CN115182009A - Bright nickel-tungsten alloy plating solution and preparation process of corrosion-resistant multilayer plating layer - Google Patents

Bright nickel-tungsten alloy plating solution and preparation process of corrosion-resistant multilayer plating layer Download PDF

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CN115182009A
CN115182009A CN202210809720.7A CN202210809720A CN115182009A CN 115182009 A CN115182009 A CN 115182009A CN 202210809720 A CN202210809720 A CN 202210809720A CN 115182009 A CN115182009 A CN 115182009A
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nickel
tungsten alloy
plating solution
layer
bright
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CN115182009B (en
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刘永林
姚建军
徐国福
赵景才
夏小勇
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Yuyao Edson Electroplating Technology Co ltd
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Yuyao Edson Electroplating Technology Co ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00Electrolytic coating other than with metals
    • C25D9/04Electrolytic coating other than with metals with inorganic materials
    • C25D9/06Electrolytic coating other than with metals with inorganic materials by anodic processes

Abstract

The invention relates to a bright nickel-tungsten alloy plating solution and a preparation process of a corrosion-resistant multilayer plating layer, wherein the bright nickel-tungsten alloy plating solution mainly comprises the following components: nickel sulfate, sodium tungstate, trisodium citrate, ammonium chloride, potassium bromide, a ligand and a brightening agent; wherein the concentration of each component is as follows: 35-40g/L of nickel sulfate, 95-100g/L of sodium tungstate, 90-95g/L of trisodium citrate, 25-29g/L of ammonium chloride and 26-30g/L of potassium bromide; the ligand is potassium pyrophosphate, and the addition amount of the ligand is 30-40g/L; the brightener is butynediol monopropoxy ether, the addition amount of the brightener is 0.02-0.04g/L, the nickel-tungsten alloy coating prepared by the plating solution is compact, bright and high in corrosion resistance, the electrochemical polarization in the coating process can be improved, the crystal grains can be refined, the leveling capability of the plating solution can be optimized, and the brightness of the coating can be improved; meanwhile, the preparation process of the corrosion-resistant multilayer plating layer is provided under the condition of more strict corrosion resistance requirement.

Description

Bright nickel-tungsten alloy plating solution and preparation process of corrosion-resistant multilayer plating layer
Technical Field
The invention belongs to the field of nickel-tungsten alloy electroplating, and particularly relates to a bright nickel-tungsten alloy plating solution and a preparation process of a corrosion-resistant multilayer plating layer.
Background
The nickel-tungsten alloy plating layer is usually used as one of substitutes of a chromium plating layer due to higher hardness and wear resistance, so that the pollution of hexavalent chromium to the environment and the damage to human bodies are avoided; in addition, the nickel-tungsten alloy plating layer has compact structure and higher corrosion resistance, and particularly, under the condition of higher requirement on nitric acid steam, the general nickel plating layer and the high-phosphorus nickel plating layer are difficult to resist the corrosion of the nitric acid steam, so the nickel-tungsten alloy plating layer is also widely applied to the electroplating field with higher requirement on corrosion resistance.
The nickel-tungsten alloy plating solution mainly comprises nickel salt, tungsten salt, complexing agent and pH regulator, wherein the nickel salt is generally nickel sulfate or nickel sulfamate, the tungsten salt is sodium tungstate, and the complexing agent is trisodium citrate or potassium sodium tartrate. Because sodium tungstate can form precipitated tungstic acid under an acidic condition, the nickel-tungsten alloy plating solution is usually alkaline, and a nickel-tungsten alloy coating prepared by the commercial and reported nickel-tungsten alloy plating solutions is generally dark nickel in color and does not have the characteristics of brightness, leveling and grain refinement, so that the coating appearance cannot meet the requirements of products with higher appearance requirements; in addition, for products with severe requirements on corrosion resistance, for example, a nitric acid vapor resistance test and a salt spray test are required, and under the condition that the two tests are carried out for a long time, a single plating layer is difficult to meet the requirements, so that a multi-layer plating layer combination process is required.
