CN115180209A

CN115180209A - Real-time action monitoring system and automatic material packaging equipment

Info

Publication number: CN115180209A
Application number: CN202110374005.0A
Authority: CN
Inventors: 黄德根
Original assignee: Suzhou Yousideng Internet Of Things Technology Co ltd
Current assignee: Suzhou Yousideng Internet Of Things Technology Co ltd
Priority date: 2021-04-07
Filing date: 2021-04-07
Publication date: 2022-10-14
Anticipated expiration: 2041-04-07
Also published as: CN115180209B

Abstract

The invention discloses a real-time action monitoring system and automatic material packaging equipment, wherein the real-time action monitoring system comprises: one or more controlled components; one or more monitoring devices configured to monitor real-time status parameter values of the corresponding one or more controlled components, respectively; the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each monitoring device, collect a real-time state parameter value of each monitoring device, and determine the action condition of the corresponding controlled component based on the collected real-time state parameter value of each monitoring device and the corresponding upper limit range and/or lower limit range; and the upper computer is configured to process the real-time state parameter value of each monitoring device acquired by the control device into a state curve chart representing the real-time action condition of the controlled component and analyze the running state of the equipment according to the action condition of the controlled component determined by the control device. The monitoring system can monitor the action displacement condition of the measured object in real time.

Description

Real-time action monitoring system and automatic material packaging equipment

Technical Field

The invention relates to the field of equipment monitoring, in particular to a real-time action monitoring system and automatic material packaging equipment.

Background

The pan feeding of small-size components and parts such as chip is mainly realized to current automatic packaging equipment utilizing vacuum adsorption, also utilizes the switching realization of vacuum adsorption and pressure release to arrange the material of components and parts, also mainly implants the small-size components and parts in the packing area through vacuum adsorption simultaneously.

However, existing automated packaging equipment does not achieve effective management of various vacuum flow rates. A plurality of flow meters and flow meter induction meters connected with the flow meters are also arranged in various vacuum pipelines of the current equipment. However, the flow meter sensing meters have alarm limit values set by operators, and the measured values of all the flow meters exceed the alarm limit values set by the operators to give alarms.

However, the vacuum in existing automated packaging equipment often presents the following problems in use:

1. the alarm mode of the vacuum flowmeter is limit value alarm, and the equipment can not alarm in vacuum because of false alarm or speed reduction, equipment failure and product failure occurrence due to limit value setting;

2. in the actual use of the vacuum flow of the equipment, the vacuum adsorption chip state and the non-adsorption chip state alternately appear at high speed, and the limit value of a flowmeter induction meter is set to be in a state which cannot be distinguished;

3. when the suction nozzle is half-blocked or the pipeline is half-blocked due to the problems of dust and the like in vacuum, the flow meter induction meter cannot make correct state judgment;

4. when the vacuum front-end pipeline is not connected and is in an abnormal state, the flow meter induction meter displays that the flow is normal and cannot be detected;

5. when the vacuum front end is blocked (a suction nozzle is blocked and a pipeline is blocked), and the pipeline is damaged and the vacuum is leaked between the blocked part and the mounting part of the flowmeter, the flow rate displayed by the flowmeter induction meter is normal and cannot be detected;

6. during equipment production, materials are replaced, vacuum adsorption is poor due to material size deviation, equipment cannot judge the cause of failure when equipment failure and products are poor, and failure positioning and analysis become very difficult.

Chain reaction can be produced in the emergence of these above problems, and the vacuum reason does not put in place, and the validity of vacuum adsorption and row material will go wrong, and vacuum suction nozzle's action can't be monitored, and the action of vacuum adsorption and pressure release also can't be monitored, and then makes the packing of components and parts not put in place, and production will go wrong.

Furthermore, the vacuum suction nozzle of the existing automatic packaging equipment for vacuum adsorption of small components can be driven by the driving part to reciprocate up and down to implant the adsorbed components onto the carrier tape, in the process of high-speed reciprocating motion of the general vacuum suction nozzle, the general vacuum suction nozzle can generate tiny vibration invisible to naked eyes when reaching the upper and lower suction end faces due to inertia, in the high-precision suction action, the tiny vibration can cause the problem that the components are not implanted in place in the process of implanting into the carrier tape, and the component can collide with a baffle plate when moving forwards along with the carrier tape due to the fact that the component is not implanted in place, so that the component is scratched to cause the poor production.

Furthermore, the vacuum amount of the vacuum nozzle can also influence the implantation action of the vacuum nozzle, when the vacuum nozzle is driven to move at a high speed, only when the vacuum amount of the vacuum nozzle reaches the standard, the vacuum nozzle can firmly suck the components, and only when the micro vibration amount of the vacuum nozzle is within a certain range, the implantation action of the vacuum nozzle is qualified, so that in the action process of the vacuum nozzle, the flow value and the jitter amount of the vacuum nozzle are monitored, the movement condition of the vacuum nozzle can be judged, and the reason that the action is not in place can be found in time.

Based on this, it is an urgent need to solve the problems that the existing equipment should be monitored in terms of actions, such as monitoring the vacuum flow rate to realize the orderly proceeding of the suction action and the discharge action of the vacuum suction nozzle, and further, for example, monitoring the implantation action of the vacuum suction nozzle to realize the accurate implantation of the suction nozzle into the packaging tape.

Therefore, it is necessary to provide a new technical solution to solve the problems in the prior art.

Disclosure of Invention

The vacuum management of current automatic equipment for packing is not in place, and the validity of vacuum adsorption and row material will go wrong, and vacuum suction nozzle's action can't be monitored, and the action of vacuum adsorption and pressure release also can't be monitored, and then makes the packing of components and parts not in place, leads to the production to go wrong. In order to solve the above problems, the present invention provides a real-time action monitoring system, which adopts the following specific technical scheme:

a real-time action monitoring system, comprising:

one or more controlled components;

one or more monitoring devices configured to monitor real-time status parameter values of the corresponding one or more controlled components, respectively;

the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each monitoring device, acquire a real-time state parameter value of each monitoring device, and determine the action condition of the corresponding controlled component based on the acquired real-time state parameter value of each monitoring device and the corresponding upper limit range and/or lower limit range;

and the upper computer is configured to process the real-time state parameter value of each monitoring device acquired by the control device into a state curve chart representing the real-time action condition of the controlled component, and analyze the running state of the equipment according to the action condition of the controlled component determined by the control device.

In a preferred embodiment, the controlled component includes a vacuum nozzle, the monitoring device includes displacement sensors, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each displacement sensor, acquire a real-time displacement value of each displacement sensor, and determine an operating condition of the corresponding vacuum nozzle based on the acquired real-time displacement value of each displacement sensor and the corresponding upper limit range and/or lower limit range, the upper computer processes the real-time displacement value of each displacement sensor acquired by the control device into a displacement graph representing a real-time action condition of the vacuum nozzle, and analyzes an operating state of the device according to the action condition of the vacuum nozzle determined by the control device.

In a preferred embodiment, the controlled component includes vacuum nozzles, the monitoring device includes flow meters, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each flow meter, collect a real-time flow value of each flow meter, and determine an operating condition of the corresponding vacuum nozzle based on the collected real-time flow value of each flow meter and the corresponding upper limit range and/or lower limit range, the upper computer processes the real-time flow value of each flow meter collected by the control device into a flow curve diagram representing a real-time action condition of the vacuum nozzle, and analyzes an operating state of the apparatus according to the action condition of the vacuum nozzle determined by the control device.

Based on the technical scheme of the real-time action monitoring system, the invention further provides automatic material packaging equipment comprising the real-time action monitoring system, the automatic material packaging equipment further comprises a material feeding device, a component processing device and a material packaging device, the material feeding device is used for feeding a carrier tape for packaging components, the component feeding device is used for feeding the components, the component processing device is used for implanting the components into a receiving groove of the carrier tape, and the material packaging device is used for packaging the carrier tape containing the components.

Compared with the prior art, the invention has one or more of the following beneficial effects:

1. the invention provides a real-time action monitoring system, which can be used for monitoring automation equipment in real time, such as a vacuum pipeline and vacuum flow of the automation equipment, timely responding to vacuum adsorption and pressure release on the basis of monitoring the real-time action monitoring system, ensuring that a vacuum suction nozzle serving as an actuating mechanism acts in place, monitoring the stroke of the vacuum suction nozzle and ensuring that components are effectively implanted into a packaging tape.

2. The real-time action monitoring system can be used for managing vacuum, if the vacuum management scheme of the automatic equipment is improved by adopting the monitoring system, the automatic equipment can store the upper limit range and/or the lower limit range corresponding to a plurality of flowmeters, so that the vacuum working condition of each suction nozzle is determined based on the acquired flow value of each flowmeter and the corresponding upper limit range and/or lower limit range, and one or more problems in the prior art are solved.

3. The real-time action monitoring system can also monitor whether the action of the vacuum suction nozzle is in place or not, monitor the stroke and the specific position of the suction nozzle, express the tiny displacement of the suction nozzle as a displacement curve, analyze and judge the running condition of equipment through an upper computer, analyze the cause of failure and guide the maintenance of the equipment, monitor the displacement of the vacuum suction nozzle through the action monitoring system, further determine the shaking amount of the vacuum suction nozzle on an upper suction surface and a lower suction surface, determine whether the shaking amount of the vacuum suction nozzle is in a reasonable range or not, and indicate that the equipment needs to be overhauled if the shaking amount exceeds the range.

4. The automatic material packaging equipment is also provided with a carrier tape feeding device, a component processing device and a material packaging device, wherein the carrier tape feeding device is used for feeding a carrier tape for packaging components, the component feeding device is used for feeding the components, the component processing device is used for implanting the components into the accommodating grooves of the carrier tape, and the material packaging device is used for packaging the carrier tape accommodating the components.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic top view of a component handling apparatus of the present invention in one embodiment, with some parts not shown;

FIG. 2 is an enlarged side view of a part of the component processing apparatus shown in FIG. 1, in which only the relevant part of the structure of the material inlet portion is schematically shown;

fig. 3 is a side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the discharging part is schematically shown;

fig. 4 is an enlarged side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the implant is schematically shown;

FIG. 5 is a schematic view of a gas passage structure of the component processing apparatus of FIG. 1;

fig. 6 is a schematic circuit diagram of the component processing apparatus in fig. 1;

FIGS. 7a-7c are graphs of real-time waveform data obtained from corresponding flow meters in different states of the implanted vacuum nozzle of the present invention;

FIG. 8a is a graphic diagram illustrating the real-time flow data obtained by the flow meter corresponding to the implanted vacuum nozzle of the present invention and the corresponding action signal;

FIG. 8b is an enlarged schematic view of the waveform data obtained by the flow meter of FIG. 8a in conjunction with corresponding action signals;

FIG. 9 is an enlarged side view of a vacuum nozzle of an implant of a component handling device according to an embodiment of the present invention, partially shown;

fig. 10 is a schematic flow chart of the material handling process of the automatic material packaging equipment in one embodiment of the invention.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.

The detailed description of the present invention is presented primarily in terms of procedures, steps, logic blocks, processes, or other symbolic representations that directly or indirectly simulate operations of aspects of the present invention. Those skilled in the art will be able to utilize the description and illustrations herein to effectively introduce other skilled in the art to their working essence.

Reference herein to "one embodiment" or "an embodiment" means that a feature, structure, or characteristic described in connection with the embodiment can be included in at least an implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Furthermore, the order of blocks in a method, flowchart or functional block diagram representing one or more embodiments is not a fixed order, refers to any particular order, and is not limiting of the present invention.

Example 1:

the invention provides a real-time action monitoring system, which comprises: one or more controlled components;

In an embodiment, in the real-time action monitoring system provided by the invention, the controlled component may be a vacuum nozzle, the monitoring device may be a flow meter, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each flow meter, collect a real-time flow value of each flow meter, and determine an operating condition of the corresponding vacuum nozzle based on the collected real-time flow value of each flow meter and the corresponding upper limit range and/or lower limit range, the upper computer processes the real-time flow value of each flow meter collected by the control device into a flow curve diagram representing a real-time action condition of the vacuum nozzle, and analyzes an operating state of the equipment according to the action condition of the vacuum nozzle determined by the control device.

