality of heating resistors 40 and the protective film 34A. The heating resistor 40 is electrically connected to the individual electrode 31 and the common electrode 32. The individual electrodes 31 are spaced apart from the comb-teeth 32A of the common electrode 32 so as to sandwich the heating resistors 40, and face the comb-teeth 32A. The heating resistor 40 includes a heating resistor portion 41 that generates heat by the current flowing through the individual electrode 31 and the common electrode 32. The plurality of heat-generating resistive portions 41 are provided between the individual electrodes 31 and the common electrode 32, and each heat-generating resistive portion 41 is formed independently. Fig. 1 omits illustration of the plurality of heat generation resistors 41. The plurality of heat generation resistors 41 are linearly arranged on the heat storage layer 33.
In the present embodiment, a direction in which the plurality of heat generation resistor portions 41 linearly extend is defined as a main scanning direction X, a direction perpendicular to the main scanning direction X and parallel to the upper surface of the substrate 15 is defined as a sub-scanning direction Y, and a direction corresponding to the thickness of the substrate 15 is defined as a thickness direction Z. In other words, the thickness direction Z is a direction perpendicular to the main scanning direction X and the sub-scanning direction Y, respectively. The direction in which the heat storage layer 33 is located when viewed from the substrate 15 is defined as the upper direction, and the direction in which the substrate 15 is located when viewed from the heat storage layer 33 is defined as the lower direction.
The substrate 15 is an insulator, and is made of, for example, ceramic. As the ceramic, for example, alumina or the like can be used. From the viewpoint of heat dissipation, alumina having relatively high thermal conductivity is preferably used for the substrate 15.
A heat storage layer 33 (also referred to as a glaze layer) having a function of storing heat is laminated on the substrate 15. The heat storage layer 33 stores heat generated from the heat generation resistor unit 41 described later. The heat storage layer 33 may be made of an insulating material, for example, silicon oxide or silicon nitride, which is a main component of glass. The size of the heat storage layer 33 in the thickness direction Z is not particularly limited, but is, for example, 5 to 100 μm, preferably 10 to 30 μm.
The individual electrodes 31 and the common electrode 32 formed of a metal paste are provided on the heat storage layer 33. The individual electrodes 31 and the common electrode 32 are obtained by forming an electrode pattern by applying a metal paste by screen printing or the like and then firing.
As the metal paste, for example, a paste containing metal particles of copper, silver, palladium, iridium, platinum, gold, or the like can be used. From the viewpoint of the characteristics and ionization tendency of the metal, copper, silver, platinum and gold are preferably used, and from the viewpoint of the characteristics and ionization tendency of the metal and reduction in cost, silver is more preferably used. The solvent contained in the metal paste has a function of uniformly dispersing the metal particles, and examples thereof include 1 kind of solvents such as an ester solvent, a ketone solvent, an alcohol ether solvent, an aliphatic solvent, an alicyclic solvent, an aromatic solvent, an alcohol solvent, and water, and a mixture of 2 or more kinds of solvents, but the solvent is not limited thereto.
Examples of the ester solvent include ethyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, pentyl acetate, ethyl lactate, and dimethyl carbonate. Examples of the ketone solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone benzene, diisobutyl ketone, diacetone alcohol, isophorone, and cyclohexanone. Examples of the alcohol ether solvent include ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, and the like, acetic acid esters of these monoethers, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, and the like, and acetic acid esters of these monoethers, and the like.
Examples of the aliphatic solvent include n-heptane, n-hexane, cyclohexane, methylcyclohexane, and ethylcyclohexane. Examples of the alicyclic solvent include methylcyclohexane, ethylcyclohexane, and cyclohexane. Examples of the aromatic solvent include toluene, xylene, and tetrahydronaphthalene. Examples of the alcohol solvent (other than the alcohol ether solvents) include ethanol, propanol, and butanol.