Disclosure of Invention
The invention provides a bright nickel-tungsten alloy plating solution and a preparation process of a corrosion-resistant multilayer plating layer, which can improve electrochemical polarization in the plating layer process, refine crystal grains, optimize leveling capability of the plating solution and improve brightness of the plating layer; meanwhile, the preparation process of the corrosion-resistant multilayer plating layer is provided under the condition of more strict corrosion resistance requirement.
The invention firstly provides a bright nickel-tungsten alloy plating solution, which specifically comprises the following raw materials: trisodium citrate, sodium tungstate, ammonium chloride, potassium bromide, nickel sulfate, potassium pyrophosphate, ammonia water and a brightening agent, wherein the concentration of each component is as follows: 35-40g/L of nickel sulfate, 95-100g/L of sodium tungstate, 90-95g/L of trisodium citrate, 25-29g/L of ammonium chloride, 26-30g/L of potassium bromide and 3-5L of ammonia water; the ligand is potassium pyrophosphate, and the addition amount of the ligand is 30-40g/L; the addition amount of the brightener is 0.02-0.04g/L.
Adopt above-mentioned technical scheme: on the basis of the basic components of the existing alkaline nickel-tungsten alloy plating solution, by adding ligand potassium pyrophosphate, the potassium pyrophosphate is hydrolyzed into potassium phosphate in acid or alkali solution and is mixed with water to form a viscous slurry body, the integral viscoelasticity is greatly improved, the plating solution is stable, the decomposition products are reduced, the service life of the plating solution is prolonged, and the working load of treating the bath solution is reduced.
Preferably, the brightener is butynediol monopropoxy ether.
Adopt above-mentioned technical scheme: the electrochemical polarization is improved, the crystal grains are refined, the leveling capability of the plating solution is optimized, and the brightness of the plating layer is improved.
Preferably, the formulation comprises the steps of:
A. dissolving a certain amount of trisodium citrate in pure water at 60 ℃;
B. then adding a certain amount of sodium tungstate, and completely dissolving;
C. then adding a certain amount of ammonium chloride and potassium bromide, and completely dissolving;
D. adding a certain amount of nickel sulfate and completely dissolving;
E. adding a certain amount of potassium pyrophosphate and completely dissolving;
F. adjusting the pH value by ammonia water;
G. finally, a certain amount of brightener is added.
Preferably, the pH value of the plating solution is controlled to be 7.5-8.
Adopt above-mentioned technical scheme: the pH value of the plating solution is optimized, and the optimal plating environment is provided.
Preferably, the temperature of the plating solution is controlled to be 60-65 ℃.
Adopt above-mentioned technical scheme: the temperature range of the plating solution is optimized, and the optimal plating environment is provided.
Preferably, the cathodic current density during electroplating of the bathIs 1-15A/dm 2
Adopt above-mentioned technical scheme: the cathode current density range of the plating solution is optimized, and the optimal plating environment is further provided.
The invention also provides a preparation process of the corrosion-resistant multilayer coating, which adopts the bright nickel-tungsten alloy plating solution, wherein the surface of a plated part is plated with nickel-tungsten alloy/nickel aminosulfonate/high-phosphorus nickel in sequence from inside to outside, the nickel-tungsten alloy is plated as a bottom layer, the bright nickel-tungsten alloy plating solution is adopted for coating, the nickel aminosulfonate is used as an intermediate layer, the sulfamic acid plating solution is adopted for coating, the high-phosphorus nickel is used as an outermost layer, and the high-phosphorus nickel plating solution is adopted for coating.
Adopt above-mentioned technical scheme: by adopting the combination of the three nickel plating layers and the cooperation of the bright nickel-tungsten alloy plating solution, the best corrosion resistant effect can be achieved, and the method is suitable for the dual test requirements of a long-time salt spray test and a long-time nitric acid steam test.