Based on the real-time action monitoring system, the invention demonstrates that the real-time action monitoring system is applied to a component processing device, so that the component processing device adopts the real-time action monitoring system to improve the vacuum management scheme of the component processing device, very effective help can be provided for the use, maintenance and repair of the component processing device, and the intelligent management of a machine is realized. It should be noted that, in this document, the term "processing" in the component processing apparatus has a broad meaning, and the component pickup, transfer, inspection, removal, blanking, placement, mounting, and the like can be referred to as the processing of the component. The components herein may include small components such as chips, resistors, capacitors, and the like.

There are many kinds of the component processing apparatuses. Some component processing equipment can pack components into a containing groove in a carrier tape by utilizing the principle of vacuum adsorption, wherein the loading of the components (namely, the picking of the components), the transferring of the components, the detection of the components, the removal of the abnormal components and the implantation of the normal components (namely, the arrangement of the components) are involved, and a plurality of actions are required to be completed through the vacuum adsorption. In addition, some component processing apparatuses are designed not to pack the components into a carrier tape, but to select qualified components and directly load the selected components into a related container, and the operations of the component processing apparatuses include loading of components (i.e., picking up of components), transferring of components, detection of components, removal of components with abnormal detection, and unloading of components with normal detection (i.e., directly loading the selected components into a related container), and the like, and all of the operations are required to be performed by vacuum adsorption. In addition, there are component handling apparatuses for mounting components on a carrier, such as a circuit board, involving the loading of components (i.e., component pickup), component transfer, component mounting, and the like, wherein a plurality of operations are performed by vacuum suction.

The description will be given mainly by taking a component handling apparatus for packaging components in receiving grooves in a carrier tape as an example. It should be apparent that in some embodiments, other component handling apparatuses may employ the same vacuum suction principle, and those skilled in the art may apply the vacuum management scheme described in detail herein to other types of component handling devices (such as component screening apparatuses or component placement apparatuses) according to the teachings herein.

Fig. 1 is a schematic top view of a component handling apparatus 100 according to an embodiment of the present invention, with some components not shown. The component handling apparatus 100 may pack the component 200 into the receiving slot 320 in the carrier tape 300. The component 200 may be a small passive component such as a chip. Before packing components 200 into the accommodating groove 320 in the carrier tape 300, the component processing apparatus 100 can also perform electrical performance detection on the components 200, and the component processing apparatus 100 also needs to eliminate the components 200 with abnormal detection and keep detecting normal components.

As shown in fig. 1 to 4, the component processing apparatus 100 includes a machine table 180, a turntable 120 disposed on the machine table 180, a feeding portion 110, a discharging portion 130, an implanting portion 140, and a detecting device (not shown).

The turntable 120 is driven to rotate in operation, which may be in the direction of D2 in fig. 1, and the turntable 120 includes a plurality of grooves 121 disposed on an edge. For simplicity, several recesses 121 are shown in fig. 1 only as an example, which are provided on part of the edge of the turntable 120, in practice, the recesses 121 are provided uniformly on all edge parts of the turntable 120.

Fig. 2 is a side-view enlarged schematic diagram of a partial structure of the component processing apparatus 100 in fig. 1, in which only a relevant partial structure of the material inlet portion 110 is schematically shown. Fig. 5 is a schematic view of a gas passage structure of the component processing apparatus in fig. 1. As shown in fig. 1, 2 and 5, the feeding portion 110 includes a feeding vacuum nozzle 111 disposed on the machine platform 180, a feeding rail 113 disposed on the machine platform 180, a separating needle 112 and a positioning detector 114. The implantation vacuum nozzle 111 is in communication with a vacuum pump 151 (shown in FIG. 5) via a conduit. The separator pin 112 is controlled to move between a blocking position and an open position. The component 200 on the feeding track 113 is blocked when the separating pin 112 is in the blocking position, as shown in fig. 2, when the separating pin 112 is in the blocking position. When the separating pin 112 is in the open position, the top end of the separating pin 112 is lower than or equal to the track surface of the feeding track 113, the feeding vacuum nozzle 111 sucks the component 200 on the feeding track 113 into the groove 121 at the feeding vacuum nozzle 111 through vacuum suction, and then the separating pin 112 returns to the blocking position from the normally open position. The docking detector 114 is configured to detect whether the component 200 enters the recess 121 at the feeding vacuum nozzle 111. When the turntable 120 rotates, the grooves 121 of the turntable 120 sequentially pass through the feeding vacuum suction nozzle 111, and are matched with the reciprocating motion of the separating needle 112 between the blocking position and the opening position, so that the components 200 are adsorbed into the grooves 121 of the turntable 120 one by one.

With the rotation of the turntable 120, the detection device can sequentially perform electrical performance detection, such as resistance detection or capacitance detection, on the components 200 adsorbed into the grooves 121 of the turntable 120. For the components 200 that are detected to be abnormal to be excluded from the turntable 120, the bin 130 may be configured to perform the operation of excluding the components 200 that are detected to be abnormal. Of course, the ejection unit 130 does not perform the ejection operation for the component 200 that is detected to be normal, and it is necessary to suck the component 200 that is detected to be normal.

Fig. 3 is a side-view enlarged schematic diagram of a partial structure of the component processing apparatus 100 in fig. 1, in which only a relevant partial structure of the discharging portion 130 is schematically illustrated. As shown in fig. 1, 2 and 5, the discharging portion 130 includes a discharging vacuum nozzle 131, a receiving chamber 132 and a solenoid valve 133 (shown in fig. 5) disposed on the machine. A first port of the electromagnetic valve 133 is communicated with the discharging vacuum nozzle 131, a second port of the electromagnetic valve 133 is communicated with the vacuum pump 151, and a third port of the electromagnetic valve 133 is communicated with the air outlet pump 135. The solenoid valve 133 is controlled to selectively communicate the first port with one of the second port and the third port. The discharge vacuum nozzle 131 is controlled to selectively communicate with one of the vacuum pump 151 and the air outlet pump 135 through a solenoid valve 133.

For the component 200 which is normally tested, the electromagnetic valve 133 enables the discharge vacuum nozzle 131 to communicate with the vacuum pump 151, and the discharge vacuum nozzle 131 adsorbs the component which is normally tested in the groove 121 at the discharge vacuum nozzle 131 through vacuum suction. For the abnormal component 200, the electromagnetic valve 133 makes the discharge vacuum nozzle 131 communicate with the air outlet pump 135, the discharge vacuum nozzle 131 blows the abnormal component 200 out of the groove 121 at the discharge vacuum nozzle 131 by the blowing thrust, and the blown component 200 falls into the receiving cavity 132. Along with the rotation of the turntable 120, the grooves 121 on the edge of the turntable 120 sequentially pass through the discharging vacuum nozzles 131 of the discharging part 130, and the components 200 which are detected normally can be retained and the components 200 which are detected abnormally can be removed by matching with the action control of the electromagnetic valve 133.

As shown in fig. 1, three discharge portions 130 are schematically illustrated, the discharge vacuum nozzles of which are respectively designated 131a, 131b and 131c, the receiving chambers of which are respectively designated 132a, 132b and 132c, and the three discharge portions 130 also have three solenoid valves 133. Fig. 5 and 6 illustrate only one discharging portion 130. Of course, in other embodiments, one discharge, two discharges or more discharges may be provided, the number of discharges depending on the application and design.

Fig. 4 is an enlarged side view of a part of the structure of the component processing apparatus in fig. 1, in which only the relevant part of the structure of the implant 140 is schematically shown. As shown in connection with figures 1, 4 and 5,

the implant part 140 includes an implant vacuum nozzle 141 and an implant driving part 142. The implantation vacuum nozzle 141 is in communication with a vacuum pump 151 via a conduit. The implanting vacuum nozzle 141 sucks and implants the components 200 located in the grooves 121 at the implanting vacuum nozzle 141 into the receiving grooves 320 of the carrier tape 300 by vacuum suction. The implantation driving part 142 drives the implantation vacuum nozzle 141 to reciprocate between the material-taking position and the implantation position. As shown in fig. 4, the implantation vacuum nozzle 141 is located at a material removal position, and the implantation vacuum nozzle 141 moves downward to an implantation position (not shown). The implanting vacuum nozzle 141 sucks the components 200 in the grooves 121 at the implanting vacuum nozzle 141 at the pick-up position, and implants the sucked components 200 in the receiving grooves 320 of the carrier tape 300 at the implanting position.

The component processing apparatus 100 further includes a carrier tape drive unit (not shown). As shown in fig. 1, the carrier tape driving part drives the carrier tape 300 through the implanting part 140. The carrier tape 300 includes a plurality of receiving grooves 320 arranged in a row and carrier tape holes 310 arranged in a row. The carrier tape driving part drives the receiving slots 320 of the carrier tape 300 forward through the carrier tape holes 310 of the carrier tape 300 to pass through the implanting vacuum nozzle 141 in sequence.

As shown in fig. 1, with the rotation of the turntable 120, the grooves 121 on the edge of the turntable 120 sequentially pass through the material feeding vacuum nozzle 111, the material discharging vacuum nozzle 131 and the implanting vacuum nozzle 141, and cooperate with the reciprocating motion of the separating needle 112 between the blocking position and the opening position, the components 200 are adsorbed into the grooves 121 of the turntable 120 one by one, the components 200 detected normally can be retained by cooperating with the action control of the electromagnetic valve 133, the components 200 detected abnormally can be removed, and the components 200 implanted into the grooves 121 on the edge of the turntable 120 can be sequentially placed into the accommodating grooves 320 of the carrier tape 300 by cooperating with the reciprocating motion of the implanting vacuum nozzle 141 and the forward motion of the carrier tape 300.

Fig. 6 is a schematic circuit diagram of the component processing apparatus 100 in fig. 1. As shown in fig. 5-6, the component handling apparatus 100 further includes a plurality of flow meters and control apparatus 160. The plurality of flow meters are configured to measure flow values of the feed vacuum nozzle 111, the discharge vacuum nozzle 131, and the implant vacuum nozzle 141, respectively. The control device 160 is configured to store the upper and/or lower limit ranges corresponding to the respective flow meters, collect the flow rate values of the respective flow meters, and determine the vacuum operation of the implant 110, the feeding portion 130, and/or the implant 140 based on the collected flow rate values of the respective flow meters and the corresponding upper and/or lower limit ranges. It should be noted that the control device 160 can collect real-time flow rate values of the flowmeter, so that the condition of each vacuum can be known in more detail.

The plurality of flow meters may include a first flow meter 115 disposed on a conduit in communication with the feeding vacuum nozzle 111, a second flow meter 134 disposed on a conduit in communication with the discharging vacuum nozzle 131, and a third flow meter 134 disposed on a conduit in communication with the implanting vacuum nozzle 141.

The first flow meter 115 is electrically connected to the control device 160 and is configured to measure the gas flow rate of the inlet vacuum nozzle 111 to obtain a first flow value and transmit the obtained first flow value to the control device 160. The second flow meter 134 is electrically connected to the control device 160, and is configured to measure the gas flow of the discharge vacuum nozzle 131 to obtain a second flow value, and transmit the second flow value to the control device 160. The third flow meter 134 is electrically connected to the control device 160, and is configured to measure the gas flow of the implanted vacuum nozzle 141 to obtain a third flow value, and transmit the obtained second flow value to the control device 160. The control device 160 may be a single chip, a programmable controller, a microcontroller, a computing device, or the like.

