CN115188917A - Packaging process of OLED panel - Google Patents
Packaging process of OLED panel Download PDFInfo
- Publication number
- CN115188917A CN115188917A CN202210883981.3A CN202210883981A CN115188917A CN 115188917 A CN115188917 A CN 115188917A CN 202210883981 A CN202210883981 A CN 202210883981A CN 115188917 A CN115188917 A CN 115188917A
- Authority
- CN
- China
- Prior art keywords
- inorganic fiber
- fiber film
- frit
- glue
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012858 packaging process Methods 0.000 title claims description 6
- 239000003292 glue Substances 0.000 claims abstract description 43
- 239000012784 inorganic fiber Substances 0.000 claims abstract description 36
- 239000010410 layer Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000005357 flat glass Substances 0.000 claims abstract description 17
- 230000008569 process Effects 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007711 solidification Methods 0.000 claims abstract description 5
- 230000008023 solidification Effects 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 4
- 239000012790 adhesive layer Substances 0.000 claims abstract description 3
- 239000006059 cover glass Substances 0.000 claims description 7
- 239000001856 Ethyl cellulose Substances 0.000 claims description 3
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical group CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 3
- 229920001249 ethyl cellulose Polymers 0.000 claims description 3
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 230000000903 blocking effect Effects 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 30
- 238000005516 engineering process Methods 0.000 description 4
- 229920001621 AMOLED Polymers 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
An encapsulation process of an OLED panel, comprising: providing a cover plate glass; plating an inorganic fiber film on the frame glue coating area on the upper surface of the cover plate glass; coating Frit glue on the inorganic fiber film layer; the Frit glue is solidified, the melting point of the inorganic fiber film is lower than or equal to the solidification temperature of the Frit glue, and the inorganic fiber film is melted with the glue material in the solidification process of the Frit glue; and providing laser light above the cover plate glass, wherein the laser light penetrates through the cover plate glass to heat and solidify the Frit adhesive layer, and thus the packaged panel is obtained. According to the invention, the inorganic fiber film is additionally arranged on the cover plate glass, so that the saddle shape of the Frit glue is improved, and the Frit glue can be fused with the Frit glue; the method is favorable for improving the laser packaging effect, thereby improving the water and oxygen blocking capability of the OLED product and effectively prolonging the service life of the OLED.
Description
Technical Field
The invention belongs to the technical field of display devices, and particularly relates to an OLED panel packaging process.
Background
In recent years, active-matrix Organic Light Emitting Diode (AMOLED) displays have been sought by the international display industry because of their advantages of self-luminescence, wide viewing angle, short response time, high luminous efficiency, wide color gamut, and low operating voltage.
As for OLED encapsulation technology of rigid panels, there are Frit (glass paste), thin Film Encapsulation (TFE), dam and Filler, etc. encapsulation technologies. The common use of the rigid AMOLED is Frit packaging, and the manufacturing process comprises the steps of printing a layer of Frit glue on cover plate glass, baking to form dry glue, pressing the dry glue with a TFT backboard, and sintering the Frit glue by using a laser welding technology, so that the cover plate is attached to the backboard to form a tight packaging effect and prevent the invasion of water and oxygen.
In the Frit packaging process, the morphology of Frit glue directly affects the laser packaging effect, and if defects exist in the morphology (for example, a saddle shape, as shown in fig. 1), the packaging life is shortened, and even the packaging fails, so that the problems of water and oxygen intrusion, failure of an OLED device and the like are caused.
Disclosure of Invention
The invention aims to provide an OLED panel packaging process for improving Frit glue.
The invention is realized in the following way:
an encapsulation process of an OLED panel comprises the following steps:
the method comprises the following steps: providing a cover plate glass;
step two: plating an inorganic fiber film on the frame glue coating area on the upper surface of the cover plate glass;
step three: coating Frit glue on the inorganic fiber film layer;
step four: the Frit glue is solidified, the melting point of the inorganic fiber film is lower than or equal to the solidification temperature of the Frit glue, and the inorganic fiber film is melted with the glue material in the process of solidifying the Frit glue;
step five: and providing laser light above the cover plate glass, and enabling the laser light to penetrate through the cover plate glass to heat and solidify the Frit adhesive layer to obtain the packaged panel.
In the second step, the inorganic fiber film is plated on the upper surface of the cover glass by PVD or CVD.
Further, the inorganic fiber film is ethyl cellulose or the like.
Further, the shape of the film layer of the inorganic fiber film is consistent with the shape of the Frit glue coating.
Further, the shape of the film layer of the inorganic fiber film is in a grid shape.
Further, the shape of the film layer of the inorganic fiber film is a square grid shape.
Further, the thickness of the film layer of the inorganic fiber film is 300-400nm.
Further, the width of the film layer of the inorganic fiber film is 100-300um larger than the design value of the width of the Frit glue.
The invention has the advantages that: according to the invention, the inorganic fiber film is additionally arranged on the cover plate glass, so that the appearance of the saddle-shaped rubber of the Frit rubber is improved, and the Frit rubber can be fused with the Frit rubber; the method is favorable for improving the laser packaging effect, thereby improving the water and oxygen blocking capability of the OLED product and effectively prolonging the service life of the OLED.
Drawings
The invention will be further described with reference to the following examples with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of an OLED panel of the prior art.
FIG. 2 is a schematic structural view of the cover glass according to the present invention coated with an inorganic fiber layer.
Fig. 3 is a top view of fig. 2.
Fig. 4 is a schematic diagram of the optimized morphology process of the inorganic fiber layer coated with Frit glue.
Fig. 5 is a schematic structural diagram of a fiber membrane fused with a rubber material in the Frit curing process.