Preferably, the thickness of the bottom layer nickel-tungsten alloy plating layer is 0.5-1.5 μm, the thickness of the middle layer nickel sulfamate plating layer is 1-2 μm, and the thickness of the outermost layer high-phosphorus nickel plating layer is 1-2 μm.
Adopt above-mentioned technical scheme: the combined thickness of the three nickel plating layers is optimized to achieve the best corrosion resistant effect.
Preferably, the sulfamic acid plating solution comprises 550-600g/L of nickel sulfamic acid, 5-15g/L of nickel chloride, 35-50g/L of boric acid and 30-35ml/L of additive MP200 (SE), and the plating environment is as follows: pH value of 3.2-4.0, temperature of 55-65 deg.C, cathode current density of 2-60A/dm 2
Adopt above-mentioned technical scheme: the components of the raw materials for electroplating the nickel sulfamate layer are optimized, and the quality of the finished product after plating is improved.
Preferably, the high-phosphorus nickel plating solution comprises 436-660g/L of nickel sulfate, 7-27g/L of nickel chloride, 30-40g/L of boric acid and 100-150ml/L of additive EP-M, and the plating environment is as follows: pH value of 1.0-1.5, temperature of 50-70 deg.C, cathode current density of 1-40A/dm 2
Adopt above-mentioned technical scheme: the components of the electroplating raw material of the high-phosphorus nickel layer are optimized, and the quality of the finished product after plating is improved.
Advantageous effects
The invention provides a bright nickel-tungsten alloy plating solution and a preparation process of a corrosion-resistant multilayer plating layer. The method has the following beneficial effects:
1. on the basis of basic components of the existing alkaline nickel-tungsten alloy plating solution, the invention adds the ligand potassium pyrophosphate to stabilize the plating solution, reduce decomposition products, prolong the service life of the plating solution and reduce the working load of bath solution treatment; by adding a brightener butynediol monopropoxy ether, the electrochemical polarization is improved, crystal grains are refined, the leveling capability of a plating solution is optimized, and the brightness of a plating layer is improved;
2. the invention also provides a preparation process of the corrosion-resistant multilayer coating, wherein the surface of a plated part is sequentially plated with nickel-tungsten alloy/nickel aminosulfonate/high-phosphorus nickel from inside to outside, and the bright nickel-tungsten alloy plating solution can achieve the best corrosion-resistant effect by adopting the combination of the three nickel coatings and matching with the nickel-tungsten alloy plating solution, thereby being suitable for the double test requirements of a salt spray test and a nitric acid steam test for a longer time.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
According to some embodiments of the present description, a bright nickel tungsten alloy plating solution is provided. The bright nickel-tungsten alloy plating solution comprises the following raw materials: trisodium citrate, sodium tungstate, ammonium chloride, potassium bromide, nickel sulfate, potassium pyrophosphate, ammonia water and a brightening agent, wherein the concentration of each component is as follows: 35-40g/L of nickel sulfate, 95-100g/L of sodium tungstate, 90-95g/L of trisodium citrate, 25-29g/L of ammonium chloride, 26-30g/L of potassium bromide and 3-5L of ammonia water. Potassium pyrophosphate is a ligand, and the addition amount of the potassium pyrophosphate is 30-40g/L; the brightener is butynediol monopropoxy ether, and the addition amount of the brightener is 0.02-0.04g/L. The nickel-tungsten alloy plating layer prepared by the plating solution has high compactness, brightness and corrosion resistance. On the basis of the basic components of the existing alkaline nickel-tungsten alloy plating solution, the ligand potassium pyrophosphate is added, so that the plating solution is stable, the decomposition products are reduced, the service life of the plating solution is prolonged, and the working load of treating the bath solution is reduced; by adding the brightener butynediol monopropoxy ether, the electrochemical polarization is improved, the crystal grains are refined, the leveling capability of the plating solution is optimized, and the brightness of the plating layer is improved.
