JPS616291A - Plating method of nickel-tungsten alloy - Google Patents

Plating method of nickel-tungsten alloy

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Publication number
JPS616291A
JPS616291A JP12536984A JP12536984A JPS616291A JP S616291 A JPS616291 A JP S616291A JP 12536984 A JP12536984 A JP 12536984A JP 12536984 A JP12536984 A JP 12536984A JP S616291 A JPS616291 A JP S616291A
Authority
JP
Japan
Prior art keywords
nickel
bath
plating
tungsten
ammonia
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12536984A
Other languages
Japanese (ja)
Inventor
Koji Takada
高田 幸路
Norishige Sawada
沢田 徳重
Shozo Mori
森 正造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAKADA KENKYUSHO KK
TEIKOKU KUROMU KK
Original Assignee
TAKADA KENKYUSHO KK
TEIKOKU KUROMU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAKADA KENKYUSHO KK, TEIKOKU KUROMU KK filed Critical TAKADA KENKYUSHO KK
Priority to JP12536984A priority Critical patent/JPS616291A/en
Publication of JPS616291A publication Critical patent/JPS616291A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE:To execute electrodeposition of an Ni-W alloy contg. W at a high rate by using a bath prepd. by adding a specific amt. of citric acid and aq. ammonia to a plating bath contg. nickel sulfamate and sodium tungstate and executing electrolysis under specific conditions. CONSTITUTION:The citric acid of the equiv. of the molar number of Ni and W in total or above is added to the plating bath into which Ni is incorporated at 0.2-0.4M/l in the form of nickel sulfamate and W at 0.2-0.4M/l in the form of sodium tungstate. The aq. ammonia is added to such soln. and the pH is adjusted to 6-7. The electrolysis is executed by using such plating bath at 60- 80 deg.C bath temp. and 10-30A/dm<2> cathode current density. The industrial plating of the Ni-W alloy having high film hardness is made possible at a high rate of about >=40% concn. of W by the above-mentioned method.

Description

【発明の詳細な説明】 本発明はタングステンを40〜50%含有するニッケル
−タングステン合金のメッキ方法に係るものである。従
来ニッケル−タングステン合金メツキラ得るメッキ浴は
硫酸ニッケル、タングステン酸ナトリウム及びクエン酸
塩を含むアンモニアアルカリ性の浴でpH8〜9の浴が
公知であった。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of plating a nickel-tungsten alloy containing 40 to 50% tungsten. Conventionally, the plating bath for producing a nickel-tungsten alloy has been known to be an ammonia alkaline bath containing nickel sulfate, sodium tungstate and citrate, and having a pH of 8 to 9.

例えばべ、エム、ヴヤチェスラヴオフの著書新しい合金
メッキ法の171頁によればニッケル   13g//
117硫酸ニッケルとして添加クエン酸ナトリウム  
200g/l 塩化アンモニウム    50g/l 陰極電流密度     20A/dm”浴温     
     90℃ の浴から83%以下のタングステンを含むニッケル−タ
ングステン合金メッキが得られると記述されている。
For example, according to page 171 of the book New Alloy Plating Method by B. M. Vyacheslavov, nickel 13g//
Sodium citrate added as 117 nickel sulfate
200g/l Ammonium chloride 50g/l Cathode current density 20A/dm” Bath temperature
It is stated that a nickel-tungsten alloy plating containing up to 83% tungsten can be obtained from a 90°C bath.

しかしこの様にpH8〜9のアンモニアアルカリ性の浴
は浴温か70℃以上の高温浴に於いては、著しくアンモ
ニア臭を発し作業環境を害し実用上極めて不便であるば
かりでなくアンモニアの蒸発により浴組成が変化し不安
定となる欠点があり、又40%以上のタングステンを含
む合金メッキが得難いことが本発明者の追試によって確
められた。本発明者は作業中アンモニア臭を発するとと
々く、且つ浴組成が安定な浴で、特にタングステンを4
0%以上の高率で含有するニッケル−タングステン合金
を電着し得るメッキ浴を追求し鋭意研究した結果、ニッ
ケルを硫酸塩の代すにスルファミン酸塩の形で浴に添加
するときはpHを6〜7の中性で、作業中アンモニア臭
を発生せず且つタングステンを40〜50%の高率で含
有するニッケル−タングステン合金を電着する実用的な
メッキ浴が得られることを発見して本発明を完成させた
のである。
However, when an ammonia-alkaline bath with a pH of 8 to 9 is used at a high temperature of 70°C or higher, it not only emits a marked ammonia odor, harms the working environment, and is extremely inconvenient in practice, but also causes the bath to evaporate due to ammonia evaporation. The inventor of the present invention has confirmed through follow-up experiments that there is a drawback that the tungsten changes and becomes unstable, and that it is difficult to obtain an alloy plating containing 40% or more of tungsten. The inventor of the present invention uses a bath that frequently emits ammonia odor during work and has a stable bath composition, especially tungsten.
As a result of intensive research in pursuit of a plating bath capable of electrodepositing a nickel-tungsten alloy containing a high percentage of 0% or more, we found that when adding nickel to the bath in the form of sulfamate instead of sulfate, the pH should be adjusted. It was discovered that it is possible to obtain a practical plating bath for electrodepositing a nickel-tungsten alloy that is neutral in the range of 6 to 7, does not generate an ammonia odor during operation, and contains a high percentage of tungsten of 40 to 50%. The present invention was completed.