The component processing apparatus 100 further includes a flow divider 152, and the flow divider 152 is connected to the vacuum pump 151 through a pipe. The vacuum pump 151 is in communication with the feeding vacuum nozzle 111, the discharging vacuum nozzle 131, and the implanting vacuum nozzle 141 through the flow splitter 152. The plurality of flow meters includes: a fourth flow meter 153 disposed on a pipe of the vacuum pump 151, the fourth flow meter 153 may be configured to measure a total flow value.

The docking detector 114 is electrically connected to the control device 160 and provides docking detection signals to the control device 160. The solenoid valve 133 is connected to the control device 160, and the control device 160 can control the solenoid valve 133. The separation needle 112 and the implantation driving part 142 are electrically connected to the control device 160, and the control device 160 controls the actions of the separation needle 112 and the implantation driving part 142. The component processing apparatus 100 further includes a turntable driving portion 122 for driving the turntable 120 to rotate, and the turntable driving portion 122 is electrically connected to the control device 160.

As shown in fig. 6, in an embodiment, the component processing apparatus 100 may further include: and a communication module 170 for communicating with an upper computer (not shown). The upper computer may be a computer device communicating with the component processing apparatus 100. The communication module 170 may be a wired or wireless module, such as a Wifi wireless communication module, a bluetooth wireless communication module, a USB communication module, an RS485 module, and the like. In one embodiment, the communication module 170 is configured to receive an upper limit range and/or a lower limit range corresponding to each flow meter transmitted by the upper computer.

In one embodiment, the upper computer may generate and update the upper limit range and/or the lower limit range corresponding to each flow meter based on the total flow value of the vacuum pump 151, the equipment type of the component processing apparatus 100, and the component type transmitted by the communication module 170. The upper limit range and/or the lower limit range corresponding to each flow meter are set in relation to the total flow rate of the vacuum pump 151, the type of equipment of the component processing apparatus 100, and the type of component, and it is necessary to combine these factors to set the appropriate upper limit range and/or lower limit range corresponding to each flow meter. Of course, other factors may be associated with the setting of the upper and/or lower range for each flow meter, and other factors may need to be considered. Of course, in another embodiment, the upper limit range and/or the lower limit range corresponding to each flow meter may also be directly set on the component processing apparatus 100.

In addition, the upper limit range and/or the lower limit range corresponding to each flow meter of the same component processing apparatus 100 are not constant, and they may vary depending on the use of the equipment. Therefore, the upper computer may recalculate the upper limit range and/or the lower limit range corresponding to each flow meter periodically or according to a request, and update the parameters into the component processing apparatus 100.

Preferably, the upper computer may be connected to an artificial intelligence module (AI), and the artificial intelligence module may generate and update an upper limit range and/or a lower limit range corresponding to each flow meter according to production record data of one or more component processing apparatuses 100. The production log data includes real-time measurement values measured by the respective flow meters during the production process, the component type, the equipment type of the component processing apparatus 100, and the like. One part of the real-time measured values is a high value, namely the flow rate value obtained by each flow meter in a material-free state, and the other part of the real-time measured values is a low value, namely the flow rate value obtained by each flow meter in a material state. The upper limit range of each flowmeter can be accurately obtained by counting the value range of the high position in the real-time measurement value, and the lower limit range of each flowmeter can be accurately obtained by counting the value range of the low position in the real-time measurement value. And the upper computer is communicated with the artificial intelligence module to obtain the upper limit range and/or the lower limit range of each flowmeter.

The upper computer determines whether to allow the component handling apparatus 100 to normally operate (or be referred to as normal operation) based on the total flow value of the vacuum pump 151 transmitted by the communication module 170 and the total flow value limit value obtained by the fourth flow meter 153.

The upper limit range comprises a highest upper limit value and a lowest upper limit value, if the flow value is between the highest upper limit value and the lowest upper limit value, the flow value is considered to be in the upper limit range, if the flow value is higher than the highest upper limit value, the flow value is considered to be higher than or exceed the upper limit range, and if the flow value is lower than the lowest upper limit value, the flow value is considered to be lower than the upper limit range. Likewise, the lower range includes a highest lower value and a lowest lower value, and the flow value is considered to be within the lower range if the flow value is between the highest lower value and the lowest lower value, is considered to be above or beyond the lower range if the flow value is above the highest lower value, and is considered to be below the lower range if the flow value is below the lowest lower value. For example, if the lowest limit value is 0, the flow rate value is generally not lower than the lower limit range.

Specifically, the first flow meter 115 is provided with a corresponding upper limit range and/or lower limit range, which is the upper limit range and/or lower limit range of the gas flow rate of the material inlet vacuum nozzle 111, the second flow meter 134 is provided with a corresponding upper limit range and/or lower limit range, which is the upper limit range and/or lower limit range of the gas flow rate of the material outlet vacuum nozzle 131, and the third flow meter 143 is provided with a corresponding upper limit range and/or lower limit range, which is the upper limit range and/or lower limit range of the gas flow rate of the material inlet vacuum nozzle 141. In addition, it should be noted that, for each state of each vacuum nozzle, a corresponding upper limit range and/or lower limit range is provided, and the upper limit range and/or lower limit range corresponding to different states may be different or may be the same.

In the invention, the real-time measurement values of the flow meters are collected, so that technical support can be provided for subsequent more accurate analysis, and rich information contained in the real-time measurement values of the flow meters can be extracted. Because the corresponding upper limit range and/or lower limit range is set for the flow value of each flowmeter, the abnormal conditions of various flow values can be distinguished more clearly, so that the reason of the abnormal conditions can be analyzed, the fault removal help is provided for users, the specific conditions of the normal conditions of the flow values can be known, and the health condition of corresponding machine equipment can be evaluated.

The vacuum management scheme employed by the control device 160 is described in detail below.

1) Vacuum management with respect to the material inlet portion 110

When the feeding portion 110 is in a continuous material-free state, if the acquired real-time flow value of the feeding vacuum nozzle 111 is lower than the corresponding upper limit range, the control device 160 determines that the feeding portion vacuum is abnormal. For the first feeding portion vacuum abnormality, the control device 160 may prompt the abnormality cause: one or more of insufficient vacuum of the feeding part 110, blockage of the feeding vacuum suction nozzle 111, blockage of a pipeline of the feeding part 110 and air leakage of a pipeline in front of a flow meter of the feeding part 110. When the feeding portion 110 is in a continuous material-free state, if the collected real-time flow value of the feeding vacuum nozzle 111 is higher than the corresponding upper limit range, the control device 160 determines that the feeding portion vacuum is abnormal of the second type. For the second feeding portion vacuum anomaly, the control device 160 may prompt the anomaly cause as follows: the feeding portion 110 is over-vacuumed.

And under the condition that the feeding part 110 is in a material-existence alternative conversion state, if the high value of the acquired real-time flow value of the feeding vacuum suction nozzle 111 is in the corresponding upper limit range, and the low value of the acquired real-time flow value of the feeding vacuum suction nozzle 111 is higher than the corresponding lower limit range, determining that the feeding part is in vacuum anomaly of a third kind. For the third vacuum anomaly of the feeding portion, the control device 160 may prompt the anomaly cause: and the air leakage of the pipeline behind the flowmeter of the feeding part.

The continuous material-free state of the feeding part is provided with a corresponding upper limit range, the material-free state of the feeding part is provided with a corresponding upper limit range and a corresponding lower limit range, and the continuous material-free state of the feeding part and the material-free state of the feeding part are alternately switched in different upper limit ranges.

Therefore, the user can be helped to quickly find out the fault reason of the vacuum abnormity of the feeding part, and the efficiency is improved. In addition, even if the real-time flow value of the feeding part is in the corresponding upper limit range or lower limit range, and the feeding part is normal in vacuum, the health condition of the feeding vacuum suction nozzle 111 of the feeding part can be evaluated according to the real-time flow value of the specific feeding part, and a prompt can be given when the health condition deteriorates to a certain threshold value, so as to avoid abnormal conditions.

The control device 160 is further configured to collect one or more of a rotation signal of the turntable 120, an implantation signal of the implantation portion 140, a feeding signal of the feeding portion 110, and a discharging signal of the discharging portion 130. The feeding action signal of the feeding portion 110 may include an action signal of the separation needle 112 of the feeding portion 110 and/or a detection signal of the docking detector 114. The implant operation signal of the implant part 140 may include an operation signal of the implant driving part 142 of the implant part 140. The discharging operation signal of the discharging unit 130 may include a switching signal of the solenoid valve 133 of the discharging unit 130.

The control device 160 can determine whether the feeding portion 110 is in a continuous material-free state and a material-free alternate switching state based on the collected feeding action signal of the feeding portion 110 and/or the collected real-time flow value of the feeding vacuum nozzle 111. Of course, the control device 160 may also determine the state of the material feeding portion 110 according to the rotation signal of the turntable 120.

In one embodiment, the control device 160 can determine that the material feeding portion 110 is in the continuous material-free state when the material feeding portion 110 has no action signal continuously and the collected real-time flow value of the material feeding vacuum nozzle 111 is continuously at the high value continuously for a continuous period of time. When the collected real-time flow value of the feeding vacuum nozzle 111 is alternatively switched between a high value and a low value in cooperation with the collected action signal of the feeding portion 110, the control device 160 may determine that the feeding portion 110 is in a material-presence or material-absence alternative switching state.

2) Vacuum management for discharge section 130

When the discharging portion 130 is in a continuous material-free state, if the collected real-time flow value of the discharging vacuum nozzle 131 is lower than the corresponding upper limit range, the control device 160 determines that the first discharging portion vacuum is abnormal. For the first discharge portion vacuum anomaly, the control device 160 may indicate the anomaly reason: the material discharging part is one or more of insufficient vacuum, blockage of a material discharging vacuum suction nozzle, blockage of a pipeline of the material discharging part and air leakage of a pipeline in front of a flowmeter of the material discharging part.

If the collected real-time flow value of the discharge vacuum nozzle is higher than the corresponding upper limit range under the continuous material-free state of the discharge part, the control device 160 determines that the second type of discharge part vacuum is abnormal. For the second type of vacuum anomaly in the discharge portion, the control device 160 may indicate the anomaly cause: one or more of excessive vacuum of the discharging part 130 and air leakage of the rear pipeline of the flowmeter of the discharging part 130

When the discharge part is in a state of material existence and material nonexistence, if the high value and the low value of the collected real-time flow value of the discharge vacuum nozzle are converted too slowly, the control device 160 determines that the third discharge part is abnormal in vacuum. For a third discharge portion vacuum anomaly, the control device 160 may indicate the anomaly reason: one or more of aging of the solenoid valve 133 of the discharge portion 130 and clogging of the discharge vacuum nozzle 131 of the discharge portion 130.

Wherein, a corresponding upper limit range is set for the continuous material-free state of the discharging part 130.

Therefore, the user can be helped to quickly find out the fault reason of the empty abnormity of the discharging part 130, and the efficiency is improved. In addition, even if the real-time flow value of the discharge part 130 is within the corresponding upper limit range, the discharge part 130 is in normal vacuum, the health condition of the discharge vacuum suction nozzle of the discharge part 130 can be evaluated according to the real-time flow value of the specific discharge part 130, and a prompt can be given when the health condition deteriorates to a certain threshold value, so as to avoid abnormal occurrence.

The control device 160 may determine whether the discharging portion 130 is in the continuous material-free state and the material-free state based on the collected discharging action signal of the discharging portion 130 and/or the collected real-time flow value of the discharging vacuum nozzle 131. The control device 160 may also determine the state of the discharging unit 130 in combination with a rotation operation signal of the turntable 120.

In one embodiment, when the discharge portion 130 continues to have no operation signal and the collected real-time flow value of the discharge vacuum nozzle 131 continues to be at the high value for a continuous period of time, the control device 160 may determine that the discharge portion 130 is in the continuous material-free state; when the collected real-time flow value of the discharge vacuum nozzle 131 is matched with the collected action signal of the discharge part 130 and is switched from a low value to a high value, the discharge part 130 is judged to be in a material-existing state and is switched to a material-nonexisting state.