The metal paste may contain a dispersant, a surface treatment agent, a friction resistance improver, an infrared absorber, an ultraviolet absorber, an aromatic agent, an antioxidant, an organic pigment, an inorganic pigment, an antifoaming agent, a silane coupling agent, a titanate coupling agent, a plasticizer, a flame retardant, a humectant, an ion scavenger, and the like, as required.
The individual electrodes 31 are formed in a stripe shape extending substantially in the sub-scanning direction Y, and are not electrically connected to each other. Therefore, when a printer incorporating a thermal head is used, the individual electrodes 31 can be independently applied with different potentials. An independent pad portion not shown is connected to an end portion of each independent electrode 31.
The common electrode 32 is a portion having an electrical reverse polarity to the plurality of individual electrodes 31 when the printer incorporating the thermal head is used. The common electrode 32 has comb-teeth 32A and a common portion 32B that connects the comb-teeth 32A in common. The common portion 32B is formed in the main scanning direction X along the edge of the upper side of the substrate 15. In the sub-scanning direction Y, the common electrode 32 is located in a direction as viewed from the individual electrodes 31, which is an upper side in the sub-scanning direction Y. Each comb tooth portion 32A is formed in a belt shape extending in the sub-scanning direction Y. The tip end portions of the comb-teeth portions 32A face the tip end portions of the individual electrodes 31 at a predetermined interval in the sub-scanning direction Y. With such a configuration, the pitch of the heating resistors 40 can be narrowed, and thus high-definition printing can be realized.
The protective film 34A has a groove 38. The individual electrodes 31, the common electrode 32, and the like are covered with a protective film 34A, which protects the individual electrodes 31, the common electrode 32, and the like from abrasion, corrosion, oxidation, and the like. The protective film 34A can be made of an insulating material, for example, amorphous glass. The protective film 34A is formed by thick-film printing of a glass paste and then firing. The dimension of the protective film 34A in the thickness direction Z is, for example, about 1 to 10 μm.
The heating resistor 40 is electrically connected to the individual electrode 31 and the common electrode 32, and generates heat from a portion through which the current flows from the individual electrode 31 and the common electrode 32. Specifically, the heating resistor 40 (heating resistor portion 41) to which the heating voltage is independently applied selectively generates heat in accordance with a print signal transmitted from the outside to the driver IC or the like. The heat-generating resistor units 41 are independently energized in response to a print signal, and thereby selectively generate heat. Thus, the printed dots are formed by heat generation. The heating resistor 40 is made of a material having a higher resistivity than the materials constituting the individual electrodes 31 and the common electrode 32, and may be made of, for example, ruthenium oxide.
The heating resistor 40 can be formed by embedding a resistor paste in the groove 38 of the protective film 34A and baking the same. In the present embodiment, the dimension of the heating resistor 40 in the thickness direction Z is, for example, about 1 to 10 μm.
The resistor paste to be the heating resistor 40 shrinks by firing. For example, even if the resistor paste is supplied so as to completely fill the groove portions 38, the surface of the heating resistor 40 that contacts the protective film 34B is microscopically located closer to the substrate 15 than the surface of the protective film 34A that contacts the protective film 34B, as shown in fig. 4, by firing. In other words, the boundary surface between the heating resistor 40 and the protective film 34B is located closer to the substrate 15 (lower side) than the boundary surface between the protective film 34A and the protective film 34B. In the case where it is difficult to determine the boundary between the protective film 34A and the protective film 34B, such as when the protective film 34A and the protective film 34B are made of the same material, a portion separated from the main surface of the protective film 34B (the main surface of the protective film 34B on the side opposite to the side on which the protective film 34A is provided) by the thickness of the protective film 34B is defined as the boundary surface between the protective film 34A and the protective film 34B. When the boundary surface between the heating resistor 40 and the protective film 34B is located closer to the substrate 15 than the boundary surface between the protective film 34A and the protective film 34B, the end of the heating resistor 40 is located closer to the substrate 15 than the boundary surface between the protective film 34A and the protective film 34B, and therefore the end of the heating resistor 40 can be completely covered with the protective film 34B, which is preferable.