The preparation of the bright nickel-tungsten alloy plating solution comprises the following steps:
A. dissolving a certain amount of trisodium citrate in pure water at 60 ℃;
B. then adding a certain amount of sodium tungstate, and completely dissolving;
C. then adding a certain amount of ammonium chloride and potassium bromide, and completely dissolving;
D. adding a certain amount of nickel sulfate and completely dissolving;
E. adding a certain amount of potassium pyrophosphate and completely dissolving;
F. adjusting the pH value by ammonia water;
G. finally, a certain amount of brightener is added.
Wherein, the temperature in the electroplating process of the bright nickel-tungsten alloy plating solution is preferably 60-65 ℃, the electroplating deposition efficiency is higher under the condition, and the loss and the aging of the plating solution are smaller; the cathode current density in the electroplating process of the bright nickel-tungsten alloy plating solution is preferably 1-15A/dm2, the plating layer is dense and bright in the current density range, when the current density is too low, the tungsten content in the formed nickel-tungsten alloy plating layer is reduced, the corrosion resistance of the plating layer is reduced, and when the current density is too high, the nickel-tungsten alloy plating layer is easy to scorch.
The invention also provides a preparation process of the corrosion-resistant multilayer coating, wherein the surface of a plated part is electroplated with nickel-tungsten alloy/nickel sulfamate layer/high-phosphorus nickel from inside to outside in sequence, and the preparation process specifically comprises the following steps:
A. the bright nickel-tungsten alloy plating layer is prepared according to the process conditions by adopting the bright nickel-tungsten alloy plating solution for the bottom layer of the plating layer so as to improve the compactness and the corrosion resistance of the bottom layer to protect the base material.
B. The middle layer of the plating layer is a nickel sulfamic acid plating layer, and the nickel sulfamic acid plating solution comprises the following components in parts by weight: 550-600g/L of nickel sulfamate, 5-15g/L of nickel chloride, 35-50g/L of boric acid, 30-35ml/L of additive MP200 (SE), 3.2-4.0 of pH value, 55-65 ℃ of temperature and 2-60A/dm < 2 > of cathode current density, and the nickel sulfamate plating solution and process parameters are adopted to prepare an intermediate nickel layer so as to reduce plating stress and improve plating covering capacity.
C. The outermost layer of the coating is a high-phosphorus nickel coating, and the high-phosphorus nickel plating solution comprises the following components: 436-660g/L of nickel sulfate, 7-27g/L of nickel chloride, 30-40g/L of boric acid, 100-150ml/L of additive EP-M, 1.0-1.5 of pH value, 50-70 ℃ of temperature and 1-40A/dm < 2 > of cathode current density, and the high-phosphorus nickel plating solution and the process parameters are adopted to prepare the high-phosphorus nickel plating layer so as to improve the salt mist corrosion resistance of a plated part.
According to the preparation process of the corrosion-resistant multilayer coating, the thickness of the bottom layer nickel-tungsten alloy coating is 0.5-1.5 mu m, the thickness of the middle layer nickel sulfamate coating is 1-2 mu m, and the thickness of the outermost layer high-phosphorus nickel coating is 1-2 mu m. By adopting the combination of the three nickel plating layers and the combination of the bright nickel-tungsten alloy plating solution, the best corrosion resistant effect can be achieved, and the method is suitable for the double test requirements of a salt spray test and a nitric acid steam test for a longer time.
Examples 1 to 10
The preparation method of the bright nickel-tungsten alloy plating solution comprises the following steps:
trisodium citrate CAS:68-04-2;
sodium tungstate; CAS:13472-45-2;
ammonium chloride; CAS:12125-02-9;
potassium bromide; CAS:7758-02-3;
nickel sulfate; CAS:7786-81-4;
potassium pyrophosphate; CAS:7320-34-5;
ammonia water; CAS:1336-21-6;
butynediol monopropoxy ether CAS:1606-79-7.