3) Vacuum management with respect to implant 140

In the continuous no-material state of the implant 140, the control device 160 may determine that the implant vacuum is abnormal of a first type if the real-time flow value of the implant vacuum nozzle 141 is collected below a corresponding upper range. For the first implant vacuum abnormality, the control device 160 may indicate the abnormality cause: one or more of insufficient vacuum in the implant, an occlusion of the implant vacuum nozzle, an occlusion of the conduit of the implant, and an air leak in the conduit prior to the flow meter of the implant.

In the material-filled/material-free alternate switching state of the implant 140, if the acquired high value of the real-time flow value of the implant vacuum nozzle 141 is within the corresponding upper limit range and the acquired low value of the real-time flow value of the implant vacuum nozzle 141 is higher than the corresponding lower limit range, the control device 160 may determine that the implant vacuum is abnormal of a second type. For the second type of vacuum anomaly of the implant, the control device 160 may indicate the anomaly cause: one or more of damage of the implanted vacuum suction nozzle, abrasion of the implanted vacuum suction nozzle and air leakage of a pipeline behind the flow meter of the implanted part.

And under the condition that the implantation part 140 is in a material-free alternate conversion state, if the high value of the acquired real-time flow value of the implantation vacuum suction nozzle 141 is in the corresponding upper limit range, and the low value of the acquired real-time flow value of the implantation vacuum suction nozzle 141 is in the corresponding lower limit range but is close to the upper limit value of the corresponding lower limit range and regularly fluctuates, determining that the implantation part is in a third implantation part vacuum anomaly. For a third type of implant vacuum anomaly, the control device 160 may indicate the anomaly cause: one or more of a half-occlusion of the implanted vacuum nozzle 141, and an occlusion of a single orifice of the implanted vacuum nozzle 141.

In the state that the implanting part 140 is in the material-to-material alternate switching state, if the high value of the collected real-time flow value of the implanting vacuum nozzle 141 is within the corresponding upper limit range, and the low value of the collected real-time flow value of the implanting vacuum nozzle 141 is within the corresponding lower limit range and fluctuates irregularly, the control device 160 may determine that the fourth implanting part is abnormal in vacuum. For the fourth implantation vacuum anomaly, the control device 160 may indicate the anomaly reason: the size of the component is abnormal.

In the event of a fourth implantation vacuum anomaly, the control device 160 can determine the non-standard rate of the components 200 according to the collected real-time flow values of the implantation vacuum nozzles 111 of a predetermined number of components (e.g., 100 or other numbers).

The control device 160 may determine whether the implant 140 is in the continuous material-free state and the material-free state based on the collected implant operation signal of the implant 140 and/or the collected real-time flow value of the implanted vacuum nozzle 141. The control device 160 can also determine the state of the implantation portion 140 in combination with the rotation signal of the turntable 120.

In one embodiment, the control device 160 may determine that the implant 140 is in the material-free state when the implant 140 continues to have no motion signal and the collected real-time flow value of the implant vacuum nozzle 141 continues to be at the high value for a continuous period of time; when the collected real-time flow value of the implanted vacuum nozzle 141 is alternately switched between a high value and a low value in cooperation with the collected operation signal of the implanted part 140, the control device 160 may determine that the implanted part is in a material-presence/absence alternate switching state.

Wherein, a corresponding upper limit range is set for the continuous material-free state of the implantation part 140, and a corresponding upper limit range and a corresponding lower limit range are set for the material-free and material-free alternating conversion state of the implantation part 140, wherein the upper limit range of the continuous material-free state and the upper limit range of the material-free and material-free alternating conversion state of the implantation part 140 are different.

This helps the user to quickly find the cause of the failure of the vacuum abnormality of the implant 140, thereby improving efficiency. In addition, even if the real-time flow value of the implant part 140 is within the corresponding upper limit range or lower limit range, and the vacuum of the implant part 140 is normal, the health condition of the implant vacuum nozzle of the implant part 140 can be evaluated according to the real-time flow value of the specific implant part 140, and a prompt is given when the health condition deteriorates to a certain threshold value, so as to avoid the generation of abnormality.

In one embodiment, the control device 160 may report the vacuum abnormal conditions of the material inlet portion 110, the material discharge portion 130 and the implantation portion 140 to an upper computer, and the upper computer displays, prompts or alarms. Of course, the component processing apparatus 100 may prompt itself, specifically, the component processing apparatus may prompt through a self-configured display screen, or may display the component processing apparatus through a related indicator light. In addition, the control device 160 may also report the vacuum normal conditions of the material inlet portion 110, the material discharge portion 130, and the implantation portion 140 to an upper computer, and the upper computer may analyze the vacuum normal conditions or perform health condition assessment.

The real-time flow value of the implanted vacuum nozzle 141 will be described with reference to the drawings.

Figures 7a-7c are graphs of waveform data obtained from a corresponding flow meter in various conditions of the implanted vacuum nozzle 141 of the present invention. Fig. 7a is a waveform data diagram (real-time flow rate value) obtained by the corresponding flow meter when the implanted vacuum nozzle 141 is in a material state, wherein the Y-axis is an induced voltage value, the X-axis is time (unit is 10 us), and the voltage value obtained by the flow meter fluctuates between 2.02V and 2.62V at a period of 21ms. Fig. 7b is a waveform data diagram of the flow meter corresponding to the implanted vacuum nozzle 141 in the material-free state, wherein the Y-axis represents the induced voltage value and the X-axis represents the time (unit is 10 us), and the voltage value obtained by the flow meter fluctuates between 3.75V and 4.15V with a period of 21ms. Fig. 7c is a waveform data diagram obtained by the corresponding flow meter when the implanted vacuum nozzle 141 is in the material-presence/absence alternating state, the Y axis of the waveform data diagram is the induced voltage value, the X axis of the waveform data diagram is the time, the voltage value obtained by the flow meter fluctuates between 3.75V and 4.15V at this time, and the period is 60-80 ms.

FIG. 8a is a schematic diagram showing the real-time flow rate data obtained by the flow meter corresponding to the implanted vacuum nozzle of the present invention and the corresponding action signal. Fig. 8b is a time-enlarged schematic view of a graph of waveform data obtained by the flow meter of fig. 8a in cooperation with corresponding action signals. For clarity, the X-axis is time (in units of 10 us) and the Y-axis is amplitude for real-time flow values, where in fig. 8a and 8b not voltage values are already present, but rather mapped values of the voltage values after the scaling. Wherein, the waveform C1 is waveform data obtained by a flowmeter corresponding to the implanted vacuum suction nozzle, and C2 is a time sequence waveform of the turntable, wherein, the high level represents the rotation of the turntable, and the low level represents the immobility of the turntable; c3 is an action signal after the implantation vacuum suction nozzle moves downwards, wherein the low level represents at an implantation position, and the high level represents at a material taking position. The falling edge of the action signal after the implanted vacuum suction nozzle moves downwards is delayed by 6.5ms until the flow sensing minimum value, and the falling edge of the action signal after the implanted vacuum suction nozzle moves downwards is delayed by 7.5ms until the flow sensing maximum value is reached. As shown in fig. 8a, in the D1 area of the waveform C1, since the components implanted into the grooves of the corresponding turntable of the vacuum nozzle have been removed in the removal portion, the real-time flow rate value is greatly increased, and in the other portions except the D1 area, the implantation portion 140 is in the material-presence/absence alternating state, and the real-time flow rate value fluctuates up and down periodically, and the high values of the real-time flow rate value are all located in the corresponding upper limit range, and the low values of the real-time flow rate value are all located in the corresponding lower limit range, in cooperation with the operation signal of the turntable and the operation signal of the implantation portion.

Thus, the control device, the upper computer or the artificial intelligence module can obtain the appropriate upper limit range and/or lower limit range of each state according to the real-time flow value collected by the flow meter and related to the implanted vacuum nozzle 141. Therefore, by combining the real-time flow value acquired by the flowmeter and the action signals of all the action parts, the working conditions of all the vacuum suction nozzles, including abnormal conditions and normal conditions, can be analyzed very accurately. For abnormal conditions, analysis and prompt of abnormal reasons can be carried out, for normal conditions, health conditions can be evaluated, and abnormal hidden dangers can be discovered in time.

Similarly, the control device, the upper computer or the artificial intelligence module can obtain the appropriate upper limit range and/or lower limit range of other vacuum suction nozzles in each state according to the real-time flow value acquired by the flowmeter.

In accordance with another aspect of the invention, in one embodiment, a component handling apparatus of the invention includes one or more vacuum nozzles configured to pick up or drop components; one or more flow meters configured to measure real-time flow values of the corresponding one or more vacuum nozzles, respectively; and the control device is configured to obtain the upper limit range and/or the lower limit range corresponding to each flowmeter, acquire the real-time flow value of each flowmeter, and determine the working condition of the corresponding vacuum suction nozzle based on the acquired real-time flow value of each flowmeter and the corresponding upper limit range and/or lower limit range. The operating conditions may include abnormal conditions and normal conditions.

Preferably, at least one vacuum suction nozzle has a continuous material-free state and a material-free material alternating state, the flowmeter is capable of providing a real-time flow value in a period of the material-free material alternating state, the control device compares a highest value of the real-time flow value in each period of the material-free material alternating state with a corresponding upper limit range, compares a lowest value of the real-time flow value in each period of the material-free material alternating state with a corresponding lower limit range, and determines the working condition of the corresponding vacuum suction nozzle in the material-free material alternating state, and the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range, and determines the working condition of the corresponding vacuum suction nozzle in the continuous material-free state.

Preferably, at least one vacuum suction nozzle has a continuous material-free state and is switched from a material-free state to a material-free state, the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle in the continuous material-free state, and the control device determines the working condition of the corresponding vacuum suction nozzle in the material-free state to the material-free state based on the waveform of the real-time flow value in the material-free state to the material-free state.

Preferably, the component processing apparatus further includes: at least one or more motion components configured to cooperate with the vacuum nozzle to cause the vacuum nozzle to pick up or drop a component; the control device is also configured to collect the action signal of the action component, and determine whether the vacuum nozzle is in a continuous material-free state or a material-free alternating state or whether the vacuum nozzle is in the continuous material-free state or is in a material-free state or is switched to the material-free state according to the collected action signal of the action component and the real-time flow value of the vacuum nozzle. Therefore, by combining the real-time flow value acquired by the flowmeter and the action signals of all the action parts, the working conditions of all the vacuum suction nozzles, including abnormal conditions and normal conditions, can be analyzed very accurately. The abnormal condition of the needle can be analyzed and prompted according to the abnormal reason of the vacuum, and the health condition can be evaluated according to the normal condition, so that the abnormal hidden danger can be discovered in time.

Therefore, when the real-time action monitoring system is applied to the component processing device, the vacuum flow in the conventional component processing device can be controlled, the vacuum management scheme is improved practically, and the production management capacity is improved.

Example 2:

the invention also provides a real-time action monitoring system, which comprises: one or more controlled components;

the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each monitoring device, acquire a real-time state parameter value of each monitoring device, determine the action condition of a corresponding controlled component based on the acquired real-time state parameter value of each monitoring device and the corresponding upper limit range and/or lower limit range, and;

In an embodiment, the controlled component in the real-time motion monitoring system is a vacuum nozzle, the monitoring device is a displacement sensor, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each displacement sensor, acquire a real-time displacement value of each displacement sensor, determine a working condition of the corresponding vacuum nozzle based on the acquired real-time displacement value of each displacement sensor and the corresponding upper limit range and/or lower limit range, and the upper computer processes the real-time displacement value of each displacement sensor acquired by the control device into a displacement curve diagram representing a real-time motion condition of the vacuum nozzle and analyzes an operating state of the equipment according to the motion condition of the vacuum nozzle determined by the control device.