In addition, a portion of the main surface of the protective film 34B opposite to the side on which the protective film 34A is provided, which portion overlaps with the heating resistor 40 when viewed from the normal direction of the main surface, may be a flat surface. In the present specification and the like, the term "flat surface" includes a surface having an average surface roughness of 0.5 μm or less. The average surface roughness can be measured, for example, in accordance with JIS B0601: 2013 or ISO25178 standard. When the portion overlapping the heating resistor 40 is a flat surface, contact with the platen roller of the thermal head becomes easy, which is preferable.
As shown in fig. 5, the heating resistor 40 may have a concave curved surface 40A on its main surface (the surface opposite to the surface on which the heat storage layer 33 is provided). In the step of forming the heating resistor 40, the resistor paste is embedded in the groove portion 38 of the protective film 34A and fired, and therefore the main surface may have a concave curved surface 40A due to the surface tension of the resistor paste and the protective film 34A. When the main surface of the heating resistor 40 has the concave curved surface 40A, it is preferable to form the protective film 34B and the like which can be satisfactorily covered.
The heating resistor 40, the protective film 34A, and the like are covered with the protective film 34B, and the protective film 34B protects the heating resistor 40, the protective film 34A, and the like from abrasion, corrosion, oxidation, and the like. The protective film 34B can be made of an insulating material, for example, amorphous glass. The protective film 34B is formed by thick-film printing of a glass paste and then firing. The dimension of the protective film 34B in the thickness direction Z is, for example, about 2 to 8 μm. A thickness within this range is preferable because the thermal head 100 can suppress a pressure failure and maintain good printing quality. Even if the protective film 34B is made thin, the end portion of the heating resistor 40 can be completely covered, and the printing performance of the thermal print head 100 can be improved.
Here, a method of manufacturing the thermal head 100 according to the present embodiment will be described.
As shown in fig. 6 to 8, first, the substrate 15 is prepared, and the heat storage layer 33 is formed on the substrate 15. Next, the wiring layer 30 is formed on the heat storage layer 33.
The heat storage layer 33 can be formed by applying a glass paste by screen printing or the like, drying the applied glass paste, and then performing a firing process. The firing treatment is carried out, for example, at 800 to 1200 ℃ for 10 minutes to 1 hour. The dimension of the heat storage layer 33 in the thickness direction Z is, for example, 25 μm.
The wiring layer 30 becomes an individual electrode 31 and a common electrode 32 formed later. The wiring layer 30 is obtained by applying the above-described metal paste to be the individual electrodes 31 and the common electrode 32 by screen printing or the like, and then firing the paste.
Next, as shown in fig. 9 to 11, the wiring layer 30 is etched to form the individual electrodes 31 and the common electrode 32.
Next, as shown in fig. 12 to 14, a resist 36 is formed on the heat storage layer 33, on the individual electrodes 31, and on the common electrode 32. In the region where the resist 36 is present, the heating resistor 40 is formed later. Since a failure in the shape pattern of the resist 36 is related to a failure in the shape pattern of the heating resistor 40 to be formed later, it is preferable to form the resist 36 with high accuracy by appropriately adjusting the etching conditions. By forming the resist 36 into a desired shape, the groove 38 having a desired shape can be formed, and the groove 38 can provide the desired heating resistor 40. Therefore, by processing the shape pattern of the resist 36 with high accuracy, defects in the shape pattern of the heating resistor 40 can be reduced.
Next, as shown in fig. 15 to 17, a protective film 34A is formed on the heat storage layer 33, the individual electrodes 31, and the common electrode 32, on which the resist 36 is not provided. The protective film 34A is made of, for example, amorphous glass. The protective film 34A is formed by thick-film printing a material paste (e.g., glass paste) to be the protective film 34A and then firing the printed material paste.
Next, as shown in fig. 18 to 20, resist 36 is removed in a baking step in forming protective film 34A, thereby forming groove 38 in protective film 34A. The resist 36 may be removed by performing an organic stripping process. Examples of the solvent that can be used in the organic stripping step include a stripping liquid 10 manufactured by tokyo chemical industries co.