The preparation method comprises the following steps:
A. dissolving trisodium citrate in pure water at 60 ℃;
B. then adding sodium tungstate, and completely dissolving;
C. then adding ammonium chloride and potassium bromide, and completely dissolving;
D. adding nickel sulfate and completely dissolving;
E. adding potassium pyrophosphate and completely dissolving;
F. adjusting the pH value by ammonia water;
G. butynediol monopropoxy ether was added last.
The bright nickel-tungsten alloy plating solution is prepared by adopting the components in the following table 1, and the content unit is g/L.
TABLE 1
Figure BDA0003740201530000071
After the bright nickel-tungsten alloy plating solutions described in the above examples 1-10 were prepared, the pH was adjusted to 7.8 with ammonia, the temperature was raised to 60 ℃ with red copper as the base material and 3A/dm 2 And (3) electroplating with cathode current density for 5 minutes, wherein the thickness of the nickel-tungsten alloy coating is 2.6 mu m, the tungsten content is 45 percent, and bright nickel-tungsten alloy coating plated parts 1-10 with different coating specific components are obtained.
Comparative example 1
Comparative example 1 used a conventional nickel layer. The red copper base material is plated with nickel, and the plating layer is 2.6 μm thick and is used as a common nickel plating part 1.
Experiment 1
Comparing the bright nickel-tungsten alloy plating part 1-10 with the common nickel plating part 1, simultaneously placing the bright nickel-tungsten alloy plating part 1-10 into an evaporating dish with 65% -68% nitric acid in the bottom layer, suspending the plating part above nitric acid solution, and coating by being surrounded by nitric acid steam.
After 1 hour of nitric acid steam, the copper base material of the common nickel-plated part 1 is corroded, the nickel layer peels off, the bright nickel-tungsten alloy plated part 1-10 is relatively intact, and after 48 hours of nitric acid steam, the phenomena of peeling off and copper base material corrosion of the plated layer of the bright nickel-tungsten alloy plated part 1-10 are not found, so that the nickel-tungsten alloy plated layer prepared by the bright nickel-tungsten alloy plating solution is superior in nitric acid steam resistance. The results of experiment 1 confirm that the nitric acid vapor resistance of the plated article obtained from the bright nickel-tungsten alloy plating layer of example 5 is optimal.
Experiment 2
Adopting red copper substrate to electroplate multilayer cladding, the surface of plated item electroplates nickel-tungsten alloy/nickel aminosulfonate layer/high phosphorus nickel from inside to outside in proper order, specifically is:
(1) the bright nickel-tungsten alloy plating solution in the examples 1 to 10 is adopted, the pH value is 7.8, the stability is 60 ℃, red copper is used as a base material, electroplating is carried out by adopting 3A/dm2 cathode current density, the electroplating time is 1.5 minutes, the thickness of a nickel-tungsten alloy coating is 1.3 mu m, and the nickel-tungsten alloy coating is used as a bottom layer;
(2) then in sulfamic acid plating solution (nickel sulfamic acid 580g/L, nickel chloride 10g/L, boric acid 45g/L, additive MP200 ml/L), pH value is 3.8, temperature is 60 ℃, cathode current density is 3A/dm2, electroplating time is 2 minutes, and thickness of nickel layer is 1.7 μm, thus being an intermediate nickel layer;
(3) finally, in a high-phosphorus nickel plating solution (nickel sulfate 500g/L, nickel chloride 17 g/L, boric acid 35g/L, additive EP-M100 ml/L), the pH value is 1.2, the temperature is 60 ℃, the cathode current density is 2A/dm < 2 >, the electroplating time is 3 minutes, the thickness of a nickel layer is 1.1 mu M, and the nickel layer is taken as the outermost layer, thereby obtaining the plated part 11-20 with three layers of plating layers.
Placing the plated parts 11-20 in a neutral salt spray test box, wherein after 500 hours, the plated parts do not show the phenomena of peeling and peeling of the plating layers of the bright nickel-tungsten alloy plating layer three-layer plated part and corrosion of a copper substrate, so that the electroplated nickel-tungsten alloy/nickel sulfamate layer/high-phosphorus nickel combined plating layer has better salt spray resistance; and the common nickel-plated part 1 is placed in a neutral salt spray test box, and salt spray test for 48 hours shows that the plating layer of the plated part peels off and the copper substrate is seriously corroded. The results of experiment 2 confirm that the plated article with three layers of plating layers obtained by the bright nickel-tungsten alloy plating layer of example 5 has the best salt spray resistance.