Based on the real-time action monitoring system, the invention is demonstrated, the real-time action monitoring system is applied to a component processing device, and the real-time action monitoring system is used for monitoring the implantation stroke of a vacuum suction nozzle of the component processing device for implanting components, and the jitter amount and time in the implantation process.

In one embodiment, the monitoring device comprises two displacement sensors, probes of the two displacement sensors are arranged oppositely, the vacuum suction nozzle is linked with the elastic sheet, the elastic sheet is arranged between the probes of the two displacement sensors, when the vacuum suction nozzle is driven to vibrate up and down, the elastic sheet moves back and forth between the probes of the two displacement sensors, and the two displacement sensors monitor the displacement value of the elastic sheet in real time.

The probe of each displacement sensor is a field source of an electromagnetic field generated by the probe, the elastic sheet is arranged in the coverage area of the electromagnetic field, when the elastic sheet approaches one probe of the displacement sensor from far to near, the magnetic field intensity of the electromagnetic field generated by the displacement sensor is reduced from large, and the attenuation degree of the magnetic field intensity of the electromagnetic field is also increased from small to large;

the control device calculates real-time displacement values of the elastic pieces and the probes of the displacement sensors according to a functional relation presented by the distance between the elastic pieces and each displacement sensor probe and the magnetic field intensity of the electromagnetic field generated by the elastic pieces, the upper computer receives the real-time displacement values and processes the real-time displacement values into a continuous displacement curve graph, and the continuous displacement curve graph represents the real-time displacement values of the vertical vibration of the vacuum suction nozzle.

In one embodiment, at least one vacuum suction nozzle is driven to reciprocate alternately between a first position and a second position, the vacuum suction nozzle is respectively provided with a corresponding upper limit range and/or a corresponding lower limit range for representing displacement at the first position and the second position, the displacement sensor can provide real-time displacement values in periods where the vacuum suction nozzle alternates between the first position and the second position, the control device compares the highest value of the displacement of the real-time displacement values in each period where the first position and the second position alternate with the corresponding upper limit range, compares the lowest value of the displacement of the real-time displacement values in each period where the first position and the second position alternate with the corresponding lower limit range, determines the working condition of the corresponding vacuum suction nozzle under the first position and the second position alternate, and compares the highest value of the displacement of the real-time displacement values in the first position with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle under the first position; or,

the control device compares the maximum value of the displacement of the real-time displacement value when the vacuum suction nozzle is at the first position with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle when the vacuum suction nozzle is at the first position, and the control device determines the working condition of the corresponding vacuum suction nozzle when the vacuum suction nozzle is at the first position to the second position based on the curve of the real-time displacement value when the vacuum suction nozzle is switched from the first position to the second position.

In one embodiment, at least one or more drive components configured to act in cooperation with the vacuum nozzle to cause the vacuum nozzle to pick up or drop a component; the control device is also configured to collect the action signal of the driving component, and determine that the vacuum suction nozzle is at the position based on the collected action signal of the driving component and the real-time displacement value of the vacuum suction nozzle.

The following describes the process of monitoring the vacuum nozzle 080 of the device processing apparatus by using the real-time motion monitoring system of the present invention with reference to fig. 9, wherein 010-electromagnet, 020-electromagnet shaft, 030-first catch, 040-second catch, 050-shrapnel, 060-cushion, 070-coupler, 080-vacuum nozzle, 090-spring; 0100-sensor probe A; 0110-sensor Probe B.

Referring to fig. 9, the implantation portion of the component processing apparatus includes a vacuum suction nozzle 080 and an electromagnet 010 coaxially linked with the vacuum suction nozzle 080, the electromagnet 010 is installed on a first stopper 030, an electromagnet shaft 020 of the electromagnet 010 penetrates through the first stopper 030 and further penetrates through a second stopper 040 arranged opposite to the first stopper 030, one end, close to the second stopper 040, of the electromagnet shaft 020 is connected with one end of the suction nozzle 080 through a coupling 070, a spring 090 is further arranged between the coupling 070 and the second stopper 040, a metal elastic sheet 050 is further arranged on the electromagnet shaft 020, the metal elastic sheet 050 is close to one end of the electromagnet 010, cushion pads 060 are further arranged on two sides of the metal elastic sheet 050 respectively, a sensor probe is arranged on each of the first stopper 030 and the second stopper 040, two sensor probes (sensor probe a and sensor probe B) are arranged oppositely, and the metal elastic sheet connected to the electromagnet shaft 020 moves between the two sensor probes. When the electromagnet 010 receives an action signal, the electromagnet drives the vacuum suction nozzle 080 to move upwards (taking the figure as an example, wherein the upward direction or the downward direction is both described by referring to the principle in the direction of the figure, and cannot be understood as the limitation on the movement direction), at this time, the spring 090 is placed between the coupler 070 and the second baffle 040 and is compressed, and the electromagnet 010 moves upwards to enable the metal elastic piece 050 to be closer to the sensor probe a on the first baffle 030, at this time, the magnetic field strength of the electromagnetic field in the detection range of the sensor probe a on the first baffle 030 attenuates, the sensor probe a on the first baffle 030 sends a signal representing the magnetic field strength of the electromagnetic field to the control device, the control device converts the signal into a real-time displacement value of the vacuum suction nozzle 080 at this time and sends the real-time displacement value to the upper computer, and the upper computer receives the real-time displacement value and processes the real-time displacement value into a continuous displacement graph, and the continuous displacement graph represents the real-time displacement value of the vertical vibration of the vacuum suction nozzle.

In the above case, the vacuum suction nozzles 080 are driven upward so that the spring plates 050 are close to the first shutter 030, and the positions where the spring plates 050 are close to the vacuum suction nozzles 080 of the first shutter 030 are referred to as first positions, and correspondingly, the positions where the spring plates 050 are close to the vacuum suction nozzles 080 of the second shutter 040 are referred to as second positions. Then, the vacuum nozzles 080 are driven to reciprocate alternately between a first position and a second position, in which the vacuum nozzles 080 are provided with corresponding upper and/or lower limit ranges indicative of displacements, respectively, and the corresponding upper and/or lower limit ranges are entered into the control device. When the vacuum suction nozzle 080 moves to the first position, the control device records the real-time displacement value of the vacuum suction nozzle 080 at the moment, compares the real-time displacement value with the recorded upper limit range and/or lower limit range corresponding to the first position, if the real-time displacement value is within the upper limit range and/or lower limit range corresponding to the first position, the suction nozzle 080 is indicated to be operated well, and if the real-time displacement value exceeds the upper limit range and/or lower limit range corresponding to the first position, the suction nozzle 080 does not move in place, and the equipment needs to be overhauled. The situation when the vacuum nozzle 080 is driven to the second position is similar to that when it is in the first position, and therefore, the situation when the vacuum nozzle 080 is in the second position will not be described, and can be analyzed in conjunction with fig. 9 and the above description.

Meanwhile, the control device also sends the recorded real-time displacement value to the upper computer in real time, the upper computer updates and generates a continuous displacement curve graph in real time according to the real-time displacement value, and records an upper limit range and/or a lower limit range corresponding to the first position and an upper limit range and/or a lower limit range corresponding to the second position into the upper computer, so that whether the suction nozzle 080 acts in the range can be directly observed from the displacement curve graph of the upper computer, the continuous displacement curve graph also represents the conversion condition of the suction nozzle 080 at the first position and the second position, when the suction nozzle 080 acts stably, the continuous displacement curve graph is similar to the waveform of a sine function, certainly, when the suction nozzle 080 moves at a high speed, some micro jitter also exists in the waveform of the sine function, but as long as the range is not exceeded, the action of the suction nozzle can be determined to be normal.

When the upper computer records and displays a displacement curve chart representing the vacuum suction nozzle 080, a large amount of data can be used as data support for the upper computer to estimate the cause of the poor movement of the suction nozzle, a set of fault analysis logic can be established in the upper computer system according to the data, and the equipment is guided to be overhauled and maintained through the logic.

It should be noted that, in the process of high-speed reciprocating motion of the implantation portion vacuum suction nozzle 080, micro invisible vibration occurs when the implantation portion vacuum suction nozzle 080 reaches the upper and lower suction end faces due to the problems of inertia, or collision with baffle impurities, and the like, and in the high-precision suction action, the micro vibration can cause the problem that components are not implanted in place in the process of implanting the component packaging carrier tape in the component processing device, and the component can collide with the baffle when moving forwards along with the packaging carrier tape due to the fact that the component is not implanted in place, so that the component is scratched to cause defects. The monitoring system of the invention can be applied to the implant vacuum suction nozzle 080 to monitor the motion state of the implant vacuum suction nozzle 080, and whether the micro-vibration amount and the vibration time of the implant vacuum suction nozzle 080 exceed the range is analyzed on the basis of the monitoring result, so that the condition of bad products is avoided or reduced, and one or more problems in the prior art are solved.

Example 3:

with reference to the foregoing embodiment 1 and embodiment 2, the real-time motion monitoring system according to the present invention can monitor motion and displacement conditions in real time, and therefore, based on the foregoing embodiment, the present invention further provides an automatic material packaging apparatus.

Referring to fig. 10, a flow chart of a material processing process is shown, and a packaging process of the automatic material packaging apparatus according to the present invention can be described with reference to fig. 10, where the material packaged in the automatic material packaging apparatus can include various components, and in an embodiment, the material can be used as an instructional operation flow chart of a component processing process. The flowchart shown in fig. 10 is explained below:

the flowchart shown in fig. 10 can be divided into the following processes: process 1: obtaining a carrier tape for packaging the components through a carrier tape feeding device; a step 2 of feeding the components through a component feeding device; and 3, process: implanting components into the carrier tape by a component processing device; and 4, process: and packaging the carrier tape implanted with the components by using the material packaging device. The sequence of the process 1 and the process 2 is not sequential, and generally, the process 1 and the process 2 are parallel for the production efficiency. One or more detection procedures can be set in the process 1, the process 2 or the process 3 according to the requirements, and the detection procedures are mainly used for detecting the appearance and the electrical performance of the components. Of course, the detection process cannot be set in the process 4, and the defects can be controlled at the front end of production only by detection before packaging, so that the error correction cost is reduced, and the production efficiency is improved.

In one embodiment, process 1 requires that the carrier tape for packaging the components (which can be purchased directly under the support of the budget of production cost) is made by matching the master tape and the lower tape, and the carrier tape has accommodating slots for accommodating the components.

In an embodiment, the process 2 is for loading, the packaged components need to be loaded to a designated position and then fed (feeding is a previous step of implanting the components in the process 3, that is, feeding is a preparation work for implanting the components into the carrier tape), the components can be subjected to appearance detection and electrical performance detection before and after feeding, and the components are stored in a defective box after detecting defective products, and a worker determines whether the defective products are really defective or not for the second time.

In an embodiment, the process 3 is to implant the components into the storage grooves of the carrier tape one by one, before or after the components are implanted, the components can be subjected to appearance detection and electrical performance detection, the defects detected before the components are implanted can be directly discharged, and the defects detected after the components are implanted can be taken out of the storage grooves.

In an embodiment, the process 4 is to package the carrier tape on which the component is implanted, at this time, a tape can be provided, the carrier tape is packaged by the tape, and the finished product tape is obtained after the packaging is completed.

In order to improve the efficiency of material packaging, automation equipment for each operation step can be developed by starting from the four processing procedures, so that the automation of the operation step is realized. Further, it is necessary to develop a suitable sub-device or mechanism for the sub-step in each step to automate the sub-step. For example, for process 1, since the process includes three sub-steps of supplying a master tape, supplying a lower tape, attaching a lower tape, and the like, it may be necessary to develop three sub-devices or mechanisms for the above three sub-steps. Of course, these automation devices for the individual steps can also be integrated in order to achieve full process automation of the material encapsulation. The present invention is based on the above inventive concept, and the following describes an automatic apparatus and a complete automatic material packaging device for various operation steps according to various embodiments.