By forming the protective film 34A using the resist 36 in this manner, the groove 38 can be easily formed in the protective film 34A without using an etchant such as hydrofluoric acid which requires sufficient care.
Next, as shown in fig. 21 to 23, a resistor paste to be the heating resistor 40 (heating resistor portion 41) is formed so as to fill the groove portion 38. The groove 38 is supplied with a resistor paste using a mask such as screen printing or stencil mask. For example, the resistor paste is preferably supplied by using a stencil mask because printing accuracy can be improved. The resistor paste contains, for example, ruthenium oxide.
Next, the heating resistor 40 (heating resistor portion 41) is formed by firing the resistor paste.
In the step of forming the heating resistor 40, the resistor paste is embedded in the groove portion 38 of the protective film 34A and fired, and therefore the main surface of the heating resistor 40 may have a concave curved surface 40A due to the surface tension of the resistor paste and the protective film 34A. When the main surface of the heating resistor 40 has the concave curved surface 40A, it is preferable because a protective film 34B having good coverage can be formed.
Next, as shown in fig. 1 to 3, a protective film 34B is formed. The protective film 34B is made of, for example, amorphous glass. The protective film 34B is formed by thick-film printing of a glass paste and then firing.
Through the above steps, the thermal print head 100 of the present embodiment can be manufactured.
According to the present embodiment, since the heating resistor 40 is formed so as to be embedded in the groove portion 38, even if the protective film 34B is made thin, the end portion of the heating resistor 40 can be completely covered, and the printing performance of the thermal head 100 can be improved. Further, since the heating resistors 40 are formed in the groove portions 38 of the protective film 34A instead of forming a plurality of heating resistors by wet etching or the like based on 1 heating resistor, it is possible to reduce the defects in the pattern shape of each heating resistor.
(second embodiment)
The thermal print head according to the present embodiment will be described with reference to the drawings.
Fig. 24 is a partial perspective view showing a thermal head. Fig. 25 isbase:Sub>A partial sectional view alongbase:Sub>A linebase:Sub>A-base:Sub>A of fig. 24 in the main scanning direction X. Fig. 26 is a partial sectional view taken along line B-B of fig. 24 in the sub-scanning direction Y. Fig. 24 to 26 show a part of a thermal head (corresponding to 1 thermal head), and in the present embodiment, the 1 thermal head is formed as a single-sheet thermal head 100A. The thermal print head 100A includes: a substrate 15 as an insulator; a heat storage layer 33 on the substrate 15; a protective film 34A having a groove portion 38 on the heat storage layer 33; a plurality of heating resistors 40 disposed on the heat storage layer 33 and embedded in the groove portions 38; a common electrode 32 and a plurality of individual electrodes 31 on the heating resistor 40 and the protective film 34A; a protective film 34B covering the plurality of heating resistors 40, the protective film 34A, the common electrode 32, and the plurality of individual electrodes 31.
The thermal print head 100A of the present embodiment is different from the thermal print head 100 of the first embodiment in that the individual electrodes 31 and the common electrode 32 are disposed on the heating resistor 40 and the protective film 34A. In the present embodiment, the description of the first embodiment is referred to for points common to the first embodiment, and differences will be described below.
When the individual electrodes 31 and the common electrode 32 are arranged on the heating resistor 40 and the protective film 34A, the individual electrodes 31 and the common electrode 32 generate heat on the main surface (the surface opposite to the surface on which the heat storage layer 33 is provided) side of the heating resistor 40, and therefore the generated heat can be efficiently transferred to the printing medium, and the printing performance of the thermal head 100A can be further improved.
Here, a method of manufacturing the thermal head 100A according to the present embodiment will be described.
As shown in fig. 27 to 29, first, the substrate 15 is prepared, and the heat storage layer 33 is formed on the substrate 15. Next, a resist 36 is formed on the heat storage layer 33. In the region where the resist 36 is present, the heating resistor 40 is formed thereafter.
Next, as shown in fig. 30 to 32, a protective film 34A is formed on the heat storage layer 33 on which the resist 36 is not provided.