The foregoing shows and describes the general principles and features of the present invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, and such changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (10)

1. The bright nickel-tungsten alloy plating solution is characterized by comprising the following raw materials: trisodium citrate, sodium tungstate, ammonium chloride, potassium bromide, nickel sulfate, potassium pyrophosphate, ammonia water and a brightening agent, wherein the concentration of each component is as follows: 35-40g/L of nickel sulfate, 95-100g/L of sodium tungstate, 90-95g/L of trisodium citrate, 25-29g/L of ammonium chloride, 26-30g/L of potassium bromide and 3-5L of ammonia water; the ligand is potassium pyrophosphate, and the addition amount of the ligand is 30-40g/L; the addition amount of the brightener is 0.02-0.04g/L.
2. The bright nickel tungsten alloy plating bath according to claim 1, wherein the brightener is butynediol monopropoxy ether.
3. The bright nickel-tungsten alloy plating solution according to claim 1, wherein the preparation comprises the following steps:
A. dissolving a certain amount of trisodium citrate in pure water at 60 ℃;
B. then adding a certain amount of sodium tungstate, and completely dissolving;
C. then adding a certain amount of ammonium chloride and potassium bromide, and completely dissolving;
D. adding a certain amount of nickel sulfate and completely dissolving;
E. adding a certain amount of potassium pyrophosphate and completely dissolving;
F. adjusting the pH value by ammonia water;
G. finally, a certain amount of brightener is added.
4. The bright nickel tungsten alloy plating solution according to claim 1, characterized in that the pH of the plating solution is controlled between 7.5 and 8.
5. The bright nickel tungsten alloy plating solution according to claim 1, wherein the temperature of the plating solution is controlled to be 60-65 ℃.
6. The bright nickel tungsten alloy plating bath according to claim 1, characterized in that the cathodic current density during electroplating of said bath is 1-15A/dm 2
7. A preparation process of a corrosion-resistant multilayer coating adopts the bright nickel-tungsten alloy plating solution in claim 1, and is characterized in that the surface of a plated part of the preparation process of the corrosion-resistant multilayer coating is plated with nickel-tungsten alloy/nickel aminosulfonate/high-phosphorus nickel in sequence from inside to outside, the nickel-tungsten alloy is plated as a bottom layer, the bright nickel-tungsten alloy plating solution is adopted for plating, the nickel aminosulfonate is an intermediate layer, the sulfamic acid plating solution is adopted for plating, the high-phosphorus nickel is an outermost layer, and the high-phosphorus nickel plating solution is adopted for plating.
8. The process of claim 7, wherein the thickness of the bottom layer nickel-tungsten alloy plating layer is 0.5-1.5 μm, the thickness of the middle layer nickel sulfamate plating layer is 1-2 μm, and the thickness of the outermost layer high-phosphorus nickel plating layer is 1-2 μm.
9. The process for preparing a corrosion-resistant multilayer coating according to claim 7, wherein the sulfamic acid plating solution comprises 550-600g/L of nickel sulfamic acid, 5-15g/L of nickel chloride, 35-50g/L of boric acid and 30-35ml/L of additive MP200 (SE), and the coating environment is as follows: pH of 3.2-4.0, temperature of 55-65 deg.C, cathode current density of 2-60A/dm 2
10. The process for preparing a corrosion-resistant multilayer coating according to claim 7, wherein the high-phosphorus nickel plating solution comprises 436-660g/L of nickel sulfate, 7-27g/L of nickel chloride, 30-40g/L of boric acid and 100-150ml/L of additive EP-M, and the coating environment is as follows: pH value of 1.0-1.5, temperature of 50-70 deg.C, cathode current density of 1-40A/dm 2
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