Material loading device (Carrier band loading device)

In one embodiment, the present invention provides a material loading apparatus, which is mainly used for loading a carrier tape. Which is capable of transporting the carrier tape to a subsequent station for receiving a subsequent operation.

The material loading device can be called as a carrier tape loading device, can be used as a loading device of a component processing device, and conveys an unloaded carrier tape to the component processing device to complete the implantation of components, and at the moment, the subsequent station is a material implantation station. Of course, the material loading device described in this embodiment may also be used as a loading device of other material handling devices, and this embodiment is not particularly limited.

In an embodiment, referring to fig. 10, the carrier tape feeding device according to the present invention includes two feeding devices, one feeding device is used to feed a mother tape, and the other feeding device is used to feed a bottom tape (it should be noted that the mother tape is a plastic strip and is provided with a through hole, the shape and size of the through hole is adapted to the shape and size of the component to be packaged, the bottom tape is attached to one side of the mother tape, and the bottom tape covers the through hole on the mother tape, so that the mother tape with the bottom tape attached to one side forms a carrier tape capable of packaging the component), after the two feeding devices feed, the mother tape and the bottom tape are simultaneously conveyed to a bottom pressing station, the bottom tape is attached to one side surface of the mother tape at the bottom pressing station, the bottom pressing device is provided at the bottom pressing station, and the bottom pressing device reciprocates up and down in cooperation with a certain temperature to press the bottom pressing tape and the mother tape, thereby obtaining the carrier tape. The lower pressing device can comprise an electrified instant heating type soldering iron (called electric soldering iron for short), the electric soldering iron is connected with the electromagnet, the electric soldering iron is driven by the electromagnet to reciprocate up and down to complete pressing action, in practical application, an appropriate heating temperature of the electric soldering iron is selected according to the material and the characteristics of the lower adhesive tape and the mother tape, an appropriate pressing time is set, in order to ensure firm pressing, the electric soldering iron stays on the lower adhesive tape for a certain time in the pressing process, a certain pressing force is given to the adhesive tape to ensure the adhesion of the lower adhesive tape and the mother tape, and thus the component processing device obtains a carrier tape which can be used for packaging components from a first front end processing route, and a containing groove is formed in the carrier tape.

In one embodiment, the master tape and the lower adhesive tape are both roll-shaped materials, the master tape roll and the lower adhesive tape roll are respectively fixed on stations reserved on the rack, the master tape and the lower adhesive tape roll are conveyed to a lower pressing station, and then the lower adhesive tape roll is adhered to the master tape through the lower pressing device, so that the carrier tape is obtained.

In one embodiment, the carrier tape feeding device further comprises a carrier tape driving part, and the carrier tape driving part conveys the prepared carrier tape to a subsequent station.

In one embodiment, if the carrier tape is directly provided without processing through the master tape and the lower tape, the carrier tape loading device of the invention may only include one carrier tape driving part, and the carrier tape is loaded to the material implanting station through the carrier tape driving part.

The material loading attachment that this embodiment provided can regard as an integral part, constitutes whole set of material automatic packaging equipment to use together with components and parts loading attachment, components and parts processing apparatus and material packaging device integration. When the material loading device is used as a component of the whole set of automatic material packaging equipment, the material loading device loads the carrier tape into the component processing device to receive subsequent loading operation, and the specific process can refer to the related content of the automatic material packaging equipment in the subsequent embodiment.

Of course, the material feeding device can also be used as a feeding device of other types of material processing devices.

Component feeding device

In one embodiment, the present invention provides a component feeding device, which is capable of storing, feeding and feeding components to convey the components one by one to a subsequent station to receive a subsequent operation.

The component feeding device can be used as a feeding device of the component processing device, so that components are conveyed into the component processing device, and at the moment, the subsequent station is a material implantation station on the component processing device. Of course, the component feeding device may also be used as a feeding device for other component handling devices, and the embodiment is not particularly limited.

The component feeding device in the embodiment of the invention can be used for realizing the scattering of concentrated materials, the scattered materials can be sequentially arranged in a single row, the preparation for feeding is ready for the subsequent materials to be implanted into the carrier tape, after the materials are sequentially arranged in the single row, the detection device can be arranged for sequentially carrying out electrical performance detection (the electrical performance detection can comprise two resistance detections and one capacitance detection) on each component, and if the defective products are detected, the defective products are discharged into the corresponding storage box. Implanting detection device in components and parts loading attachment can be at the material loading in-process with accuse components and parts quality to before accomodating bad control, reduce the cost of doing over again. Of course, the detection device may not be implanted in the component feeding device, only the storage, feeding and feeding of the components are completed in the feeding process, the screening process of the electrical performance detection is performed in the subsequent process, and the specific stage of the electrical performance detection can be determined according to the actual integrated structure of the component processing device.

In one embodiment, the component feeding device provided by the invention can comprise a hopper, a material vibration disc and a material transmission rail, wherein one end of the hopper is communicated with a feeding hole of the material vibration disc, a discharging hole of the material vibration disc is connected with the material transmission rail, a sensor is further arranged on the material vibration disc and can monitor the material quantity in the material vibration disc, if the material quantity is detected to be insufficient, the hopper is controlled to feed materials into the material vibration disc, and the hopper is controlled to stop feeding materials after the materials are fed to the set material quantity. The material vibration dish accessible mechanical vibration arranges the material single file on the material transmission track. Wherein, the hopper is used for storage components and parts, material vibration dish can sort the material through the vibration, and the material transmission track then can be carried the convenient pan feeding with the material list.

In an embodiment, if a detection process is implanted in the component feeding device, the detection device may be installed upside down below the material conveying track (the installation position is related to the detection method, in this embodiment, the detection device is upside down, mainly because a probe extends from bottom to top during the electrical performance detection to detect whether the resistance and capacitance performance is qualified, so the detection device is installed upside down below the material conveying track), and when the material is conveyed to a detection station (in this embodiment, the detection station coincides with the material conveying track feeding station), the detection device performs the electrical performance detection on the material.

In an embodiment, the detecting device of the present invention may include three detecting processes, wherein two detecting processes may be resistance detection and the other detecting process may be capacitance detection (certainly, the two detecting processes may be redistributed, and this embodiment only provides an example to illustrate the problem, and does not limit the present invention).

In one embodiment, the detection device is described as including three detection members, each corresponding to a detection process. For example, the first detection part and the second detection part for detecting the resistor respectively comprise two detection probes, when a component is monitored at a detection station, the detection probes extend out and penetrate into a target detection part of the component, the resistance value of the resistor is obtained from the target detection part, whether the electrical property of the detected component is qualified or not is judged, if the electrical property is qualified, the next detection procedure is carried out, and if the electrical property is not qualified, the component is discharged into a corresponding defective product storage box. The third detection part for capacitance detection comprises two detection probes, is the same as resistance detection, needs to be penetrated into a target capacitance detection part of the component by the detection probes, obtains a capacitance value from the target detection part, judges whether the electrical property of the detected component is qualified or not, enters the next detection procedure if the electrical property of the detected component is qualified, and arranges the component into a corresponding defective storage box if the electrical property of the detected component is unqualified. The components passing through the three detection processes are conveyed to a material implantation station on a material conveying track. By the mode of screening layer by layer, the defects are controlled at the front end of the storage box, and the quality of finished products is ensured.

The component feeding device provided by the embodiment can be used as an assembly part and integrated with the carrier tape feeding device, the component processing device and the material packaging device to form a whole set of material automatic packaging equipment for use. When the component feeding device is used as a component of the whole set of material automatic packaging equipment, the component feeding device feeds components into the component processing device to receive subsequent loading operation, and the specific process can refer to the related content of the material automatic packaging equipment in the subsequent embodiment.

Of course, the component feeding device can also be used as a feeding device of other types of material processing devices. Such as other material loading devices, etc.

Component processing device

The invention provides a component processing device which can realize the picking, transferring, detecting and implanting of components and convey carrier bands for implanting the components to a subsequent station to receive subsequent operation.

The component processing device can be used as a feeding device of a material packaging device, so that a carrier tape with implanted components to be packaged is conveyed into the material packaging device, and at the moment, the subsequent station is an upper pressing station of the material packaging device. Of course, the component handling apparatus may also be used as a feeding apparatus for other component handling apparatuses, and the embodiment is not particularly limited.

The component processing device that this embodiment provided receives the carrier band of carrier band loading attachment material loading, also receives the component of component loading attachment material loading simultaneously, and component processing device's main function is to implant the component to the carrier band promptly, but in order to guarantee product quality, has still increased the detection function in component processing device, and the purpose is just to control badly at the production front end, reduces the cost of doing over again.

And a material implantation station is arranged in the component processing device, and the loaded components are implanted into the carrier tape at the material implantation station. The electrical performance detection process can also be completed together with the material implantation station. Certainly, in order to guarantee the quality, also can all carry out the electrical property in components and parts material loading process and material implantation station department and detect to this probability that comes greatly reduced to implant the bad material.

The process of packaging the component into the receiving slot in the carrier tape by the component processing apparatus has been described in detail in embodiment 1, and is not described herein again with reference to fig. 1 to 6.

In one embodiment, the component processing apparatus 100 according to the present invention further includes a carrier tape driving unit (not shown). The carrier tape driving part drives the carrier tape 300 to pass through an implanting part of the component processing equipment and drives the carrier tape to continuously move forwards to reach an appearance detection station on an equipment machine table after the components are implanted into the carrier tape, the appearance detection station is provided with a detection window, an image detection device is arranged right above the detection window, the detection window is provided with an amplification lens, the amplification lens can amplify the components in the accommodating groove, the image detection device can conveniently identify the images of the components, the image detection device is used for carrying out appearance inspection and positioning inspection on the components, the components are determined to be qualified in appearance and correctly accommodated in the accommodating groove with the front face upward, if the components are detected to be unqualified in appearance or incorrect in positioning, the carrier tape is continuously moved forwards to a screening station, a push-pull plate is arranged on the screening station, after the unqualified components are moved to the screening station, the push-pull plate is started to take out the unqualified components, and if the components are not detected to be unqualified, the carrier tape passes through the screening station and continuously moves to the next station.

The component processing device provided by the embodiment can be used as an assembly part and integrated with the carrier tape feeding device, the component feeding device and the material packaging device to form a whole set of material automatic packaging equipment for use. When the component processing device is used as a component of the whole set of material automatic packaging equipment, the component processing device loads the carrier tape containing the components to the material packaging device to receive subsequent packaging operation, and the specific process can refer to the related content of the material automatic packaging equipment in the subsequent embodiment.

Of course, the component processing apparatus may be used as a loading apparatus of other types of material processing apparatuses, and may also be put into production as a single component processing device, which is not particularly limited herein.

Material packaging device

In one embodiment, the invention provides a material packaging device, which mainly packages a carrier tape containing components, and the packaged carrier tape is made into a material roll.

The material packaging device can be used as the next packaging device of the component processing device, and the carrier tape processed by the component processing device is packaged, coiled, terminated and labeled to finally obtain a finished product coil. Of course, the material packaging device described in this embodiment may also be used as a packaging device for other material handling devices, and this embodiment is not limited in particular.

In an embodiment, referring to fig. 10, the material packaging apparatus of the present invention needs to package the carrier tape containing the components, that is, needs to further have a feeding device for supplying a tape (the tape is used to package the carrier tape, that is, the tape is attached to the other side of the mother tape to complete component packaging), and the material packaging apparatus attaches the tape to one side surface of the carrier tape to package the components.

In one embodiment, the material packaging device comprises an upper pressing device, the upper pressing device is arranged on an upper pressing station, an upper adhesive tape supplied by the feeding device and a carrier tape supplied by the component processing device are conveyed to the upper pressing station, and packaging of the carrier tape is completed on the upper pressing station (the upper adhesive tape seals the carrier tape).