Next, as shown in fig. 33 to 35, resist 36 is removed by a baking step in forming protective film 34A, thereby forming groove 38 in protective film 34A. The resist 36 may be removed by performing an organic stripping process.
By forming the protective film 34A using the resist 36 in this manner, the groove 38 can be easily formed in the protective film 34A without using an etchant such as hydrofluoric acid which requires sufficient care for treatment.
Next, as shown in fig. 36 to 38, a resistor paste to be the heating resistor 40 (heating resistor portion 41) is formed so as to be embedded in the groove portion 38. Next, the heating resistor 40 (heating resistor portion 41) is formed by firing the resistor paste.
Next, as shown in fig. 24 to 26, a protective film 34B is formed. The protective film 34B is made of, for example, amorphous glass. The protective film 34B is formed by thick-film printing of glass paste and then firing.
Through the above steps, the thermal head 100A of the present embodiment can be manufactured.
According to the present embodiment, since the heating resistor 40 is formed so as to be embedded in the groove portion 38, even if the protective film 34B is made thin, the end portion of the heating resistor 40 can be completely covered, and the printing performance of the thermal head 100A can be improved. Further, since the heat generating resistors 40 are formed in the groove portions 38 of the protective film 34A instead of forming a plurality of heat generating resistors by wet etching or the like based on 1 heat generating resistor, it is possible to reduce the defects in the pattern shapes of the respective heat generating resistors.
(other embodiments)
As described above, although the description has been made on one embodiment, the description and drawings constituting a part of the invention are illustrative and should not be construed as restrictive. Various alternative embodiments, examples, and techniques of use will be apparent to those skilled in the art in light of this disclosure. As described above, the present embodiment includes various embodiments and the like not described herein.
< thermal Printer >
The thermal head (e.g., the thermal head 100) further includes, as shown in fig. 39: substrate 15 (heat storage layer 33 and the like on substrate 15 are not shown), connection substrate 5, heat dissipation member 8, driver IC7, a plurality of leads 81, resin portion 82, and connector 59. The substrate 15 and the connection substrate 5 are mounted on the heat dissipation member 8 so as to be adjacent to each other in the sub-scanning direction Y. A plurality of heat generation resistor portions 41 arranged in the main scanning direction X are formed on the substrate 15. The heat generation resistor unit 41 is driven to selectively generate heat by the driver IC7 mounted on the connection substrate 5. The heating resistor 41 is configured to be printed on a printing medium 92 such as a thermal input pressed against the heating resistor 41 by a platen roller 91 in response to a printing signal transmitted from the outside through a connector 59.
For example, a printed wiring board can be used as the connection substrate 5. The connection substrate 5 has a structure in which a base material layer and a wiring layer not shown are laminated. The substrate layer can be made of, for example, glass epoxy resin. For example, metals such as copper, silver, palladium, iridium, platinum, and gold can be used for the wiring layer.
The heat dissipation member 8 has a function of dissipating heat from the substrate 15. The substrate 15 and the connection substrate 5 are mounted on the heat dissipation member 8. The heat dissipation member 8 can be made of metal such as aluminum, for example.
The conductive wire 81 can be made of a conductor such as gold, for example. The plurality of wires 81 are bonded to each other to electrically connect the driver IC7 and each individual electrode. In addition, some of the other wires 81 conduct the driving IC7 and the connector 59 through the wiring layer in the connection substrate 5 by bonding.
For example, black resin can be used for the resin portion 82. As the resin portion 82, for example, epoxy resin, silicone resin, or the like can be used. The resin portion 82 covers the drive IC7, the plurality of lead wires 81, and the like, and protects the drive IC7 and the plurality of lead wires 81. The connector 59 is fixed to the connection substrate 5. To the connector 59, wiring for supplying power from the outside of the thermal head to the thermal head and controlling the drive IC7 is connected.
The thermal printer can have the thermal head described above. The thermal printer performs printing on a printing medium conveyed in the sub-scanning direction Y. Normally, the print medium is conveyed from the connector 59 side to the heat-generating resistor portion 41 side. Examples of the print medium include bar code paper and thermal paper used for producing receipts.