次に本発明の構成について説明すると、ニッケルはスル
ファミン酸ニッケk 、 Ni (NH2SO3)2・
4H20の形でメッキ浴に添加され、その濃度範囲:は
。、2〜0.4耽々アある。
Next, to explain the structure of the present invention, nickel is sulfamic acid nickel, Ni(NH2SO3)2.
It is added to the plating bath in the form of 4H20 and its concentration range: is. , 2 to 0.4 indulgences.

タングステンはタングステン酸ナトリウムNa2VJ0
4・2H20の形でメッキ浴に添加されその濃度範囲は
0.2〜0.4mal/lである。次にクエン酸はニッ
ケル及びタングステンの合計のモル数と当量以上を添加
する。この溶液にアンモニア水を添加してpHを6〜7
に調製したメッキ浴を用い、浴温60〜80℃にて陰極
電流密度10〜30 A/dm 2で電解することが本
発明の構成要件である。
Tungsten is sodium tungstate Na2VJ0
It is added to the plating bath in the form of 4.2H20 and its concentration ranges from 0.2 to 0.4 mal/l. Next, citric acid is added in an amount equivalent to or more than the total number of moles of nickel and tungsten. Add ammonia water to this solution to adjust the pH to 6-7.
A component of the present invention is to conduct electrolysis at a cathode current density of 10 to 30 A/dm 2 at a bath temperature of 60 to 80° C. using a plating bath prepared in the following manner.

陽極としてはニッケル陽極又は白金被覆チタン電極、ス
テンレス等の不溶性陽極を使用することが出来る。
As the anode, a nickel anode, a platinum-coated titanium electrode, or an insoluble anode made of stainless steel or the like can be used.

メッキ浴中の各成分の濃度範囲はスルファミン酸ニッケ
ル及びタングステン酸ナトリウム共に0.2〜0.4M
/lの範囲が必要で各々0.2M/l以下では作業中浴
組成が変化し易く安定した合金組成を得ることが難しく
なるので好ましくなく、又各々0.4M/1以上では浴
の粘度が高くなるので好ましくない。
The concentration range of each component in the plating bath is 0.2 to 0.4M for both nickel sulfamate and sodium tungstate.
A range of 0.2 M/l or less is not preferable because the bath composition tends to change during work and it becomes difficult to obtain a stable alloy composition. I don't like it because it's expensive.

クエン酸の濃度はニッケル及びタングステンの合計のモ
ル数と当モル以上であることが必要で、これ以下の濃度
では浴が不安定となるので好ましくない。
The concentration of citric acid must be equal to or higher than the total number of moles of nickel and tungsten; a concentration lower than this is not preferred because the bath becomes unstable.

浴のpHは6〜7の中性であることが必要でpH6以下
では電流効率が低下するので好ましく々く、又pH7以
上では作業中にアンモニア臭を発するので好ましくない
The pH of the bath must be neutral, between 6 and 7. If the pH is less than 6, the current efficiency will decrease, which is preferable, and if it is more than 7, an ammonia odor will be emitted during the operation, which is not preferable.

浴温は60〜80℃であることが必要で、60℃以下で
は電析物中のタングステンの含有率が40%以下になる
ので好ましくない。又80℃以上では浴中のクエン酸が
陽極酸化を受けて分解消耗するので好ましくない。電流
密度Pi IOA/dm2以下ではメッキ皮膜中のタン
グステン含有量が40%以下となるので好ましくなく、
又80AΔh2以上ではメッキ皮膜にクラックが生ずる
ので好ましくない。
The bath temperature needs to be 60 to 80°C; if it is below 60°C, the content of tungsten in the deposit will be below 40%, which is not preferable. Further, if the temperature exceeds 80°C, the citric acid in the bath undergoes anodic oxidation and is decomposed and consumed, which is not preferable. If the current density is less than Pi IOA/dm2, the tungsten content in the plating film will be less than 40%, which is not preferable.
Moreover, if it exceeds 80AΔh2, cracks will occur in the plating film, which is not preferable.