In one embodiment, a next station of the screening station in the component processing apparatus may be connected to the upper press-fit station, and the carrier tape supplied from the component processing apparatus is conveyed to the upper press-fit station at the screening station. The upper pressing device arranged at the upper pressing station can comprise an electrified instant heating type soldering iron (called electric soldering iron for short), the electric soldering iron is connected with the electromagnet, the electric soldering iron is driven by the electromagnet to reciprocate up and down to adhere the upper adhesive tape to the carrier tape, the upper adhesive tape is used for packaging the carrier tape after the pressing action is finished, a finished material tape is obtained, and the carrier tape driving part drives the finished material tape to continuously move to the next station.

In one embodiment, the material packaging device is further provided with a material rolling station, the finished material belt is moved to the material rolling station from the upper pressing station, the material rolling station is provided with a tail label feeding device and an automatic material rolling device, the tail label feeding device feeds a tail label to the material rolling station, the automatic material rolling device automatically winds the finished material belt into a roll through a roller, the material roll is obtained after the roll reaches a set length/thickness, and the automatic material rolling device pastes the tail label to the material roll terminal to obtain the packaged finished material roll.

In one embodiment, a labeling station is further arranged on the material packaging device, the packaged finished material roll is conveyed to the labeling station, a labeling device and a scanning device are arranged at the labeling station, the labeling device attaches a nameplate on a reel of the finished material roll, and the scanning device scans and detects whether a bar code on the nameplate can be correct. Of course, the nameplate can be attached manually or can be identified and attached by matching a sensor with a machine.

The material packaging device provided by the embodiment can be used as an assembly part and integrated with the component feeding device, the material feeding device and the component processing device to form a whole set of material automatic packaging equipment for use. When the material packaging device is used as a component of the whole set of material automatic packaging equipment, the material packaging device receives materials from the component processing device and packages the materials. Of course, the material feeding device can also be used as other types of material processing devices, and is not particularly limited herein according to the packaging requirements.

Automatic material packaging equipment

The invention provides automatic material packaging equipment which can continuously and automatically complete the operations of feeding, arranging, packaging, coiling and the like of components, thereby greatly improving the processing efficiency of materials.

In one embodiment, the automatic material packaging equipment comprises a rack, and a material feeding device, a component processing device and a material packaging device which are integrally installed on the rack. Wherein:

the material loading device is used for loading the carrier tape to the component processing device;

the component feeding device is used for feeding components to the component processing device;

the component processing device is arranged in the accommodating groove of the carrier tape and conveys the carrier tape accommodating the components to the material packaging device;

the material packaging device packages, rolls, finishes and labels the carrier tape containing the components, and finally, a finished material roll which can be sold externally is manufactured.

It should be noted that the material loading device, the component processing device, and the material packaging device are not necessarily completely independent in structure, and some or several structural components may be reused among the devices. Correspondingly, the processing stations in each device are not necessarily completely staggered in spatial position, and some stations may be partially or even completely overlapped. The structure is multiplexed and the stations are overlapped so as to save production space and shorten production transfer routes, for example, the feeding stations in the component feeding device can be multiplexed as detection stations.

It should be particularly noted that in some embodiments, the present invention provides only one type of transfer member that is not only capable of reciprocating between devices to transfer a carrier tape from one device to another, but that is also accessible within the devices to effect transfer of a carrier tape between processing stations within the devices. In these embodiments, the carrier tape driving component mentioned in the present invention refers specifically to the transfer component, and certainly, in order to improve the processing efficiency of the automatic material packaging equipment, multiple groups of transfer components may be provided, and the multiple groups of transfer components operate in parallel, so that the automatic material packaging equipment can simultaneously package multiple carrier tapes, and certainly, at the same time, the carrier tapes are located at different stations to receive different operations, and it is ensured that the carrier tapes do not interfere with each other or misplace.

In other embodiments, the interior of each device is provided with separate internal transfer elements as needed, which move only within the device to effect transfer of the carrier tape between the processing stations within the device. The machine table or the rack is additionally provided with an external transfer component, and the external transfer component can move back and forth among the devices, so that the carrier tape is transferred from one device to another device. In these embodiments, the transfer mechanism of the present invention includes an inner transfer member and an outer transfer member within each device, and the carrier tape is transported by the carrier tape drive unit.

The material loading device in the automatic material packaging equipment in the embodiment of the present invention is the material loading device in the embodiment of the present invention, and since the detailed description has been given above on the specific structure and the working process of the material loading device, the detailed description is omitted here, and reference is made to the related description in the embodiment of the present invention. In addition, it should be noted that, when the following description is made on the material loading device, it is not necessary to introduce each component part therein, and please refer to the related description in the above embodiments directly.

It should be noted that in other embodiments, the carrier tape is manually loaded to the material implantation station. Therefore, in these embodiments, the automatic material packaging apparatus in the embodiments of the present invention is not equipped with the material feeding device. The device only comprises a component feeding device, a component processing device and a material packaging device which are arranged on a rack, and can sequentially complete the processing operation of components.

The component feeding device in the automatic material packaging equipment in the embodiment of the present invention is the component feeding device in the above embodiment of the present invention, and since the specific structure and the working process of the component feeding device have been described in detail in the foregoing, detailed description is omitted here, and reference is made to the related description in the above embodiment.

The component processing device in the automatic material packaging equipment in the embodiment of the present invention is the component processing device in the above embodiment of the present invention, and since the specific structure and the working process of the component processing device have been described in detail in the foregoing, detailed description is omitted here, and reference is made to the related description in the above embodiment.

The material packaging device in the automatic material packaging equipment in the embodiment of the present invention is the material packaging device in the above embodiment of the present invention, and since the specific structure and the working process of the material packaging device have been described in detail in the foregoing, detailed description is omitted here, and reference is made to the related description in the above embodiment.

Each functional device in the automatic material packaging equipment provided by the invention can be detached, recombined, replaced or deleted according to the actual application environment, but the basic function of the automatic material packaging equipment is still not influenced.

In an embodiment, the real-time motion monitoring system of the present invention may be applied to the automatic material packaging apparatus of the present invention, for example, a vacuum suction nozzle of a component processing device, and further, for example, a soldering iron in an upper pressing device of a material packaging device, so as to monitor the displacement and motion of a measured object, to ensure stable operation of important parts of the apparatus, and to ensure production yield.

As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.

In this document, the terms front, back, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are used for clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims. The features of the embodiments and embodiments described herein above may be combined with each other without conflict. The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. A real-time action monitoring system, comprising:

one or more controlled components;

2. A real-time motion monitoring system according to claim 1,

the controlled component comprises a vacuum suction nozzle, the monitoring device comprises displacement sensors, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each displacement sensor, acquire a real-time displacement value of each displacement sensor, determine the working condition of the corresponding vacuum suction nozzle based on the acquired real-time displacement value of each displacement sensor and the corresponding upper limit range and/or lower limit range, and the upper computer processes the real-time displacement value of each displacement sensor acquired by the control device into a displacement curve graph representing the real-time action condition of the vacuum suction nozzle and analyzes the running state of the equipment according to the action condition of the vacuum suction nozzle determined by the control device.

3. The real-time motion monitoring system according to claim 2, wherein the monitoring device comprises two displacement sensors, probes of the two displacement sensors are arranged oppositely, the vacuum suction nozzle is linked with an elastic sheet, the elastic sheet is arranged between the probes of the two displacement sensors, when the vacuum suction nozzle is driven to vibrate up and down, the elastic sheet moves back and forth between the probes of the two displacement sensors, and the two displacement sensors monitor the displacement value of the elastic sheet in real time;

when the elastic sheet approaches to one probe of the displacement sensor from far to near, the magnetic field intensity of the electromagnetic field generated by the displacement sensor is reduced from large to small, and the attenuation degree of the magnetic field intensity of the electromagnetic field is also increased from small to large;

4. A real-time motion monitoring system according to claim 3,

at least one vacuum suction nozzle is driven to reciprocate alternately between a first position and a second position, the vacuum suction nozzle is positioned at the first position and the second position and is provided with a corresponding upper limit range and/or a corresponding lower limit range for representing displacement respectively, the displacement sensor can provide real-time displacement values in periods when the vacuum suction nozzle alternates between the first position and the second position, the control device compares the highest value of the displacement of the real-time displacement values in each period when the first position and the second position alternate with the corresponding upper limit range, compares the lowest value of the displacement of the real-time displacement values in each period when the first position and the second position alternate with the corresponding lower limit range, and determines the working condition of the corresponding vacuum suction nozzle under the first position and the second position alternate, and the control device compares the highest value of the displacement of the real-time displacement values in the first position with the corresponding upper limit range and determines the working condition of the corresponding vacuum suction nozzle under the first position; or,

at least one vacuum suction nozzle is switched from the first position to the second position, the vacuum suction nozzle is provided with a corresponding upper limit range and/or a corresponding lower limit range for representing displacement at the first position and the second position, the control device compares the highest value of the displacement of the real-time displacement value at the first position of the vacuum suction nozzle with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle at the first position, and the control device determines the working condition of the corresponding vacuum suction nozzle from the first position to the second position based on the curve of the real-time displacement value switched from the first position to the second position;

it still includes:

at least one or more drive components configured to act in cooperation with the vacuum nozzle to cause the vacuum nozzle to pick up or drop a component;

the control device is also configured to collect the action signal of the driving component, and determine that the vacuum suction nozzle is at the position based on the collected action signal of the driving component and the real-time displacement value of the vacuum suction nozzle.

5. A real-time motion monitoring system according to claim 1,

the controlled component comprises a vacuum suction nozzle, the monitoring device comprises a flowmeter, the control device is configured to obtain an upper limit range and/or a lower limit range corresponding to each flowmeter, acquire a real-time flow value of each flowmeter, determine the working condition of the corresponding vacuum suction nozzle based on the acquired real-time flow value of each flowmeter and the corresponding upper limit range and/or lower limit range, and the upper computer processes the real-time flow value of each flowmeter acquired by the control device into a flow curve graph representing the real-time action condition of the vacuum suction nozzle and analyzes the running state of the equipment according to the action condition of the vacuum suction nozzle determined by the control device.

6. A real-time motion monitoring system according to claim 5,

at least one vacuum suction nozzle is provided with a continuous material-free state and a material-free material alternating state, each state of the vacuum suction nozzle is provided with a corresponding upper limit range and/or lower limit range, the flowmeter can provide a real-time flow value in each period of the material-free material alternating state, the control device compares the highest value of the real-time flow value in each period of the material-free material alternating state with the corresponding upper limit range, compares the lowest value of the real-time flow value in each period of the material-free material alternating state with the corresponding lower limit range, and determines the working condition of the corresponding vacuum suction nozzle in the material-free material alternating state, and the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle in the continuous material-free state; or,

at least one vacuum suction nozzle has a continuous material-free state and is switched from a material-free state to a material-free state, each state of the vacuum suction nozzle is provided with a corresponding upper limit range and/or lower limit range, the control device compares the highest value of the real-time flow value in the continuous material-free state with the corresponding upper limit range to determine the working condition of the corresponding vacuum suction nozzle in the continuous material-free state, and the control device determines the working condition of the corresponding vacuum suction nozzle in the material-free state based on the waveform of the real-time flow value in the material-free state;

it still includes:

at least one or more motion components configured to cooperate with the vacuum nozzle to cause the vacuum nozzle to pick up or drop a component;

the control device is also configured to collect the action signal of the action component, and determine which state the vacuum suction nozzle is in the continuous material-free state and the material-free alternating state or which state the vacuum suction nozzle is in the continuous material-free state and the material-free state is switched to based on the collected action signal of the action component and the real-time flow value of the vacuum suction nozzle.