The thermal printer includes, for example, a thermal head 100, a platen roller 91, a main power supply circuit, a measurement circuit, and a control unit. The platen roller 91 faces the thermal head 100.
The main power supply circuit supplies power to the plurality of heat-generating resistor units 41 in the thermal head 100. The measuring circuit measures the resistance value of each of the plurality of heat generating resistor units 41. The measuring circuit measures the resistance value of each of the plurality of heat-generating resistive portions 41, for example, when printing on a print medium is not performed. This makes it possible to check the life of the heat-generating resistor 41 and the presence or absence of a defective heat-generating resistor 41. The control unit controls the driving states of the main power supply circuit and the measuring circuit. The control unit controls the respective energization states of the plurality of heat generation resistors 41. There are cases where the circuit for measurement is omitted.
The connector 59 is used for communication with a device outside the thermal head 100. The thermal head 100 is electrically connected to a main power supply circuit and a measurement circuit via the connector 59. The thermal head 100 is electrically connected to the control unit via the connector 59.
The drive IC7 receives a signal from the control section via the connector 59. The drive IC7 controls the energization state of each of the plurality of heat generation resistive portions 41 based on the signal received from the control portion. Specifically, the drive IC7 selectively energizes the plurality of individual electrodes to arbitrarily generate heat in any one of the plurality of heat-generating resistive portions 41.
The thermal head is not limited to the above configuration, and may be configured such that the driver IC7 is directly mounted on the substrate 15 without providing the connection substrate 5, may be configured such that the lead wire 81 is not provided by flip-chip mounting, or may be configured such that the heat dissipation member 8 is not provided.
Next, a method of using the thermal printer will be described.
When printing on a print medium, a potential V11 as a potential V1 is applied from the main power supply circuit to the connector 59. In this case, the plurality of heat generation resistor units 41 selectively supply electricity and generate heat. By transferring this heat to the print medium, printing to the print medium is completed. As described above, when the potential V11 is applied as the potential V1 to the connector 59 from the main power supply circuit, the current-carrying paths to the plurality of heat-generating resistor units 41 can be secured.
When printing on the print medium is not performed, the resistance value of each of the heat generation resistor units 41 is measured. At the time of this measurement, no potential is applied from the main power supply circuit to the connector 59. When measuring the resistance value of each heat generation resistance portion 41, the potential V12 is applied from the measurement circuit to the connector 59 as the potential V1. In this case, the plurality of heat-generating resistor portions 41 are energized sequentially (for example, sequentially from the heat-generating resistor portion 41 located at the end in the main scanning direction X). The measuring circuit measures the resistance value of each heat generation resistor unit 41 based on the value of the current flowing through the heat generation resistor unit 41 and the potential v 12. As described above, when the potential V11 is applied as the potential V1 to the connector 59 from the main power supply circuit, the current supply path to each of the plurality of heat-generating resistor portions 41 is substantially blocked. Thus, the resistance value of each heat generation resistor unit 41 can be measured more accurately by the measuring circuit, and the life of the heat generation resistor unit 41 and the presence or absence of a defective heat generation resistor unit 41 can be checked.
According to the above, a thermal printer ensuring good printing performance can be obtained.
The present invention is associated with the subject matter of japanese patent application No. 2021-068352 filed on 14.4.2021, the entire disclosure of which is incorporated by reference into this specification.
Claims (18)
1. A thermal print head, comprising:
an insulator;
a heat storage layer disposed on the insulator;
a first protective film disposed on the heat storage layer and having a groove portion;
a heat generating resistor disposed on the heat storage layer and embedded in the groove;
an independent electrode electrically connected to the heating resistor;
a common electrode having a comb-tooth portion electrically connected to the heating resistor; and
a second protective film covering the heating resistor and the first protective film,
the individual electrode is spaced apart from and opposite to the comb-tooth portion of the common electrode.