以上が本発明に於ける構成要件の理由の説明である。The above is an explanation of the reasons for the constituent elements of the present invention.

次に本発明の効果について説明する。Next, the effects of the present invention will be explained.

本発明によって得られるニッケル−タングステン合金メ
ッキはタングステンを40〜50重量%を含有する光沢
メッキが得られ、その硬度はHv 630〜780 テ
あり、400℃1時間の熱処理により硬度はHvlO0
0〜11ooとなり、600’C1時間の熱処理によh
 Hv 1200〜135oの高い硬度が得られる。
The nickel-tungsten alloy plating obtained by the present invention can be a bright plating containing 40 to 50% by weight of tungsten, and its hardness is Hv 630 to 780 Te, and after heat treatment at 400°C for 1 hour, the hardness is HvlO0.
0 to 11oo, and after heat treatment at 600'C for 1 hour, h
High hardness of Hv 1200-135o is obtained.

又耐酸性が優れておh、8NHC7の浸漬テストによる
と無電解ニッケルメッキの15〜20倍、硬質クロムメ
ッキの200倍の耐食性を示した。
It also has excellent acid resistance, and according to the 8NHC7 immersion test, it showed 15 to 20 times more corrosion resistance than electroless nickel plating and 200 times more than hard chrome plating.

上記の如き性質を有するニッケルータングステテン合金
メッキが本発明によるメッキ浴により極めて容易且つ工
業的に得られることが本発明者の研究によh実証された
The research conducted by the present inventors has demonstrated that nickel-tungstate alloy plating having the properties described above can be obtained extremely easily and industrially using the plating bath according to the present invention.

本発明によるニッケル−タングステン合金メッキは高温
度に於ける硬度が優れているのでガラスの金型のメッキ
に使用すると優れた耐久性と離型酸が得られる、又耐塩
酸性が優れているので、塩化水素の発生による腐蝕が問
題となる塩素化プラスチックの成型金型のメッキに応用
すると優れた効果があることが本発明者の研究により明
らかになった。
The nickel-tungsten alloy plating according to the present invention has excellent hardness at high temperatures, so when used for plating glass molds, excellent durability and mold release acid can be obtained.Also, since it has excellent hydrochloric acid resistance, The inventor's research has revealed that the present invention has an excellent effect when applied to plating molds for chlorinated plastics, where corrosion due to the generation of hydrogen chloride is a problem.

以上説明した様に本発明は工業的に極めて優れた効果を
発揮するものである。
As explained above, the present invention exhibits extremely excellent industrial effects.

次に実施例を挙げて説明する。Next, an example will be given and explained.

実施例1 スルファミン酸ニッケル   0.25M/lタングス
テン酸ナトリウム  0.25M/lクエン酸    
      0.5 M/lpH6,5(アンモニア水
にて調整) 上記のメッキ浴を用い浴温75℃にて、18−8ステン
レス板を陽極とし軟鋼板を陰極として陰極電流密度20
A/dmにて15分間電解して、膜厚25μの光沢のあ
るニッケル−タングステン合金メッキを得た。このメッ
キ層はEPMAによh定量分析を行ったところニッケル
58%、タングステン42%の組成であった。メッキ皮
膜の硬度けHV 680であわ、このものを600℃1
時間の熱処理を行ったところ硬度はHv1200を示し
だ。
Example 1 Nickel sulfamate 0.25M/l Sodium tungstate 0.25M/l citric acid
0.5 M/l pH 6.5 (adjusted with aqueous ammonia) Using the above plating bath at a bath temperature of 75°C, with an 18-8 stainless steel plate as an anode and a mild steel plate as a cathode, a cathode current density of 20
Electrolysis was carried out at A/dm for 15 minutes to obtain a shiny nickel-tungsten alloy plating with a thickness of 25 μm. Quantitative analysis of this plated layer by EPMA revealed that the composition was 58% nickel and 42% tungsten. The hardness of the plating film is HV 680, and this is heated to 600℃1.
After heat treatment for several hours, the hardness was 1200 Hv.

実施例2 スルファミン酸ニッケル   0.8 M/lタングス
テン酸ナトリウム  0.85M/lクエン酸    
      0.70M/lpH6,8(アンモニア水
にて調整) 浴温  78℃ 上記のメッキ浴を用いて、素材がSUS 403製のガ
ラス金型を陰極とし、ステンレス線を陽極として陰極電
流密度15A/dm2にて10分間メッキを行い約20
μの光沢ニッケル−タングステン合金メッキを得た。こ
の金型を400℃で1時間の熱処理を行ったところその
硬度は1030であった。この金型はガラス成形工程に
於いて連続使用したところ優れた離型性と耐久性を示1
.た。
Example 2 Nickel sulfamate 0.8 M/l Sodium tungstate 0.85 M/l citric acid
0.70M/l pH 6.8 (adjusted with ammonia water) Bath temperature 78℃ Using the above plating bath, a cathode current density of 15A/dm2 with a glass mold made of SUS 403 as the cathode and a stainless steel wire as the anode. Plating for 10 minutes at
A bright nickel-tungsten alloy plating of μ was obtained. When this mold was heat treated at 400° C. for 1 hour, its hardness was 1030. This mold showed excellent mold releasability and durability when used continuously in the glass molding process1.
.. Ta.