7. The real-time motion monitoring system according to claim 5, further comprising:

a machine platform;

the rotary table is arranged on the machine table, driven to rotate during work and comprises a plurality of grooves arranged on the edge;

the feeding part comprises a feeding vacuum suction nozzle which is arranged on the machine table and belongs to one of the one or more vacuum suction nozzles;

the discharging part comprises a discharging vacuum suction nozzle which is arranged on the machine table and belongs to one of the one or more vacuum suction nozzles, and a plurality of grooves which are positioned on the edge of the turntable sequentially pass through the feeding vacuum suction nozzle and the discharging vacuum suction nozzle when the turntable rotates;

a detection device;

an implantation portion including an implantation vacuum nozzle belonging to one of the one or more vacuum nozzles;

a carrier tape driving part which drives a carrier tape through the implanting part, wherein the carrier tape comprises a plurality of accommodating grooves arranged in a row; and

wherein the implantation vacuum suction nozzle is communicated with a vacuum pump through a pipeline, the feeding vacuum suction nozzle is communicated with the vacuum pump through a pipeline, the discharging vacuum suction nozzle is controlled by a pipeline to be selectively communicated with one of the vacuum pump and the air outlet pump,

the feeding vacuum suction nozzle sucks components into a groove at the feeding vacuum suction nozzle through vacuum suction, the components positioned in the groove of the turntable can be detected by the detection device, the discharging vacuum suction nozzle sucks the components which are detected normally into the groove at the discharging vacuum suction nozzle through the vacuum suction, the discharging vacuum suction nozzle blows the components which are detected abnormally out of the groove at the discharging vacuum suction nozzle through blowing thrust, and the implanting vacuum suction nozzle sucks the components positioned in the groove at the implanting vacuum suction nozzle through the vacuum suction and implants the components into a receiving groove of the carrier tape;

the feeding part also comprises a feeding track, a separating needle and a position detector, the feeding track, the separating needle and the position detector are arranged on the machine table, the separating needle is controlled to move between a blocking position and an opening position, components on the feeding track are blocked when the separating needle is at the blocking position, the components on the feeding track are sucked into a groove at the feeding vacuum suction nozzle by the feeding vacuum suction nozzle when the separating needle is at the opening position, and the position detector is configured to detect whether the components enter the groove at the feeding vacuum suction nozzle;

the discharge part further comprises an electromagnetic valve, a first port of the electromagnetic valve is communicated with a discharge vacuum suction nozzle, a second port of the electromagnetic valve is communicated with the vacuum pump, a third port of the electromagnetic valve is communicated with the air outlet pump, the electromagnetic valve is controlled to selectively communicate the first port with one of the second port and the third port, and the discharge vacuum suction nozzle is controlled to selectively communicate with one of the vacuum pump and the air outlet pump through the electromagnetic valve;

the implantation part further comprises an implantation driving part, the implantation driving part drives the implantation vacuum suction nozzle to reciprocate between a material taking position and an implantation position, the implantation vacuum suction nozzle is used for sucking components in a groove at the position of the implantation vacuum suction nozzle when the material taking position is reached, and the sucked components are implanted into the accommodating groove of the carrier tape when the material implanting position is reached.

8. A real-time motion monitoring system according to claim 7, wherein the flow meter comprises:

the first flowmeter is arranged on a pipeline communicated with the feeding vacuum suction nozzle and is configured for measuring the gas flow of the feeding vacuum suction nozzle to obtain a first flow value;

a second flow meter disposed on a conduit in communication with the discharge vacuum nozzle and configured to measure a gas flow rate of the discharge vacuum nozzle to obtain a second flow value;

the third flow meter is arranged on a pipeline communicated with the implantation vacuum nozzle and is configured for measuring the gas flow of the implantation vacuum nozzle to obtain a third flow value;

a fourth flow meter disposed on the piping of the vacuum pump, configured to measure a total flow value;

the communication module is used for communicating with an upper computer and is configured to receive an upper limit range and/or a lower limit range which are/is corresponding to each flow meter and sent by the upper computer;

the upper computer generates and updates an upper limit range and/or a lower limit range corresponding to each flowmeter based on the total flow value of the vacuum pump, the equipment type of the component processing device and the component type transmitted by the communication module;

the upper computer is connected with the artificial intelligence module, the artificial intelligence module generates and updates an upper limit range and/or a lower limit range corresponding to each flowmeter according to production record data of one or more component processing devices, and transmits the obtained upper limit range and/or lower limit range corresponding to each flowmeter to the upper computer;

and the upper computer determines whether the component processing device is allowed to work normally or not based on the total flow value and the total flow value limit value transmitted by the communication module.

9. A real-time motion monitoring system according to claim 7, wherein each state of the vacuum nozzle is provided with a corresponding upper limit range and/or lower limit range,

the control device performs the following operations:

when the feeding part is in a continuous material-free state, if the acquired flow value of the feeding vacuum suction nozzle is lower than the corresponding upper limit range, determining that the feeding part is in a first vacuum abnormal state; when the feeding part is in a continuous material-free state, if the acquired flow value of the feeding vacuum suction nozzle is higher than the corresponding upper limit range, determining that the feeding part is in a second abnormal vacuum state; when the feeding part is in a material-existence alternative conversion state, if the high value of the acquired flow value of the feeding vacuum suction nozzle is in a corresponding upper limit range, and the low value of the acquired flow value of the feeding vacuum suction nozzle is higher than a corresponding lower limit range, determining that the feeding part is in vacuum abnormity; and/or

When the discharge part is in a continuous material-free state, if the acquired flow value of the discharge vacuum suction nozzle is lower than the corresponding upper limit range, determining that the first type of discharge part is abnormal in vacuum; when the discharge part is in a continuous material-free state, if the acquired flow value of the discharge vacuum nozzle is higher than the corresponding upper limit range, determining that the second type of discharge part is abnormal in vacuum; when the discharge part is in a state of material existence and material nonexistence, if the high value and the low value of the acquired flow value of the discharge vacuum suction nozzle are converted too slowly, the third type of discharge part is determined to be abnormal in vacuum; and/or

When the implanted part is in a continuous material-free state, if the acquired flow value of the implanted vacuum suction nozzle is lower than the corresponding upper limit range, determining that the implanted part is abnormal in vacuum; when the implanted part is in a material-free alternative conversion state, if the high value of the acquired flow value of the implanted vacuum suction nozzle is in the corresponding upper limit range, and the low value of the acquired flow value of the implanted vacuum suction nozzle is higher than the corresponding lower limit range, determining that the implanted part is abnormal in vacuum; when the implanted part is in a material-free alternative conversion state, if the high value of the acquired flow value of the implanted vacuum suction nozzle is in the corresponding upper limit range, and the low value of the acquired flow value of the implanted vacuum suction nozzle is in the corresponding lower limit range but is close to the upper limit value of the corresponding lower limit range and regularly fluctuates, determining that the implanted part is in a third abnormal vacuum state; when the implanted part is in a material-free alternative conversion state, if the high value of the acquired flow value of the implanted vacuum suction nozzle is in the corresponding upper limit range, and the low value of the acquired flow value of the implanted vacuum suction nozzle is in the corresponding lower limit range and fluctuates irregularly, determining that the implanted part is in vacuum anomaly;

to first kind pan feeding portion vacuum unusual, the suggestion unusual reason is: one or more of insufficient vacuum of the feeding part, blockage of a feeding vacuum suction nozzle, blockage of a pipeline of the feeding part and air leakage of a pipeline in front of a flow meter of the feeding part; to the vacuum anomaly of the second feeding part, the anomaly reason is prompted as follows: the feeding part is over-vacuum; to the vacuum anomaly of the third feeding part, the anomaly reason is prompted as follows: the air leakage of the rear pipeline of the flow meter of the feeding part; and/or

For the first discharge part vacuum abnormity, the abnormity reason is shown as follows: one or more of insufficient vacuum of the discharge part, blockage of a discharge vacuum suction nozzle, blockage of a pipeline of the discharge part and air leakage of a pipeline in front of a flowmeter of the discharge part; for the second discharge part vacuum abnormality, the abnormality reason is suggested as follows: one or more of overlarge vacuum of the removing part and air leakage of a pipeline behind the flowmeter of the discharging part; for the third discharge part vacuum anomaly, the anomaly reason is suggested as: one or more of aging of an electromagnetic valve of the discharge part and blockage of a discharge vacuum suction nozzle of the discharge part; and/or

The first type of vacuum abnormality of the implant part suggests the causes of the abnormality as: one or more of insufficient vacuum of the implantation part, blockage of an implantation vacuum suction nozzle, blockage of a pipeline of the implantation part and air leakage of the pipeline before a flow meter of the implantation part; the second type of vacuum abnormality of the implant part suggests the causes of the abnormality are: one or more of damage of the implanted vacuum suction nozzle, abrasion of the implanted vacuum suction nozzle and air leakage of a pipeline behind the flow meter of the implanted part; for the third type of vacuum abnormality of the implant part, the abnormality is suggested to be caused by: implanting one or more of a half blockage of the vacuum suction nozzle and a single hole blockage of the vacuum suction nozzle; for the fourth kind of vacuum abnormality of the implanted part, the reason for the abnormality is as follows: abnormal size of the components; when the fourth implantation part is abnormal in vacuum, judging the nonstandard rate of the components according to the acquired flow value of the implantation vacuum suction nozzle with the preset number of the components;

the control device is also configured to acquire one or more of a rotation action signal of the turntable, an implantation action signal of the implantation part, a feeding action signal of the feeding part and a discharging action signal of the discharging part,

the control device judges whether the implantation part is in a continuous material-free state and a material-free alternate conversion state or not based on the acquired implantation action signal of the implantation part and/or the acquired flow value of the implantation vacuum suction nozzle;

the control device judges whether the feeding part is in a continuous material-free state and a material-free alternate conversion state or not based on the collected feeding action signal of the feeding part and/or the collected flow value of the feeding vacuum suction nozzle;

the control device judges whether the discharge part is in a continuous material-free state or not and whether the discharge part is in a material-free state or not and whether the discharge part is converted into the material-free state or not according to the collected discharge action signal of the discharge part and/or the collected flow value of the discharge vacuum suction nozzle;

the control device is combined with a rotation action signal of the turntable to judge the states of the material discharging part, the material feeding part and the implanting part;

the implantation action signal of the implantation part comprises an action signal of an implantation driving part of the implantation part;

the feeding action signal of the feeding part comprises an action signal of a separation needle of the feeding part and/or a detection signal of the positioning detector;

the discharging action signals of the discharging part comprise the electromagnetic valve switching signals of the discharging part;

in a continuous period of time, when the feeding part continuously has no action signal and the acquired flow value of the feeding vacuum suction nozzle is continuously at a high value, the situation that the feeding part is in a continuous material-free state is judged; when the acquired flow value of the feeding vacuum suction nozzle is matched with the acquired action signal of the feeding part to be alternately switched between a high value and a low value, judging that the feeding part is in a material-existence alternate switching state;

when the implanted part continuously has no action signal and the acquired flow value of the implanted vacuum suction nozzle is continuously at a high value in a continuous period of time, judging that the implanted part is in a continuous material-free state; when the acquired flow value of the implanted vacuum suction nozzle is matched with the acquired action signal of the implanted part to be alternately switched between a high value and a low value, judging that the implanted part is in a material-containing or material-free alternate switching state;

in a continuous period of time, when the discharge part continuously has no action signal and the acquired flow value of the discharge vacuum suction nozzle is continuously at a high value, the discharge part is judged to be in a continuous material-free state; and when the acquired flow value of the discharge vacuum suction nozzle is matched with the acquired action signal of the discharge part and is switched from a low value to a high value, judging that the discharge part is in a material-existing state and is switched to a material-nonexisting state.

10. An automatic packaging apparatus for materials, characterized in that it comprises a real-time action monitoring system according to any one of claims 1 to 9;

it still includes material loading attachment, components and parts processing apparatus and material packaging hardware, material loading attachment is used for carrying out the material loading to the carrier band of packing components and parts, components and parts loading attachment is used for realizing the material loading to components and parts, components and parts processing apparatus be used for with components and parts implant extremely in the groove of accomodating of carrier band, material packaging hardware is used for realizing packing the carrier band of accomodating components and parts.