2. The thermal print head of claim 1, wherein:
the heating resistor is disposed on the individual electrode and the comb-teeth portion.
3. The thermal print head of claim 1, wherein:
the individual electrodes and the common electrode are disposed on the heating resistor and the first protective film.
4. A thermal print head according to any one of claims 1 to 3, wherein:
a boundary surface between the heating resistor and the second protective film is located closer to the insulator than a boundary surface between the first protective film and the second protective film.
5. The thermal print head according to any one of claims 1 to 4, wherein:
a portion of the second protective film that overlaps the heating resistor when viewed from a normal direction of the main surface is a flat surface, the portion being on an opposite side of the main surface from a side on which the first protective film is provided.
6. The thermal print head according to any one of claims 1 to 5, wherein:
the main surface of the heating resistor on the side where the second protective film is provided has a concave curved surface.
7. The thermal print head according to any one of claims 1 to 6, wherein:
the insulator is a substrate.
8. The thermal print head of claim 7, wherein:
the substrate is composed of ceramic.
9. A thermal printer, characterized by:
a thermal print head according to any one of claims 1 to 8.
10. A method of manufacturing a thermal print head, comprising:
a heat storage layer is formed on the insulator,
a common electrode and an independent electrode having comb teeth are formed on the heat storage layer,
forming a resist on the heat storage layer, on the individual electrodes, and on the comb-teeth portions,
forming a first protective film having a groove portion using the resist,
a heating resistor body electrically connected to the individual electrode and the common electrode is formed in the groove portion,
forming a second protective film covering the heating resistor and the first protective film,
the individual electrode is spaced apart from and opposite to the comb-tooth portion of the common electrode.
11. A method of manufacturing a thermal print head, comprising:
a heat storage layer is formed on the insulator,
a resist is formed on the heat storage layer,
forming a first protective film having a groove portion using the resist,
a heating resistor is formed in the groove portion,
forming a common electrode and an individual electrode having comb-teeth portions on the heating resistor body and the first protective film,
forming a second protective film covering the heating resistor body, the first protective film, the common electrode, and the individual electrodes,
the individual electrode is spaced apart from and opposite to the comb-tooth portion of the common electrode.
12. The method of manufacturing a thermal print head according to claim 10 or 11, wherein:
the first protection film is formed by firing a material paste to be the first protection film.
13. The method of manufacturing a thermal print head according to any one of claims 10 to 12, wherein:
the heating resistor is formed by embedding a resistor paste in the groove of the first protective film and baking the resistor paste.
14. The method of manufacturing a thermal print head according to any one of claims 10 to 13, wherein:
the heating resistor body is formed by screen printing.
15. The method of manufacturing a thermal print head according to any one of claims 10 to 13, wherein:
the heating resistor body is formed using a mask.
16. The method of manufacturing a thermal print head according to claim 15, wherein:
the mask is a hollow mask.
17. A method of manufacturing a thermal print head according to any one of claims 10 to 16, wherein:
the first protective film is formed through a firing process,
the resist is removed by one or more steps selected from the firing step and the organic stripping step.
18. The method of manufacturing a thermal print head according to any one of claims 10 to 17, wherein:
the main surface of the heating resistor on the side where the second protective film is provided has a concave curved surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-068352 | 2021-04-14 | ||
| JP2021068352A JP2022163429A (en) | 2021-04-14 | 2021-04-14 | Thermal print head and manufacturing method of the same and thermal printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115195304A true CN115195304A (en) | 2022-10-18 |
Family
ID=83574648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210383281.8A Pending CN115195304A (en) | 2021-04-14 | 2022-04-13 | Thermal print head, method of manufacturing the same, and thermal printer |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2022163429A (en) |
| CN (1) | CN115195304A (en) |
-
2021
- 2021-04-14 JP JP2021068352A patent/JP2022163429A/en active Pending
-
2022
- 2022-04-13 CN CN202210383281.8A patent/CN115195304A/en active Pending
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| Publication number | Publication date |
|---|---|
| JP2022163429A (en) | 2022-10-26 |
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