上記の実施例でも明らか々様に本発明は40%以Hの高
率のタングステンを含むニッケル−タングステン合金メ
ッキの工業的生産を可能と1.たもので工業ヒ有意義々
発明である。
As is clear from the above examples, the present invention enables industrial production of nickel-tungsten alloy plating containing a high percentage of tungsten of 40% or more. This is an invention of great industrial significance.

1罰正 国1 penalty Country

Claims (1)

【特許請求の範囲】[Claims] スルファミン酸ニッケル0.2〜0.4M/l、タング
ステン酸ナトリウム0.2〜0.4M/lとニッケル及
びタングステンの合計と当量以上のクエン酸を含み、ア
ンモニア水にてpHを6〜7となしたメッキ浴を用い、
浴温度60〜80℃、陰極電流密度10〜30A/dm
^2にて電解することを特徴とするニッケル−タングス
テン合金のメッキ方法。
Contains 0.2 to 0.4 M/l of nickel sulfamate, 0.2 to 0.4 M/l of sodium tungstate, and citric acid equivalent to or more than the total amount of nickel and tungsten, and adjusts the pH to 6 to 7 with aqueous ammonia. Using the same plating bath,
Bath temperature 60-80℃, cathode current density 10-30A/dm
A method for plating a nickel-tungsten alloy, characterized by electrolyzing at ^2.
JP12536984A 1984-06-20 1984-06-20 Plating method of nickel-tungsten alloy Pending JPS616291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12536984A JPS616291A (en) 1984-06-20 1984-06-20 Plating method of nickel-tungsten alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12536984A JPS616291A (en) 1984-06-20 1984-06-20 Plating method of nickel-tungsten alloy

Publications (1)

Publication Number Publication Date
JPS616291A true JPS616291A (en) 1986-01-11

Family

ID=14908422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12536984A Pending JPS616291A (en) 1984-06-20 1984-06-20 Plating method of nickel-tungsten alloy

Country Status (1)

Country Link
JP (1) JPS616291A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087943A (en) * 2008-11-10 2009-04-23 Denso Corp Headlight lamp
WO2012124711A1 (en) * 2011-03-15 2012-09-20 株式会社Leap Ni-W ELECTROFORMING SOLUTION FOR PRODUCING FORMING DIE, PROCESS FOR PRODUCING FORMING DIE, FORMING DIE, AND PROCESS FOR PRODUCING FORMED ARTICLE
CN103614753A (en) * 2013-11-22 2014-03-05 西峡龙成特种材料有限公司 Heat treatment process for copper-plate nickel-tungsten-alloy electroplated layer of continuous-casting crystallizer
CN115182009A (en) * 2022-07-11 2022-10-14 余姚市爱迪升电镀科技有限公司 Bright nickel-tungsten alloy plating solution and preparation process of corrosion-resistant multilayer plating layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009087943A (en) * 2008-11-10 2009-04-23 Denso Corp Headlight lamp
WO2012124711A1 (en) * 2011-03-15 2012-09-20 株式会社Leap Ni-W ELECTROFORMING SOLUTION FOR PRODUCING FORMING DIE, PROCESS FOR PRODUCING FORMING DIE, FORMING DIE, AND PROCESS FOR PRODUCING FORMED ARTICLE
JP2012193395A (en) * 2011-03-15 2012-10-11 Kanagawa Prefecture Ni-W ELECTROFORMING SOLUTION FOR MOLDING DIE, METHOD FOR PRODUCING MOLDING DIE, MOLDING DIE, AND METHOD FOR PRODUCING MOLDED ARTICLE
CN103614753A (en) * 2013-11-22 2014-03-05 西峡龙成特种材料有限公司 Heat treatment process for copper-plate nickel-tungsten-alloy electroplated layer of continuous-casting crystallizer
CN103614753B (en) * 2013-11-22 2015-10-28 西峡龙成特种材料有限公司 A kind of continuous casting crystallizer copper plate nickel tungsten alloy electroplating layer thermal treatment process
CN115182009A (en) * 2022-07-11 2022-10-14 余姚市爱迪升电镀科技有限公司 Bright nickel-tungsten alloy plating solution and preparation process of corrosion-resistant multilayer plating layer

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