Reference numerals are as follows:
110. cover glass 120, inorganic fiber film 130, frit glue 140, OLED light emitting area
Detailed Description
As shown in fig. 1 to 5, an encapsulation process of an OLED panel includes the following steps:
the method comprises the following steps: providing a cover glass 110;
step two: coating a layer of inorganic fiber film 120 on the frame glue coating area on the upper surface of the clean blank cover plate glass 110 by using a PVD (physical vapor deposition) or CVD (chemical vapor deposition) technology; the film can be ethyl cellulose and the like, has similar and compatible properties with the Frit glue material, the shape of the film layer is consistent with the coating shape of the Frit glue 130 according to the product design, the film layer is square in the embodiment, but the film layer does not only comprise the square in the specific practice, the film layer is in a grid shape but is not limited to the square grid shown in the embodiment, the thickness of the film layer is controlled to be 300-400nm, and the width of the film layer is larger than the design value of the Frit glue, namely 100-300 mu m;
step three: coating Frit glue 130 on the inorganic fiber film layer 120; due to the attraction of the fiber, the Frit rubber 130 is attracted to two sides, so that the appearance of the rubber is optimized;
step four: the Frit glue 130 is cured, the melting point of the inorganic fiber film 120 is lower than or equal to the curing temperature of the Frit glue, and the inorganic fiber film is melted with the glue material in the curing process of the Frit glue;
step five: providing laser light above the cover glass 110, wherein the laser light penetrates through the cover glass 110 to heat and cure the Frit glue layer 130, and obtaining the packaged panel.
According to the invention, the inorganic fiber film 120 is additionally arranged on the cover plate glass 110, so that the saddle-shaped appearance of the Frit rubber 130 is improved, and the Frit rubber 130 can be fused; the method is favorable for improving the laser packaging effect, thereby improving the water and oxygen blocking capability of the OLED product and effectively prolonging the service life of the OLED.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The packaging process of the OLED panel is characterized in that: the method comprises the following steps:
the method comprises the following steps: providing a cover plate glass;
step two: coating a layer of inorganic fiber film on the frame glue coating area on the upper surface of the cover plate glass;
step three: coating Frit glue on the inorganic fiber film layer;
step four: the Frit glue is solidified, the melting point of the inorganic fiber film is lower than or equal to the Frit glue solidification temperature, and the inorganic fiber film is fused with the glue material in the Frit glue solidification process;
step five: and providing laser light above the cover plate glass, wherein the laser light penetrates through the cover plate glass to heat and solidify the Frit adhesive layer, and thus the packaged panel is obtained.
2. The encapsulation process for an OLED panel according to claim 1, wherein: in the second step, the inorganic fiber film is plated on the upper surface of the cover glass by using a PVD or CVD mode.
3. The process of claim 1, wherein: the inorganic fiber film is ethyl cellulose or the like.
4. The process of claim 1 for encapsulating an OLED panel, wherein: the shape of the film layer of the inorganic fiber film is consistent with the shape of the coating of Frit glue.
5. The process of claim 1, wherein the step of encapsulating the OLED panel comprises: the shape of the film layer of the inorganic fiber film is in a grid shape.
6. The process of claim 1, wherein the step of encapsulating the OLED panel comprises: the shape of the film layer of the inorganic fiber film is square grid shape.
7. The process of claim 1, wherein the step of encapsulating the OLED panel comprises: the thickness of the film layer of the inorganic fiber film is 300-400nm.
8. The process of claim 1, wherein the step of encapsulating the OLED panel comprises: the width of the film layer of the inorganic fiber film is 100-300 mu m larger than the design value of the width of the Frit glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210883981.3A CN115188917B (en) | 2022-07-26 | 2022-07-26 | OLED panel packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210883981.3A CN115188917B (en) | 2022-07-26 | 2022-07-26 | OLED panel packaging technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115188917A true CN115188917A (en) | 2022-10-14 |
| CN115188917B CN115188917B (en) | 2024-06-14 |
Family
ID=83521312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210883981.3A Active CN115188917B (en) | 2022-07-26 | 2022-07-26 | OLED panel packaging technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115188917B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013104604A1 (en) * | 2013-05-06 | 2014-11-20 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic assembly and optoelectronic assembly |
| CN104393186A (en) * | 2014-10-16 | 2015-03-04 | 京东方科技集团股份有限公司 | Thin-film device and packaging method, and display apparatus |
| CN110364642A (en) * | 2019-05-29 | 2019-10-22 | 福建华佳彩有限公司 | Display device packaging technology |
| CN113809274A (en) * | 2021-10-21 | 2021-12-17 | 福建华佳彩有限公司 | Screen plate for improving Frit glue depression and screen plate manufacturing method |
| CN114039019A (en) * | 2021-11-08 | 2022-02-11 | 福建华佳彩有限公司 | Frit packaging method and device |
-
2022
- 2022-07-26 CN CN202210883981.3A patent/CN115188917B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013104604A1 (en) * | 2013-05-06 | 2014-11-20 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic assembly and optoelectronic assembly |
| CN104393186A (en) * | 2014-10-16 | 2015-03-04 | 京东方科技集团股份有限公司 | Thin-film device and packaging method, and display apparatus |
| CN110364642A (en) * | 2019-05-29 | 2019-10-22 | 福建华佳彩有限公司 | Display device packaging technology |
| CN113809274A (en) * | 2021-10-21 | 2021-12-17 | 福建华佳彩有限公司 | Screen plate for improving Frit glue depression and screen plate manufacturing method |
| CN114039019A (en) * | 2021-11-08 | 2022-02-11 | 福建华佳彩有限公司 | Frit packaging method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115188917B (en) | 2024-06-14 |
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